MY196654A - Epoxy Resin Composition and Electronic Component Device - Google Patents
Epoxy Resin Composition and Electronic Component DeviceInfo
- Publication number
- MY196654A MY196654A MYPI2018703974A MYPI2018703974A MY196654A MY 196654 A MY196654 A MY 196654A MY PI2018703974 A MYPI2018703974 A MY PI2018703974A MY PI2018703974 A MYPI2018703974 A MY PI2018703974A MY 196654 A MY196654 A MY 196654A
- Authority
- MY
- Malaysia
- Prior art keywords
- epoxy resin
- resin composition
- electronic component
- component device
- carbon atoms
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016091768 | 2016-04-28 | ||
PCT/JP2017/017100 WO2017188455A1 (ja) | 2016-04-28 | 2017-04-28 | エポキシ樹脂組成物及び電子部品装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY196654A true MY196654A (en) | 2023-04-27 |
Family
ID=60160777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2018703974A MY196654A (en) | 2016-04-28 | 2017-04-28 | Epoxy Resin Composition and Electronic Component Device |
Country Status (8)
Country | Link |
---|---|
JP (1) | JP7343978B2 (ja) |
KR (1) | KR102127589B1 (ja) |
CN (1) | CN109071780B (ja) |
MY (1) | MY196654A (ja) |
PH (1) | PH12018502283A1 (ja) |
SG (1) | SG11201809513UA (ja) |
TW (1) | TWI724162B (ja) |
WO (1) | WO2017188455A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7351291B2 (ja) * | 2018-03-16 | 2023-09-27 | 株式会社レゾナック | エポキシ樹脂組成物、及び電子部品装置 |
WO2024128191A1 (ja) * | 2022-12-16 | 2024-06-20 | 株式会社レゾナック | 硬化性樹脂組成物及び電子部品装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0753791B2 (ja) | 1987-09-04 | 1995-06-07 | 東レ株式会社 | 半導体封止用樹脂組成物 |
JP3603483B2 (ja) * | 1996-07-11 | 2004-12-22 | 日立化成工業株式会社 | 半導体素子用封止材及びそれを用いた半導体装置 |
JP3440449B2 (ja) | 1997-06-24 | 2003-08-25 | 京セラケミカル株式会社 | 封止用樹脂組成物および半導体封止装置 |
JP2000103940A (ja) | 1998-09-25 | 2000-04-11 | Toshiba Chem Corp | エポキシ樹脂組成物および半導体封止装置 |
JP3819220B2 (ja) | 2000-06-26 | 2006-09-06 | 京セラケミカル株式会社 | 封止用樹脂組成物および半導体封止装置 |
JP3510869B2 (ja) | 2001-08-28 | 2004-03-29 | 住金エア・ウォーター・ケミカル株式会社 | フェノール系重合体、その製法及びその用途 |
JP5906673B2 (ja) * | 2010-11-26 | 2016-04-20 | 日立化成株式会社 | 封止用エポキシ樹脂成形材料、及びこの成形材料で封止した素子を備えた電子部品装置 |
MY169844A (en) * | 2012-02-23 | 2019-05-17 | Nippon Steel Chemical & Mat Co Ltd | Polyvalent hydroxy resin, epoxy resin, method for producing same, epoxy resin composition and cured product thereof |
TWI595019B (zh) * | 2012-11-12 | 2017-08-11 | Dic股份有限公司 | 含有酚性羥基樹脂、環氧樹脂、硬化性樹脂組成物、其硬化物及半導體封裝材料 |
-
2017
- 2017-04-28 JP JP2018514747A patent/JP7343978B2/ja active Active
- 2017-04-28 WO PCT/JP2017/017100 patent/WO2017188455A1/ja active Application Filing
- 2017-04-28 CN CN201780026111.1A patent/CN109071780B/zh active Active
- 2017-04-28 TW TW106114312A patent/TWI724162B/zh active
- 2017-04-28 KR KR1020187033222A patent/KR102127589B1/ko active IP Right Grant
- 2017-04-28 MY MYPI2018703974A patent/MY196654A/en unknown
- 2017-04-28 SG SG11201809513UA patent/SG11201809513UA/en unknown
-
2018
- 2018-10-26 PH PH12018502283A patent/PH12018502283A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2017188455A1 (ja) | 2017-11-02 |
PH12018502283A1 (en) | 2019-07-08 |
TW201807057A (zh) | 2018-03-01 |
KR20180136494A (ko) | 2018-12-24 |
CN109071780B (zh) | 2022-04-08 |
JPWO2017188455A1 (ja) | 2019-03-07 |
JP7343978B2 (ja) | 2023-09-13 |
CN109071780A (zh) | 2018-12-21 |
TWI724162B (zh) | 2021-04-11 |
KR102127589B1 (ko) | 2020-06-26 |
SG11201809513UA (en) | 2018-11-29 |
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