JP6654887B2 - Resin material supply apparatus and method, and compression molding apparatus - Google Patents

Resin material supply apparatus and method, and compression molding apparatus Download PDF

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JP6654887B2
JP6654887B2 JP2015250316A JP2015250316A JP6654887B2 JP 6654887 B2 JP6654887 B2 JP 6654887B2 JP 2015250316 A JP2015250316 A JP 2015250316A JP 2015250316 A JP2015250316 A JP 2015250316A JP 6654887 B2 JP6654887 B2 JP 6654887B2
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resin material
folded
horizontal portion
flexible sheet
compression molding
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JP2017113941A (en
JP2017113941A5 (en
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竹内　慎
慎 竹内
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Towa Corp
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Priority to CN201611174792.XA priority patent/CN107030952B/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B11/00—Making preforms
    • B29B11/02—Making preforms by dividing preformed material, e.g. sheets, rods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3405—Feeding the material to the mould or the compression means using carrying means
    • B29C2043/3416—Feeding the material to the mould or the compression means using carrying means conveyor belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3405—Feeding the material to the mould or the compression means using carrying means
    • B29C2043/3427—Feeding the material to the mould or the compression means using carrying means hopper, vessel, chute, tube, conveying screw, for material in discrete form, e.g. particles or powder or fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Description

本発明は、樹脂材料供給装置及び方法、並びに該樹脂材料供給装置を有する圧縮成形装置に関する。   The present invention relates to a resin material supply device and method, and a compression molding device having the resin material supply device.

電子部品の小型化及びそれによる半導体チップ等のボンディングワイヤの小径化に伴い、電子部品の封止成形に圧縮成形が用いられるようになってきている。圧縮成形では、離型フィルムで被覆した下型のキャビティに樹脂材料を供給し、加熱溶融した後、電子部品を装着した基板を取り付けた上型との間で型締めして該樹脂を圧縮することにより成形が行われる。   With the miniaturization of electronic components and the resulting reduction in the diameter of bonding wires such as semiconductor chips, compression molding has been used for sealing molding of electronic components. In compression molding, a resin material is supplied to a cavity of a lower mold covered with a release film, heated and melted, and then the resin is compressed by clamping between the upper mold and a board on which electronic components are mounted. Thus, molding is performed.

特許文献１には、複数本のスリット状の樹脂材料供給孔が設けられた、樹脂材料を収容する樹脂トレイを下型のキャビティの上に配置したうえで、樹脂トレイの底部に設けられた、中央で突合された2枚の平板から成るシャッターをこの樹脂材料供給孔のスリットの長手方向に垂直な方向に開けることにより、樹脂材料供給孔から樹脂材料をキャビティ内に落下させる樹脂材料供給装置が記載されている。この樹脂材料供給装置によれば、キャビティの全体に所定量の樹脂材料を過不足無く且つ均等に供給することができる。   In Patent Literature 1, a plurality of slit-shaped resin material supply holes are provided, a resin tray containing a resin material is disposed on a cavity of a lower mold, and provided on a bottom portion of the resin tray. A resin material supply device that drops a resin material from a resin material supply hole into a cavity by opening a shutter made of two flat plates abutted at the center in a direction perpendicular to the longitudinal direction of a slit of the resin material supply hole is provided. Has been described. According to this resin material supply device, a predetermined amount of the resin material can be uniformly supplied to the entire cavity without excess or shortage.

特許文献２には、粉末の樹脂材料をベルトコンベア上に均等に敷き詰め、該ベルトコンベアの終端からキャビティに樹脂材料を落下させつつ該終端を押す方向にベルトコンベアを移動させることにより、ベルトコンベア上の樹脂材料をそのままキャビティに均等に供給する樹脂材料供給装置が記載されている。この樹脂材料供給装置もキャビティの全体に所定量の樹脂材料を過不足無く且つ均等に供給することを目的としている。   Patent Document 2 discloses that a resin material of powder is evenly spread on a belt conveyor, and the belt conveyor is moved in a direction of pushing the terminal while dropping the resin material from an end of the belt conveyor to a cavity. A resin material supply device for uniformly supplying the resin material to the cavity as it is is described. This resin material supply apparatus also aims to supply a predetermined amount of resin material to the entire cavity without excess, shortage and evenness.

特開2007-125783号公報JP 2007-125783 A 特開2003-223901号公報JP 2003-223901 A

圧縮成形装置には、1個の下型に複数個のキャビティが形成されるタイプのものがある。この場合、それら複数のキャビティ内には均等に樹脂材料を供給する一方、キャビティとキャビティの間の部分（マージン）には樹脂材料を供給してはならない。このような、全体として所定のパターンとなるように下型に樹脂材料を供給しようとする場合、特許文献１や２に記載の樹脂材料供給装置では対応することができない。   There is a compression molding apparatus in which a plurality of cavities are formed in one lower mold. In this case, the resin material must be supplied evenly into the plurality of cavities, but the resin material must not be supplied to the portion (margin) between the cavities. In the case where the resin material is to be supplied to the lower mold so as to have a predetermined pattern as a whole, the resin material supply devices described in Patent Documents 1 and 2 cannot cope.

本発明が解決しようとする課題は、圧縮成形装置の下型に、所定のパターンで樹脂材料を供給することができる樹脂材料供給装置及び樹脂材料供給方法、並びに該樹脂材料供給装置を有する圧縮成形装置を提供することである。   An object of the present invention is to provide a resin material supply device and a resin material supply method capable of supplying a resin material in a predetermined pattern to a lower mold of a compression molding device, and a compression molding having the resin material supply device. It is to provide a device.

上記課題を解決するために成された本発明に係る樹脂材料供給装置は、圧縮成形装置の下型に粉状、顆粒状又はシート状の樹脂材料を供給する装置であって、
a) 水平に配置された水平部と、該水平部の一端に設けられた、下方への折返し部を有する、前記下型の上に配置される可撓性シートと、
b) 前記樹脂材料を前記水平部の上に所定のパターンとなるように配置する樹脂材料配置部と、
c) 前記折返し部において前記可撓性シートの下側に接しつつ該折返し部を前記水平部側に移動させる折返し部材と
を備えることを特徴とする。 The resin material supply device according to the present invention made in order to solve the above-described problems is a device for supplying a powdery, granular, or sheet-like resin material to a lower mold of a compression molding device,
a) a horizontal portion disposed horizontally, and a flexible sheet provided on one end of the horizontal portion, having a folded portion downward, disposed on the lower mold,
b) a resin material arranging portion for arranging the resin material on the horizontal portion in a predetermined pattern;
c) a folding member that moves the folded portion toward the horizontal portion while contacting the lower side of the flexible sheet at the folded portion.

本発明において、可撓性シートの水平部は、可撓性シート上の樹脂材料のパターンが重力によって崩れず、且つ折返し部材が移動していないときに樹脂材料が折返し部材から落下しない程度に、厳密な水平の状態からわずかに傾斜していることが許容される。   In the present invention, the horizontal portion of the flexible sheet is such that the pattern of the resin material on the flexible sheet does not collapse due to gravity, and to such an extent that the resin material does not drop from the folding member when the folding member is not moving. A slight tilt from a strictly horizontal position is allowed.

本発明に係る樹脂材料供給装置は以下のように使用する。まず、樹脂材料配置部により、樹脂材料を可撓性シートの水平部の上に所定のパターンになるように配置する。樹脂材料配置部には、従来の樹脂材料供給装置で用いられているものを適用することができる。粉状又は顆粒状の樹脂材料を用いる場合には、例えば、特許文献１に記載の樹脂材料供給装置で用いられているフィーダの先端を、該パターンの形状に応じて移動させながら樹脂材料を水平部上に配置してゆくことにより、該パターンを形成することができる。シート状の樹脂材料を用いる場合には、例えば、予め所定のパターンに切り抜かれたシート状の樹脂材料を搬送装置により可撓性シートの上まで搬送して載置すればよい。   The resin material supply device according to the present invention is used as follows. First, a resin material is arranged in a predetermined pattern on the horizontal portion of the flexible sheet by the resin material disposing portion. As the resin material disposing portion, those used in a conventional resin material supply device can be applied. When a powdery or granular resin material is used, for example, the resin material is horizontally moved while moving the tip of a feeder used in the resin material supply device described in Patent Document 1 according to the shape of the pattern. By arranging them on the part, the pattern can be formed. When a sheet-shaped resin material is used, for example, a sheet-shaped resin material cut out in a predetermined pattern in advance may be transported and placed on a flexible sheet by a transport device.

次に、可撓性シートが圧縮成形装置の下型の上に配置された状態で、折返し部材が可撓性シートの下側に接しつつ、該折返し部材を前記水平部側に移動させる。なお、可撓性シートを前記下型の上に配置するタイミングは、樹脂材料を水平部上に配置する前及び配置した後のいずれであってもよい。この折返し部材の移動により、可撓性シートは水平部側に順に折り返されてゆき、折返し部も折返し部材と同じ方向に移動してゆく。そのため、水平部上に配置された樹脂材料は、折返し部から順に下型内に落下してゆく。ここで、可撓性シートが面であることから、折返し部は必然的に線状となり、この線状の折返し部が移動することにより樹脂材料が面状に供給される。   Next, in a state where the flexible sheet is placed on the lower mold of the compression molding device, the folding member is moved to the horizontal portion side while the folding member is in contact with the lower side of the flexible sheet. The timing of disposing the flexible sheet on the lower mold may be before or after disposing the resin material on the horizontal portion. Due to the movement of the folding member, the flexible sheet is sequentially folded toward the horizontal portion, and the folded portion also moves in the same direction as the folding member. Therefore, the resin material arranged on the horizontal portion falls into the lower mold sequentially from the folded portion. Here, since the flexible sheet is a surface, the folded portion is necessarily linear, and the resin material is supplied in a planar shape by moving the linear folded portion.

下型に対して、可撓性シートの水平部上の各点が移動せずに折返し部のみが移動するように折返し部材を移動させることにより、水平部上の樹脂材料はそのパターンを維持したまま下型に供給される。
一方、折返し部材の移動速度をそれよりも速くすることにより、下型には可撓性シートの水平部上でのパターンが該移動方向に伸長したパターンで樹脂材料が供給される。また、折返し部材の移動速度を前記移動速度よりも遅くすることにより、該移動方向に圧縮されたパターンで樹脂材料が供給される。このように、本発明に係る樹脂材料供給装置によれば、水平部上に配置されたパターンに対応した、所望のパターンで樹脂材料を下型に供給することもできる。 With respect to the lower mold, the resin material on the horizontal portion maintained its pattern by moving the folding member so that each point on the horizontal portion of the flexible sheet did not move and only the folded portion moved. It is supplied to the lower mold as it is.
On the other hand, by making the moving speed of the folding member higher than that, the resin material is supplied to the lower mold in a pattern in which the pattern on the horizontal portion of the flexible sheet extends in the moving direction. Further, by making the moving speed of the folding member lower than the moving speed, the resin material is supplied in a pattern compressed in the moving direction. As described above, according to the resin material supply device of the present invention, the resin material can be supplied to the lower mold in a desired pattern corresponding to the pattern arranged on the horizontal portion.

前記折返し部材は、前記可撓性シートに対して滑りながら前記水平部側に移動するものであってもよい。その例として、前記折返し部材が、前記折返し部に端部が配置され前記可撓性シートの前記水平部を下側から支持する板材であるという構成が挙げられる。このような板材を用いる場合には、可撓性シートの折返し部の反対側にある端部のうち板材の上側にある方を固定したうえで、板材の下側にある端部の方を前記移動方向に引くことにより、該板材を該方向に移動させながら、該折返し部を該方向に移動させる。これにより、可撓性シート上の各点が移動せずに折返し部のみを移動させることができ、可撓性シート上のパターンを維持したまま樹脂材料を下型に供給することができる。板材の他に、線状の折返し部の方向に延びる棒材等の折返し部材を用いることもできる。樹脂材料が配置された水平部を下側から全面で保持することができるという点で、上記板状の折返し部材を用いることが望ましい。   The folding member may move toward the horizontal portion while sliding with respect to the flexible sheet. As an example thereof, there is a configuration in which the folded member is a plate member having an end arranged at the folded portion and supporting the horizontal portion of the flexible sheet from below. In the case of using such a plate, the upper end of the plate is fixed on the end opposite to the folded portion of the flexible sheet, and the lower end of the flexible plate is connected to the end. By pulling in the moving direction, the folded portion is moved in the direction while moving the plate material in the direction. Thus, only the folded portion can be moved without moving each point on the flexible sheet, and the resin material can be supplied to the lower mold while maintaining the pattern on the flexible sheet. In addition to the plate member, a folded member such as a bar extending in the direction of the linear folded portion may be used. It is desirable to use the above-mentioned plate-shaped folded member in that the horizontal portion on which the resin material is arranged can be held from the lower side over the entire surface.

あるいは、前記折返し部材は、回転することにより前記可撓性シートに対して滑ることなく前記水平部側に移動するものであってもよい。この場合、この折返し部材と共に、該折返し部材よりも前記水平部側に設けられた、前記可撓性シートを第２の折返し部で上方側に折り返し、回転することにより該可撓性シートに対して該折返し部材と同方向に移動する第２折返し部材を備え、前記可撓性シートが前記折返し部から前記第２の折返し部を経て該折返し部に戻るエンドレスのシートである、という構成を取ることが好ましい。この構成により、樹脂材料供給装置を1回使用した後に、第２折返し部から上方に折り返された可撓性シートが水平部に供給されるため、可撓性シートを元の状態に戻さなくとも次の樹脂材料の供給動作を行うことができる。なお、可撓性シートは、前記折返し部で滑らなければ、第２折返し部で滑ることは許容される。   Alternatively, the folding member may move toward the horizontal portion without slipping on the flexible sheet by rotating. In this case, together with the folding member, the flexible sheet, which is provided on the horizontal portion side of the folding member, is folded upward at the second folding portion and rotated to rotate the flexible sheet with respect to the flexible sheet. And a second folded member that moves in the same direction as the folded member, and the flexible sheet is an endless sheet that returns from the folded portion to the folded portion via the second folded portion. Is preferred. With this configuration, after the resin material supply device is used once, the flexible sheet folded upward from the second folded portion is supplied to the horizontal portion, so that the flexible sheet does not need to be returned to the original state. The next supply operation of the resin material can be performed. Note that the flexible sheet is allowed to slide at the second folded portion unless it slides at the folded portion.

本発明に係る樹脂材料供給装置において、前記折返し部の移動範囲の下側に、該折返し部から落下する樹脂材料を前記下型の所定の範囲内に誘導する下部誘導具を備えることが好ましい。これにより、樹脂材料を下型の所定の範囲内に確実に供給することができる。あるいは、本発明に係る樹脂材料供給装置は、前記水平部の上側に、前記樹脂材料配置部により配置される樹脂材料を前記水平部の上に所定の位置に誘導する上部誘導具を備えていてもよい。   In the resin material supply device according to the present invention, it is preferable that a lower guiding tool that guides the resin material falling from the folded portion into a predetermined range of the lower mold is provided below the moving range of the folded portion. This makes it possible to reliably supply the resin material within a predetermined range of the lower mold. Alternatively, the resin material supply device according to the present invention includes an upper guide that guides the resin material disposed by the resin material disposition portion to a predetermined position above the horizontal portion, above the horizontal portion. Is also good.

本発明に係る樹脂材料供給装置において、前記折返し部の移動に伴って移動することで該折返し部の近傍に配置される、前記樹脂材料に生じる静電気を除電する除電部を備えることが好ましい。これにより、樹脂材料と可撓性シートの摩擦により生じる静電気を、樹脂材料が下型に供給される直前に除去することができる。   In the resin material supply device according to the present invention, it is preferable that the resin material supply device further includes a static eliminator configured to move along with the movement of the folded portion and disposed near the folded portion to eliminate static electricity generated in the resin material. Thereby, static electricity generated by friction between the resin material and the flexible sheet can be removed immediately before the resin material is supplied to the lower mold.

本発明に係る樹脂材料供給装置において、前記可撓性シート及び前記折返し部材を、複数設けられた圧縮成形装置のいずれかの下型の上に搬送する搬送部を備えることが好ましい。これにより、1組の樹脂材料配置部、可撓性シート及び折返し部材を用いて、複数の圧縮成形装置の下型に樹脂材料を供給することができる。   In the resin material supply device according to the present invention, it is preferable that the resin material supply device further includes a transport unit that transports the flexible sheet and the folded member onto a lower mold of any of the plurality of compression molding devices. Thereby, the resin material can be supplied to the lower molds of the plurality of compression molding devices using one set of the resin material placement portion, the flexible sheet, and the folded member.

本発明に係る圧縮成形装置は、粉状、顆粒状又はシート状の樹脂材料を用いて樹脂成形品を製造する装置であって、
樹脂成形品が成形される空間であるキャビティを有する下型と、
前記下型に相対向する上型と、
本発明に係る前記樹脂材料供給装置と
を備えることを特徴とする。 The compression molding apparatus according to the present invention is an apparatus for producing a resin molded product using a powdery, granular, or sheet-like resin material,
A lower mold having a cavity that is a space in which the resin molded product is molded;
An upper die opposed to the lower die,
And a resin material supply device according to the present invention.

また、本発明に係る圧縮成形装置の他の態様のものは、粉状、顆粒状又はシート状の樹脂材料を用いて樹脂成形品を製造する圧縮成形モジュールを備える装置であって、
前記圧縮成形モジュールに設けられた、樹脂成形品が成形される空間であるキャビティを有する下型と、
前記圧縮成形モジュールに設けられた、前記下型に相対向する上型と、
本発明に係る前記樹脂材料供給装置と
を備え、
前記圧縮成形モジュールが他の圧縮成形モジュールに対して着脱可能である
ことを特徴とする。 Another aspect of the compression molding apparatus according to the present invention is an apparatus including a compression molding module for producing a resin molded product using a powdery, granular, or sheet-like resin material,
Provided in the compression molding module, a lower mold having a cavity which is a space where a resin molded product is molded,
An upper mold provided in the compression molding module, facing the lower mold,
Comprising the resin material supply device according to the present invention,
The compression molding module is detachable from another compression molding module.

前記圧縮成形モジュールを有する圧縮成形装置では、樹脂材料供給装置は圧縮成形モジュール毎に設けてもよいし、複数個の圧縮成形モジュールに共通のものを設けてもよい。複数個の圧縮成形モジュールに共通の樹脂材料供給装置には、前述の搬送部を設ければよい。   In the compression molding device having the compression molding module, the resin material supply device may be provided for each compression molding module, or a common material may be provided for a plurality of compression molding modules. The above-described transport unit may be provided in a resin material supply device common to a plurality of compression molding modules.

本発明に係る樹脂材料供給方法は、圧縮成形装置の下型に粉状、顆粒状又はシート状の樹脂材料を供給する方法であって、
水平に配置された水平部と、該水平部の一端に設けられた、下方への折返し部を有する可撓性シートの該水平部の上に、前記樹脂材料を所定のパターンとなるように配置し、
前記折返し部において前記可撓性シートの下側に接しつつ折返し部材を前記水平部側に移動させることにより、前記水平部上の前記樹脂材料を該折返し部から前記下型に供給する
ことを特徴とする。 The resin material supply method according to the present invention is a method of supplying a powdery, granular or sheet-like resin material to a lower mold of a compression molding apparatus,
The resin material is arranged in a predetermined pattern on the horizontal portion of a flexible sheet having a horizontally disposed horizontal portion and a downwardly folded portion provided at one end of the horizontal portion. And
The resin material on the horizontal portion is supplied to the lower mold from the folded portion by moving the folded member toward the horizontal portion while contacting the lower side of the flexible sheet at the folded portion. And

本発明に係る樹脂材料供給装置及び樹脂材料供給方法によれば、圧縮成形装置の下型に、所定のパターンで樹脂材料を供給することができる。そして、該樹脂材料供給装置を有する圧縮成形装置により、該パターンに対応した形状を有する樹脂成形品を得ることができる。   According to the resin material supply device and the resin material supply method according to the present invention, the resin material can be supplied to the lower mold of the compression molding device in a predetermined pattern. Then, a resin molded product having a shape corresponding to the pattern can be obtained by the compression molding device having the resin material supply device.

本発明に係る樹脂材料供給装置の第１実施形態を示す概略構成図。FIG. 1 is a schematic configuration diagram showing a first embodiment of a resin material supply device according to the present invention. 第１実施形態の樹脂材料供給装置における樹脂材料配置部及び該樹脂材料配置部を用いて樹脂材料を可撓性シートに配置するパターンの一例を示す上面図(a)、並びに該樹脂材料供給装置により樹脂材料が供給される下型のキャビティを示す上面図(b)。Top view (a) showing an example of a resin material arranging portion and a pattern of arranging a resin material on a flexible sheet using the resin material arranging portion in the resin material supplying device of the first embodiment, and the resin material arranging device. FIG. 4B is a top view showing the cavity of the lower mold to which the resin material is supplied according to FIG. 第１実施形態の樹脂材料供給装置の動作を示す図。The figure which shows operation | movement of the resin material supply apparatus of 1st Embodiment. 第１実施形態の樹脂材料供給装置において折返し部材を元の位置に戻すための構成を示す図。FIG. 4 is a diagram illustrating a configuration for returning a folded member to an original position in the resin material supply device according to the first embodiment. 第１実施形態の樹脂材料供給装置を用いてシート状樹脂材料を下型に供給する動作を示す図。The figure which shows the operation | movement which supplies a sheet-shaped resin material to a lower die using the resin material supply apparatus of 1st Embodiment. 第１実施形態の樹脂材料供給装置におけるシート移動装置の変形例を示す図。FIG. 5 is a diagram showing a modification of the sheet moving device in the resin material supply device of the first embodiment. 折返し部材の別の例を示す側面図。The side view which shows another example of a folded member. シート移動装置及び折返し部材のさらに別の例を示す側面図。The side view which shows another example of a sheet moving device and a folding member. 樹脂材料配置部を用いて樹脂材料を可撓性シートに配置するパターンの他の２つの例を示す上面図((a-1), (a-2))、及びこれらのパターンで可撓性シートに配置された樹脂材料が供給される下型のキャビティを示す上面図((b-1), (b-2))。Top views ((a-1), (a-2)) showing two other examples of a pattern in which a resin material is placed on a flexible sheet using a resin material placement section, and the flexibility of these patterns. FIG. 4 is a top view ((b-1), (b-2)) showing the cavity of the lower mold to which the resin material placed on the sheet is supplied. 第１実施形態の樹脂材料供給装置に下部誘導具(a)及び上部誘導具(b)を設けた例を示す概略図。FIG. 2 is a schematic diagram showing an example in which a lower guide (a) and an upper guide (b) are provided in the resin material supply device of the first embodiment. 第１実施形態の樹脂材料供給装置に除電部を設けた例を示す概略図。FIG. 3 is a schematic diagram illustrating an example in which a charge removing unit is provided in the resin material supply device according to the first embodiment. 第１実施形態の樹脂材料供給装置を用いて樹脂封止品を製造する工程を示す図。The figure which shows the process of manufacturing a resin sealing article using the resin material supply apparatus of 1st Embodiment. 本発明に係る樹脂材料供給装置の第２実施形態を示す概略構成図。The schematic block diagram which shows 2nd Embodiment of the resin material supply apparatus which concerns on this invention. 第２実施形態の樹脂材料供給装置の動作を示す図。The figure which shows operation | movement of the resin material supply apparatus of 2nd Embodiment. 本発明に係る樹脂材料供給装置を1組有し、成形モジュールを複数組有する例を示す平面図。FIG. 1 is a plan view showing an example having one set of a resin material supply device according to the present invention and having a plurality of sets of molding modules.

図１〜図１５を用いて、本発明に係る樹脂材料供給装置及び樹脂材料供給方法の実施形態を説明する。これら装置及び方法は、圧縮成形のために粉状、顆粒状又はシート状の樹脂材料を圧縮成形装置の型のキャビティに供給するものである。以下では併せて、当該樹脂材料供給装置を用いた圧縮成形装置の実施形態を説明する。   Embodiments of a resin material supply apparatus and a resin material supply method according to the present invention will be described with reference to FIGS. In these apparatuses and methods, a powdery, granular or sheet-like resin material is supplied to a mold cavity of a compression molding apparatus for compression molding. Hereinafter, an embodiment of a compression molding apparatus using the resin material supply device will be described together.

(1) 第１実施形態
図１は、第１実施形態の樹脂材料供給装置１０を示す概略構成図である。樹脂材料供給装置１０は、可撓性シート１１と、樹脂材料配置（散布）装置１２と、折返し部材１３と、シート引張装置１４を有する。本実施例では、可撓性シート１１はシリコーンゴム製であり、折返し部材１３は金属（ステンレス鋼）製の長方形の板材である。可撓性シート１１にはシリコーンゴムの他に、ポリウレタン、ポリエステル、フッ素樹脂等の材料を用いることができる。折返し部材１３にはステンレス鋼以外の金属製のものや、それら金属製の板材にテフロン（登録商標）等の樹脂でコーティングしたもの、あるいはセラミックス製のもの等を用いることができる。折返し部材１３の板材の側面のうちの１つは、板材の上面及び下面との角が丸められている。この側面を「折返し面」と呼ぶ。 (1) First Embodiment FIG. 1 is a schematic configuration diagram illustrating a resin material supply device 10 according to a first embodiment. The resin material supply device 10 includes a flexible sheet 11, a resin material placement (spraying) device 12, a folding member 13, and a sheet pulling device 14. In this embodiment, the flexible sheet 11 is made of silicone rubber, and the folded member 13 is a rectangular plate made of metal (stainless steel). For the flexible sheet 11, materials such as polyurethane, polyester, and fluororesin can be used in addition to silicone rubber. The folded member 13 may be made of a metal other than stainless steel, a metal plate material coated with a resin such as Teflon (registered trademark), or a ceramic material. One of the side surfaces of the plate member of the folded member 13 has rounded corners with the upper and lower surfaces of the plate member. This side is referred to as a “turning side”.

可撓性シート１１の形状は、本実施形態では帯状である。該帯の一端である固定端１１３は、折返し部材１３の板材の側面のうちの１つである折返し部１１２と平行に、折返し部材１３の上面の所定の位置に配置されるよう、樹脂材料供給装置１０の筐体（図示せず）に固定されている。なお、固定端１１３は、折返し部材１３には固定されていない。可撓性シート１１の帯は、固定端１１３から折返し部材１３の上面から折返し面に向かい、折返し面で下面に折返され、折返し面から離れるように延びている。この折返し部材１３の折返し面で折り返された可撓性シート１１の部分を折返し部１１２と呼ぶ。また、可撓性シート１１のうち折返し部１１２と固定端１１３の間の部分を水平部１１１と呼ぶ。樹脂材料供給装置１０の全体は、水平部１１１が略水平になるように配置されている。なお、水平部１１１は、後述のように水平部１１１上に配置（散布）される樹脂材料Ｐが重力で折返し部１１２から落下しない程度であれば、水平から多少傾斜していてもよい。   The shape of the flexible sheet 11 is a band in this embodiment. The fixed end 113 which is one end of the band is supplied with a resin material so as to be arranged at a predetermined position on the upper surface of the folded member 13 in parallel with the folded portion 112 which is one of the side surfaces of the plate member of the folded member 13. It is fixed to a housing (not shown) of the device 10. Note that the fixed end 113 is not fixed to the folded member 13. The band of the flexible sheet 11 extends from the fixed end 113 toward the folded surface from the upper surface of the folded member 13, is folded down at the folded surface, and extends away from the folded surface. The portion of the flexible sheet 11 folded on the folded surface of the folded member 13 is called a folded portion 112. Further, a portion between the folded portion 112 and the fixed end 113 of the flexible sheet 11 is referred to as a horizontal portion 111. The entire resin material supply device 10 is arranged such that the horizontal portion 111 is substantially horizontal. Note that the horizontal portion 111 may be slightly inclined from horizontal as long as the resin material P disposed (sprayed) on the horizontal portion 111 does not fall from the folded portion 112 due to gravity as described later.

樹脂材料配置装置１２は、図２(a)に示すように、粉状又は顆粒状の樹脂材料Ｐを貯留するホッパ１２１と、ホッパ１２１から側方に延び、先端から樹脂材料Ｐを散布する（落下させる）ことで該樹脂材料Ｐを水平部１１１上に配置するリニアフィーダ１２２を有する。樹脂材料配置装置１２は、その全体が水平方向に移動することにより、水平部１１１上の任意の位置に樹脂材料Ｐを配置することができる。シート状の樹脂材料を用いる場合には、樹脂材料配置装置１２の代わりに、例えば、搬送装置（図示せず）の下部に気体の吸引等の方法によってシート状の樹脂材料を吸着させた状態で、該搬送装置を水平部１１１上の所定位置まで移動させ、吸着を停止することにより、該シート状の樹脂材料を該所定位置に配置することができる。以上のように、粉状、顆粒状及びシート状のいずれの形態の樹脂材料Ｐを用いる場合にも、該樹脂材料Ｐを水平部１１１上の任意の位置に配置することができる。   As shown in FIG. 2A, the resin material placement device 12 stores a powdery or granular resin material P, and extends sideways from the hopper 121 to spray the resin material P from the tip ( The resin material P is disposed on the horizontal portion 111 by dropping). The resin material placement device 12 can place the resin material P at an arbitrary position on the horizontal portion 111 by moving the entirety in the horizontal direction. When a sheet-like resin material is used, for example, the sheet-like resin material is adsorbed to a lower portion of a transfer device (not shown) by a method such as gas suction instead of the resin material placement device 12. By moving the transfer device to a predetermined position on the horizontal portion 111 and stopping the suction, the sheet-shaped resin material can be disposed at the predetermined position. As described above, the resin material P can be disposed at an arbitrary position on the horizontal portion 111 regardless of whether the resin material P is in the form of powder, granule, or sheet.

折返し部材１３は、略水平に移動自在に、樹脂材料供給装置１０の筐体に設けられたガイドレール（図示せず）に保持されている。折返し部材１３の上面に可撓性シート１１の水平部１１１が配置されるため、水平部１１１はその全体が折返し部材１３の上面で支持される。   The folded member 13 is held by a guide rail (not shown) provided on the housing of the resin material supply device 10 so as to be movable substantially horizontally. Since the horizontal portion 111 of the flexible sheet 11 is disposed on the upper surface of the folding member 13, the entire horizontal portion 111 is supported by the upper surface of the folding member 13.

シート引張装置１４は、可撓性シート１１を巻き付けるドラム１４１と、可撓性シート１１をドラム１４１に巻きつける（ドラム１４１側に引く）方向に該ドラムを回転させるモータ（図示せず）を有する。可撓性シート１１の固定端１１３の反対側である端部は、ドラム１４１に固定されている。また、可撓性シート１１の帯の幅方向にある折返し部材１３の両側面には、折返し部材１３を折返し部１１２側に移動させるローラ１４２が当接しており、該ローラ１４２を回転させるモータ（図示せず）が設けられている。   The sheet tensioning device 14 includes a drum 141 for winding the flexible sheet 11 and a motor (not shown) for rotating the drum in a direction of winding the flexible sheet 11 around the drum 141 (pulling the drum 141). . An end of the flexible sheet 11 opposite to the fixed end 113 is fixed to the drum 141. Further, rollers 142 for moving the folding member 13 toward the folding portion 112 are in contact with both side surfaces of the folding member 13 in the width direction of the band of the flexible sheet 11, and a motor (for rotating the roller 142) (Not shown).

図２〜図４を参照しつつ、第１実施形態の樹脂材料供給装置１０の動作を説明する。まず、折返し部材１３の可動範囲内で折返し部１１２が固定端１１３から最も離れる、すなわち水平部１１１の長さが最大になる位置に折返し部材１３を配置する。そして、キャビティ２１１の上に水平部１１１が配置されるように、樹脂材料供給装置１０を下型の上に移動させる。この状態で、樹脂材料配置装置１２から水平部１１１に散布することにより、樹脂材料Ｐを所定のパターンになるように配置する（図２(a)）。図３(a)に、水平部１１１に樹脂材料Ｐを配置するパターンの一例を示す。この例では、図２(b)に上面図で示した複数個の直方体状のキャビティ２１１に合わせて、水平部１１１上の複数の長方形の領域に樹脂材料Ｐを配置している。このようなパターンは、樹脂材料配置装置１２を水平方向に移動させつつ、樹脂材料Ｐの散布（落下）の有無を制御することにより形成することができる。なお、下型の上に樹脂材料供給装置１０を移動させるタイミングは、樹脂材料Ｐの配置の後でもよく、その場合には、樹脂材料供給装置１０の構成要素のうち樹脂材料配置装置１２を下型の上に移動させる必要はない。   The operation of the resin material supply device 10 according to the first embodiment will be described with reference to FIGS. First, the folded member 13 is arranged at a position where the folded portion 112 is farthest from the fixed end 113 within the movable range of the folded member 13, that is, the position where the length of the horizontal portion 111 is maximized. Then, the resin material supply device 10 is moved above the lower mold so that the horizontal portion 111 is arranged above the cavity 211. In this state, the resin material P is scattered from the resin material arranging device 12 to the horizontal portion 111 to arrange the resin material P in a predetermined pattern (FIG. 2A). FIG. 3A shows an example of a pattern in which the resin material P is arranged on the horizontal portion 111. In this example, the resin material P is arranged in a plurality of rectangular regions on the horizontal portion 111 in accordance with the plurality of rectangular cavities 211 shown in the top view in FIG. Such a pattern can be formed by moving the resin material placement device 12 in the horizontal direction and controlling whether or not the resin material P is sprayed (dropped). The timing of moving the resin material supply device 10 onto the lower mold may be after the placement of the resin material P. In this case, the resin material placement device 12 of the components of the resin material supply device 10 may be moved downward. There is no need to move it over the mold.

次に、シート引張装置１４のドラム１４１を回転させることで可撓性シート１１を該ドラム１４１に巻き付けてゆく。これにより、可撓性シート１１が折返し部１１２の反対側に引かれると共に、折返し部１１２で折返し部材１３が可撓性シート１１の内側の面で押される。そのため、折返し部材１３が可撓性シート１１に接しつつ該可撓性シート１１に対して滑りながら水平部１１１側に移動し、それに伴って折返し部１１２も水平部１１１側に移動する（図３(b)）。なお、このときにはローラ１４２を回転させる必要はない。この折返し部１１２の移動により、水平部１１１上の樹脂材料Ｐは、固定端１１３の反対側から順に、それを支えていた可撓性シート１１及び折返し部材１３が無くなって、キャビティ２１１に落下してゆく。これにより、樹脂材料Ｐは、水平部１１１上でのパターンを維持したまま、下型のキャビティ２１１に供給される。水平部１１１上の樹脂材料Ｐが全て下型のキャビティ２１１に供給されるまで折返し部１１２を移動させる（図３(c)）ことにより、キャビティ２１１への樹脂材料の供給の操作を終了する。   Next, the flexible sheet 11 is wound around the drum 141 by rotating the drum 141 of the sheet pulling device 14. Thereby, the flexible sheet 11 is pulled toward the opposite side of the folded portion 112, and the folded member 13 is pressed by the folded portion 112 on the inner surface of the flexible sheet 11. Therefore, the folded member 13 moves to the horizontal portion 111 side while sliding on the flexible sheet 11 while being in contact with the flexible sheet 11, and the folded portion 112 also moves to the horizontal portion 111 side accordingly (FIG. 3). (b)). At this time, it is not necessary to rotate the roller 142. Due to the movement of the folded portion 112, the resin material P on the horizontal portion 111 drops from the opposite side of the fixed end 113 to the cavity 211 without the flexible sheet 11 and the folded member 13 that supported it. Go on. As a result, the resin material P is supplied to the lower mold cavity 211 while maintaining the pattern on the horizontal portion 111. The operation of supplying the resin material to the cavity 211 is completed by moving the folded portion 112 until all the resin material P on the horizontal portion 111 is supplied to the lower cavity 211 (FIG. 3C).

その後、シート引張装置１４のドラム１４１をこれまでとは逆方向に回転させながら、ローラ１４２を回転させ、折返し部材１３を折返し部１１２側に移動させる（図４）ことにより、折返し部１１２を元（樹脂材料Ｐを水平部１１１上に配置する前）の位置に戻す。これにより、可撓性シート１１も元の位置に戻り、次の樹脂材料供給の作業を行うことができる。   Thereafter, the roller 142 is rotated while rotating the drum 141 of the sheet pulling device 14 in the opposite direction to the conventional one, and the folding member 13 is moved to the folding portion 112 side (FIG. 4). (Before placing the resin material P on the horizontal portion 111). As a result, the flexible sheet 11 also returns to the original position, and the operation of supplying the next resin material can be performed.

シート状樹脂材料ＳＰを用いる場合も同様の動作により、第１実施形態の樹脂材料供給装置１０を用いて下型２１の所定の位置に該シート状樹脂材料ＳＰを配置することができる。この場合、図５に示すように、樹脂材料供給装置１０と下型２１のキャビティ２１１をできるだけ近づけておくことにより、シート状樹脂材料ＳＰの先端がキャビティ２１１に達したときに他端が樹脂材料供給装置１０の可撓性シート１１上に残り、その状態で折返し部材１３を更に移動させることで、シート状樹脂材料ＳＰを所定の位置に供給することができる。   Even when the sheet-shaped resin material SP is used, the same operation can be used to arrange the sheet-shaped resin material SP at a predetermined position of the lower mold 21 using the resin material supply device 10 of the first embodiment. In this case, as shown in FIG. 5, the resin material supply device 10 and the cavity 211 of the lower mold 21 are brought as close as possible, so that when the front end of the sheet-shaped resin material SP reaches the cavity 211, the other end is formed of the resin material. The sheet-shaped resin material SP can be supplied to a predetermined position by remaining on the flexible sheet 11 of the supply device 10 and further moving the folding member 13 in that state.

図６に、シート引張装置の他の例を示す。このシート引張装置１４Ａは、前述のローラ１４２と同様の構成（但し、後述のように動作は異なる）を有するローラ１４２Ａと、固定端１１３の反対側の可撓性シート１１の端部に一端が取り付けられたバネ１４３と、該バネ１４３の他端側が固定される固定部１４４を有する。   FIG. 6 shows another example of the sheet pulling apparatus. This sheet pulling device 14A has a roller 142A having the same configuration as the above-described roller 142 (however, the operation is different as described later), and one end at the end of the flexible sheet 11 opposite to the fixed end 113. It has a spring 143 attached and a fixing portion 144 to which the other end of the spring 143 is fixed.

シート引張装置１４Ａは以下のように使用する。まず、水平部１１１上に樹脂材料Ｐが配置される直前の状態にするために、ローラ１４２Ａを回転させて折返し部材１３を折返し部１１２側に移動させる（図６(a)）。これにより、可撓性シート１１が折返し部１１２側に引かれてバネ１４３が伸びた状態となり、可撓性シート１１及び折返し部材１３がバネ１４３側に引かれるが、ローラ１４２Ａで折返し部材１３を押さえつけることによって可撓性シート１１及び折返し部材１３の位置を固定する。可撓性シート１１の水平部１１１上に樹脂材料Ｐを所定のパターンで配置した後、ローラ１４２Ａを先程とは逆方向に回転させることにより、折返し部材１３を折返し部１１２の反対側に移動させる（図６(b)）。その際、可撓性シート１１がバネ１４３で引かれるため、折返し部材１３が可撓性シート１１に対して滑りながら移動することとなる。水平部１１１上の樹脂材料Ｐが全て下型のキャビティ２１１に供給されるまで折返し部１１２が移動した（図６(c)）後、ローラ１４２Ａを回転させて可撓性シート１１及び折返し部材１３を、樹脂材料Ｐを配置する位置まで戻すことにより、次の樹脂材料Ｐの供給操作を行うことができる。   The sheet tensioning device 14A is used as follows. First, in order to bring the resin material P to a state immediately before the resin material P is disposed on the horizontal portion 111, the roller 142A is rotated to move the folding member 13 toward the folding portion 112 (FIG. 6A). As a result, the flexible sheet 11 is pulled toward the folded portion 112 and the spring 143 is extended, and the flexible sheet 11 and the folded member 13 are pulled toward the spring 143. By pressing down, the positions of the flexible sheet 11 and the folded member 13 are fixed. After arranging the resin material P on the horizontal portion 111 of the flexible sheet 11 in a predetermined pattern, the roller 142A is rotated in a direction opposite to the above, so that the folding member 13 is moved to the opposite side of the folding portion 112. (FIG. 6 (b)). At this time, since the flexible sheet 11 is pulled by the spring 143, the folding member 13 moves while sliding with respect to the flexible sheet 11. After the folded portion 112 moves until all the resin material P on the horizontal portion 111 is supplied to the lower mold cavity 211 (FIG. 6C), the roller 142A is rotated to rotate the flexible sheet 11 and the folded member 13. Is returned to the position where the resin material P is arranged, so that the supply operation of the next resin material P can be performed.

図７に、別の例の折返し部材１３Ａを有する樹脂材料供給装置１０Ａを示す。この折返し部材１３Ａは、折返し部１１２の線に平行（可撓性シート１１の帯の幅方向）な棒材から成る。折返し部材１３Ａの棒材の両端は、樹脂材料供給装置１０の筐体に設けられたガイドレール（図示せず）に保持されており、前述の板状の折返し部材１３と同様に、可撓性シート１１がシート引張装置１４Ａで折返し部１１２の反対側の方向に引かれるのに伴って該方向に移動する。この折返し部材１３Ａは、板状の折返し部材１３とは異なり水平部１１１の全体を支持することはないが、それ以外の動作は板状の折返し部材１３と同様である。   FIG. 7 shows a resin material supply device 10A having a folded member 13A of another example. This folded member 13A is made of a bar material parallel to the line of the folded portion 112 (in the width direction of the band of the flexible sheet 11). Both ends of the bar of the folded member 13A are held by guide rails (not shown) provided on the housing of the resin material supply device 10, and are flexible like the above-mentioned plate-shaped folded member 13. As the sheet 11 is pulled by the sheet pulling device 14A in a direction opposite to the folded portion 112, the sheet 11 moves in the direction. This folded member 13A does not support the entire horizontal portion 111 unlike the plate-shaped folded member 13, but other operations are the same as those of the plate-shaped folded member 13.

図８(a)に、シート引張装置及び折返し部材のさらに別の例を有する樹脂材料供給装置１０Ｂを示す。この例では、折返し部材１３Ｂは、板状の部材である。可撓性シート１１Ｂは、樹脂材料供給装置１０Ｂの筐体（図示せず）に固定された固定端１１３Ｂから折返し部材１３Ｂの板材の側面のうちの１つである折返し部１１２Ｂまで該上面に延び、折返し部１１２Ｂで折返し部材１３Ｂの下面に折返され、折返し部１１２Ｂに対向する折返し部材１３Ｂの端面である第２折返し部１１５Ｂで上面に折返されている。可撓性シート１１Ｂの固定端１１３Ｂの反対側にある端部は樹脂材料供給装置１０Ｂの筐体に対して移動することが可能である（可動端１１４Ｂ）。可動端１１４Ｂは固定端１１３Ｂとバネ１４３Ｂで結ばれており、該バネ１４３Ｂによって固定端１１３Ｂ側に引かれている。折返し部材１３Ｂは、移動装置（図示せず）により折返し部１１２Ｂ側及び第２折返し部１１５Ｂ側に向けて移動可能である。移動機構にはモータやエアシリンダ等を用いることができる。可撓性シート１１Ｂの水平部１１１Ｂの上には、上記と同様の樹脂材料配置装置１２が設けられている。   FIG. 8A shows a resin material supply device 10B having still another example of the sheet pulling device and the folding member. In this example, the folded member 13B is a plate-shaped member. The flexible sheet 11B extends from the fixed end 113B fixed to the housing (not shown) of the resin material supply device 10B to the folded portion 112B, which is one of the side surfaces of the plate member of the folded member 13B, on the upper surface. The folded portion 112B is folded back to the lower surface of the folded member 13B, and is folded back to the upper surface at the second folded portion 115B which is the end surface of the folded member 13B facing the folded portion 112B. The end of the flexible sheet 11B opposite to the fixed end 113B is movable with respect to the housing of the resin material supply device 10B (movable end 114B). The movable end 114B is connected to the fixed end 113B by a spring 143B, and is pulled toward the fixed end 113B by the spring 143B. The folded member 13B is movable toward the folded portion 112B and the second folded portion 115B by a moving device (not shown). A motor, an air cylinder, or the like can be used for the moving mechanism. On the horizontal portion 111B of the flexible sheet 11B, the same resin material placement device 12 as described above is provided.

この樹脂材料供給装置１０Ｂは、前述の樹脂材料供給装置１０と同様の方法により水平部１１１Ｂの上に樹脂材料Ｐを配置した後、下型の上で移動機構によって折返し部材１３Ｂを第２折返し部１１５Ｂ側に向けて移動させる。これにより、可撓性シート１１Ｂの固定端１１３Ｂの位置が固定された状態で折返し部１１２Ｂが第２折返し部１１５Ｂ側に向けて移動してゆき、水平部１１１Ｂ上の樹脂材料Ｐがパターンを維持したまま下型に落下してゆく（図８(b)）。その際、可撓性シート１１Ｂは、可動端１１４Ｂがバネ１４３Ｂによって固定端１１３Ｂ側に引かれているため、張力が保たれ、弛むことがない。水平部１１１Ｂ上の樹脂材料Ｐが全て下型に落下したら折返し部材１３Ｂの移動を停止し、1回の樹脂供給を終了する（同図(c)）。その後、折返し部材１３Ｂを元の位置に戻し、次の樹脂供給を行う。   The resin material supply device 10B arranges the resin material P on the horizontal portion 111B in the same manner as the resin material supply device 10 described above, and then moves the folded member 13B by the moving mechanism on the lower mold to the second folded portion. Move toward 115B side. As a result, the folded portion 112B moves toward the second folded portion 115B while the position of the fixed end 113B of the flexible sheet 11B is fixed, and the resin material P on the horizontal portion 111B maintains the pattern. It falls into the lower mold while keeping it (Fig. 8 (b)). At this time, since the movable end 114B of the flexible sheet 11B is pulled toward the fixed end 113B by the spring 143B, the tension is maintained and the flexible sheet 11B does not loosen. When all of the resin material P on the horizontal portion 111B falls to the lower mold, the movement of the folding member 13B is stopped, and one resin supply is completed (FIG. 13C). Thereafter, the folded member 13B is returned to the original position, and the next resin supply is performed.

図９に、可撓性シート１１の水平部１１１に樹脂材料Ｐを配置するパターンの別の例を示す。(a-1)に示した例では、(b-1)に示す複数個の円板形のキャビティ２１１Ａの形状に合わせて、それら円板に対応する複数個の円形の領域に樹脂材料Ｐを配置する。(a-2)に示した例では、(b-2)に示すように前述の複数個の直方体状のキャビティ２１１よりも大きい、1個のみの直方体状のキャビティ２１１Ｂの形状に合わせて、可撓性シート１１の水平部１１１に樹脂材料Ｐを配置する。キャビティ２１１Ｂは、特許文献１及び２に記載の従来の樹脂材料配置装置において樹脂材料を供給する対象としているものであるが、本実施形態の樹脂材料供給装置１０を用いても当該キャビティ２１１Ｂに樹脂材料を供給することができる。樹脂材料Ｐを配置するパターンはこれらの例に限定されず、任意の形状とすることができる。   FIG. 9 shows another example of a pattern in which the resin material P is arranged on the horizontal portion 111 of the flexible sheet 11. In the example shown in (a-1), the resin material P is applied to a plurality of circular regions corresponding to the disks in accordance with the shapes of the plurality of disk-shaped cavities 211A shown in (b-1). Deploy. In the example shown in (a-2), as shown in (b-2), it is possible to match the shape of only one rectangular cavity 211B, which is larger than the plurality of rectangular cavities 211 described above. The resin material P is disposed on the horizontal portion 111 of the flexible sheet 11. Although the cavity 211B is intended to supply a resin material in the conventional resin material disposition devices described in Patent Documents 1 and 2, even if the resin material supply device 10 of the present embodiment is used, the cavity 211B is filled with resin. Material can be supplied. The pattern for arranging the resin material P is not limited to these examples, and may be any shape.

図１０(a)に、第１実施形態の樹脂材料供給装置１０に下部誘導具を設けた例を示す。下部誘導具１５は、板材１５０に、下型の複数個のキャビティ（後述）に対応して同数の開口部１５１が設けられ、各開口部１５１の下側に筒状部１５２が設けられたものである。下部誘導具１５は、筒状部１５２が下型の各キャビティ２１１の直上に位置するように、可撓性シート１１及び折返し部材１３と下型の間に配置される。板材１５０の上面では、開口部１５１同士が接しており、開口部１５１間に平坦な部分がない。開口部１５１及び筒状部１５２は下に向かって絞られる形状を有している。このような下部誘導具１５を用いることにより、水平部１１１から落下する樹脂材料Ｐを確実にキャビティ２１１に誘導することができる。例えば、やや深いキャビティ２１１に樹脂材料Ｐを供給するために、水平部１１１上に樹脂材料Ｐを高く盛ると、樹脂材料Ｐが水平部１１１から落下する直前にパターンが崩れて少し横に移動するおそれがあるが、そのような場合でも下部誘導具１５を用いれば、樹脂材料Ｐを対象のキャビティ２１１に誘導することができる。あるいは、図１０(b)に示すように、下部誘導具１５と同形状の上部誘導具１５Ａをリニアフィーダ１２２と可撓性シート１１の間に設け、可撓性シート１１の水平部１１１に樹脂材料Ｐを配置する際に該上部誘導具１５Ａで樹脂材料Ｐを誘導するようにしてもよい。   FIG. 10A shows an example in which a lower guide is provided in the resin material supply device 10 of the first embodiment. The lower guide 15 has a plate member 150 in which the same number of openings 151 are provided corresponding to a plurality of lower cavities (described later), and a tubular portion 152 is provided below each of the openings 151. It is. The lower guide 15 is disposed between the flexible sheet 11 and the folded member 13 and the lower die so that the tubular portion 152 is located immediately above each cavity 211 of the lower die. On the upper surface of the plate 150, the openings 151 are in contact with each other, and there is no flat portion between the openings 151. The opening 151 and the cylindrical portion 152 have a shape that can be squeezed downward. By using such a lower guide 15, the resin material P falling from the horizontal portion 111 can be reliably guided to the cavity 211. For example, when the resin material P is piled high on the horizontal portion 111 in order to supply the resin material P to the slightly deep cavity 211, the pattern collapses immediately before the resin material P falls from the horizontal portion 111, and the resin material P moves slightly laterally. Although there is a possibility that the resin material P can be guided to the target cavity 211 by using the lower guide 15 even in such a case. Alternatively, as shown in FIG. 10 (b), an upper guide tool 15A having the same shape as the lower guide tool 15 is provided between the linear feeder 122 and the flexible sheet 11, and the resin is provided on the horizontal portion 111 of the flexible sheet 11. When arranging the material P, the resin material P may be guided by the upper guide 15A.

図１１に、第１実施形態の樹脂材料供給装置１０に除電部を設けた例を示す。(a)は、折返し部１１２の近傍に除電ブラシから成る除電部１６を設けたものを示し、(b)は、折返し部１１２の近傍に除電に必要なイオンを供給する除電部（イオナイザ）１６Ａを設けたものを示す。これら除電部１６及び１６Ａは、折返し部１１２の移動に従って、移動機構（図示せず）により移動する。いずれの例でも、樹脂材料Ｐと可撓性シート１１の摩擦により生じる静電気を、キャビティ２１１に供給される直前の樹脂材料Ｐから除去することができる。   FIG. 11 shows an example in which a static elimination unit is provided in the resin material supply device 10 of the first embodiment. (a) shows a configuration in which a static elimination unit 16 made of a static elimination brush is provided in the vicinity of the turning unit 112, and (b) is a static elimination unit (ionizer) 16A that supplies ions necessary for static elimination to the vicinity of the turning unit 112. Is shown. These static elimination units 16 and 16A are moved by a movement mechanism (not shown) in accordance with the movement of the turnback unit 112. In any case, static electricity generated by friction between the resin material P and the flexible sheet 11 can be removed from the resin material P immediately before being supplied to the cavity 211.

次に、図１２を参照しつつ、半導体チップ等の電子部品を樹脂で封止した樹脂封止品を製造する方法を説明する。この樹脂封止品製造方法では、第１実施形態の樹脂材料供給装置１０と、キャビティ２１１が設けられた下型２１と、該下型に対向する上型２２を有する圧縮成形装置を使用する。   Next, a method of manufacturing a resin-sealed product in which electronic components such as a semiconductor chip are sealed with a resin will be described with reference to FIG. In this method for manufacturing a resin-sealed product, a compression molding apparatus having the resin material supply device 10 of the first embodiment, a lower die 21 having a cavity 211, and an upper die 22 facing the lower die is used.

まず、下型２１のキャビティ２１１の表面を離型フィルム２１２で被覆する。この被覆は、キャビティ２１１の上面に離型フィルム２１２を張設したうえで、キャビティ２１１側から空気を吸引することにより行うことができる。また、上型２２には、表面に電子部品Ｃがキャビティ２１１と同数個取り付けられた基板Ｓを、電子部品Ｃが下側になるように装着する。そして、下型２１と上型２２の間に、樹脂材料供給装置１０を配置する(a)。なお、離型フィルム２１２を使用しない態様を採用することもできる。   First, the surface of the cavity 211 of the lower mold 21 is covered with a release film 212. This coating can be performed by stretching the release film 212 on the upper surface of the cavity 211 and then sucking air from the cavity 211 side. Further, the upper die 22 is mounted with a substrate S having the same number of electronic components C as the cavities 211 on the surface so that the electronic components C are on the lower side. Then, the resin material supply device 10 is disposed between the lower mold 21 and the upper mold 22 (a). Note that an embodiment in which the release film 212 is not used may be employed.

次に、前述のように樹脂材料配置装置１２から可撓性シート１１の水平部１１１に、前記複数個のキャビティ２１１に対応したパターンで樹脂材料Ｐを配置する(b)。そして、前述のように可撓性シート１１を折返し部１１２の反対側に引くと共に折返し部材１３を折返し部１１２の反対側に向かう方向に移動させることで、折返し部１１２を該方向に移動させることにより、水平部１１１上の樹脂材料Ｐをキャビティ２１１に供給する(c)。その後、下型２１と上型２２の間から樹脂材料供給装置１０を除去し、下型２１を加熱することにより各キャビティ２１１内の樹脂材料Ｐを溶融させる(d)。そのうえで、下型２１と上型２２を接近させて基板Ｓ表面の各電子部品Ｃを、対応するキャビティ２１１内の樹脂材料Ｐに浸漬させたうえで、下型２１と上型２２を型締めして(e)、樹脂材料Ｐを硬化させる。その後、下型２１と上型２２を離すと、樹脂材料Ｐが硬化した樹脂は離型フィルム２１２が存在することによりキャビティ２１１から離れ、基板Ｓ表面の電子部品Ｃが該樹脂で封止された複数個の樹脂成形品が得られる(f)。
Next, as described above, the resin material P is arranged on the horizontal portion 111 of the flexible sheet 11 from the resin material arrangement device 12 in a pattern corresponding to the plurality of cavities 211 (b). Then, as described above, by pulling the flexible sheet 11 to the opposite side of the folded portion 112 and moving the folded member 13 in the direction toward the opposite side of the folded portion 112, the folded portion 112 is moved in the direction. Thereby, the resin material P on the horizontal portion 111 is supplied to the cavity 211 (c). Thereafter, the resin material supply device 10 is removed from between the lower mold 21 and the upper mold 22, and the resin material P in each cavity 211 is melted by heating the lower mold 21 (d). Then, the lower mold 21 and the upper mold 22 are brought close to each other, and each electronic component C on the surface of the substrate S is immersed in the resin material P in the corresponding cavity 211, and then the lower mold 21 and the upper mold 22 are clamped. (E), the resin material P is cured. Thereafter, when the lower mold 21 and the upper mold 22 are separated, the resin in which the resin material P is cured is separated from the cavity 211 due to the presence of the release film 212, and the electronic component C on the surface of the substrate S is sealed with the resin. A plurality of resin molded products are obtained (f) .

(2) 第２実施形態
図１３を参照しつつ、本発明に係る樹脂材料供給装置の第２実施形態を説明する。第２実施形態の樹脂材料供給装置１０Ｃは、可撓性シート１１Ｃと、樹脂材料配置装置１２と、折返し部材１３Ｃと、第２折返し部材１７を有する。樹脂材料配置装置１２は第１実施形態のものと同様であるため、詳細な説明は省略する。 (2) Second Embodiment A second embodiment of the resin material supply device according to the present invention will be described with reference to FIG. The resin material supply device 10C of the second embodiment includes a flexible sheet 11C, a resin material placement device 12, a folded member 13C, and a second folded member 17. Since the resin material placement device 12 is the same as that of the first embodiment, detailed description is omitted.

可撓性シート１１Ｃは、シリコーンゴム製の帯の両端を繋いで環状にしたものである。折返し部材１３Ｃ及び第２折返し部材１７はいずれも円柱状であって前述の板状の折返し部材１３と同じ材料から成る棒材であり、可撓性シート１１Ｃの環の内側に、軸を可撓性シート１１Ｃの帯の幅方向に向けて略水平且つ互いに略平行に配置されている。折返し部材１３Ｃと第２折返し部材１７は、上下の可撓性シート１１Ｃが軽く引っ張られるように距離をとって配置されている。これにより、可撓性シート１１Ｃには、折返し部材１３Ｃ及び第２折返し部材１７の上側の両部材間に水平部１１１Ｃが、折返し部材１３Ｃ側に折返し部１１２Ｃが、第２折返し部材１７側に第２折返し部１１５Ｃが、それぞれ形成されている。折返し部材１３Ｃには、該折返し部材１３Ｃをその軸を中心に回転させるモータ（図示せず）が接続されている。なお、このモータは、折返し部材１３Ｃの代わりに第２折返し部材１７に接続してもよい。さらに、折返し部材１３Ｃ及び第２折返し部材１７には、両者の間隔を維持しつつ該両者を略水平且つ可撓性シート１１Ｃの帯の長手方向に移動させる移動機構（図示せず）が設けられている。この移動機構は例えば、折返し部材１３Ｃ及び第２折返し部材１７を軸方向に回転可能に共通の筐体に保持しておき、該筐体を移動させるアクチュエータを用いることで実現できる。   The flexible sheet 11C is formed by connecting both ends of a band made of silicone rubber into an annular shape. The folded member 13C and the second folded member 17 are both cylindrical and are rods made of the same material as the above-mentioned plate-shaped folded member 13. The shaft is flexible inside the ring of the flexible sheet 11C. Are arranged substantially horizontally and substantially parallel to each other in the width direction of the strip of the conductive sheet 11C. The folded member 13C and the second folded member 17 are arranged at a distance so that the upper and lower flexible sheets 11C are lightly pulled. Thereby, in the flexible sheet 11C, the horizontal portion 111C is provided between the upper members of the folded member 13C and the second folded member 17, the folded portion 112C is located on the folded member 13C side, and the horizontal portion 111C is located on the second folded member 17 side. Two folded portions 115C are respectively formed. A motor (not shown) that rotates the turning member 13C about its axis is connected to the turning member 13C. This motor may be connected to the second folded member 17 instead of the folded member 13C. Further, the folding member 13C and the second folding member 17 are provided with a movement mechanism (not shown) for moving the both substantially horizontally and in the longitudinal direction of the band of the flexible sheet 11C while maintaining the interval between them. ing. This moving mechanism can be realized, for example, by holding the folded member 13C and the second folded member 17 in a common housing so as to be rotatable in the axial direction, and using an actuator that moves the housing.

図１４を参照しつつ、第２実施形態の樹脂材料供給装置１０Ｃの動作を説明する。
まず、キャビティ２１１の上に水平部１１１Ｃが配置されるように、樹脂材料供給装置１０Ｃを下型の上に移動させる。そして、第１実施形態と同様の方法により、樹脂材料配置装置１２から水平部１１１Ｃに樹脂材料Ｐを所定のパターンになるように配置する(a)。なお、第１実施形態の場合と同様に、樹脂材料供給装置１０Ｃを下型の上に移動させるタイミングは、樹脂材料Ｐを水平部１１１Ｃに配置した後でもよい。 The operation of the resin material supply device 10C according to the second embodiment will be described with reference to FIG.
First, the resin material supply device 10C is moved above the lower mold so that the horizontal portion 111C is arranged above the cavity 211. Then, in the same manner as in the first embodiment, the resin material P is arranged in a predetermined pattern from the resin material arrangement device 12 on the horizontal portion 111C (a). As in the case of the first embodiment, the timing of moving the resin material supply device 10C onto the lower mold may be after the resin material P is disposed on the horizontal portion 111C.

次に、折返し部材１３Ｃを、折返し部１１２Ｃにおいて上側の可撓性シート１１Ｃが下側に移動する方向に回転させつつ、折返し部材１３Ｃ及び第２折返し部材１７を折返し部１１２Ｃの反対側の方向に略水平に移動させる(b)。これにより、折返し部材１３Ｃに対して（折返し部材１３Ｃから見て）可撓性シート１１Ｃが該折返し部材１３Ｃ側に移動してゆき、それにより、可撓性シート１１Ｃ（の移動前の水平部１１１Ｃ）上に配置された樹脂材料Ｐが、折返し部材１３Ｃ側から順に折返し部１１２Ｃからキャビティ２１１に落下してゆく。その際、折返し部材１３Ｃ及び第２折返し部材１７を略水平に移動させる速さを、折返し部材１３Ｃに対する可撓性シート１１Ｃの移動の速さと同じとすることにより、樹脂材料Ｐは、水平部１１１Ｃ上でのパターンを維持したまま、その場からキャビティ２１１に落下する。樹脂材料Ｐが全て可撓性シート１１Ｃから落下したら(c)、折返し部材１３Ｃ及び第２折返し部材１７の移動を停止する。   Next, while rotating the folded member 13C in the direction in which the upper flexible sheet 11C moves downward in the folded portion 112C, the folded member 13C and the second folded member 17 are moved in the direction opposite to the folded portion 112C. It is moved almost horizontally (b). As a result, the flexible sheet 11C moves toward the folded member 13C with respect to the folded member 13C (as viewed from the folded member 13C), whereby the horizontal portion 111C of the flexible sheet 11C (before the movement of the flexible sheet 11C) is moved. ) The resin material P disposed on the upper part falls from the folded part 112C to the cavity 211 in order from the folded member 13C side. At this time, by setting the speed at which the folded member 13C and the second folded member 17 are moved substantially horizontally to be the same as the speed of movement of the flexible sheet 11C with respect to the folded member 13C, the resin material P becomes While maintaining the pattern above, it falls into the cavity 211 from the place. When all of the resin material P falls from the flexible sheet 11C (c), the movement of the folded member 13C and the second folded member 17 is stopped.

上記の動作の例では、折返し部材１３Ｃ及び第２折返し部材１７の移動の速さは、折返し部材１３Ｃに対する可撓性シート１１Ｃの移動の速さと同じとしたが、これら折返し部材１３Ｃ及び第２折返し部材１７をより速く移動させることにより、水平部１１１Ｃ上でのパターンよりも該移動方向に伸張したパターンで樹脂材料Ｐを下型に供給することができる。一方、折返し部材１３Ｃ及び第２折返し部材１７をより遅く移動させることにより、水平部１１１Ｃ上でのパターンよりも該移動方向に圧縮したパターンで樹脂材料Ｐを下型に供給することができる。   In the above operation example, the moving speed of the folding member 13C and the second folding member 17 is the same as the moving speed of the flexible sheet 11C with respect to the folding member 13C. By moving the member 17 faster, the resin material P can be supplied to the lower mold in a pattern that extends in the moving direction than the pattern on the horizontal portion 111C. On the other hand, by moving the folded member 13C and the second folded member 17 more slowly, the resin material P can be supplied to the lower mold in a pattern compressed in the moving direction more than the pattern on the horizontal portion 111C.

第２実施形態の樹脂材料供給装置１０Ｃにおいても、第１実施形態と同様に誘導具１５や除電部１６を用いてもよい。   In the resin material supply device 10C of the second embodiment, the guide 15 and the charge removing section 16 may be used similarly to the first embodiment.

(3) 複数の圧縮成形装置の下型に樹脂材料を供給する構成の例
図１５を参照しつつ、本発明に係る樹脂材料供給装置において複数の圧縮成形装置の下型に樹脂材料を供給する構成の例を示す。図１５は、1組の圧縮成形装置が収容された圧縮成形モジュール３１を有する圧縮成形ユニット３０を示している。ここでは圧縮成形モジュール３１を1方向に複数個接続した例を説明する。圧縮成形モジュール３１の個数は任意である。また、圧縮成形モジュール３１は互いに（他の圧縮成形モジュール３１に対して）着脱可能である。これにより、使用状況に応じて任意に増減することができる。また、圧縮成形ユニット３０は、圧縮成形モジュール３１が1個のみである場合にも、該圧縮成形モジュール３１が複数個である場合と同様に使用することができる。 (3) Example of configuration in which resin material is supplied to lower dies of a plurality of compression molding devices Referring to FIG. 15, the resin material is supplied to the lower dies of a plurality of compression molding devices in a resin material supply device according to the present invention. The example of a structure is shown. FIG. 15 shows a compression molding unit 30 having a compression molding module 31 in which a set of compression molding devices is housed. Here, an example in which a plurality of compression molding modules 31 are connected in one direction will be described. The number of compression molding modules 31 is arbitrary. The compression molding modules 31 are detachable from each other (with respect to other compression molding modules 31). Thereby, it can be arbitrarily increased or decreased according to the use situation. Further, the compression molding unit 30 can be used in the case where only one compression molding module 31 is provided, as in the case where the number of the compression molding modules 31 is plural.

圧縮成形ユニット３０は、圧縮成形モジュール３１の他に、樹脂材料・基板供給モジュール３２と、樹脂成形品搬出モジュール３３を有する。樹脂材料・基板供給モジュール３２は、第１実施形態の樹脂材料供給装置１０を1組有している。樹脂材料供給装置１０の各構成要素のうち樹脂材料配置装置１２は樹脂材料・基板供給モジュール３２内に固定されているが、それ以外の構成要素（可撓性シート１１、折返し部材１３、シート引張装置１４。誘導具１５や除電部１６を用いる場合にはそれらも同様。）は、各構成要素間の位置関係を維持しつつ、後述の搬送装置３４により樹脂材料・基板供給モジュール３２外に移動可能である。以下、これらの移動可能な構成要素をまとめて、（樹脂材料供給装置１０の）移動部１９と呼ぶ。樹脂材料・基板供給モジュール３２内には更に、表面に電子部品Ｃが取り付けられた基板Ｓを保管する基板保管部３２２を有する。なお、ここでは第１実施形態の樹脂材料供給装置１０を用いる例を示したが、第２実施形態の樹脂材料供給装置１０Ｃを用いる場合にも同様に、樹脂材料配置装置１２は樹脂材料・基板供給モジュール３２内に固定し、それ以外の構成要素を移動可能にすればよい。   The compression molding unit 30 includes a resin material / substrate supply module 32 and a resin molded product unloading module 33 in addition to the compression molding module 31. The resin material / substrate supply module 32 has one set of the resin material supply device 10 of the first embodiment. Among the components of the resin material supply device 10, the resin material placement device 12 is fixed in the resin material / substrate supply module 32, but the other components (the flexible sheet 11, the folded member 13, the sheet tension member, The device 14 is also moved when the guiding tool 15 and the static elimination unit 16 are used.) The transport device 34 described later moves out of the resin material / substrate supply module 32 while maintaining the positional relationship between the components. It is possible. Hereinafter, these movable components are collectively referred to as a moving unit 19 (of the resin material supply device 10). The resin material / substrate supply module 32 further has a substrate storage section 322 for storing a substrate S having an electronic component C mounted on its surface. Although the example in which the resin material supply device 10 of the first embodiment is used is shown here, the resin material disposition device 12 similarly applies to the case of using the resin material supply device 10C of the second embodiment. What is necessary is just to fix in the supply module 32 and to make other components movable.

樹脂成形品搬出モジュール３３は、搬送装置３４により圧縮成形モジュール３１から搬出された、圧縮成形後の樹脂封止品が表面に形成された基板Ｓを保管する樹脂成形品形成済基板保管部３３１を有する。   The resin molded product unloading module 33 includes a resin molded product formed substrate storage unit 331 that stores the substrate S on which a resin-encapsulated product after compression molding is formed and which is unloaded from the compression molding module 31 by the transport device 34. Have.

搬送装置３４は、樹脂材料・基板供給モジュール３２と複数の圧縮成形モジュール３１と樹脂成形品搬出モジュール３３を貫いて設けられた搬送経路３５内で、樹脂材料供給装置１０の移動部１９や基板Ｓを移動させる装置である。また、各圧縮成形モジュール３１内では、搬送経路３５と圧縮成形装置を結ぶ副搬送経路３１１が設けられており、移動部１９や基板Ｓが搬送装置３４により搬送経路３５から圧縮成形装置に搬送されるようになっている。   The transfer device 34 includes a transfer path 35 extending through the resin material / substrate supply module 32, the plurality of compression molding modules 31, and the resin molded product unloading module 33. This is a device for moving. In each compression molding module 31, a sub-transport path 311 connecting the transport path 35 and the compression molding apparatus is provided, and the moving unit 19 and the substrate S are transported from the transport path 35 to the compression molding apparatus by the transport apparatus 34. It has become so.

圧縮成形ユニット３０の動作を説明する。まず、樹脂材料・基板供給モジュール３２の基板保管部３２２から、複数個の圧縮成形モジュール３１のうちの１つに基板Ｓを搬送し、該圧縮成形モジュール３１内の上型に該基板を装着する。次に、樹脂材料・基板供給モジュール３２内で、樹脂材料供給装置１０の樹脂材料配置装置１２から樹脂材料Ｐを所定のパターンで可撓性シート１１の水平部１１１上に配置する。続いて、樹脂材料Ｐが配置された樹脂材料供給装置１０の移動部１９を、先ほど基板Ｓが搬送された圧縮成形モジュール３１に搬送し、該圧縮成形モジュール３１内の下型２１に、水平部１１１上の樹脂材料Ｐを供給する。その際の樹脂材料Ｐの供給方法は、第１実施形態で説明した通りである。その後、該圧縮成形モジュール３１において、搬送装置３４により移動部１９を除去し、樹脂材料Ｐを加熱して溶融したうえで型締めする。そして、樹脂が固化して樹脂成形品が形成された後、搬送装置３４により、基板Ｓを圧縮成形モジュール３１から樹脂成形品搬出モジュール３３に搬送することにより、1個の圧縮成形モジュール３１における1枚の基板Ｓに対する処理が終了する。   The operation of the compression molding unit 30 will be described. First, the substrate S is transported from the substrate storage unit 322 of the resin material / substrate supply module 32 to one of the plurality of compression molding modules 31, and the substrate is mounted on the upper mold in the compression molding module 31. . Next, in the resin material / substrate supply module 32, the resin material P is arranged on the horizontal portion 111 of the flexible sheet 11 in a predetermined pattern from the resin material arrangement device 12 of the resin material supply device 10. Subsequently, the moving part 19 of the resin material supply device 10 on which the resin material P is arranged is transported to the compression molding module 31 to which the substrate S has been transported earlier, and the lower part 21 in the compression molding module 31 The resin material P on 111 is supplied. The method of supplying the resin material P at this time is as described in the first embodiment. After that, in the compression molding module 31, the transfer unit 19 is removed by the transfer device 34, and the resin material P is heated and melted, and then clamped. Then, after the resin is solidified to form a resin molded product, the substrate S is transported from the compression molding module 31 to the resin molded product unloading module 33 by the transport device 34, so that one of the compression molding modules 31 The processing for the substrates S ends.

上記の動作の説明では1個の圧縮成形モジュール３１に着目したが、下型２１に樹脂材料を供給してから樹脂成形品が得られるまでにある程度の時間を要する。そこで、この時間に他の圧縮成形モジュール３１に対して基板Ｓの搬送及び下型２１への樹脂材料の供給を行うことにより、複数個の圧縮成形モジュール３１に対して同時並行で処理を行うことができ、樹脂成形品を効率よく製造することができる。   In the above description of the operation, attention is paid to one compression molding module 31. However, it takes a certain time from supplying the resin material to the lower mold 21 to obtaining a resin molded product. Therefore, by carrying the substrate S to another compression molding module 31 and supplying the resin material to the lower mold 21 at this time, a plurality of compression molding modules 31 can be processed simultaneously and in parallel. And a resin molded product can be manufactured efficiently.

１０、１０Ａ、１０Ｂ、１０Ｃ…樹脂材料供給装置
１１、１１Ｂ…可撓性シート
１１１、１１１Ｂ、１１１Ｃ…可撓性シートの水平部
１１２、１１２Ｂ、１１２Ｃ…可撓性シートの折返し部
１１３、１１３Ｂ…可撓性シートの固定端
１１４Ｂ…可撓性シートの可動端
１１５Ｃ…可撓性シートの第２折返し部
１２…樹脂材料配置装置
１２１…ホッパ
１２２…リニアフィーダ
１３、１３Ａ、１３Ｂ、１３Ｃ…折返し部材
１４、１４Ａ…シート引張装置
１４１…シート引張装置のドラム
１４２、１４２Ａ…ローラ
１４３、１４３Ｂ…バネ
１４４…固定部
１５…下部誘導具
１５Ａ…上部誘導具
１５０…誘導具の板材
１５１…誘導具の開口部
１５２…誘導具の筒状部
１６、１６Ａ…除電部
１７…第２折返し部材
１９…移動部
２１…下型
２１１、２１１Ａ、２１１Ｂ…キャビティ
２１２…離型フィルム
２２…上型
３０…圧縮成形ユニット
３１…圧縮成形モジュール
３１１…副搬送経路
３２…樹脂材料・基板供給モジュール
３２２…基板保管部
３３…樹脂成形品搬出モジュール
３３１…樹脂成形品形成済基板保管部
３４…搬送装置
３５…搬送経路
Ｃ…電子部品
Ｐ…樹脂材料
ＳＰ…シート状樹脂材料
Ｓ…基板 10, 10A, 10B, 10C: Resin material supply device 11, 11B: Flexible sheets 111, 111B, 111C: Horizontal portions 112, 112B, 112C of flexible sheets: Folding portions 113, 113B of flexible sheets Flexible sheet fixed end 114B Flexible sheet movable end 115C Flexible sheet second folded portion 12 Resin material placement device 121 Hopper 122 Linear feeders 13, 13A, 13B, 13C Folded member 14, 14A: Sheet tensioning device 141: Drum 142, 142A of sheet tensioning device: Rollers 143, 143B: Spring 144: Fixed portion 15: Lower guide 15A: Upper guide 150: Guide plate 151: Opening of guide Part 152: cylindrical parts 16 and 16A of the guiding tool ... static elimination part 17 ... second folded member 19 ... moving part 21 ... lower mold 211, 211A 211B ... cavity 212 ... release film 22 ... upper die 30 ... compression molding unit 31 ... compression molding module 311 ... sub-transport path 32 ... resin material / substrate supply module 322 ... substrate storage unit 33 ... resin molded product unloading module 331 ... resin Molded product formed substrate storage unit 34 ... Transport device 35 ... Transport path C ... Electronic component P ... Resin material SP ... Sheet resin material S ... Substrate

Claims (10)

圧縮成形装置の下型に粉状、顆粒状又はシート状の樹脂材料を供給する装置であって、
a) 水平に配置された水平部と、該水平部の一端に設けられた、下方への折返し部を有する、前記下型の上に配置される可撓性シートと、
b) 前記樹脂材料を前記水平部の上に所定のパターンとなるように配置する樹脂材料配置部と、
c) 前記折返し部において前記可撓性シートの下側に接しつつ該可撓性シートに対して滑りながら移動することにより該折返し部を前記水平部側に移動させる折返し部材と
を備えることを特徴とする樹脂材料供給装置。 A device for supplying a powdery, granular or sheet-like resin material to a lower mold of a compression molding device,
a) a horizontal portion disposed horizontally, and a flexible sheet provided on one end of the horizontal portion, having a folded portion downward, disposed on the lower mold,
b) a resin material arranging portion for arranging the resin material on the horizontal portion in a predetermined pattern;
c) a folding member that moves the folded portion toward the horizontal portion by sliding while moving against the flexible sheet while being in contact with the lower side of the flexible sheet at the folded portion. Resin material supply device. 前記折返し部材が、前記折返し部に端部が配置され前記可撓性シートの前記水平部を下側から支持する板材であることを特徴とする請求項１に記載の樹脂材料供給装置。 2. The resin material supply device according to claim 1 , wherein the folded member is a plate member having an end arranged at the folded portion and supporting the horizontal portion of the flexible sheet from below. 3. 圧縮成形装置の下型に粉状、顆粒状又はシート状の樹脂材料を供給する装置であって、
a) 水平に配置された水平部と、該水平部の一端に設けられた、下方への折返し部を有する、前記下型の上に配置される可撓性シートと、
b) 前記樹脂材料を前記水平部の上に所定のパターンとなるように配置する樹脂材料配置部と、
c) 前記折返し部において前記可撓性シートの下側に接しつつ該折返し部を前記水平部側に移動させる折返し部材と、
d) 前記折返し部の移動範囲の下側に配置された、該折返し部から落下する樹脂材料を前記下型の所定の範囲内に誘導する誘導具と
を備えることを特徴とする樹脂材料供給装置。 A device for supplying a powdery, granular or sheet-like resin material to a lower mold of a compression molding device,
a) a horizontal portion disposed horizontally, and a flexible sheet provided on one end of the horizontal portion, having a folded portion downward, disposed on the lower mold,
b) a resin material arranging portion for arranging the resin material on the horizontal portion in a predetermined pattern;
c) a folding member that moves the folded portion toward the horizontal portion while contacting the lower side of the flexible sheet at the folded portion;
d) a guide that is disposed below the range of movement of the folded portion and guides the resin material falling from the folded portion into a predetermined range of the lower mold.
A resin material supply device comprising: 圧縮成形装置の下型に粉状、顆粒状又はシート状の樹脂材料を供給する装置であって、
a) 水平に配置された水平部と、該水平部の一端に設けられた、下方への折返し部を有する、前記下型の上に配置される可撓性シートと、
b) 前記樹脂材料を前記水平部の上に所定のパターンとなるように配置する樹脂材料配置部と、
c) 前記折返し部において前記可撓性シートの下側に接しつつ該折返し部を前記水平部側に移動させる折返し部材と、
d) 前記折返し部の移動に伴って移動することで該折返し部の近傍に配置される、前記樹脂材料に生じる静電気を除電する除電部と
を備えることを特徴とする樹脂材料供給装置。 A device for supplying a powdery, granular or sheet-like resin material to a lower mold of a compression molding device,
a) a horizontal portion disposed horizontally, and a flexible sheet provided on one end of the horizontal portion, having a folded portion downward, disposed on the lower mold,
b) a resin material arranging portion for arranging the resin material on the horizontal portion in a predetermined pattern;
c) a folding member that moves the folded portion toward the horizontal portion while contacting the lower side of the flexible sheet at the folded portion;
d) a static eliminator for eliminating static electricity generated in the resin material, which is disposed near the folded portion by moving along with the movement of the folded portion;
A resin material supply device comprising: 前記可撓性シート及び前記折返し部材を、複数設けられた圧縮成形装置のいずれかの下型の上に搬送する搬送部を備えることを特徴とする請求項１〜４のいずれかに記載の樹脂材料供給装置。 The resin according to any one of claims 1 to 4 , further comprising a transport unit configured to transport the flexible sheet and the folded member onto a lower mold of one of a plurality of compression molding devices. Material supply device. 粉状、顆粒状又はシート状の樹脂材料を用いて樹脂成形品を製造する圧縮成形装置であって、
樹脂成形品が成形される空間であるキャビティを有する下型と、
前記下型に相対向する上型と、
請求項１〜５のいずれかに記載の樹脂材料供給装置と
を備えることを特徴とする圧縮成形装置。 A compression molding apparatus for producing a resin molded product using a powdery, granular or sheet-like resin material,
A lower mold having a cavity that is a space in which the resin molded product is molded;
An upper die opposed to the lower die,
Compression molding apparatus characterized by comprising a resin material supply device according to any one of claims 1-5. 粉状、顆粒状又はシート状の樹脂材料を用いて樹脂成形品を製造する圧縮成形モジュールを備える圧縮成形装置であって、
前記圧縮成形モジュールに設けられた、樹脂成形品が成形される空間であるキャビティを有する下型と、
前記圧縮成形モジュールに設けられた、前記下型に相対向する上型と、
請求項１〜５のいずれかに記載の樹脂材料供給装置と
を備え、
前記圧縮成形モジュールが他の圧縮成形モジュールに対して着脱可能である
ことを特徴とする圧縮成形装置。 A compression molding apparatus including a compression molding module for producing a resin molded product using a powdery, granular, or sheet-like resin material,
Provided in the compression molding module, a lower mold having a cavity which is a space where a resin molded product is molded,
An upper mold provided in the compression molding module, facing the lower mold,
A resin material supply device according to any one of claims 1 to 5 ,
A compression molding apparatus, wherein the compression molding module is detachable from another compression molding module. 圧縮成形装置の下型に粉状、顆粒状又はシート状の樹脂材料を供給する方法であって、
水平に配置された水平部と、該水平部の一端に設けられた、下方への折返し部を有する可撓性シートの該水平部の上に、前記樹脂材料を所定のパターンとなるように配置し、
前記折返し部において前記可撓性シートの下側に接しつつ折返し部材を前記可撓性シートに対して滑らせながら前記水平部側に移動させることにより、前記水平部上の前記樹脂材料を該折返し部から前記下型に供給する
ことを特徴とする樹脂材料供給方法。 A method of supplying a powdery, granular or sheet-like resin material to a lower mold of a compression molding apparatus,
The resin material is arranged in a predetermined pattern on the horizontal portion of a flexible sheet having a horizontally disposed horizontal portion and a downwardly folded portion provided at one end of the horizontal portion. And
The resin material on the horizontal portion is folded by moving the folding member toward the horizontal portion while sliding the folding member against the flexible sheet while being in contact with the lower side of the flexible sheet at the folded portion. A resin material supply method, wherein the resin material is supplied to the lower mold from a part. 圧縮成形装置の下型に粉状、顆粒状又はシート状の樹脂材料を供給する方法であって、A method of supplying a powdery, granular or sheet-like resin material to a lower mold of a compression molding apparatus,
水平に配置された水平部と、該水平部の一端に設けられた、下方への折返し部を有する可撓性シートの該水平部の上に、前記樹脂材料を所定のパターンとなるように配置し、  The resin material is arranged in a predetermined pattern on the horizontal portion of a flexible sheet having a horizontally disposed horizontal portion and a downwardly folded portion provided at one end of the horizontal portion. And
前記折返し部の移動範囲の下側に、該折返し部から落下する樹脂材料を前記下型の所定の範囲内に誘導する誘導具を配置し、On the lower side of the movement range of the folded portion, a guiding tool that guides the resin material falling from the folded portion into a predetermined range of the lower mold is arranged.
前記折返し部において前記可撓性シートの下側に接しつつ折返し部材を前記水平部側に移動させることにより、前記水平部上の前記樹脂材料を該折返し部から前記下型に供給するThe resin material on the horizontal portion is supplied from the folded portion to the lower mold by moving the folded member toward the horizontal portion while contacting the lower side of the flexible sheet at the folded portion.
ことを特徴とする樹脂材料供給方法。A method for supplying a resin material, comprising: 圧縮成形装置の下型に粉状、顆粒状又はシート状の樹脂材料を供給する方法であって、A method of supplying a powdery, granular or sheet-like resin material to a lower mold of a compression molding apparatus,
水平に配置された水平部と、該水平部の一端に設けられた、下方への折返し部を有する可撓性シートの該水平部の上に、前記樹脂材料を所定のパターンとなるように配置し、The resin material is arranged in a predetermined pattern on the horizontal portion of a flexible sheet having a horizontally disposed horizontal portion and a downwardly folded portion provided at one end of the horizontal portion. And
前記折返し部において前記可撓性シートの下側に接しつつ折返し部材を前記水平部側に移動させることにより、前記水平部上の前記樹脂材料を該折返し部から前記下型に供給し、By moving the folded member to the horizontal portion side while contacting the lower side of the flexible sheet in the folded portion, the resin material on the horizontal portion is supplied from the folded portion to the lower mold,
前記折返し部の近傍において、前記樹脂材料に生じる静電気を除電するIn the vicinity of the folded portion, static electricity generated in the resin material is eliminated.
ことを特徴とする樹脂材料供給方法。A method for supplying a resin material, comprising:
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JP2015250316A JP6654887B2 (en) 2015-12-22 2015-12-22 Resin material supply apparatus and method, and compression molding apparatus
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019193820A (en) * 2019-06-20 2019-11-07 株式会社オリンピア Game machine
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JP2019193834A (en) * 2019-06-25 2019-11-07 株式会社オリンピア Game machine

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10199299B1 (en) 2017-08-07 2019-02-05 Micron Technology, Inc. Semiconductor mold compound transfer system and associated methods
CN114589852A (en) * 2022-03-17 2022-06-07 黄高维 Resin well lid loading attachment for industrial production

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815153Y2 (en) * 1973-06-16 1983-03-26 株式会社クボタ Press the press button to press the button.
JPS5981123A (en) * 1982-11-01 1984-05-10 Toyota Motor Corp Method and apparatus for supplying plastic resin material to compression molding force
JPS6389311A (en) * 1986-10-03 1988-04-20 Mikuni Seisakusho:Kk Supply of base material for heating molding of stamping molding tool
JPH0449127U (en) * 1990-08-30 1992-04-24
US6096379A (en) * 1998-03-20 2000-08-01 Eckhoff; Paul S. Radiation processing apparatus and method
JP2000326328A (en) * 1999-05-24 2000-11-28 Meiwa Ind Co Ltd Carrying method for heat softened resin sheet
JP2003171009A (en) * 2001-12-04 2003-06-17 Sainekkusu:Kk Powdered resin supply apparatus for semiconductor sealing
JP4791851B2 (en) * 2006-02-24 2011-10-12 Ｔｏｗａ株式会社 Resin sealing molding equipment for electronic parts
JP2008114512A (en) * 2006-11-07 2008-05-22 Trinc:Kk Resin molding machine with antistatic function and antistatic method for resin molding
JP5793806B2 (en) * 2011-08-17 2015-10-14 アピックヤマダ株式会社 Resin molding equipment
JP5693931B2 (en) * 2010-11-25 2015-04-01 アピックヤマダ株式会社 Resin molding equipment
KR101439596B1 (en) * 2012-04-09 2014-09-17 (주)엘지하우시스 Eva sheet for solar cell sealing and manufacturing appratus thereof
CN103846432A (en) * 2012-12-05 2014-06-11 兴化市东旭机械有限公司 Tungsten powder filling device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019193820A (en) * 2019-06-20 2019-11-07 株式会社オリンピア Game machine
JP2019193822A (en) * 2019-06-20 2019-11-07 株式会社オリンピア Game machine
JP2019193834A (en) * 2019-06-25 2019-11-07 株式会社オリンピア Game machine

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