TWI730715B - Resin molding device and method for manufacturing resin molded product - Google Patents

Resin molding device and method for manufacturing resin molded product Download PDF

Info

Publication number
TWI730715B
TWI730715B TW109112110A TW109112110A TWI730715B TW I730715 B TWI730715 B TW I730715B TW 109112110 A TW109112110 A TW 109112110A TW 109112110 A TW109112110 A TW 109112110A TW I730715 B TWI730715 B TW I730715B
Authority
TW
Taiwan
Prior art keywords
release film
mold
lower mold
liquid resin
resin
Prior art date
Application number
TW109112110A
Other languages
Chinese (zh)
Other versions
TW202102350A (en
Inventor
中尾聰
笠井俊典
寺岡拓人
木村光
Original Assignee
日商Ｔｏｗａ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｔｏｗａ股份有限公司 filed Critical 日商Ｔｏｗａ股份有限公司
Publication of TW202102350A publication Critical patent/TW202102350A/en
Application granted granted Critical
Publication of TWI730715B publication Critical patent/TWI730715B/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14008—Inserting articles into the mould
    • B29C45/14016—Intermittently feeding endless articles, e.g. transfer films, to the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/004—Arrangements for converting the motion of a material which is continuously fed to a working station in a stepwise motion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B29C31/08—Feeding of the material to be moulded, e.g. into a mould cavity of preforms to be moulded, e.g. tablets, fibre reinforced preforms, extruded ribbons, tubes or profiles; Manipulating means specially adapted for feeding preforms, e.g. supports conveyors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
    • B29C33/18—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/20—Opening, closing or clamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
    • B29C37/0075—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other using release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C2037/90—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3405—Feeding the material to the mould or the compression means using carrying means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
    • B29C2043/3605—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B29C2043/561—Compression moulding under special conditions, e.g. vacuum under vacuum conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00—Use of unspecified macromolecular compounds as moulding material
    • B29K2101/10—Thermosetting resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2007/00—Flat articles, e.g. films or sheets
    • B29L2007/002—Panels; Plates; Sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

本發明所欲解決的問題在於提供一種樹脂成形裝置、以及樹脂成形品的製造方法，其可對具有熱硬化性的液狀樹脂比適當的時機更早硬化的情形加以抑制。 本發明的解決手段為一種樹脂成形裝置，其具備：成形模具、合模機構、薄膜供給機構、液狀樹脂供給機構及控制部。成形模具包含上模與下模，該下模與該上模相對向。合模機構，將成形模具合模。薄膜供給機構，將脫模薄膜供給到上模與下模之間。液狀樹脂供給機構，將具有熱硬化性的液狀樹脂供給到脫模薄膜上。控制部控制液狀樹脂供給機構，以在脫模薄膜與下模分離的狀態下，將液狀樹脂供給到脫模薄膜上。The problem to be solved by the present invention is to provide a resin molding apparatus and a method for manufacturing a resin molded product, which can prevent the liquid resin having thermosetting properties from curing earlier than an appropriate timing. The solution of the present invention is a resin molding apparatus including a molding die, a mold clamping mechanism, a film supply mechanism, a liquid resin supply mechanism, and a control unit. The forming mold includes an upper mold and a lower mold, and the lower mold is opposite to the upper mold. The mold clamping mechanism closes the forming mold. The film supply mechanism supplies the release film between the upper mold and the lower mold. The liquid resin supply mechanism supplies the liquid resin having thermosetting properties to the release film. The control unit controls the liquid resin supply mechanism to supply the liquid resin to the release film in a state where the release film is separated from the lower mold.

Description

樹脂成形裝置、以及樹脂成形品的製造方法Resin molding device and method for manufacturing resin molded product

本發明關於樹脂成形裝置、以及樹脂成形品的製造方法。The present invention relates to a resin molding apparatus and a method of manufacturing a resin molded product.

日本特開2017-183443號公報(專利文獻1)中揭示有一種樹脂成形裝置。該樹脂成形裝置具備彼此對向配置的上模和下模。薄膜被送到上模與下模之間。在該樹脂成形裝置中，是藉由在薄膜上被供給有樹脂材料的狀態下將上模與下模合模(夾緊)來進行樹脂成形(參照專利文獻1)。Japanese Patent Application Laid-Open No. 2017-183443 (Patent Document 1) discloses a resin molding apparatus. The resin molding apparatus includes an upper mold and a lower mold arranged to face each other. The film is sent between the upper mold and the lower mold. In this resin molding apparatus, resin molding is performed by clamping (clamping) the upper mold and the lower mold in a state where the resin material is supplied to the film (see Patent Document 1).

[先前技術文獻] (專利文獻) 專利文獻1：日本特開2017-183443號公報。[Prior Technical Literature] (Patent Document) Patent Document 1: Japanese Patent Application Laid-Open No. 2017-183443.

(發明所欲解決的問題) 上述專利文獻1所揭示的樹脂成形裝置中，是在下模被加熱過且薄膜被吸附到下模的狀態下，將樹脂材料供給到薄膜上。在這樣的構成中，例如若使用具有熱硬化性的液狀樹脂來作為樹脂材料，被供給到薄膜上的液狀樹脂有可能會比適當的時機更早硬化。(The problem to be solved by the invention) In the resin molding apparatus disclosed in Patent Document 1, the resin material is supplied to the film in a state where the lower mold is heated and the film is adsorbed to the lower mold. In such a configuration, for example, if a thermosetting liquid resin is used as the resin material, the liquid resin supplied to the film may harden earlier than an appropriate timing.

本發明是為了解決這樣的問題而完成，目的在於提供一種樹脂成形裝置、以及樹脂成形品的製造方法，其可對具有熱硬化性的液狀樹脂比適當的時機更早硬化的情形加以抑制。The present invention was completed in order to solve such a problem, and its object is to provide a resin molding apparatus and a method for manufacturing a resin molded product that can prevent the thermosetting liquid resin from curing earlier than an appropriate timing.

(用於解決問題的手段) 遵照本發明的一個態樣的樹脂成形裝置，具備：成形模具、合模機構、薄膜供給機構、液狀樹脂供給機構及控制部。成形模具包含上模與下模，該下模與該上模相對向。合模機構，將成形模具合模。薄膜供給機構，將脫模薄膜供給到上模與下模之間。液狀樹脂供給機構，將具有熱硬化性的液狀樹脂供給到脫模薄膜上。控制部控制液狀樹脂供給機構，以在脫模薄膜與下模分離的狀態下，將液狀樹脂供給到脫模薄膜上。(Means used to solve the problem) A resin molding apparatus according to one aspect of the present invention includes a molding die, a mold clamping mechanism, a film supply mechanism, a liquid resin supply mechanism, and a control unit. The forming mold includes an upper mold and a lower mold, and the lower mold is opposite to the upper mold. The mold clamping mechanism closes the forming mold. The film supply mechanism supplies the release film between the upper mold and the lower mold. The liquid resin supply mechanism supplies the liquid resin having thermosetting properties to the release film. The control unit controls the liquid resin supply mechanism to supply the liquid resin to the release film in a state where the release film is separated from the lower mold.

遵照本發明的另一個態樣的樹脂成形品的製造方法，包含以下步驟：將脫模薄膜供給到上模與下模之間；在脫模薄膜與下模分離的狀態下，將具有熱硬化性的液狀樹脂供給到脫模薄膜上；將已供給有液狀樹脂之脫模薄膜吸附到下模上；及，將上模與下模合模，該下模處於吸附住脫模薄膜的狀態。A method of manufacturing a resin molded article according to another aspect of the present invention includes the steps of: supplying a release film between an upper mold and a lower mold; and in a state where the release film is separated from the lower mold, it will have a thermosetting Supply the liquid resin to the release film; absorb the release film supplied with the liquid resin to the lower mold; and close the upper mold and the lower mold, and the lower mold is in the position where the mold release film is adsorbed status.

(發明的功效) 根據本發明，能夠提供一種樹脂成形裝置、以及樹脂成形品的製造方法，其可對具有熱硬化性的液狀樹脂比適當的時機更早硬化的情形加以抑制。(Effect of invention) According to the present invention, it is possible to provide a resin molding apparatus and a method for manufacturing a resin molded product, which can suppress the curing of the thermosetting liquid resin earlier than an appropriate timing.

以下，針對本發明的一態樣的實施型態(以下亦稱為「本實施型態」)，使用圖式來詳細加以說明。此外，圖式中對於相同或相當的部分附加相同符號並且不重複進行說明。又，各圖式為了便於理解而以適當省略或誇張對象物的方式來示意性繪示。又，各圖式中，箭頭所示的方向是共通的。Hereinafter, one aspect of the implementation of the present invention (hereinafter also referred to as "this implementation") will be described in detail using drawings. In addition, the same symbols are attached to the same or equivalent parts in the drawings, and the description will not be repeated. In addition, for ease of understanding, each drawing is schematically illustrated in a manner that appropriately omits or exaggerates the object. In addition, the directions indicated by the arrows in each drawing are common.

[1、樹脂成形裝置的構成] (1-1、全體構成) 第1圖是遵照本實施型態的樹脂成形裝置10的正面圖。樹脂成形裝置10，被構成為藉由使用所謂壓模法來製造樹脂成形品。[1. Composition of resin molding equipment] (1-1. Overall composition) Fig. 1 is a front view of a resin molding apparatus 10 according to this embodiment. The resin molding apparatus 10 is configured to manufacture a resin molded product by using a so-called compression molding method.

如第1圖所示，樹脂成形裝置10包含：底座100、拉桿(tie bar)110、上台板120、下台板130、合模機構200、成形模具300、薄膜供給機構500、移動機構600、控制部700及液狀樹脂供給機構900。As shown in Figure 1, the resin molding apparatus 10 includes a base 100, a tie bar 110, an upper platen 120, a lower platen 130, a clamping mechanism 200, a forming mold 300, a film supply mechanism 500, a moving mechanism 600, and a control Section 700 and liquid resin supply mechanism 900.

底座100，是俯視呈矩形形狀的板狀構件。複數根(4根)拉桿110的各者，是在上下方向延伸的桿狀構件。複數根拉桿110，分別被固定在底座100的四個角落。上台板120，是俯視呈矩形形狀的板狀構件，且被固定於複數根拉桿110的上部。上台板120，在樹脂成形裝置10中，與底座100相對向。下台板130，是俯視呈矩形形狀的板狀構件，在底座100與上台板120之間，以可在上下方向移動的狀態被安裝於拉桿110上。下台板130，在樹脂成形裝置10中，與上台板120和底座100的雙方相對向。The base 100 is a plate-shaped member having a rectangular shape in plan view. Each of the plural (4) tie rods 110 is a rod-shaped member extending in the vertical direction. A plurality of tie rods 110 are respectively fixed on the four corners of the base 100. The upper platen 120 is a plate-shaped member having a rectangular shape in plan view, and is fixed to the upper portion of the plurality of tie rods 110. The upper platen 120 faces the base 100 in the resin molding apparatus 10. The lower platen 130 is a plate-shaped member having a rectangular shape in plan view, and is mounted on the tie rod 110 between the base 100 and the upper platen 120 in a state of being movable in the vertical direction. The lower platen 130 is opposed to both the upper platen 120 and the base 100 in the resin molding apparatus 10.

合模機構200，被固定於底座100的上表面。合模機構200，為了成形模具300的合模與開模而被構成為可使下台板130升降。亦即，合模機構200被構成為可將成形模具300合模。合模機構200，例如是藉由伺服馬達和滾珠螺桿的組合、油壓缸和連桿機構的組合等來加以實現。The clamping mechanism 200 is fixed to the upper surface of the base 100. The mold clamping mechanism 200 is configured to allow the lower table 130 to be raised and lowered for mold clamping and mold opening of the forming mold 300. That is, the mold clamping mechanism 200 is configured to be capable of clamping the forming mold 300. The mold clamping mechanism 200 is realized by, for example, a combination of a servo motor and a ball screw, a combination of a hydraulic cylinder and a link mechanism, and the like.

成形模具300，包含：金屬製的上模310、金屬製的下模320及金屬製的中間板323，該下模320與該上模310相對向，該中間板323與上模310和下模320的雙方相對向。上模310被固定在上台板120的下表面，下模320被固定在下台板130的上表面。在上模310與下模320的各者中，設有加熱部(加熱器)350。上模310與下模320的各者，藉由加熱部350來加熱。中間板323，是框狀的構件，在中央部形成有俯視呈矩形形狀的孔，並且與下模320一起夾住脫模薄膜400。關於成形模具300，後面將加以詳細說明。The forming mold 300 includes an upper mold 310 made of metal, a lower mold 320 made of metal, and an intermediate plate 323 made of metal. The lower mold 320 faces the upper mold 310, and the intermediate plate 323 is opposite to the upper mold 310 and the lower mold. The two sides of 320 face each other. The upper mold 310 is fixed on the lower surface of the upper platen 120, and the lower mold 320 is fixed on the upper surface of the lower platen 130. In each of the upper mold 310 and the lower mold 320, a heating unit (heater) 350 is provided. Each of the upper mold 310 and the lower mold 320 is heated by the heating part 350. The intermediate plate 323 is a frame-shaped member, has a rectangular hole in a plan view formed in the center, and clamps the release film 400 together with the lower mold 320. The forming mold 300 will be described in detail later.

薄膜供給機構500，被構成為將長條狀的脫模薄膜400供給到上模310(中間板323)與下模320之間。作為脫模薄膜400的材料，可使用具有耐熱性、脫模性、柔軟性、伸展性等特性的樹脂材料，例如：PTFE(聚四氟乙烯)、ETFE(乙烯-四氟乙烯共聚物)、PET(聚對苯二甲酸乙二酯)、FEP(四氟乙烯-六氟丙烯共聚物)、聚丙烯、聚苯乙烯、聚偏二氯乙烯等。The film supply mechanism 500 is configured to supply the strip-shaped release film 400 between the upper mold 310 (middle plate 323) and the lower mold 320. As the material of the release film 400, resin materials with heat resistance, release properties, flexibility, stretchability, etc. can be used, such as: PTFE (polytetrafluoroethylene), ETFE (ethylene-tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), polypropylene, polystyrene, polyvinylidene chloride, etc.

薄膜供給機構500包含：送出機構510、捲取機構520、送出輥530、捲取輥540。The film supply mechanism 500 includes a delivery mechanism 510, a winding mechanism 520, a delivery roller 530, and a winding roller 540.

送出機構510，被構成為將已捲繞在捲軸上的使用前的脫模薄膜400送到上模310(中間板323)與下模320之間。例如，送出機構510，包含送出輥與使該送出輥旋轉的馬達(未圖示)。捲取機構520，被構成為將用於樹脂成形的已使用完畢的脫模薄膜400捲繞到捲軸上。例如，捲取機構520，包含捲取輥與使該捲取輥旋轉的馬達(未圖示)。藉由控制各馬達的轉矩，使脫模薄膜400被朝行進方向送出。又，當送出脫模薄膜400時，藉由控制各馬達的轉矩，在脫模薄膜400的行進方向上施加適當的張力(tension)。The delivery mechanism 510 is configured to feed the release film 400 before use wound on a reel between the upper mold 310 (middle plate 323) and the lower mold 320. For example, the delivery mechanism 510 includes a delivery roller and a motor (not shown) that rotates the delivery roller. The winding mechanism 520 is configured to wind the used release film 400 for resin molding onto a reel. For example, the winding mechanism 520 includes a winding roller and a motor (not shown) that rotates the winding roller. By controlling the torque of each motor, the release film 400 is sent out in the advancing direction. In addition, when the release film 400 is sent out, by controlling the torque of each motor, an appropriate tension (tension) is applied in the traveling direction of the release film 400.

在送出機構510與成形模具300之間，配置有用來對脫模薄膜400施加張力的送出輥530。亦即，送出輥530，在脫模薄膜400的輸送路徑上，被配置在比下模320更靠近送出機構510側。在成形模具300與捲取機構520之間，配置有用來對脫模薄膜400施加張力的捲取輥540。亦即，捲取輥540，在脫模薄膜400的輸送路徑上，被配置在比下模320更靠近捲取機構520側。送出輥530和捲取輥540的各者，被構成為對脫模薄膜400施加張力並可在上模310與下模320之間輸送脫模薄膜400。Between the delivery mechanism 510 and the forming die 300, a delivery roller 530 for applying tension to the release film 400 is arranged. That is, the delivery roller 530 is arranged on the conveying path of the release film 400 closer to the delivery mechanism 510 than the lower mold 320. Between the forming die 300 and the winding mechanism 520, a winding roller 540 for applying tension to the release film 400 is arranged. That is, the winding roller 540 is arranged on the conveying path of the release film 400 closer to the winding mechanism 520 than the lower mold 320. Each of the delivery roller 530 and the take-up roller 540 is configured to apply tension to the release film 400 and can transport the release film 400 between the upper mold 310 and the lower mold 320.

各移動機構600，將送出輥530或捲取輥540的旋轉軸，以可在上下方向移動的狀態來加以保持。移動機構600，被構成為可使送出輥530和捲取輥540的旋轉軸升降。移動機構600，例如能夠藉由使送出輥530和捲取輥540的旋轉軸上升，而使脫模薄膜400自下模320物理性分離。移動機構600，例如是藉由伺服馬達和滾珠螺桿的組合、氣缸等來加以實現。Each moving mechanism 600 holds the rotating shaft of the delivery roller 530 or the winding roller 540 in a state that can move in the vertical direction. The moving mechanism 600 is configured to move the rotation shafts of the delivery roller 530 and the winding roller 540 up and down. The moving mechanism 600 can physically separate the release film 400 from the lower mold 320 by raising the rotation shafts of the delivery roller 530 and the winding roller 540, for example. The moving mechanism 600 is realized by, for example, a combination of a servo motor and a ball screw, an air cylinder, or the like.

液狀樹脂供給機構900，是所謂的分配器，被構成為將具有熱硬化性的液狀樹脂噴到脫模薄膜400上。液狀樹脂供機構900，能夠一邊在上模310與下模320(中間板323)之間的區域中，於面方向(箭頭XY方向)上移動，一邊噴出液狀樹脂，並且也能夠退避到上模310與下模320之間以外的區域。例如，液狀樹脂供給機構900，在將液狀樹脂供給到脫模薄膜400上之後，退避到上模310與下模320之間以外的區域。The liquid resin supply mechanism 900 is a so-called dispenser, and is configured to spray a thermosetting liquid resin onto the release film 400. The liquid resin supply mechanism 900 is capable of ejecting liquid resin while moving in the surface direction (arrow XY direction) in the area between the upper mold 310 and the lower mold 320 (intermediate plate 323), and can also be retracted to The area other than the area between the upper mold 310 and the lower mold 320. For example, the liquid resin supply mechanism 900 retreats to a region other than the area between the upper mold 310 and the lower mold 320 after supplying the liquid resin onto the release film 400.

控制部700，被構成為對樹脂成形裝置10全體加以控制。控制部700，例如控制合模機構200、薄膜供給機構500、移動機構600、液狀樹脂供給機構900等。控制部700，包含硬體處理器也就是CPU(中央處理單元)、RAM(隨機存取記憶體)及ROM(唯讀記憶體)等，並且被構成為基於程式和各種資料來執行資訊處理。此外，控制部700，可被配置在樹脂成形裝置10內的任意場所，亦可由複數電腦來構成。The control unit 700 is configured to control the entire resin molding apparatus 10. The control unit 700 controls, for example, the mold clamping mechanism 200, the film supply mechanism 500, the moving mechanism 600, the liquid resin supply mechanism 900, and the like. The control unit 700 includes a hardware processor, namely CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), etc., and is configured to perform information processing based on programs and various data. In addition, the control unit 700 may be arranged at any place in the resin molding apparatus 10, or may be constituted by a plurality of computers.

(1-2、成形模具和吸附機構的構成) 第2圖是下模320的一部分的平面圖。第3圖是包含上模310、下模320及中間板323的剖面的圖。第3圖中，下模320的一部分剖面對應於第2圖的沿III-III線的剖面。(1-2, the composition of the forming mold and the adsorption mechanism) FIG. 2 is a plan view of a part of the lower mold 320. FIG. 3 is a view including a cross section of the upper mold 310, the lower mold 320, and the intermediate plate 323. In FIG. 3, a part of the cross section of the lower mold 320 corresponds to the cross section along the line III-III in FIG.

如第2圖和第3圖所示，在下模320中形成有模腔326，且下模320包含：底面構件321，其構成模腔326的底面；及，側面構件322，其構成模腔326的側面。底面構件321，是俯視呈矩形形狀的板狀構件。側面構件322，是包覆底面構件321的周圍的框狀構件。在下模320中，側面構件322隔著安裝構件328而被固定，該安裝構件328包含彈簧等的彈性構件。側面構件322，位於比底面構件321略為上方的位置，以構成模腔326。在底面構件321與側面構件322之間形成有少許間隙，以使得底面構件321與側面構件322可以相對滑動。As shown in FIGS. 2 and 3, a cavity 326 is formed in the lower mold 320, and the lower mold 320 includes: a bottom surface member 321 that constitutes the bottom surface of the cavity 326; and a side member 322 that constitutes the cavity 326 Of the side. The bottom surface member 321 is a plate-shaped member having a rectangular shape in plan view. The side member 322 is a frame-shaped member covering the periphery of the bottom member 321. In the lower mold 320, the side member 322 is fixed via a mounting member 328, which includes an elastic member such as a spring. The side member 322 is located slightly above the bottom member 321 to form a cavity 326. A slight gap is formed between the bottom surface member 321 and the side surface member 322 so that the bottom surface member 321 and the side surface member 322 can slide relatively.

下模320，進而包含：下側密封固定構件329與安裝桿327。在藉由中間板323與下模320來夾住脫模薄膜400的狀態下，安裝桿327和下側密封固定構件329的上表面會接觸中間板323。在下側密封固定構件329中形成有貫穿通路324。各貫穿通路324，經由吸引用配管325而連接到真空泵330。由於如上述在底面構件321與側面構件322之間形成有間隙，因此藉由以真空泵330進行吸氣，位於下模320上的脫模薄膜400被吸附到下模320上。包含各貫穿通路324和真空泵330之構成，是本發明的「吸附機構」的一例。The lower mold 320 further includes a lower seal fixing member 329 and a mounting rod 327. In the state where the release film 400 is clamped by the intermediate plate 323 and the lower mold 320, the upper surface of the mounting rod 327 and the lower side seal fixing member 329 contact the intermediate plate 323. A through passage 324 is formed in the lower sealing and fixing member 329. Each through passage 324 is connected to a vacuum pump 330 via a suction pipe 325. Since a gap is formed between the bottom surface member 321 and the side surface member 322 as described above, the release film 400 on the lower mold 320 is sucked onto the lower mold 320 by suction by the vacuum pump 330. The configuration including each through passage 324 and the vacuum pump 330 is an example of the "suction mechanism" of the present invention.

上模310，例如被構成為安裝有基板800，且該基板800配置有複數個晶片810。晶片810，例如是半導體積體電路。晶片810，相對於基板800可加以電性連接，亦可未加以電性連接。基板800的形狀例如是四邊形或圓形。基板800，例如是半導體基板(矽晶圓等)、金屬基板、玻璃基板、陶瓷基板、樹脂基板或配線基板，且亦可包含用於FO-WLP(扇出型晶圓級封裝)或FO-PLP(扇出型面板級封裝)的板狀構件的載體。上模310，包含上側密封固定構件311。上側密封固定構件311，當將成形模具300合模時會接觸中間板323。The upper mold 310 is, for example, configured to have a substrate 800 mounted thereon, and a plurality of wafers 810 are arranged on the substrate 800. The wafer 810 is, for example, a semiconductor integrated circuit. The chip 810 may be electrically connected to the substrate 800 or not. The shape of the substrate 800 is, for example, a quadrangular shape or a circular shape. The substrate 800 is, for example, a semiconductor substrate (silicon wafer, etc.), a metal substrate, a glass substrate, a ceramic substrate, a resin substrate, or a wiring substrate, and may also include FO-WLP (fan-out wafer level packaging) or FO- PLP (fan-out panel level packaging) carrier for plate-shaped components. The upper mold 310 includes an upper sealing and fixing member 311. The upper sealing and fixing member 311 contacts the intermediate plate 323 when the molding die 300 is closed.

[2、液狀樹脂的硬化對策] 在如上述的樹脂成形裝置10中，假設在脫模薄膜400被吸附在下模320上的狀態下，藉由液狀樹脂供給機構900將具有熱硬化性的液狀樹脂噴到脫模薄膜400上。此時，由於下模320的熱容易傳達到被供給到脫模薄膜400上的液狀樹脂，因此液狀樹脂有可能會比適當的時機更早硬化。[2. Curing measures for liquid resin] In the resin molding apparatus 10 as described above, assuming that the release film 400 is adsorbed on the lower mold 320, the liquid resin supply mechanism 900 sprays a thermosetting liquid resin onto the release film 400 . At this time, since the heat of the lower mold 320 is easily transferred to the liquid resin supplied to the release film 400, the liquid resin may harden earlier than an appropriate timing.

特別是，在從液狀樹脂供給機構900噴出的液狀樹脂是高黏度的情況、或是要噴灑液狀樹脂的脫模薄膜400上的面積較廣的情況(例如一邊300mm以上的四邊形或直徑300mm以上的圓形)下，到液狀樹脂的供給完畢需要較長時間。在這樣的情況下，更容易發生液狀樹脂比適當的時機更早硬化的事態。In particular, when the liquid resin ejected from the liquid resin supply mechanism 900 has a high viscosity, or when the release film 400 on which the liquid resin is sprayed has a large area (for example, a quadrilateral or a diameter of 300 mm or more on one side) In the case of a circle of 300 mm or more), it takes a long time to complete the supply of the liquid resin. In such a case, it is more likely that the liquid resin hardens earlier than the appropriate timing.

例如，作為解決這樣的問題的手段，有想到一種方法，是在樹脂成形裝置10以外的其他場所將液狀樹脂供給到脫模薄膜400上，然後再將已供給有液狀樹脂之脫模薄膜400配置到下模320上。然而，若根據這樣的方法，例如當將脫模薄膜400配置到下模320上時，脫模薄膜400可能會產生皺折。特別是，若脫模薄膜400的尺寸增大，要在不產生皺折的情況下將脫模薄膜400配置到下模320上是困難的。For example, as a means to solve such a problem, a method has been conceived of supplying liquid resin to the release film 400 at a place other than the resin molding apparatus 10, and then supplying the release film to which the liquid resin has been supplied. 400 is configured to the lower mold 320. However, according to such a method, for example, when the release film 400 is placed on the lower mold 320, the release film 400 may be wrinkled. In particular, if the size of the release film 400 increases, it is difficult to arrange the release film 400 on the lower mold 320 without causing wrinkles.

詳細如後述，但在遵照本實施型態的樹脂成形裝置10中，控制部700，控制液狀樹脂供給機構900以使得在脫模薄膜400與下模320分離的狀態下將液狀樹脂供給到脫模薄膜400上。The details are as described later, but in the resin molding apparatus 10 according to this embodiment, the control section 700 controls the liquid resin supply mechanism 900 so that the liquid resin is supplied to the mold release film 400 and the lower mold 320 in a state where the release film 400 is separated from the lower mold 320. On the release film 400.

樹脂成形裝置10中，由於是在脫模薄膜400與下模320物理分離的狀態下將液狀樹脂供給到脫模薄膜400上，因此下模320的熱不容易傳達到脫模薄膜400上的液狀樹脂。因此，根據樹脂成形裝置10，能夠抑制液狀樹脂比適當的時機更早硬化的事態。In the resin molding apparatus 10, since the liquid resin is supplied to the release film 400 in a state where the release film 400 and the lower mold 320 are physically separated, the heat of the lower mold 320 is not easily transmitted to the release film 400. Liquid resin. Therefore, according to the resin molding apparatus 10, it is possible to suppress a situation in which the liquid resin hardens earlier than an appropriate timing.

[3、樹脂成形品的製造步驟] 第4圖是表示藉由樹脂成形裝置10來進行的樹脂成形品的製造步驟的流程圖。第4圖所示的處理，是在脫模薄膜400被設置在薄膜供給機構500上且成形模具300開模的狀態下，藉由控制部700來執行。[3. Manufacturing steps of resin molded products] FIG. 4 is a flowchart showing the manufacturing procedure of the resin molded product performed by the resin molding apparatus 10. The processing shown in FIG. 4 is executed by the control unit 700 in a state where the release film 400 is set on the film supply mechanism 500 and the forming mold 300 is opened.

參照第4圖，控制部700，控制移動機構600來使送出輥530和捲取輥540上升到預先決定的位置(例如脫模薄膜400與中間板323的下表面接觸的位置)(步驟S100)。亦即，控制部700，控制移動機構600以使脫模薄膜400與下模320物理性分離。Referring to Fig. 4, the control unit 700 controls the moving mechanism 600 to raise the delivery roller 530 and the take-up roller 540 to a predetermined position (for example, the position where the release film 400 is in contact with the lower surface of the intermediate plate 323) (step S100) . That is, the control unit 700 controls the moving mechanism 600 so that the release film 400 and the lower mold 320 are physically separated.

一旦送出輥530和捲取輥540的移動結束，控制部700便控制薄膜供給機構500以提高施加在脫模薄膜400上的張力(步驟S110)。更具體而言，控制部700，固定送出機構510中的送出輥的旋轉，並控制捲取機構520中的捲取輥的轉矩，藉此提高施加在脫模薄膜400上的張力。或是，控制部700，固定捲取機構520中的捲取輥的旋轉，並控制送出機構510中的送出輥的轉矩。藉此，能夠抑制當液狀樹脂被供給到脫模薄膜400上時，液狀樹脂垂滴到脫模薄膜400的下方的情形。Once the movement of the delivery roller 530 and the take-up roller 540 is completed, the control part 700 controls the film supply mechanism 500 to increase the tension applied to the release film 400 (step S110). More specifically, the control unit 700 fixes the rotation of the delivery roller in the delivery mechanism 510 and controls the torque of the winding roller in the winding mechanism 520, thereby increasing the tension applied to the release film 400. Alternatively, the control unit 700 fixes the rotation of the winding roller in the winding mechanism 520 and controls the torque of the delivery roller in the delivery mechanism 510. Thereby, when the liquid resin is supplied to the release film 400, it can suppress that the liquid resin drips below the release film 400. As shown in FIG.

控制部700，控制液狀樹脂供給機構900，以在脫模薄膜400與下模320物理性分離的狀態下將液狀樹脂供給到脫模薄膜400上(步驟S120)。The control unit 700 controls the liquid resin supply mechanism 900 to supply the liquid resin to the release film 400 in a state where the release film 400 is physically separated from the lower mold 320 (step S120).

第5圖是表示液狀樹脂供給機構900將液狀樹脂供給到脫模薄膜400上的樣貌的圖。如第5圖所示，液狀樹脂供給機構900，在脫模薄膜400自底面構件321和側面構件322的雙方物理性分離的狀態下，將液狀樹脂910供給到脫模薄膜400的面內的預先決定的範圍內。FIG. 5 is a diagram showing the appearance of the liquid resin supply mechanism 900 supplying the liquid resin onto the release film 400. FIG. As shown in FIG. 5, the liquid resin supply mechanism 900 supplies the liquid resin 910 into the surface of the release film 400 in a state where the release film 400 is physically separated from both the bottom surface member 321 and the side surface member 322. Within the predetermined range.

一旦脫模薄膜400上的液狀樹脂供給完畢，控制部700便控制液狀樹脂供給機構900以自上模310與下模320之間退避(步驟S130)。一旦液狀樹脂供給機構900退避完畢，控制部700便控制移動機構600以使送出輥530和捲取輥540下降到預先決定的位置(步驟S140)。Once the supply of the liquid resin on the release film 400 is completed, the control unit 700 controls the liquid resin supply mechanism 900 to retract from between the upper mold 310 and the lower mold 320 (step S130). Once the retreat of the liquid resin supply mechanism 900 is completed, the control unit 700 controls the moving mechanism 600 so that the delivery roller 530 and the take-up roller 540 are lowered to predetermined positions (step S140).

一旦送出輥530和捲取輥540下降完畢，控制部700便控制合模機構200，以使下模320上升到側面構件322接觸脫模薄膜400且然後下側密封固定構件329隔著脫模薄膜400接觸中間板323的位置(步驟S150)。一旦下模320上升完畢，控制部700便控制真空泵330等(吸附機構)以將已供給有液狀樹脂之脫模薄膜400吸附到下模320上(步驟S160)。Once the delivery roller 530 and the take-up roller 540 have been lowered, the control part 700 controls the mold clamping mechanism 200 so that the lower mold 320 is raised until the side member 322 contacts the release film 400 and then the lower seal fixing member 329 is interposed with the release film 400 contacts the position of the middle plate 323 (step S150). Once the lower mold 320 is lifted, the control unit 700 controls the vacuum pump 330 and the like (suction mechanism) to suck the release film 400 supplied with the liquid resin onto the lower mold 320 (step S160).

然後，控制部700，在脫模薄膜400上的液狀樹脂的黏度降低後，控制合模機構200以使下模320上升來進行成形模具300的合模，且上述合模是在側面構件322隔著脫模薄膜400與基板800接觸的狀態下使底面構件321上升(步驟S170)來達成。藉此，完成了樹脂成形品。樹脂成形裝置10中，之後藉由反覆進行成形模具300的開模和脫模薄膜400的輸送以及步驟S100～步驟S170的處理，來量產樹脂成形品。Then, after the viscosity of the liquid resin on the release film 400 decreases, the control unit 700 controls the mold clamping mechanism 200 to raise the lower mold 320 to perform mold clamping of the forming mold 300, and the mold clamping is on the side member 322 This is achieved by raising the bottom surface member 321 in a state in which the release film 400 is in contact with the substrate 800 (step S170). In this way, the resin molded product was completed. In the resin molding apparatus 10, the mold opening of the molding die 300, the conveyance of the release film 400, and the processes of steps S100 to S170 are then repeatedly performed to mass-produce resin molded products.

[4、功效等] 如以上所述，在遵照本實施型態的樹脂成形裝置10中，控制部700控制液狀樹脂供給機構900，以在脫模薄膜400與下模320分離的狀態下將液狀樹脂供給到脫模薄膜400上。在樹脂成形裝置10中，由於是在脫模薄膜400與下模320物理性分離的狀態下將液狀樹脂供給到脫模薄膜400上，所以下模320的熱不容易傳達到脫模薄膜400上的液狀樹脂。因此，根據樹脂成形裝置10，能夠對液狀樹脂比適當的時機更早硬化的事態加以抑制。[4. Efficacy, etc.] As described above, in the resin molding apparatus 10 according to this embodiment, the control unit 700 controls the liquid resin supply mechanism 900 to supply the liquid resin to the mold release film 400 and the lower mold 320 in a state where the release film 400 is separated from the lower mold 320. Mold film 400 on. In the resin molding apparatus 10, since the liquid resin is supplied to the release film 400 in a state where the release film 400 and the lower mold 320 are physically separated, the heat of the lower mold 320 is not easily transmitted to the release film 400. Liquid resin on top. Therefore, according to the resin molding apparatus 10, it is possible to suppress a situation in which the liquid resin hardens earlier than an appropriate timing.

又，在遵照本實施型態的樹脂成形裝置10中，控制部700控制薄膜供給機構500，以在液狀樹脂供給機構900將液狀樹脂供給到脫模薄膜400上之前，提高施加在脫模薄膜400上的張力。藉此，能夠抑制當供給液狀樹脂到脫模薄膜400上時，液狀樹脂垂滴到脫模薄膜400的下方的情形。In addition, in the resin molding apparatus 10 according to this embodiment, the control unit 700 controls the film supply mechanism 500 to increase the application of the liquid resin to the mold release film 400 before the liquid resin supply mechanism 900 supplies the liquid resin to the mold release film 400 The tension on the film 400. Thereby, when the liquid resin is supplied to the release film 400, it can suppress that the liquid resin drips below the release film 400. As shown in FIG.

又，在遵照本實施型態的樹脂成形裝置10中，控制部700控制真空泵330等(吸附機構)，以在將液狀樹脂供給到脫模薄膜400上之後，將脫模薄膜400吸附到下模320上。藉此，能夠抑制下模320上的脫模薄膜400的位置偏差，而能夠更精準地製造樹脂成形品。In addition, in the resin molding apparatus 10 according to the present embodiment, the control unit 700 controls the vacuum pump 330 and the like (suction mechanism) so that after the liquid resin is supplied to the release film 400, the release film 400 is sucked to the bottom On the mold 320. Thereby, the positional deviation of the release film 400 on the lower mold 320 can be suppressed, and the resin molded product can be manufactured more accurately.

[5、其他實施型態] 上述實施型態的思想，並不限定於以上所說明過的實施型態。以下說明能夠應用上述實施型態的思想的其他實施型態的一例。[5. Other implementation types] The idea of the above-mentioned embodiment is not limited to the above-explained embodiment. Hereinafter, an example of another embodiment that can apply the idea of the above embodiment is described.

上述實施型態中，在上模310與下模320之間設有中間板323，但不一定需要有中間板323。In the above embodiment, an intermediate plate 323 is provided between the upper mold 310 and the lower mold 320, but the intermediate plate 323 is not necessarily required.

又，上述實施型態中，樹脂成形裝置10是單體的裝置。然而，樹脂成形裝置10，並不一定需要是單體的裝置，亦可為具有複數功能的裝置中的一部分單元。In addition, in the above-mentioned embodiment, the resin molding apparatus 10 is a stand-alone apparatus. However, the resin molding apparatus 10 does not necessarily need to be a stand-alone apparatus, and may be a part of a unit in an apparatus having plural functions.

以上，以例示性的方式說明了本發明的實施型態。亦即，為了例示性說明而揭示有詳細說明和隨附圖式。據此，在詳細說明和隨附圖式所記載的構成要素中，包含有要解決問題時不一定必須的構成要素。因此，即便在詳細說明和隨附圖式中記載有該等非必須的構成要素，也不該就此認定該等非必須的構成要素是必須的。Above, the embodiment of the present invention has been described in an exemplary manner. That is, for illustrative purposes, detailed descriptions and accompanying drawings are disclosed. Accordingly, the components described in the detailed description and the accompanying drawings include components that are not necessarily necessary to solve the problem. Therefore, even if such non-essential constituent elements are described in the detailed description and accompanying drawings, it should not be deemed necessary for these non-essential constituent elements.

又，上述實施型態中，在所有要點中皆僅為本發明的例示。上述實施型態在本發明的範圍內能夠進行各種改良或變更。亦即，要實施本發明時，能夠對應實施型態而適當採用具體的構成。In addition, in the above-mentioned embodiments, all the points are merely examples of the present invention. The above-mentioned embodiment can be variously improved or changed within the scope of the present invention. That is, when the present invention is to be implemented, a specific configuration can be appropriately adopted in accordance with the implementation mode.

10:樹脂成形裝置 100:底座 110:拉桿 120:上台板 130:下台板 200:合模機構 300:成形模具 310:上模 311:上側密封固定構件 320:下模 321:底面構件 322:側面構件 323:中間板 324:貫穿通路 325:吸引用配管 326:模腔 327:安裝桿 328:安裝構件 329:下側密封固定構件 330:真空泵 350:加熱部 400:脫模薄膜 500:薄膜供給機構 510:送出機構 520:捲取機構 530:送出輥 540:捲取輥 600:移動機構 700:控制部 800:基板 810:晶片 900:液狀樹脂供給機構 910:液狀樹脂 S100~S170:步驟10: Resin molding device 100: base 110: tie rod 120: upper plate 130: Lower plate 200: clamping mechanism 300: forming mold 310: upper die 311: Upper side seal fixing member 320: lower die 321: Bottom member 322: Side member 323: Intermediate plate 324: Through the Path 325: Suction piping 326: Mould Cavity 327: Mounting pole 328: Installation components 329: Lower side seal fixing member 330: Vacuum pump 350: heating section 400: release film 500: Film supply mechanism 510: sending organization 520: take-up mechanism 530: send out roller 540: take-up roller 600: mobile mechanism 700: Control Department 800: substrate 810: chip 900: Liquid resin supply mechanism 910: Liquid resin S100~S170: steps

第1圖是樹脂成形裝置的正面圖。 第2圖是下模的一部分的平面圖。 第3圖是包含上模、下模及中間板的剖面的圖。 第4圖是表示藉由樹脂成形裝置來進行的樹脂成形品的製造步驟的流程圖。 第5圖是表示液狀樹脂供給機構將液狀樹脂供給到脫模薄膜上的樣貌的圖。Figure 1 is a front view of the resin molding apparatus. Figure 2 is a plan view of a part of the lower mold. Fig. 3 is a view including a cross section of an upper mold, a lower mold, and an intermediate plate. Fig. 4 is a flowchart showing the manufacturing procedure of a resin molded product performed by a resin molding apparatus. Fig. 5 is a diagram showing a state where the liquid resin supply mechanism supplies the liquid resin onto the release film.

國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無Domestic deposit information (please note in the order of deposit institution, date and number) no Foreign hosting information (please note in the order of hosting country, institution, date, and number) no

S100~S170:步驟 S100~S170: steps

Claims (5)

一種樹脂成形裝置，其具備：成形模具，其包含上模與下模，該下模與前述上模相對向；合模機構，其將前述成形模具合模；薄膜供給機構，其將脫模薄膜供給到前述上模與前述下模之間；液狀樹脂供給機構，其將具有熱硬化性的液狀樹脂供給到前述脫模薄膜上；控制部，其控制前述液狀樹脂供給機構，以在前述脫模薄膜與前述下模分離的狀態下，將前述液狀樹脂供給到前述脫模薄膜上；及，移動機構，該移動機構使前述脫模薄膜移動到與前述下模分離的位置；前述薄膜供給機構包含：送出機構，其送出前述脫模薄膜；捲取機構，其捲取前述脫模薄膜；送出輥，其在前述脫模薄膜的輸送路徑上，被配置在比前述下模更靠近前述送出機構側；及，捲取輥，其在前述脫模薄膜的輸送路徑上，被配置在比前述下模更靠近前述捲取機構側；並且，前述移動機構，使前述送出輥和前述捲取輥上升。 A resin molding apparatus includes: a molding die including an upper die and a lower die, the lower die opposing the upper die; a clamping mechanism that closes the molding die; a film supply mechanism that releases the film Is supplied between the upper mold and the lower mold; a liquid resin supply mechanism that supplies a thermosetting liquid resin to the release film; a control section that controls the liquid resin supply mechanism to In a state where the release film is separated from the lower mold, the liquid resin is supplied to the release film; and, a moving mechanism that moves the mold release film to a position separated from the lower mold; The film supply mechanism includes: a delivery mechanism that delivers the release film; a winding mechanism that winds up the release film; and a delivery roller that is arranged closer to the lower mold than the lower mold on the delivery path of the release film The delivery mechanism side; and, the winding roller, which is arranged on the conveying path of the release film, is closer to the winding mechanism side than the lower mold; and the moving mechanism makes the delivery roller and the roll Take the roll up. 如請求項1所述之樹脂成形裝置，其中，前 述控制部控制前述薄膜供給機構，以在前述液狀樹脂供給機構將前述液狀樹脂供給到前述脫模薄膜上之前，提高施加在前述脫模薄膜上的張力。 The resin molding apparatus according to claim 1, wherein the former The control unit controls the film supply mechanism to increase the tension applied to the release film before the liquid resin supply mechanism supplies the liquid resin to the release film. 如請求項1或2所述之樹脂成形裝置，其中，更具備吸附機構，該吸附機構將前述脫模薄膜吸附在前述下模上；並且，前述控制部控制前述吸附機構，以在前述液狀樹脂被供給到前述脫模薄膜上之後，將前述脫模薄膜吸附在前述下模上。 The resin molding apparatus according to claim 1 or 2, further comprising an adsorption mechanism that adsorbs the release film on the lower mold; and the control unit controls the adsorption mechanism to be in the liquid state After the resin is supplied to the mold release film, the mold release film is adsorbed on the lower mold. 一種樹脂成形品的製造方法，其具備以下步驟：藉由薄膜供給機構將脫模薄膜供給到上模與下模之間；藉由移動機構將前述脫模薄膜移動到與前述下模分離的位置；在前述脫模薄膜與前述下模分離的狀態下，將具有熱硬化性的液狀樹脂供給到前述脫模薄膜上；將已供給有前述液狀樹脂之前述脫模薄膜吸附到前述下模上；及，將前述上模與前述下模合模，該下模處於吸附住前述脫模薄膜的狀態；前述薄膜供給機構包含：送出機構，其送出前述脫模薄膜；捲取機構，其捲取前述脫模薄膜； 送出輥，其在前述脫模薄膜的輸送路徑上，被配置在比前述下模更靠近前述送出機構側；及，捲取輥，其在前述脫模薄膜的輸送路徑上，被配置在比前述下模更靠近前述捲取機構側；並且，前述移動機構，使前述送出輥和前述捲取輥上升。 A method of manufacturing a resin molded product, comprising the steps of: supplying a mold release film between an upper mold and a lower mold by a film supply mechanism; and moving the mold release film to a position separated from the lower mold by a moving mechanism ; In the state where the release film is separated from the lower mold, a thermosetting liquid resin is supplied to the release film; the release film that has been supplied with the liquid resin is adsorbed to the lower mold And, the upper mold and the lower mold are clamped together, and the lower mold is in a state where the mold release film is adsorbed; the film supply mechanism includes: a delivery mechanism that sends out the mold release film; a winding mechanism that rolls Take the aforementioned release film; The delivery roller is arranged on the conveying path of the release film, which is closer to the delivery mechanism side than the lower mold; and, the take-up roller is arranged on the conveying path of the release film than the foregoing The lower mold is closer to the winding mechanism side; and the moving mechanism raises the delivery roller and the winding roller. 如請求項4所述之樹脂成形品的形成方法，其中，更具備以下步驟：在將前述液狀樹脂供給到前述脫模薄膜上之前，提高施加在前述脫模薄膜上的張力。 The method for forming a resin molded product according to claim 4, further comprising the step of increasing the tension applied to the release film before supplying the liquid resin to the release film.
TW109112110A 2019-07-10 2020-04-10 Resin molding device and method for manufacturing resin molded product TWI730715B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-128101 2019-07-10
JP2019128101A JP7134926B2 (en) 2019-07-10 2019-07-10 RESIN MOLDING APPARATUS AND METHOD OF MANUFACTURING RESIN MOLDED PRODUCT

Publications (2)

Publication Number Publication Date
TW202102350A TW202102350A (en) 2021-01-16
TWI730715B true TWI730715B (en) 2021-06-11

Family

ID=74059400

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109112110A TWI730715B (en) 2019-07-10 2020-04-10 Resin molding device and method for manufacturing resin molded product

Country Status (4)

Country Link
JP (1) JP7134926B2 (en)
KR (1) KR102338656B1 (en)
CN (1) CN112208054B (en)
TW (1) TWI730715B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7360407B2 (en) * 2021-02-10 2023-10-12 Ｔｏｗａ株式会社 Resin molding equipment and method for manufacturing resin molded products
JP7230160B1 (en) * 2021-12-01 2023-02-28 Ｔｏｗａ株式会社 RESIN MOLDING APPARATUS AND RESIN MOLDED PRODUCT MANUFACTURING METHOD

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200406293A (en) * 2002-09-06 2004-05-01 Towa Corp Resin encapsulation molding method of electronic part and resin encapsulation molding apparatus used therefor
TW201733769A (en) * 2016-03-30 2017-10-01 Towa Corp Resin molding apparatus and method thereof, film delivery roller and film supply device for resin molding apparatus which are used for resin molding to reduce the occurrence of wrinkles and deflections on a film

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5949132A (en) * 1995-05-02 1999-09-07 Texas Instruments Incorporated Dambarless leadframe for molded component encapsulation
JP3590146B2 (en) * 1995-08-09 2004-11-17 アピックヤマダ株式会社 Resin molding equipment
JPH10244556A (en) * 1997-03-06 1998-09-14 Sony Corp Production of semiconductor package
JP2000195883A (en) * 1998-12-25 2000-07-14 Nitto Denko Corp Method of sealing semiconductor wafer with resin
JP2005219297A (en) * 2004-02-04 2005-08-18 Apic Yamada Corp Method and apparatus for molding resin
JP4373237B2 (en) * 2004-02-13 2009-11-25 Ｔｏｗａ株式会社 Semiconductor chip resin sealing molding method and resin sealing molding die
JP2007301950A (en) * 2006-05-15 2007-11-22 Sumitomo Heavy Ind Ltd Molding method of thermosetting resin and molding machine therefor
JP4836661B2 (en) * 2006-05-17 2011-12-14 Ｔｏｗａ株式会社 Resin sealing molding method for electronic parts and mold for resin sealing molding
JP2009083438A (en) * 2007-10-03 2009-04-23 Towa Corp Compression molding method of electronic part
KR101000776B1 (en) * 2008-07-24 2010-12-15 세크론 주식회사 Apparatus for molding a electronic device
JP2010034447A (en) * 2008-07-31 2010-02-12 Renesas Technology Corp Method of manufacturing semiconductor device
JP5368054B2 (en) * 2008-10-15 2013-12-18 日本メクトロン株式会社 Method for manufacturing flexible circuit board and flexible circuit board
JP5234971B2 (en) * 2009-02-04 2013-07-10 住友重機械工業株式会社 Resin sealing device and resin sealing method
SG191479A1 (en) * 2011-12-27 2013-07-31 Apic Yamada Corp Method for resin molding and resin molding apparatus
JP5786918B2 (en) * 2013-10-23 2015-09-30 第一精工株式会社 Resin sealing mold, resin sealing device using the same, and resin sealing method
JP6169516B2 (en) * 2014-03-31 2017-07-26 Ｔｏｗａ株式会社 Resin molding apparatus and resin molding method
JP6298719B2 (en) * 2014-06-09 2018-03-20 Ｔｏｗａ株式会社 Resin sealing device and resin sealing method
KR102455987B1 (en) * 2014-07-22 2022-10-18 아피쿠 야마다 가부시키가이샤 Molding die, molding device, method for manufacturing molded article and resin molding method
JP6400446B2 (en) * 2014-11-28 2018-10-03 Ｔｏｗａ株式会社 Method for manufacturing plate-like member with protruding electrode, plate-like member with protruding electrode, method for manufacturing electronic component, and electronic component
JP6193951B2 (en) * 2015-10-19 2017-09-06 Ｔｏｗａ株式会社 Method for manufacturing resin-encapsulated electronic component and apparatus for manufacturing resin-encapsulated electronic component
JP6640003B2 (en) * 2016-04-05 2020-02-05 Ｔｏｗａ株式会社 Resin sealing device and resin sealing method
JP6423399B2 (en) * 2016-09-27 2018-11-14 アピックヤマダ株式会社 Resin molding method, film conveying apparatus, and resin molding apparatus
JP6774865B2 (en) * 2016-12-13 2020-10-28 アピックヤマダ株式会社 Frame jig, resin supply jig and its weighing method, mold resin measuring device and method, resin supply device, resin supply measuring device and method, and resin molding device and method
JP6723185B2 (en) * 2017-03-29 2020-07-15 Ｔｏｗａ株式会社 Mold, resin molding apparatus, resin molding method, and resin molded article manufacturing method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200406293A (en) * 2002-09-06 2004-05-01 Towa Corp Resin encapsulation molding method of electronic part and resin encapsulation molding apparatus used therefor
TW201733769A (en) * 2016-03-30 2017-10-01 Towa Corp Resin molding apparatus and method thereof, film delivery roller and film supply device for resin molding apparatus which are used for resin molding to reduce the occurrence of wrinkles and deflections on a film

Also Published As

Publication number Publication date
KR20210008308A (en) 2021-01-21
TW202102350A (en) 2021-01-16
JP2021014017A (en) 2021-02-12
CN112208054B (en) 2022-10-25
KR102338656B1 (en) 2021-12-14
JP7134926B2 (en) 2022-09-12
CN112208054A (en) 2021-01-12

Similar Documents

Publication Publication Date Title
TWI730715B (en) Resin molding device and method for manufacturing resin molded product
TWI634627B (en) Resin molding apparatus, resin molding method and resin molding die set
CN110099777B (en) Metering device for molded resin, resin supply metering device, resin molding device, methods thereof, and resin supply device
KR102026520B1 (en) Resin molding device, resin molding method, roller for transporting film and film supplying device for resin molding device
US20070085237A1 (en) Resin sealing and molding method of electronic component
TWI828702B (en) Resin molding device and resin molding method
JP6430342B2 (en) Resin molding apparatus, resin molding method, and mold
JP6560498B2 (en) Resin sealing method and resin molded product manufacturing method
TW201448074A (en) Resin molding apparatus and resin molding method
TW201912362A (en) Resin molding device and resin molded article manufacturing method
TWI657030B (en) Film conveying device, film conveying method, and resin molding device
JP6654887B2 (en) Resin material supply apparatus and method, and compression molding apparatus
JP2007237740A (en) Photoelectron component, and method for manufacturing photoelectron component
JP6501063B2 (en) In-mold decoration forming method and in-mold decoration forming apparatus
JP3017490B1 (en) Resin mold device and mold used for it
TWI768846B (en) Resin molding apparatus
JPH08244064A (en) Resin molding apparatus and method using release film
TW202249128A (en) Resin sealing device and resin sealing method
JP2015056467A (en) Method and apparatus for manufacturing semiconductor device, and sheet-like resin for resin sealing
KR20150016441A (en) Facility and method manufacturing substrates
JP2010221430A (en) Molding resin and resin molding method
JP2012049541A (en) Resist application apparatus for manufacturing printed circuit board
JP6763692B2 (en) Resin supply method and resin molding method
JP2014039065A (en) Resin sealing apparatus
KR20190055448A (en) Substrate treating apparatus