TW202206906A - Electronic device - Google Patents
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- TW202206906A TW202206906A TW110107470A TW110107470A TW202206906A TW 202206906 A TW202206906 A TW 202206906A TW 110107470 A TW110107470 A TW 110107470A TW 110107470 A TW110107470 A TW 110107470A TW 202206906 A TW202206906 A TW 202206906A
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Abstract
Description
本發明是有關於一種裝置,且特別是有關於一種電子裝置。The present invention relates to a device, and in particular, to an electronic device.
隨電子產業的技術的進步與發展,電子裝置的應用已跨及眾多領域而用於取代需多傳統的產品。就顯示產品相關的電子裝置而言,利用拼接的方式達成各種尺寸需求的設計已被提出。為了達成這樣的設計,電子裝置,例如顯示面板、顯示裝置等,正努力朝向及窄邊框甚至無邊框的設計發展。With the advancement and development of technology in the electronic industry, the application of electronic devices has spanned many fields to replace traditional products. As far as electronic devices related to display products are concerned, designs using splicing to meet various size requirements have been proposed. In order to achieve such a design, electronic devices, such as display panels, display devices, etc., are striving to develop designs with narrow or even bezels.
本發明提供一種電子裝置,具有窄邊框的設計且具有理想的品質。The present invention provides an electronic device with a narrow frame design and ideal quality.
本發明的電子裝置包括基板、多條邊緣導線以及保護結構。基板具有第一主表面、側表面以及連接於第一主表面與側表面之間的第一多重轉折面。第一多重轉折面包括法線方向不同的多個第一轉折面。邊緣導線配置於基板上。邊緣導線各自由第一主表面經過第一多重轉折面而延伸至側表面。保護結構配置於基板上,且包括覆蓋多條邊緣導線的導線保護部。導線保護部在側表面具有第一厚度,在第一主表面具有第二厚度,在多個第一轉折面的至少一者上具有第三厚度。第一厚度大於第二厚度,且第二厚度大於第三厚度。The electronic device of the present invention includes a substrate, a plurality of edge wires and a protection structure. The substrate has a first main surface, a side surface, and a first multiple inflection surface connected between the first main surface and the side surface. The first multiple inflection surfaces include a plurality of first inflection surfaces with different normal directions. The edge wires are arranged on the substrate. The edge conductors each extend from the first main surface to the side surfaces through the first multiple inflection surfaces. The protection structure is disposed on the substrate and includes a wire protection portion covering a plurality of edge wires. The wire protection portion has a first thickness on the side surface, a second thickness on the first main surface, and a third thickness on at least one of the plurality of first turning surfaces. The first thickness is greater than the second thickness, and the second thickness is greater than the third thickness.
在本發明的一實施例中,上述的保護結構還包括延伸於多條邊緣導線之間的間隙保護部。間隙保護部在側表面上具有第四厚度,在第一主表面上具有第五厚度,在多個第一轉折面的至少一者上具有第六厚度,第四厚度大於第五厚度,且第五厚度大於第六厚度。In an embodiment of the present invention, the above-mentioned protection structure further includes a gap protection portion extending between the plurality of edge wires. The gap protection portion has a fourth thickness on the side surface, a fifth thickness on the first main surface, a sixth thickness on at least one of the plurality of first turning surfaces, the fourth thickness is greater than the fifth thickness, and the first The fifth thickness is greater than the sixth thickness.
在本發明的一實施例中,上述的第二厚度大於第五厚度。In an embodiment of the present invention, the above-mentioned second thickness is greater than the fifth thickness.
在本發明的一實施例中,上述的第二厚度大於第四厚度。In an embodiment of the present invention, the above-mentioned second thickness is greater than the fourth thickness.
在本發明的一實施例中,上述的保護結構由第一保護層與第二保護層堆疊而成,且第一保護層位於多條邊緣導線與第二保護層之間。In an embodiment of the present invention, the above-mentioned protective structure is formed by stacking a first protective layer and a second protective layer, and the first protective layer is located between the plurality of edge wires and the second protective layer.
在本發明的一實施例中,上述的第一保護層覆蓋多條邊緣導線,且邊緣導線的輪廓順應於第一保護層的輪廓。In an embodiment of the present invention, the above-mentioned first protective layer covers a plurality of edge wires, and the outline of the edge wires conforms to the outline of the first protective layer.
在本發明的一實施例中,上述的第二保護層包括重疊段與間隙段。重疊段疊置於第一保護層上而與第一保護層構成導線保護部。間隙段位於多條邊緣導線之間的間隙中並接觸基板。In an embodiment of the present invention, the above-mentioned second protective layer includes an overlapping segment and a gap segment. The overlapping section is stacked on the first protective layer to form a wire protection portion with the first protective layer. The gap segment is located in the gap between the plurality of edge wires and contacts the substrate.
在本發明的一實施例中,上述的第二保護層露出第一保護層在第一主表面上的部分。In an embodiment of the present invention, the above-mentioned second protective layer exposes a portion of the first protective layer on the first main surface.
在本發明的一實施例中,上述的基板還包括第二主表面以及第二主表面與側表面之間的第二多重轉折面。第二多重轉折面包括法線方向不同的多個第二轉折面。In an embodiment of the present invention, the above-mentioned substrate further includes a second main surface and a second multiple inflection surface between the second main surface and the side surface. The second multiple inflection surfaces include a plurality of second inflection surfaces with different normal directions.
在本發明的一實施例中,上述的邊緣導線各自從第一主表面、第一多重轉折面、側表面、第二多重轉折面至第二主表面連續延伸。In an embodiment of the present invention, the above-mentioned edge wires respectively extend continuously from the first main surface, the first multiple inflection surface, the side surface, the second multi-inflection surface to the second main surface.
在本發明的一實施例中,上述的第一多重轉折面與第一主表面的交點距離側表面第一側向距離,第二多重轉折面與第二主表面的交點距離側表面第二側向距離,且第一側向距離小於第二側向距離。In an embodiment of the present invention, the intersection of the first multiple turning surface and the first main surface is a first lateral distance from the side surface, and the intersection of the second multiple turning surface and the second main surface is a second distance from the side surface. Two lateral distances, and the first lateral distance is smaller than the second lateral distance.
在本發明的一實施例中,上述的電子裝置還包括第一導電接墊與第二導電接墊。第一導電接墊與第二導電接墊分別配置於第一主表面與第二主表面上,且邊緣導線的其中一者將第一導電接墊與第二導電接墊電連接。In an embodiment of the present invention, the above-mentioned electronic device further includes a first conductive pad and a second conductive pad. The first conductive pad and the second conductive pad are respectively disposed on the first main surface and the second main surface, and one of the edge wires electrically connects the first conductive pad and the second conductive pad.
在本發明的一實施例中,上述的第二導電接墊相較於第一導電接墊更遠離側表面。In an embodiment of the present invention, the above-mentioned second conductive pads are further away from the side surface than the first conductive pads.
在本發明的一實施例中,上述的第一導電接墊的長度小於第二導電接墊的長度。In an embodiment of the present invention, the length of the first conductive pad is smaller than the length of the second conductive pad.
在本發明的一實施例中,上述的電子裝置還包括發光元件。發光元件配置於第一主表面上,且與保護結構間隔開來。In an embodiment of the present invention, the above-mentioned electronic device further includes a light-emitting element. The light emitting element is disposed on the first main surface and is spaced apart from the protective structure.
在本發明的一實施例中,上述的電子裝置還包括封裝層,以包覆發光元件。In an embodiment of the present invention, the above-mentioned electronic device further includes an encapsulation layer to encapsulate the light-emitting element.
在本發明的一實施例中,上述的封裝層進一步重疊第一主表面上的保護結構的一部分。In an embodiment of the present invention, the above-mentioned encapsulation layer further overlaps a portion of the protective structure on the first main surface.
在本發明的一實施例中,上述的多個第一轉折面的法線方向介於第一主表面的法線方向與側表面的法線方向之間。In an embodiment of the present invention, the normal direction of the first turning surfaces is between the normal direction of the first main surface and the normal direction of the side surface.
在本發明的一實施例中,上述的第一多重轉折面與第一主表面的交點距離側表面第一側向距離,第一多重轉折面與側表面的交點距離所述第一主表面第一垂直距離,且第一垂直距離為第一側向距離的0.5倍至2倍。In an embodiment of the present invention, the intersection of the first multiple turning surface and the first main surface is a first lateral distance from the side surface, and the intersection of the first multiple turning surface and the side surface is far from the first main surface. The surface has a first vertical distance, and the first vertical distance is 0.5 times to 2 times the first lateral distance.
在本發明的一實施例中,上述的第一垂直距離等於第一側向距離。In an embodiment of the present invention, the above-mentioned first vertical distance is equal to the first lateral distance.
基於上述,本發明一些實施例的電子裝置利用設置於基板測表面上的邊緣導線來實現訊號傳遞線路,而可允許將外部電子元件(例如電路板之類的元件)接合於主表面以外的表面。如此一來,電子裝置可將功能性的電子元件(例如顯示元件、觸控元件、感測元件等)設置在基板的主表面的大部分面積上,甚至鄰近基板的邊緣設置這些功能性的電子元件。因此,電子裝置可具有窄邊框甚至幾乎無邊框的設計。另外,電子裝置的機板可具有多重轉折面,使得邊緣導線可連續的由主表面經過多重轉折面而延伸到側表面而確保邊緣導線的連續性。Based on the above, the electronic device of some embodiments of the present invention utilizes the edge wires disposed on the surface of the substrate to realize the signal transmission line, which can allow external electronic components (such as components such as circuit boards) to be bonded to surfaces other than the main surface. . In this way, the electronic device can arrange functional electronic components (such as display components, touch components, sensing components, etc.) on most of the main surface of the substrate, and even arrange these functional electronic components adjacent to the edge of the substrate. element. Therefore, the electronic device can have a narrow bezel or even almost bezel-less design. In addition, the board of the electronic device can have multiple inflection surfaces, so that the edge wires can continuously extend from the main surface through the multiple inflection surfaces to the side surfaces to ensure the continuity of the edge wires.
在附圖中,為了清楚起見,放大了層、膜、面板、區域等的厚度。在整個說明書中,相同的附圖標記表示相同的元件。應當理解,當諸如層、膜、區域或基板的元件被稱為在「另一元件上」、或「連接到另一元件」、「重疊於另一元件」時,其可以直接在另一元件上或與另一元件連接,或者中間元件可以也存在。相反,當元件被稱為「直接在另一元件上」或「直接連接到」另一元件時,不存在中間元件。如本文所使用的,「連接」可以指物理及/或電性連接。再者,「電性連接」或「耦合」係可為二元件間存在其它元件。In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. The same reference numerals refer to the same elements throughout the specification. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on," "connected to," "overlying" another element, it can be directly on the other element on or connected to another element, or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to a physical and/or electrical connection. Furthermore, "electrically connected" or "coupled" may refer to the existence of other elements between the two elements.
應當理解,儘管術語「第一」、「第二」、「第三」等在本文中可以用於描述各種元件、部件、區域、層及/或部分,但是這些元件、部件、區域、及/或部分不應受這些術語的限制。這些術語僅用於將一個元件、部件、區域、層或部分與另一個元件、部件、區域、層或部分區分開。因此,下面討論的「第一元件」、「部件」、「區域」、「層」、或「部分」可以被稱為第二元件、部件、區域、層或部分而不脫離本文的教導。It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, and/or or parts shall not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, "a first element," "component," "region," "layer," or "section" discussed below could be termed a second element, component, region, layer or section without departing from the teachings herein.
這裡使用的術語僅僅是為了描述特定實施例的目的,而不是限制性的。如本文所使用的,除非內容清楚地指示,否則單數形式「一」、「一個」和「該」旨在包括複數形式,包括「至少一個」。「或」表示「及/或」。如本文所使用的,術語「及/或」包括一個或多個相關所列項目的任何和所有組合。還應當理解,當在本說明書中使用時,術語「包括」及/或「包括」指定所述特徵、區域、整體、步驟、操作、元件的存在及/或部件,但不排除一個或多個其它特徵、區域整體、步驟、操作、元件、部件及/或其組合的存在或添加。The terminology used herein is for the purpose of describing particular embodiments only and is not limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms including "at least one" unless the content clearly dictates otherwise. "Or" means "and/or". As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. It will also be understood that, when used in this specification, the terms "comprising" and/or "comprising" designate the stated feature, region, integer, step, operation, presence of an element and/or part, but do not exclude one or more The presence or addition of other features, entireties of regions, steps, operations, elements, components, and/or combinations thereof.
此外,諸如「下」或「底部」和「上」或「頂部」的相對術語可在本文中用於描述一個元件與另一元件的關係,如圖所示。應當理解,相對術語旨在包括除了圖中所示的方位之外的裝置的不同方位。例如,如果一個附圖中的裝置翻轉,則被描述為在其他元件的「下」側的元件將被定向在其他元件的「上」側。因此,示例性術語「下」可以包括「下」和「上」的取向,取決於附圖的特定取向。類似地,如果一個附圖中的裝置翻轉,則被描述為在其它元件「下方」或「下方」的元件將被定向為在其它元件「上方」。因此,示例性術語「下面」或「上面」可以包括上方和下方的取向。Furthermore, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe one element's relationship to another element, as shown in the figures. It should be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one of the figures is turned over, elements described as being on the "lower" side of other elements would then be oriented on "upper" sides of the other elements. Thus, the exemplary term "lower" may include an orientation of "lower" and "upper", depending on the particular orientation of the figures. Similarly, if the device in one of the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "below" or "above" can encompass both an orientation of above and below.
本文使用的「約」、「實質上」、或「近似」包括所述值和在本領域普通技術人員確定的特定值的可接受的偏差範圍內的平均值,考慮到所討論的測量和與測量相關的誤差的特定數量(即,測量系統的限制)。例如,「約」可以表示在所述值的一個或多個標準偏差內,或±30%、±20%、±10%、±5%內。再者,本文使用的「約」、「實質上」、或「近似」可依光學性質、蝕刻性質或其它性質,來選擇較可接受的偏差範圍或標準偏差,而可不用一個標準偏差適用全部性質。As used herein, "about", "substantially", or "approximately" includes the stated value and the average within an acceptable deviation of the particular value as determined by one of ordinary skill in the art, considering the measurement in question and the A specific amount of measurement-related error (ie, the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, as used herein, "about", "substantially", or "approximately" may be used to select a more acceptable range of deviation or standard deviation depending on optical properties, etching properties, or other properties, and not one standard deviation may apply to all. nature.
除非另有定義,本文使用的所有術語(包括技術和科學術語)具有與本發明所屬領域的普通技術人員通常理解的相同的含義。將進一步理解的是,諸如在通常使用的字典中定義的那些術語應當被解釋為具有與它們在相關技術和本發明的上下文中的含義一致的含義,並且將不被解釋為理想化的或過度正式的意義,除非本文中明確地這樣定義。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be construed as having meanings consistent with their meanings in the context of the related art and the present invention, and are not to be construed as idealized or excessive Formal meaning, unless expressly defined as such herein.
本文參考作為理想化實施例的示意圖的截面圖來描述示例性實施例。因此,可以預期到作為例如製造技術及/或公差的結果的圖示的形狀變化。因此,本文所述的實施例不應被解釋為限於如本文所示的區域的特定形狀,而是包括例如由製造導致的形狀偏差。例如,示出或描述為平坦的區域通常可以具有粗糙及/或非線性特徵。此外,所示的銳角可以是圓的。因此,圖中所示的區域本質上是示意性的,並且它們的形狀不是旨在示出區域的精確形狀,並且不是旨在限制權利要求的範圍。Exemplary embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments. Thus, variations in the shapes of the illustrations as a result of, for example, manufacturing techniques and/or tolerances, are to be expected. Accordingly, the embodiments described herein should not be construed as limited to the particular shapes of regions as shown herein, but rather include deviations in shapes resulting from, for example, manufacturing. For example, regions illustrated or described as flat may typically have rough and/or nonlinear features. Additionally, the acute angles shown may be rounded. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the claims.
為了方便說明,以下圖式皆以X方向、Y方向與Z方向來表示各圖面所呈現構件的定向。X方向、Y方向與Z方向可彼此正交,也可以非正交方式彼此相交。For the convenience of description, the following drawings all represent the orientation of the components presented in each drawing in the X direction, the Y direction and the Z direction. The X direction, the Y direction, and the Z direction may be orthogonal to each other, or may intersect with each other in a non-orthogonal manner.
圖1至圖4呈現本發明一些實施例的製造電子裝置的部分步驟。在圖1中,於基板110上預先形成第一導電接墊P1以及第二導電接墊(圖1未示出),且於基板110上形成導體材料層120’。基板110為具有一定機械強度而可以承載物件,以供多個膜層及/或多個物件配置其上的板狀物。在一些實施例中,基板110的材質包括玻璃、高分子材料、陶瓷等。在另外一些實施例中,基板110可以為多層基板,其由多個子層堆疊而成。基板110具有第一主表面112A、第二主表面112B以及側表面114。在圖1中,第一導電接墊P1的數量為多個,且多個第一導電接墊P1可沿著Y方向排列設置。第一導電接墊P1位於第一主表面112A上,且圖1未示出的第二導電接墊可位於第二主表面112B上。1 to 4 present some steps of manufacturing an electronic device according to some embodiments of the present invention. In FIG. 1 , a first conductive pad P1 and a second conductive pad (not shown in FIG. 1 ) are pre-formed on the
導體材料層120’可以覆蓋基板110的第一主表面112A上的第一導電接墊P1,並且可以由第一主表面112A,經過側表面114而連續延伸到第二主表面112B。導體材料層120’可採用邊緣濺鍍的方式形成於基板110上。導體材料層120’的材質包括銅、鋁、鉬、銀、金、鎳、鈦ITO、IGZO等。導體材料層120’可以接觸且直接覆蓋住第一導電接墊P1。在第二主表面112B上設置有接墊(例如第二導電接墊,未示出)時,導體材料層120’可以接觸且直接覆蓋住第二主表面112B上的第二導電接墊。The conductor material layer 120' may cover the first conductive pads P1 on the first
在圖2中,於基板110上形成第一保護層132。第一保護層132可具有條狀的圖案,且第一保護層132可由第一主表面112A經過側表面114連續的延伸到第二主表面112B。如圖2所示,多個條狀的第一保護層132可沿Y方向排列,且多個條狀的第一保護層132可以對應於第一導電接墊P1設置。在一些實施例中,第一保護層132可採用印刷的方式製作於基板110上。舉例而言,在一些製作流程中,可先將保護層材料塗佈或是施加於印刷工具上,再以印刷工具抵壓基板110的側表面114,使得印刷工具上的保護層材料附著於導體材料層120’上。接著,移除印刷工具後,可對附著於導體材料層120’上的保護層材料進行固化步驟而形成第一保護層132。In FIG. 2 , the first
在圖2的第一保護層132製作完成之後,可進行圖案化步驟,以將未被第一保護層132覆蓋的導體材料層120’移除而形成圖3所示的邊緣導線120。圖案化導體材料層120’的方法包括等向性蝕刻法。舉例而言,圖案化步驟例如是使得未被第一保護層132覆蓋的導體材料層120’接觸蝕刻劑。在此,圖案化導體材料層120’的蝕刻劑對導體材料層120’與第一保護層132具有選擇性。也就是說,圖案化步驟採用的蝕刻劑例如不容易,甚至不會與第一保護層132的材料發生反應,因此第一保護層132在蝕刻步驟中大致上不會受損而作為硬罩幕之用。After the first
邊緣導線120配置於基板110上,且對應於第一保護層132。邊緣導線120的數量可相同於第一保護層132的數量。各邊緣導線120夾在其中一個條狀的第一保護層132與基板110之間,且從基板110的第一主表面112A經過基板110的側表面114而連續的延伸至基板110的第二主表面112B。The
接著,如圖4所示,在圖3的結構上進一步形成第二保護層134以完成電子裝置100。第二保護層134配置於基板110上且包覆第一保護層132。第二保護層134可採用印刷的方式(例如轉印)製作或是以浸濡的方式製作。舉例而言,第二保護層134的製作方式可以是將基板110浸濡於保護材料的溶液中,使保護材料沾附於基板110上,而後待保護材料固化後即可形成第二保護層134。第一保護層132與第二保護層134可構成保護邊緣導線120的保護結構130。Next, as shown in FIG. 4 , a second
第一保護層132與第二保護層134的材料可包括聚酯類樹脂(polyester resins)、酚醛樹脂(phenolic resins)、醇酸樹脂(alkyd resins)、聚碳酸酯樹脂(polycarbonate resins)、聚醯胺樹脂(polyamide resins)、聚胺酯樹脂(polyurethane resins)、矽氧樹脂(silicone resins)、環氧樹脂(epoxy resins)、聚乙烯樹脂(polyethylene resins)、丙烯酸樹脂(acrylic resins)、聚苯乙烯樹脂(polystyrene resins)、聚丙烯樹脂(polypropylene resins)、或其他具有防水保護作用的材料。第一保護層132與第二保護層134可採用相同材質製作也可選用不同材質。The materials of the first
圖4為本發明一實施例的電子裝置的局部示意圖。圖5為圖4的電子裝置沿線I-I的剖面示意圖。在圖4與圖5中,電子裝置100包括基板110、多條邊緣導線120以及保護結構130,但不以此為限。在一些實施例中,電子裝置100還可包括其他訊號線、其他電子元件等。舉例而言,除了圖中的構件外,電子裝置100還可包括有發光元件、顯示元件、觸控元件或上述元件的組合。舉例而言,如圖5所示,電子裝置100可進一步包括第一導電接墊P1以及第二導電接墊P2,其中第一導電接墊P1配置於基板110的第一主表面112A上,且第二導電接墊P2配置於基板110的第二主表面112B上。每一條邊緣導線120對應其中一個第一導電接墊P1來設置,且邊緣導線120的其中一者可將第一導電接墊P1與對應的第二導電接墊P2電連接以建立由第一主表面112A連續延伸至第二主表面112B的電傳輸路徑。FIG. 4 is a partial schematic diagram of an electronic device according to an embodiment of the present invention. FIG. 5 is a schematic cross-sectional view of the electronic device of FIG. 4 along line I-I. In FIGS. 4 and 5 , the
在圖4至圖5中,基板110例如具有第一主表面112A、第二主表面112B以及側表面114。在本實施例中,第一主表面112A與第二主表面112B的法線方向例如可平行方向Z,而側表面114的法線方向可平行方向X。換言之,第一主表面112A的法線方向可相交於側表面114的法線方向,而平行於第二主表面112B的法線方向,但不以此為限。In FIGS. 4 to 5 , the
圖6為圖4的電子裝置沿線II-II的剖面示意圖,且圖7為圖4的電子裝置沿線III-III的剖面示意圖。基板110可經切割而具有需要的大小尺寸,另外,第一主表面112A與側表面114之間的轉角可經導角處理而使基板110具有第一多重轉折面116A。第一多重轉折面116A連接於第一主表面112A與側表面114之間。第一多重轉折面116A的法線方向可介於第一主表面112A的法線方向與側表面114的法線方向之間。6 is a schematic cross-sectional view of the electronic device of FIG. 4 along line II-II, and FIG. 7 is a schematic cross-sectional view of the electronic device of FIG. 4 taken along line III-III. The
在圖6與圖7中,第一多重轉折面116A可經由兩次的導角處理而形成。舉例而言,第一多重轉折面116A可包括兩個第一轉折面116A1與116A2,其中第一轉折面116A1連接於第一轉折面116A2與第一主表面112A之間,而第一轉折面116A2連接於第一轉折面116A1與側表面114之間。在其他實施例中,第一多重轉折面116A可選擇性的具有三個或是三個以上的轉折面。In FIG. 6 and FIG. 7 , the first
相似的,第二主表面112B與側表面114之間的轉角可經導角處理而使基板110具有第二多重轉折面116B。第二多重轉折面116B連接於第二主表面112B與側表面114之間且可由第二轉折面116B1與第二轉折面116B2構成,但不以此為限。在其他實施例中,第二主表面112B與側表面114之間的轉角可選擇的不經導角處理,但不以此為限。第二多重轉折面116B的法線方向可介於第二主表面112B的法線方向與側表面114的法線方向之間。Similarly, the corners between the second
第一多重轉折面116A夾於第一主表面112A與側表面114之間以及第二多重轉折面116B夾於第二主表面112B與側表面114之間可使得相鄰表面之間具有鈍角轉角。如此,任何橫越相鄰表面的膜層及/或構件可具有較佳的連續性,不容易在轉角處中斷。因此,可確保電子裝置100的品質。The first
由圖4、5與6可知,邊緣導線120配置於基板110上,且各邊緣導線120自第一主表面112A經過第一多重轉折面116A而延伸至側表面116。視設計需求,各邊緣導線120可進一步由側表面116經過第二多重轉折面116B而延伸至第二主表面112B。第一多重轉折面116A以及第二多重轉折面116B使得相鄰表面之間具有鈍角轉角,因此邊緣導線120可連續的由第一主表面112A、經過第一多重轉折面116A、側表面114及第二多重轉折面116B而延伸到第二主表面112B。換言之,邊緣導線120在不同法向量的表面之間具有良好的延續性,這有助於確保邊緣導線120的電訊號傳輸品質。It can be seen from FIGS. 4 , 5 and 6 that the
保護結構130配置於基板110上,且包括覆蓋多條邊緣導線120的導線保護部130A以及延伸於邊緣導線120之間的間隙保護部130B。在本實施例中,導線保護部130A是指保護結構130重疊邊緣導線120的部分,而間隙保護部130B是指保護結構130延伸於邊緣導線120的間隙G120中的部分。也就是說,導線保護部130A與間隙保護部130B是以分布位置來區分的。The
具體來說,保護結構130可以由第一保護層132以及第二保護層堆疊而成。第一保護層132具有多個條狀圖案的保護層。第一保護層132的每個條狀圖案都對應於其中一條邊緣導線120設置以覆蓋住邊緣導線120。由圖4與5可知,邊緣導線120的輪廓順應於第一保護層132的輪廓,且第一保護層132對應的覆蓋每一條邊緣導線120。第二保護層134則連續的覆蓋邊緣導線120與邊緣導線120之間的間隙G120。第二保護層134可覆蓋第一保護層132並且將第一保護層132與邊緣導線120完全包覆,但不以此為限。Specifically, the
在一些實施例中,第一保護層132與第二保護層134可具有相同材料,因此第一保護層132與第二保護層134之間不存在明顯交界。在另外一些實施例中,第一保護層132與第二保護層134可具有不同材料,而有明顯的交界存在兩者之間。此外,第二保護層134可包括重疊段134A與間隙段134B。重疊段134A疊置於第一保護層132上而與第一保護層132構成導線保護部130A。間隙段134B位於多條邊緣導線120之間的間隙G120中並接觸基板110,以構成保護結構130的間隙保護部130B。In some embodiments, the first
請參照圖6,保護結構130的導線保護部130A主要由第一保護層132與堆疊於第一保護層132上的重疊段134A構成。導線保護部130A在側表面114具有第一厚度T1,在第一主表面112A具有第二厚度T2,在第一轉折面116A1上具有第三厚度T3。第一厚度T1大於所述第二厚度T2,且第二厚度T2大於第三厚度T3。Referring to FIG. 6 , the
參照圖4與圖7,延伸於多條邊緣導線120之間的間隙保護部130B主要由第二保護層134的間隙段134B構成,且間隙段134B可以接觸基板110而無導線夾於基板110與間隙段134B之間。間隙保護部130B在側表面114上具有第四厚度T4,在第一主表面112A上具有第五厚度T5,在第一轉折面116A1上具有第六厚度T6,第四厚度T4大於第五厚度T5,且第五厚度T5大於第六厚度T6。同時參照圖5與圖6,在一些實施例中,第二厚度T2可大於第五厚度T5。在另一些實施例中,第二厚度T2可大於第四厚度T4。在又另一些實施例中,第三厚度T3大於第六厚度T6。Referring to FIGS. 4 and 7 , the
圖8表示本發明一實施例的基板的局部剖面示意圖,其中圖8呈現出基板110的第一多重轉折面116A的局部放大示意圖。基板110的第一主表面112A的法線方向例如平行方向Z而側表面114的法線方向例如平行方向X。第一多重轉折面116A可包括兩個第一轉折面116A1以及116A2。在本實施例中,第一轉折面116A1以及第二轉折面116A2的法線方向可以都介於方向Z與方向X之間。具體而言,第一轉折面116A1的法線方向介於第一主表面112A的法線方向與第二轉折面116A2的法線方向之間,而第二轉折面116A2的法線方向之間介於第一轉折面116A1的法線方向與側表面116的法線方向之間。第一主表面112A的法線方向與第一轉折面116A1的法線方向的交角、第一轉折面116A1的法線方向與第一轉折面116A2的法線方向的交角以及第一轉折面116A2的法線方向與側表面114的法線方向的交角可以彼此相等或是近似。FIG. 8 is a schematic partial cross-sectional view of a substrate according to an embodiment of the present invention, wherein FIG. 8 is a partially enlarged schematic view of the first
在一些實施例中,第一多重轉折面116A與第一主表面112A的交點X1距離側表面114第一側向距離D1,第一多重轉折面116A與側表面114的交點X2距離第一主表面112A第一垂直距離D2,且第一垂直距離D2可大致為第一側向距離D1的0.5倍至2倍。在一些實施例中,第一垂直距離D2可大致相等於第一側向距離D1。所謂的側向距離是指在平行於方向X所量測的距離,而所謂的垂直距離是指在平行於方向Z所量測的距離。此處所描述的第一側向距離D1與第一垂直距離D2的關係可應用於本文中所有實施例中,並不特別限定。In some embodiments, the intersection X1 of the first
圖9表示本發明另一實施例的基板的局部剖面示意圖,其中圖9呈現出基板110的第一多重轉折面116A的局部結構。基板110的第一主表面112A的法線方向例如平行方向Z而側表面114的法線方向例如平行方向X。第一多重轉折面116A可包括三個第一轉折面116A1、116A2以及116A3。在本實施例中,第一轉折面116A1、第二轉折面116A2與第三轉折面116A3的法線方向可以都介於方向Z與方向X之間。第一主表面112A的法線方向與第一轉折面116A1的法線方向的交角R1、第一轉折面116A1的法線方向與第一轉折面116A2的法線方向的交角R2、第一轉折面116A2的法線方向與第一轉折面116A3的法線方向的交角R3以及第一轉折面116A3的法線方向與側表面114的法線方向的交角R4可以彼此相等或是近似。FIG. 9 is a schematic partial cross-sectional view of a substrate according to another embodiment of the present invention, wherein FIG. 9 shows a partial structure of the first
圖10為本發明另一實施例的電子裝置的局部剖面示意圖。圖10的電子裝置200包括基板110、邊緣導線120、保護結構230、發光元件140以及封裝層150,其中保護結構230例如由第一保護層132與第二保護層234堆疊而成。本實施例中所述的基板110、邊緣導線120與第一保護層132大致相同於前述實施例的對應構件,因此前述實施例中關於基板110、邊緣導線120與第一保護層132的描述都可併入本實施例中,不再重述。另外,圖10所示的發光元件140與密封層150可應用於本文的其他實施例中。10 is a partial cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention. The
在本實施例中,發光元件140可配置於基板110的第一主表面112A上,且與保護結構230間隔開來。也就是說,發光元件140不接觸保護結構230。在一些實施例中,發光元件140包括發光二極體元件,但不以此為限。發光元件140的數量例如為多個,且不同發光元件140可發出不同色彩的光。發光元件140可藉由製作於基板110上的電路結構而電連接至對應的第一導電接墊P1。在此,邊緣導線120、第一導電接墊P1以及第二導電接墊P2都可用於傳遞發光元件140所需要的電訊號。In this embodiment, the
封裝層150可配置於基板110的第一主表面114A上以包覆發光元件140。另外,本實施例的第二保護層234與前述實施例的第二保護層134大致相似,其材質與配置方式都可參照前述第二保護層134的描述。不過,本實施例的第二保護層234露出第一保護層132在第一主表面112A上的部分。也就是說,第一保護層132在第一主表面112A上的部分並不完全被第二保護層234覆蓋。此外,封裝層150可進一步重疊第一主表面112A上的保護結構230的一部分,甚至覆蓋部分的第二保護層234。如此一來,第一保護層132可完全第二保護層234與封裝層150密封。The
圖11為本發明又一實施例的電子裝置的局部剖面示意圖。圖11的電子裝置300包括基板110、邊緣導線120以及保護結構130,其中基板110、邊緣導線120以及保護結構130的相對配置關係及製作方式可參照前述實施例的描述。圖11所示的構件大致上相似於圖4的構件,因此以下主要以兩實施例的差異來說明。圖4與圖11中標示相同元件附號的構件可以相同的方式來設置。11 is a partial cross-sectional schematic diagram of an electronic device according to still another embodiment of the present invention. The
在圖11中,第一主表面112A與第二主表面112B例如為基板110的相對表面。第一主表面112A與基板110的側表面114之間設置有第一多重轉折面116A’,且第二主表面112A與基板110的側表面114之間設置有第二多重轉折面116B’。本實施例不同於圖4的實施例的其中一處在於,第一多重轉折面116A’與第二多重轉折面116B’的延伸長度。具體而言,第一多重轉折面116A’與第一主表面112A的交點X1’距離側表面114第一側向距離D1’,且第一多重轉折面116A’與側表面114的交點X2’距離第一主表面112A第一垂直距離D2’。第二多重轉折面116B’與第二主表面112B的交點X2’距離側表面114第二側向距離D3’,且第二多重轉折面116B’與側表面114的交點X4’距離第二主表面112B第二垂直距離D4’。在本實施例中,第一側向距離D1’可小於第二側向距離D3’,且第一垂直距離D2’可小於第二垂直距離D4’。在一些實施例中,可採用第一側向距離D1’小於第二側向距離D3’且第一垂直距離D2’等於第二垂直距離D4’的設計,或是採用第一側向距離D1’等於第二側向距離D3’且第一垂直距離D2’小於第二垂直距離D4’的設計。也就是說,第一多重轉折面116A’與第二多重轉折面116B’可具有不同的延伸長度。In FIG. 11 , the first
在一些實施例中,第一多重轉折面116A’與第二多重轉折面116B’可具有不同延伸長度,但第一多重轉折面116A’在方向Z上與方向X上的長度可以為相等的,且第二多重轉折面116B’在方向Z上與方向X上的長度可以為相等的。舉例而言,第一垂直距離D2’可大致等於第一側向距離D1’,且第二垂直距離D4’可大致等於第二側向距離D3’。在一些實施例中,第一垂直距離D2’可大致為第一側向距離D1’的0.5倍至2倍,而類似的,第二垂直距離D4’可大致為第二側向距離D3’的0.5倍至2倍。另外,第一多重轉折面116A’與第二多重轉折面116B’在此以各自具有兩個轉折面為例來說明,但第一多重轉折面116A’與第二多重轉折面116B’各自所具有的轉折面的數量可依據不同的設計而有所調整。In some embodiments, the first
在一些實施例中,基板110上可設置有第一導電接墊P1’以及第二導電接墊P2’,且邊緣導線120接觸第一導電接墊P1’以及第二導電接墊P2’以將第一導電接墊P1’以及第二導電接墊P2’彼此電連接。第一導電接墊P1’配置於基板110的第一主表面112A上,而第二導電接墊P2’配置於基板110的第二主表面112B上,且第二導電接墊P2’可相較於第一導電接墊P1’在方向X上更遠離側表面114。第一導電接墊P1’在方向X上的長度L1’可以小於第二導電接墊P2’在方向X上的長度L2。In some embodiments, a first conductive pad P1' and a second conductive pad P2' may be disposed on the
另外,在電子裝置300中,包覆邊緣導線120的保護結構130可由第一保護層132與第二保護層134堆疊而成。在第一保護層132與第二保護層134由不同材料製作的實施方式中,第一保護層132與第二保護層134之間可存在明顯交界。在第一保護層132與第二保護層134由相同材料製作的實施方式中,第一保護層132與第二保護層134之間沒有明顯交界而使得保護結構130大致上可視為一體的結構物。In addition, in the
在一些實施例中,第一保護層132可具有變化的厚度以下所描述厚度是指第一保護層132在所在表面的法線方向上量測到的尺寸。舉例而言,第一保護層132在第一表面112A上具有厚度T132a,在第一多重轉折面116A’上具有厚度T132b與T132c,且在側表面114上具有厚度T132d。厚度T132a、厚度T132b、厚度T132c與厚度T132d可以不完全相同。在一些實施例中,厚度T132d可以大於厚度T132a、厚度T132b與厚度T132c每一者,因此第一保護層132在側表面114處具有最大的厚度,但不以此為限。另外,厚度T132a、厚度T132b與厚度T132c可依次減小,例如厚度T132a大於厚度T132b,且厚度T132b大於厚度T132c,但不以此為限。在一些實施例中,第一保護層132在第二主表面112B上的厚度可以大致相似於厚度T132a,而在第二多重轉折面116B’上的厚度可大致相似於厚度T132b與厚度T132c。In some embodiments, the first
綜上所述,本發明的電子裝置具有多重轉折的轉角,因此沿著轉角分布的邊緣導線可具有理想的連續性。另外,電子裝置具有邊緣導線的設計可以具有極窄邊框,而有助於提升電子裝置的應用彈性。如此一來,本發明實施例的電子裝置可以應用於需要極窄邊框甚至要求無邊框的產品,例如拼接式的產品中。To sum up, the electronic device of the present invention has corners with multiple turns, so the edge wires distributed along the corners can have ideal continuity. In addition, the design of the electronic device with edge wires can have a very narrow frame, which helps to improve the application flexibility of the electronic device. In this way, the electronic device of the embodiment of the present invention can be applied to products that require extremely narrow bezels or even no bezels, such as spliced products.
100、200:電子裝置
110:基板
112A:第一主表面
112B:第二主表面
114:側表面
116A、116A’:第一多重轉折面
116A1、116A2、116A3:第一轉折面
116B、116B’:第二多重轉折面
116B1、116B2:第二轉折面
120:邊緣導線
120’:導體材料層
130、230:保護結構
130A:導線保護部
130B:間隙保護部
132:第一保護層
134、234:第二保護層
134A:重疊段
134B:間隙段
140:發光元件
150:封裝層
D1、D1’:第一側向距離
D2、D2’:第一垂直距離
D3':第二側向距離
D4':第二垂直距離
G120:間隙
P1、P1':第一導電接墊
P2、P2':第二導電接墊
R1、R2、R3、R4:交角
T1:第一厚度
T132a、T132b、T132c、T132d:厚度
T2:第二厚度
T3:第三厚度
T4:第四厚度
T5:第五厚度
T6:第六厚度
X、Y、Z:方向
X1、X1’、X2、X2’、X3'、X4':交點100, 200: Electronic devices
110:
圖1至圖4呈現本發明一些實施例的製造電子裝置的部分步驟。 圖5為圖4的電子裝置沿線I-I的剖面示意圖。 圖6為圖4的電子裝置沿線II-II的剖面示意圖。 圖7為圖4的電子裝置沿線III-III的剖面示意圖。 圖8表示本發明一實施例的基板的局部剖面示意圖。 圖9表示本發明另一實施例的基板的局部剖面示意圖。 圖10為本發明另一實施例的電子裝置的局部剖面示意圖。 圖11為本發明又一實施例的電子裝置的局部剖面示意圖。1 to 4 present some steps of manufacturing an electronic device according to some embodiments of the present invention. FIG. 5 is a schematic cross-sectional view of the electronic device of FIG. 4 along line I-I. FIG. 6 is a schematic cross-sectional view of the electronic device of FIG. 4 along line II-II. FIG. 7 is a schematic cross-sectional view of the electronic device of FIG. 4 along line III-III. FIG. 8 is a schematic partial cross-sectional view of a substrate according to an embodiment of the present invention. FIG. 9 is a schematic partial cross-sectional view of a substrate according to another embodiment of the present invention. 10 is a partial cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention. 11 is a partial cross-sectional schematic diagram of an electronic device according to still another embodiment of the present invention.
110:基板110: Substrate
112A:第一主表面112A: First major surface
114:側表面114: Side Surface
116A:第一多重轉折面116A: First Multiple Turning Surface
116A1、116A2:第一轉折面116A1, 116A2: The first turning surface
D1:第一側向距離D1: first lateral distance
D2:第一垂直距離D2: The first vertical distance
X、Z:方向X, Z: direction
X1、X2:交點X1, X2: intersection point
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CN110928061B (en) * | 2019-11-29 | 2022-04-26 | 武汉华星光电技术有限公司 | Display panel and display device |
CN110967881B (en) * | 2019-12-30 | 2023-05-30 | Tcl华星光电技术有限公司 | Display panel and preparation method thereof |
CN111192883A (en) * | 2020-01-08 | 2020-05-22 | 深圳市华星光电半导体显示技术有限公司 | Side edge binding structure of display panel and manufacturing method thereof |
CN111427202A (en) * | 2020-04-08 | 2020-07-17 | 深圳市华星光电半导体显示技术有限公司 | Narrow-frame display panel and display device |
CN111352270B (en) * | 2020-04-16 | 2023-01-31 | 京东方科技集团股份有限公司 | Liquid crystal display panel, manufacturing method thereof and liquid crystal display device |
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2020
- 2020-10-21 TW TW109136358A patent/TWI737520B/en active
- 2020-11-26 TW TW109141519A patent/TWI741885B/en active
- 2020-12-30 TW TW109146921A patent/TWI749974B/en active
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2021
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- 2021-02-08 TW TW110104760A patent/TWI751020B/en active
- 2021-02-19 TW TW110105874A patent/TWI750034B/en active
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TWI767785B (en) | 2022-06-11 |
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TW202206905A (en) | 2022-02-16 |
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TW202206907A (en) | 2022-02-16 |
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TW202206904A (en) | 2022-02-16 |
TW202207498A (en) | 2022-02-16 |
TW202207504A (en) | 2022-02-16 |
TWI758203B (en) | 2022-03-11 |
TW202206294A (en) | 2022-02-16 |
TWI741885B (en) | 2021-10-01 |
TW202206909A (en) | 2022-02-16 |
TWI753735B (en) | 2022-01-21 |
TWI761171B (en) | 2022-04-11 |
TW202206900A (en) | 2022-02-16 |
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