TWI682072B - Surface treatment device - Google Patents

Abstract

為了提供一種表面處理裝置，將包含藉由一個治具保持的工件之陰極設定部位設定成獨立的複數個陰極，而能對每個陰極進行精密的電流控制。 　　表面處理裝置(1)係具有：處理槽(3-1)、至少一個陽極(20)、N(N為2以上的整數)個陰極軌道(40A,40B)、複數個治具(30)及至少N個整流器(50)，處理槽(3-1)是用於收容處理液，至少一個陽極(20)是配置於處理槽內，複數個治具(30)，是將浸漬於處理液之複數個工件(2)各個分別保持，且與N個陰極軌道接觸而將複數個工件各個設定成陰極，至少N個整流器(50)是連接於N個陰極軌道各個和至少一個陽極，複數個治具各個係包含：從N個陰極軌道各個導通到複數個工件各個之不同的N個部位各個之N個導通路徑(31A,31B)，且N個導通路徑互相絕緣。In order to provide a surface treatment device, a cathode setting portion including a workpiece held by a jig is set to a plurality of independent cathodes, and precise current control can be performed for each cathode. The surface treatment device (1) has a treatment tank (3-1), at least one anode (20), N (N is an integer of 2 or more) cathode tracks (40A, 40B), a plurality of jigs (30) and At least N rectifiers (50), the processing tank (3-1) is used to contain the processing liquid, at least one anode (20) is arranged in the processing tank, and a plurality of jigs (30) are used to immerse the processing liquid Each of the plurality of workpieces (2) is held separately and is in contact with N cathode rails to set each of the plurality of workpieces as a cathode. At least N rectifiers (50) are connected to each of the N cathode rails and at least one anode. Each system includes: N conduction paths (31A, 31B) from each of the N cathode tracks to each of the different N parts of the plurality of workpieces, and the N conduction paths are insulated from each other.

Description

表面處理裝置Surface treatment device

本發明是關於將藉由治具保持之工件設定成陰極而進行處理的表面處理裝置等。The present invention relates to a surface treatment device and the like for setting a workpiece held by a jig as a cathode for processing.

在專利文獻1揭示一種電鍍裝置，是在收容有電鍍液之電鍍槽內將複數個工件間歇搬運，於複數個工件的各停止位置將流過陽極和工件(陰極)間的電流藉由整流器個別地控制，藉此將各工件進行電鍍。Patent Document 1 discloses an electroplating device that intermittently transports a plurality of workpieces in an electroplating tank containing a plating solution, and the current flowing between the anode and the workpiece (cathode) is individually separated by a rectifier at each stop position of the plurality of workpieces Local control, thereby electroplating each workpiece.

特別是在該電鍍裝置，是在電鍍槽內之各停止處位置將供應給工件的電流量累積，藉由控制裝置，當該累積値到達工件所需電流量時將昇降裝置驅動，讓用於支承搬運工件之懸吊具(hanger)移動到電鍍槽的上方，並解除對工件的通電。如此，例如可將流向多樣少量的工件之電流量個別地調整，而能對應於工件的形狀、表面積而將電流量個別地調整。Especially in the electroplating device, the amount of current supplied to the workpiece is accumulated at each stop position in the electroplating tank, and by the control device, when the accumulated value reaches the current required by the workpiece, the lifting device is driven to be used for The hanger that supports and transports the workpiece moves to the top of the electroplating tank and releases the power to the workpiece. In this way, for example, the amount of current flowing to a small number of workpieces can be individually adjusted, and the amount of current can be individually adjusted according to the shape and surface area of the workpiece.

[專利文獻1] 日本特許第2727250號公報[Patent Document 1] Japanese Patent No. 2727250

[發明所欲解決之問題][Problems to be solved by the invention]

近年，不斷要求對於工件的表面處理之更精密的控制。縱使欲將流過藉由一個治具保持之一個工件的電流利用一個整流器進行調整，起因於設置於一個治具之複數個導通路徑之電阻值的差異等，並不一定能夠實現精密的電流控制。關於這點，不管是將工件連續搬運的情況或將工件間歇搬運的情況都會發生，而是共同的問題。In recent years, there has been a continuous demand for more precise control of the surface treatment of workpieces. Even if the current flowing through a workpiece held by a jig is to be adjusted by a rectifier, it may not be possible to achieve precise current control due to the difference in resistance values of a plurality of conduction paths provided in a jig, etc. . Regarding this point, no matter whether the workpiece is continuously conveyed or the workpiece is intermittently conveyed, it is a common problem.

此外，起因於設置於一個治具之複數個導通路徑之電阻值的差異等，當將藉由一個治具所保持之複數個工件進行批次處理的情況，有同時被處理之複數個工件各個的表面處理品質不同的疑慮。In addition, due to the difference in resistance values of a plurality of conduction paths provided in one jig, etc., when a plurality of workpieces held by one jig are batch-processed, there are a plurality of workpieces that are processed simultaneously Doubts about the quality of the surface treatment.

本發明之至少一態樣，其目的是為了提供一種表面處理裝置，將包含藉由一個治具保持的工件之陰極設定部位設定成獨立的複數個陰極，而能對每個陰極進行精密的電流控制。At least one aspect of the present invention is to provide a surface treatment device that sets a cathode setting portion including a workpiece held by a jig to an independent plurality of cathodes, and can perform precise current flow to each cathode control.

本發明之其他至少一態樣，其目的是為了提供一種表面處理裝置，將藉由一個治具保持而被批次處理之複數個工件各個設定成獨立的陰極，而能對每個工件進行精密的電流控制。 [解決問題之技術手段]At least one other aspect of the present invention is to provide a surface treatment device that sets a plurality of workpieces to be processed in batches held by a jig to be independent cathodes, allowing precise precision for each workpiece Current control. [Technical means to solve the problem]

(1)本發明的一態樣，是關於一種表面處理裝置，其係具有：處理槽、至少一個陽極、N(N為2以上的整數)個陰極軌道、複數個治具、及至少N個整流器， 　　前述處理槽，是用於收容處理液， 　　前述至少一個陽極，是配置於前述處理槽內， 　　前述複數個治具，是將浸漬於前述處理液之複數個工件各個分別保持，且與前述N個陰極軌道接觸而將前述複數個工件各個設定成陰極， 　　前述至少N個整流器，是連接於前述N個陰極軌道各個和前述至少一個陽極， 　　前述複數個治具各個係包含：從前述N個陰極軌道各個導通到前述複數個工件各個之不同的N個部位各個之N個導通路徑，且前述N個導通路徑互相絕緣。(1) An aspect of the present invention relates to a surface treatment device including: a treatment tank, at least one anode, N (N is an integer of 2 or more) cathode tracks, a plurality of jigs, and at least N pieces The rectifier, 　　 the processing tank is for containing the processing liquid, 　　 the at least one anode is arranged in the processing tank, 　　 the plurality of jigs is to hold each of the plurality of workpieces immersed in the processing liquid separately N cathode rails are in contact to set each of the plurality of workpieces as a cathode, 　　 the at least N rectifiers are connected to each of the N cathode rails and the at least one anode, 　　 the plurality of fixtures each include: from the N pieces Each of the cathode rails is connected to the N conduction paths of the different N parts of the plurality of workpieces, and the N conduction paths are insulated from each other.

依據本發明的一態樣，將浸漬於處理液之複數個工件各個分別保持之複數個治具各個，係包含互相絕緣的N個導通路徑，N個導通路徑是透過N個陰極軌道而和N個整流器分別連接。藉此，將包含藉由一個治具保持的工件之供電部位設定成N個陰極。由N個整流器對N個陰極各個控制電流，藉此可將包含藉由一個治具保持之工件的N個陰極設定部位(包含工件和其周圍的虛擬被處理部亦可)精密地進行電流控制。According to one aspect of the present invention, each of the plurality of workpieces immersed in the treatment liquid is held by each of the plurality of jigs, which includes N conductive paths insulated from each other, and the N conductive paths pass through the N cathode tracks and N Rectifiers are connected separately. By this, the power supply site including the workpiece held by one jig is set to N cathodes. Each of the N cathodes is controlled by N rectifiers to control the current, so that the N cathode settings including the workpiece held by one jig (including the workpiece and the virtual processed part around it) can be precisely controlled. .

(2)依據本發明的一態樣(1)，前述N個導通路徑，可從前述N個陰極軌道各個導通到前述複數個工件各個之不同的N個部位。如此，可將藉由一個治具保持的工件設定成N個陰極，能將被處理的工件之面內均一性提高。(2) According to an aspect (1) of the present invention, the N conduction paths may be conducted from each of the N cathode tracks to N different positions of the plurality of workpieces. In this way, the workpiece held by one jig can be set to N cathodes, and the in-plane uniformity of the processed workpiece can be improved.

(3)在本發明的一態樣(2)可構成為，前述複數個治具各個，是包含將工件夾持之至少N個夾持器，前述複數個工件各個之不同的部位，是藉由前述至少N個夾持器所把持之至少各個部位。如此，可將藉由一個治具保持之工件透過N個夾持器設定成N個陰極，能將被處理的工件之面內均一性提高。(3) In one aspect (2) of the present invention, each of the plurality of jigs includes at least N holders that clamp the workpiece, and the different parts of the plurality of workpieces are borrowed At least various parts held by the aforementioned at least N holders. In this way, the workpiece held by one jig can be set to N cathodes through N holders, and the in-plane uniformity of the processed workpiece can be improved.

(4)在本發明的一態樣(3)可構成為，藉由前述至少N個夾持器所把持之前述至少各個部位，係包含藉由前述複數個治具各個所保持之前述複數個工件各個的上端部和下端部。一般而言，治具的上部夾持器和下部夾持器，因為離陰極軌道的距離不同，要將配線電阻值設定成相等是困難的，能以此電阻值的差異為前提而藉由整流器控制電流。如此，使被處理的工件之面內均一性提高。(4) In one aspect of the present invention (3), the at least each part held by the at least N holders may include the plurality of pieces held by each of the plurality of jigs The upper and lower ends of the workpiece. Generally speaking, it is difficult to set the wiring resistance value to be equal because the distance between the upper gripper and the lower gripper of the jig is different from the cathode rail. The rectifier can be used as the premise of the difference in resistance value Control current. In this way, the in-plane uniformity of the processed workpiece is improved.

(5)在本發明的一態樣(3)可構成為，前述至少一個陽極係包含：與前述複數個工件之表面及背面相對向之至少2個陽極，藉由前述至少N個夾持器把持之前述至少各個部位係包含：藉由前述複數個治具各個保持之前述複數個工件各個的前述表面和前述背面。如此，藉由一個治具保持之工件的表面和背面，可透過夾持器設定成獨立的陰極，而能在工件的表面和背面將處理品質提高。一個夾持器，如果將與工件的表背面接觸之一方設為導電部並將另一方設為絕緣部，可僅對工件的表背面之一方通電。(5) In one aspect (3) of the present invention, the at least one anode may include: at least two anodes opposed to the front and back surfaces of the plurality of workpieces, with the at least N holders The at least each part to be controlled includes the front surface and the back surface of each of the plurality of workpieces held by the plurality of jigs. In this way, the surface and back of the workpiece held by a jig can be set as independent cathodes through the holder, and the processing quality can be improved on the surface and back of the workpiece. In one holder, if one side that contacts the front and back of the workpiece is set as the conductive portion and the other side is set as the insulating portion, only one of the front and back sides of the workpiece can be energized.

(6)在本發明的一態樣(1)可構成為，前述複數個治具各個，係在前述複數個工件各個的周圍包含虛擬被處理部，前述N個導通路徑係包含：從前述N個陰極軌道之至少一個導通到前述複數個工件各個之第1導通路徑、及從前述N個陰極軌道之至少另一個導通到前述虛擬被處理部之第2導通路徑。如此，虛擬被處理部也和工件同樣地被處理。因為工件的周緣位於虛擬被處理部的內側，工件的周緣不會成為邊緣(edge)。如此，如此，在工件的周緣不會產生電場集中，所謂狗骨頭(dog bone)的厚膜部並不會發生。虛擬被處理部成為獨立於工件的陰極而進行電流控制，藉此使工件的面內均一性提高。(6) In an aspect (1) of the present invention, each of the plurality of jigs includes a virtual processed part around each of the plurality of workpieces, and the N conduction paths include: from the N At least one of the cathode tracks leads to the first conduction path of each of the plurality of workpieces, and the second conduction path leads from at least the other of the N cathode tracks to the virtual processed portion. In this way, the virtual processed part is also processed in the same way as the workpiece. Since the periphery of the workpiece is located inside the virtual processed part, the periphery of the workpiece does not become an edge. In this way, there is no electric field concentration at the periphery of the workpiece, and the thick film portion of the so-called dog bone does not occur. The virtual to-be-processed portion becomes a cathode independent of the workpiece and performs current control, thereby improving the in-plane uniformity of the workpiece.

(7)在本發明的一態樣(1)~(6)可構成為，前述至少N個整流器當中之至少2個，是由1個整流器兼用，前述1個整流器之端子，是透過前述N個陰極軌道之一而連接於前述N個導通路徑之一，且透過可變電阻器和前述N個陰極軌道之另一個而連接於前述N個導通路徑之另一個。如此般，可取代至少一個整流器而共用其他整流器的端子，且藉由可變電阻器的調整來控制供給設置於治具之N個導通路徑的至少一個之電流。(7) In one aspect (1) to (6) of the present invention, at least two of the at least N rectifiers may be used by one rectifier, and the terminals of the one rectifier may pass through the N One of the cathode tracks is connected to one of the N conduction paths, and is connected to the other of the N conduction paths through the variable resistor and the other of the N cathode tracks. In this way, the terminals of other rectifiers can be shared instead of at least one rectifier, and the current supplied to at least one of the N conduction paths provided in the jig can be controlled by the adjustment of the variable resistor.

(8)在本發明的一態樣(1)~(7)可構成為，進一步具有間歇搬運裝置，該間歇搬運裝置是將前述複數個治具以前述處理槽內的M個(M為2以上的整數)停止位置為起點及/或終點而間歇地搬運，前述N個陰極軌道各個，是與分別停止於前述M個停止位置之M個治具分別接觸，且包含被電氣絕緣的M個導電部，前述複數個整流器是對應於合計N×M個的導電部而設有N×M個，將前述N×M個的整流器各個與前述N×M個的導電部各個連接。本發明的一態樣也能適用於連續搬運式的表面處理裝置，上述的情況需要N×M條的陰極軌道。特別適用於可將陰極軌道的數量減少到N條(各1條有M個導電部)之間歇搬運式的表面處理裝置。(8) In one aspect (1) to (7) of the present invention, it may be configured to further have an intermittent conveying device that uses the plurality of jigs in the processing tank (M is 2 (Integer above) The stop position is the starting point and/or the end point and is transported intermittently. Each of the N cathode rails is in contact with M fixtures respectively stopped at the M stop positions, and includes M electrically insulated In the conductive portion, the plurality of rectifiers are provided with N×M corresponding to a total of N×M conductive portions, and each of the N×M rectifiers is connected to the N×M conductive portions. The aspect of the present invention can also be applied to a continuous conveying type surface treatment device. In the above case, N×M cathode tracks are required. It is especially suitable for intermittent conveying type surface treatment equipment which can reduce the number of cathode rails to N (each has M conductive parts).

(9)在本發明的一態樣(1)~(8)可構成為，前述至少一個陽極係包含：與分別停止於前述M個停止位置之M個工件相對向之至少M個陽極，將前述M個陽極各個，和與分別停止於前述M個停止位置之M個治具各個連接之N個整流器共同連接。如此般，對於複數個工件各個，是讓複數個陰極及一個陽極絕緣地連接，因此每個工件之完全個別供電及工件內的陰極分割成為可能。(9) In one aspect (1) to (8) of the present invention, the at least one anode system may include: at least M anodes opposed to the M workpieces stopped at the M stopping positions respectively, and Each of the M anodes is connected to N rectifiers connected to the M fixtures respectively stopped at the M stop positions. In this way, for each of the plurality of workpieces, a plurality of cathodes and an anode are insulatedly connected, so that it is possible to completely supply power for each workpiece individually and divide the cathode in the workpiece.

(10)本發明的其他態樣，是關於一種表面處理裝置，其係具備：處理槽、至少一個陽極、N個(N為複數)陰極連接部、治具、及N個整流器， 　　前述處理槽，是用於收容處理液， 　　前述至少一個陽極，是配置於前述處理槽內， 　　前述治具，是用於保持浸漬於前述處理液之複數個工件，且與前述複數個陰極連接部接觸而將前述複數個工件各個設定成獨立的陰極， 　　前述N個整流器，是連接於前述N個陰極連接部各個和前述至少一個陽極， 　　前述複數個治具係包含：從前述N個陰極連接部各個導通到前述複數個工件各個之N個導通路徑，且前述N個導通路徑互相絕緣。依據本發明的其他態樣，可將被批次處理之複數個工件各個設定成獨立的陰極而進行精密的電流控制。(10) Another aspect of the present invention relates to a surface treatment device including: a treatment tank, at least one anode, N (N is plural) cathode connection parts, a jig, and N rectifiers, and the aforementioned treatment tank Is used to contain the processing liquid, 　　 the at least one anode is disposed in the processing tank, 　　 the jig is used to hold a plurality of workpieces immersed in the processing liquid, and is in contact with the plurality of cathode connections Each of the plurality of workpieces is set as an independent cathode, 　　The N rectifiers are connected to each of the N cathode connection portions and the at least one anode, 　　The plurality of fixtures includes: from each of the N cathode connection portions to N conduction paths of each of the plurality of workpieces, and the N conduction paths are insulated from each other. According to other aspects of the present invention, a plurality of workpieces to be processed in batches can be set as independent cathodes for precise current control.

(11)在本發明的其他態樣(10)可構成為，前述N×M個的整流器當中之至少2個是由1個整流器兼用，前述1個整流器的端子，是與導通到前述M個工件之一之不同的N個部位之N個導通路徑之一直接連接，且與前述N個導通路徑之另一個是透過可變電阻器而連接。如此般，可取代至少一個整流器而共用其他整流器的端子，且藉由可變電阻器的調整，來控制供給導通到M個工件之一之不同的N個部位之N個導通路徑之至少一個的電流。(11) In another aspect (10) of the present invention, at least two of the N×M rectifiers may be used by one rectifier, and the terminals of the one rectifier may be connected to the M One of the N conduction paths of different N parts of one of the workpieces is directly connected, and is connected to the other of the aforementioned N conduction paths through a variable resistor. In this way, at least one rectifier can be replaced and the terminals of other rectifiers can be shared, and the adjustment of the variable resistor can be used to control the supply of at least one of the N conduction paths conducting to different N parts of one of the M workpieces. Current.

以下，針對本發明的較佳實施形態詳細地說明。又以下所說明之本實施形態，並不是用於對申請專利範圍所記載之本發明的內容做不當地限定，本實施形態所說明的構成全體，作為本發明的解決手段不一定是必須的。Hereinafter, preferred embodiments of the present invention will be described in detail. The present embodiment described below is not intended to improperly limit the content of the present invention described in the scope of the patent application. The entire structure described in the present embodiment is not necessarily required as a solution to the present invention.

1.複數個處理單元 　　圖1係本實施形態的電鍍裝置(廣義來說，表面處理裝置)之剖面圖。圖1中，該電鍍裝置1中，用於將電路基板等的工件2電鍍之電鍍處理部是將1個以上的處理單元3-1~3-n(n為自然數)連結而構成。複數個處理單元3-1~3-n可具有實質相同的構造。在複數個處理單元3-1~3-n各個，可將工件2連續搬運，亦可將工件2間歇搬運。間歇搬運式的電鍍裝置1的情況，在複數個處理單元3-1~3-n各個，可讓至少一個、圖1中為M個(M為2以上的整數)例如M=4個的工件2間歇停止。圖1顯示最大尺寸的工件2，電鍍裝置1具有可處理此最大尺寸以下的工件2之通用性。以下，是舉間歇搬運式的電鍍裝置1為例來做說明。又本發明當然也能適用於不將複數個處理單元連結的構造，亦即適用於在單一處理單元將複數個工件間歇或連續搬運者。1. A plurality of processing units FIG. 1 is a cross-sectional view of an electroplating apparatus (broadly speaking, a surface treatment apparatus) of this embodiment. In FIG. 1, in this plating apparatus 1, a plating processing section for plating a workpiece 2 such as a circuit board is configured by connecting one or more processing units 3-1 to 3-n (n is a natural number). The plurality of processing units 3-1~3-n may have substantially the same structure. In each of the plurality of processing units 3-1 to 3-n, the workpiece 2 can be continuously conveyed or the workpiece 2 can be intermittently conveyed. In the case of the intermittent transport type electroplating apparatus 1, in each of the plurality of processing units 3-1 to 3-n, at least one, M pieces in FIG. 1 (M is an integer of 2 or more), for example, M=4 pieces 2 Intermittent stop. FIG. 1 shows the workpiece 2 of the maximum size, and the electroplating apparatus 1 has the versatility to handle the workpiece 2 below the maximum size. Hereinafter, the electroplating apparatus 1 of the intermittent conveyance type will be described as an example. Of course, the present invention can also be applied to a structure that does not connect a plurality of processing units, that is, to a person who intermittently or continuously transports a plurality of workpieces in a single processing unit.

工件2，是藉由後述的間歇搬運裝置，從現在的停止位置朝向下一個停止位置沿A方向依序被間歇搬運。在本實施形態，一個工件2是在各處理單元內停止於M=4處。亦可在最上游的處理單元3-1之上游側連結搬入單元4，搬入單元4是藉由往B方向的下降移動而將工件2搬入。當處理單元3-1內的工件2被間歇搬運時，搬入單元4內的工件2也被間歇搬運而移動到處理單元3-1。亦可在最下游的處理單元3-n之下游側連結搬出單元5，搬出單元5是讓從處理單元3-n水平移動的工件2往C方向上昇而將其搬出。在處理單元3-n內的工件2被間歇搬運之前，搬出單元5內的工件2被往上方搬出。但將搬入單元4及/或搬出單元5省略亦可。在此情況，是在處理單元3-1的最上游停止位置讓工件2下降，讓處理單元3-n的最下游停止位置的工件2上昇而被搬出。The workpiece 2 is sequentially intermittently conveyed in the direction A from the current stop position to the next stop position by an intermittent conveying device described later. In this embodiment, one workpiece 2 is stopped at M=4 in each processing unit. The carrying-in unit 4 may be connected to the upstream side of the processing unit 3-1 at the most upstream, and the carrying-in unit 4 carries the work 2 in by moving downward in the direction B. When the workpiece 2 in the processing unit 3-1 is intermittently transported, the workpiece 2 in the transport unit 4 is also intermittently transported and moved to the processing unit 3-1. The unloading unit 5 may be connected to the downstream side of the most downstream processing unit 3-n. The unloading unit 5 moves the workpiece 2 horizontally moved from the processing unit 3-n in the C direction to carry it out. Before the workpiece 2 in the processing unit 3-n is intermittently transported, the workpiece 2 in the unloading unit 5 is carried out upward. However, the carrying-in unit 4 and/or carrying-out unit 5 may be omitted. In this case, the workpiece 2 is lowered at the most upstream stop position of the processing unit 3-1, and the workpiece 2 at the most downstream stop position of the processing unit 3-n is raised to be carried out.

圖2係具有與處理單元3-2~3-n共同的構造之處理單元3-1的俯視圖。處理單元3-1具有：用於收容電鍍液(廣義來說，處理液)之分割處理槽6。工件2浸漬於分割處理槽6內的電鍍液。分割處理槽6是在上方開口之大致箱體，在上游側及下游側的間隔壁分別設有開口6A,6B，藉此在相鄰單元(處理單元、搬入單元或搬出單元)之間容許工件2的水平移動。FIG. 2 is a top view of the processing unit 3-1 having a structure common to the processing units 3-2 to 3-n. The processing unit 3-1 has a divided processing tank 6 for containing a plating solution (broadly speaking, a processing solution). The workpiece 2 is immersed in the plating solution in the division processing tank 6. The split processing tank 6 is a substantially box that opens upward, and the upstream and downstream partition walls are provided with openings 6A, 6B, respectively, to allow workpieces between adjacent units (processing unit, carrying unit, or carrying unit) 2. Horizontal movement.

在本實施形態，在位於處理單元3-1內之M=4個停止位置之工件2的表面及背面之至少一方側設置至少一個陽極20。在本實施形態是設置：與位於各停止位置之各個工件2的表面相對向之陽極20A、及與工件2的背面相對向之陽極20B。陽極20(20A,20B)各個可包含：互相導通之複數個分割陽極。在本實施形態，是分割成上游側的分割陽極20A1(20B1)和下游側的分割陽極20A2(20B2)。陽極20亦可包含被分割成3個以上之分割陽極，因為互相導通而可視為一個陽極。In this embodiment, at least one anode 20 is provided on at least one side of the front and back surfaces of the workpiece 2 located at M=4 stop positions in the processing unit 3-1. In this embodiment, an anode 20A opposed to the surface of each workpiece 2 at each stop position and an anode 20B opposed to the rear surface of the workpiece 2 are provided. Each of the anodes 20 (20A, 20B) may include: a plurality of divided anodes that are connected to each other. In this embodiment, it is divided into an upstream divided anode 20A1 (20B1) and a downstream divided anode 20A2 (20B2). The anode 20 may also include three or more divided anodes, which can be regarded as one anode because of mutual conduction.

圖3係顯示配置於處理單元3-1之陽極20A1, 20A2(20B1,20B2)和工件2的位置關係之前視圖。如圖3所示般，工件2是藉由搬運治具30保持。如圖2及圖3所示般，陽極20(20A,20B)各個配置成，正對著位於4個停止位置之工件2。要點在於，如圖2所示般，只要能在設定成陰極之工件2和陽極20之間形成均一的電場即可。陽極20的形狀沒有特別的限制，圖2及圖3所示的陽極的輪廓雖呈矩形，但俯視下的輪廓呈圓形亦可。陽極是不溶性陽極或可溶性陽極皆可。3 is a front view showing the positional relationship between the anodes 20A1, 20A2 (20B1, 20B2) and the workpiece 2 disposed in the processing unit 3-1. As shown in FIG. 3, the workpiece 2 is held by the transfer jig 30. As shown in FIGS. 2 and 3, the anodes 20 (20A, 20B) are each arranged so as to face the workpiece 2 at four stop positions. The point is that, as shown in FIG. 2, it is only necessary to form a uniform electric field between the workpiece 2 and the anode 20 which are set as cathodes. The shape of the anode 20 is not particularly limited. Although the outline of the anode shown in FIGS. 2 and 3 is rectangular, the outline in plan view may be circular. The anode may be either an insoluble anode or a soluble anode.

在本實施形態可具有：將一個處理單元3-1區劃成4個槽室11-1~11-4之遮蔽板23。在各槽室11-1~11-4內，於俯視下之工件2的兩側配置陽極20(20A1,20A2, 20B1,20B2)。遮蔽板23是用於遮蔽在相鄰槽室間之電場(圖2之箭頭所示之陽極-陰極間的電場)的影響。在遮蔽板23形成有：讓工件2通過之開口23A。In this embodiment, it is possible to include a shielding plate 23 that divides one processing unit 3-1 into four chambers 11-1 to 11-4. In each of the chambers 11-1 to 11-4, anodes 20 (20A1, 20A2, 20B1, 20B2) are arranged on both sides of the workpiece 2 in a plan view. The shielding plate 23 is for shielding the influence of the electric field between the adjacent cells (the electric field between the anode and the cathode shown by arrows in FIG. 2). The shielding plate 23 has an opening 23A through which the workpiece 2 passes.

2.搬運治具 　　圖4係顯示搬運治具30的一例。該搬運治具30係具有：水平臂部300、垂直臂部310、工件保持部320、被導引部330、複數例如2個的第1,第2被供電部340A,340B、以及被推動片350。水平臂部300，是沿著與間歇搬運方向A正交的方向B延伸。垂直臂部310是藉由水平臂部300以垂下的方式保持。工件保持部320固定於垂直臂部310。工件保持部320係包含：上部框架321、及藉由上部框架321例如可昇降地支承之下部框架322。在上部框架321設置：用於夾持工件2的上部之複數個夾持器323。在下部框架322設置：用於夾持工件2的下部之複數個夾持器324。利用下部的夾持器324，對工件2賦予向下的張力。但當工件2較厚的情況，或從工件2的下部不供電的情況，將下部框架322及夾持器324省略亦可。2. Transportation jig Figure 4 shows an example of transportation jig 30. The transport jig 30 includes a horizontal arm 300, a vertical arm 310, a workpiece holding part 320, a guided part 330, a plurality of, for example, two first, second powered parts 340A, 340B, and a pushed piece 350. The horizontal arm 300 extends in a direction B orthogonal to the intermittent conveying direction A. The vertical arm 310 is held down by the horizontal arm 300. The workpiece holding portion 320 is fixed to the vertical arm portion 310. The workpiece holding portion 320 includes an upper frame 321 and a lower frame 322 that is supported by the upper frame 321 so as to be movable up and down. The upper frame 321 is provided with a plurality of grippers 323 for gripping the upper part of the work 2. The lower frame 322 is provided with a plurality of clamps 324 for clamping the lower part of the workpiece 2. The lower gripper 324 applies downward tension to the workpiece 2. However, when the workpiece 2 is thick or no power is supplied from the lower part of the workpiece 2, the lower frame 322 and the holder 324 may be omitted.

被導引部330，是藉由沿著處理單元3-2~3-n配置而在例如以每個處理單元3-2~3-n為單位而被分割的導軌(未圖示)導引，且是用於將搬運治具30進行直線導引。被導引部330可包含：與導軌的頂面轉動接觸之滾子331、及與導軌的兩側面轉動接觸之滾子332(圖4中，僅圖示出與一側面轉動接觸之滾子)。The guided portion 330 is guided by a guide rail (not shown) divided by, for example, each processing unit 3-2 to 3-n by being arranged along the processing unit 3-2 to 3-n , And is used to linearly guide the transport jig 30. The guided portion 330 may include: a roller 331 that is in rotational contact with the top surface of the guide rail, and a roller 332 that is in rotational contact with both side surfaces of the guide rail (in FIG. 4, only the roller that is in rotary contact with one side surface is shown) .

第1,第2被供電部340，是與圖5及圖6(A)(B)所說明的陰極軌道40A,40B接觸，透過圖7所示之2個導通路徑31A,31B而將工件2設定成2個陰極。第1,第2被供電部340A,340B分別包含：藉由沿著間歇搬運方向A延伸之第1,第2支承臂341A,341B的上游側和下游側支承之2個接觸子342,343。接觸子342,343，是透過平行連桿機構而藉由支承臂341支承，且以壓接於圖5所示之陰極軌道40A(40B)的方式被彈簧蓄勢。又當被供電部340的數量為3個以上的情況，與其匹配而使陰極軌道40的數量也成為3個以上。The first and second power-supplied parts 340 are in contact with the cathode rails 40A, 40B described in FIGS. 5 and 6(A)(B), and the workpiece 2 is passed through the two conduction paths 31A, 31B shown in FIG. 7. Set to 2 cathodes. The first and second power-feeding portions 340A, 340B include two contactors 342, 343 supported by the upstream and downstream sides of the first and second support arms 341A, 341B extending along the intermittent conveying direction A, respectively. The contact pieces 342, 343 are supported by the support arm 341 through the parallel link mechanism, and are spring-loaded so as to be crimped to the cathode rail 40A (40B) shown in FIG. In addition, when the number of power-supplied parts 340 is three or more, the number of cathode rails 40 is also matched to three or more.

被推動片350，是固定於例如垂直臂部310，在工件保持部320之正上方位置將被推動片350垂直地配置。被推動片350是藉由後述的間歇搬運裝置從圖示C方向推動，而對搬運治具30傳遞間歇搬運力。在圖4所示的搬運治具30設有：使用於連續搬運時之被卡合部360，而讓搬運治具30可兼用於間歇搬運及連續搬運。The pushed piece 350 is fixed to, for example, the vertical arm portion 310, and the pushed piece 350 is vertically arranged at a position directly above the workpiece holding portion 320. The pushed piece 350 is pushed from the direction C shown in the figure by an intermittent conveying device described later, and transmits an intermittent conveying force to the conveying jig 30. The conveyance jig 30 shown in FIG. 4 is provided with the engaged portion 360 for continuous conveyance, and the conveyance jig 30 can be used for both intermittent conveyance and continuous conveyance.

3.N個陰極軌道、N個導通路徑及N×M個的整流器 　　如圖5所示般，各處理單元3-1~3-n(圖5僅圖示出2個處理單元)係具有N根(N為2以上的整數)例如N=2根的陰極軌道40A,40B。2根陰極軌道40A,40B配置成與搬運方向A平行。2根陰極軌道40A,40B各個較佳為具有：以每個處理單元3-1~3-n為單位而被分割之複數根分割陰極軌道40-1~40-n(圖5僅顯示2根分割陰極軌道40-1,40-2)，且連結成在搬運方向A呈連續。如圖5及圖6(A)所示般，分割陰極軌道40-1~40-n各個，係在絕緣軌道41上隔著間隔(非導電部)42而在讓工件2停止之各槽室分別設置一個導電部43，即合計設有4個導電部43。設置於陰極軌道40A之4個導電部43各個，是在各處理單元3-1~3-n的4處的停止位置，與將工件2保持而停止後之圖4所示的搬運治具30之第1被供電部340A(2個接觸子342,343)電氣導通。設置於陰極軌道40B之4個導電部43各個，是在各處理單元3-1~3-n的4處的停止位置，與將工件2保持而停止後之圖4所示的搬運治具30之第2被供電部340B(2個接觸子342,343)電氣導通。又在圖5顯示在各處理單元3-1~3-n所收容之電鍍液的液面L，工件2浸漬於電鍍液中。3. N cathode tracks, N conduction paths, and N×M rectifiers are as shown in FIG. 5, and each processing unit 3-1 to 3-n (FIG. 5 only shows two processing units) has N The root (N is an integer of 2 or more), for example, N=2 cathode rails 40A, 40B. The two cathode rails 40A and 40B are arranged parallel to the conveying direction A. Each of the two cathode rails 40A and 40B preferably has: a plurality of divided cathode rails 40-1 to 40-n divided in units of each processing unit 3-1 to 3-n (FIG. 5 shows only two The cathode rails 40-1, 40-2) are divided and connected so as to be continuous in the conveying direction A. As shown in FIG. 5 and FIG. 6(A), each of the cathode rails 40-1 to 40-n is divided, and the insulating rail 41 is placed in each chamber where the workpiece 2 is stopped with a gap (non-conductive portion) 42 One conductive portion 43 is provided respectively, that is, four conductive portions 43 are provided in total. Each of the four conductive portions 43 provided on the cathode rail 40A is at a stop position at four positions of each processing unit 3-1 to 3-n, and the transport jig 30 shown in FIG. 4 after holding and stopping the workpiece 2 The first powered portion 340A (two contacts 342, 343) is electrically conducted. Each of the four conductive portions 43 provided on the cathode rail 40B is at a stop position at four positions of each processing unit 3-1 to 3-n, and the transport jig 30 shown in FIG. 4 after holding and stopping the workpiece 2 The second powered part 340B (two contacts 342, 343) is electrically conducted. 5 shows the liquid surface L of the plating solution contained in each processing unit 3-1 to 3-n, and the workpiece 2 is immersed in the plating solution.

如圖6(B)所示般，在2根陰極軌道4040A,40B共用之絕緣軌道41之寬度方向的兩端設有間隔壁44A,44A，藉此可在導電部43上保持非油性的導電性流體(例如水)45。如此般，透過導電性流體45可更確實地保證被供電部340(2個接觸子342,343)和導電部43的電氣接觸。但因為水的導電性比金屬製之導電部43的導電性低得多，相鄰的導電部43,43間的絕緣性被維持住。此外，如圖6(B)所示般，用於將導電部43固定在絕緣軌道41上之螺栓46，可配置在隔著第1,第2被供電部340A,340B之行進路線的兩側。藉此，不須在導電部34設置螺栓的埋頭孔，可排除形成電阻的主要原因。As shown in FIG. 6(B), partition walls 44A, 44A are provided at both ends in the width direction of the insulating rail 41 shared by the two cathode rails 4040A, 40B, thereby maintaining non-oily conductivity on the conductive portion 43 Sexual fluid (eg water) 45. In this way, the conductive fluid 45 can more surely ensure the electrical contact between the powered portion 340 (two contacts 342, 343) and the conductive portion 43. However, since the conductivity of water is much lower than that of the conductive portion 43 made of metal, the insulation between the adjacent conductive portions 43 and 43 is maintained. In addition, as shown in FIG. 6(B), the bolt 46 for fixing the conductive portion 43 to the insulating rail 41 may be arranged on both sides of the travel path between the first and second power-supplying portions 340A, 340B . Thereby, it is not necessary to provide countersunk holes for bolts in the conductive portion 34, which can eliminate the main cause of the formation of resistance.

各處理單元3-1~3-n，是在讓工件2停止的M=4的各槽室分別設有N=2個整流器50，即合計設有M×N=8個的整流器50(圖5，對於處理單元3-1~3-n僅顯示8個整流器50)。8個整流器50當中之對應於各槽室(工件2的停止位置)而配置之一對整流器50之一方的正端子51，是與配置於各槽室之陽極20A1,20A2共同連接，一對整流器50之一方的負端子52是在供電軌道40A上與對應於各槽室之導電部43連接。一對整流器50之另一方的正端子51，是與配置於各槽室之陽極20B1,20B2共同連接，一對整流器50之另一方的負端子52，是在供電軌道40B上與對應於各槽室之導電部43連接。Each processing unit 3-1 to 3-n is provided with N=2 rectifiers 50 in each tank of M=4 where the workpiece 2 is stopped, that is, a total of M×N=8 rectifiers 50 (FIG. 5. Only 8 rectifiers 50 are displayed for the processing units 3-1~3-n. Among the eight rectifiers 50, one pair of positive terminals 51 corresponding to each cell (stop position of the workpiece 2) is arranged, and is connected to the anodes 20A1, 20A2 arranged in each cell, a pair of rectifiers One negative terminal 52 is connected to the conductive portion 43 corresponding to each cell on the power supply rail 40A. The other positive terminal 51 of the pair of rectifiers 50 is connected to the anodes 20B1 and 20B2 arranged in each cell. The other negative terminal 52 of the pair of rectifiers 50 is corresponding to each slot on the power supply rail 40B The conductive portion 43 of the chamber is connected.

如圖7之示意圖所示般，搬運治具30係具有：從2根陰極軌道40A,40B各個導通到工件2之不同的N=2個部位之N=2個的第1,第2導通路徑31A,31B。在圖7的例子，第1導通路徑31A是與工件2的上部連接，第2導通路徑31B是與工件2的下部連接。第1導通路徑31A包含第1被供電部340A，第2導通路徑31B包含第2被供電部340B。並列配置於搬運治具30之第1,第2被供電部340A,340B，是與圖5所示之N=2根之並列的陰極軌道40A,40B分別接觸，而將工件2設定成可獨立地進行電流控制之N=2個的陰極。如果N為3以上的話，能將工件2設定成可獨立地進行電流控制之N=3以上的陰極。As shown in the schematic diagram of FIG. 7, the transport jig 30 has: from the two cathode rails 40A, 40B each conducting to the different N=2 parts of the workpiece 2 N=2 first and second conducting paths 31A, 31B. In the example of FIG. 7, the first conduction path 31A is connected to the upper part of the workpiece 2, and the second conduction path 31B is connected to the lower part of the workpiece 2. The first conduction path 31A includes the first power-supplied portion 340A, and the second conduction path 31B includes the second power-supplied portion 340B. The first and second powered parts 340A, 340B arranged in parallel on the transport jig 30 are in contact with the N=2 parallel cathode rails 40A, 40B shown in FIG. 5 respectively, and the workpiece 2 is set to be independent N=2 cathodes for current control. If N is 3 or more, the workpiece 2 can be set to a cathode with N=3 or more that can independently perform current control.

第1導通路徑31A係包含上部框架321及夾持器323。此外，第2導通路徑321B係包含下部框架322及夾持器324。使上部框架321和下部框架322絕緣而成為獨立的導通路徑之治具，是例如記載於本案申請人所提出之日本特許5898540號、日本特願2017-204603號。在該治具中，如果將從第1被供電部340A到上部框架321的導通路徑、從第2被供電部340B到下部框架322的導通路徑藉由例如配線等形成電氣絕緣，即可確立圖6所示的第1,第2導通路徑31A,31B。The first conduction path 31A includes an upper frame 321 and a holder 323. In addition, the second conduction path 321B includes a lower frame 322 and a holder 324. The jig for insulating the upper frame 321 and the lower frame 322 into independent conduction paths is described in, for example, Japanese Patent No. 5898540 and Japanese Patent Application No. 2017-204603 proposed by the applicant of the present case. In this jig, if the conduction path from the first power-supplied portion 340A to the upper frame 321 and the conduction path from the second power-supplied portion 340B to the lower frame 322 are electrically insulated by, for example, wiring, the figure can be established The first and second conduction paths 31A and 31B shown in 6 are shown.

在圖7的例子，透過圖5所示的上部夾持器323流到工件2的上部之電流、透過下部夾持器324而流到工件2的下部之電流，是藉由2個整流器50獨立地控制。治具30的上部夾持器323和下部夾持器324，因為離陰極軌道40A,40B的距離不同，要將配線電阻值設定成相等是困難的，但能以此電阻值的差異為前提，而藉由2個整流器50將電流分別獨立地控制。如此，在工件2的上部和下部讓大致相等的電流流過，而使被處理後的工件之面內均一性提高。In the example of FIG. 7, the current flowing through the upper holder 323 shown in FIG. 5 to the upper part of the workpiece 2 and the current flowing through the lower holder 324 to the lower part of the workpiece 2 are independent by the two rectifiers 50地控制。 To control. Since the upper holder 323 and the lower holder 324 of the jig 30 have different distances from the cathode rails 40A and 40B, it is difficult to set the wiring resistance value to be equal, but this difference can be used as a premise, The two rectifiers 50 control the current independently. In this way, substantially equal current flows through the upper and lower parts of the workpiece 2 to improve the in-plane uniformity of the processed workpiece.

將藉由一個治具30保持的工件2設定成N個陰極時，並不限定於像圖7的例子那樣的設定成上下2個陰極。例如，亦可將複數個上部夾持器323各個連接於不同的整流器50，而且將複數個下部夾持器324各個連接於不同的整流器50。如此，能夠實現對N=3以上的部位各個進行獨立地電流控制。此外，亦可對工件2的表面和背面供給被獨立地控制之電流。如此，藉由一個治具30保持之工件2的表面和背面，分別藉由不同的整流器50供給獨立地控制之電流，而能將在工件2的表面和背面之處理品質提高。保持工件2之一個夾持器，可將與工件2的表背面接觸之一方設為導電部並將另一方設為絕緣部，如此可僅對工件2之表背面的一方通電。如此，在圖7的例子，如果上部夾持器323僅對工件2的表面通電，下部夾持器324僅對工件2的背面通電，則可對工件2的表背面分別供給獨立地控制之電流。此外，亦可對工件2的上部/下部和表面/背面的雙方分別供給獨立地控制之電流。When the workpiece 2 held by one jig 30 is set to N cathodes, it is not limited to the two cathodes set up and down as in the example of FIG. 7. For example, each of the plurality of upper holders 323 may be connected to different rectifiers 50, and each of the plurality of lower holders 324 may be connected to different rectifiers 50. In this way, it is possible to realize independent current control of each part of N=3 or more. In addition, independently controlled current may be supplied to the front and back surfaces of the work 2. In this way, the surface and back surface of the workpiece 2 held by one jig 30 are supplied with currents independently controlled by different rectifiers 50, respectively, and the processing quality on the surface and back surface of the workpiece 2 can be improved. One holder holding the work 2 can set one side in contact with the front and back sides of the work 2 as a conductive part and the other side as an insulation part, so that only one side of the front and back sides of the work 2 can be energized. In this way, in the example of FIG. 7, if the upper gripper 323 energizes only the surface of the workpiece 2 and the lower gripper 324 energizes only the back of the workpiece 2, independently controlled currents can be supplied to the front and back of the workpiece 2 . In addition, independently controlled currents can be supplied to both the upper part/lower part and the front/back side of the workpiece 2.

4.工件2停止時的電流控制 　　在各處理單元3-1~3-n之M=4處的停止位置(槽室)，流過M=4個的工件2各個之電流，是藉由在各槽室分別設有2個之整流器50各個獨立地控制。而且，在槽室間使陰極彼此絕緣，陽極彼此也絕緣，因此讓各個工件2絕緣分離，而能藉由各整流器50將工件2個別地進行供電控制。此外，在槽室間是利用遮蔽板23將電場分離，因此可排除槽室間的影響，而保證每個工件2的個別供電。如此，能讓工件2的電鍍品質提高。4. The current when workpiece 2 stops is controlled at the stop position (chamber) at M=4 of each processing unit 3-1~3-n. The current flowing through each workpiece 2 of M=4 is Each tank is provided with two rectifiers 50, which are independently controlled. In addition, the cathodes are insulated from each other, and the anodes are also insulated from each other. Therefore, the work pieces 2 are insulated and separated, and the work pieces 2 can be individually controlled by each rectifier 50. In addition, the shielding plate 23 is used to separate the electric field between the chambers, so that the influence between the chambers can be eliminated, and the individual power supply for each workpiece 2 can be ensured. In this way, the plating quality of the workpiece 2 can be improved.

本實施形態的間歇搬運方式，與習知之連續搬運方式進行比對的結果，習知之被連續搬運的工件(陰極)和被固定的陽極之位置關係不斷改變，反而本實施形態之停止的工件(陰極)2是可正對著陽極20。如此般，在工件2停止中，陰極和陽極的位置關係成為一定，各工件成為同一電鍍條件，因此可期待電鍍品質的提高。特別是如果工件2停止的話，接觸電阻的變動就不會發生，因此可進行精密的電流控制。此外，在連續搬運所使用之很長的陰極軌道途中設有固定螺栓用的埋頭孔等，因此陰極軌道的電阻値會因場所而有不同，無法成為均一的電阻。因此，依工件之連續搬運中的位置，流過工件的電流會有不同，間歇搬運則可解決這樣的問題。再者，本實施形態也不像連續搬運那樣，電鍍品質並不會受工件的連續搬運速度之不良影響。The intermittent conveying method of this embodiment is compared with the conventional continuous conveying method. The positional relationship between the workpiece (cathode) that is continuously conveyed and the fixed anode is changed continuously, but the stopped workpiece (this embodiment) The cathode 2 can be directly facing the anode 20. In this way, while the workpiece 2 is stopped, the positional relationship between the cathode and the anode becomes constant, and each workpiece becomes the same plating condition. Therefore, it is expected that the plating quality will be improved. In particular, if the workpiece 2 is stopped, no change in contact resistance occurs, so precise current control can be performed. In addition, countersunk holes for fixing bolts and the like are provided on the way of the long cathode rails used for continuous transportation. Therefore, the resistance value of the cathode rails differs depending on the location and cannot be a uniform resistance. Therefore, the current flowing through the workpiece will be different depending on the position of the workpiece during continuous transportation. Intermittent transportation can solve such a problem. Furthermore, in this embodiment, unlike continuous conveying, the plating quality is not adversely affected by the continuous conveying speed of the workpiece.

然而，不一定要實施上述般的完全個別供電來將工件2間歇搬運。亦即，在各處理單元3-1~3-n之4個槽室11-1~11-4，將陽極設定為共用亦可。此外，取代間歇搬運而將工件2連續搬運亦可，在此情況，圖5及圖6(A)所示之導電部43間的間隔(非導電部)42變得不需要。However, it is not necessary to implement the above-described completely individual power supply to intermittently transport the workpiece 2. That is, the anodes may be set to be common in the four chambers 11-1 to 11-4 of each processing unit 3-1 to 3-n. In addition, instead of intermittent conveyance, the workpiece 2 may be continuously conveyed. In this case, the interval (non-conductive portion) 42 between the conductive portions 43 shown in FIGS. 5 and 6(A) becomes unnecessary.

5.工件2間歇搬運中的電流控制 　　連工件2在槽室間被間歇搬運的期間，也藉由整流器50對工件2供給電流。在此，在間歇搬運中，圖4所示之搬運治具30的2個接觸子342,343之至少一方是與陰極軌道上的導電部43接觸。亦即，縱使搬運上游側的接觸子342在間隔42的位置與絕緣軌道41接觸，搬運下游側的接觸子343仍與導電部43接觸。同樣的，縱使搬運下游側的接觸子343在間隔42的位置與絕緣軌道41接觸，搬運上游側的接觸子342仍與相鄰的槽室之導電部43接觸。在這些過程，搬運下游側的接觸子343是與例如槽室11-1的導電部43接觸，搬運上游側的接觸子342是與槽室11-2的導電部43。在此情況，工件2是從對應於槽室11-1及槽室11-2之2個整流器50供給電流。圖8係顯示在槽室間移動的過程的狀態(轉乘狀態)之示意圖。在圖8中，將圖4所示的搬運治具30之被供電部340示意地顯示，被供電部340(第1,第2被供電部340A,340B的總稱)是與上游側槽室的導電部43及下游側槽室的導電部43接觸。在此，若維持工件2停止時之整流器50的輸出而將工件2間歇搬運，會有在與2個整流器50連接之轉乘中的工件2過渡地讓2倍電流流過的疑慮。特別是間歇搬運速度越慢，過渡電流的影響越大。5. Current control during intermittent conveyance of work piece 2 Even during the intermittent conveyance of work piece 2 between tanks, current is supplied to work piece 2 by rectifier 50. Here, during intermittent conveyance, at least one of the two contact pieces 342, 343 of the conveying jig 30 shown in FIG. 4 is in contact with the conductive portion 43 on the cathode rail. That is, even if the contact 342 on the upstream side of the conveyance contacts the insulating rail 41 at the position of the space 42, the contact 343 on the downstream side of the conveyance still contacts the conductive portion 43. Similarly, even if the contact 343 on the downstream side of the conveyance contacts the insulating rail 41 at the position of the space 42, the contact 342 on the upstream side of the conveyance still contacts the conductive portion 43 of the adjacent cell. In these processes, the contact 343 on the conveyance downstream side is in contact with, for example, the conductive portion 43 of the tank 11-1, and the contact 342 on the conveyance upstream side is in contact with the conductive portion 43 of the tank 11-2. In this case, the workpiece 2 is supplied with current from the two rectifiers 50 corresponding to the chamber 11-1 and the chamber 11-2. FIG. 8 is a schematic diagram showing the state (transfer state) of the process of moving between tanks. In FIG. 8, the power-supplied portion 340 of the transport jig 30 shown in FIG. 4 is schematically shown. The power-supplied portion 340 (general term for the first and second power-supplied portions 340A, 340B) is the same as the upstream side chamber. The conductive portion 43 is in contact with the conductive portion 43 of the downstream chamber. Here, if the output of the rectifier 50 is maintained while the workpiece 2 is stopped and the workpiece 2 is intermittently transported, there may be a possibility that a double current flows through the workpiece 2 in transit when connected to the two rectifiers 50. In particular, the slower the intermittent transport speed, the greater the influence of the transient current.

在本實施形態，在工件2之間歇搬運中是採用以下2種電流控制之任一種。當間歇搬運速度較慢的情況，為了將上述的過渡電流減低或防止，是讓工件2停止時之整流器50的輸出(例如100%)漸減(例如漸減到50%)後漸增(回到100%)。當間歇搬運速度較快的情況，因為過渡電流流過的期間極短而可忽視。如此，在此情況，不控制成在工件2停止時和工件2的間歇搬運時使整流器50的輸出不同亦可。例如，當假定工件2的搬運方向的寬度為800mm，間歇搬運速度為12m/min，圖8之示意顯示的被供電部430之搬運方向的寬度為60mm時，間歇搬運時間成為5sec，被供電部430為了在槽室間轉乘導電部43所需的時間(可讓過渡電流流過的時間)僅0.3sec。In the present embodiment, either of the following two types of current control is adopted in the intermittent conveyance of the work 2. When the intermittent transport speed is slow, in order to reduce or prevent the above transient current, the output of the rectifier 50 (for example, 100%) when the workpiece 2 is stopped is gradually reduced (for example, gradually reduced to 50%) and then gradually increased (back to 100 %). When the intermittent conveying speed is relatively fast, the period during which the transient current flows is extremely short and can be ignored. As such, in this case, it is not necessary to control the output of the rectifier 50 to be different when the workpiece 2 stops and when the workpiece 2 is intermittently conveyed. For example, when the width of the workpiece 2 in the conveying direction is 800 mm, the intermittent conveying speed is 12 m/min, and the width of the conveyed direction of the power-supplied portion 430 shown schematically in FIG. 8 is 60 mm, the intermittent conveying time becomes 5 sec. 430 The time required to transfer the conductive portion 43 between the chambers (the time during which a transient current can flow) is only 0.3 sec.

6.噴管的移動掃描 　　在各處理單元3-1~3-n之4個槽室11-1~11-4，如圖8所示般，俯視下在位於停止位置之工件2的各面(表面及背面)和陽極20之間，可進一步設置至少1根噴管60。因為噴管60會將形成於工件(陰極)2和陽極20間的電場遮蔽，當設有複數個噴管60的情況，其數量是越少越好。噴管60是如圖9所示般，具有噴出電鍍液之複數個噴出口60A。圖9所示之噴管60的噴出口60A，其垂直方向節距P可比習知的連續搬運式所採用之節距(例如7.5mm)更小，可設定成噴出口60A的外徑以上且5mm以下。這是因為可將每單位時間之電鍍液供給量增多。此外，為了對小尺寸的晶片、精密的圖案均等地供給電鍍液，節距P是越小越好。又在圖9中，工件2之表背面側的噴管60雖是隔著工件2對置，但設置於非對向位置亦可。如果對置的話，可解決工件2因液壓而變形的問題，當非對向配置時，要對工件2的貫通孔供給電鍍液變容易。縱使是連續搬運方式也設有噴管，其數量在一處理單元多達十幾根。6. The moving scanning of the nozzle is in the four chambers 11-1 to 11-4 of each processing unit 3-1 to 3-n, as shown in FIG. 8, in plan view on each surface of the workpiece 2 at the stop position Between the (front and back) and the anode 20, at least one nozzle 60 may be further provided. Because the nozzle 60 shields the electric field formed between the workpiece (cathode) 2 and the anode 20, when a plurality of nozzles 60 are provided, the fewer the number, the better. As shown in FIG. 9, the nozzle 60 has a plurality of ejection ports 60A for ejecting the plating solution. The nozzle 60A of the nozzle 60 shown in FIG. 9 has a vertical pitch P that is smaller than the pitch (for example, 7.5 mm) used in the conventional continuous transport type, and can be set to be more than the outer diameter of the nozzle 60A and Below 5mm. This is because the supply amount of plating solution per unit time can be increased. In addition, in order to equally supply the plating solution to small-sized wafers and precise patterns, the smaller the pitch P, the better. In FIG. 9, although the nozzles 60 on the front and back sides of the work 2 face each other across the work 2, they may be provided at non-opposed positions. If they are opposed, the problem of deformation of the work piece 2 due to hydraulic pressure can be solved. When the arrangement is not opposed, it becomes easy to supply the plating solution to the through hole of the work piece 2. Even if it is a continuous conveying method, there are also nozzles, the number of which is up to a dozen in one processing unit.

在工件的連續搬運方式多數根噴管雖是固定的，在採用間歇搬運方式之本實施形態，在各處理單元3-1~3-n之4個槽室11-1~11-4，讓至少1根噴管60沿著例如圖8的箭頭A1方向及A2方向(皆與間歇搬運方向A平行)進行水平掃描移動。藉此，如圖9所示般，可對工件2全面均一地噴出電鍍液。此外，噴管60的移動速度，可設定成比連續搬運方式之工件2的移動速度(例如0.8m/min)更快。如此，可將每單位時間之電鍍液供給量增多。又在連續搬運方式，當將工件速度加快時，處理槽的全長會變長而使裝置變得大型化，但在本實施形態般的間歇搬運，不會使裝置變得大型化。In the continuous conveying method of the workpiece, although most of the nozzles are fixed, in this embodiment adopting the intermittent conveying method, in the four chambers 11-1 to 11-4 of each processing unit 3-1 to 3-n, let At least one nozzle 60 performs horizontal scanning movement along, for example, the arrow A1 direction and the A2 direction (both are parallel to the intermittent conveying direction A) of FIG. 8. As a result, as shown in FIG. 9, the electroplating solution can be uniformly ejected onto the workpiece 2 over the entire surface. In addition, the moving speed of the nozzle 60 can be set to be faster than the moving speed (for example, 0.8 m/min) of the workpiece 2 in the continuous conveyance method. In this way, the supply amount of the plating solution per unit time can be increased. In the continuous conveyance method, when the speed of the workpiece is increased, the total length of the processing tank becomes longer and the device becomes larger. However, the intermittent conveying as in this embodiment does not increase the size of the device.

噴管60的往復移動機構雖圖示省略，可採用公知之讓其往復直線運動的機構(例如用可逆馬達驅動之齒輪-齒條機構、活塞-曲柄機構等)。該往復移動機構，能以與在各槽室停止中之工件2的至少水平寬度對應的長度範圍進行至少一次循環掃描的方式，讓2根噴管60移動。如此，使被處理之工件2的面內均一性提高。又較佳為，讓噴管60從初期位置進行至少一次循環掃描後再返回初期位置。這是因為，使噴管60的影子在工件面內大致均一化。可在裝置運轉中讓噴管60的往復掃描移動連續進行，亦可在工件2的間歇搬運中將噴管60的往復掃描移動停止。Although the illustration of the reciprocating mechanism of the nozzle 60 is omitted, a well-known mechanism for reciprocating linear motion (for example, a gear-rack mechanism driven by a reversible motor, a piston-crank mechanism, etc.) may be used. This reciprocating mechanism can move the two nozzles 60 in a manner that at least one cycle scan is performed in a length range corresponding to at least the horizontal width of the workpiece 2 in the stop of each cell. In this way, the in-plane uniformity of the workpiece 2 to be processed is improved. It is also preferable that the nozzle 60 be scanned at least once from the initial position and then returned to the initial position. This is because the shadow of the nozzle 60 is substantially uniform in the workpiece surface. The reciprocating scanning movement of the nozzle 60 may be continuously performed during the operation of the apparatus, or the reciprocating scanning movement of the nozzle 60 may be stopped during the intermittent conveyance of the workpiece 2.

依據本實施形態，對於間歇停止的工件2，對應於工件2的停止位置可讓至少一根、例如2根噴管60相對於工件2進行掃描移動。如此，俯視下成為位於工件2和陽極20間之噴管60的影子而使陽極-陰極間之電場受干擾的區域，會隨著噴管60的移動而移動。因此，電場受噴管60干擾的區域不是固定的，而使被處理之工件2的面內均一性提高。又噴管60之掃描移動方向並不限定於水平方向。例如將噴管60水平地配置而沿著垂直方向掃描移動亦可，掃描移動方向可為水平、垂直等的任一方向。According to this embodiment, for the workpiece 2 that is intermittently stopped, at least one, for example, two nozzles 60 can be scanned and moved relative to the workpiece 2 corresponding to the stop position of the workpiece 2. In this way, in a plan view, a region that becomes the shadow of the nozzle 60 between the workpiece 2 and the anode 20 and disturbs the electric field between the anode and the cathode will move as the nozzle 60 moves. Therefore, the area where the electric field is disturbed by the nozzle 60 is not fixed, and the in-plane uniformity of the workpiece 2 to be processed is improved. The scanning movement direction of the nozzle 60 is not limited to the horizontal direction. For example, the nozzle 60 may be arranged horizontally and scanned and moved in the vertical direction, and the scanning and moving direction may be any of horizontal, vertical, and the like.

噴管60，可利用公知的構造，將分割處理槽內之噴出口60A附近的電鍍液捲入後噴出。如此，可將陽極20附近之金屬離子豐富的電鍍液朝向工件2噴出，而使處理量提高。The nozzle 60 can use a well-known structure to take in the electroplating solution in the vicinity of the ejection port 60A in the divided processing tank and eject it. In this way, a plating solution rich in metal ions in the vicinity of the anode 20 can be ejected toward the workpiece 2 to increase the throughput.

又噴管60之掃描移動，可廣泛運用於間歇搬運方式的表面處理裝置，並不限定於上述實施形態般的構造，亦即不限定於複數個處理單元的連結構造、陰極分割構造、陽極分割構造、具備利用後述推動器的間歇搬運機構之構造等。In addition, the scanning movement of the nozzle 60 can be widely used in the surface treatment apparatus of the intermittent conveyance method, and is not limited to the structure as in the above embodiment, that is, not limited to the connection structure of a plurality of processing units, the cathode division structure, and the anode division Structure, structure including an intermittent conveying mechanism using a pusher described later, and the like.

7.每個處理單元的間歇搬運裝置 　　在本實施形態，較佳為在各處理單元3-1~3-n分別設置間歇搬運裝置。這是因為，縱使處理單元的數量n改變，也不須進行間歇搬運裝置的重新設計。如果不要求其方便，可使用像專利文獻1那樣的循環式間歇搬運裝置，亦可使用在各處理單元3-1~3-n共用之一個間歇搬運裝置。又以下所說明之間歇搬運裝置，並不限定於將複數個處理單元連結來形成電鍍槽者。7. Intermittent conveying device for each processing unit In this embodiment, it is preferable to provide an intermittent conveying device for each processing unit 3-1 to 3-n. This is because even if the number n of processing units changes, it is not necessary to redesign the intermittent conveying device. If convenience is not required, a circulation type intermittent conveying device like Patent Document 1 may be used, or an intermittent conveying device common to each processing unit 3-1 to 3-n may be used. In addition, the intermittent conveying device described below is not limited to those in which a plurality of processing units are connected to form a plating tank.

作為設置於各處理單元3-1~3-n之間歇搬運裝置，可採用圖11或圖12所示者。圖11所示的間歇搬運裝置，是由可朝向與間歇搬運方向A平行的正逆方向A1,A2藉由例如氣缸等進行進退驅動之推動器70所構成。推動器70是在4處具有推動片71。4個推動片71可推動4個搬運治具30之被推動片350(參照圖4)。4個推動片71，朝向圖11中的順時針方向D被旋轉蓄勢。As the intermittent conveying device provided in each of the processing units 3-1 to 3-n, those shown in FIG. 11 or 12 can be used. The intermittent conveying device shown in FIG. 11 is composed of a pusher 70 that can be moved forward and backward by, for example, an air cylinder or the like in the forward and reverse directions A1 and A2 parallel to the intermittent conveying direction A. The pusher 70 has push pieces 71 at four locations. The four push pieces 71 can push the four pushed pieces 350 of the transport jig 30 (refer to FIG. 4 ). The four pushing pieces 71 are rotated toward the clockwise direction D in FIG. 11 to accumulate potential.

推動器70，當朝方向A1前進時，4個推動片71將4個搬運治具30的被推動片350推動而將4個工件2間歇搬運。推動器70，當朝方向A2後退時，若推動片71與被推動片350接觸，推動片71反抗朝箭頭D方向的蓄勢力而朝向與箭頭D相反的方向旋轉，不受被推動片350的阻礙而返回初期位置。如此，位於各處理單元3-1~3-n內之4個工件2，是藉由推動器70同時移動一步(one step)而被間歇搬運。藉此，處理單元內之最上游位置以外的3個工件2，是在同一處理單元內移動一步，位於同一或前段的處理單元內之最上游位置之工件2，則移動到其後段的處理單元內之最下游位置。如此，由4個搬運治具30所保持之4個工件2，以處理單元內之4個停止位置為起點及/或終點而被間歇地搬運。When the pusher 70 advances in the direction A1, the four pushing pieces 71 push the pushed pieces 350 of the four transport jigs 30 to carry the four workpieces 2 intermittently. The pusher 70, when retreating in the direction A2, if the pushing piece 71 contacts the pushed piece 350, the pushing piece 71 rotates in the direction opposite to the arrow D against the stored force in the direction of arrow D, and is not pushed by the pushed piece 350 Obstacle to return to the initial position. In this way, the four workpieces 2 located in the processing units 3-1 to 3-n are intermittently transported by the pusher 70 moving one step at the same time. In this way, the three workpieces 2 outside the most upstream position in the processing unit are moved one step in the same processing unit, and the workpiece 2 located in the most upstream position in the same or previous processing unit is moved to the subsequent processing unit The most downstream position within. In this way, the four workpieces 2 held by the four transport jigs 30 are intermittently transported using the four stop positions in the processing unit as starting points and/or end points.

圖11所示的間歇搬運裝置，因為僅將搬運治具30推動，並無法控制搬運治具30的停止位置。該間歇搬運裝置可使用於：間歇搬運速度較慢，推動器70所致的推動停止後不會發生使搬運治具30繼續前進的慣性力的情況。或是，在搬運治具30之導引用的滾子331,332的至少一個設置由本案申請人提出之國際專利申請案PCT/JP2018/020119所載的制動機構的情況，也能採用該間歇搬運裝置。The intermittent conveying device shown in FIG. 11 cannot control the stop position of the conveying jig 30 because only the conveying jig 30 is pushed. The intermittent conveying device can be used for: the intermittent conveying speed is slow, and the inertial force that causes the conveying jig 30 to continue to move does not occur after the pushing by the pusher 70 stops. Or, in the case where at least one of the rollers 331, 332 cited in the guide of the transport jig 30 is provided with a braking mechanism contained in the international patent application PCT/JP2018/020119 filed by the applicant of the present case, the intermittent transport device can also be used.

圖12(A)(B)所示之間歇搬運裝置係包含：具備4個推動片73而被進退驅動(A1,A2方向的驅動)及昇降驅動(箭頭E方向的驅動)之推動器72。4個推動片73係包含：供搬運治具30的被推動片350嵌合之例如朝上開口的凹部73A。如圖12(A)所示般，當推動器72上昇時，在4個凹部73A嵌合搬運治具30的被推動片350。然後，如圖12(B)所示般，當讓推動器72朝A1方向前進時，4個搬運治具30同時移動一步而被間歇搬運。此外，當推動器72的前進結束時，利用凹部73A來無歧異地決定被推動片350的停止位置。然後，使推動器72下降，進一步後退而返回初期位置。特別是藉由凹部73A和被推動片350的卡合，可讓複數個搬運治具30停止於既定的位置，而能進行更高速的間歇搬運。The intermittent conveying device shown in FIGS. 12(A) and (B) includes a pusher 72 provided with four push pieces 73 and driven forward and backward (drive in the direction of A1 and A2) and a lift drive (drive in the direction of arrow E). The four pushing pieces 73 include a concave portion 73A that opens upward, for example, into which the pushed piece 350 of the transfer jig 30 is fitted. As shown in FIG. 12(A), when the pusher 72 rises, the pushed piece 350 of the transfer jig 30 is fitted into the four recesses 73A. Then, as shown in FIG. 12(B), when the pusher 72 is advanced in the A1 direction, the four transport jigs 30 are simultaneously moved by one step and are intermittently transported. In addition, when the advancement of the pusher 72 ends, the recessed portion 73A is used to unambiguously determine the stop position of the pushed piece 350. Then, the pusher 72 is lowered and further retracted to return to the initial position. In particular, by engaging the concave portion 73A and the pushed piece 350, the plurality of transport jigs 30 can be stopped at a predetermined position, and intermittent transport at a higher speed can be performed.

又雖如上述般針對本實施形態做詳細地說明，但所屬技術領域具有通常知識者應可輕易地理解到，在實質上不脫離本發明的新事項及效果的範圍內存在有許多的變形。因此，這樣的變形例全都包含於本發明的範圍。例如，說明書或圖式中至少出現一次之與更廣義或同義的不同用語一起記載之用語，在說明書或圖式之任何部分都能置換成該不同的用語。又本實施形態及變形例之所有的組合都包含於本發明的範圍。Although the present embodiment will be described in detail as described above, those of ordinary skill in the art should readily understand that there are many variations within the scope of the new matters and effects that do not deviate substantially from the present invention. Therefore, all such modifications are included in the scope of the present invention. For example, terms that are described at least once in the specification or drawings together with different terms that are broader or synonymous can be replaced by the different terms in any part of the specification or drawings. All combinations of the present embodiment and modified examples are included in the scope of the present invention.

圖13顯示，將圖9所示之搬運治具30當中的工件保持部320變更為工件保持部320A的變形例。在圖13，在用圍繞工件2的陰影線表示之四角框區域設置虛擬被處理部80。虛擬被處理部80是和工件2一起被實施表面處理(電鍍)的區域。虛擬被處理部80是與圖13所示的供電部81連接。在此，能將圖4所示的治具30之第1被供電部340A透過上部/下部夾持器323,324而與工件2電氣連接，另一方面，將圖13所示的供電部81與圖4所示的第2被供電部340B電氣連接。如此，流過虛擬被處理部80和流過工件2的電流可藉由不同的整流器50獨立地控制。將虛擬被處理部80分割成2個以上、例如上下左右分割成4個，並連接於圖4中設有5個以上之被供電部340中的4個，將剩下的被供電部340連接於工件，藉由能將虛擬被處理部80的電流控制分割成2個以上而更精細地進行。FIG. 13 shows a modified example in which the workpiece holding portion 320 in the conveyance jig 30 shown in FIG. 9 is changed to the workpiece holding portion 320A. In FIG. 13, a virtual processed part 80 is provided in a square frame area indicated by hatching around the work 2. The virtual portion to be processed 80 is an area that is subjected to surface treatment (plating) together with the workpiece 2. The virtual processed part 80 is connected to the power supply part 81 shown in FIG. 13. Here, the first powered portion 340A of the jig 30 shown in FIG. 4 can be electrically connected to the workpiece 2 through the upper/lower grippers 323, 324. On the other hand, the power feeding portion 81 shown in FIG. 13 and FIG. The second power supply unit 340B shown in 4 is electrically connected. In this way, the current flowing through the virtual processed part 80 and the workpiece 2 can be independently controlled by different rectifiers 50. The virtual to-be-processed part 80 is divided into two or more, for example, up, down, left, and right into four, and connected to four of the power-supply parts 340 provided with five or more in FIG. 4, and the remaining power-supply parts 340 are connected For the workpiece, the current control of the virtual processed part 80 can be divided into two or more to perform finer.

工件2的周緣是位於虛擬被處理部80的內側，因此工件2的周緣不會成為邊緣。如此，在工件2的周緣不會產生電場集中，所謂狗骨頭的厚膜部並不會發生。如果將流過虛擬被處理部80的電流和流過工件2的電流設定成大致相等，包含工件2周圍的虛擬被處理部80之寬廣面積成為電鍍區域，而使位於其中心之工件2的面內均一性提高。又電鍍裝置1，是在電鍍處理部的後工序具有剝離槽，電鍍後，將搬運治具30投入剝離槽而使鍍膜剝離。這時形成於虛擬被處理部80之鍍膜也被剝離，因此可將搬運治具30反覆再使用。The peripheral edge of the workpiece 2 is located inside the virtual processed portion 80, so the peripheral edge of the workpiece 2 does not become an edge. In this way, electric field concentration does not occur at the periphery of the workpiece 2, and the so-called thick film portion of the dog bone does not occur. If the current flowing through the virtual processed portion 80 and the current flowing through the workpiece 2 are set to be approximately equal, the wide area including the virtual processed portion 80 around the workpiece 2 becomes the plating area, and the surface of the workpiece 2 located at the center thereof Internal homogeneity is improved. In addition, the electroplating apparatus 1 has a peeling groove in the post-process of the plating processing section, and after the plating, the transport jig 30 is put into the peeling groove to peel off the plating film. At this time, the plating film formed on the dummy part 80 is also peeled off, so the transport jig 30 can be reused repeatedly.

圖14係顯示將連接於N=2個的陰極軌道之導電部之一對整流器是由一個整流器兼用的變形例。圖5是在各處理單元10-1~10-n分別配置N×M=8個的整流器50，在圖14則是配置M=4個整流器50。對應於各槽室在N=2的情況所配置之圖5中一對整流器50，在圖14是由1個整流器50兼用。如圖14所示般，對應於各槽室之1個整流器50的負端子52，是直接連接於陰極軌道40A的導電部43，且可透過可變電阻器53連接於陰極軌道40B的導電部43。對應於各槽室之1個整流器50的正端子51，是共同連接於配置在各槽室之陽極20(20A1,20A2,20B1,20B2)。縱使是這樣的情況，流過治具30的第1導通路徑31A的電流可藉由整流器50控制，且流過治具30之第2導通路徑31B的電流可藉由同一整流器50及可變電阻器53控制。而且，整流器50之總個數至多可讓其減半。當N=3以上的情況，可在一個整流器50的端子連接3根以上的配線，在其中2根以上連接可變電阻器53。FIG. 14 shows a modified example in which a pair of rectifiers connected to the conductive rails of N=2 cathode rails is used by one rectifier. FIG. 5 is that each processing unit 10-1 to 10-n is provided with N×M=8 rectifiers 50 respectively, and in FIG. 14, M=4 rectifiers 50 are provided. The pair of rectifiers 50 in FIG. 5 arranged corresponding to the case where each tank is N=2 is used by one rectifier 50 in FIG. 14. As shown in FIG. 14, the negative terminal 52 of one rectifier 50 corresponding to each cell is directly connected to the conductive portion 43 of the cathode rail 40A, and can be connected to the conductive portion of the cathode rail 40B through the variable resistor 53 43. The positive terminal 51 of one rectifier 50 corresponding to each cell is commonly connected to the anode 20 (20A1, 20A2, 20B1, 20B2) arranged in each cell. Even in this case, the current flowing through the first conduction path 31A of the jig 30 can be controlled by the rectifier 50, and the current flowing through the second conduction path 31B of the jig 30 can be controlled by the same rectifier 50 and the variable resistor Device 53 controls. Moreover, the total number of rectifiers 50 can be halved at most. When N=3 or more, three or more wires can be connected to the terminal of one rectifier 50, and the variable resistor 53 can be connected to two or more of them.

圖15顯示，在圖8所示的搬運治具30當中之被供電部340(第1,第2被供電部的總稱)附加陰極軌道40(40A,40B的總稱)的清掃功能之變形例之搬運治具30A。但圖15中，將第1,第2被供電部以一個被供電部340的形式呈現。 　　在圖15，支承臂341除了支承接觸子342,343以外，還支承與陰極軌道40接觸而清掃陰極軌道40之至少一個軌道清掃部344。圖15所示的軌道清掃部344係包含：研磨陰極軌道40的導電部43而將堆積層(例如導電部上的氧化皮膜等)除去之作為研磨材的例如刮刀344A、及將研磨粉和垃圾掃出之刷子344B的至少一方或雙方。刷子344B可設置於刮刀344A之下游側。藉由與接觸子342,344同樣的構造，將清掃部344(344A,344B)壓接於陰極軌道40。FIG. 15 shows a modification of the cleaning function of the cathode rail 40 (general term of 40A, 40B) with the cathode rail 40 (general term of 40A, 40B) added to the powered part 340 (general term of the first and second powered parts) in the transport jig 30 shown in FIG. 8 Transport fixture 30A. However, in FIG. 15, the first and second power-supplied parts are presented in the form of one power-supplied part 340. In FIG. 15, the support arm 341 supports at least one rail cleaning part 344 that contacts the cathode rail 40 and cleans the cathode rail 40 in addition to the contact pieces 342 and 343. The rail cleaning unit 344 shown in FIG. 15 includes, for example, a scraper 344A that grinds the conductive portion 43 of the cathode rail 40 to remove the accumulated layer (for example, an oxide film on the conductive portion, etc.) as a polishing material, and grinds powder and garbage At least one or both of the brushes 344B that are swept out. The brush 344B may be provided on the downstream side of the blade 344A. With the same structure as the contactors 342, 344, the cleaning section 344 (344A, 344B) is crimped to the cathode rail 40.

採用圖15所示之具有清掃部344的搬運治具30A，作為在電鍍裝置1循環使用之多數個搬運治具之至少一個，可一邊讓電鍍裝置1運轉一邊清掃陰極軌道40，而防止通電不良。如此，可抑制陰極軌道40之導電部43的電阻値變高等的異常，可減少以往以每週一次的頻率實施之保養頻率。Using the conveying jig 30A having the cleaning part 344 shown in FIG. 15 as at least one of the plurality of conveying jigs circulating in the electroplating apparatus 1, the cathode rail 40 can be cleaned while the electroplating apparatus 1 is in operation, thereby preventing poor electrical conduction . In this way, it is possible to suppress abnormalities such as an increase in the resistance value of the conductive portion 43 of the cathode rail 40, and it is possible to reduce the maintenance frequency that was conventionally performed once a week.

又圖15所示的搬運治具39A，並不限定於上述間歇搬運式的表面處理裝置，在具有將導電部34連續地設置之陰極軌道之連續搬運式的表面處理裝置也能使用。Furthermore, the transfer jig 39A shown in FIG. 15 is not limited to the above-mentioned intermittent transfer type surface treatment device, and can also be used in a continuous transfer type surface treatment device having a cathode rail in which the conductive portion 34 is continuously provided.

圖16及圖17係顯示讓複數個工件同時浸漬於電鍍液而進行處理之批式表面處理裝置。該表面處理裝置，是在收容於處理槽100之電鍍液中，透過治具200而浸漬M=4個的工件(也稱為基板1~4)。批式的本實施形態，與上述實施形態同樣的，是將工件2(如圖13所示般在工件2的周圍具有虛擬被處理部80的情況，也包含虛擬被處理部80)設定成N=2個的陰極。在此，在本實施形態，N=2個的陰極可以是各工件2的表面和背面。但像上述實施形態那樣，N=2個的陰極亦可為各工件2之上部和下部，或是工件2和虛擬被處理部80。此外，如上述般，所設定之陰極數量N並不限定為2。Fig. 16 and Fig. 17 show a batch type surface treatment device in which a plurality of workpieces are simultaneously immersed in a plating solution for processing. This surface treatment device is to immerse M=4 workpieces (also referred to as substrates 1 to 4) through the jig 200 in the plating solution contained in the processing tank 100. The present embodiment of the batch type is the same as the above embodiment, in which the workpiece 2 (when the virtual processed part 80 is provided around the workpiece 2 as shown in FIG. 13, including the virtual processed part 80) is set to N = 2 cathodes. Here, in the present embodiment, N=2 cathodes may be the front and back of each work 2. However, as in the above-described embodiment, the N=2 cathodes may be the upper and lower portions of each workpiece 2, or the workpiece 2 and the virtual processed portion 80. In addition, as described above, the set number N of cathodes is not limited to two.

在本實施形態，設有N×M=8個的整流器50 (也稱為整流器1~8)。在N×M=8個的整流器50之負端子，是與可接觸治具200之N×M=8個的陰極連接部110連接。在治具200設有：與8個陰極連接部110接觸之N×M=8個的端子210。在治具200設有昇降臂220，藉由未圖示的昇降機構進行昇降。當治具200下降時，M=4個的工件2被浸漬於處理槽100內的電鍍液，且端子210與陰極連接部110連接。In the present embodiment, N×M=8 rectifiers 50 (also referred to as rectifiers 1 to 8) are provided. The negative terminal of the N×M=8 rectifier 50 is connected to the N×M=8 cathode connection parts 110 of the accessible fixture 200. The jig 200 is provided with N×M=8 terminals 210 in contact with the eight cathode connecting portions 110. The jig 200 is provided with a lifting arm 220, which is raised and lowered by a lifting mechanism (not shown). When the jig 200 is lowered, M=4 workpieces 2 are immersed in the plating solution in the processing tank 100, and the terminal 210 is connected to the cathode connection portion 110.

在處理槽100配置至少一個陽極20。在本實施形態，在與M=4個的工件2之表背面相對向的位置設有M×2=8個的陽極20A1~20A4,20B1~20B4(也稱為陽極1~8)。陽極1~8和整流器1~8的連接是如圖16所示般。利用整流器1控制基板1表面和陽極1的電流，利用整流器2控制基板1背面和陽極2的電流，利用整流器3控制基板2表面和陽極3的電流，利用整流器4控制基板2背面和陽極4的電流。此外，利用整流器5控制基板3表面和陽極5的電流，利用整流器6控制基板3背面和陽極6的電流，利用整流器7控制基板4表面和陽極7的電流，利用整流器8控制基板4背面和陽極8的電流。如此，在本實施形態，可將被批次處理之複數個工件各個設定成獨立的陰極而能進行精密的電流控制。At least one anode 20 is arranged in the treatment tank 100. In this embodiment, M×2=8 anodes 20A1 to 20A4, 20B1 to 20B4 (also referred to as anodes 1 to 8) are provided at positions facing the front and back surfaces of the M=4 workpieces 2. The connection of anodes 1-8 and rectifiers 1-8 is as shown in Figure 16. The rectifier 1 controls the current on the surface of the substrate 1 and the anode 1, the rectifier 2 controls the current on the back of the substrate 1 and the anode 2, the rectifier 3 controls the current on the surface of the substrate 2 and the anode 3, and the rectifier 4 controls the back of the substrate 2 and the anode 4. Current. In addition, the rectifier 5 controls the current on the surface of the substrate 3 and the anode 5, the rectifier 6 controls the current on the back of the substrate 3 and the anode 6, the rectifier 7 controls the current on the surface of the substrate 4 and the anode 7, and the rectifier 8 controls the back surface and anode of the substrate 4 8 current. In this way, in this embodiment, each of the plurality of workpieces to be processed in batches can be set as an independent cathode, and precise current control can be performed.

在此，本實施形態也是與圖14同樣的，可將N×M個的整流器50當中之至少2個由1個整流器50兼用。在此情況，被兼用的1個整流器50之端子，是與導通到M個工件2之一之不同的N個部位(例如表面/背面、上部/下部或工件2/虛擬被處理部80)之N個導通路徑之一直接連接，且與N個導通路徑之另一個是透過可變電阻器53而連接。如此般，可取代至少一個整流器50而共用其他整流器50的端子，且藉由可變電阻器53的調整，來控制供給導通到M個工件2之一之不同的N個部位之N個導通路徑之至少一個的電流。Here, this embodiment is also the same as FIG. 14, and at least two of the N×M rectifiers 50 can be used by one rectifier 50. In this case, the terminal of one rectifier 50 to be used is N parts (for example, front/back, upper/lower, or workpiece 2/virtual processed part 80) different from the one conducting to one of the M workpieces 2 One of the N conduction paths is directly connected, and the other of the N conduction paths is connected through the variable resistor 53. In this way, it is possible to replace at least one rectifier 50 and share the terminals of other rectifiers 50, and adjust the variable resistor 53 to control the N conduction paths supplied to different N parts conducting to one of the M workpieces 2 At least one current.

在本實施形態，可將陽極20和陽極棒22的連接改變成例如圖18所示般。在圖18，在陽極20之與工件2相對向的面設有複數個接點21。複數個接點21各個是透過例如鈦等的導通構件22A而與陽極棒22導通連接。在此，以往，是將陽極20的上端部固定於陽極棒22，僅從陽極20的上側供電。如此，由於處理單元3-1~3-n內之液中電阻大，電子容易通過工件2及陽極20的低電阻部，而使工件2的電流分布成為面內不均一。如圖18所示般，藉由透過陽極20之多數個接點21進行供電，使電流分布的面內均一性提高，而能改善被處理的工件2之面內均一性。再者，藉由在複數個接點21之至少1個分別連接整流器而能進行電流調整，不管電阻差如何都能使電流分布的面內均一性進一步提高。In this embodiment, the connection between the anode 20 and the anode rod 22 can be changed as shown in FIG. 18, for example. In FIG. 18, a plurality of contacts 21 are provided on the surface of the anode 20 facing the workpiece 2. Each of the plurality of contacts 21 is electrically connected to the anode rod 22 through a conduction member 22A such as titanium. Here, in the past, the upper end of the anode 20 was fixed to the anode rod 22, and power was only supplied from the upper side of the anode 20. In this way, since the resistance in the liquid in the processing units 3-1 to 3-n is large, electrons easily pass through the low resistance portions of the workpiece 2 and the anode 20, so that the current distribution of the workpiece 2 becomes uneven in the plane. As shown in FIG. 18, by supplying power through the plurality of contacts 21 of the anode 20, the in-plane uniformity of the current distribution is improved, and the in-plane uniformity of the workpiece 2 to be processed can be improved. Furthermore, by connecting a rectifier to at least one of the plurality of contacts 21, the current can be adjusted, and the in-plane uniformity of the current distribution can be further improved regardless of the resistance difference.

1‧‧‧表面處理裝置2‧‧‧工件3-1~3-n‧‧‧處理槽(分割處理槽)20(20A、20B、20A1、20A2、20B1、20B2)‧‧‧陽極30、30A‧‧‧搬運治具31A、31B‧‧‧N個導通路徑40A、40B‧‧‧陰極軌道41‧‧‧絕緣軌道42‧‧‧間隔(非導電部)43‧‧‧導電部50‧‧‧整流器51‧‧‧正端子52‧‧‧負端子53‧‧‧可變電阻器60‧‧‧噴管60A‧‧‧噴出口70、72‧‧‧推動器(間歇搬運裝置)71、73‧‧‧推動片73A‧‧‧凹部80‧‧‧虛擬被處理部100‧‧‧處理槽110‧‧‧N×M個的陰極連接部200‧‧‧治具210‧‧‧N×M個的端子322、324‧‧‧夾持器340A、340B‧‧‧第1,第2被供電部1‧‧‧Surface treatment device 2‧‧‧Workpiece 3-1~3-n‧‧‧Treatment tank (divided treatment tank) 20 (20A, 20B, 20A1, 20A2, 20B1, 20B2) ‧‧‧Anode 30, 30A ‧‧‧Transfer jig 31A, 31B ‧‧‧N conduction paths 40A, 40B ‧‧‧ Cathode rail 41‧‧‧ Insulation rail 42‧‧‧‧ Interval (non-conductive part) 43‧‧‧ Conductive part 50‧‧‧ Rectifier 51‧‧‧ Positive terminal 52‧‧‧ Negative terminal 53‧‧‧Variable resistor 60‧‧‧ Nozzle 60A‧‧‧Ejection outlet 70, 72‧‧‧ Pusher (intermittent conveying device) 71, 73‧ ‧‧Push piece 73A‧‧‧Concave part 80‧‧‧ Virtual processed part 100‧‧‧Treatment tank 110‧‧‧N×M cathode connecting part 200‧‧‧Jig 210 210‧‧‧N×M Terminals 322, 324‧‧‧ grippers 340A, 340B ‧‧‧ 1st and 2nd power supply parts

圖1係本發明的實施形態之間歇搬運方式的電鍍裝置之電鍍處理部的概略剖面圖。 　　圖2係圖1所示的電鍍裝置之一個處理單元的概略俯視圖。 　　圖3係顯示在一個處理單元內停止中的工件和陽極的位置關係。 　　圖4係搬運工件的搬運治具之立體圖。 　　圖5係顯示陽極、陰極軌道上的導電部及整流器的連接之示意圖。 　　圖6(A)(B)係N=2條陰極軌道的前視圖及剖面圖。 　　圖7係顯示2條陰極軌道、工件(陰極)、陽極及2個整流器的連接之一例的示意圖。 　　圖8係顯示搬運治具的被供電部在槽室間轉乘陰極軌道之導電部的狀態之示意圖。 　　圖9係顯示在槽室內往復水平掃描移動之噴管的俯視圖。 　　圖10係顯示噴管的噴出口之排列節距。 　　圖11係顯示配置於各處理單元之間歇搬運裝置的一例。 　　圖12(A)(B)係顯示配置於各處理單元之間歇搬運裝置的另一例。 　　圖13係顯示適用於間歇搬運方式之搬運治具的變形例。 　　圖14係顯示連接於N=2個陰極軌道的導電部之一對的整流器由一個整流器兼用的變形例。 　　圖15係顯示附加陰極軌道的清掃功能之搬運治具的變形例。 　　圖16係批式表面處理裝置的剖面圖。 　　圖17係批式表面處理裝置的俯視圖。 　　圖18係顯示陽極和陽極棒的連接之變形例。FIG. 1 is a schematic cross-sectional view of a plating processing section of an electroplating apparatus of an intermittent conveyance method according to an embodiment of the present invention. FIG. 2 is a schematic plan view of one processing unit of the plating apparatus shown in FIG. 1.　　 Figure 3 shows the positional relationship between the workpiece and the anode during a stop in a processing unit.　　 Figure 4 is a perspective view of a conveying jig for conveying a workpiece.　　 Figure 5 is a schematic diagram showing the connection between the conductive parts on the anode and cathode rails and the rectifier.　　 Figure 6(A)(B) is a front view and a cross-sectional view of N=2 cathode tracks. FIG. 7 is a schematic diagram showing an example of connection of two cathode rails, a workpiece (cathode), an anode, and two rectifiers. FIG. 8 is a schematic diagram showing the state where the power-receiving part of the transfer jig transfers to the conductive part of the cathode rail between the chambers.　　 FIG. 9 is a plan view showing a nozzle that reciprocates horizontally in the tank.　　 Figure 10 shows the arrangement pitch of the nozzles of the nozzle. FIG. 11 shows an example of an intermittent conveying device arranged in each processing unit. FIG. 12(A) and (B) show another example of the intermittent conveying device arranged in each processing unit.　　 Figure 13 shows a modified example of the transfer jig applicable to the intermittent transfer method.　　 FIG. 14 shows a modification in which one pair of rectifiers connected to a pair of conductive parts of N=2 cathode rails is used by one rectifier.　　 Figure 15 shows a modified example of the transport jig with the cleaning function of the cathode rail.　　 Figure 16 is a sectional view of a batch type surface treatment device.　　 Figure 17 is a plan view of a batch type surface treatment device. Fig. 18 shows a modification of the connection between the anode and the anode rod.

2‧‧‧工件 2‧‧‧Workpiece

20A、20B、20A1、20A2、20B1、20B2‧‧‧陽極 20A, 20B, 20A1, 20A2, 20B1, 20B2 ‧‧‧Anode

31A、31B‧‧‧N個導通路徑 31A, 31B‧‧‧N conduction paths

40A、40B‧‧‧陰極軌道 40A, 40B ‧‧‧ cathode track

50‧‧‧整流器 50‧‧‧Rectifier

51‧‧‧正端子 51‧‧‧Positive terminal

52‧‧‧負端子 52‧‧‧Negative terminal

340A、340B‧‧‧第1,第2被供電部 340A, 340B

Claims (11)

一種表面處理裝置，其特徵在於，係具有：處理槽、至少一個陽極、N(N為2以上的整數)個陰極軌道、複數個治具、及至少N個整流器， 　　前述處理槽，是用於收容處理液， 　　前述至少一個陽極，是配置於前述處理槽內， 　　前述複數個治具，是將浸漬於前述處理液之複數個工件各個分別保持，且與前述N個陰極軌道接觸而將前述複數個工件各個設定成陰極， 　　前述至少N個整流器，是連接於前述N個陰極軌道各個和前述至少一個陽極， 　　前述複數個治具各個係包含：從前述N個陰極軌道各個導通到前述複數個工件各個之不同的N個部位各個之N個導通路徑，且前述N個導通路徑互相絕緣。A surface treatment device, characterized by comprising: a treatment tank, at least one anode, N (N is an integer of 2 or more) cathode rails, a plurality of jigs, and at least N rectifiers, the aforementioned treatment tank is used for Containing the processing solution, 　　 the at least one anode is arranged in the processing tank, 　　 the plurality of jigs, each holding a plurality of workpieces immersed in the processing solution, and contacting the N cathode rails to store the plurality Each workpiece is set as a cathode, 　　 the at least N rectifiers are connected to each of the N cathode rails and the at least one anode, 　　 the plurality of fixtures each include: from each of the N cathode rails to the plurality of workpieces N conduction paths in each of the different N parts, and the aforementioned N conduction paths are insulated from each other. 如請求項1所述之表面處理裝置，其中， 　　前述N個導通路徑，是從前述N個陰極軌道各個導通到前述複數個工件各個之不同的N個部位。The surface treatment device according to claim 1, wherein the N conduction paths are conducted from each of the N cathode tracks to N different portions of the plurality of workpieces. 如請求項2所述之表面處理裝置，其中， 　　前述複數個治具各個，是包含將工件夾持之至少N個夾持器， 　　前述複數個工件各個之不同的部位，是藉由前述至少N個夾持器所把持之至少各個部位。The surface treatment device according to claim 2, wherein 　　 each of the plurality of jigs includes at least N holders that clamp the workpiece, and 　　different parts of each of the plurality of workpieces are determined by the at least N At least various parts held by each holder. 如請求項3所述之表面處理裝置，其中， 　　藉由前述至少N個夾持器所把持之前述至少各個部位，是包含藉由前述複數個治具各個所保持之前述複數個工件各個的上端部和下端部。The surface treatment device according to claim 3, wherein the at least each part held by the at least N holders includes the upper end of each of the plurality of workpieces held by each of the plurality of jigs Department and lower end. 如請求項3所述之表面處理裝置，其中， 　　前述至少一個陽極係包含：與前述複數個工件之表面及背面相對向之至少2個陽極， 　　藉由前述至少N個夾持器把持之前述至少各個部位係包含：藉由前述複數個治具各個保持之前述複數個工件各個的前述表面和前述背面。The surface treatment device according to claim 3, wherein the at least one anode includes: at least two anodes facing the front and back surfaces of the plurality of workpieces, and the at least one anode held by the at least N holders Each part includes the front surface and the back surface of the workpieces held by the jigs. 如請求項1所述之表面處理裝置，其中， 　　前述複數個治具各個，是在前述複數個工件各個的周圍包含虛擬被處理部， 　　前述N個導通路徑係包含：從前述N個陰極軌道之至少一個導通到前述複數個工件各個之第1導通路徑、及從前述N個陰極軌道之至少另一個導通到前述虛擬被處理部之第2導通路徑。The surface treatment device according to claim 1, wherein each of the plurality of jigs includes a virtual processed part around each of the plurality of workpieces, and the N conduction paths include: from the N cathode tracks At least one first conduction path that leads to each of the plurality of workpieces, and a second conduction path that leads from at least the other of the N cathode tracks to the virtual processed portion. 如請求項1所述之表面處理裝置，其中， 　　前述至少N個整流器當中之至少2個，是由1個整流器兼用，前述1個整流器之端子，是透過前述N個陰極軌道之一而連接於前述N個導通路徑之一，且透過可變電阻器和前述N個陰極軌道之另一個而連接於前述N個導通路徑之另一個。The surface treatment device according to claim 1, wherein at least two of the at least N rectifiers are used by one rectifier, and the terminals of the one rectifier are connected to one of the N cathode rails One of the N conduction paths is connected to the other of the N conduction paths through the variable resistor and the other of the N cathode tracks. 如請求項1所述之表面處理裝置，其進一步具有間歇搬運裝置， 　　該間歇搬運裝置是將前述複數個治具以前述處理槽內的M個(M為2以上的整數)停止位置為起點及/或終點而間歇地搬運， 　　前述N個陰極軌道各個，是與分別停止於前述M個停止位置之M個治具分別接觸，且包含被電氣絕緣的M個導電部， 　　前述至少N個整流器是對應於合計N×M個的導電部而設有N×M個，將前述N×M個的整流器各個與前述N×M個的導電部各個連接。The surface treatment device according to claim 1, further comprising an intermittent conveying device, wherein the intermittent conveying device uses the plurality of jigs with M stop positions (M is an integer of 2 or more) in the processing tank as starting points and /Or end point and intermittent transportation, each of the N cathode rails is in contact with M fixtures that are stopped at the M stop positions, respectively, and includes M electrically conductive parts that are electrically insulated, and the at least N rectifiers are N×M conductive sections are provided corresponding to the total of N×M conductive sections, and each of the N×M rectifiers is connected to the N×M conductive sections. 如請求項1至8中任一項所述之表面處理裝置，其中， 　　前述至少一個陽極係包含：與分別停止於前述M個停止位置之M個工件相對向之至少M個陽極， 　　將前述M個陽極各個，和與分別停止於前述M個停止位置之M個治具各個連接之N個整流器共同連接。The surface treatment device according to any one of claims 1 to 8, wherein the at least one anode includes: at least M anodes opposed to the M workpieces stopped at the M stopping positions, and the M Each anode is connected to the N rectifiers connected to the M fixtures stopped at the M stop positions. 一種表面處理裝置，其特徵在於，係具備：處理槽、至少一個陽極、N×M個(N,M為2以上的整數)的陰極連接部、治具、及N×M個的整流器， 　　前述處理槽，是用於收容處理液， 　　前述至少一個陽極，是配置於前述處理槽內， 　　前述治具，是用於保持浸漬於前述處理液之M個工件，且與前述N×M個的陰極連接部接觸而將前述M個工件各個設定成N個陰極， 　　前述N×M個的整流器，是連接於前述N×M個的陰極連接部各個和前述至少一個陽極， 　　前述治具係包含：從前述N×M個的陰極連接部各個導通到前述M個工件各個之不同的N個部位之N×M個的導通路徑，且前述N×M個的導通路徑互相絕緣。A surface treatment device, characterized by comprising: a treatment tank, at least one anode, N×M (N, M is an integer of 2 or more) cathode connection parts, jigs, and N×M rectifiers, 　　The processing tank is used to contain the processing liquid, 　　 the at least one anode is arranged in the processing tank, 　　 the jig is used to hold M workpieces immersed in the processing liquid, and the N×M cathodes The connection parts are in contact to set the M workpieces to N cathodes. The N×M rectifiers are connected to the N×M cathode connection parts and the at least one anode. The fixture system includes: Each of the N×M cathode connection portions is connected to N×M conduction paths of N different positions of the M workpieces, and the N×M conduction paths are insulated from each other. 如請求項10所述之表面處理裝置，其中， 　　前述N×M個的整流器當中之至少2個是由1個整流器兼用，前述1個整流器的端子，是與導通到前述M個工件之一之不同的N個部位之N個導通路徑之一直接連接，且與前述N個導通路徑之另一個是透過可變電阻器而連接。The surface treatment device according to claim 10, wherein at least two of the N×M rectifiers are used by one rectifier, and the terminal of the one rectifier is connected to one of the M workpieces One of the N conduction paths of different N parts is directly connected, and the other of the N conduction paths described above is connected through a variable resistor.

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