TWI732764B - 暫時接著劑、接著膜、接著性支持體、積層體及接著劑套組 - Google Patents

暫時接著劑、接著膜、接著性支持體、積層體及接著劑套組 Download PDF

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Publication number
TWI732764B
TWI732764B TW105116944A TW105116944A TWI732764B TW I732764 B TWI732764 B TW I732764B TW 105116944 A TW105116944 A TW 105116944A TW 105116944 A TW105116944 A TW 105116944A TW I732764 B TWI732764 B TW I732764B
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TW
Taiwan
Prior art keywords
adhesive
mass
adhesive layer
support
elastomer
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Application number
TW105116944A
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English (en)
Chinese (zh)
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TW201643230A (zh
Inventor
岩井悠
加持義貴
Original Assignee
日商富士軟片股份有限公司
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Publication of TW201643230A publication Critical patent/TW201643230A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C09J125/08—Copolymers of styrene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
TW105116944A 2015-06-01 2016-05-31 暫時接著劑、接著膜、接著性支持體、積層體及接著劑套組 TWI732764B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015111125 2015-06-01
JP2015-111125 2015-06-01

Publications (2)

Publication Number Publication Date
TW201643230A TW201643230A (zh) 2016-12-16
TWI732764B true TWI732764B (zh) 2021-07-11

Family

ID=57440671

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105116944A TWI732764B (zh) 2015-06-01 2016-05-31 暫時接著劑、接著膜、接著性支持體、積層體及接著劑套組

Country Status (4)

Country Link
JP (1) JP6588094B2 (ko)
KR (1) KR102045770B1 (ko)
TW (1) TWI732764B (ko)
WO (1) WO2016194917A1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017092138A (ja) * 2015-11-05 2017-05-25 Jsr株式会社 基材の処理方法、積層体、半導体装置およびその製造方法、ならびに仮固定用組成物
JP2018145365A (ja) * 2017-03-09 2018-09-20 東レフィルム加工株式会社 表面保護フィルム
JPWO2019124417A1 (ja) * 2017-12-20 2021-01-14 ダウ・東レ株式会社 シリコーン系接着シート、それを含む積層体、半導体装置の製造方法
KR102146997B1 (ko) * 2017-12-29 2020-08-21 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자
JPWO2020017269A1 (ja) * 2018-07-20 2021-08-02 東洋紡株式会社 ポリオレフィン系接着剤組成物
JP7074879B2 (ja) * 2018-10-18 2022-05-24 富士フイルム株式会社 仮接着用組成物、キットおよび積層体
CN111724676B (zh) * 2019-03-21 2022-09-02 昆山工研院新型平板显示技术中心有限公司 可拉伸导线及其制作方法和显示装置
JP7470411B2 (ja) 2020-09-30 2024-04-18 フジコピアン株式会社 ウェーハ加工用積層体、それを用いた薄型ウェーハの製造方法及び薄型ウェーハ個片化の製造方法
JP2023174600A (ja) * 2022-05-27 2023-12-07 花王株式会社 接着剤用洗浄剤組成物
JP2023184483A (ja) * 2022-06-17 2023-12-28 花王株式会社 半導体基板の製造方法
WO2023243661A1 (ja) * 2022-06-17 2023-12-21 花王株式会社 接着剤用洗浄剤組成物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1622279A (zh) * 2003-03-25 2005-06-01 株式会社巴川制纸所 半导体器件制造用粘接片及用此粘接片的半导体器件和制法
JP2014037458A (ja) * 2012-08-13 2014-02-27 Tokyo Ohka Kogyo Co Ltd 接着剤組成物、接着フィルムおよび貼付方法
TW201544562A (zh) * 2014-04-22 2015-12-01 Tokyo Ohka Kogyo Co Ltd 接著劑組成物、層合體及剝離方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04320473A (ja) * 1991-04-20 1992-11-11 Daiabondo Kogyo Kk 非粘着型ホットメルト接着剤もしくはホットメルトシーリング材
JPH07188631A (ja) * 1993-12-28 1995-07-25 Toyo Ink Mfg Co Ltd 再剥離型粘着剤組成物
JP2001323227A (ja) * 2000-05-16 2001-11-22 Dainippon Ink & Chem Inc 耐衝撃性に優れる遮光性粘着テープ
JP5348341B1 (ja) 2012-04-27 2013-11-20 Ｊｓｒ株式会社 基材の処理方法、仮固定用組成物および半導体装置
JP6216575B2 (ja) * 2012-10-25 2017-10-18 東京応化工業株式会社 接着剤組成物及び接着フィルム
JP6323690B2 (ja) * 2013-04-11 2018-05-16 東洋紡株式会社 自己粘着性表面保護フィルム
JP6182491B2 (ja) 2013-08-30 2017-08-16 富士フイルム株式会社 積層体およびその応用

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1622279A (zh) * 2003-03-25 2005-06-01 株式会社巴川制纸所 半导体器件制造用粘接片及用此粘接片的半导体器件和制法
JP2014037458A (ja) * 2012-08-13 2014-02-27 Tokyo Ohka Kogyo Co Ltd 接着剤組成物、接着フィルムおよび貼付方法
TW201544562A (zh) * 2014-04-22 2015-12-01 Tokyo Ohka Kogyo Co Ltd 接著劑組成物、層合體及剝離方法

Also Published As

Publication number Publication date
JPWO2016194917A1 (ja) 2018-04-26
JP6588094B2 (ja) 2019-10-09
KR20170139609A (ko) 2017-12-19
KR102045770B1 (ko) 2019-11-18
TW201643230A (zh) 2016-12-16
WO2016194917A1 (ja) 2016-12-08

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