TWI689378B - 研磨裝置，研磨構件的加工方法，研磨構件的修整方法，形狀加工用切削工具及表面修整用工具 - Google Patents

研磨裝置，研磨構件的加工方法，研磨構件的修整方法，形狀加工用切削工具及表面修整用工具 Download PDF

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Publication number
TWI689378B
TWI689378B TW103134422A TW103134422A TWI689378B TW I689378 B TWI689378 B TW I689378B TW 103134422 A TW103134422 A TW 103134422A TW 103134422 A TW103134422 A TW 103134422A TW I689378 B TWI689378 B TW I689378B
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TW
Taiwan
Prior art keywords
polishing
shape
polished
tool
curved
Prior art date
Application number
TW103134422A
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English (en)
Chinese (zh)
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TW201536479A (zh
Inventor
森永均
浅野宏
大月伸悟
玉井一誠
Original Assignee
日商福吉米股份有限公司
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Publication of TW201536479A publication Critical patent/TW201536479A/zh
Application granted granted Critical
Publication of TWI689378B publication Critical patent/TWI689378B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
    • B24B53/07—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels by means of forming tools having a shape complementary to that to be produced, e.g. blocks, profile rolls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/08—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding non-circular cross-sections, e.g. shafts of elliptical or polygonal cross-section
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW103134422A 2013-10-04 2014-10-02 研磨裝置，研磨構件的加工方法，研磨構件的修整方法，形狀加工用切削工具及表面修整用工具 TWI689378B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013209601 2013-10-04
JP2013-209601 2013-10-04

Publications (2)

Publication Number Publication Date
TW201536479A TW201536479A (zh) 2015-10-01
TWI689378B true TWI689378B (zh) 2020-04-01

Family

ID=52778772

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103134422A TWI689378B (zh) 2013-10-04 2014-10-02 研磨裝置，研磨構件的加工方法，研磨構件的修整方法，形狀加工用切削工具及表面修整用工具

Country Status (7)

Country Link
US (1) US20160236322A1 (ja)
EP (1) EP3053704A4 (ja)
JP (2) JPWO2015050185A1 (ja)
KR (1) KR20160067107A (ja)
CN (1) CN105636743B (ja)
TW (1) TWI689378B (ja)
WO (1) WO2015050185A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6884015B2 (ja) * 2017-03-22 2021-06-09 株式会社荏原製作所 基板の研磨装置および研磨方法
US11685013B2 (en) 2018-01-24 2023-06-27 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad for chemical mechanical planarization

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW308562B (ja) * 1994-11-28 1997-06-21 Canon Kk
TW445193B (en) * 1998-06-25 2001-07-11 Unova Uk Ltd Wafer edge polishing method and apparatus

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TW445193B (en) * 1998-06-25 2001-07-11 Unova Uk Ltd Wafer edge polishing method and apparatus

Also Published As

Publication number Publication date
EP3053704A1 (en) 2016-08-10
TW201536479A (zh) 2015-10-01
CN105636743B (zh) 2021-01-08
EP3053704A4 (en) 2017-07-19
JP2017185623A (ja) 2017-10-12
JPWO2015050185A1 (ja) 2017-03-09
WO2015050185A1 (ja) 2015-04-09
US20160236322A1 (en) 2016-08-18
KR20160067107A (ko) 2016-06-13
JP6474861B2 (ja) 2019-02-27
CN105636743A (zh) 2016-06-01

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