EP3053704A4 - Polishing device, processing method of polishing member, modification method of polishing member, shape processing cutting tool, and surface modification tool - Google Patents

Polishing device, processing method of polishing member, modification method of polishing member, shape processing cutting tool, and surface modification tool Download PDF

Info

Publication number
EP3053704A4
EP3053704A4 EP14851154.6A EP14851154A EP3053704A4 EP 3053704 A4 EP3053704 A4 EP 3053704A4 EP 14851154 A EP14851154 A EP 14851154A EP 3053704 A4 EP3053704 A4 EP 3053704A4
Authority
EP
European Patent Office
Prior art keywords
polishing
polishing member
tool
modification
cutting tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14851154.6A
Other languages
German (de)
French (fr)
Other versions
EP3053704A1 (en
Inventor
Hitoshi Morinaga
Hiroshi Asano
Shingo OTSUKI
Kazusei Tamai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of EP3053704A1 publication Critical patent/EP3053704A1/en
Publication of EP3053704A4 publication Critical patent/EP3053704A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
    • B24B53/07—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels by means of forming tools having a shape complementary to that to be produced, e.g. blocks, profile rolls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/08—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding non-circular cross-sections, e.g. shafts of elliptical or polygonal cross-section
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
EP14851154.6A 2013-10-04 2014-10-02 Polishing device, processing method of polishing member, modification method of polishing member, shape processing cutting tool, and surface modification tool Withdrawn EP3053704A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013209601 2013-10-04
PCT/JP2014/076359 WO2015050185A1 (en) 2013-10-04 2014-10-02 Polishing device, processing method of polishing member, modification method of polishing member, shape processing cutting tool, and surface modification tool

Publications (2)

Publication Number Publication Date
EP3053704A1 EP3053704A1 (en) 2016-08-10
EP3053704A4 true EP3053704A4 (en) 2017-07-19

Family

ID=52778772

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14851154.6A Withdrawn EP3053704A4 (en) 2013-10-04 2014-10-02 Polishing device, processing method of polishing member, modification method of polishing member, shape processing cutting tool, and surface modification tool

Country Status (7)

Country Link
US (1) US20160236322A1 (en)
EP (1) EP3053704A4 (en)
JP (2) JPWO2015050185A1 (en)
KR (1) KR20160067107A (en)
CN (1) CN105636743B (en)
TW (1) TWI689378B (en)
WO (1) WO2015050185A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6884015B2 (en) * 2017-03-22 2021-06-09 株式会社荏原製作所 Substrate polishing equipment and polishing method
US11685013B2 (en) 2018-01-24 2023-06-27 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad for chemical mechanical planarization

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1082418A (en) * 1966-07-22 1967-09-06 Toolmasters Ltd Improvements relating to grinding wheels

Family Cites Families (33)

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JPS47636Y1 (en) * 1966-07-12 1972-01-11
US3526058A (en) * 1967-06-28 1970-09-01 Litton Industries Inc Diamond roller dresser
US4010583A (en) * 1974-05-28 1977-03-08 Engelhard Minerals & Chemicals Corporation Fixed-super-abrasive tool and method of manufacture thereof
JPS5250088A (en) * 1975-10-15 1977-04-21 Monsanto Co Crush forming roll
US4182082A (en) * 1978-01-19 1980-01-08 Ernst Winter & Sohn (Gmbh & Co.) Method for the profiling of grinding wheels and apparatus therefor
US4555873A (en) * 1981-03-30 1985-12-03 Energy-Adaptive Grinding, Inc. Method and apparatus for wheel conditioning in a grinding machine
JPS6090674A (en) * 1983-10-22 1985-05-21 Yasumasa Nakamura Abrasive sponge wheel
JPS60143646U (en) * 1984-03-02 1985-09-24 豊田工機株式会社 grinding equipment
JPH01289671A (en) * 1988-05-11 1989-11-21 Boarheath Theodore Sanding wheel
JP2559650B2 (en) * 1991-11-27 1996-12-04 信越半導体株式会社 Wafer chamfer polishing device
JP2921250B2 (en) * 1992-02-28 1999-07-19 信越半導体株式会社 Mirror polishing method and apparatus for wafer chamfer
JPH06170720A (en) * 1992-12-02 1994-06-21 Speedfam Co Ltd Surface plate dressing device
US5624306A (en) * 1993-11-23 1997-04-29 Visser Irrevocable Trust 1992-1 Stacked sanding wheel for radical profiles
JPH08206953A (en) * 1994-11-28 1996-08-13 Canon Inc Grinding-polishing method and grinding-polishing tool and its manufacture
US5938507A (en) * 1995-10-27 1999-08-17 Applied Materials, Inc. Linear conditioner apparatus for a chemical mechanical polishing system
WO1997020658A1 (en) * 1995-12-06 1997-06-12 Idemitsu Kosan Co., Ltd. Method of flattening surfaces of sheet material, and method of manufacturing sheet material on the basis of same
JP3676030B2 (en) * 1997-04-10 2005-07-27 株式会社東芝 Polishing pad dressing method and semiconductor device manufacturing method
JP3187353B2 (en) 1997-10-01 2001-07-11 株式会社エスプリジャパン Cleaning method and cleaning device for air conditioner of vehicles such as automobiles
JPH11188590A (en) 1997-12-22 1999-07-13 Speedfam Co Ltd Edge polishing device
DE69903547T2 (en) * 1998-06-25 2003-07-10 Unova Uk Ltd METHOD AND DEVICE FOR BEVELING SEMICONDUCTOR DISCS
US6783428B1 (en) * 1999-01-18 2004-08-31 Nsk Ltd. Method for forming grooves on workpiece and for dressing a grindstone used in the groove formation
JP2001121391A (en) * 1999-10-28 2001-05-08 Canon Inc Polishing plate combining method
US6630059B1 (en) * 2000-01-14 2003-10-07 Nutool, Inc. Workpeice proximity plating apparatus
JP2003048164A (en) * 2001-08-07 2003-02-18 Disco Abrasive Syst Ltd Polishing wheel
JP3534115B1 (en) * 2003-04-02 2004-06-07 住友電気工業株式会社 Edge-polished nitride semiconductor substrate, edge-polished GaN free-standing substrate, and edge processing method for nitride semiconductor substrate
JP2005340732A (en) * 2004-05-31 2005-12-08 Disco Abrasive Syst Ltd Wafer cleaning apparatus
JP2007088143A (en) * 2005-09-21 2007-04-05 Elpida Memory Inc Edge grinding device
JP4742845B2 (en) * 2005-12-15 2011-08-10 信越半導体株式会社 Method for processing chamfered portion of semiconductor wafer and method for correcting groove shape of grindstone
JP2010173016A (en) * 2009-01-29 2010-08-12 Mitsubishi Materials Corp Conditioner for semiconductor polishing cloth, method for manufacturing the conditioner for semiconductor polishing cloth, and semiconductor polishing apparatus
JP2010182813A (en) * 2009-02-04 2010-08-19 Noritake Super Abrasive Co Ltd Cmp pad conditioner
CN201380419Y (en) * 2009-03-02 2010-01-13 湖北新火炬科技股份有限公司 Diamond roller grinding wheel for grinding inner roller way of hub assembly
JP5405887B2 (en) * 2009-04-27 2014-02-05 ルネサスエレクトロニクス株式会社 Polishing apparatus and polishing method
CN201728564U (en) * 2010-07-28 2011-02-02 许昌义 Angle grinder adhesive wheel and adhesive sticker sand paper

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1082418A (en) * 1966-07-22 1967-09-06 Toolmasters Ltd Improvements relating to grinding wheels

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2015050185A1 *

Also Published As

Publication number Publication date
EP3053704A1 (en) 2016-08-10
TWI689378B (en) 2020-04-01
TW201536479A (en) 2015-10-01
CN105636743B (en) 2021-01-08
JP2017185623A (en) 2017-10-12
JPWO2015050185A1 (en) 2017-03-09
WO2015050185A1 (en) 2015-04-09
US20160236322A1 (en) 2016-08-18
KR20160067107A (en) 2016-06-13
JP6474861B2 (en) 2019-02-27
CN105636743A (en) 2016-06-01

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