MY196654A - Epoxy Resin Composition and Electronic Component Device - Google Patents

Epoxy Resin Composition and Electronic Component Device

Info

Publication number
MY196654A
MY196654A MYPI2018703974A MYPI2018703974A MY196654A MY 196654 A MY196654 A MY 196654A MY PI2018703974 A MYPI2018703974 A MY PI2018703974A MY PI2018703974 A MYPI2018703974 A MY PI2018703974A MY 196654 A MY196654 A MY 196654A
Authority
MY
Malaysia
Prior art keywords
epoxy resin
resin composition
electronic component
component device
carbon atoms
Prior art date
Application number
MYPI2018703974A
Inventor
Tadashi Ishiguro
Toru Baba
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of MY196654A publication Critical patent/MY196654A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

An epoxy resin composition includes an epoxy resin containing a compound represented by the following Formula (1); and a curing agent containing at least one selected from the group consisting of biphenylene-type phenol aralkyl resins, phenol aralkyl resins, and triphenylmethane-type phenol resins. Each R1 independently represents a hydrogen atom or a monovalent hydrocarbon group having from 1 to 6 carbon atoms; each R2 represents a substituent represented by Formula (a); m represents a number from 0 to 20; p represents from 0.5 to 2.0; and each of R3s independently represents a hydrogen atom or a monovalent hydrocarbon group having from I to 6 carbon atoms
MYPI2018703974A 2016-04-28 2017-04-28 Epoxy Resin Composition and Electronic Component Device MY196654A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016091768 2016-04-28
PCT/JP2017/017100 WO2017188455A1 (en) 2016-04-28 2017-04-28 Epoxy resin composition and electronic component device

Publications (1)

Publication Number Publication Date
MY196654A true MY196654A (en) 2023-04-27

Family

ID=60160777

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018703974A MY196654A (en) 2016-04-28 2017-04-28 Epoxy Resin Composition and Electronic Component Device

Country Status (8)

Country Link
JP (1) JP7343978B2 (en)
KR (1) KR102127589B1 (en)
CN (1) CN109071780B (en)
MY (1) MY196654A (en)
PH (1) PH12018502283A1 (en)
SG (1) SG11201809513UA (en)
TW (1) TWI724162B (en)
WO (1) WO2017188455A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7351291B2 (en) * 2018-03-16 2023-09-27 株式会社レゾナック Epoxy resin composition and electronic component equipment
WO2024128191A1 (en) * 2022-12-16 2024-06-20 株式会社レゾナック Curable resin composition and electronic component device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0753791B2 (en) 1987-09-04 1995-06-07 東レ株式会社 Resin composition for semiconductor encapsulation
JP3603483B2 (en) * 1996-07-11 2004-12-22 日立化成工業株式会社 Semiconductor element sealing material and semiconductor device using the same
JP3440449B2 (en) 1997-06-24 2003-08-25 京セラケミカル株式会社 Sealing resin composition and semiconductor sealing device
JP2000103940A (en) 1998-09-25 2000-04-11 Toshiba Chem Corp Epoxy resin composition and semiconductor sealing device
JP3819220B2 (en) 2000-06-26 2006-09-06 京セラケミカル株式会社 Resin composition for sealing and semiconductor sealing device
JP3510869B2 (en) 2001-08-28 2004-03-29 住金エア・ウォーター・ケミカル株式会社 Phenolic polymer, its production method and its use
JP5906673B2 (en) * 2010-11-26 2016-04-20 日立化成株式会社 Epoxy resin molding material for sealing, and electronic component device provided with element sealed with this molding material
MY169844A (en) * 2012-02-23 2019-05-17 Nippon Steel Chemical & Mat Co Ltd Polyvalent hydroxy resin, epoxy resin, method for producing same, epoxy resin composition and cured product thereof
TWI595019B (en) * 2012-11-12 2017-08-11 Ｄｉｃ股份有限公司 Phenolic hydroxyl group-containing resin, epoxy resin, curable resin composition,cured product thereof and semiconductor encapsulating material

Also Published As

Publication number Publication date
WO2017188455A1 (en) 2017-11-02
PH12018502283A1 (en) 2019-07-08
TW201807057A (en) 2018-03-01
KR20180136494A (en) 2018-12-24
CN109071780B (en) 2022-04-08
JPWO2017188455A1 (en) 2019-03-07
JP7343978B2 (en) 2023-09-13
CN109071780A (en) 2018-12-21
TWI724162B (en) 2021-04-11
KR102127589B1 (en) 2020-06-26
SG11201809513UA (en) 2018-11-29

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