TWI730150B - 工作夾台、多孔陶瓷吸引板的製造方法及吸引保持系統 - Google Patents
工作夾台、多孔陶瓷吸引板的製造方法及吸引保持系統 Download PDFInfo
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Abstract
[課題]提供一種即使改變載置於工作夾台之被加工物的大小、形狀,也可以良好地進行保持之工作夾台及多孔陶瓷吸引板的製造方法。 [解決手段]一種吸引保持板狀被加工物之工作夾台,其具備:吸引板,由多孔陶瓷所形成且具有複數個通氣孔;及框體,支撐該吸引板,並覆蓋該吸引板之吸附面以外的側面及背面,且具有形成於上表面之複數個吸引溝、及將該吸引溝連通至吸引源之連通路,該多孔陶瓷吸引板之氣孔率以體積比表示為60~70%,該複數個通氣孔之直徑為10μm~25μm。
Description
發明領域 本發明是關於一種吸引保持被加工物的平面之工作夾台、構成該工作夾台之多孔陶瓷吸引板的製造方法。
發明背景 將IC、LSI等複數個元件以分割預定線區劃而形成於正面的晶圓,是藉由磨削裝置磨削背面,以形成所期望的厚度,之後再對藉由雷射加工裝置而形成有分割起點的晶圓賦予外力,藉此來分割成一個個的元件,並利用於行動電話、個人電腦等電氣機器上。
雷射加工裝置大致是由用於保持晶圓之具有通氣性的工作夾台、照射對吸引保持於該工作夾台之吸附面的晶圓具有穿透性之波長的雷射光線之雷射光線照射設備、使該工作夾台及該雷射光線照射設備相對地在X軸方向上移動之X軸移動設備、及使該工作夾台及該雷射光線照射設備相對地在Y軸方向移動之Y軸移動設備所構成,並且可以沿著晶圓之分割預定線高精度地形成作為分割起點的改質層(參照例如專利文獻1)。 先前技術文獻 專利文獻
專利文獻1:日本專利特許第3408805號公報
發明概要 發明欲解決之課題 在以往之雷射加工裝置中,吸引保持作為被加工物之晶圓的工作夾台之吸附面,其大小是配合晶圓之形狀與尺寸而形成,且前提是該晶圓覆蓋該吸附面之整體。因此,構成工作夾台之多孔陶瓷吸引板的氣孔率及通氣孔的大小是形成為在吸附面載置有任何東西之狀態下,儘量不使吸引源之負荷變大,且將工作夾台之內部空間的壓力設定成例如0.9大氣壓左右。如此一來,導致即使是載置小於該吸附面之晶圓,並作動用來吸引保持之吸引源,仍會將外部之空氣大量地從未被該晶圓覆蓋之吸附面的外周部分吸引至工作夾台的內部,因而實質上並無法將晶圓吸引保持在該吸附面上。據此,在以往,要變更所要加工之晶圓的尺寸的情況下,每次都需花費時間來更換成具有對應於晶圓之尺寸的直徑之工作夾台,而有生產性較差之問題。此外,必須事先準備並且保管複數個直徑相異之工作夾台,也會有管理較煩瑣之問題。
相關的問題並不侷限於在雷射加工裝置中對晶圓施行雷射加工的情況,也是在例如,將晶圓載置於工作夾台之吸附面上,並且在檢查形成於晶圓之正面的元件之優劣的檢查裝置中會產生的問題。 據此,本發明之目的在於:提供一種即使是改變載置於工作夾台之被加工物的大小、形狀,也可以做到良好地吸引保持的工作夾台及多孔陶瓷的製造方法。 用以解決課題之手段
根據本發明之一個方面,可提供一種吸引保持板狀被加工物之工作夾台,該工作夾台具備:吸引板,由多孔陶瓷而形成且具有複數個通氣孔;及框體,支撐該吸引板,並覆蓋該吸引板的吸附面以外之側面及背面,且具有形成於上表面之複數個吸引溝、及將該吸引溝連通至吸引源之連通路,該多孔陶瓷吸引板的氣孔率以體積比表示為60~70%,且該複數個通氣孔之直徑為10μm~25μm。
根據本發明之另一個方面,可提供一種吸引保持板狀被加工物之工作夾台,其具備:吸引板,由多孔陶瓷而形成且具有複數個通氣孔;及框體,具有形成於正面之複數個吸引溝、及將該吸引溝連通至吸引源之連通路,並且覆蓋該吸引板之吸附面以外的側面及背面且支撐該吸引板,該工作夾台是將該多孔陶瓷吸引板之氣孔率及該複數個通氣孔之直徑設定成:透過吸引路來將該連通路連接至作為該吸引源之減壓幫浦,且在該吸引路設置壓力計並在該吸引板的吸附面未載置有任何東西之狀態下作動該減壓幫浦時,使該壓力計的值為0.3大氣壓以上且0.6大氣壓以下。
根據本發明之另一個方面,可提供一種多孔陶瓷吸引板的製造方法,其具備有:顆粒製造步驟,將長石、陶石、黏土及滑石混合並以球磨機粉碎,且將糊劑混入來製造直徑為200μm以下之顆粒;成形步驟,壓製該顆粒來成形板狀物;及燒製步驟,將已成形之板狀物以800℃~1300℃之溫度來燒製而製造多孔陶瓷板狀物。
根據本發明之另一個方面,可提供一種吸引保持板狀被加工物之吸引保持系統,其具備:吸引板,以多孔陶瓷形成且具有複數個通氣孔;框體,具有形成於正面之複數個吸引溝、及一端連通至該吸引溝之連通路,且覆蓋該吸引板之吸附面以外的側面及背面並且支撐該吸引板;及吸引源,連接至該連通路之另一端, 該吸引保持系統是將該多孔陶瓷吸引板之氣孔率、通氣孔之直徑及吸引源的壓力設定成:在該吸引板之吸附面未載置有任何東西的狀態下作動該吸引源時,即使保持在該吸附面之該板狀被加工物之面積小於該吸附面之面積,該連通路之壓力仍成為可維持以該吸附面吸引保持該板狀被加工物之狀態的壓力。 發明效果
本發明之工作夾台由於具備以多孔陶瓷所形成並具有通氣孔之吸引板、覆蓋該吸引板之吸附面以外的側面及背面之框體、形成於該框體且連通至吸引源之連通路,且構成為即使該多孔陶瓷吸引板所要吸引保持之被加工物的平面之面積小於該吸附面之面積,仍具備可以吸引保持被加工物之平面的通氣孔,所以即使改變一個晶圓之直徑、或是形狀,也可以在不需要更換工作夾台的情形下保持晶圓,而變得可做到有效率實行晶圓的加工、或是檢查。且,不需要準備複數個直徑相異之工作夾台,也解決了保管等之管理煩瑣的問題。
用以實施發明之形態 以下,參照附圖,以詳細地說明關於本發明之工作夾台、構成工作夾台之多孔陶瓷吸引板的製造方法、及吸引保持系統。
圖1所顯示的是作為適用本發明之工作夾台的裝置之一例,以編號40來表示之雷射加工裝置的整體立體圖。
雷射加工裝置40具備有基台41、隔著例如保護膠帶T來保持預定大小之晶圓的保持設備42、移動保持設備42之移動設備43、將雷射光線照射至保持於保持設備42之被加工物的雷射光線照射機構44、及攝像設備50。
保持設備42包含:在圖中於以箭頭X表示之X方向上移動自如地搭載在基台41上之矩形的X方向可動板60、在圖中於以箭頭Y表示之Y方向上移動自如地搭載在X方向可動板60上之矩形的Y方向可動板61、固定在Y方向可動板61的上表面的圓筒狀之支柱62、及固定在支柱62的上端的矩形的罩板63。在罩板63上配置有通過形成在該罩板63上之長孔而朝上方延伸之圓形的保持被加工物的工作夾台64。工作夾台64是載置於工作夾台基台67上,且構成工作夾台64之吸附面的吸引板641是藉由通過支柱62之流路而連接至後述之吸引源。再者,X方向是圖1中以箭頭X表示的方向,Y方向是圖1中以箭頭Y表示的方向且為正交於X方向的方向。
移動設備43包含X方向移動設備80、及Y方向移動設備82。X方向移動設備80是將馬達的旋轉運動轉換成直線運動並傳達至X方向可動板60,且使X方向可動板60沿著基台41上的引導軌道在X方向上進退。Y方向移動設備82是將馬達的旋轉運動轉換成直線運動並傳達至Y方向可動板61,且使Y方向可動板61沿著X方向可動板60上的引導軌道在Y方向上進退。再者,雖然圖示是省略的,但在X方向移動設備80、Y方向移動設備82上分別配設有位置檢測設備,而變得可正確地檢測工作夾台64之X方向的位置、Y方向的位置,且根據由圖未示之控制設備所指示之訊號來驅動X方向移動設備80、Y方向移動設備82,而可將工作夾台64正確地定位到任意的位置。又,攝像設備50是位於保持設備42之上方,且藉由移動工作夾台64而變得可拍攝載置於工作夾台64之晶圓等的被加工物。
利用上述之雷射加工裝置40,可以對被搬送到工作夾台64上之晶圓實施雷射加工。更具體地來說,在保持於工作夾台64之吸引板641上的圖未示之晶圓上,是執行例如下述之校準:形成表示形成有施行雷射加工之分割預定線的方向之校準標記(alignment mark),且利用攝像設備50拍攝該校準標記,並實行型樣匹配(pattern matching)等之圖像處理,以調整晶圓相對於雷射光線照射機構44之聚光器的相對位置及方向之校準,而實施雷射加工。再者,在藉由該雷射加工裝置40來實施加工之時,雖然是將在該罩板63之X軸方向相鄰區域構成為以可隨著工作夾台64之移動而伸長、收縮之伸縮設備來覆蓋,以免粉塵、塵埃等進入移動設備43的區域,但為了方便本實施形態之說明,在圖1中關於該伸縮設備等是省略的。
如圖2中放大而顯示地,上述工作夾台64具備:由具有通氣性之多孔性材料的多孔陶瓷所構成之吸引板641、及圍繞吸引板641且由覆蓋吸引板641之吸附面以外的側面及背面的陶瓷所構成的框體642(參照圖2(a)),且該工作夾台64是保有間隙來定位在由不鏽鋼(SUS)所形成的支撐基台67的上表面(參照圖2(b)),並被一體化(參照圖2(c)),而配設在雷射加工裝置40上。如圖2(a)所示,在圍繞吸引板641之該框體642的上表面形成有覆蓋吸引板641之側面的緣部642a,且在已將吸引板641保持在框體642的狀態下,是將緣部641a之上表面與吸引板641之上表面形成為齊平面。又,在框體642之支撐吸引板641的上表面側,形成有同心圓狀之複數個吸引溝642b、及連接各吸引溝642b之朝徑方向伸長的連接吸引溝642c。此外,在框體642之下表面側的中央,形成有與吸引源連通的連通路642d,該吸源是用於對以吸引板641和框體642所形成之空間供給負壓,且在框體642之下表面側形成有圓形的突出部642e(也一併參照圖3)。再者,框體642不受限於以陶瓷來形成,亦可例如,以不鏽鋼(SUS)來形成。
在支撐基台67的上表面中央,形成有嵌合突出於工作夾台64之下表面側的突出部642e之圓形的凹部67a。在該凹部67a之中央,形成有供給負壓的連通路67b,該負壓是用於透過上述之突出部642e的連通路642d來吸引載置於吸引板641上的被加工物。又,在該凹部67a的底部,除了該連通路67b之外,還形成有用於吸引被嵌合之突出部642e之底面以吸引固定工作夾台64之吸引孔67c。如圖3所示,連通路67b、吸引孔67c是透過從吸引路L分歧之副吸引路La、Lb而一起連接於由減壓幫浦所構成之吸引源P,並構成吸引保持系統。並且,在本實施形態中,如圖3所示,在該吸引路L上設定用於測量包含連通路67b、吸引路L、副吸引路La、Lb之區域的壓力之壓力計S。
像這樣構成之工作夾台64是形成為藉由吸引源P而將作為被加工物之例如圓盤狀之半導體晶圓吸引保持於吸引板641上,且形成為可藉由配設在圓筒構件62內之圖未示的脈衝馬達來使其旋轉。利用圖3以更進一步說明至少根據工作夾台64、支撐基台67、及吸引源P來構成之吸引保持系統的作用。
構成本發明之工作夾台64之吸引板641是如上述地形成,且可藉由至少由下述步驟所構成的製造方法來製造:顆粒生成步驟,將例如長石、陶石、黏土、及滑石混合並以球磨機粉碎,並將甲基纖維素(methyl cellulose)等的糊劑混入來生成直徑為200μm以下之顆粒驟;成形步驟,壓製該顆粒來成形板狀物;及燒製步驟,將已成形之板狀物以800~1300℃來燒製而生成多孔陶瓷。
藉由如上所述之製造方法來進行製造,以使形成吸引板641之多孔陶瓷的氣孔率以體積比表示為60~70%,且藉由該氣孔而構成之該通氣孔的大小是形成為直徑10~25μm。並且,可調整成在吸引板641之吸附面未載置有任何東西之狀態下,且作動連接至工作夾台64之吸引源P的情況下,配設在吸引路之壓力計的壓力值相較於以往之構成所顯示之值即0.9大氣壓變得更小,且較佳的是顯示0.3~0.6大氣壓之數值。
由於本發明是如以上地構成,因此不用說是載置與該吸引板641相同形狀、相同尺寸的半導體晶圓的情況,連如圖4(a)所示之載置有比該吸引板641小之晶圓W1的情況、甚至即使是如圖4(b)所示之載置有矩形形狀的晶圓W2的情況,在雷射加工之時都可在不產生任何障礙的情形下良好地維持吸引保持狀態。 在圖4(a)及圖4(b)中,雖然將外部的空氣從未載置有晶圓W1或W2之吸引板641的區域吸引至工作夾台之內部,但是由於上述之實施形態的吸引板641是將其氣孔率及通氣孔之直徑設定得比以往的吸引板更小,因此可以將工作夾台內部之負壓維持在比以往更大的負壓,而能夠以吸引板641來吸引保持晶圓W1或W2。
40‧‧‧雷射加工裝置41‧‧‧基台42‧‧‧保持設備43‧‧‧移動設備44‧‧‧雷射光線照射機構50‧‧‧攝像設備60‧‧‧X方向可動板61‧‧‧Y方向可動板62‧‧‧支柱63‧‧‧罩板64‧‧‧工作夾台641‧‧‧吸引板642‧‧‧框體642a‧‧‧緣部642b‧‧‧吸引溝642c‧‧‧連接吸引溝642d、67b‧‧‧連通路642e‧‧‧突出部67‧‧‧支撐基台(工作夾台基台)67a‧‧‧凹部67c‧‧‧吸引孔80‧‧‧X方向移動設備82‧‧‧Y方向移動設備L‧‧‧吸引路La、Lb‧‧‧副吸引路P‧‧‧吸引源S‧‧‧壓力計T‧‧‧保護膠帶X、Y‧‧‧箭頭W1、W2‧‧‧晶圓
圖1是作為適用根據本發明而構成之工作夾台的裝置之一例而顯示的雷射加工裝置的整體立體圖。 圖2(a)、(b)、(c)是顯示適用於圖1所示之雷射加工裝置的工作夾台、及支撐基台之構成的立體圖。 圖3是用於說明吸引保持系統的截面圖。 圖4(a)、(b)是用於說明工作夾台的使用形態之例的立體圖。
64‧‧‧工作夾台
641‧‧‧吸引板
642‧‧‧框體
642a‧‧‧周緣部
642b‧‧‧吸引溝
642d、67b‧‧‧連通路
642e‧‧‧突出部
67‧‧‧支撐基台(工作夾台基台)
67a‧‧‧凹部
67c‧‧‧吸引孔
L‧‧‧吸引路
La、Lb‧‧‧副吸引路
P‧‧‧吸引源
S‧‧‧壓力計
Claims (4)
- 一種工作夾台,是吸引保持板狀被加工物之工作夾台,其具備:吸引板,由多孔陶瓷所形成且具有複數個通氣孔;及框體,支撐該吸引板,並覆蓋該吸引板之吸附面以外的側面及背面,且具有形成在上表面之複數個吸引溝、及將該吸引溝連通至吸引源之連通路,該多孔陶瓷吸引板的氣孔率以體積比表示為60~70%,該複數個通氣孔之直徑為10μm~25μm。
- 一種工作夾台,是吸引保持板狀被加工物之工作夾台,其具備:吸引板,由多孔陶瓷所形成且具有複數個通氣孔;框體,具有形成於正面之複數個吸引溝、及將該吸引溝連通至吸引源之連通路,並且覆蓋該吸引板之吸附面以外的側面及背面且支撐該吸引板,該工作夾台是將該多孔陶瓷吸引板之氣孔率及該複數個通氣孔之直徑設定成:透過吸引路來將該連通路連接至作為該吸引源之減壓幫浦,且在該吸引路設置壓力計並在該吸引板之吸附面未載置有任何東西之狀態下作動該減壓幫浦時,使該壓力計之值成為0.3大氣壓以上且為0.6大氣壓以下。
- 一種多孔陶瓷吸引板的製造方法,其具備有: 顆粒製造步驟,將長石、陶石、黏土及滑石混合並以球磨機粉碎,且將糊劑混入來製造直徑為200μm以下之顆粒;成形步驟,壓製該顆粒來成形板狀物;及燒製步驟,將已成形之板狀物以800℃~1300℃之溫度來燒製而製造多孔陶瓷吸引板,該多孔陶瓷吸引板的氣孔率以體積比表示為60~70%,該多孔陶瓷吸引板的複數個通氣孔之直徑為10μm~25μm。
- 一種吸引保持系統,是吸引保持板狀被加工物之吸引保持系統,其具備:吸引板,以多孔陶瓷形成且具有複數個通氣孔;框體,具有形成於正面之複數個吸引溝、及一端連通至該吸引溝之連通路,且覆蓋該吸引板之吸附面以外的側面及背面並且支撐該吸引板;及吸引源,連接至該連通路之另一端,且該吸引保持系統是將該多孔陶瓷吸引板之氣孔率、通氣孔之直徑及吸引源的壓力設定成:在該吸引板之吸附面未載置有任何東西之狀態下作動該吸引源時,即使保持在該吸附面之該板狀被加工物的面積小於該吸附面之面積,該連通路之壓力仍成為可維持以該吸附面吸引保持該板狀被加工物之狀態的壓力,該多孔陶瓷吸引板的氣孔率以體積比表示為 60~70%,該複數個通氣孔之直徑為10μm~25μm。
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- 2017-09-04 DE DE102017215424.1A patent/DE102017215424A1/de active Pending
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JP2008270233A (ja) * | 2007-04-16 | 2008-11-06 | Mitsui Kozan Material Kk | 真空吸着装置用吸着体及び真空吸着装置 |
CN104040709A (zh) * | 2011-12-28 | 2014-09-10 | 炭研轴封精工有限公司 | 吸附盘 |
US20150214085A1 (en) * | 2012-08-31 | 2015-07-30 | Semiconductor Technologies & Instruments Pte Ltd | Multifunction wafer and film frame handling system |
TW201628812A (zh) * | 2014-10-24 | 2016-08-16 | Towa Corp | 工件吸附板、工件切斷裝置、工件切斷方法、及工件吸附板之製造方法 |
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DE102017215424A1 (de) | 2018-03-08 |
KR20180027337A (ko) | 2018-03-14 |
MY187742A (en) | 2021-10-18 |
JP6815138B2 (ja) | 2021-01-20 |
CN107803604B (zh) | 2021-05-25 |
TW201811483A (zh) | 2018-04-01 |
SG10201706484XA (en) | 2018-04-27 |
JP2018041799A (ja) | 2018-03-15 |
US20180065187A1 (en) | 2018-03-08 |
CN107803604A (zh) | 2018-03-16 |
US10532411B2 (en) | 2020-01-14 |
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