TWI744817B - Conductive powder and test connector comprising the same - Google Patents
Conductive powder and test connector comprising the same Download PDFInfo
- Publication number
- TWI744817B TWI744817B TW109107608A TW109107608A TWI744817B TW I744817 B TWI744817 B TW I744817B TW 109107608 A TW109107608 A TW 109107608A TW 109107608 A TW109107608 A TW 109107608A TW I744817 B TWI744817 B TW I744817B
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive
- polymer layer
- conductive powder
- particles
- present
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/442—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from aromatic vinyl compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/01—Magnetic additives
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Dispersion Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
Abstract
本發明之一觀點係關於一種導電粉末,其包含:核心粒子;及聚合物層,其包圍上述核心粒子之表面;且於上述聚合物層結合有複數個導電性粒子,上述聚合物包含一種以上之不飽和烴、芳香族烴或該兩者。本發明之一觀點係關於一種測試用連接器,其包含:導電部,其包含上述導電粉末;及絕緣性材質之薄片。本發明之一觀點之導電粉末可表現出優異之耐變形性、耐磨耗性及電阻穩定性。One aspect of the present invention relates to a conductive powder comprising: a core particle; and a polymer layer that surrounds the surface of the core particle; and a plurality of conductive particles are bonded to the polymer layer, and the polymer includes one or more The unsaturated hydrocarbons, aromatic hydrocarbons or both. One aspect of the present invention relates to a connector for testing, which includes: a conductive portion including the above-mentioned conductive powder; and a sheet of insulating material. The conductive powder of one aspect of the present invention can exhibit excellent deformation resistance, abrasion resistance, and resistance stability.
Description
本發明係關於一種新穎之導電(conductive)粉末及包括該導電粉末之測試用連接器。The present invention relates to a novel conductive powder and a test connector including the conductive powder.
於用以判斷如半導體器件之被測試器件是否不良之測試製程中,在被測試器件與檢測(test)設備之間配置測試用連接器。測試用連接器已知有如下測試方法:將被測試器件與檢測設備電性連接,基於被測試器件與檢測設備是否通電來判斷被測試器件是否不良。In the test process for judging whether the device under test, such as a semiconductor device, is defective, a test connector is arranged between the device under test and the test equipment. The following test methods are known for test connectors: the device under test is electrically connected with the testing equipment, and the device under test is judged whether the device under test is bad based on whether the device under test and the testing equipment are energized.
若不使用測試用連接器而使被測試器件之端子直接與檢測設備之端子接觸,則於反覆進行的測試過程中檢測設備之端子會磨耗或破損而需更換整個檢測設備。先前,利用測試用連接器來防止產生需更換整個檢測設備之情況。具體而言,於測試用連接器因與被測試器件之端子反覆接觸而磨耗或破損時,能夠僅更換相應之測試用連接器。If the terminals of the device under test are in direct contact with the terminals of the testing equipment without using the test connector, the terminals of the testing equipment will be worn or damaged during repeated tests and the entire testing equipment needs to be replaced. Previously, testing connectors were used to prevent the need to replace the entire testing equipment. Specifically, when the test connector is worn or damaged due to repeated contact with the terminal of the device under test, only the corresponding test connector can be replaced.
使用於測試用連接器之導電部之導電粉末係於具有磁性之核心鍍覆金(Au)而使用。此時,若測試用連接器於其使用過程中反覆壓縮,則會引起多種問題。例如,存在於連接器之導電粉末因壓縮而受力,導電粉末間接觸,從而粒子發生變形及磨耗。若因粒子之磨耗而表面之鍍金層剝落,則作為導電性較低之磁性核心之成分之鐵(Fe)、鎳(Ni)或鈷(Co)暴露於外部而導電性減小,接觸電阻增加,從而無法順利地傳輸電信號。The conductive powder used in the conductive part of the test connector is coated with gold (Au) on the magnetic core. At this time, if the test connector is repeatedly compressed during its use, it will cause various problems. For example, the conductive powder present in the connector is forced by compression, and the conductive powder contacts, so that the particles are deformed and abraded. If the gold-plated layer on the surface peels off due to the abrasion of the particles, iron (Fe), nickel (Ni) or cobalt (Co), which is a component of the magnetic core with lower conductivity, is exposed to the outside and the conductivity decreases and the contact resistance increases. , So that electrical signals cannot be transmitted smoothly.
又,現有之導電粉末之粒子形成不規則而粒子間之接觸呈點接觸之形態,因此於連接器被壓縮之情形時,粒子間之接點錯位而電阻變得不穩定,會無法順利地實現電信號傳輸。 [先前技術文獻] [專利文獻]In addition, the particles of the existing conductive powder are irregularly formed and the contact between the particles is in the form of point contact. Therefore, when the connector is compressed, the contacts between the particles are dislocated and the resistance becomes unstable, which may not be smoothly realized. Electric signal transmission. [Prior Technical Literature] [Patent Literature]
(專利文獻1)韓國公開專利公報第10-2018-0132031號(2018.12.11.)(Patent Document 1) Korean Patent Publication No. 10-2018-0132031 (2018.12.11.)
[發明所欲解決之課題][The problem to be solved by the invention]
本發明之目的在於提供一種即便反覆壓縮測試用連接器,導電粉末之變形及磨耗亦較少,保持穩定之電阻而電信號傳輸較為順利之新穎之導電粉末。 [解決課題之技術手段]The object of the present invention is to provide a novel conductive powder that has less deformation and abrasion of the conductive powder, maintains a stable electrical resistance and smooth electrical signal transmission even if the connector for repeated compression testing is repeated. [Technical means to solve the problem]
為了解決上述課題,本發明之一觀點提供一種導電粉末,其包含:核心粒子;及聚合物層,其包圍上述核心粒子之表面;且於上述聚合物層結合有複數個導電性粒子,上述聚合物包含一種以上之不飽和烴、芳香族烴或該兩者。 [發明之效果]In order to solve the above-mentioned problems, one aspect of the present invention provides a conductive powder comprising: a core particle; and a polymer layer surrounding the surface of the core particle; and a plurality of conductive particles are bonded to the polymer layer, and the polymer layer The product contains more than one unsaturated hydrocarbon, aromatic hydrocarbon or both. [Effects of Invention]
本發明之一觀點之導電粉末可表現出優異之耐變形性、耐磨耗性及電阻穩定性。此種導電粉末可表現出如下效果:於測試用連接器被壓縮時,聚合物層亦靈活地變形而粒子間之接點不錯開且彼此以面接觸形態保持接觸,於聚合物層結合有複數個導電性粒子,因此表現出優異之電阻穩定性,即便反覆使用,亦穩定地傳輸電信號。The conductive powder of one aspect of the present invention can exhibit excellent deformation resistance, abrasion resistance, and resistance stability. This kind of conductive powder can exhibit the following effects: when the connector for testing is compressed, the polymer layer is also flexibly deformed, and the contact points between the particles are not open and keep in contact with each other in a surface contact form. The polymer layer is combined with a plurality of Each conductive particle, therefore, exhibits excellent resistance stability, and even if used repeatedly, it also stably transmits electrical signals.
本發明之實施例或一觀點係以說明本發明之技術思想為目的而例示。本發明之權利範圍並不限定於以下提出之實施例、一觀點或該等之具體說明。The embodiment or a viewpoint of the present invention is exemplified for the purpose of explaining the technical idea of the present invention. The scope of rights of the present invention is not limited to the following embodiments, a viewpoint, or specific descriptions thereof.
只要無其他定義,則本發明中使用之所有技術用語及科學用語具有於本發明所屬之技術領域內具有常識者通常理解之含義。本發明中使用之所有用語係以更明確地說明本發明為目的而選擇者,並非係為了限制本發明之權利範圍而選擇者。As long as there are no other definitions, all technical and scientific terms used in the present invention have the meanings commonly understood by those with common sense in the technical field to which the present invention belongs. All terms used in the present invention are selected for the purpose of more clearly describing the present invention, and not for the purpose of limiting the scope of rights of the present invention.
本發明中使用之如“包含”、“具備”、“具有”等之表達係只要未於包含相應之表達的語句或句子中提及其他含義,則應理解為具有包含其他實施例之可能性之開放型用語(open-ended terms)。The expression system used in the present invention such as "include", "have", "have", etc., as long as other meanings are not mentioned in the sentence or sentence containing the corresponding expression, it should be understood as having the possibility of including other embodiments The open-ended terms (open-ended terms).
本發明中使用之如“僅包含”相應構成等之表達應理解為排除除了相應構成以外包含其他構成之可能性之封閉式用語(closed-ended terms)。Expressions such as "only including" corresponding components used in the present invention should be understood as closed-ended terms that exclude the possibility of including other components in addition to the corresponding components.
只要未提及其他含義,則本發明中所記述之單數型表達可包含複數型含義,此種情形亦相同地適用於發明申請專利範圍中所記載之單數型表達。As long as no other meaning is mentioned, the singular expression described in the present invention may include the plural meaning, and this situation is equally applicable to the singular expression described in the scope of the invention application.
本發明中使用之“第1”、“第2”等表達用於相互區分複數個構成要素,並非限定相應構成要素之順序或重要度。The expressions such as "first" and "second" used in the present invention are used to distinguish plural constituent elements from each other, and do not limit the order or importance of corresponding constituent elements.
於本發明之一觀點中,用語“約”係以包括包含於具體數值之製程上之誤差或屬於本發明之技術思想的範疇之略微之數值調整之意圖使用。例如,用語“約”係指其所表示之值之±10%之範圍,於一觀點中為±5%之範圍,於又一觀點中為±2%之範圍。於本發明內容之領域中,只要未提及值具體地要求更小之範圍,則該水準之近似值為宜。In one aspect of the present invention, the term "about" is used for the purpose of including errors included in the manufacturing process of specific numerical values or slight numerical adjustments belonging to the scope of the technical idea of the present invention. For example, the term "about" refers to the range of ±10% of the value it represents, in one viewpoint it is in the range of ±5%, and in another viewpoint it is in the range of ±2%. In the field of the content of the present invention, as long as the value is not mentioned and a smaller range is specifically required, the approximate value of the level is appropriate.
本發明中使用之“上方”、“上”等方向指示語係指以測試用連接器100為基準而配置被測試器件10之端子11之方向,“下方”、“下”等方向指示語係指以測試用連接器100為基準而配置檢測設備20之端子21之方向。本發明中提及之測試用連接器100之“厚度方向”係指上下方向。該厚度方向僅係以明確地理解本發明之方式進行說明之基準,當然亦可根據基準位置來不同地定義上方及下方。The direction indicators such as "upper" and "upper" used in the present invention refer to the direction in which the
於一觀點中,本發明可提供一種導電粉末,其包含:核心粒子;及聚合物層,其包圍上述核心粒子之表面;且上述聚合物層包含與聚合物結合之導電性粒子,上述聚合物包含一種以上之不飽和烴、芳香族烴或該兩者。In one aspect, the present invention can provide a conductive powder comprising: a core particle; and a polymer layer surrounding the surface of the core particle; and the polymer layer includes conductive particles combined with a polymer, the polymer Contains more than one type of unsaturated hydrocarbons, aromatic hydrocarbons, or both.
於本發明之一觀點中,上述聚合物層與複數個導電性粒子之間之結合可藉由如下方式實現:於上述聚合物層包圍核心粒子之狀態下,使包含上述導電性粒子之前驅物之溶液吸收至上述聚合物層,使上述前驅物還原。藉由此種結合,上述複數個導電性粒子中之一部分附著或結合於聚合物層之外部表面,上述複數個導電性粒子之剩餘部分中之一部分可注入或滲透至聚合物層之內部而存在。In one aspect of the present invention, the bonding between the polymer layer and a plurality of conductive particles can be achieved by the following method: in a state where the polymer layer surrounds the core particles, the conductive particle precursor is included The solution is absorbed into the polymer layer to reduce the precursor. With this combination, a part of the plurality of conductive particles is attached or bonded to the outer surface of the polymer layer, and a part of the remaining part of the plurality of conductive particles can be injected or penetrated into the inside of the polymer layer to exist. .
於本發明之一觀點中,上述複數個導電性粒子中之一部分於露出於上述聚合物層之外部表面之狀態下結合於上述聚合物層,上述複數個導電性粒子中之其餘一部分能夠以浸漬於上述聚合物層之狀態結合於上述聚合物層。In one aspect of the present invention, a part of the plurality of conductive particles is bonded to the polymer layer in a state exposed on the outer surface of the polymer layer, and the remaining part of the plurality of conductive particles can be impregnated The state of the above-mentioned polymer layer is bonded to the above-mentioned polymer layer.
於一觀點中,本發明可提供一種導電粉末,其包含聚合物,於上述聚合物之表面結合有複數個導電性粒子,上述聚合物包含一種以上之不飽和烴、芳香族烴或該兩者。In one aspect, the present invention can provide a conductive powder comprising a polymer, a plurality of conductive particles are bonded to the surface of the polymer, and the polymer comprises more than one unsaturated hydrocarbon, aromatic hydrocarbon, or both .
於本發明之一觀點中,上述聚合物與複數個導電性粒子之間之結合可藉由如下方式實現:使包含上述導電性粒子之前驅物之溶液吸收至上述聚合物,使上述前驅物還原。藉由此種結合,上述導電性粒子中之一部分附著或結合於上述聚合物之表面,上述複數個導電性粒子之剩餘部分中之一部分可注入或滲透至上述聚合物之外廓的內部而存在。In one aspect of the present invention, the bonding between the polymer and a plurality of conductive particles can be achieved by the following method: the solution containing the precursor of the conductive particles is absorbed into the polymer, and the precursor is reduced . By this bonding, a part of the conductive particles is attached or bonded to the surface of the polymer, and a part of the remaining parts of the plurality of conductive particles can be injected or penetrated into the inside of the outer outline of the polymer to exist. .
於本發明之一觀點中,上述複數個導電性粒子中之一部分於露出於外部表面之狀態下結合於上述聚合物,上述複數個導電性粒子之剩餘部分中之一部分能夠以浸漬於上述聚合物之狀態結合。In one aspect of the present invention, a part of the plurality of conductive particles is bonded to the polymer while being exposed on the external surface, and a part of the remaining part of the plurality of conductive particles can be impregnated in the polymer The state is combined.
於本發明之一觀點中,上述聚合物可為選自由聚乙烯、聚丙烯、聚四氟乙烯、聚氯乙烯、聚苯乙烯、聚丙烯腈、聚乙酸乙烯酯、聚甲基丙烯酸甲酯、該等之組合及該等之嵌段共聚物所組成之群中的一種以上。於本發明之一觀點中,上述聚合物可為苯乙烯嵌段共聚物。In one aspect of the present invention, the above-mentioned polymer may be selected from polyethylene, polypropylene, polytetrafluoroethylene, polyvinyl chloride, polystyrene, polyacrylonitrile, polyvinyl acetate, polymethyl methacrylate, One or more of these combinations and the group consisting of these block copolymers. In one aspect of the present invention, the above-mentioned polymer may be a styrene block copolymer.
於本發明之一觀點中,上述聚合物可為苯乙烯嵌段共聚物。In one aspect of the present invention, the above-mentioned polymer may be a styrene block copolymer.
於本發明之一觀點中,上述苯乙烯嵌段共聚物可為選自由苯乙烯-丁二烯-苯乙烯(SBS)共聚物、SIS(苯乙烯-異戊二烯-苯乙烯)共聚物、苯乙烯-(乙烯-丁二烯)-苯乙烯(SEBS)共聚物及該等之組合所組成之群中之一種以上,但並不限制於此。此種聚合物於用作導電粉末之聚合物層成分之情形時,良好地與核心粒子吸附,能夠優異地達成本發明所欲達成之效果。In one aspect of the present invention, the above-mentioned styrene block copolymer may be selected from styrene-butadiene-styrene (SBS) copolymers, SIS (styrene-isoprene-styrene) copolymers, There is one or more of styrene-(ethylene-butadiene)-styrene (SEBS) copolymers and combinations thereof, but it is not limited thereto. When such a polymer is used as a component of the polymer layer of a conductive powder, it adsorbs well with the core particles, and can excellently achieve the desired effect of the present invention.
於本發明之一觀點中,苯乙烯嵌段共聚物可具有如以下化學式1之結構,可為苯乙烯嵌段共聚物,可具有兩個苯乙烯聚合物嵌段。In one aspect of the present invention, the styrene block copolymer may have a structure as shown in the following chemical formula 1, may be a styrene block copolymer, and may have two styrene polymer blocks.
[化學式1] (於上述化學式1中,x、y、z可為1以上之整數,x與z可相同,A可為普通技術人員可使用之任意之重複單元)[Chemical formula 1] (In the above chemical formula 1, x, y, and z can be integers greater than 1, x and z can be the same, and A can be any repeating unit that can be used by a person of ordinary skill)
於本發明之一觀點中,上述核心粒子可為磁性粒子、聚合物粒子、除金屬以外之無機粒子、或有機-無機混合粒子,但並不限制於此。In one aspect of the present invention, the above-mentioned core particles may be magnetic particles, polymer particles, inorganic particles other than metals, or organic-inorganic hybrid particles, but are not limited thereto.
於本發明之一觀點中,上述磁性粒子可包含選自由鈷、鎳、鐵及包含該等中之任一種以上之合金所組成之群中的一種以上,但並不限制於此。藉此,可提高導電部130之導電性,且利用磁性體粒子於磁場內磁化之性質於下文敍述之製造方法中提高製造性。於本發明之一觀點中,上述合金可為於磁性物質(鈷、鎳及鐵)中之任一種中添加有除此以外之其他物質(例如,銅)之合金,或亦可為由該等中之至少2種以上形成之合金。In one aspect of the present invention, the magnetic particles may include one or more selected from the group consisting of cobalt, nickel, iron, and alloys including any one or more of these, but it is not limited thereto. Thereby, the conductivity of the
於本發明之一觀點中,上述聚合物粒子之聚合物可為選自由聚乙烯、聚丙烯、聚苯乙烯、聚氯乙烯、聚二氯亞乙烯、聚異丁烯、聚丁二烯、聚甲基丙烯酸甲酯、聚丙烯酸甲酯、聚碳酸酯、聚醯胺、酚甲醛樹脂、三聚氰胺甲醛樹脂、苯并胍胺甲醛樹脂、尿素甲醛樹脂、酚樹脂、三聚氰胺樹脂、苯并胍胺樹脂、尿素樹脂、環氧樹脂、不飽和聚酯樹脂、飽和聚酯樹脂、聚對苯二甲酸乙二酯、聚碸、聚苯醚、聚縮醛、聚醯亞胺、聚醯胺醯亞胺、聚醚醚酮、聚醚碸、二乙烯苯聚合物、二乙烯苯系共聚物及該等之組合所組成之群中之一種以上,但並不限制於此。In one aspect of the present invention, the polymer of the above-mentioned polymer particles may be selected from polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, polyisobutylene, polybutadiene, polymethyl Methyl acrylate, polymethyl acrylate, polycarbonate, polyamide, phenol formaldehyde resin, melamine formaldehyde resin, benzoguanamine formaldehyde resin, urea formaldehyde resin, phenol resin, melamine resin, benzoguanamine resin, urea resin , Epoxy resin, unsaturated polyester resin, saturated polyester resin, polyethylene terephthalate, polyether, polyphenylene ether, polyacetal, polyimide, polyimide imine, polyether One or more of the group consisting of ether ketone, polyether agglomerate, divinylbenzene polymer, divinylbenzene copolymer, and combinations thereof, but it is not limited thereto.
於本發明之一觀點中,聚合物粒子之聚合物可為將1種或2種以上之具有乙烯性不飽和基之聚合性單體聚合而成的聚合物。此處,具有乙烯性不飽和基之聚合性單體可為非交聯性單體或交聯性單體。In one aspect of the present invention, the polymer of the polymer particles may be a polymer obtained by polymerizing one or more polymerizable monomers having ethylenic unsaturated groups. Here, the polymerizable monomer having an ethylenically unsaturated group may be a non-crosslinkable monomer or a crosslinkable monomer.
於本發明之一觀點中,作為上述非交聯性單體,例如可列舉:苯乙烯、α-甲基苯乙烯等苯乙烯系單體;(甲基)丙烯酸、順丁烯二酸、順丁烯二酸酐等含有羧基之單體;(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸鯨蠟酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸異𦯉基酯等(甲基)丙烯酸烷基酯化合物;(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸甘油酯、聚氧乙烯(甲基)丙烯酸酯、(甲基)丙烯酸縮水甘油酯等含有氧原子之(甲基)丙烯酸酯化合物;(甲基)丙烯腈等含有腈之單體;甲基乙烯基醚、乙基乙烯基醚、丙基乙烯基醚等乙烯基醚化合物;乙酸乙烯酯、丁酸乙烯酯、月桂酸乙烯酯、硬脂酸乙烯酯等酸乙烯酯化合物;乙烯、丙烯、異戊二烯、丁二烯等不飽和烴;(甲基)丙烯酸三氟甲酯、(甲基)丙烯酸五氟乙酯、氯乙烯、氟乙烯、氯苯乙烯等含有鹵素之單體等,但並不限制於此。In one aspect of the present invention, examples of the non-crosslinkable monomer include: styrene-based monomers such as styrene and α-methylstyrene; (meth)acrylic acid, maleic acid, cis- Butenedioic anhydride and other monomers containing carboxyl groups; methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, (meth)acrylic acid 2- Ethylhexyl, lauryl (meth)acrylate, cetyl (meth)acrylate, stearyl (meth)acrylate, cyclohexyl (meth)acrylate, isopropyl (meth)acrylate, etc. Alkyl (meth)acrylate compounds; 2-hydroxyethyl (meth)acrylate, glycerol (meth)acrylate, polyoxyethylene (meth)acrylate, glycidyl (meth)acrylate, etc. contain oxygen Atom (meth)acrylate compounds; (meth)acrylonitrile and other monomers containing nitriles; vinyl ether compounds such as methyl vinyl ether, ethyl vinyl ether, and propyl vinyl ether; vinyl acetate, Vinyl butyrate, vinyl laurate, vinyl stearate and other acid vinyl ester compounds; ethylene, propylene, isoprene, butadiene and other unsaturated hydrocarbons; (meth) trifluoromethyl acrylate, (formaldehyde) Base) pentafluoroethyl acrylate, vinyl chloride, vinyl fluoride, chlorostyrene and other halogen-containing monomers, etc., but not limited thereto.
於本發明之一觀點中,作為上述交聯性單體,例如可列舉:四羥甲基甲烷四(甲基)丙烯酸酯、四羥甲基甲烷三(甲基)丙烯酸酯、四羥甲基甲烷二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、甘油三(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、(聚)丁二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯等多官能(甲基)丙烯酸酯化合物;(異)氰尿酸三烯丙酯、偏苯三酸三烯丙酯、二乙烯苯、鄰苯二甲酸二烯丙酯、二烯丙基丙烯醯胺、二烯丙基醚、γ-(甲基)丙烯氧丙基三甲氧基矽烷、三甲氧基矽烷基苯乙烯、乙烯基三甲氧基矽烷等含有矽烷之單體等。In one aspect of the present invention, examples of the crosslinkable monomer include tetramethylolmethane tetra(meth)acrylate, tetramethylolmethane tri(meth)acrylate, and tetramethylolmethane tetra(meth)acrylate. Methane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, glycerol tri(meth)acrylate , Glycerol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, (poly)butanediol di(meth)acrylate, Multifunctional (meth)acrylate compounds such as 1,4-butanediol di(meth)acrylate; triallyl (iso)cyanurate, triallyl trimellitate, divinylbenzene, o-benzene Diallyl dicarboxylate, diallyl acrylamide, diallyl ether, γ-(meth)acryloxypropyl trimethoxysilane, trimethoxysilyl styrene, vinyl trimethoxysilane Monomers containing silane, etc.
於本發明之一觀點中,上述具有乙烯性不飽和基之聚合性單體可藉由公知之方法聚合而獲得上述聚合物粒子。於此種公知之方法中,例如可列舉於存在自由基聚合起始劑之條件下進行懸浮聚合之方法、以及使用非交聯之種粒子來與自由基聚合起始劑一併使單體膨潤而進行聚合之方法等,但並不限制於此。In one aspect of the present invention, the polymerizable monomer having an ethylenically unsaturated group can be polymerized by a known method to obtain the polymer particle. Such known methods include, for example, a method of carrying out suspension polymerization in the presence of a radical polymerization initiator, and the use of non-crosslinked seed particles to swell the monomer together with the radical polymerization initiator. The method of polymerization is not limited to this.
於本發明之一觀點中,上述聚合物粒子之聚合物可為選自由聚茀、聚苯、聚芘、聚薁、聚萘、聚吡咯、聚咔唑、聚吲哚、聚氮呯、聚苯胺、聚噻吩、聚(3,4-伸乙二氧基噻吩)、聚苯硫醚、聚乙炔、聚苯乙烯磺酸酯及聚苯亞乙烯、及該等之組合所組成之群之一種以上,但並不限制於此。In one aspect of the present invention, the polymer of the above-mentioned polymer particles can be selected from the group consisting of polypyrene, polyphenylene, polypyrene, polyazulene, polynaphthalene, polypyrrole, polycarbazole, polybenzazole, polyazide, and Aniline, polythiophene, poly(3,4-ethylenedioxythiophene), polyphenylene sulfide, polyacetylene, polystyrene sulfonate and polyphenylene vinylene, and a combination of these The above, but not limited to this.
於本發明之一觀點中,上述無機粒子可包含選自由氧化矽、氧化鋁、鈦酸鋇、氧化鋯、碳黑及該等之組合所組成之群中之一種以上,但並不限制於此。作為由上述氧化矽形成之粒子,並無特別限定,例如可列舉藉由如下方式獲得之粒子:於將具有2個以上之水解性烷氧基矽烷基之矽化合物水解而形成交聯聚合物粒子後,視需要進行煅燒。作為上述有機-無機混合粒子,例如可列舉由交聯之烷氧基矽烷基聚合物與丙烯酸系樹脂形成之有機無機混合粒子等。上述有機-無機混合粒子可為具有核心及配置於該核心之表面上之殼之核殼型有機-無機混合粒子。此時,核心可為有機核心,殼可為無機殼。此處,有機核心可為以上述聚合物為材料之核心。In one aspect of the present invention, the above-mentioned inorganic particles may include one or more selected from the group consisting of silica, alumina, barium titanate, zirconia, carbon black, and combinations thereof, but are not limited thereto. . The particles formed of the above-mentioned silicon oxide are not particularly limited. Examples include particles obtained by hydrolyzing a silicon compound having two or more hydrolyzable alkoxysilyl groups to form cross-linked polymer particles. After that, calcination is carried out as necessary. Examples of the organic-inorganic hybrid particles include organic-inorganic hybrid particles formed of a crosslinked alkoxysilyl polymer and acrylic resin. The organic-inorganic hybrid particles may be core-shell organic-inorganic hybrid particles having a core and a shell arranged on the surface of the core. At this time, the core may be an organic core, and the shell may be an inorganic shell. Here, the organic core may be a core using the above-mentioned polymer as a material.
於本發明之一觀點中,上述導電性粒子可為選自由金、銀、鉑、鈀、銠及包含該等中之任一種以上之合金所組成之群中的一種以上,但並不限制於此。於本發明之一觀點中,上述合金可為於導電性粒子(金、銀、鉑、鈀及銠)中之任一種中添加有除此以外之其他物質(例如,磷)之合金,或亦可為由該等中之至少2種以上形成之合金。In one aspect of the present invention, the conductive particles may be one or more selected from the group consisting of gold, silver, platinum, palladium, rhodium, and alloys containing any one or more of these, but are not limited to this. In one aspect of the present invention, the above-mentioned alloy may be an alloy in which other substances (for example, phosphorus) are added to any one of conductive particles (gold, silver, platinum, palladium, and rhodium), or also It may be an alloy formed from at least two of these.
於本發明之一觀點中,上述核心粒子之形狀可定性地為球狀(spherical)、角狀(angular)、淚滴形狀(tear drop)、立方體形狀(cubic)、海綿形狀(sponge)、針形狀(ancicular)、圓筒形狀(cylindrical)、不規則形狀(irregular)、帶狀(ligamental)、片狀(flake)、纖維形狀(fibrous)、多邊形形狀(polygonal)、樹枝狀(dendritic)或集合體形狀(aggregate)。於本發明之一觀點中,關於上述核心粒子之尺寸,由於尺寸較小且每個粒子之尺寸不同,故而難以統一特定,但能夠以將粒子全部包容於內部之圓之直徑來表示(參照文獻[Randall M. German, Powder metallurgy science, Metal Powder Industry, 2nd edition, page 64 (March 1, 1994)])。例如,於本發明之一觀點中,關於核心粒子之尺寸,此種直徑可為約20 μm至約60 μm之範圍。In one aspect of the present invention, the shape of the core particles can be qualitatively spherical, angular, tear drop, cubic, sponge, needle Ancicular, cylindrical, irregular, ligamental, flake, fibrous, polygonal, dendritic, or collection Body shape (aggregate). In one aspect of the present invention, the size of the aforementioned core particles is difficult to be uniformly specified because the size is small and the size of each particle is different, but it can be expressed in terms of the diameter of the circle that contains all the particles inside (reference document [Randall M. German, Powder metallurgy science, Metal Powder Industry, 2nd edition, page 64 (March 1, 1994)]). For example, in one aspect of the present invention, regarding the size of the core particle, the diameter may be in the range of about 20 μm to about 60 μm.
於本發明之一觀點中,上述聚合物層可包圍或塗佈核心粒子之表面。此時,上述聚合物層之厚度難以統一特定,但其厚度可分佈於約0.1 μm以上約5 μm以下之範圍內。於本發明之一觀點中,上述導電粉末可進而包含第2塗佈層。於本發明之一觀點中,上述第2塗佈層可存在於核心粒子與聚合物層之間或存在於聚合物層上。於本發明之一觀點中,第2塗佈層可包含選自由金、銀、鉑、鈀、銠及包含該等中之任一種以上之合金所組成之群中的一種以上,但並不限制於此。In one aspect of the present invention, the above-mentioned polymer layer can surround or coat the surface of the core particle. At this time, it is difficult to uniformly specify the thickness of the above-mentioned polymer layer, but its thickness can be distributed in the range of about 0.1 μm or more and about 5 μm or less. In one aspect of the present invention, the conductive powder may further include a second coating layer. In one aspect of the present invention, the above-mentioned second coating layer may exist between the core particle and the polymer layer or on the polymer layer. In one aspect of the present invention, the second coating layer may include one or more selected from the group consisting of gold, silver, platinum, palladium, rhodium, and alloys containing any one or more of these, but is not limited Here.
於本發明之一觀點中,導電粉末之尺寸可為約20 μm至約65 μm之範圍。In one aspect of the present invention, the size of the conductive powder may be in the range of about 20 μm to about 65 μm.
於一觀點中,本發明可提供一種測試用連接器,其係用以配置於被測試器件與檢測設備之間而將被測試器件與檢測設備彼此電性連接者,其包含:絕緣性材質之薄片;及導電部,其於上述薄片內沿上下方向延伸而可沿上下方向通電。In one point of view, the present invention can provide a test connector, which is used to connect the device under test and the test equipment electrically to each other, which includes: an insulating material Sheet; and a conductive portion, which extends in the vertical direction within the sheet and can be energized in the vertical direction.
於本發明之一觀點中,上述導電部可包含本發明之一觀點之導電粉末。In one aspect of the present invention, the above-mentioned conductive portion may include the conductive powder according to one aspect of the present invention.
於本發明之一觀點中,參考圖1,被測試器件10可為半導體器件等。被測試器件10包含複數個端子11。複數個端子11配置於被測試器件10之下側面。於對被測試器件10進行測試時,複數個端子11可與測試用連接器100之上側面接觸。In one aspect of the present invention, referring to FIG. 1, the device under
檢測設備20包含複數個端子21。複數個端子21與複數個端子11對應。於對被測試器件10進行測試時,複數個端子21可與測試用連接器100之下側面接觸。The
於本發明之一觀點中,複數個端子21之各者配置於沿上下方向與複數個端子11之各者面向之位置。雖未圖示,但於複數個導電部130相對於上下方向傾斜之另一實施例中,複數個端子21之各者可配置於沿複數個導電部130之傾斜方向與複數個端子11之各者面向的位置。In one aspect of the present invention, each of the plurality of
於本發明之一觀點中,測試用連接器100係為了配置於被測試器件10與檢測設備20之間將被測試器件10與檢測設備20彼此電性連接而構成。測試用連接器100包含:絕緣性材質之薄片110;及導電部130,其係為了將被測試器件10之端子11與檢測設備20之端子21電性連接而構成。In one aspect of the present invention, the
於本發明之一觀點中,薄片110沿上下方向具有厚度。薄片110之厚度(厚度方向之長度)小於垂直於薄片110之厚度方向之方向上的長度。In one aspect of the present invention, the
於本發明之一觀點中,薄片110由電絕緣性材質形成。薄片110可由能夠彈性變形之材質形成。In one aspect of the present invention, the
於本發明之一觀點中,薄片110可包含具有絕緣性之彈性高分子物質。上述彈性高分子物質可為具有交聯結構之高分子物質。作為可用於獲得上述交聯高分子物質之硬化性高分子物質形成材料之例,可列舉:聚丁二烯橡膠、天然橡膠、聚異戊二烯橡膠、苯乙烯-丁二烯共聚物橡膠、丙烯腈-丁二烯共聚物橡膠等共軛二烯系橡膠及該等之氫化物、苯乙烯-丁二烯-二烯嵌段共聚物橡膠、苯乙烯-異戊二烯嵌段共聚物等嵌段共聚物橡膠及該等之氫化物、氯丁二烯、胺基甲酸酯橡膠、聚酯系橡膠、表氯醇橡膠、聚矽氧橡膠、乙烯-丙烯共聚物橡膠、乙烯-丙烯-二烯共聚物橡膠等,但並不限制於此。In one aspect of the present invention, the
於本發明之一觀點中,上述薄片110可包含聚矽氧橡膠。此處,聚矽氧橡膠可為液態聚矽氧橡膠(LSR,Liquid Silicone Rubber)。又,聚矽氧橡膠可為聚矽氧烷,且可為縮合型、加成型、含有乙烯基或羥基之聚矽氧烷,例如可為聚二甲基矽氧烷、聚甲基苯基矽氧烷、或聚二苯基矽氧烷,但並不限制於此。本發明中可使用之液態聚矽氧橡膠可包含於不使本發明之一觀點之測試用連接器的性能劣化之範圍內可由普通技術人員用作絕緣性物質之液態聚矽氧橡膠。In one aspect of the present invention, the
於本發明之一觀點中,導電部130可沿上下方向延伸。導電部130於薄片110內沿上下方向延伸而可沿上下方向通電。In one aspect of the present invention, the
於本發明之一觀點中,導電部130配置於薄片110。導電部130可由薄片110支持。In one aspect of the present invention, the
於本發明之一觀點中,複數個導電部130沿垂直於上下方向之方向彼此隔開。複數個導電部130可彼此實質上隔開固定間隔而排列。In one aspect of the present invention, the plurality of
於本發明之一觀點中,導電部130之上下方向兩端露出於薄片110之上下方向表面。導電部130之上端露出於薄片110之上側表面,導電部130之下端露出於薄片110之下側表面。導電部130之上端以可與被測試器件10之端子11接觸之方式構成,導電部130之下端以可與檢測設備20之端子21接觸之方式構成。In one aspect of the present invention, the upper and lower ends of the
於本發明之一觀點中,導電部130包含露出於薄片110之表面之露出部(未圖示),該露出部係指導電部130之表面。上述露出部位於導電部130之兩端。薄片110能夠以包圍除上述露出部以外之導電部130之方式構成。In one aspect of the present invention, the
以下,對導電粉末之製造方法進行說明。Hereinafter, the manufacturing method of the conductive powder will be described.
於一觀點中,本發明可提供一種製造方法,其係導電粉末之製造方法,其包含如下步驟:(1)於核心粒子表面塗佈聚合物層之步驟(圖4(A));(2)使包含導電性粒子之前驅物之溶液吸收至聚合物層之步驟(圖4(B));(3)使吸收於聚合物層之導電性粒子之前驅物還原而結合至聚合物層之步驟(圖4(C))。In one aspect, the present invention can provide a manufacturing method, which is a manufacturing method of conductive powder, which includes the following steps: (1) the step of coating the surface of the core particle with a polymer layer (Figure 4(A)); (2) ) The step of absorbing the solution containing the precursor of conductive particles into the polymer layer (Figure 4(B)); (3) reducing the precursor of the conductive particles absorbed in the polymer layer to bond to the polymer layer Steps (Figure 4(C)).
於本發明之一觀點中,上述製造方法於步驟(3)後,可進而包含(4)反覆進行步驟(2)與步驟(3)而使導電性粒子充分地結合至聚合物層之步驟。In one aspect of the present invention, after step (3), the above-mentioned manufacturing method may further include (4) the step of repeatedly performing steps (2) and (3) to fully bond the conductive particles to the polymer layer.
本發明之一觀點之導電粉末可藉由包含下述步驟之方法製造。The conductive powder according to one aspect of the present invention can be produced by a method including the following steps.
步驟(1):將核心粒子與溶解於有機溶劑之聚合物溶液放入至燒杯進行混合。於添加水使聚合物溶液分離後去除該聚合物溶液。Step (1): Put the core particle and the polymer solution dissolved in the organic solvent into a beaker and mix. After adding water to separate the polymer solution, the polymer solution is removed.
步驟(2):此後,進行超音波處理來析出聚合物。反覆進行超音波處理與析出過程,直至燒杯之水變清為止。此後,去除水,利用醇清洗塗佈有聚合物之核心粒子。Step (2): After that, ultrasonic treatment is performed to precipitate the polymer. Repeat the ultrasonic treatment and precipitation process until the water in the beaker becomes clear. Thereafter, the water is removed, and the polymer-coated core particles are cleaned with alcohol.
步驟(3):將於上述步驟中獲得之塗佈有聚合物之粉末與導電性粒子之前驅物溶液放入至另外的圓錐形管進行攪拌。此時,導電性粒子之前驅物溶液可為將包含導電性粒子之前驅物(例如,如三氟乙酸銀(CF3 COOAg)之化合物)溶解於醇所得者。於攪拌後,去除前驅物溶液。Step (3): Put the polymer-coated powder and conductive particle precursor solution obtained in the above step into another conical tube and stir. At this time, the conductive particle precursor solution may be obtained by dissolving a conductive particle precursor (for example, a compound such as silver trifluoroacetate (CF 3 COOAg)) in alcohol. After stirring, remove the precursor solution.
步驟(4):此後,於管中添加還原劑溶液進行攪拌。此時,還原劑溶液可為將還原劑(例如,如水合肼(NH2 NH2 ·xH2 O)之還原劑)溶解於醇而成者。於攪拌後,去除還原劑,之後利用水或醇清洗上述粉末。Step (4): After that, add the reducing agent solution to the tube and stir. At this time, the reducing agent solution may be obtained by dissolving a reducing agent (for example, a reducing agent such as hydrazine hydrate (NH 2 NH 2 ·xH 2 O)) in alcohol. After stirring, the reducing agent is removed, and then the powder is washed with water or alcohol.
步驟(5):反覆進行步驟(3)與步驟(4),直至導電性粒子充分地結合至塗佈於核心粒子表面之聚合物層為止。最後,於利用醇清洗粉末後,使其乾燥而獲得本發明之導電粉末。Step (5): Repeat steps (3) and (4) until the conductive particles are fully bonded to the polymer layer coated on the surface of the core particles. Finally, after washing the powder with alcohol, it is dried to obtain the conductive powder of the present invention.
於本發明之一觀點中,在聚合物溶液中,聚合物與溶劑之重量比可為1:3至1:50。於本發明之一觀點中,聚合物溶液之溶劑可為選自正戊烷(n-Pentane)、正己烷(n-Hexane)、正庚烷(n-Heptane)、正辛烷(n-Octane)、2-甲基戊烷(2-Methylpentane)、環戊烷(Cyclopentane)、環己烷(Cyclohexane)、甲基環已烷(Methylcyclohexane)、苯、乙苯、1-己烯(1-Hexene)、四氫呋喃(Tetrahydrofuran)及甲苯之群中之一種以上。In one aspect of the present invention, in the polymer solution, the weight ratio of the polymer to the solvent may be 1:3 to 1:50. In one aspect of the present invention, the solvent of the polymer solution can be selected from n-Pentane, n-Hexane, n-Heptane, n-Octane ), 2-Methylpentane, Cyclopentane, Cyclohexane, Methylcyclohexane, Benzene, Ethylbenzene, 1-Hexene ), Tetrahydrofuran and toluene.
於本發明之一觀點中,在導電性粒子溶液中,包含導電性粒子之化合物與溶劑之重量比可為1:2至1:10。於本發明之一觀點中,導電性粒子溶液之溶劑可為水或醇,具體而言,可為選自由水、甲醇、乙醇、2-丙醇、1-丁醇及該等之組合所組成之群中之一種以上。In one aspect of the present invention, in the conductive particle solution, the weight ratio of the compound containing the conductive particles to the solvent may be 1:2 to 1:10. In one aspect of the present invention, the solvent of the conductive particle solution can be water or alcohol. Specifically, it can be selected from water, methanol, ethanol, 2-propanol, 1-butanol, and combinations thereof. More than one in the group.
於本發明之一觀點中,在還原劑溶液中,還原劑與溶劑之重量比可為1:5至1:40。於本發明之一觀點中,導電性粒子溶液之溶劑可為水或醇,具體而言,可為選自由水、甲醇、乙醇、2-丙醇、1-丁醇及該等之組合所組成之群中之一種以上。In one aspect of the present invention, in the reducing agent solution, the weight ratio of the reducing agent to the solvent may be 1:5 to 1:40. In one aspect of the present invention, the solvent of the conductive particle solution can be water or alcohol. Specifically, it can be selected from water, methanol, ethanol, 2-propanol, 1-butanol, and combinations thereof. More than one in the group.
以下,對測試用連接器100之製造方法進行說明。實施例A之上述製造方法包含將沿上下方向延伸之固體化之導電部130配置於模具內的步驟。上述實施例A之上述製造方法於此後包含藉由將聚矽氧等液態絕緣材料注入至上述模具內而使其硬化來形成薄片110之步驟。Hereinafter, the manufacturing method of the
於實施例B中,亦可利用三維印刷方式製造測試用連接器100。此處,可藉由三維印刷形成薄片110或形成導電部130,亦可形成整個測試用連接器。In the embodiment B, the
實施例C之製造方法包含於硬化之薄片110形成配置導電部130之孔的步驟。上述孔能夠以上下貫通薄片110之方式形成。可利用雷射形成上述孔。上述實施例C之製造方法包含藉由將包含本發明之一觀點之導電粉末的溶液注入至薄片110之上述孔而使其硬化來形成導電部130之步驟。The manufacturing method of the embodiment C includes the step of forming a hole for disposing the
上述實施例D之製造方法包含將本發明之一觀點之導電粉末與液態絕緣性材料的混合物注入至特定位置之(a)步驟。例如,上述液態絕緣性材料可為液態聚矽氧材質。上述實施例D之製造方法於(a)步驟後,包含產生磁場以使上述經塗佈之導電粉末排列至既定位置之(b)步驟。於上述(b)步驟中,藉由產生上述磁場而上述導電粉末形成導電部130。此處,導電部130沿上下方向延伸,可沿上下方向通電。與上述導電粉末一併注入於上述特定位置之上述液態絕緣性材料經由上述(b)步驟後硬化。經由上述(b)步驟後硬化之上述絕緣性材料可構成薄片110之至少一部分。經由上述(b)步驟後硬化之上述絕緣性材料可執行支持導電部130之功能。The manufacturing method of the above-mentioned embodiment D includes the step (a) of injecting the mixture of the conductive powder and the liquid insulating material according to one aspect of the present invention to a specific position. For example, the above-mentioned liquid insulating material may be liquid polysiloxy material. After step (a), the manufacturing method of the above embodiment D includes a step (b) of generating a magnetic field to arrange the coated conductive powder to a predetermined position. In the step (b), the conductive powder forms the
作為上述實施例D之一例,上述特定位置可為模具內部。於上述(a)步驟中,可將上述導電粉末及液態絕緣性材料之混合物注入至上述模具內部。於(a)步驟中注入之上述液態絕緣性材料經由(b)步驟後硬化,藉此形成薄片110。藉由在上述(b)步驟中產生之磁場,上述導電粉末可於液態絕緣性材料內流動而排列至既定位置。As an example of the above-mentioned embodiment D, the above-mentioned specific position may be inside the mold. In the step (a), the mixture of the conductive powder and the liquid insulating material may be injected into the mold. The liquid insulating material injected in the step (a) is cured after the step (b), thereby forming the
作為上述實施例D之另一例,上述特定位置可為形成於硬化之薄片之孔內部。於上述(a)步驟前,可進行形成沿上下方向貫通硬化之薄片之孔之孔形成步驟。上述孔能夠以上下貫通上述薄片之方式形成。可利用雷射形成上述孔。於上述(a)步驟中,可將本發明之一觀點之導電粉末及液態絕緣性材料之混合物注入至上述孔。藉由在上述(b)步驟中產生之磁場,上述導電粉末可於上述孔內部流動而排列至既定位置。經由上述(b)步驟後,上述液態絕緣性材料硬化,藉此可構成上述薄片之一部分。As another example of the above-mentioned embodiment D, the above-mentioned specific position may be formed inside the hole of the hardened sheet. Before the step (a) above, a hole forming step of forming holes penetrating the hardened sheet in the vertical direction may be performed. The above-mentioned hole can be formed by penetrating the above-mentioned sheet up and down. A laser can be used to form the above-mentioned holes. In the above step (a), a mixture of the conductive powder and the liquid insulating material according to one aspect of the present invention can be injected into the hole. By the magnetic field generated in the step (b), the conductive powder can flow inside the pores and be arranged to a predetermined position. After the step (b), the liquid insulating material is cured, thereby forming a part of the sheet.
以下,列舉實施例及試驗例來更具體地對本發明之構成及效果進行說明。然而,該等實施例及試驗例僅係為了有助於理解本發明而以例示之目的提供者,本發明之範疇及範圍並不限制於下述例。Hereinafter, examples and test examples are given to more specifically describe the structure and effects of the present invention. However, these examples and test examples are provided for the purpose of illustration to help understand the present invention, and the scope and scope of the present invention are not limited to the following examples.
又,參照隨附圖式對本發明之實施例進行說明。於隨附圖式中,可對相同或對應之構成要素賦予相同之參照符號。又,於以下實施例之說明中,可省略重複記述相同或對應之構成要素之內容。然而,即便省略有關構成要素之記述,亦不意味著此種構成要素不包含於某個實施例。In addition, embodiments of the present invention will be described with reference to the accompanying drawings. In the accompanying drawings, the same or corresponding components may be given the same reference signs. In addition, in the description of the following embodiments, repetitive description of the same or corresponding constituent elements may be omitted. However, even if the description of the constituent elements is omitted, it does not mean that such constituent elements are not included in a certain embodiment.
[實施例]具有附著或結合於聚合物層之外部表面且注入或滲透於聚合物層內部之導電性粒子之導電粉末的製造 (1)將平均粒徑為30 μm之鎳核心粒子粉末與溶解於甲苯之苯乙烯-丁二烯-苯乙烯(SBS)溶液放入至燒杯進行混合。此時,SBS聚合物與甲苯之重量比可為1:25至1:40。於添加水使SBS溶液分離後去除該SBS溶液。[Example] Manufacturing of conductive powder with conductive particles attached or bonded to the outer surface of the polymer layer and injected or penetrated into the interior of the polymer layer (1) Put the nickel core particle powder with an average particle diameter of 30 μm and the styrene-butadiene-styrene (SBS) solution dissolved in toluene into a beaker and mix. At this time, the weight ratio of SBS polymer to toluene can be 1:25 to 1:40. After adding water to separate the SBS solution, the SBS solution was removed.
(2)此後,進行超音波處理來析出SBS。反覆進行超音波處理與析出過程,直至燒杯之水變清為止。此後,去除水,利用醇清洗塗佈有SBS之鎳核心粒子粉末。(2) After that, ultrasonic processing is performed to precipitate SBS. Repeat the ultrasonic treatment and precipitation process until the water in the beaker becomes clear. After that, the water is removed, and the nickel core particle powder coated with SBS is cleaned with alcohol.
(3)將於上述步驟中獲得之塗佈有SBS之粉末與導電性粒子溶液放入至另外之圓錐形管進行攪拌。此時,導電性粒子溶液可為將包含導電性粒子之化合物(例如,如三氟乙酸銀(CF3 COOAg)之化合物)溶解於乙醇所得者。此時,三氟乙酸銀與乙醇之重量比可為1:5。於攪拌後,去除導電性粒子溶液。(3) Put the SBS-coated powder and conductive particle solution obtained in the above steps into another conical tube and stir. At this time, the conductive particle solution may be obtained by dissolving a compound containing conductive particles (for example, a compound such as silver trifluoroacetate (CF 3 COOAg)) in ethanol. At this time, the weight ratio of silver trifluoroacetate to ethanol may be 1:5. After stirring, the conductive particle solution is removed.
(4)此後,於管中添加還原劑溶液進行攪拌。此時,還原劑溶液可為將還原劑(例如,如水合肼(NH2 NH2 ·xH2 O)之還原劑)溶解於乙醇而成者。此時,還原劑與乙醇之重量比可為1:15。於攪拌後,去除還原劑,之後利用水或醇清洗上述粉末。(4) After that, add the reducing agent solution to the tube and stir. At this time, the reducing agent solution may be obtained by dissolving a reducing agent (for example, a reducing agent such as hydrazine hydrate (NH 2 NH 2 ·xH 2 O)) in ethanol. At this time, the weight ratio of reducing agent to ethanol may be 1:15. After stirring, the reducing agent is removed, and then the powder is washed with water or alcohol.
(5)反覆進行步驟(3)與步驟(4),直至導電性粒子充分地塗佈浸漬至塗佈於核心粒子表面之聚合物層為止。最後,於利用醇清洗粉末後,使其乾燥而獲得本發明之導電粉末。(5) Steps (3) and (4) are repeated until the conductive particles are sufficiently coated and impregnated to the polymer layer coated on the surface of the core particles. Finally, after washing the powder with alcohol, it is dried to obtain the conductive powder of the present invention.
[試驗例] 利用掃描式電子顯微鏡(Scanning Electron Microscope,SEM)及聚焦離子束(Focused Ion Beam,FIB)對自上述實施例最終獲得之本發明之導電粉末之表面與剖面進行觀察。將SEM結果示於圖5,將FIB結果示於圖6與圖7。根據此種圖,可確認到本發明之導電粉末彼此不凝聚而良好地塗佈結合有導電性粒子之聚合物層。[Test Example] Using Scanning Electron Microscope (SEM) and Focused Ion Beam (FIB) to observe the surface and cross-section of the conductive powder of the present invention finally obtained from the above examples. The SEM results are shown in FIG. 5, and the FIB results are shown in FIGS. 6 and 7. According to such figures, it can be confirmed that the conductive powders of the present invention do not aggregate with each other, and the polymer layer to which the conductive particles are bonded is applied well.
以上,藉由一部分實施例與隨附圖式所示之例對本發明之技術思想進行了說明,但應瞭解,可於不脫離本發明所屬之技術領域內具有常識者可理解之本發明之技術思想及範圍內進行各種置換、變化及變更。又,應理解為此種置換、變化及變更屬於隨附之發明申請專利範圍內。Above, the technical idea of the present invention has been explained by some embodiments and examples shown in the accompanying drawings. However, it should be understood that the technology of the present invention can be understood by those with common sense in the technical field to which the present invention belongs. Various substitutions, changes and changes are made within the mind and scope. In addition, it should be understood that such replacements, changes and changes fall within the scope of the attached invention application patent.
10:被測試器件 11:被測試器件之端子 20:檢測設備 21:檢測設備之端子 30:導電粉末 40:聚合物層 50:導電性粒子 60:核心粒子 100:測試用連接器 110:薄片 130:導電部10: Device under test 11: Terminal of the device under test 20: Testing equipment 21: Terminals of testing equipment 30: conductive powder 40: polymer layer 50: conductive particles 60: core particles 100: Test connector 110: flakes 130: conductive part
圖1係一實施例之測試用連接器100之局部剖視圖,表示測試用連接器100配置於被測試器件10與檢測設備20之間之情況。
圖2係本發明之一觀點之導電粉末30之模式圖。此種粒子呈於核心粒子60塗佈有聚合物層40之形態,於聚合物層中,複數個導電性粒子50附著或結合於聚合物層之外部表面,能夠注入或滲透於聚合物層之內部而存在。
圖3係表示本發明之一觀點之導電粉末於使用前後受到壓力時保持面接觸形態之情況的模式圖。此處,(a)圖係表示使用前存在於導電部之導電粉末30之排列,(b)圖係表示上下受到壓力時導電粉末彼此接觸之形態。根據圖可知,受到壓力之導電粉末係聚合物層彈性變形而接觸面積變大。即,導電粉末呈彼此面接觸之形態。又,即便隨著接觸面積變大成為面接觸而導電粉末彼此推擠脫離之程度減小,於去除壓力之情形時,導電粉末亦恢復至原先之位置。
圖4係按時間順序表示藉由本發明之一觀點之導電粉末之製造步驟獲得的導電粉末之模式圖。(A)係表示將聚合物層塗佈於核心粒子表面而獲得之導電粉末。(B)係表示導電性粒子吸收於聚合物層之狀態之導電粉末。(C)係表示所吸收之導電性粒子還原,從而複數個導電性粒子附著或結合於聚合物層之外部表面且注入或滲透至聚合物層之內部而存在之導電粉末。(D)係表示導電性粒子滲透前後之導電粉末。
圖5係表示根據本發明之一觀點製造之以聚合物層塗佈之導電粉末的掃描式顯微鏡照片。根據本發明,於塗佈後,導電粉末彼此不凝聚而良好地塗佈有聚合物層。
圖6及圖7係表示以上述聚合物層塗佈之導電粉末之利用聚焦離子束之剖面照片。FIG. 1 is a partial cross-sectional view of a
10:被測試器件 10: Device under test
11:被測試器件之端子 11: Terminal of the device under test
20:檢測設備 20: Testing equipment
21:檢測設備之端子 21: Terminals of testing equipment
100:測試用連接器 100: Test connector
110:薄片 110: flakes
130:導電部 130: conductive part
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020190032568A KR102113732B1 (en) | 2019-03-21 | 2019-03-21 | Conductive powder and test connector comprising the same |
KR10-2019-0032568 | 2019-03-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202040593A TW202040593A (en) | 2020-11-01 |
TWI744817B true TWI744817B (en) | 2021-11-01 |
Family
ID=70910254
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109107608A TWI744817B (en) | 2019-03-21 | 2020-03-09 | Conductive powder and test connector comprising the same |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR102113732B1 (en) |
TW (1) | TWI744817B (en) |
WO (1) | WO2020189901A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11128072B1 (en) | 2020-07-22 | 2021-09-21 | TE Connectivity Services Gmbh | Electrical connector assembly having variable height contacts |
US11509080B2 (en) | 2020-07-22 | 2022-11-22 | Te Connectivity Solutions Gmbh | Electrical connector assembly having hybrid conductive polymer contacts |
US11509084B2 (en) | 2020-07-24 | 2022-11-22 | Te Connectivity Solutions Gmbh | Electrical connector assembly having hybrid conductive polymer contacts |
US11894629B2 (en) | 2021-03-09 | 2024-02-06 | Tyco Electronics Japan G.K. | Electrical interconnect with conductive polymer contacts having tips with different shapes and sizes |
KR102635465B1 (en) * | 2021-12-31 | 2024-02-13 | 주식회사 아이에스시 | Conductive particle and test connector comprising the same |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201028498A (en) * | 2008-09-25 | 2010-08-01 | Ube Nitto Kasei Co | Conductive particles and method for forming metal film |
TW201344703A (en) * | 2012-03-06 | 2013-11-01 | Toyo Ink Sc Holdings Co Ltd | Conductive microparticle and manufacturing method thereof, conductive resin composition, conductive sheet, and electromagnetic wave shielding sheet |
KR20160134311A (en) * | 2015-05-15 | 2016-11-23 | 주식회사 아이에스시 | anisotropic conductive sheet |
KR20170025996A (en) * | 2015-08-31 | 2017-03-08 | 삼성전자주식회사 | Anisotropic conductive material, electronic device including anisotropic conductive material and method of manufacturing electronic device |
TW201743341A (en) * | 2016-05-11 | 2017-12-16 | Isc股份有限公司 | Test socket and conductive particle |
TW201826290A (en) * | 2016-05-11 | 2018-07-16 | Isc股份有限公司 | Test socket and conductive particle |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100889256B1 (en) * | 2007-11-07 | 2009-03-19 | 주식회사 라이온켐텍 | Metal composite powder consisted of core-shell structure for a good laser sintering property and manufacturing method thereof |
KR101148143B1 (en) * | 2008-12-17 | 2012-05-23 | 제일모직주식회사 | Insulated conductive particles and anisotropic conductive film composition using the same |
JP6523794B2 (en) * | 2014-06-06 | 2019-06-05 | 積水化学工業株式会社 | Conductive material and connection structure |
JPWO2017179532A1 (en) | 2016-04-12 | 2019-02-14 | 積水化学工業株式会社 | Conductive material and connection structure |
-
2019
- 2019-03-21 KR KR1020190032568A patent/KR102113732B1/en active IP Right Grant
-
2020
- 2020-02-20 WO PCT/KR2020/002447 patent/WO2020189901A1/en active Application Filing
- 2020-03-09 TW TW109107608A patent/TWI744817B/en active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201028498A (en) * | 2008-09-25 | 2010-08-01 | Ube Nitto Kasei Co | Conductive particles and method for forming metal film |
TW201344703A (en) * | 2012-03-06 | 2013-11-01 | Toyo Ink Sc Holdings Co Ltd | Conductive microparticle and manufacturing method thereof, conductive resin composition, conductive sheet, and electromagnetic wave shielding sheet |
KR20160134311A (en) * | 2015-05-15 | 2016-11-23 | 주식회사 아이에스시 | anisotropic conductive sheet |
KR20170025996A (en) * | 2015-08-31 | 2017-03-08 | 삼성전자주식회사 | Anisotropic conductive material, electronic device including anisotropic conductive material and method of manufacturing electronic device |
TW201743341A (en) * | 2016-05-11 | 2017-12-16 | Isc股份有限公司 | Test socket and conductive particle |
TW201826290A (en) * | 2016-05-11 | 2018-07-16 | Isc股份有限公司 | Test socket and conductive particle |
Also Published As
Publication number | Publication date |
---|---|
TW202040593A (en) | 2020-11-01 |
WO2020189901A1 (en) | 2020-09-24 |
KR102113732B1 (en) | 2020-05-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI744817B (en) | Conductive powder and test connector comprising the same | |
TWI326086B (en) | ||
KR100766205B1 (en) | Coated conductive particle, anisotropic conductive material, and conductive connection structure | |
TWI615858B (en) | Conductive particles, conductive materials, and connection structures | |
TWI601159B (en) | Conductive particles, resin particles, a conductive material, and a connecting structure | |
CN103748637B (en) | Electroconductive particle, conductive material and connection structural bodies | |
JP6734159B2 (en) | Conductive particles, conductive material and connection structure | |
CN112313758B (en) | Conductive particle, conductive material, and connection structure | |
KR101018334B1 (en) | Preparation of electroconductive nano/microparticles coated with graphene nanosheets | |
KR102172940B1 (en) | Base material particle, conductive particle, conductive material, and connection structure | |
JP7036872B2 (en) | Conductive particles, conductive materials, and connecting structures | |
CN103782351B (en) | Electroconductive particle, conductive material and connection structural bodies | |
KR20140106385A (en) | Conductive particles, conductive material, and connection structure | |
JP6737572B2 (en) | Base particle, conductive particle, conductive material, and connection structure | |
JPWO2018030438A1 (en) | Conductivity inspection member and continuity inspection device | |
KR100651177B1 (en) | Bump Type Conductive Particle Composition with Anisotropic Conduction and Anisotropic Conductive Film Using the Same | |
CN107615466B (en) | Method for producing connection structure, conductive particle, conductive film, and connection structure | |
JP6637391B2 (en) | Conductive particles, conductive material and connection structure | |
JP4050086B2 (en) | Conductive particles, conductive materials, and anisotropic conductive films | |
JP2006107881A (en) | Conductive fine particle and anisotropic conductive material | |
CN112352294B (en) | Conductive particle with insulating particles, conductive material, and connection structure | |
KR100736598B1 (en) | Highly reliable conductive particles | |
JP2014026970A (en) | Conductive particle, conductive material, and connection structure | |
KR20090063361A (en) | Insulated conductive particle, method for preparing thereof and anisotropic conductive film using the same |