CN110967881A - Display panel and preparation method thereof - Google Patents
Display panel and preparation method thereof Download PDFInfo
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- CN110967881A CN110967881A CN201911391351.9A CN201911391351A CN110967881A CN 110967881 A CN110967881 A CN 110967881A CN 201911391351 A CN201911391351 A CN 201911391351A CN 110967881 A CN110967881 A CN 110967881A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a display panel and a preparation method thereof, the display panel comprises a color film substrate, an array substrate, a flip chip film, a PCB (printed Circuit Board), a liquid crystal layer and frame glue, wherein the side surfaces of the color film substrate and the array substrate are mutually aligned, the array substrate is provided with a plurality of thin film transistors distributed in an array manner and a plurality of signal terminals electrically connected with the thin film transistors correspondingly, the edge of one side of each signal terminal is provided with a cut surface, the cut surface is an inclined surface, the flip chip film is bonded to the cut surface, and the side surfaces of the array substrate and the color film substrate are subjected to oblique grinding treatment, so that the flip chip film is arranged on the side surfaces of the array substrate and the color film substrate, the contact impedance can be reduced while the frame of the display panel is reduced.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel and a preparation method thereof.
Background
The TFT-LCD (thin Film transistor liquid crystal display) mostly adopts Outer Lead Bonding (OLB), the upper substrate and the lower substrate are staggered for a certain distance by adopting a non-cutting-in design, the exposed TFT leads are connected with a driving Chip (IC), and a driving signal is input into a display panel, wherein the method for connecting the driving IC is that one end of a Chip On Film (COF) is bonded On the leads, and the other end of the Chip On Film (COF) is connected with a Printed Circuit Board (PCB) provided with the driving IC in a pressing way; an Anisotropic Conductive Film (ACF) is usually used as an adhesive between the components to achieve fixation and conduction, and since the outer lead bonding area has a width enough for the requirement, the frame width of the whole machine is increased, which affects the appearance.
In order to solve the problem, a novel Side Bonding (Side Bonding) technology of the chip on film is provided in the industry, wherein the upper substrate and the lower substrate adopt a cut-and-align design, the pin section is exposed through Side grinding, and then the chip on film is bonded at the pin section to realize an ultra-narrow frame; however, when the side bonding technique is adopted, the contact area between the flip chip film and the pin cross section is greatly reduced compared with the bonding of the outer pin, so that the contact impedance is higher.
In view of the foregoing, it is desirable to provide a new display panel and a method for manufacturing the same to solve the above-mentioned problems.
Disclosure of Invention
The invention provides a display panel and a preparation method thereof, which solve the technical problem of high contact impedance caused by the fact that the contact area between a chip on film and a pin section is greatly reduced when the conventional display panel adopts the chip on film side bonding.
In order to solve the above problems, the technical scheme provided by the invention is as follows:
an embodiment of the present invention provides a display panel, including:
a color film substrate;
the array substrate is arranged opposite to the color film substrate, the side surface of the color film substrate is aligned with the side surface of the array substrate, a plurality of thin film transistors distributed in an array mode and a plurality of signal terminals electrically connected with the thin film transistors correspondingly are arranged on the array substrate, a cutting surface is arranged at the edge of one side of each signal terminal, and the cutting surface is an inclined surface;
a chip on film bonded to the cut surface;
the PCB board is connected with the chip on film;
the liquid crystal layer is arranged between the color film substrate and the array substrate; and
and the frame glue is arranged on the outer side of the liquid crystal layer and is connected with the color film substrate and the array substrate.
According to the display panel provided by the embodiment of the invention, the peripheral edge of the array substrate and the peripheral edge of the color film substrate are both provided with inclined planes, wherein the array substrate comprises a first inclined plane close to the color film substrate and a second inclined plane far away from the color film substrate, and the color film substrate comprises a third inclined plane close to the array substrate and a fourth inclined plane far away from the array substrate.
According to the display panel provided by the embodiment of the invention, the plane extending towards one side of the sealant is intersected with the plane extending towards one side of the sealant by the third inclined surface to form a first included angle, and a groove is formed between the first included angle and the sealant and the signal terminal.
According to the display panel provided by the embodiment of the invention, the first inclined surface and the cut surface are in the same plane.
According to the display panel provided by the embodiment of the invention, the display panel further comprises a conductive layer, and the conductive layer is arranged in the groove and covers the cut surfaces of the signal terminals.
According to the display panel provided by the embodiment of the invention, the first included angle is 30-70 degrees.
According to the display panel provided by the embodiment of the invention, the second inclined plane and the fourth inclined plane are correspondingly arranged, and a plane extending from the second inclined plane to one side far away from the sealant is intersected with a plane extending from the fourth inclined plane to one side far away from the sealant to form a second included angle.
According to the display panel provided by the embodiment of the invention, the second included angle is 60-120 degrees; the orthographic projection widths of the second inclined plane and the fourth inclined plane on one side, close to the color film substrate, of the array substrate are 50-200 um.
The embodiment of the invention provides a preparation method of a display panel, which comprises the following steps:
step S10: providing a color film substrate and an array substrate which are arranged in a box-to-box manner;
step S20: cutting off the part of the array substrate extending out of the color film substrate to enable the side surface of the color film substrate and the side surface of the array substrate to be flush with each other;
step 30: performing oblique grinding treatment on the side surface of the color film substrate and the side surface of the array substrate by using a grinding wheel so as to form a cut surface at the edge of one side of the signal terminal arranged on the array substrate, wherein the cut surface is an inclined surface;
step S40: coating conductive silver paste on the cut surface and curing to form a conductive layer;
step S50: preparing a chip on film on the conductive layer; and
step S60: and connecting a PCB (printed Circuit Board) on the chip on film.
According to the manufacturing method of the display panel provided by the embodiment of the invention, in the step S30, the grinding wheel performs chamfer angle processing on the peripheral edge of the array substrate and the peripheral edge of the color film substrate to form inclined planes, wherein the array substrate includes a first inclined plane close to the color film substrate and a second inclined plane far away from the color film substrate, and the color film substrate includes a third inclined plane close to the array substrate and a fourth inclined plane far away from the array substrate.
The invention has the beneficial effects that: according to the display panel and the preparation method thereof, the cutting surface is arranged at one end of the signal terminal, the cutting surface is an inclined surface, and the chip on film is bonded to the cutting surface; meanwhile, the side faces of the array substrate and the color film substrate are aligned, the side faces of the array substrate and the color film substrate are subjected to oblique grinding treatment, and the flip chip films are arranged on the side faces of the array substrate and the color film substrate, so that the frame of the display panel can be reduced, the contact impedance can be reduced, cracks on two sides of glass can be eliminated, the cracks can be prevented from being stressed and growing and breaking, and the strength of the glass can be improved.
Drawings
In order to illustrate the embodiments or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for a person skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic cross-sectional structure diagram of a display panel according to an embodiment of the present invention;
fig. 2 is a flowchart of a method for manufacturing a display panel according to an embodiment of the invention;
fig. 3 to fig. 8 are schematic flow structure diagrams of a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 9 is a schematic cross-sectional view of a grinding wheel according to an embodiment of the present invention.
Detailed Description
The following description of the various embodiments refers to the accompanying drawings that illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], are only referring to the directions of the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention. In the drawings, elements having similar structures are denoted by the same reference numerals.
The invention aims at the technical problem that when the display panel and the preparation method thereof in the prior art are adopted and the side face of the chip on film is bonded, the contact area between the chip on film and the pin section is greatly reduced, so that the contact impedance is higher.
As shown in fig. 1, the display panel according to the embodiment of the present invention includes a color film substrate 10, an array substrate 20, a liquid crystal layer 30, a sealant 40, a flip-chip film 70, and a Printed Circuit Board (PCB) 80, where the array substrate 20 and the color film substrate 10 are disposed opposite to each other, and side surfaces of the two substrates are aligned with each other, the liquid crystal layer 30 is disposed between the color film substrate 10 and the array substrate 20, and the sealant 40 is disposed on an outer side of the liquid crystal layer 30 to connect the array substrate 20 and the color film substrate 10, so that the two substrates are stacked to form a sealed liquid crystal cell.
Specifically, a plurality of thin film transistors distributed in an array and a plurality of signal terminals 50 electrically connected to the thin film transistors are disposed on the array substrate 20, and a cutting surface 501 is disposed at an edge of one side of the signal terminals 50, so that the display panel in the embodiment of the invention has a narrow frame compared to the case where the signal terminals 50 are disposed in a step region of the array substrate 20; the flip chip Film 70 is bonded to the cut surface, and an Anisotropic Conductive Film (ACF) 90 is disposed between the PCB board 80 and the flip chip Film 70 to realize fixation and conduction, so that the signal terminal 50 is connected to a driving signal through the flip chip Film 70 and transmitted to the tft to control liquid crystal molecules in the liquid crystal layer 30 to deflect, and then the display panel performs image display.
The cutting plane 501 is an inclined plane, and compared with the cutting plane in the prior art which is a vertical plane, the contact area between the chip on film 70 and the signal terminal 50 is increased, so that the contact impedance is reduced, the conduction efficiency of the signal terminal 50 and the connection stability between the signal terminal 50 and the chip on film 70 are improved, and the display effect of the display panel is improved.
Furthermore, since the side surface of the array substrate 20 is aligned with the side surface of the color film substrate 10, cracks are more likely to be generated due to the stress on the side surface during pressing, the peripheral edge of the array substrate 20 and the peripheral edge of the color film substrate 10 are processed by beveling to form inclined surfaces, so that the cracks can be prevented from being stressed and growing and broken, and the strength of the array substrate 20 and the color film substrate 10 can be improved; specifically, the array substrate 20 includes a first inclined surface 201 close to the color filter substrate 10 and a second inclined surface 202 far from the color filter substrate, the color filter substrate 10 includes a third inclined surface 101 close to the array substrate 20 and a fourth inclined surface 102 far from the array substrate 20, wherein a plane of the cutting surface 501 extending to one side of the sealant 40 intersects with a plane of the third inclined surface 101 extending to one side of the sealant 40 to form a first included angle, and forms a groove with the sealant 40 and the signal terminal 50.
In the embodiment of the present invention, the first inclined surface 201 and the cut surface 501 are formed in the same process, so that the first inclined surface 201 and the cut surface 501 are in the same plane, that is, the inclination angle of the first inclined surface 201 is maximized at this time, and the coating area of the subsequent conductive film can be increased.
Specifically, the first included angle is 30 ° to 70 °, in different embodiments, the first included angle may be 30 °, 35 °, 40 °, 45 °, 50 °, 55 °, 60 °, 65 °, 70 °, and the like, and is not specifically limited in this embodiment; when the first included angle is smaller, the area of the cut surface 501 of the signal terminal 50 is larger, and the contact area between the flip-chip film 70 and the signal terminal 50 is the largest, so that the contact impedance can be maximally reduced; when the first included angle is larger, the area of the cutting surface 501 of the signal terminal 50 is smaller, and at this time, the contact area between the flip chip film 70 and the signal terminal 50 is the smallest, and the reduction degree of the contact impedance is relatively smaller, so the size of the first included angle should be determined according to the specific size of the contact impedance between the flip chip film 70 and the signal terminal 50 in an actual situation.
Further, the display panel further includes a conductive layer 60, and the conductive layer 60 covers the cut surface 501 of the signal terminal 50, in the embodiment of the present invention, the conductive layer 60 may be disposed in the groove, and it can be understood that the conductive layer 60 covers the side surface of the sealant 40, the cut surface 501 of the signal terminal 50, the first inclined surface 201, the third inclined surface 101, and the coverage area of the conductive layer 60 can be increased, so as to further improve the connection stability between the signal terminal 50 and the chip on film 70.
Specifically, the material of the conductive layer 60 is silver.
Specifically, the second inclined surface 202 and the fourth inclined surface 102 are disposed correspondingly, and a plane extending from the second inclined surface 202 to a side away from the sealant 40 intersects with a plane extending from the fourth inclined surface 102 to a side away from the sealant 40 to form a second included angle.
The second included angle is 60 ° to 120 °, and the first included angle may be 60 °, 70 °, 80 °, 90 °, 100 °, 110 °, 120 °, and the like, which is not specifically limited in this embodiment; the orthographic projection width B of the second inclined surface 202 and the orthographic projection width B of the fourth inclined surface 102 on one side of the array substrate 20 close to the color film substrate 10 are 50um to 200um, so the positions of the second inclined surface 202 and the fourth inclined surface 102 are limited by the size of the second included angle and the size of the second included angle B, the size of the obliquely ground off at the corners of the array substrate 20 and the color film substrate 10 is limited, and the ground off volume is prevented from being too large while the cracks are completely removed.
Further, the conducting layer 60 is further covered with packaging glue, the packaging glue is used for pasting the frame, and meanwhile, the packaging glue can be made of black shading materials so as to avoid light leakage on the side face of the display panel.
As shown in fig. 2, an embodiment of the present invention further provides a method for manufacturing a display panel, including the following steps:
step S10: providing a color film substrate 10 and an array substrate 20 which are arranged in a box-to-box manner;
specifically, as shown in fig. 3, the array substrate 20 and the color film substrate 10 are arranged oppositely, a liquid crystal layer 30 and a sealant 40 formed on an outer side of the liquid crystal layer 30 are formed between the array substrate 20 and the color film substrate 10, and the sealant 40 is used for connecting the array substrate 20 and the color film substrate 10; a plurality of thin film transistors are formed on the array substrate 20 in an array, and a plurality of signal terminals 50 are electrically connected to the thin film transistors.
Step S20: and cutting off the part of the array substrate 20 extending out of the color filter substrate 10, so that the side surface of the color filter substrate 10 and the side surface of the array substrate 20 are flush with each other.
Specifically, as shown in fig. 4, the array substrate 20 may be cut by laser beam cutting.
Step 30: and performing oblique grinding treatment on the side surface of the color filter substrate 10 and the side surface of the array substrate 20 by using a grinding wheel 1, so that a cut surface 501 is formed at the edge of one side of the signal terminal 50 arranged on the array substrate 20, wherein the cut surface 501 is an inclined surface.
Specifically, as shown in fig. 5, the side surface of the color filter substrate 10 and the side surface of the array substrate 20 are subjected to an oblique grinding process by using a grinding wheel 1.
Referring to fig. 9, one side of the grinding wheel 1 close to the display panel includes a protrusion 11, a first groove 12 and a second groove 13, where the protrusion 11 is located in the middle of the grinding wheel 1, the first groove 12 and the second groove 13 are respectively located at the upper and lower sides of the grinding wheel, and the side of the display panel is obliquely ground by the grinding wheel 1, so that the protrusion 11 forms the cut surface 501 at the edge of one side of the signal terminal 50, and the cut surface 501 is an inclined surface, so that the contact area between the subsequently formed flip chip film 70 and the signal terminal 50 is increased, thereby reducing the contact impedance; the first groove 12 and the second groove 13 respectively perform bevel angle processing on the peripheral corners of the array substrate 20 and the peripheral corners of the color film substrate 10, so that the array substrate 20 includes a first inclined surface 201 close to the color film substrate 10 and a second inclined surface 202 far away from the color film substrate 10, and the color film substrate 10 includes a third inclined surface 101 close to the array substrate 20 and a fourth inclined surface 102 far away from the array substrate 20, thereby preventing cracks from being stressed to grow and break, and improving the strength of the array substrate 20 and the color film substrate 10.
Reach regulation edging volume through control the volume of pushing down, speed and the number of times of emery wheel 1, because the volume of pushing down is too big there is the risk of chipping, generally will push down the depth control at 100um, speed according to emery wheel 1 size adaptability adjusts.
It should be noted that, the protrusion 11, the first groove 12 and the second groove 13 may also be disposed on one side of the grinding wheel 1 away from the display panel, so as to perform oblique grinding on the display panel located on two opposite sides of the grinding wheel 1, thereby improving the working efficiency.
Step S40: and coating conductive silver paste on the cut surface 501 and curing to form the conductive layer 60.
Specifically, as shown in fig. 6, the conductive layer 60 is formed by a silver paste transfer process, specifically by controlling the thickness and uniformity of the silver paste.
Step S50: a flip chip film 70 is prepared on the conductive layer 60.
Specifically, as shown in fig. 7, the chip on film 70 is prepared on the conductive layer, and the chip on film 70 and the signal terminal 50 are conducted through the conductive layer 60.
Step S60: the flip chip film 70 is connected to a PCB board 80.
Specifically, as shown in fig. 8, an anisotropic conductive film 90 is used as an adhesive between the PCB board 80 and the flip chip film 70 to achieve the fixing and the conduction.
It should be noted that after the oblique grinding step is completed, the array substrate 20 and the color filter substrate 10 need to be cleaned to remove generated particles or debris.
The beneficial effects are that: according to the display panel and the preparation method thereof provided by the embodiment of the invention, the cut surface is arranged at one end of the signal terminal, the cut surface is an inclined surface, and the chip on film is bonded to the cut surface; meanwhile, the side faces of the array substrate and the color film substrate are aligned, the side faces of the array substrate and the color film substrate are subjected to oblique grinding treatment, and the flip chip films are arranged on the side faces of the array substrate and the color film substrate, so that the frame of the display panel can be reduced, the contact impedance can be reduced, cracks on two sides of glass can be eliminated, the cracks can be prevented from being stressed and growing and breaking, and the strength of the glass can be improved.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (10)
1. A display panel, comprising:
a color film substrate;
the array substrate is arranged opposite to the color film substrate, the side surface of the color film substrate is aligned with the side surface of the array substrate, a plurality of thin film transistors distributed in an array mode and a plurality of signal terminals electrically connected with the thin film transistors correspondingly are arranged on the array substrate, a cutting surface is arranged at the edge of one side of each signal terminal, and the cutting surface is an inclined surface;
a chip on film bonded to the cut surface;
the PCB board is connected with the chip on film;
the liquid crystal layer is arranged between the color film substrate and the array substrate; and
and the frame glue is arranged on the outer side of the liquid crystal layer and is connected with the color film substrate and the array substrate.
2. The display panel according to claim 1, wherein inclined surfaces are disposed on a peripheral edge of the array substrate and a peripheral edge of the color filter substrate, wherein the array substrate includes a first inclined surface close to the color filter substrate and a second inclined surface far from the color filter substrate, and the color filter substrate includes a third inclined surface close to the array substrate and a fourth inclined surface far from the array substrate.
3. The display panel according to claim 2, wherein a plane extending from the cut-off surface to the sealant side intersects with a plane extending from the third inclined surface to the sealant side to form a first included angle, and a groove is formed between the cut-off surface and the sealant and the signal terminal.
4. The display panel according to claim 3, wherein the first inclined surface and the cut surface are in the same plane.
5. The display panel according to claim 3, wherein the display panel further comprises a conductive layer disposed in the groove and covering the cut surface of the signal terminal.
6. The display panel according to claim 3, wherein the first included angle is 30 ° to 70 °.
7. The display panel according to claim 2, wherein the second inclined surface and the fourth inclined surface are disposed correspondingly, and a plane extending from the second inclined surface to a side away from the sealant intersects with a plane extending from the fourth inclined surface to a side away from the sealant to form a second included angle.
8. The display panel according to claim 7, wherein the second included angle is 60 ° to 120 °; the orthographic projection widths of the second inclined plane and the fourth inclined plane on one side, close to the color film substrate, of the array substrate are 50-200 um.
9. A preparation method of a display panel is characterized by comprising the following steps:
step S10: providing a color film substrate and an array substrate which are arranged in a box-to-box manner;
step S20: cutting off the part of the array substrate extending out of the color film substrate to enable the side surface of the color film substrate and the side surface of the array substrate to be flush with each other;
step 30: performing oblique grinding treatment on the side surface of the color film substrate and the side surface of the array substrate by using a grinding wheel so as to form a cut surface at the edge of one side of the signal terminal arranged on the array substrate, wherein the cut surface is an inclined surface;
step S40: coating conductive silver paste on the cut surface and curing to form a conductive layer;
step S50: preparing a chip on film on the conductive layer; and
step S60: and connecting a PCB (printed Circuit Board) on the chip on film.
10. The method of claim 9, wherein in step S30, the grinding wheel performs bevel treatment on the peripheral edge of the array substrate and the peripheral edge of the color filter substrate to form inclined surfaces, wherein the array substrate includes a first inclined surface close to the color filter substrate and a second inclined surface far away from the color filter substrate, and the color filter substrate includes a third inclined surface close to the array substrate and a fourth inclined surface far away from the array substrate.
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| CN111679463A (en) * | 2020-06-10 | 2020-09-18 | Tcl华星光电技术有限公司 | Liquid crystal display screen with lateral binding design and manufacturing method thereof |
| CN112669715A (en) * | 2020-12-24 | 2021-04-16 | 深圳市华星光电半导体显示技术有限公司 | Connecting piece, display panel, manufacturing method of display panel and display device |
| CN112764257A (en) * | 2021-02-03 | 2021-05-07 | Tcl华星光电技术有限公司 | Display panel, grinding head and display device |
| CN113257127A (en) * | 2020-08-14 | 2021-08-13 | 友达光电股份有限公司 | Display device |
| CN113421489A (en) * | 2021-06-08 | 2021-09-21 | Tcl华星光电技术有限公司 | Display panel, manufacturing method thereof and display device |
| TWI741885B (en) * | 2020-08-14 | 2021-10-01 | 友達光電股份有限公司 | Display device |
| CN113568224A (en) * | 2020-08-14 | 2021-10-29 | 友达光电股份有限公司 | Display device |
| CN113721398A (en) * | 2021-08-25 | 2021-11-30 | Tcl华星光电技术有限公司 | Display device and electronic apparatus |
| CN114253038A (en) * | 2021-12-20 | 2022-03-29 | 武汉华星光电技术有限公司 | Display panel |
| CN115061304A (en) * | 2022-07-01 | 2022-09-16 | Tcl华星光电技术有限公司 | Display panel and manufacturing method thereof |
| WO2023115595A1 (en) * | 2021-12-21 | 2023-06-29 | 苏州华星光电技术有限公司 | Display device and manufacturing method therefor |
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