TWI741885B - Display device - Google Patents

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TWI741885B
TWI741885B TW109141519A TW109141519A TWI741885B TW I741885 B TWI741885 B TW I741885B TW 109141519 A TW109141519 A TW 109141519A TW 109141519 A TW109141519 A TW 109141519A TW I741885 B TWI741885 B TW I741885B
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display panel
conductive
circuit board
external circuit
display device
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TW109141519A
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Chinese (zh)
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TW202206909A (en
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林宜欣
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友達光電股份有限公司
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Publication of TWI741885B publication Critical patent/TWI741885B/en
Publication of TW202206909A publication Critical patent/TW202206909A/en

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Abstract

Provided is a display device including a display panel, a conductive pad, an external circuit board and an adhesive layer. The display panel includes an inner lead exposed at a side of the display panel. The conductive pad is disposed on the side of the display panel and connected with the inner lead. The external circuit board is disposed at the side of the display panel and includes an outer lead, wherein a conductive protrusion structure is disposed on the outer lead, and the conductive protrusion structure is at least in contact with the conductive pad, such that the external circuit board is electrically connected to the display panel. The adhesive layer is disposed between the external circuit board and the display panel.

Description

顯示裝置Display device

本發明是有關於一種顯示裝置，且特別是有關於一種具有側邊接合（side bonding）的外接線路板的顯示裝置。The present invention relates to a display device, and more particularly to a display device having an external circuit board with side bonding.

在目前的顯示裝置的側邊接合製程中，大多使用導電膠來將外接線路板的外引腳連接至顯示面板的內引腳，以藉由導電膠中的導電粒子來使外接線路板經由作為側邊電極的導電接墊而與顯示面板中的內引腳電性連接。In the current side bonding process of display devices, most of the conductive glue is used to connect the outer pins of the external circuit board to the inner pins of the display panel, so that the conductive particles in the conductive glue can make the external circuit board pass through. The conductive pads of the side electrodes are electrically connected to the inner pins of the display panel.

然而，由於外接線路板是以側邊接合的方式附接在顯示面板的側面處，因此無法自顯示面板的側面觀測導電膠中的導電粒子分佈與壓合情形，因而無法準確地計算出外接線路板與顯示面板電性連接時的最小接觸面積。此外，經由導電膠來接合外接線路板與顯示面板，必須經歷高溫製程。如此一來，顯示裝置中的元件容易因高溫製程而受損。However, because the external circuit board is attached to the side of the display panel by side bonding, it is impossible to observe the distribution of conductive particles in the conductive adhesive and the bonding situation from the side of the display panel, so the external circuit cannot be accurately calculated. The minimum contact area when the board is electrically connected to the display panel. In addition, to connect the external circuit board and the display panel through the conductive adhesive, it must undergo a high-temperature manufacturing process. As a result, the components in the display device are easily damaged due to the high-temperature manufacturing process.

本發明提供一種顯示裝置，其藉由外接線路板的外引腳上的導電突起結構來使外接線路板與顯示面板電性連接。The present invention provides a display device, which electrically connects the external circuit board and the display panel through the conductive protrusion structure on the outer pin of the external circuit board.

本發明的顯示裝置包括顯示面板、導電接墊、外接線路板以及黏著層。所述顯示面板包括暴露於側邊處的內引腳。所述導電接墊設置於所述顯示面板的側邊上且與所述內引腳連接。所述外接線路板設置所述顯示面板的側邊處，且包括外引腳，其中所述外引腳上設置有導電突起結構，且所述導電突起結構至少接觸所述導電接墊，以使所述外接線路板電性連接至所述顯示面板。所述黏著層設置於所述外接線路板與所述顯示面板之間。The display device of the present invention includes a display panel, a conductive pad, an external circuit board and an adhesive layer. The display panel includes inner pins exposed at the sides. The conductive pads are arranged on the sides of the display panel and connected with the inner pins. The external circuit board is arranged at the side of the display panel and includes outer pins, wherein a conductive protrusion structure is provided on the outer pins, and the conductive protrusion structure at least contacts the conductive pads, so that The external circuit board is electrically connected to the display panel. The adhesive layer is disposed between the external circuit board and the display panel.

基於上述，在本發明的顯示裝置中，外接線路板的外引腳上設置有導電突起結構，且導電突起結構接觸顯示面板的側邊上的導電接墊（甚至穿入導電接墊中），以使外接線路板與顯示面板電性連接。如此一來，可易於計算出外接線路板與顯示面板電性連接時的最小接觸面積，且外接線路板與顯示面板之間可不需藉由導電膠來結合而不需進行高溫製程。Based on the above, in the display device of the present invention, the external pins of the external circuit board are provided with conductive protrusion structures, and the conductive protrusion structures contact the conductive pads on the sides of the display panel (even penetrate into the conductive pads), So that the external circuit board is electrically connected to the display panel. In this way, the minimum contact area when the external circuit board is electrically connected to the display panel can be easily calculated, and the connection between the external circuit board and the display panel does not need to be combined with conductive glue and does not require a high-temperature manufacturing process.

為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合附圖作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows.

下文列舉實施例並配合所附圖來進行詳細地說明，但所提供的實施例並非用以限制本發明所涵蓋的範圍。此外，附圖僅以說明為目的，並未依照原尺寸作圖。為了方便理解，在下述說明中相同的元件將以相同的符號標示來說明。The following examples are listed in conjunction with the accompanying drawings for detailed description, but the provided examples are not intended to limit the scope of the present invention. In addition, the drawings are for illustrative purposes only, and are not drawn according to the original dimensions. To facilitate understanding, the same elements will be described with the same symbols in the following description.

關於文中所提到「包含」、「包括」、「具有」等的用語均為開放性的用語，也就是指「包含但不限於」。The terms "include", "include", "have", etc. mentioned in the text are all open terms, which means "include but not limited to".

此外，文中所提到「上」、「下」、「左」、「右」等的方向性用語，僅是用以參考圖式的方向，並非用以限制本發明。In addition, the directional terms such as "upper", "lower", "left", "right", etc. mentioned in the text are only used to refer to the direction of the drawings, and are not intended to limit the present invention.

當以「第一」、「第二」等的用語來說明元件時，僅用於將這些元件彼此區分，並不限制這些元件的順序或重要性。因此，在一些情況下，第一元件亦可稱作第二元件，第二元件亦可稱作第一元件，且此不偏離申請專利範圍的範疇。When the terms "first", "second", etc. are used to describe elements, they are only used to distinguish these elements from each other, and do not limit the order or importance of these elements. Therefore, in some cases, the first element can also be referred to as the second element, and the second element can also be referred to as the first element, and this does not deviate from the scope of the patent application.

本發明的顯示裝置包括顯示面板、設置於顯示面板的側邊上的導電接墊（作為側邊電極）、設置於顯示面板的側邊處的外接線路板以及設置於外接線路板與顯示面板之間的黏著層。以下將對這些構件作詳細說明。The display device of the present invention includes a display panel, conductive pads (as side electrodes) arranged on the side of the display panel, an external circuit board arranged on the side of the display panel, and an external circuit board arranged between the external circuit board and the display panel. Between the adhesive layer. These components will be described in detail below.

圖1為本發明實施例的顯示面板的側視示意圖。在本發明中，將不對顯示面板的種類作限制。舉例來說，在本實施例中，顯示面板包括相對設置的兩個基板，但本發明不限於此。在其他實施例中，顯示面板也可僅包括一個基板。此外，為了便於對本發明進行說明，圖1中僅簡單繪示出構成顯示面板的薄膜電晶體基板、彩色濾光器基板以及用以接合薄膜電晶體基板與彩色濾光器基板的框膠，但本發明不限於此，且這些構件為本領域技術人員所熟知，於此將不再另行說明。視實際需求，本領域技術人員可對本實施例中的顯示面板的結構進行合適的變更。FIG. 1 is a schematic side view of a display panel according to an embodiment of the invention. In the present invention, the type of display panel will not be limited. For example, in this embodiment, the display panel includes two substrates arranged opposite to each other, but the invention is not limited to this. In other embodiments, the display panel may also include only one substrate. In addition, in order to facilitate the description of the present invention, FIG. 1 only briefly depicts the thin film transistor substrate, the color filter substrate and the sealant used to join the thin film transistor substrate and the color filter substrate that constitute the display panel, but The present invention is not limited to this, and these components are well known to those skilled in the art, and will not be further described here. According to actual needs, those skilled in the art can make appropriate changes to the structure of the display panel in this embodiment.

請參照圖1，在本實施例中，顯示面板10包括相對設置的第一基板102與第二基板104以及用以接合第一基板102與第二基板104的框膠105。第一基板102例如為薄膜電晶體基板，且其可具有主動元件、線路圖案、引腳等構件，其中引腳自第一基板102的內部延伸至側邊且暴露於側邊處，以與外部元件連接。在本實施例中，自第一基板102的內部延伸至側邊且暴露於側邊處的引腳稱為內引腳102a。在本實施例中，繪示出的內引腳102a的數量僅為示例之用，本發明不對此進行限制。此外，第二基板104例如為彩色濾光器基板，且其可具有彩色濾光器、電極圖案等構件，其中電極圖案設置於第二基板104上。在本實施例中，電極圖案104a設置於第二基板104上，且不延伸至第二基板104的側邊而暴露於側邊處，亦即電極圖案104a的邊緣與第二基板104的邊緣相隔一段距離。1, in this embodiment, the display panel 10 includes a first substrate 102 and a second substrate 104 disposed opposite to each other, and a sealant 105 for bonding the first substrate 102 and the second substrate 104. The first substrate 102 is, for example, a thin film transistor substrate, and it may have components such as active components, circuit patterns, pins, etc., wherein the pins extend from the inside of the first substrate 102 to the sides and are exposed at the sides to communicate with the outside. Component connection. In this embodiment, the pins extending from the inside of the first substrate 102 to the side and exposed at the side are referred to as inner pins 102a. In this embodiment, the number of inner pins 102a shown is only for example, and the present invention does not limit this. In addition, the second substrate 104 is, for example, a color filter substrate, and it may have components such as color filters, electrode patterns, and the like, wherein the electrode patterns are disposed on the second substrate 104. In this embodiment, the electrode pattern 104a is disposed on the second substrate 104, and does not extend to the side of the second substrate 104 but is exposed at the side, that is, the edge of the electrode pattern 104a is separated from the edge of the second substrate 104 Some distance.

框膠105設置於第一基板102與第二基板104之間，用以接合第一基板102與第二基板104。在本實施例中，框膠105設置於鄰近顯示面板10的邊緣，且於顯示面板10的中央區域界定出用以容置液晶的空間。The sealant 105 is disposed between the first substrate 102 and the second substrate 104 for bonding the first substrate 102 and the second substrate 104. In this embodiment, the sealant 105 is disposed adjacent to the edge of the display panel 10, and a space for accommodating the liquid crystal is defined in the central area of the display panel 10.

此外，在本實施例中，顯示面板10的正面100a上設置有偏光板106a，且顯示面板10的背面100b上設置有偏光板106b。In addition, in this embodiment, a polarizing plate 106a is provided on the front side 100a of the display panel 10, and a polarizing plate 106b is provided on the back side 100b of the display panel 10.

導電接墊108設置於顯示面板10的側邊上且與內引腳連接。在本實施例中，導電接墊108設置於顯示面板10的側邊上，且每一個導電接墊108皆與相應的內引腳102a連接。如此一來，外部元件可經由導電接墊108而與顯示面板10電性連接。在本發明中，不對導電接墊108的設置方式進行限定，本領域技術人員可視實際需求進行變更。在本實施例中，導電接墊108可例如為銀接墊。The conductive pad 108 is disposed on the side of the display panel 10 and connected to the inner pins. In this embodiment, the conductive pads 108 are disposed on the side of the display panel 10, and each conductive pad 108 is connected to the corresponding inner pin 102a. In this way, external components can be electrically connected to the display panel 10 via the conductive pad 108. In the present invention, the arrangement of the conductive pad 108 is not limited, and those skilled in the art can change it according to actual needs. In this embodiment, the conductive pad 108 may be, for example, a silver pad.

圖2A為本發明實施例的外接線路板的局部的剖面示意圖。圖2B為圖2A中的外引腳的上視示意圖。外接線路板主要包括基板、設置於基板上的線路圖案與用以與外部元件連接的外引腳以及設置於線路圖案上的晶片。此外，為了便於對本發明進行說明，圖2中僅簡單繪示出局部的外接線路板，其包括基板以及設置於基板上的外引腳，而其他區域中的構件為本領域技術人員所熟知，於此不再另行說明。2A is a partial cross-sectional schematic diagram of an external circuit board according to an embodiment of the present invention. FIG. 2B is a schematic top view of the outer pins in FIG. 2A. The external circuit board mainly includes a substrate, a circuit pattern arranged on the substrate, external pins for connecting with external components, and a chip arranged on the circuit pattern. In addition, in order to facilitate the description of the present invention, FIG. 2 only briefly shows a partial external circuit board, which includes a substrate and external pins provided on the substrate, and the components in other areas are well known to those skilled in the art. No further explanation here.

請同時參照圖2A與圖2B，在本實施例中，外接線路板20例如為覆晶薄膜（chip on film，COF）線路板。外接線路板20包括基板200、設置於基板200上的外引腳202與線路圖案以及設置於線路圖案的晶片，其中為使圖示清楚以及便於說明，未繪示出線路圖案以及晶片。外引腳202設置於基板200上，用以與外部元件（例如圖1中的顯視面板10）連接，以使外接線路板20能夠電性連接至外部元件。在本實施例中，不對外引腳202的數量、寬度、厚度、長度以及膜層數進行限制，本領域技術人員可視實際需求來調整外引腳202的數量、寬度、厚度、長度以及膜層數。在本實施例中，外引腳202上設置有導電突起結構204。這些導電突起結構204彼此不接觸地分佈於外引腳202的表面上。在本實施例中，導電突起結構204以陣列的方式設置於外引腳202的表面上且位於外引腳202的末端處，但本發明不限於此。此外，在本實施例中，導電突起結構204為錐狀結構。在本實施例中，導電突起結構204為四角錐結構，但本發明不限於此。在其他實施例中，導電突起結構可為圓錐結構或其他型式的立體結構。2A and 2B at the same time, in this embodiment, the external circuit board 20 is, for example, a chip on film (COF) circuit board. The external circuit board 20 includes a substrate 200, an external pin 202 and a circuit pattern disposed on the substrate 200, and a chip disposed on the circuit pattern. For clarity and convenience of illustration, the circuit pattern and the chip are not shown. The external pins 202 are provided on the substrate 200 for connecting with external components (for example, the display panel 10 in FIG. 1 ), so that the external circuit board 20 can be electrically connected to the external components. In this embodiment, the number, width, thickness, length, and film layers of the external pins 202 are not limited, and those skilled in the art can adjust the number, width, thickness, length, and film layers of the external pins 202 according to actual needs. number. In this embodiment, a conductive protrusion structure 204 is provided on the outer pin 202. These conductive protrusion structures 204 are distributed on the surface of the outer pin 202 without contacting each other. In this embodiment, the conductive protrusion structure 204 is arranged on the surface of the outer pin 202 in an array and located at the end of the outer pin 202, but the present invention is not limited to this. In addition, in this embodiment, the conductive protrusion structure 204 is a cone-shaped structure. In this embodiment, the conductive protrusion structure 204 is a quadrangular pyramid structure, but the invention is not limited to this. In other embodiments, the conductive protrusion structure may be a conical structure or another type of three-dimensional structure.

如圖3A所示，設置於外引腳202的表面上的導電突起結構204a可為頂部寬度小於底部寬度的柱狀結構。如圖3B所示，設置於外引腳202的表面上的導電突起結構204b可為頂部寬度等於底部寬度的柱狀結構。如圖3C所示，設置於外引腳202的表面上的導電突起結構204c可為球狀結構。As shown in FIG. 3A, the conductive protrusion structure 204a provided on the surface of the outer pin 202 may be a columnar structure with a top width smaller than a bottom width. As shown in FIG. 3B, the conductive protrusion structure 204b provided on the surface of the outer pin 202 may be a columnar structure with a top width equal to a bottom width. As shown in FIG. 3C, the conductive protrusion structure 204c provided on the surface of the outer pin 202 may be a spherical structure.

此外，導電突起結構除了以陣列的方式設置於外引腳202的表面上之外，還可採用彼此平行的條狀方式設置於外引腳202的表面上。如圖3D所示，設置於外引腳202的表面上的導電突起結構204d為條狀結構，且導電突起結構204d的延伸方向與外引腳202的延伸方向平行。如圖3E所示，設置於外引腳202的表面上的導電突起結構204e為條狀結構，且導電突起結構204e的延伸方向與外引腳202的延伸方向交錯。此外，在導電突起結構為條狀結構的情況下，每一個導電突起結構的垂直於其延伸方向的剖面的形狀也可是三角形、矩形或球形。In addition, in addition to being arranged on the surface of the outer pin 202 in an array, the conductive protruding structure can also be arranged on the surface of the outer pin 202 in a strip pattern parallel to each other. As shown in FIG. 3D, the conductive protrusion structure 204 d provided on the surface of the outer pin 202 is a strip structure, and the extension direction of the conductive protrusion structure 204 d is parallel to the extension direction of the outer pin 202. As shown in FIG. 3E, the conductive protrusion structure 204e provided on the surface of the outer pin 202 is a strip structure, and the extension direction of the conductive protrusion structure 204e is staggered with the extension direction of the outer pin 202. In addition, when the conductive protrusion structure is a strip structure, the shape of the cross-section perpendicular to the extending direction of each conductive protrusion structure may also be triangular, rectangular or spherical.

將外接線路板20與顯示面板10接合即可構成本發明的顯示裝置，以下將對此作詳細說明。The display device of the present invention can be constructed by joining the external circuit board 20 and the display panel 10, which will be described in detail below.

圖4為本發明實施例的顯示裝置的剖面示意圖。在本實施例中，為使圖示清楚，僅繪示出顯示面板10內部的內引腳而未繪示出其他內部構件。4 is a schematic cross-sectional view of a display device according to an embodiment of the invention. In this embodiment, in order to make the illustration clear, only the internal pins inside the display panel 10 are drawn, and other internal components are not drawn.

請同時參照圖1、圖2A、圖2B與圖4，顯示裝置40包括顯示面板10、導電接墊108、設置於顯示面板10的側邊處的外接線路板20以及設置於外接線路板20與顯示面板10之間的黏著層402。外接線路板20與顯示面板10接合時，外接線路板20的一個外引腳202與顯示面板10的側邊上的一個導電接墊108對準且接觸，而外引腳202的表面上的導電突起結構204穿入導電接墊108中，以使外接線路板20能夠電性連接至顯示面板10。此外，在另一實施例中，導電突起結構204可僅與導電接墊108接觸而不穿入導電接墊108中。Referring to FIGS. 1, 2A, 2B and 4 at the same time, the display device 40 includes a display panel 10, conductive pads 108, an external circuit board 20 arranged on the side of the display panel 10, and an external circuit board 20 and The adhesive layer 402 between the display panels 10. When the external circuit board 20 is joined to the display panel 10, an external pin 202 of the external circuit board 20 is aligned with and in contact with a conductive pad 108 on the side of the display panel 10, and the surface of the external pin 202 is conductive. The protruding structure 204 penetrates into the conductive pad 108 so that the external circuit board 20 can be electrically connected to the display panel 10. In addition, in another embodiment, the conductive protrusion structure 204 may only contact the conductive pad 108 without penetrating into the conductive pad 108.

在本實施例中，導電突起結構204的高度小於導電接墊108的厚度，以避免導電突起結構204穿入導電接墊108時造成內引腳102a損壞。在另一實施例中，導電突起結構204的高度可等於導電接墊108的厚度，亦即導電突起結構204穿入導電接墊108時僅接觸內引腳102a的表面而不會過度損壞內引腳102a。此外，在本實施例中，每一個導電突起結構204的高度相等，但本發明不限於此。在其他實施例中，取決於導電接墊108的厚度，導電突起結構204可具有不同的高度。舉例來說，當導電接墊108的中央部分的厚度大於周邊部分的厚度時，在外引腳202的表面上對應於導電接墊108的周邊部分的導電突起結構204的高度可大於對應於導電接墊108的中央部分的導電突起結構204的高度，以使所有的導電突起結構204能夠穿入導電接墊108中。In this embodiment, the height of the conductive protrusion structure 204 is smaller than the thickness of the conductive pad 108 to prevent the inner lead 102a from being damaged when the conductive protrusion structure 204 penetrates the conductive pad 108. In another embodiment, the height of the conductive protrusion structure 204 may be equal to the thickness of the conductive pad 108, that is, when the conductive protrusion structure 204 penetrates the conductive pad 108, it only touches the surface of the inner lead 102a without excessively damaging the inner lead. Feet 102a. In addition, in this embodiment, the height of each conductive protrusion structure 204 is equal, but the present invention is not limited to this. In other embodiments, depending on the thickness of the conductive pad 108, the conductive protrusion structure 204 may have different heights. For example, when the thickness of the central portion of the conductive pad 108 is greater than the thickness of the peripheral portion, the height of the conductive protrusion structure 204 corresponding to the peripheral portion of the conductive pad 108 on the surface of the outer pin 202 may be greater than that of the conductive pad 108. The height of the conductive protruding structure 204 in the central part of the pad 108 is such that all the conductive protruding structures 204 can penetrate into the conductive pad 108.

此外，在另一實施例中，如圖5所示，在外接線路板20與顯示面板10接合之前，導電突起結構的高度大於導電接墊108的厚度，因此在外接線路板20與顯示面板10接合之後，導電突起結構穿入導電接墊108中並接觸內引腳102a，且進而彎折。詳細地說，在本實施例的顯示裝置50中，在不傷害損壞內引腳102a或不過度損壞內引腳102a的情況下，導電突起結構在導電接墊108中接觸內引腳102a且彎折，形成具有彎折形狀的導電突起結構204f。此時，導電突起結構204f包括主體部204f_1以及延伸部204f_2。主體部204f_1設置於外引腳202上，且延伸部204f_2自主體部204f_1延伸在內引腳102a的表面上，且視實際情況，延伸部204f_2可進一步位於第一基板102與第二基板104的側表面上。此外，在外接線路板20中，相鄰的外引腳202上的延伸部204f_2彼此不接觸，以避免發生短路問題。如此一來，可使導電突起結構204f因與導電接墊108的接觸面積增加而更穩固地附接於導電接墊108，進而提高外接線路板20與顯示面板10之間的接合強度。In addition, in another embodiment, as shown in FIG. 5, before the external circuit board 20 is joined to the display panel 10, the height of the conductive protrusion structure is greater than the thickness of the conductive pad 108, so the external circuit board 20 and the display panel 10 After bonding, the conductive protrusion structure penetrates into the conductive pad 108 and contacts the inner pin 102a, and then bends. In detail, in the display device 50 of this embodiment, the conductive protrusion structure contacts the inner lead 102a in the conductive pad 108 and is bent without damaging the inner lead 102a or excessively damaging the inner lead 102a. Folding to form a conductive protrusion structure 204f having a bent shape. At this time, the conductive protrusion structure 204f includes a main portion 204f_1 and an extension portion 204f_2. The main body portion 204f_1 is disposed on the outer pin 202, and the extension portion 204f_2 extends from the main body portion 204f_1 on the surface of the inner pin 102a, and depending on the actual situation, the extension portion 204f_2 may be further located between the first substrate 102 and the second substrate 104 On the side surface. In addition, in the external circuit board 20, the extension portions 204f_2 on the adjacent outer pins 202 are not in contact with each other to avoid short circuit problems. In this way, the conductive protrusion structure 204f can be more firmly attached to the conductive pad 108 due to the increase in the contact area with the conductive pad 108, thereby improving the bonding strength between the external circuit board 20 and the display panel 10.

回到圖1、圖2A、圖2B與圖4，黏著層402設置於外接線路板20與顯示面板10之間，以提供外接線路板20與顯示面板10之間的附著力。黏著層402的材料例如為樹脂，但本發明不限於此。進一步說，由於外接線路板20與顯示面板10之間透過導電突起結構204以及導電接墊108而彼此電性連接，因此黏著層402僅需提供外接線路板20與顯示面板10之間的附著力，而不需額外提供導電路徑。換句話說，在本實施例中，不需使用導電膠來作為黏著層402的材料。因此，在接合外接線路板20與顯示面板10的過程中不須經歷高溫製程，以避免顯示裝置中的元件受損。另外，黏著層402也可在外接線路板20與顯示面板10之間提供良好的緩衝力，以及避免外界的濕氣進入顯示裝置40中而造成導電接墊108損壞。Returning to FIGS. 1, 2A, 2B and 4, the adhesive layer 402 is disposed between the external circuit board 20 and the display panel 10 to provide adhesion between the external circuit board 20 and the display panel 10. The material of the adhesive layer 402 is, for example, resin, but the present invention is not limited thereto. Furthermore, since the external circuit board 20 and the display panel 10 are electrically connected to each other through the conductive protrusion structure 204 and the conductive pad 108, the adhesive layer 402 only needs to provide adhesion between the external circuit board 20 and the display panel 10. , Without the need to provide additional conductive paths. In other words, in this embodiment, there is no need to use conductive glue as the material of the adhesive layer 402. Therefore, it is not necessary to go through a high temperature process in the process of joining the external circuit board 20 and the display panel 10 to avoid damage to the components in the display device. In addition, the adhesive layer 402 can also provide a good buffering force between the external circuit board 20 and the display panel 10, and prevent external moisture from entering the display device 40 and causing damage to the conductive pad 108.

此外，在本實施例中，外接線路板20與顯示面板10之間透過導電突起結構以及導電接墊108而彼此電性連接。如此一來，可經由預先設置的導電突起結構來準確地計算出外接線路板20與顯示面板10電性連接時所需的最小接觸面積，不會因無法觀測導電膠中的導電粒子分佈與壓合情形而無法達成準確計算。In addition, in this embodiment, the external circuit board 20 and the display panel 10 are electrically connected to each other through the conductive protrusion structure and the conductive pad 108. In this way, the minimum contact area required when the external circuit board 20 is electrically connected to the display panel 10 can be accurately calculated through the pre-set conductive protrusion structure, and the distribution and pressure of the conductive particles in the conductive adhesive will not be observable. Under the circumstances, accurate calculations cannot be achieved.

另外一提的是，在導電突起結構為條狀結構且導電突起結構的延伸方向與外引腳的延伸方向交錯的情況下（例如導電突起結構204e），可進一步提高外接線路板20與顯示面板10之間的接合準確度。詳細地說，在外接線路板20與顯示面板10的接合過程中，由於條狀結構的導電突起結構204e的延伸方向與外引腳202的延伸方向交錯，因此在將外引腳202與導電接墊108對準時，即使外引腳202與導電接墊108之間存在對準偏差，導電突起結構204e仍可以準確地穿入導電接墊108中而避免與導電接墊108之間的接觸面積減少而產生電性問題。In addition, when the conductive protrusion structure is a strip structure and the extension direction of the conductive protrusion structure is staggered with the extension direction of the outer pin (for example, the conductive protrusion structure 204e), the external circuit board 20 and the display panel can be further improved. The accuracy of the joint between 10. In detail, during the joining process of the external circuit board 20 and the display panel 10, since the extending direction of the conductive protrusion structure 204e of the strip structure is staggered with the extending direction of the outer pin 202, the outer pin 202 is connected to the conductive connection When the pad 108 is aligned, even if there is an alignment deviation between the outer pin 202 and the conductive pad 108, the conductive protrusion structure 204e can still accurately penetrate into the conductive pad 108 to avoid a reduction in the contact area with the conductive pad 108 And produce electrical problems.

雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視所附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the attached patent application.

10:顯示面板 20:外接線路板 40、50:顯示裝置 100a:正面 100b:背面 102:第一基板 102a:內引腳 104:第二基板 104a:電極圖案 105:框膠 106a、106b:偏光板 108:導電接墊 200:基板 202:外引腳 204、204a、204b、204c、204d、204e、204f:導電突起結構 402:黏著層 204f_1:主體部 204f_2:延伸部 10: Display panel 20: External circuit board 40, 50: display device 100a: front 100b: back 102: first substrate 102a: inner pin 104: second substrate 104a: Electrode pattern 105: frame glue 106a, 106b: Polarizing plate 108: conductive pad 200: substrate 202: external pin 204, 204a, 204b, 204c, 204d, 204e, 204f: conductive protrusion structure 402: Adhesive Layer 204f_1: main body 204f_2: extension

圖1為本發明實施例的顯示面板的側視示意圖。 圖2A為本發明實施例的外接線路板的局部的剖面示意圖。 圖2B為圖2A中的外引腳的上視示意圖。 圖3A為本發明另一實施例的外引腳的剖面示意圖。 圖3B為本發明另一實施例的外引腳的剖面示意圖。 圖3C為本發明另一實施例的外引腳的剖面示意圖。 圖3D為本發明另一實施例的外引腳的上視示意圖。 圖3E為本發明另一實施例的外引腳的上視示意圖。 圖4為本發明實施例的顯示裝置的剖面示意圖。 圖5為本發明另一實施例的顯示裝置的剖面示意圖。 FIG. 1 is a schematic side view of a display panel according to an embodiment of the invention. 2A is a partial cross-sectional schematic diagram of an external circuit board according to an embodiment of the present invention. FIG. 2B is a schematic top view of the outer pins in FIG. 2A. 3A is a schematic cross-sectional view of an outer lead according to another embodiment of the invention. 3B is a schematic cross-sectional view of an outer lead according to another embodiment of the invention. 3C is a schematic cross-sectional view of an outer lead according to another embodiment of the invention. FIG. 3D is a schematic top view of an outer lead according to another embodiment of the present invention. FIG. 3E is a schematic top view of an outer lead according to another embodiment of the present invention. 4 is a schematic cross-sectional view of a display device according to an embodiment of the invention. FIG. 5 is a schematic cross-sectional view of a display device according to another embodiment of the invention.

40:顯示裝置 40: display device

102:第一基板 102: first substrate

102a:內引腳 102a: inner pin

104:第二基板 104: second substrate

104a:電極圖案 104a: Electrode pattern

105:框膠 105: frame glue

106a、106b:偏光板 106a, 106b: Polarizing plate

108:導電接墊 108: conductive pad

200:基板 200: substrate

202:外引腳 202: external pin

204:導電突起結構 204: Conductive protrusion structure

402:黏著層 402: Adhesive Layer

Claims (8)

一種顯示裝置，包括：顯示面板，包括暴露於側邊處的內引腳；導電接墊，設置於所述顯示面板的側邊上且與所述內引腳連接；外接線路板，設置於所述顯示面板的側邊處，且包括外引腳，其中所述外引腳上設置有導電突起結構，且所述導電突起結構至少接觸所述導電接墊，以使所述外接線路板電性連接至所述顯示面板；以及黏著層，設置於所述外接線路板與所述顯示面板之間，其中所述導電突起結構穿入所述導電接墊中。 A display device includes: a display panel, including inner pins exposed at the side; conductive pads, arranged on the side of the display panel and connected to the inner pins; and an external circuit board, arranged on the side The side of the display panel includes external pins, wherein a conductive protrusion structure is provided on the external pins, and the conductive protrusion structure at least contacts the conductive pads to make the external circuit board electrically conductive Connected to the display panel; and an adhesive layer disposed between the external circuit board and the display panel, wherein the conductive protrusion structure penetrates the conductive pad. 如請求項1所述的顯示裝置，其中所述導電突起結構為錐狀結構、柱狀結構、球狀結構或條狀結構。 The display device according to claim 1, wherein the conductive protrusion structure is a cone structure, a column structure, a spherical structure, or a strip structure. 如請求項2所述的顯示裝置，其中所述條狀結構的延伸方向與所述外引腳的延伸方向平行。 The display device according to claim 2, wherein the extending direction of the strip structure is parallel to the extending direction of the outer pin. 如請求項2所述的顯示裝置，其中所述條狀結構的延伸方向與所述外引腳的延伸方向交錯。 The display device according to claim 2, wherein the extending direction of the strip structure is staggered with the extending direction of the outer pin. 如請求項1所述的顯示裝置，其中所述導電突起結構的高度不超過所述導電接墊的厚度。 The display device according to claim 1, wherein the height of the conductive protrusion structure does not exceed the thickness of the conductive pad. 如請求項1所述的顯示裝置，其中所述導電突起結構包括主體部以及延伸部，所述主體部設置於所述外引腳上，且所述延伸部自所述主體部延伸在所述內引腳的表面上。 The display device according to claim 1, wherein the conductive protrusion structure includes a main body portion and an extension portion, the main body portion is disposed on the outer pin, and the extension portion extends from the main body portion to the On the surface of the inner pin. 如請求項1所述的顯示裝置，其中所述黏著層的材料包括樹脂。 The display device according to claim 1, wherein the material of the adhesive layer includes resin. 如請求項1所述的顯示裝置，更包括偏光板，設置於所述顯示面板的正面及背面上。 The display device according to claim 1, further comprising polarizing plates, which are arranged on the front and back of the display panel.
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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI801172B (en) * 2022-03-22 2023-05-01 友達光電股份有限公司 Electronic device
TWI812124B (en) * 2022-03-28 2023-08-11 李銘洛 Electronic module and carrier structure thereof and manufacturing method thereof
TWI814434B (en) * 2022-04-01 2023-09-01 友達光電股份有限公司 Light emitting diode array substrate
TWI839096B (en) * 2023-01-31 2024-04-11 友達光電股份有限公司 Display device and tiling display

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180210271A1 (en) * 2015-07-17 2018-07-26 Lg Display Co., Ltd. Display device
CN108490700A (en) * 2018-01-09 2018-09-04 友达光电股份有限公司 Electronic device and method for manufacturing the same
US10303016B2 (en) * 2016-09-07 2019-05-28 Samsung Display Co., Ltd. Display device and method for manufacturing the same
TW202009569A (en) * 2018-08-14 2020-03-01 南韓商三星顯示器有限公司 Display apparatus and manufacturing the same
CN110967881A (en) * 2019-12-30 2020-04-07 Tcl华星光电技术有限公司 Display panel and preparation method thereof
CN111427202A (en) * 2020-04-08 2020-07-17 深圳市华星光电半导体显示技术有限公司 Narrow-frame display panel and display device

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4749465A (en) * 1985-05-09 1988-06-07 Seagate Technology In-line disk sputtering system
US6317248B1 (en) * 1998-07-02 2001-11-13 Donnelly Corporation Busbars for electrically powered cells
US6460369B2 (en) * 1999-11-03 2002-10-08 Applied Materials, Inc. Consecutive deposition system
EP1376212A1 (en) * 2002-06-21 2004-01-02 Asulab S.A. Display cell, in particular comprising liquid crystals, or photovoltaic cell comprising connection means to a driver circuit
TWI278417B (en) * 2006-04-14 2007-04-11 Yi-Sung Tzeng Automatic storage controlling system for a sputtering machine and method for carrying jigs
JP2009105081A (en) * 2007-10-19 2009-05-14 Ebatekku:Kk Substrate processing apparatus
DE112009003614T5 (en) * 2008-11-14 2013-01-24 Tokyo Electron Ltd. Substrate processing system
TW201504872A (en) * 2013-07-17 2015-02-01 Wintek Corp Touch panel and touch display device
TWI540361B (en) * 2011-07-05 2016-07-01 友達光電股份有限公司 Method for cutting mother board of display panel
DE102012221002A1 (en) * 2012-11-16 2014-05-22 Jumatech Gmbh Angled and / or angled printed circuit board structure with at least two printed circuit board sections and method for their production
TW201432532A (en) * 2013-02-05 2014-08-16 Unidisplay Inc Touch panel and manufacturing method thereof and touch display panel
WO2015042309A1 (en) * 2013-09-20 2015-03-26 Applied Materials, Inc. Substrate carrier with integrated electrostatic chuck
TWI520851B (en) * 2013-09-26 2016-02-11 余敏守 Marking and printing device for metal workpieces
KR102109752B1 (en) * 2013-10-02 2020-05-12 엘지이노텍 주식회사 Circuit board and lighting device having the circuit board
JP6303024B2 (en) * 2013-12-23 2018-03-28 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Holding arrangement for holding a substrate under a vacuum process, apparatus for depositing a layer on a substrate, and method for transporting a holding arrangement
KR102380645B1 (en) * 2014-07-31 2022-03-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device and electronic device
CN106573462B (en) * 2014-08-08 2019-07-09 株式会社富士 Silk-screen printing device
JP6401373B2 (en) * 2015-02-19 2018-10-10 富士フイルム株式会社 Printing apparatus and printing method
KR102403671B1 (en) * 2015-09-18 2022-05-27 엘지디스플레이 주식회사 Display Device
KR20180032726A (en) * 2016-09-22 2018-04-02 삼성디스플레이 주식회사 Display device and manufacturing method thereof
TWI610281B (en) * 2017-03-09 2018-01-01 友達光電股份有限公司 Display panel
TWI621900B (en) * 2017-04-28 2018-04-21 友達光電股份有限公司 Display and method of fabricating the same
US10416509B2 (en) * 2017-07-31 2019-09-17 Shenzhen China Star Optoelectronics Technology Co., Ltd Display panel, electronic device, and display panel fabrication method
CN107323078A (en) * 2017-08-26 2017-11-07 梅明会 A kind of weaving dyeing and printing device easy to use
CN107544715A (en) * 2017-09-08 2018-01-05 业成科技（成都）有限公司 Touch control display apparatus
TWI648573B (en) * 2017-09-11 2019-01-21 友達光電股份有限公司 Array substrate
JP2020507534A (en) * 2017-12-21 2020-03-12 北京▲伯▼陽頂栄光伏科技有限公司 Substrate tray return device, substrate tray return method, and fully automatic coating machine
KR20190083014A (en) * 2018-01-02 2019-07-11 삼성디스플레이 주식회사 Display device
TWI662525B (en) * 2018-02-07 2019-06-11 友達光電股份有限公司 Electronic device
TWI649795B (en) * 2018-02-13 2019-02-01 友達光電股份有限公司 Display panel
TWI648574B (en) * 2018-02-22 2019-01-21 友達光電股份有限公司 Display panel
KR102543688B1 (en) * 2018-04-02 2023-06-14 삼성디스플레이 주식회사 Display device and manufacturing method of display device
JP7054361B2 (en) * 2018-04-10 2022-04-13 キヤノン株式会社 Display device and its manufacturing method
TWI669816B (en) * 2018-04-18 2019-08-21 友達光電股份有限公司 Tiling display panel and manufacturing method thereof
CN108582187A (en) * 2018-05-07 2018-09-28 长泰朗德机械设备有限公司 A kind of printing equipment that processing effect is good
TWI662341B (en) * 2018-05-31 2019-06-11 友達光電股份有限公司 Display apparatus
KR102151099B1 (en) * 2018-07-04 2020-09-02 삼성전자주식회사 Display panel and large format display apparatus using the same
CN108957878B (en) * 2018-07-19 2022-03-11 武汉天马微电子有限公司 Display module, preparation method thereof and display device
TWI674466B (en) * 2018-07-30 2019-10-11 友達光電股份有限公司 Display panel and manufacturing method thereof
TWI687740B (en) * 2019-01-02 2020-03-11 友達光電股份有限公司 Thin film transistor driving circuit and liquid crystal display device
TWI702453B (en) * 2019-01-04 2020-08-21 友達光電股份有限公司 Display device and manufacturing method thereof
TWI734074B (en) * 2019-01-30 2021-07-21 友達光電股份有限公司 Display panel and manufacturing method thereof
CN109739057B (en) * 2019-02-28 2023-02-07 京东方科技集团股份有限公司 Display device and binding method of display substrate
CN110277018B (en) * 2019-06-24 2020-12-25 武汉华星光电技术有限公司 Display panel and preparation method thereof
CN110764323A (en) * 2019-10-18 2020-02-07 深圳市华星光电技术有限公司 Display panel, manufacturing method thereof and display device
CN210626839U (en) * 2019-11-28 2020-05-26 维沃移动通信有限公司 Display module and electronic equipment
CN110928061B (en) * 2019-11-29 2022-04-26 武汉华星光电技术有限公司 Display panel and display device
CN111192883A (en) * 2020-01-08 2020-05-22 深圳市华星光电半导体显示技术有限公司 Side edge binding structure of display panel and manufacturing method thereof
CN111352270B (en) * 2020-04-16 2023-01-31 京东方科技集团股份有限公司 Liquid crystal display panel, manufacturing method thereof and liquid crystal display device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180210271A1 (en) * 2015-07-17 2018-07-26 Lg Display Co., Ltd. Display device
US10303016B2 (en) * 2016-09-07 2019-05-28 Samsung Display Co., Ltd. Display device and method for manufacturing the same
CN108490700A (en) * 2018-01-09 2018-09-04 友达光电股份有限公司 Electronic device and method for manufacturing the same
TW202009569A (en) * 2018-08-14 2020-03-01 南韓商三星顯示器有限公司 Display apparatus and manufacturing the same
CN110967881A (en) * 2019-12-30 2020-04-07 Tcl华星光电技术有限公司 Display panel and preparation method thereof
CN111427202A (en) * 2020-04-08 2020-07-17 深圳市华星光电半导体显示技术有限公司 Narrow-frame display panel and display device

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