TWI724162B - 環氧樹脂組成物及電子零件裝置 - Google Patents

環氧樹脂組成物及電子零件裝置 Download PDF

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Publication number
TWI724162B
TWI724162B TW106114312A TW106114312A TWI724162B TW I724162 B TWI724162 B TW I724162B TW 106114312 A TW106114312 A TW 106114312A TW 106114312 A TW106114312 A TW 106114312A TW I724162 B TWI724162 B TW I724162B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin composition
group
general formula
phenol
Prior art date
Application number
TW106114312A
Other languages
English (en)
Chinese (zh)
Other versions
TW201807057A (zh
Inventor
石黒正
馬場徹
Original Assignee
日商昭和電工材料股份有限公司
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Filing date
Publication date
Application filed by 日商昭和電工材料股份有限公司 filed Critical 日商昭和電工材料股份有限公司
Publication of TW201807057A publication Critical patent/TW201807057A/zh
Application granted granted Critical
Publication of TWI724162B publication Critical patent/TWI724162B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW106114312A 2016-04-28 2017-04-28 環氧樹脂組成物及電子零件裝置 TWI724162B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016091768 2016-04-28
JP2016-091768 2016-04-28

Publications (2)

Publication Number Publication Date
TW201807057A TW201807057A (zh) 2018-03-01
TWI724162B true TWI724162B (zh) 2021-04-11

Family

ID=60160777

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106114312A TWI724162B (zh) 2016-04-28 2017-04-28 環氧樹脂組成物及電子零件裝置

Country Status (8)

Country Link
JP (1) JP7343978B2 (ja)
KR (1) KR102127589B1 (ja)
CN (1) CN109071780B (ja)
MY (1) MY196654A (ja)
PH (1) PH12018502283A1 (ja)
SG (1) SG11201809513UA (ja)
TW (1) TWI724162B (ja)
WO (1) WO2017188455A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7351291B2 (ja) * 2018-03-16 2023-09-27 株式会社レゾナック エポキシ樹脂組成物、及び電子部品装置
WO2024128191A1 (ja) * 2022-12-16 2024-06-20 株式会社レゾナック 硬化性樹脂組成物及び電子部品装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201425375A (zh) * 2012-11-12 2014-07-01 Dainippon Ink & Chemicals 含有酚性羥基樹脂、環氧樹脂、硬化性樹脂組成物、其硬化物及半導體封裝材料
CN104334597A (zh) * 2012-02-23 2015-02-04 新日铁住金化学株式会社 多元羟基树脂、环氧树脂、它们的制造方法、环氧树脂组合物及其固化物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0753791B2 (ja) 1987-09-04 1995-06-07 東レ株式会社 半導体封止用樹脂組成物
JP3603483B2 (ja) * 1996-07-11 2004-12-22 日立化成工業株式会社 半導体素子用封止材及びそれを用いた半導体装置
JP3440449B2 (ja) 1997-06-24 2003-08-25 京セラケミカル株式会社 封止用樹脂組成物および半導体封止装置
JP2000103940A (ja) 1998-09-25 2000-04-11 Toshiba Chem Corp エポキシ樹脂組成物および半導体封止装置
JP3819220B2 (ja) 2000-06-26 2006-09-06 京セラケミカル株式会社 封止用樹脂組成物および半導体封止装置
JP3510869B2 (ja) 2001-08-28 2004-03-29 住金エア・ウォーター・ケミカル株式会社 フェノール系重合体、その製法及びその用途
JP5906673B2 (ja) * 2010-11-26 2016-04-20 日立化成株式会社 封止用エポキシ樹脂成形材料、及びこの成形材料で封止した素子を備えた電子部品装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104334597A (zh) * 2012-02-23 2015-02-04 新日铁住金化学株式会社 多元羟基树脂、环氧树脂、它们的制造方法、环氧树脂组合物及其固化物
TW201425375A (zh) * 2012-11-12 2014-07-01 Dainippon Ink & Chemicals 含有酚性羥基樹脂、環氧樹脂、硬化性樹脂組成物、其硬化物及半導體封裝材料

Also Published As

Publication number Publication date
WO2017188455A1 (ja) 2017-11-02
PH12018502283A1 (en) 2019-07-08
TW201807057A (zh) 2018-03-01
MY196654A (en) 2023-04-27
KR20180136494A (ko) 2018-12-24
CN109071780B (zh) 2022-04-08
JPWO2017188455A1 (ja) 2019-03-07
JP7343978B2 (ja) 2023-09-13
CN109071780A (zh) 2018-12-21
KR102127589B1 (ko) 2020-06-26
SG11201809513UA (en) 2018-11-29

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