TWI693731B - 高頻超音波壓電元件、其製造方法以及包含該高頻超音波壓電元件的高頻超音波探頭 - Google Patents

高頻超音波壓電元件、其製造方法以及包含該高頻超音波壓電元件的高頻超音波探頭 Download PDF

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Publication number: TWI693731B
Authority: TW; Taiwan
Prior art keywords: piezoelectric; piezoelectric element; lower electrode; frequency ultrasonic; concave portion
Prior art date: 2015-06-24

Application number

TW105119414A

Other languages

English (en)

Chinese (zh)

Other versions

TW201705560A (zh

Inventor

小林牧子

田邊將之

椎名毅

隅田劍生

河口範夫

Original Assignee

國立大學法人熊本大學

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2015-06-24

Filing date

2016-06-21

Publication date

2020-05-11

2016-06-21 Application filed by 國立大學法人熊本大學 filed Critical 國立大學法人熊本大學

2017-02-01 Publication of TW201705560A publication Critical patent/TW201705560A/zh

2020-05-11 Application granted granted Critical

2020-05-11 Publication of TWI693731B publication Critical patent/TWI693731B/zh

Links

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238000002604 ultrasonography Methods 0.000 title abstract description 14
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238000005245 sintering Methods 0.000 claims abstract description 11
239000011248 coating agent Substances 0.000 claims abstract description 9
238000000576 coating method Methods 0.000 claims abstract description 9
239000002131 composite material Substances 0.000 claims description 29
238000005507 spraying Methods 0.000 claims description 18
238000003491 array Methods 0.000 claims description 2
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239000010408 film Substances 0.000 description 109
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HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
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Images

Classifications

- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
- H10N30/078—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/093—Forming inorganic materials
- H10N30/097—Forming inorganic materials by sintering
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/13—Tomography
- A61B8/14—Echo-tomography

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Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Chemical & Material Sciences (AREA)
Physics & Mathematics (AREA)
Acoustics & Sound (AREA)
Signal Processing (AREA)
Dispersion Chemistry (AREA)
Inorganic Chemistry (AREA)
Ultra Sonic Daignosis Equipment (AREA)
Transducers For Ultrasonic Waves (AREA)
Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

TW105119414A 2015-06-24 2016-06-21 高頻超音波壓電元件、其製造方法以及包含該高頻超音波壓電元件的高頻超音波探頭 TWI693731B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2015126268A JP6122066B2 (ja)	2015-06-24	2015-06-24	高周波超音波圧電素子、その製造方法、及びそれを含む高周波超音波プローブ
JPJP2015-126268		2015-06-24

Publications (2)

Publication Number	Publication Date
TW201705560A TW201705560A (zh)	2017-02-01
TWI693731B true TWI693731B (zh)	2020-05-11

Family

ID=57584920

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW105119414A TWI693731B (zh)	2015-06-24	2016-06-21	高頻超音波壓電元件、其製造方法以及包含該高頻超音波壓電元件的高頻超音波探頭

Country Status (3)

Country	Link
JP (1)	JP6122066B2 (ja)
TW (1)	TWI693731B (ja)
WO (1)	WO2016208425A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR101965171B1 (ko) *	2018-08-24	2019-08-13	(주)비티비엘	초음파센서의 제조방법

Citations (2)

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JP2012011024A (ja) *	2010-07-01	2012-01-19	Konica Minolta Medical & Graphic Inc	超音波探触子、および超音波診断装置
JP2013168573A (ja) *	2012-02-16	2013-08-29	Mitsubishi Heavy Ind Ltd	超音波厚みセンサの製造方法

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JPH071920Y2 (ja) *	1988-05-10	1995-01-18	東レ株式会社	超音波トランスデューサ
JP2002008939A (ja) *	2000-04-13	2002-01-11	Fujitsu Ltd	選択的コーティングによるセラミック体の製造方法
JP4759117B2 (ja) *	2000-06-22	2011-08-31	日本特殊陶業株式会社	金属酸化物膜付き基板及び金属酸化物膜付き基板の製造方法
JP2004111835A (ja) *	2002-09-20	2004-04-08	Canon Inc	圧電体素子の製造方法、圧電体素子及びインクジェット式記録ヘッド
JP2005327919A (ja) *	2004-05-14	2005-11-24	Seiko Epson Corp	デバイスの製造方法及びデバイス、電気光学素子、プリンタ
US7449821B2 (en) *	2005-03-02	2008-11-11	Research Triangle Institute	Piezoelectric micromachined ultrasonic transducer with air-backed cavities
JP5540361B2 (ja) *	2011-06-07	2014-07-02	日立Ｇｅニュークリア・エナジー株式会社	超音波センサ及びその製造方法
JP2013207155A (ja) *	2012-03-29	2013-10-07	Mitsubishi Materials Corp	強誘電体薄膜の製造方法
JP6132337B2 (ja) *	2013-04-24	2017-05-24	国立大学法人電気通信大学	超音波診断装置及び超音波画像構築方法

2015
- 2015-06-24 JP JP2015126268A patent/JP6122066B2/ja active Active
2016
- 2016-06-10 WO PCT/JP2016/067395 patent/WO2016208425A1/ja active Application Filing
- 2016-06-21 TW TW105119414A patent/TWI693731B/zh not_active IP Right Cessation

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2012011024A (ja) *	2010-07-01	2012-01-19	Konica Minolta Medical & Graphic Inc	超音波探触子、および超音波診断装置
JP2013168573A (ja) *	2012-02-16	2013-08-29	Mitsubishi Heavy Ind Ltd	超音波厚みセンサの製造方法

Also Published As

Publication number	Publication date
TW201705560A (zh)	2017-02-01
JP6122066B2 (ja)	2017-04-26
JP2017011144A (ja)	2017-01-12
WO2016208425A1 (ja)	2016-12-29

Legal Events

Date	Code	Title	Description
2023-02-11	MM4A	Annulment or lapse of patent due to non-payment of fees

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