CN108957878B - Display module, preparation method thereof and display device - Google Patents
Display module, preparation method thereof and display device Download PDFInfo
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- CN108957878B CN108957878B CN201810795221.0A CN201810795221A CN108957878B CN 108957878 B CN108957878 B CN 108957878B CN 201810795221 A CN201810795221 A CN 201810795221A CN 108957878 B CN108957878 B CN 108957878B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13456—Cell terminals located on one side of the display only
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- Crystallography & Structural Chemistry (AREA)
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- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract
The invention discloses a display module, a preparation method thereof and a display device, relating to the technical field of display, wherein the display module is provided with a display area and a non-display area, the display area comprises a binding area, and the display module comprises: an array substrate including a plurality of first electrical connection terminals located at a non-display area; the first substrate is arranged opposite to the array substrate and is positioned on one side of the array substrate, which faces the light-emitting surface of the display module; the flexible circuit board is bound on the binding area, the binding area is positioned on the surface of the array substrate, which is far away from the first substrate, or the binding area is positioned on the surface of the first substrate, which is far away from the array substrate, and the flexible circuit board comprises a plurality of second electric connecting terminals, and the second electric connecting terminals are electrically connected with the first electric connecting terminals in a one-to-one correspondence manner; and a connection lead electrically connected to the second electrical connection terminal and the first electrical connection terminal, respectively. Through binding the flexible circuit board in specific region, be favorable to realizing display module assembly and display device's narrow frame design.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display module, a preparation method thereof and a display device.
Background
As the panel display screen is more widely used, the wide screen technology becomes an important technical item, and meanwhile, the technology of the narrow lower frame of the display panel is more and more emphasized. Advanced electronic products, especially portable electronic products, are increasingly tending to be small in size. COF (chip on flex) technology is an important technology for realizing the small size of electronic products. The COF technology is a technology in which a control chip IC is fixed to a flexible circuit board, and a flexible additional circuit board is used as a carrier of a package chip to bond a control chip and a circuit of the flexible additional circuit board. In practical application, the flexible circuit board and the binding area on the display panel are bound, and then the flexible circuit board integrated with the control chip is folded back to the back of the display panel, so that the small size of the whole display device is realized.
Therefore, on the basis of the COF technology, how to further reduce the frame of the display device becomes one of the technical problems to be solved at the present stage.
Disclosure of Invention
In view of this, the invention provides a display module, a manufacturing method thereof and a display device, in which a flexible circuit board is bound on a surface of an array substrate away from a first substrate or bound on a surface of the first substrate away from the array substrate, which is beneficial to further reducing the frame width of the display device, thereby further realizing the narrow frame design of the display device.
In a first aspect, the present application provides a display module assembly, has the display area and encircles the non-display area in display area, non-display area is including binding the district, the display module assembly includes:
an array substrate including a plurality of first electrical connection terminals located at the non-display area;
the first substrate is arranged opposite to the array substrate and is positioned on one side of the array substrate, which faces the light-emitting surface of the display module;
the flexible circuit board is bound on the binding area, the binding area is located on the surface, away from the first substrate, of the array substrate, or the binding area is located on the surface, away from the array substrate, of the first substrate, the flexible circuit board comprises a plurality of second electric connecting terminals, and the second electric connecting terminals are electrically connected with the first electric connecting terminals in a one-to-one corresponding mode; and the number of the first and second groups,
and a connection lead electrically connected with the second electrical connection terminal and the first electrical connection terminal, respectively.
In a second aspect, the present application provides a method for manufacturing a display module, where the display module is a display module provided by the present application, and has a display area and a non-display area surrounding the display area, the non-display area includes a binding area, and the method includes:
preparing an array substrate and a first substrate which are oppositely arranged, wherein the array substrate comprises a plurality of first electric connecting terminals positioned in the binding area, and the first substrate comprises a plurality of third electric connecting terminals positioned in the non-display area;
printing a conductive colloid material on the array substrate or the first substrate in a coating or ink-jet mode to form a connecting lead, wherein the conductive colloid material comprises glue containing conductive particles or aqueous conductive gel;
preparing a flexible circuit board comprising a plurality of second electrical connection terminals;
and binding a flexible circuit board on the connecting lead of the surface of the array substrate departing from the first substrate, or binding the flexible circuit board on the connecting lead of the surface of the first substrate departing from the array substrate, so that the second electric connection terminal on the flexible circuit board is electrically connected with the first electric connection terminal on the array substrate through the connecting lead.
The third aspect provides a display device, including the display module assembly, this display module assembly is the display module assembly that this application provided.
Compared with the prior art, the display module, the preparation method thereof and the display device provided by the invention at least realize the following beneficial effects:
in the display module, the preparation method thereof and the display device provided by the application, the array substrate comprises a plurality of first electric connecting terminals, and the first electric connecting terminals are connected with signal lines and power lines on the array substrate; the flexible circuit board is bound in the binding area, the first substrate is arranged opposite to the array substrate, and the second electric connecting terminal on the flexible circuit board is electrically connected with the first electric connecting terminal, so that relevant signals and power required by the operation of the array substrate can be provided for the array substrate through the flexible circuit board. In particular, the flexible circuit board in the present application is bonded to the surface of the array substrate facing away from the first substrate or bonded to the surface of the first substrate facing away from the array substrate, the first and second electrical connection terminals are electrically connected by the connection leads, so that it is not necessary to bend the flexible circuit board to an area between the array substrate and the first substrate, nor to leave a certain distance between the side edge of the first substrate facing the flexible circuit board and the bonding area, therefore, in the frame area of the display module facing the bonding area, no extra space is required to be arranged on the array substrate or the first substrate except the width of the bonding area, thereby reduced array substrate or first base plate and bound the frame width of district one side, be favorable to reducing display module assembly and display device's frame width to be favorable to realizing display module assembly and display device's narrow frame design.
Of course, it is not necessary for any product in which the present invention is practiced to achieve all of the above-described technical effects simultaneously.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a top view of an unbonded flexible circuit board of a display module according to an embodiment of the disclosure;
fig. 2 is a top view of the display module according to the embodiment of the present disclosure after the flexible circuit board is bonded;
FIG. 3 is an AA' cross-sectional view of the display module of the embodiment shown in FIG. 2;
FIG. 4 is a cross-sectional view of another AA' of the display module of the embodiment shown in FIG. 2;
FIG. 5 is a cross-sectional view of another AA' of the display module shown in FIG. 2;
FIG. 6 is a cross-sectional view of another AA' of the display module shown in FIG. 2;
fig. 7 is a flowchart illustrating a method for manufacturing a display module according to an embodiment of the present disclosure;
fig. 8 is a relative position diagram of the array substrate and the first substrate when the display module is a liquid crystal display module according to an embodiment of the present disclosure;
fig. 9 is a relative position relationship diagram of the array substrate and the first substrate when the display module is an organic light emitting display module according to an embodiment of the present disclosure;
fig. 10 is a flow chart illustrating the formation of connecting leads on the array of substrates in the manufacturing method according to the embodiment of the present application;
fig. 11 is a schematic view of the array substrate and the first substrate shown in fig. 8 on a carrier;
FIG. 12 is a schematic diagram of a process for printing conductive paste material on an array substrate;
FIG. 13 is a schematic view of a process of forming first connecting leads on an array substrate;
fig. 14 is a schematic structural view of the first substrate and the array substrate in fig. 13 after being turned over;
fig. 15 is a schematic view showing a process of printing a conductive paste material on an array substrate again;
FIG. 16 is a schematic view showing a process of forming second connection leads on the array substrate;
fig. 17 is a schematic structural diagram of a display device according to an embodiment of the present disclosure.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
In the prior art, COF (chip on flex) technology is generally adopted to realize the important technology of electronic products with small size. The COF technology is a technology in which a control chip IC is fixed to a flexible circuit board, and a flexible additional circuit board is used as a carrier of a package chip to bond a control chip and a circuit of the flexible additional circuit board. In practical application, the flexible circuit board and the binding area on the display panel are bound, and then the flexible circuit board integrated with the control chip is folded back to the back of the display panel, so that the small size of the whole display device is realized. The flexible circuit board is usually bound in the binding area of the first substrate on the step surface of the array substrate in the prior art, the binding area is required to have a certain length for ensuring the binding reliability of the flexible circuit board, and the flexible circuit board is required to keep a certain distance from the first substrate for ensuring the normal binding of the flexible circuit board, so that the step surface is required to have a large width, and the narrow frame of the display module and the display device is obstructed.
In view of this, the invention provides a display module, a manufacturing method thereof and a display device, in which a flexible circuit board is bound on a surface of an array substrate away from a first substrate or bound on a surface of the first substrate away from the array substrate, which is beneficial to further reducing the frame width of the display device, thereby further realizing the narrow frame design of the display device.
Fig. 1 is a top view of a display module not bound with a flexible circuit board according to an embodiment of the present disclosure, fig. 2 is a top view of a display module bound with a flexible circuit board according to an embodiment of the present disclosure, fig. 3 is an AA' cross-sectional view of a display module according to an embodiment of the present disclosure, with reference to fig. 2 and fig. 3, a display module 100 according to an embodiment of the present disclosure includes a display area 11 and a non-display area 12 surrounding the display area 11, the non-display area 12 includes a binding area 13, and the display module 100 includes:
an array substrate 10 including a plurality of first electrical connection terminals 131 positioned at the non-display area 12;
the first substrate 20 is disposed opposite to the array substrate 10 and located on a side of the array substrate 10 facing the light-emitting surface of the display module 100;
and the flexible circuit board 30 is bound on the binding region 13, the binding region 13 is located on the surface of the array substrate 10 facing away from the first substrate 20, or the binding region 13 is located on the surface of the first substrate 20 facing away from the array substrate 10. The flexible circuit board 30 includes a plurality of second electrical connection terminals 132, the second electrical connection terminals 132 being electrically connected to the first electrical connection terminals 131 in a one-to-one correspondence; and the number of the first and second groups,
the connection lead 40 is electrically connected to the second electrical connection terminal 132 and the first electrical connection terminal 131, respectively.
Alternatively, the first electrical connection terminal 131 is located on a surface of the array substrate 10 on a side facing the first substrate 20.
Specifically, the embodiment shown in fig. 3 is described by taking an example of binding the flexible circuit board 30 to the binding region 13 corresponding to the surface of the array substrate 10 facing away from the first substrate 20. In this embodiment, it is necessary to slightly lengthen the length of the array substrate 10 with respect to the first substrate 20 to form the first electrical connection terminal 131, and the first electrical connection terminal 131 is located on the surface of the array substrate 10 facing the first substrate 20. The connecting lead 40 is electrically connected to the first electrical connecting terminal 131 and extends from the side of the array substrate 10 to the surface of the array substrate 10 facing away from the first substrate 20, which is equivalent to extending the first electrical connecting terminal 131 to the surface of the array substrate 10 facing away from the first substrate 20, so that the flexible circuit board 30 can be bonded to the surface of the array substrate 10 facing away from the first substrate 20. Like this, need not to buckle flexible circuit board 30 to the region between array substrate 10 and the first base plate 20, also need not to leave specific spacing distance with leaving between the side edge of first base plate 20 towards flexible circuit board 30 and the first base plate 20, therefore in the frame region of display module assembly 100 towards binding district 13, except the required width of first electric connection terminal 131, need not to set up extra interval on array substrate 10, thereby array substrate 10 or the frame width of first base plate 20 towards binding district 13 one side has been reduced, be favorable to reducing the frame width of display module assembly 100, thereby be favorable to realizing the narrow frame design of display module assembly 100. In addition, to bind the position setting at the back of array substrate 10, when deviating from the surface of first base plate 20 promptly, the area of binding district 13 can be set for as required, does not occupy the positive space of array substrate 10, and the width of binding district 13 when being located the back can not cause the influence to the width of frame, consequently both does benefit to the narrow frame design that realizes display module assembly 100, is favorable to promoting the reliability of binding of flexible circuit board 30 again.
Referring to fig. 1, in general, a plurality of gate lines 71 extending along a first direction and arranged along a second direction, a plurality of data lines 72 arranged along the first direction and extending along the second direction, and a plurality of power lines 73 arranged along the first direction and extending along the second direction are disposed on an array substrate 10, two adjacent gate lines 71 and two adjacent data lines 72 intersect to define a plurality of sub-pixel units 74, and the power lines 73 provide a power voltage for each sub-pixel unit 74. A gate driving circuit 75 is further disposed at a position corresponding to the non-display area of the array substrate 10, and is electrically connected to the gate line 71 to provide a gate driving signal to the gate line 71, so as to scan each pixel unit row. It should be noted that the data line 72, the power line 73 and the gate driving circuit 75 are all electrically connected to the first electrical connection terminal 131 in the embodiment of the present disclosure, and since the first electrical connection terminal 131 is finally electrically connected to the second electrical connection terminal 132 on the flexible circuit board 30, the flexible circuit board 30 can provide the data signal to the data line 72 on the array substrate 10, the power voltage signal to the power line 73 and the gate driving signal and the clock signal to the gate driving circuit 75 through the first electrical connection terminal 131. Of course, the above only exemplarily describes that a part of the signals can be provided through the first electrical connection terminal 131, in some other embodiments of the present application, the first electrical connection terminal 131 may also be used as a terminal in an electrostatic discharge circuit, for example, and in other embodiments, some other signals may also be provided, which is not specifically limited in this application. It should be noted that fig. 1 only schematically shows the relative positional relationship among the data line 72, the power line 73, the gate line 71, the gate driving circuit 75, and the sub-pixel unit 74, and does not represent actual size and number.
Optionally, with continued reference to fig. 3, the display module 100 provided in the embodiment of the present application further includes a first anisotropic conductive adhesive 51; when the flexible circuit board 30 is bound on the binding region 13 corresponding to the surface of the array substrate 10 facing away from the first substrate 20, the connecting lead 40 includes a first lead portion 41, a second lead portion 42 and a third lead portion 43 which are connected in sequence, the first lead portion 41 is located on the surface of the array substrate 10 facing toward the first substrate 20 and is electrically connected with the first electrical connection terminal 131, the second lead portion 42 is located on the side surface of the array substrate 10, and the third lead portion 43 is located on the binding region 13 corresponding to the surface of the array substrate 10 facing away from the first substrate 20;
the flexible circuit board 30 is bound with the third lead part 43 by the first anisotropic conductive paste 51.
Specifically, with reference to fig. 3, since the flexible circuit board 30 is bonded to the surface of the array substrate 10 away from the first substrate 20, the first electrical connection terminal 131 needs to be led to the surface of the array substrate 10 away from the first substrate 20 through the connection lead 40 to electrically connect with the second electrical connection terminal 132 of the flexible circuit board 30, so that the connection lead 40 is in a wire winding state as shown in fig. 3 and is divided into three parts, namely, a first lead portion 41 located on the surface of the array substrate 10 facing the first substrate 20, a second lead portion 42 located on the side of the array substrate 10, and a third lead portion 43 located on the surface of the array substrate 10 away from the first substrate 20. In this embodiment, a first anisotropic conductive adhesive 51 is introduced, and the flexible circuit board 30 is bound to the third lead portion 43 through the first anisotropic conductive adhesive 51, so that the second electrical connection terminal 132 of the flexible circuit board 30 is electrically connected to the third lead portion 43, and thus the electrical connection between the second electrical connection terminal 132 (not shown in fig. 3) on the flexible circuit board 30 and the first electrical connection terminal 131, that is, the electrical connection between the flexible circuit board 30 and the array substrate 10 is realized. It should be noted that the anisotropic conductive adhesive is a special conductive adhesive that is conductive in one direction only and has a large or almost non-conductive resistance in the other direction, and the anisotropic conductive adhesive can be used to both electrically connect the second electrical connection terminal 132 and the third lead portion 43 on the flexible circuit board 30 and reliably bind the flexible circuit board 30.
Optionally, referring to fig. 3, the display module 100 further includes a first sealant 61, where the first sealant 61 covers at least the surfaces of the first lead portion 41 and the second lead portion 42 and extends to the side surface of the first anisotropic conductive adhesive 51 and the side surface of the first substrate 20.
Specifically, with continuing reference to fig. 3, in the connection lead 40 for leading out the first electrical connection terminal 131 on the array substrate 10, in order to ensure the connection reliability between the first lead portion 41 and the first electrical connection terminal 131 and ensure that the second lead portion 42 and the third lead portion 43 can accurately transmit the signal corresponding to the first electrical connection terminal 131, the first sealant 61 is used to seal the first lead portion 41 and the second lead portion 42 to prevent external impurities from entering the first lead portion 41 or the second lead portion 42, so as to avoid affecting the electrical connection reliability of the first lead portion 41 or the second lead portion 42, and in order to improve the sealing reliability, the embodiment of the present application further extends the first sealant 61 to the side of the first substrate 20 and the side of the first anisotropic conductive adhesive 51, thereby further improving the connection reliability of the connection lead 40 with the first and second electrical connection terminals 131 and 132.
In the following, an example of binding the flexible circuit board 30 to the binding region 13 corresponding to the surface of the first substrate 20 away from the array substrate 10 is described, fig. 4 is another AA' cross-sectional view of the display module in the embodiment shown in fig. 2, and the same parts as those in the embodiment shown in fig. 3 will not be described again.
Optionally, referring to fig. 4, the display module 100 provided in the embodiment of the present application further includes a second anisotropic conductive adhesive 52, a third anisotropic conductive adhesive 53, and a third electrical connection terminal 133 located on a surface of the first substrate 20 facing the array substrate 10, wherein the first electrical connection terminal 131 is electrically connected to the third electrical connection terminal 133 through the second anisotropic conductive adhesive 52;
when the flexible circuit board 30 is bound on the binding region 13 corresponding to the surface of the first substrate 20 facing away from the array substrate 10, the connecting lead 40 includes a fourth lead portion 44, a fifth lead portion 45 and a sixth lead portion 46 which are connected in sequence, the fourth lead portion 44 is located on the side of the first substrate 20 facing the array substrate 10 and is electrically connected with the third electrical connection terminal 133, the fifth lead portion 45 is located on the side surface of the first substrate 20, and the sixth lead portion 46 is located on the binding region corresponding to the surface of the first substrate 20 facing away from the array substrate 10;
the flexible circuit board 30 is bound to the sixth lead portion 46 by the third anisotropic conductive paste 53.
Specifically, the embodiment shown in fig. 4 is illustrated in a manner that the flexible circuit board 30 is bound to a side of the first substrate 20 facing away from the array substrate 10. In this embodiment, the third electrical connection terminal 133 is disposed on the first substrate 20 facing the first side of the array substrate 10, and the third electrical connection terminal 133 is electrically connected to the first electrical connection terminal 131 on the array substrate 10 by the second anisotropic conductive adhesive 52, which corresponds to the electrical connection relationship of the first electrical connection terminal 131 being shifted to the side of the first substrate 20 facing the array substrate 10. The connecting lead 40 is electrically connected to the third electrical connection terminal 133 on the side of the first substrate 20 facing the array substrate 10, and then sequentially extends along the surface (corresponding to the fourth lead portion 44) of the side of the first substrate 20 facing the array substrate 10 and the side surface (corresponding to the fifth lead portion 45) of the first substrate 20 to the surface (corresponding to the sixth lead portion 46) of the side of the first substrate 20 facing away from the array substrate 10, so that the electrical connection relationship of the first electrical connection terminal 131 is transferred to the surface of the first substrate 20 facing away from the array substrate 10 through the connecting lead 40, and the flexible circuit board 30 and the sixth lead portion 46 are bound through the third anisotropic conductive adhesive 53, so that the electrical connection between the flexible circuit board 30 and the first electrical connection terminal 131 is realized. In this embodiment, the first substrate 20 needs to be properly extended by a certain length with respect to the array substrate 10 to provide a binding position for the flexible circuit board 30 and a space for the third electrical connection terminal 133. This embodiment binds flexible circuit board 30 when first base plate 20 deviates from one side of array substrate 10, need not to consider the distance between the terminal surface of flexible circuit board 30 and the terminal surface of first base plate 20, only need will bind the position setting in the non-display area can, consequently with first base plate 20 for array substrate 10 suitable extension can, this kind of mode is favorable to reducing display module assembly 100 towards the frame width of binding district 13 one side equally, is favorable to realizing the narrow frame design of display module assembly 100.
Optionally, with continued reference to fig. 4, the display module 100 provided in the embodiment of the present application further includes a second sealant 62, where the second sealant 62 covers at least the surfaces of the fourth lead portion 44 and the fifth lead portion 45 and extends to the side surface of the third anisotropic conductive adhesive 53 and the side surfaces of the second anisotropic conductive adhesive 52 and the array substrate 10.
Specifically, referring to fig. 4, the fourth lead portion 44 and the fifth lead portion 45 of the connecting lead 40 are respectively located on the surface and the side of the first substrate 20 facing the array substrate 10, in order to ensure the connection reliability of the fourth lead portion 44 to the first electrical connecting terminal 131, and to ensure that the fifth lead portion 45 and the sixth lead portion 46 can accurately transmit signals corresponding to the first electrical connection terminal 131, the fourth lead portion 44 and the fifth lead portion 45 are sealed by the second sealant 62, so as to prevent external impurities from entering the fourth lead portion 44 or the fifth lead portion 45, and avoid affecting the reliable electrical connection performance of the fourth lead portion 44 or the fifth lead portion 45, in order to improve the sealing reliability, the embodiment of the present application further extends the second sealant 62 to the side of the third anisotropic conductive adhesive 53 and the side of the second anisotropic conductive adhesive 52, thereby further improving the connection reliability of the connection lead 40 and the first electrical connection terminal 131.
Alternatively, in the embodiment shown in FIGS. 3 and 4, the width of the bonding area 13 is D1, and D1 is 0.5mm ≦ D1 ≦ 0.8 mm; referring to fig. 3, the width of the bonding region 13 is the width of the overlapping region of the surface of the flexible circuit board 30 facing away from the array substrate 10, or referring to fig. 4, the width of the bonding region 13 is the width of the overlapping region of the surface of the flexible circuit board 30 facing away from the array substrate 10, and the surface of the first substrate 20.
In the embodiment of the application, the width of the binding region 13 is designed to be greater than or equal to 0.5mm, so that the binding reliability of the flexible circuit board 30 can be improved, and the flexible circuit board 30 is effectively prevented from falling off from the first substrate 20 or the array substrate 10; in addition, the width of the binding region 13 is designed to be less than or equal to 0.8mm, so that the excessive space of the non-display region 12 is not occupied, and the narrow frame design of the display module 100 is facilitated.
Optionally, the display module 100 in the embodiment shown in fig. 3 and 4 is a liquid crystal display module 100, and the first substrate 20 is a color film substrate 21;
further comprising: the liquid crystal 90 is located between the array substrate 10 and the color filter substrate 21, and the backlight module 91 is located on a side of the array substrate 10 away from the color filter substrate 21.
Specifically, fig. 3 and 4 illustrate the liquid crystal display module 100 as an example, since the liquid crystal display panel itself cannot emit light, the backlight module 91 needs to be introduced to provide a light source for the display of the display panel. As can be seen from the structures shown in fig. 3 and fig. 4, the display module 100 further includes a lower polarizer 92 located between the array substrate 10 and the backlight module 91, an upper polarizer 93 is further disposed on a side of the color filter substrate 21 away from the array substrate 10, and the cover plate 94 is adhered to a first side of the upper polarizer 93 away from the array substrate 10 through an optical adhesive 95.
The display module in this application embodiment is applicable to the organic light emitting display module except being applicable to the liquid crystal display module. Alternatively, fig. 5 is another AA 'cross-sectional view of the display module provided in fig. 2, and fig. 6 is another AA' cross-sectional view of the display module provided in fig. 2, where the display module 100 in these two embodiments is an organic light emitting display module 100, and the corresponding first substrate 20 is an encapsulation glass 22;
the display module assembly 100 provided by the embodiment of the present application further includes: and an organic electroluminescent structure 80 between the array substrate 10 and the encapsulation glass 22.
Specifically, since the organic electroluminescent structure 80 belongs to the self-luminous structure 80, the organic light emitting display module 100 in the embodiment shown in fig. 5 and 6 does not need a backlight module, and in the embodiment shown in fig. 5 and 6, the organic electroluminescent structure 80 is encapsulated by the encapsulation glass 22, and the flexible circuit board 30 is bonded to the side of the array substrate 10 facing away from the encapsulation glass 22 or the encapsulation glass 22. An upper polarizer 93 is further disposed on the first side of the package glass 22 away from the array substrate 10, and the cover plate 94 is attached to one side of the upper polarizer 93 away from the array substrate 10 through an optical adhesive 95.
It should be noted that fig. 3 and fig. 4 only show a schematic structural diagram when the display module is a liquid crystal display module, fig. 5 and fig. 6 only show a schematic structural diagram when the display module is an organic light emitting display module, in some other embodiments of the present application, the display module 100 may further include some other film structures, which is not specifically limited in this application. In addition, fig. 3-6 only schematically show the relative position relationship of the films in the display module, and do not represent the actual structure of the films.
Based on the same inventive concept, the present application further provides a manufacturing method of a display module, and fig. 7 is a flowchart of the manufacturing method of the display module provided in the embodiment of the present application, where the display module 100 is the display module provided in the embodiment of the present application (for example, the display module provided in fig. 3 to 6), and has a display area 11 and a non-display area 12 surrounding the display area 11, the non-display area 12 includes a binding area 13, and the manufacturing method includes:
102, printing a conductive colloid material on the array substrate 10 or the first substrate 20 by adopting a coating or ink-jet mode to form a connecting lead 40, wherein the conductive colloid material comprises glue containing conductive particles or aqueous conductive gel;
When the display module 100 is manufactured by the method, the flexible circuit board 30 does not need to be bent to the area between the array substrate 10 and the first substrate 20, and a specific spacing distance does not need to be left between the side edge of the first substrate 20 facing the flexible circuit board 30 and the binding area 13, so that in the frame area of the display module 100 facing the binding area 13, in addition to the width required by the first electric connection terminal 131, an extra interval does not need to be arranged on the array substrate 10, the frame width of the array substrate 10 or the first substrate 20 facing one side of the binding area 13 is reduced, the frame width of the display module 100 is favorably reduced, and the narrow frame design of the display module 100 is favorably realized.
Alternatively, referring to fig. 10, fig. 10 is a flowchart illustrating a method for forming a connection lead on an array substrate 10 in a manufacturing method provided in an embodiment of the present application, in the step 102, a conductive colloid material is printed on the array substrate 10 by a coating or inkjet method to form a connection lead 40, and further:
Specifically, the present application realizes the electrical connection between the connection lead 40 (including the first connection lead 401 and the second connection lead 402) and the first electrical connection terminal 131 by printing and coating the conductive adhesive material twice on the array substrate 10, which is simple and easy to operate, and is beneficial to mass production. Meanwhile, the first electrical connection terminal 131 is led out to the side of the array substrate 10 away from the first substrate 20 through the second connection lead 402 to achieve the electrical connection of the flexible circuit board 30 and the second connection lead 402, thereby achieving the electrical connection of the flexible circuit board 30 and the first electrical connection terminal 131.
The above-mentioned embodiment is directed to a method for forming the connection leads 40 in a scheme of binding the flexible circuit board 30 to a side of the array substrate 10 facing away from the first substrate 20 (i.e., a scheme corresponding to fig. 3), and the following description is directed to a method for forming the connection leads 40 in a scheme of binding the flexible circuit board 30 to a side of the first substrate 20 facing away from the array substrate 10 (i.e., a scheme corresponding to fig. 4).
Optionally, in the step 102, a conductive adhesive material is printed on the first substrate 20 by a coating or inkjet method to form the connecting leads 40, and further:
placing the first substrate 20 and the array substrate 10, which are oppositely arranged, on a stage so that the first substrate 20 is placed toward the stage;
printing the conductive colloid material on the side of the first substrate 20 facing the array substrate 10 and the side of the first substrate 20 at the position corresponding to the third electrical connection terminal 133 by coating or ink-jet;
removing the solvent in the conductive colloid material by heating and evaporating to form first connecting leads 401 at the positions of the first substrate 20 facing the array substrate 10 and corresponding to the third electrical connecting terminals 133 and the side surface of the first substrate 20, so that the first connecting leads 401 are respectively electrically connected with the third electrical connecting terminals 133 in a one-to-one correspondence manner;
the first substrate 20 and the array substrate 10 are turned over, so that the array substrate 10 is placed towards the carrying platform;
printing a conductive colloid material on a partial surface of the first substrate 20 on the side away from the array substrate 10 and the side surface of the first substrate 20 by adopting a coating or ink-jet mode;
the solvent in the conductive colloid material is removed by heating and evaporation, so that the conductive particles form second connecting leads 402 electrically connected with the first connecting leads 401 in a one-to-one correspondence manner on the partial surface of the first substrate 20 on the side away from the array substrate 10 and the side surface of the first substrate 20, and further form the connecting leads 40 formed by the first connecting leads 401 and the second connecting leads 402.
It should be noted that, in the above method for forming the connection leads 40 in the scheme of binding the flexible circuit board 30 on the side of the first substrate 20 away from the array substrate 10, similar to the method mentioned in fig. 11-16, the connection leads 40 are formed by printing the conductive adhesive material twice, except that the formation positions of the connection leads 40 are different, the connection leads 40 are formed at the corresponding positions of the array substrate 10 in the embodiment corresponding to fig. 11-16, and the above embodiment is formed at the corresponding positions of the first substrate 20. Therefore, the above process will not be described herein.
Optionally, after the connecting leads 40 are formed at corresponding positions on the first substrate 20, the method for manufacturing the display module 100 provided in the embodiment further includes: the second anisotropic conductive paste 52 is filled between the first substrate 20 and the array substrate 10 at a position corresponding to the bonding area 13, so that the first and second electrical connection terminals 131 and 132 are electrically connected in a one-to-one correspondence.
It should be noted that the modes mentioned in fig. 11 to fig. 16 are described for the liquid crystal display module, and the method for manufacturing the organic light emitting display module can refer to the methods provided in fig. 11 to fig. 16, and the details are not repeated in this application.
Based on the same inventive concept, the present application further provides a display device, fig. 17 is a schematic structural diagram of the display device provided in the embodiment of the present application, referring to fig. 17, a display device 200 in the present application further includes a display module 100, and the display module 100 is the display module 100 in the embodiment of the present application. The flexible display device 200 provided by the present application may be: any product or component with practical functions such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. In the present application, the embodiment of the flexible display device 200 can refer to the embodiment of the flexible display module 100, and repeated details are not repeated here.
According to the embodiment, the display module, the preparation method thereof and the display device provided by the invention at least realize the following beneficial effects:
in the display module, the preparation method thereof and the display device provided by the application, the array substrate comprises a plurality of first electric connecting terminals, and the first electric connecting terminals are connected with signal lines and power lines on the array substrate; the flexible circuit board is bound in the binding area, the first substrate is arranged opposite to the array substrate, and the second electric connecting terminal on the flexible circuit board is electrically connected with the first electric connecting terminal, so that relevant signals and power required by the operation of the array substrate can be provided for the array substrate through the flexible circuit board. In particular, the flexible circuit board in the present application is bonded to the surface of the array substrate facing away from the first substrate or bonded to the surface of the first substrate facing away from the array substrate, the first and second electrical connection terminals are electrically connected by the connection leads, so that it is not necessary to bend the flexible circuit board to an area between the array substrate and the first substrate, nor to leave a certain distance between the side edge of the first substrate facing the flexible circuit board and the bonding area, therefore, in the frame area of the display module facing the bonding area, no extra space is required to be arranged on the array substrate or the first substrate except the width of the bonding area, thereby reduced array substrate or first base plate and bound the frame width of district one side, be favorable to reducing display module assembly and display device's frame width to be favorable to realizing display module assembly and display device's narrow frame design.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (10)
1. The utility model provides a display module assembly which characterized in that has the display area and encircles the non-display area in display area, the non-display area is including binding the district, display module assembly includes:
an array substrate including a plurality of first electrical connection terminals located at the non-display area;
the first substrate is arranged opposite to the array substrate and is positioned on one side of the array substrate, which faces the light-emitting surface of the display module; one side of the first substrate facing the array substrate is provided with a third electric connecting terminal;
the flexible circuit board is bound on the binding area, the binding area is positioned on the surface, away from the array substrate, of the first substrate, the flexible circuit board comprises a plurality of second electric connecting terminals, the second electric connecting terminals are electrically connected with the first electric connecting terminals in a one-to-one corresponding mode, and the first electric connecting terminals are electrically connected with the third electric connecting terminals; the first electrical connection terminal is located on a surface of the array substrate on a side facing the first substrate, and,
and a connection lead electrically connected with the second electrical connection terminal and the third electrical connection terminal, respectively.
2. The display module according to claim 1, further comprising a second anisotropic conductive adhesive and a third anisotropic conductive adhesive, wherein the first electrical connection terminal is electrically connected to the third electrical connection terminal through the second anisotropic conductive adhesive;
the flexible circuit board is bound in the binding area corresponding to the surface of the first substrate departing from the array substrate, the connecting lead comprises a fourth lead portion, a fifth lead portion and a sixth lead portion which are sequentially connected, the fourth lead portion is located on one side of the first substrate facing the array substrate and is electrically connected with the third electric connecting terminal, the fifth lead portion is located on the side face of the first substrate, and the sixth lead portion is located in the binding area corresponding to the surface of the first substrate departing from the array substrate;
the flexible circuit board is bound with the sixth lead part through the third anisotropic conductive adhesive.
3. The display module according to claim 2, further comprising a second sealant, wherein the second sealant covers at least the surfaces of the fourth lead portion and the fifth lead portion and extends to the side surface of the third anisotropic conductive adhesive and the side surface of the second anisotropic conductive adhesive and the array substrate.
4. The display module of claim 1, wherein the width of the bonding area is D1, D1 is 0.5mm or more and 0.8mm or less;
the width of an overlapping area of the flexible circuit board and the surface of the first substrate, which faces away from the array substrate.
5. The display module according to claim 1, wherein the display module is a liquid crystal display module, and the first substrate is a color film substrate;
further comprising: the liquid crystal display panel comprises a liquid crystal positioned between the array substrate and the color film substrate and a backlight module positioned on one side of the array substrate, which is far away from the color film substrate.
6. The display module according to claim 1, wherein the display module is an organic light emitting display module, and the first substrate is an encapsulation glass;
further comprising: and the organic electroluminescent structure is positioned between the array substrate and the packaging glass.
7. A method for manufacturing a display module according to any one of claims 1 to 6, wherein the display module has a display area and a non-display area surrounding the display area, the non-display area includes a binding area, and the method includes:
preparing an array substrate and a first substrate which are oppositely arranged, wherein the array substrate comprises a plurality of first electric connecting terminals positioned in the non-display area, and the first substrate comprises a plurality of third electric connecting terminals positioned in the non-display area;
printing a conductive colloid material on the array substrate or the first substrate in a coating or ink-jet mode to form a connecting lead, wherein the conductive colloid material comprises glue containing conductive particles or aqueous conductive gel;
preparing a flexible circuit board comprising a plurality of second electrical connection terminals;
binding a flexible circuit board on the connecting lead of the surface of the first substrate, which is far away from the array substrate, so that the second electric connection terminal on the flexible circuit board is electrically connected with the first electric connection terminal on the array substrate through the connecting lead; the first electrical connection terminal is electrically connected with the third electrical connection terminal; the first electric connection terminal is located on the surface of one side, facing the first substrate, of the array substrate.
8. The method for manufacturing a display module according to claim 7, wherein the conductive adhesive material is printed on the first substrate by coating or inkjet to form the connecting leads, further comprising:
placing a first substrate and an array substrate which are oppositely arranged on a carrying platform, so that the first substrate is placed towards the carrying platform;
printing a conductive colloid material on the position of one side of the first substrate, which faces the array substrate and corresponds to the third electric connection terminal, and the side face of the first substrate in a coating or ink-jet mode;
removing the solvent in the conductive colloid material by heating and evaporating to form first connecting leads at the position of one side of the first substrate, which faces the array substrate, corresponding to the third electric connection terminals and on the side face of the first substrate, so that the first connecting leads are respectively and correspondingly electrically connected with the third electric connection terminals one by one;
overturning the first substrate and the array substrate so that the array substrate is placed towards the carrying platform;
printing a conductive colloid material on the partial surface of one side of the first substrate, which is far away from the array substrate, and the side surface of the first substrate in a coating or ink-jet mode;
and removing the solvent in the conductive colloid material by adopting a heating evaporation mode, so that second connecting leads electrically connected with the first connecting leads in a one-to-one correspondence manner are formed on the partial surface of the first substrate on the side away from the array substrate and the side surface of the first substrate by the conductive particles, and further a connecting lead consisting of the first connecting lead and the second connecting lead is formed.
9. The method for manufacturing a display module according to claim 8, further comprising: and filling second anisotropic conductive adhesive between the first substrate and the array substrate and at a position corresponding to the binding region, so that the first electric connecting terminals and the second electric connecting terminals are electrically connected in a one-to-one correspondence manner.
10. A display device, comprising a display module according to any one of claims 1 to 6.
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| CN201810795221.0A CN108957878B (en) | 2018-07-19 | 2018-07-19 | Display module, preparation method thereof and display device |
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Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109671352A (en) * | 2018-12-15 | 2019-04-23 | 惠州Tcl移动通信有限公司 | Display component and preparation method thereof |
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| CN113568224B (en) * | 2020-08-14 | 2022-10-21 | 友达光电股份有限公司 | Display device |
| US11533811B2 (en) | 2020-08-14 | 2022-12-20 | Au Optronics Corporation | Electronic device |
| CN112014987A (en) * | 2020-09-03 | 2020-12-01 | Tcl华星光电技术有限公司 | Array substrate, preparation method thereof, display panel and spliced display |
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| CN112599574B (en) * | 2020-12-10 | 2022-07-12 | 武汉华星光电半导体显示技术有限公司 | Display module and display device |
| CN115280906A (en) * | 2021-01-25 | 2022-11-01 | 京东方科技集团股份有限公司 | Bearing substrate, binding assembly and binding method thereof |
| CN112764588A (en) * | 2021-02-07 | 2021-05-07 | 业成科技（成都）有限公司 | Display module, manufacturing method thereof, touch display module, display and electronic equipment |
| CN113299852B (en) * | 2021-05-11 | 2022-12-06 | 深圳市华星光电半导体显示技术有限公司 | Display panel |
| CN113721397A (en) * | 2021-08-20 | 2021-11-30 | Tcl华星光电技术有限公司 | Binding structure, display device, detection method and detection device |
| CN113900310A (en) * | 2021-09-30 | 2022-01-07 | 上海天马微电子有限公司 | Liquid crystal device and method for manufacturing the same |
| CN114371793A (en) * | 2021-12-23 | 2022-04-19 | 昆山龙腾光电股份有限公司 | Narrow-frame display module and liquid crystal display device |
| CN114594624A (en) * | 2022-01-27 | 2022-06-07 | 业成科技（成都）有限公司 | Display module, manufacturing method thereof, touch display module, display and electronic equipment |
| CN114898662B (en) * | 2022-05-06 | 2023-09-26 | 武汉天马微电子有限公司 | Module and substrate |
| CN114859595B (en) * | 2022-05-16 | 2023-10-31 | 深圳市华星光电半导体显示技术有限公司 | Display panel, manufacturing method of display panel and display device |
| CN117199215B (en) * | 2023-11-06 | 2024-02-02 | Tcl华星光电技术有限公司 | Display panel and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1288528A (en) * | 1999-01-20 | 2001-03-21 | 时至准钟表股份有限公司 | Structure for mounting semiconductor device on liquid crystal display, and semiconductor device |
| CN106324927A (en) * | 2015-07-03 | 2017-01-11 | 乐金显示有限公司 | Display device |
| CN106896599A (en) * | 2017-03-10 | 2017-06-27 | 惠科股份有限公司 | Display panel and its display device |
| CN107247355A (en) * | 2017-07-31 | 2017-10-13 | 深圳市华星光电技术有限公司 | The preparation method of display panel, electronic equipment and display panel |
| CN107315272A (en) * | 2017-08-03 | 2017-11-03 | 深圳市华星光电技术有限公司 | Frame-free liquid crystal display device and preparation method thereof |
-
2018
- 2018-07-19 CN CN201810795221.0A patent/CN108957878B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1288528A (en) * | 1999-01-20 | 2001-03-21 | 时至准钟表股份有限公司 | Structure for mounting semiconductor device on liquid crystal display, and semiconductor device |
| CN106324927A (en) * | 2015-07-03 | 2017-01-11 | 乐金显示有限公司 | Display device |
| CN106896599A (en) * | 2017-03-10 | 2017-06-27 | 惠科股份有限公司 | Display panel and its display device |
| CN107247355A (en) * | 2017-07-31 | 2017-10-13 | 深圳市华星光电技术有限公司 | The preparation method of display panel, electronic equipment and display panel |
| CN107315272A (en) * | 2017-08-03 | 2017-11-03 | 深圳市华星光电技术有限公司 | Frame-free liquid crystal display device and preparation method thereof |
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|---|---|
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