TWI736055B - 半導體製造裝置及半導體裝置的製造方法 - Google Patents

半導體製造裝置及半導體裝置的製造方法 Download PDF

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Publication number: TWI736055B
Authority: TW; Taiwan
Prior art keywords: die; imaging device; crystal grains; aforementioned; crystal grain
Prior art date: 2019-03-22

Application number

TW108145034A

Other languages

English (en)

Chinese (zh)

Other versions

TW202101604A (zh

Inventor

小橋英晴

保坂浩二

Original Assignee

日商捷進科技有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2019-03-22

Filing date

2019-12-10

Publication date

2021-08-11

2019-12-10 Application filed by 日商捷進科技有限公司 filed Critical 日商捷進科技有限公司

2021-01-01 Publication of TW202101604A publication Critical patent/TW202101604A/zh

2021-08-11 Application granted granted Critical

2021-08-11 Publication of TWI736055B publication Critical patent/TWI736055B/zh

Links

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238000003384 imaging method Methods 0.000 claims abstract description 96
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Images

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

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Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Die Bonding (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

TW108145034A 2019-03-22 2019-12-10 半導體製造裝置及半導體裝置的製造方法 TWI736055B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2019055460A JP7299728B2 (ja)	2019-03-22	2019-03-22	半導体製造装置および半導体装置の製造方法
JP2019-055460		2019-03-22

Publications (2)

Publication Number	Publication Date
TW202101604A TW202101604A (zh)	2021-01-01
TWI736055B true TWI736055B (zh)	2021-08-11

Family

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Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW108145034A TWI736055B (zh)	2019-03-22	2019-12-10	半導體製造裝置及半導體裝置的製造方法

Country Status (4)

Country	Link
JP (1)	JP7299728B2 (ko)
KR (1)	KR102304880B1 (ko)
CN (1)	CN111725086B (ko)
TW (1)	TWI736055B (ko)

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Publication number	Priority date	Publication date	Assignee	Title
JP2022182232A (ja) *	2021-05-28	2022-12-08	ファスフォードテクノロジ株式会社	ダイボンディング装置および半導体装置の製造方法

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JP5144401B2 (ja) *	2008-07-01	2013-02-13	直江津電子工業株式会社	ウエハ用検査装置
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JP2011169816A (ja) *	2010-02-19	2011-09-01	Nec Corp	半導体装置の接合傾き測定装置
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JP6685126B2 (ja) *	2015-12-24	2020-04-22	ファスフォードテクノロジ株式会社	半導体製造装置および半導体装置の製造方法
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JP6975551B2 (ja) *	2017-05-18	2021-12-01	ファスフォードテクノロジ株式会社	半導体製造装置および半導体装置の製造方法
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2019
- 2019-03-22 JP JP2019055460A patent/JP7299728B2/ja active Active
- 2019-12-10 TW TW108145034A patent/TWI736055B/zh active
2020
- 2020-01-08 KR KR1020200002392A patent/KR102304880B1/ko active IP Right Grant
- 2020-02-21 CN CN202010110478.5A patent/CN111725086B/zh active Active

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Also Published As

Publication number	Publication date
CN111725086B (zh)	2024-03-12
TW202101604A (zh)	2021-01-01
CN111725086A (zh)	2020-09-29
KR102304880B1 (ko)	2021-09-27
KR20200112639A (ko)	2020-10-05
JP7299728B2 (ja)	2023-06-28
JP2020155737A (ja)	2020-09-24

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