TWI677599B - Electroplating device - Google Patents
Electroplating device Download PDFInfo
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- TWI677599B TWI677599B TW107136455A TW107136455A TWI677599B TW I677599 B TWI677599 B TW I677599B TW 107136455 A TW107136455 A TW 107136455A TW 107136455 A TW107136455 A TW 107136455A TW I677599 B TWI677599 B TW I677599B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
Abstract
為了提供一種表面處理裝置，能在處理槽內使新生的處理液的濃度大致均等。 In order to provide a surface treatment apparatus, the concentration of the newly-generated treatment liquid can be made substantially uniform in the treatment tank.
表面處理裝置(1)係具備：配置有複數個噴管(60)之處理槽(3-1~3-n)及複數個處理液循環裝置(100)，複數個噴管(60)是朝向浸漬於處理液之複數個工件(2)噴出處理液。複數個處理液循環裝置各個，是與處理槽之在長度方向被分割成複數個而構成且分別包含複數個噴管的至少1根之複數個分割區域(6)各個分別連接，將從分割區域(6)各個回收的處理液調整後，送回設置於分割區域(6)各個之至少1根的噴管。 The surface treatment device (1) is provided with a treatment tank (3-1 to 3-n) provided with a plurality of nozzles (60) and a plurality of treatment liquid circulation devices (100). The plurality of nozzles (60) are oriented The plurality of workpieces (2) immersed in the processing liquid eject the processing liquid. Each of the plurality of processing liquid circulation devices is connected to each of a plurality of divided regions (6) formed by dividing the processing tank into a plurality of plural lengths in the longitudinal direction and each including a plurality of nozzles, and will be connected from the divided regions. (6) After each recovered processing liquid is adjusted, it is sent back to at least one nozzle installed in each of the divided areas (6).
Description
本發明是關於電鍍裝置等的表面處理裝置，特別是關於將從處理槽回收後的處理液調整再送回處理槽之處理液的循環系統。 The present invention relates to a surface treatment device such as an electroplating device, and more particularly, to a circulation system of a treatment liquid that adjusts a treatment liquid recovered from a treatment tank and returns the treatment liquid to the treatment tank.
電鍍裝置是在處理槽內收容電鍍液。在專利文獻1揭示，於電鍍槽外設置由泵和過濾器所構成的雜質除去手段之電鍍裝置。從電鍍槽的底部將電鍍液排出，藉由雜質除去手段將無淤渣(slime)之清淨的電鍍液從電鍍槽的底部送回電鍍槽內而進行循環。此外，隨著對工件進行電鍍，氧化銅等的電鍍成分會被消耗，因此以往是從長的電鍍槽的一部分供給氧化銅。 The plating apparatus stores a plating solution in a processing tank. Patent Document 1 discloses that an electroplating device including a pump and a filter for removing impurities is provided outside the electroplating tank. The plating solution is discharged from the bottom of the plating tank, and the clean plating solution without slime is sent back to the plating tank from the bottom of the plating tank by the impurity removing means to be circulated. In addition, since plating components such as copper oxide are consumed as the workpiece is plated, conventionally, copper oxide was supplied from a part of a long plating bath.
[專利文獻1]日本特開2003-013291號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2003-013291
在專利文獻1，從電鍍槽之底部排出而藉由雜質除去手段將淤渣除去後之清淨的電鍍液，是從電鍍槽 的底部送回電鍍槽內而進行循環，因此在電鍍槽內，清淨的電鍍液無法被均等地分配。此外，以往，被消耗的氧化銅是從長的電鍍槽之一部分供給，因此存在處理槽內的電鍍液濃度不均一的問題。 In Patent Document 1, the clean plating solution that is discharged from the bottom of the plating tank and the sludge is removed by the impurity removing means is from the plating tank The bottom of the substrate is returned to the plating tank for circulation, so the clean plating solution cannot be evenly distributed in the plating tank. In addition, conventionally, the consumed copper oxide was supplied from a part of a long plating bath, and therefore there was a problem that the concentration of the plating solution in the processing bath was uneven.
本發明之至少一態樣，其目的是為了提供一種表面處理裝置，能在處理槽內使新生的(fresh)處理液的濃度大致均等。 An object of at least one aspect of the present invention is to provide a surface treatment device capable of making the concentration of a fresh treatment liquid substantially uniform in a treatment tank.
(1)本發明的一態樣，是關於一種表面處理裝置，其係具備：配置有複數個噴管之處理槽及複數個處理液循環裝置，前述複數個噴管，是朝向浸漬於處理液之複數個工件噴出前述處理液，前述複數個處理液循環裝置各個，是與前述處理槽之在長度方向被分割成複數個而構成且分別包含前述複數個噴管的至少1根之複數個分割區域各個分別連接，將從前述複數個分割區域各個回收的處理液調整後，送回設置於前述複數個分割區域各個之前述至少1根的噴管。 (1) An aspect of the present invention relates to a surface treatment device including a treatment tank provided with a plurality of nozzles and a plurality of treatment liquid circulation devices, wherein the plurality of nozzles are immersed in the treatment liquid in a direction The plurality of workpieces eject the treatment liquid, and each of the plurality of treatment liquid circulation devices is divided from the treatment tank into a plurality of lengths in the longitudinal direction, and includes a plurality of divisions including at least one of the plurality of nozzles. The regions are connected to each other separately, and the processing liquid recovered from each of the plurality of divided regions is adjusted, and then returned to the at least one nozzle provided in each of the plurality of divided regions.
依據本發明的一態樣，複數個處理液循環裝置各個，可調整從將處理槽在長度方向分割而成之複數個分割區域各個回收的處理液後，送回設置於複數個分割區域各個之至少1根的噴管。藉此，調整後之新生的處理液之濃度在複數個分割區域間成為大致均等。而且，在處理槽的各分割區域內，從至少1根的噴管將新生的處理液朝向工件噴出，因此在各分割區域內新生的處理液被分散，連在各分割區域內，處理液的濃度也成為大致均等。又關於處理槽的分割區域，並不限定於物理性分割而成者，只要至少分割區域各個具備回收處理液的構造即可。According to one aspect of the present invention, each of the plurality of processing liquid circulation devices can adjust the processing liquid recovered from each of the plurality of divided areas divided by the processing tank in the length direction, and then return the treated liquid to each of the plurality of divided areas. At least one nozzle. Thereby, the density | concentration of the newly adjusted processing liquid becomes substantially equal among a some division area. In addition, in each divided area of the processing tank, the new processing liquid is ejected toward the workpiece from at least one nozzle. Therefore, the new processing liquid is dispersed in each divided area and connected to each divided area. The density also became approximately equal. Moreover, the division area of a processing tank is not limited to a physical division, as long as at least each of the division areas has a structure for recovering a processing liquid.
(2)在本發明的一態樣(1)可構成為，前述複數個處理液循環裝置各個係包含：循環泵、及將從前述複數個分割區域之一藉由前述循環泵回收的處理液調整成再供給用處理液之調整槽，將來自前述調整槽之前述再供給用處理液藉由前述循環泵送回前述至少1根的噴管。如此，藉由循環泵回收後的處理液，在調整槽中整批調整，將來自調整槽的再供給用處理液藉由循環泵送回至少1根的噴管。(2) In one aspect of the present invention (1), each of the plurality of processing liquid circulation devices may include a circulation pump and a processing liquid recovered from one of the plurality of divided regions by the circulation pump. The adjustment tank is adjusted to a re-supplying treatment liquid, and the re-supplying treatment liquid from the adjustment tank is returned to the at least one nozzle by the circulation pump. In this way, the treatment liquid recovered by the circulation pump is adjusted in a batch in the adjustment tank, and the treatment liquid for resupply from the adjustment tank is returned to at least one nozzle by the circulation pump.
(3)在本發明的一態樣(2)可構成為，前述調整槽，是對所回收的處理液實施被消耗的成分之投入及溫度調整之至少一方。關於被消耗的成分，當表面處理為例如電鍍的情況，是指處理液中的電鍍成分、添加劑等。關於電鍍成分，當例如鍍銅的情況，是指氧化銅。關於添加劑，當例如電鍍的情況，是指光澤劑、平滑劑等。溫度調整，是依表面處理固有的最佳溫度將處理液進行溫度調整。藉由其中之任一方的調整，將回收後的處理液調整成新生的再供給用處理液。例如，亦可將回收後的處理液中之電鍍成分、添加劑等的濃度、或處理液的溫度利用感測器監測，當偏離適當值的情況將濃度或溫度進行調整。(3) In one aspect of the present invention (2), the adjustment tank may be configured to perform at least one of input of a consumed component and temperature adjustment to the recovered processing liquid. Regarding the consumed components, when the surface treatment is, for example, electroplating, it refers to plating components, additives, and the like in the treatment liquid. Regarding the plating composition, when, for example, copper plating is used, it means copper oxide. Regarding additives, when, for example, plating is used, it means a glossing agent, a smoothing agent, and the like. The temperature adjustment is to adjust the temperature of the treatment liquid according to the optimal temperature inherent to the surface treatment. By any one of the adjustments, the recovered treatment liquid is adjusted to a fresh resupply treatment liquid. For example, the concentration of plating components, additives, and the like in the recovered processing liquid, or the temperature of the processing liquid may be monitored by a sensor, and the concentration or temperature may be adjusted when it deviates from an appropriate value.
(4)在本發明的一態樣(2)可構成為，前述處理槽內的處理液，是從前述處理槽的底部側排出而被回收，前述複數個處理液循環裝置各個進一步具有：將來自前述調整槽的前述再供給用處理液過濾之過濾器。混入處理槽內的處理液中之比重較重的垃圾等的雜質沉積於處理槽的底部。該等雜質可和從處理槽的底部側排出之處理液一起被回收，並藉由過濾器除去。(4) In one aspect of the present invention (2), the processing liquid in the processing tank may be discharged from the bottom side of the processing tank and recovered, and each of the plurality of processing liquid circulation devices may further include: A filter for filtering the treatment liquid for resupply from the adjustment tank. Impurities such as heavy-duty garbage in the processing liquid mixed in the processing tank are deposited on the bottom of the processing tank. Such impurities can be recovered together with the processing liquid discharged from the bottom side of the processing tank, and removed by a filter.
(5)在本發明的一態樣(4)可構成為，進一步具有與前述處理槽鄰接之溢流槽，前述處理槽內的處理液是透過前述溢流槽排出而被回收。混入處理槽內的處理液中之比重較輕的雜質，是浮游於處理槽內的處理液之上部。該等雜質可和從處理槽溢流之處理液一起透過溢流槽排出而被回收，同樣地藉由過濾器除去。(5) In one aspect (4) of the present invention, an overflow tank adjacent to the processing tank is further provided, and the processing liquid in the processing tank is discharged through the overflow tank and recovered. The impurities having a relatively small specific gravity in the processing liquid mixed in the processing tank float on the upper portion of the processing liquid in the processing tank. Such impurities can be recovered through the overflow tank together with the processing liquid overflowing from the processing tank, and similarly removed by a filter.
(6)在本發明的一態樣(1)~(5)可構成為，前述表面處理裝置是由複數個處理單元在前述長度方向連結而形成，前述複數個處理單元各個，係包含用於收容前述處理液之分割處理槽，前述複數個處理液循環裝置各個，是與前述複數個處理單元各個的前述分割處理槽分別連接。如此般，當表面處理裝置是將複數個處理單元連結而構成的情況，可在各處理單元附設處理液循環裝置。但在各處理單元附設2個以上的處理液循環裝置亦可。(6) In one aspect of the present invention (1) to (5), the surface treatment device may be formed by connecting a plurality of processing units in the length direction, and each of the plurality of processing units includes a unit for The divided processing tank containing the processing liquid, each of the plurality of processing liquid circulation devices is connected to the divided processing tank of each of the plurality of processing units, respectively. In this manner, when the surface processing device is configured by connecting a plurality of processing units, a processing liquid circulation device may be attached to each processing unit. However, two or more processing liquid circulation devices may be attached to each processing unit.
以下，針對本發明的較佳實施形態詳細地說明。又以下所說明之本實施形態，並不是用於對申請專利範圍所記載之本發明的內容做不當地限定，本實施形態所說明的構成全體，作為本發明的解決手段不一定是必須的。Hereinafter, preferred embodiments of the present invention will be described in detail. In addition, this embodiment described below is not intended to improperly limit the content of the present invention described in the scope of patent application, and the entire structure described in this embodiment is not necessarily necessary as a means of solving the present invention.
1.複數個處理單元
圖1係本實施形態的電鍍裝置(廣義來說，表面處理裝置)之剖面圖。圖1中，該電鍍裝置1中，用於將電路基板等的工件2電鍍之電鍍處理部是將1個以上的處理單元3-1~3-n(n為自然數)連結而構成。複數個處理單元3-1~3-n可具有實質相同的構造。在複數個處理單元3-1~3-n各個，可將工件2連續搬運，亦可將工件2間歇搬運。構成為間歇搬運式的電鍍裝置1的情況，在複數個處理單元3-1~3-n各個，可讓至少一個、圖1中為M個(M為2以上的整數)例如M=4個的工件2間歇停止。圖1顯示最大尺寸的工件2，電鍍裝置1具有可處理此最大尺寸以下的工件2之通用性。以下，是舉間歇搬運式的電鍍裝置1為例來做說明。1. A plurality of processing units FIG. 1 is a cross-sectional view of a plating apparatus (broadly speaking, a surface processing apparatus) according to this embodiment. In FIG. 1, in the plating apparatus 1, a plating processing unit for plating a workpiece 2 such as a circuit board is configured by connecting one or more processing units 3-1 to 3-n (n is a natural number). The plurality of processing units 3-1 to 3-n may have substantially the same structure. In each of the plurality of processing units 3-1 to 3-n, the workpiece 2 can be continuously conveyed or the workpiece 2 can be intermittently conveyed. In the case of an intermittent-plating type plating apparatus 1, at least one of each of a plurality of processing units 3-1 to 3-n can be made, and M is shown in FIG. 1 (M is an integer of 2 or more). For example, M = 4 The workpiece 2 stops intermittently. FIG. 1 shows a workpiece 2 of the largest size, and the electroplating device 1 has the versatility to process the workpiece 2 below the largest size. The following description is given by taking the intermittent transfer type plating apparatus 1 as an example.
工件2，是藉由推動器等的間歇搬運裝置，從現在的停止位置朝向下一個停止位置沿A方向依序被間歇搬運。在本實施形態，一個工件2是在各處理單元內停止於4處。亦可在最上游的處理單元3-1之上游側連結搬入單元4，搬入單元4是藉由往B方向的下降移動而將工件2搬入。當處理單元3-1內的工件2被間歇搬運時，搬入單元4內的工件2也被間歇搬運而移動到處理單元3-1。亦可在最下游的處理單元3-n之下游側連結搬出單元5，搬出單元5是讓從處理單元3-n水平移動的工件2往C方向上昇而將其搬出。在處理單元3-n內的工件2被間歇搬運之前，搬出單元5內的工件2被往上方搬出。但將搬入單元4及/或搬出單元5省略亦可。在此情況，是在處理單元3-1的最上游停止位置讓工件2下降，讓處理單元3-n的最下游停止位置的工件2上昇而被搬出。The workpiece 2 is intermittently transported in order from the current stop position to the next stop position in the direction A by an intermittent conveying device such as a pusher. In this embodiment, one workpiece 2 is stopped at four places in each processing unit. The carry-in unit 4 may be connected upstream of the processing unit 3-1 on the most upstream side. The carry-in unit 4 may carry in the workpiece 2 by moving downward in the B direction. When the workpiece 2 in the processing unit 3-1 is intermittently transferred, the workpiece 2 in the loading unit 4 is also intermittently transferred and moved to the processing unit 3-1. The unloading unit 5 may be connected to the downstream side of the most downstream processing unit 3-n. The unloading unit 5 raises the workpiece 2 horizontally moved from the processing unit 3-n to the C direction and unloads it. Before the workpiece 2 in the processing unit 3-n is intermittently transferred, the workpiece 2 in the unloading unit 5 is unloaded upward. However, the carrying-in unit 4 and / or the carrying-out unit 5 may be omitted. In this case, the workpiece 2 is lowered at the most upstream stop position of the processing unit 3-1, and the workpiece 2 at the most downstream stop position of the processing unit 3-n is raised and carried out.
圖2係具有與處理單元3-2~3-n共同的構造之處理單元3-1的俯視圖。處理單元3-1具有：用於收容電鍍液(廣義來說，處理液)之分割處理槽6。工件2浸漬於分割處理槽6內的電鍍液。分割處理槽6是在上方開口之大致箱體，在上游側及下游側的間隔壁分別設有開口6A, 6B，藉此在相鄰單元(處理單元、搬入單元或搬出單元)之間容許工件2的水平移動。FIG. 2 is a plan view of a processing unit 3-1 having a structure common to the processing units 3-2 to 3-n. The processing unit 3-1 includes a divided processing tank 6 for containing a plating solution (broadly speaking, a processing solution). The work 2 is immersed in a plating solution in the division processing tank 6. The divided processing tank 6 is a roughly box body opened at the upper side, and openings 6A and 6B are provided on the partition walls on the upstream side and the downstream side, respectively, thereby allowing workpieces between adjacent units (processing unit, carry-in unit or carry-out unit). 2 horizontal movement.
在本實施形態，在位於處理單元3-1內之複數個、例如4個停止位置之工件2的表面及背面之至少一方側設置至少一個陽極20。在本實施形態是設置：與位於各停止位置之各個工件2的表面相對向之陽極20A、及與工件2的背面相對向之陽極20B。陽極20(20A, 20B)各個可包含：互相導通之複數個分割陽極。在本實施形態，是分割成上游側的分割陽極20A1(20B1)和下游側的分割陽極20A2(20B2)。陽極20亦可包含被分割成3個以上之分割陽極，因為互相導通而可視為一個陽極。In this embodiment, at least one anode 20 is provided on at least one of the front surface and the back surface of a plurality of workpieces 2 in the processing unit 3-1, for example, at four stopping positions. In this embodiment, an anode 20A facing the surface of each workpiece 2 located at each stop position and an anode 20B facing the back surface of the workpiece 2 are provided. Each of the anodes 20 (20A, 20B) may include: a plurality of divided anodes which are conductive with each other. In this embodiment, it is divided into an upstream divided anode 20A1 (20B1) and a downstream divided anode 20A2 (20B2). The anode 20 may include three or more divided anodes, which can be regarded as one anode because they are electrically connected to each other.
圖3係顯示配置於處理單元3-1之陽極20A1, 20A2(20B1, 20B2)和工件2的位置關係之前視圖。如圖3所示般，工件2是藉由搬運治具30保持。如圖2及圖3所示般，陽極20(20A, 20B)各個配置成，正對著位於4個停止位置之工件2。要點在於，如圖2所示般，只要能在設定成陰極之工件2和陽極20之間形成均一的電場即可。陽極20的形狀沒有特別的限制，圖2及圖3所示的陽極的輪廓雖呈矩形，但俯視下的輪廓呈圓形亦可。陽極是不溶性陽極或可溶性陽極皆可。FIG. 3 is a front view showing the positional relationship between the anodes 20A1, 20A2 (20B1, 20B2) and the workpiece 2 disposed in the processing unit 3-1. As shown in FIG. 3, the workpiece 2 is held by a transfer jig 30. As shown in FIG. 2 and FIG. 3, the anodes 20 (20A, 20B) are each arranged so as to face the workpiece 2 located at the four stop positions. The point is that, as shown in FIG. 2, a uniform electric field may be formed between the workpiece 2 set as a cathode and the anode 20. The shape of the anode 20 is not particularly limited. Although the outline of the anode shown in FIGS. 2 and 3 is rectangular, the outline in plan view may be circular. The anode may be either an insoluble anode or a soluble anode.
在本實施形態可具有：將一個處理單元3-1區劃成4個槽室11-1~11-4之遮蔽板23。在各槽室11-1~11-4內，於俯視下之工件2的兩側配置陽極20 (20A1, 20A2, 20B1, 20B2)。遮蔽板23是用於遮蔽在相鄰槽室間之電場(圖2之箭頭所示之陽極-陰極間的電場)的影響。在遮蔽板23形成有：讓工件2通過之開口23A。This embodiment may include a shielding plate 23 that divides one processing unit 3-1 into four tank chambers 11-1 to 11-4. In each of the chambers 11-1 to 11-4, anodes 20 (20A1, 20A2, 20B1, 20B2) are arranged on both sides of the workpiece 2 in a plan view. The shielding plate 23 is used to shield the influence of the electric field (the electric field between the anode and the cathode indicated by the arrow in FIG. 2) between the adjacent cells. The shielding plate 23 is formed with an opening 23A through which the workpiece 2 passes.
2.搬運治具
圖4顯示搬運治具30的一例。該搬運治具30係具有：水平臂部300、垂直臂部310、工件保持部320、被導引部330、被供電部340、被推動片350。水平臂部300是沿著與間歇搬運方向A正交之方向B延伸。垂直臂部310是藉由水平臂部300以垂下的方式保持。工件保持部320固定於垂直臂部310。工件保持部320係包含：上部框架321、藉由上部框架321例如可昇降地支承之下部框架322。在上部框架321設置：用於夾持工件2的上部之複數個夾持器323。在下部框架322設置：用於夾持工件2的下部之複數個夾持器324。利用下部的夾持器324，對工件2賦予向下的張力。但當工件2較厚的情況，或從工件2的下部不供電的情況，可將下部框架322及夾持器324省略。2. Carrying jig FIG. 4 shows an example of a carrying jig 30. The transport jig 30 includes a horizontal arm portion 300, a vertical arm portion 310, a work holding portion 320, a guided portion 330, a powered portion 340, and a pushed piece 350. The horizontal arm portion 300 extends in a direction B orthogonal to the intermittent conveying direction A. The vertical arm portion 310 is held down by the horizontal arm portion 300. The work holding portion 320 is fixed to the vertical arm portion 310. The work holding unit 320 includes an upper frame 321 and a lower frame 322 supported by the upper frame 321 so as to be movable up and down, for example. The upper frame 321 is provided with a plurality of holders 323 for holding the upper portion of the work 2. The lower frame 322 is provided with a plurality of holders 324 for holding the lower portion of the workpiece 2. The lower gripper 324 applies downward tension to the work 2. However, when the workpiece 2 is thick or when no power is supplied from the lower portion of the workpiece 2, the lower frame 322 and the holder 324 may be omitted.
被導引部330，是藉由沿著處理單元3-2~3-n配置而在例如以每個處理單元3-2~3-n為單位而被分割的導軌(未圖示)導引，且是用於將搬運治具30進行直線導引。被導引部330可包含：與導軌的頂面轉動接觸之滾子331、及與導軌的兩側面轉動接觸之滾子332(圖4中，僅圖示出與一側面轉動接觸之滾子)。The guided portion 330 is guided by a guide (not shown) that is divided along each of the processing units 3-2 to 3-n by being arranged along the processing units 3-2 to 3-n. , And is used to linearly guide the carrying jig 30. The guided portion 330 may include a roller 331 in rotational contact with the top surface of the guide rail, and rollers 332 in rotational contact with both sides of the guide rail (in FIG. 4, only the rollers in rotational contact with one side are shown) .
被供電部340，是與圖5及圖6所說明之陰極軌道接觸，透過搬運治具30的水平臂部300、垂直臂部310、工件保持部320而將工件2設定成陰極。被供電部340係包含：藉由沿著間歇搬運方向A延伸之支承臂341的上游側和下游側支承之2個接觸子342, 343。接觸子342, 343，是透過平行連桿機構而藉由支承臂341支承，且以壓接於陰極軌道的方式被彈簧蓄勢。2個接觸子342, 343是與夾持器323, 324之至少一方電氣連接，藉此將工件2設定成陰極。The powered portion 340 is in contact with the cathode rail described with reference to FIGS. 5 and 6, and sets the workpiece 2 as a cathode through the horizontal arm portion 300, the vertical arm portion 310, and the workpiece holding portion 320 of the conveyance jig 30. The powered portion 340 includes two contacts 342 and 343 supported by the upstream and downstream sides of the support arm 341 extending along the intermittent conveying direction A. The contacts 342 and 343 are supported by a support arm 341 through a parallel link mechanism, and are charged by a spring so as to be crimped to the cathode track. The two contacts 342 and 343 are electrically connected to at least one of the holders 323 and 324 to set the workpiece 2 as a cathode.
被推動片350，是固定於例如垂直臂部310，在工件保持部320之正上方位置將被推動面垂直地配置。被推動片350是藉由後述的間歇搬運裝置從圖示C方向推動，而對搬運治具30傳遞間歇搬運力。在圖4所示的搬運治具30設有：使用於連續搬運時之被卡合部360，而讓搬運治具30可兼用於間歇搬運及連續搬運。The pushed piece 350 is fixed to, for example, the vertical arm portion 310, and the pushed surface is vertically arranged at a position directly above the workpiece holding portion 320. The pushed piece 350 is pushed from the direction C shown in the figure by an intermittent conveying device described later, and transmits the intermittent conveying force to the conveying jig 30. The conveyance jig 30 shown in FIG. 4 is provided with an engaged portion 360 for continuous conveyance, and the conveyance jig 30 can be used for both intermittent conveyance and continuous conveyance.
3.陰極軌道及整流器
如圖5所示般，各處理單元3-1~3-n(圖5僅圖示出2個處理單元)係具有至少1根陰極軌道40。陰極軌道40亦可與搬運方向A平行地將複數根並列配置。在此情況，複數根陰極軌道40可連接於相同的整流器，亦可連接於不同的整流器，而對每個供電部位將電流值獨立地控制。在本實施形態是設置1根陰極軌道40。1根陰極軌道40較佳為具有：以每個處理單元3-1~3-n為單位而被分割之複數根分割陰極軌道40-1~40-n(圖5僅圖示出2個分割陰極軌道40-1, 40-2)，且連結成在搬運方向A呈連續。如圖5及圖6(A)所示般，分割陰極軌道40-1~40-n各個，在絕緣軌道41上隔著間隔(非導電部)42而在讓工件2停止之各槽室分別設置一個導電部43，即合計設有4個導電部43。4個導電部43各個，是在各處理單元3-1~3-n之4處的停止位置，與將工件2保持而停止後之圖4所示的搬運治具30之被供電部340(2個接觸子342, 343)電氣導通。又在圖5顯示在各處理單元3-1~3-n所收容之電鍍液的液面L，工件2浸漬於電鍍液中。又如圖6(B)所示般，在陰極軌道40之寬度方向的兩端設有間隔壁44, 44，藉此可在導電部43上保持非油性的導電性流體(例如水)45。如此般，透過導電性流體45可更確實地保證被供電部340(2個接觸子342, 343)和導電部43的電氣接觸。但因為水的導電性比金屬製之導電部43的導電性低得多，相鄰的導電部43, 43間的絕緣性被維持住。此外，如圖6(B)所示般，用於將導電部43固定在絕緣軌道41上之螺栓46，可配置在隔著被供電部340之行進路線的兩側。藉此，不須在導電部34設置螺栓的埋頭孔，可排除形成電阻的主要原因。3. Cathode Track and Rectifier As shown in FIG. 5, each processing unit 3-1 to 3-n (only two processing units are shown in FIG. 5) has at least one cathode track 40. The cathode rails 40 may be arranged in parallel in parallel to the conveyance direction A. In this case, the plurality of cathode rails 40 can be connected to the same rectifier or different rectifiers, and the current value can be controlled independently for each power supply part. In this embodiment, one cathode track 40 is provided. One cathode track 40 is preferably provided with a plurality of divided cathode tracks 40-1 to 40 divided by each processing unit 3-1 to 3-n. -n (only two divided cathode rails 40-1, 40-2 are shown in FIG. 5), and they are connected continuously in the conveying direction A. As shown in FIG. 5 and FIG. 6 (A), each of the cathode rails 40-1 to 40-n is divided, and each of the tank chambers for stopping the workpiece 2 is separated from each other by a gap (non-conductive portion) 42 on the insulating rail 41. One conductive part 43 is provided, that is, a total of four conductive parts 43 are provided. Each of the four conductive parts 43 is a stop position at four of each processing unit 3-1 to 3-n, and after holding the workpiece 2 to stop The powered part 340 (two contacts 342, 343) of the carrying jig 30 shown in FIG. 4 is electrically conductive. FIG. 5 also shows a liquid surface L of the plating solution contained in each of the processing units 3-1 to 3-n, and the workpiece 2 is immersed in the plating solution. As shown in FIG. 6 (B), partition walls 44 and 44 are provided at both ends in the width direction of the cathode rail 40, so that a non-oily conductive fluid (such as water) 45 can be held on the conductive portion 43. In this way, the conductive fluid 45 can ensure the electrical contact between the powered portion 340 (the two contacts 342 and 343) and the conductive portion 43 more reliably. However, since the conductivity of water is much lower than that of the conductive portion 43 made of metal, the insulation between adjacent conductive portions 43 and 43 is maintained. In addition, as shown in FIG. 6 (B), the bolts 46 for fixing the conductive portion 43 to the insulating rail 41 may be disposed on both sides of the travel route across the powered portion 340. Thereby, it is not necessary to provide a countersunk hole of a bolt in the conductive portion 34, and the main cause of resistance formation can be eliminated.
各處理單元3-1~3-n，是在讓工件2停止的各槽室分別設有一個整流器50，即合計具有4個整流器50(圖5僅圖示出一個整流器50)。4個整流器50之各一個正端子51，是與配置於各槽室之陽極20(20A1, 20A2, 20B1, 20B2)連接。4個整流器50之各一個負端子52，是與分割陰極軌道40-1~40-n之對應於各一個槽室之導電部43連接。Each of the processing units 3-1 to 3-n is provided with a rectifier 50 in each of the chambers for stopping the workpiece 2, that is, a total of four rectifiers 50 (only one rectifier 50 is shown in FIG. 5). One positive terminal 51 of each of the four rectifiers 50 is connected to the anode 20 (20A1, 20A2, 20B1, 20B2) arranged in each tank. One negative terminal 52 of each of the four rectifiers 50 is connected to the conductive portion 43 corresponding to each of the compartments of the divided cathode rails 40-1 to 40-n.
4.工件停止時的電流控制
在各處理單元3-1~3-n之4處的停止位置(槽室)流過4個工件2之電流，是藉由在每個槽室分別設置一個之整流器50各個獨立地控制。而且，在槽室間是讓陰極彼此絕緣且陽極彼此絕緣，因此是讓每個工件2絕緣分離，而能利用各整流器50將工件2個別地進行供電控制。此外，在槽室間是藉由遮蔽板23將電場分離，因此可將槽室間的影響排除，而能保證每個工件2之個別供電。如此，能使工件2的電鍍品質提高。4. Current control when the workpiece is stopped 4 currents of 2 workpieces are flowed in the stopping positions (slot chambers) at 4 places of each processing unit 3-1 ~ 3-n. The rectifiers 50 are each independently controlled. In addition, since the cathodes are insulated from each other and the anodes are insulated from each other between the chambers, each work 2 is insulated and separated, and the work 2 can be individually controlled for power supply by each rectifier 50. In addition, since the electric field is separated between the chambers by the shielding plate 23, the influence between the chambers can be eliminated, and the individual power supply of each workpiece 2 can be guaranteed. In this way, the plating quality of the workpiece 2 can be improved.
本實施形態的間歇搬運方式，與習知之連續搬運方式進行比對的結果，習知之被連續搬運的工件(陰極)和被固定的陽極之位置關係不斷改變，反而本實施形態之停止的工件(陰極)2是可正對著陽極20。如此般，在工件2停止中，陰極和陽極的位置關係成為一定，各工件成為同一電鍍條件，因此可期待電鍍品質的提高。特別是如果工件2停止的話，接觸電阻的變動就不會發生，因此可進行精密的電流控制。此外，在連續搬運所使用之很長的陰極軌道途中設有固定螺栓用的埋頭孔等，因此陰極軌道的電阻值會因場所而有不同，無法成為均一的電阻。因此，依工件之連續搬運中的位置，流過工件的電流會有不同，間歇搬運則可解決這樣的問題。再者，本實施形態也不像連續搬運那樣，電鍍品質並不會受工件的連續搬運速度之不良影響。As a result of the comparison between the intermittent conveyance method of this embodiment and the conventional continuous conveyance method, the positional relationship between the workpiece (cathode) being continuously conveyed and the fixed anode is known to change continuously. Instead, the stopped workpiece ( The cathode) 2 is directly opposite the anode 20. In this way, when the workpiece 2 is stopped, the positional relationship between the cathode and the anode becomes constant, and the workpieces are under the same plating conditions. Therefore, the improvement in the plating quality can be expected. In particular, if the workpiece 2 is stopped, fluctuations in the contact resistance do not occur, so precise current control can be performed. In addition, since a long cathode track used for continuous transportation is provided with countersunk holes for fixing bolts and the like, the resistance value of the cathode track varies depending on the location, and cannot be a uniform resistance. Therefore, depending on the position of the workpiece during continuous transportation, the current flowing through the workpiece will be different, and intermittent transportation can solve this problem. Moreover, this embodiment is not like continuous conveyance, and the plating quality is not adversely affected by the continuous conveyance speed of the workpiece.
然而，不一定要實施上述般的完全個別供電來將工件2間歇搬運。亦即，在各處理單元3-1~3-n之4個槽室11-1~11-4，可將陰極及陽極之一方或雙方設定為共用(共用陰極及/或共用陽極)。However, it is not necessary to implement the above-mentioned completely separate power supply to intermittently transport the workpiece 2. That is, in the four tank chambers 11-1 to 11-4 of each processing unit 3-1 to 3-n, one or both of the cathode and the anode can be set to be shared (shared cathode and / or shared anode).
5.噴管的移動掃描
在各處理單元3-1~3-n之4個槽室11-1~11-4，如圖8所示般，俯視下在位於停止位置之工件2的各面(表面及背面)和陽極20之間，可進一步設置至少1根噴管60。因為噴管60會將形成於工件(陰極)2和陽極20間的電場遮蔽，當設有複數個噴管60的情況，其數量是越少越好。噴管60是如圖9所示般，具有噴出電鍍液之複數個噴出口60A。圖9所示之噴管60的噴出口60A，其垂直方向節距P可比習知的連續搬運式所採用之節距(例如7.5mm)更小，可設定成噴出口60A的外徑以上且5mm以下。這是因為可將每單位時間之電鍍液供給量增多。此外，為了對小尺寸的晶片、精密的圖案均等地供給電鍍液，節距P是越小越好。又在圖9中，工件2之表背面側的噴管60雖是隔著工件2對置，但設置於非對向位置亦可。如果對置的話，可解決工件2因液壓而變形的問題，當非對向配置時，要對工件2的貫通孔供給電鍍液變容易。縱使是連續搬運方式也設有噴管，其數量在一處理單元多達十幾根。5. Nozzle movement scanning in the four tank chambers 11-1 ~ 11-4 of each processing unit 3-1 ~ 3-n, as shown in Fig. 8, each side of the workpiece 2 located at the stop position in a plan view. (Front and back) and the anode 20, at least one nozzle 60 may be further provided. Because the nozzles 60 shield the electric field formed between the workpiece (cathode) 2 and the anode 20, when a plurality of nozzles 60 are provided, the smaller the number, the better. As shown in FIG. 9, the nozzle 60 has a plurality of nozzles 60A for discharging a plating solution. The discharge port 60A of the nozzle 60 shown in FIG. 9 can have a vertical pitch P that is smaller than the pitch (for example, 7.5 mm) used in the conventional continuous conveying type, and can be set to be larger than the outer diameter of the discharge port 60A and 5mm or less. This is because the supply amount of the plating solution per unit time can be increased. In addition, in order to uniformly supply the plating solution to small-sized wafers and precise patterns, the smaller the pitch P, the better. In FIG. 9, although the nozzles 60 on the front and back sides of the work 2 are opposed to each other with the work 2 interposed therebetween, the nozzles 60 may be provided at non-opposing positions. If they face each other, the problem of deformation of the workpiece 2 due to the hydraulic pressure can be solved. When the workpiece 2 is not disposed in the opposite direction, it is easy to supply the plating solution to the through holes of the workpiece 2. Even though the continuous conveying method is also provided with nozzles, the number is as many as a dozen in a processing unit.
在工件的連續搬運方式多數根噴管雖是固定的，在採用間歇搬運方式之本實施形態，在各處理單元3-1~3-n之4個槽室11-1~11-4，讓至少1根噴管60沿著例如圖8的箭頭A1方向及A2方向(皆與間歇搬運方向A平行)進行水平掃描移動。藉此，如圖9所示般，可對工件2全面均一地噴出電鍍液。此外，噴管60的移動速度，可設定成比連續搬運方式之工件2的移動速度(例如0.8m/min)更快。如此，可將每單位時間之電鍍液供給量增多。又在連續搬運方式，當將工件速度加快時，處理槽的全長會變長而使裝置變得大型化，但在本實施形態般的間歇搬運，不會使裝置變得大型化。In the continuous conveying method of the workpiece, although most of the nozzles are fixed, in this embodiment adopting the intermittent conveying method, in the four tank chambers 11-1 to 11-4 of each processing unit 3-1 to 3-n, let At least one nozzle 60 performs a horizontal scanning movement along, for example, an arrow A1 direction and an A2 direction (both parallel to the intermittent conveyance direction A) in FIG. 8. As a result, as shown in FIG. 9, the plating solution can be sprayed uniformly across the workpiece 2. In addition, the moving speed of the nozzle 60 can be set faster than the moving speed (for example, 0.8 m / min) of the workpiece 2 in the continuous conveyance method. In this way, the supply amount of the plating solution per unit time can be increased. In the continuous conveying method, when the speed of the workpiece is increased, the total length of the processing tank becomes longer and the apparatus becomes larger. However, the intermittent conveyance as in this embodiment does not increase the apparatus.
噴管60的往復移動機構雖圖示省略，可採用公知之讓其往復直線運動的機構(例如用可逆馬達驅動之齒輪-齒條機構、活塞-曲柄機構等)。該往復移動機構，能以與在各槽室停止之工件2的至少水平寬度對應的長度範圍進行至少一次循環掃描的方式，讓2根噴管60移動。如此，使被處理之工件2的面內均一性提高。又較佳為，讓噴管60從初期位置進行至少一次循環掃描後再返回初期位置。這是因為，使噴管60的影子在工件面內大致均一化。可在裝置運轉中讓噴管60的往復掃描移動連續進行，亦可在工件2的間歇搬運中將噴管60的往復掃描移動停止。Although the reciprocating mechanism of the nozzle 60 is not shown in the figure, a known mechanism that reciprocates linearly (for example, a rack-and-pinion mechanism driven by a reversible motor, a piston-crank mechanism, etc.) may be used. The reciprocating mechanism can move the two nozzles 60 at least once in a cycle scan in a length range corresponding to at least the horizontal width of the workpiece 2 stopped in each tank chamber. In this way, the in-plane uniformity of the workpiece 2 to be processed is improved. It is also preferable that the nozzle 60 be scanned at least once from the initial position and then returned to the initial position. This is because the shadow of the nozzle 60 is made substantially uniform within the workpiece surface. The reciprocating scanning movement of the nozzle 60 may be continuously performed during the operation of the apparatus, or the reciprocating scanning movement of the nozzle 60 may be stopped during the intermittent conveyance of the workpiece 2.
依據本實施形態，對於間歇停止的工件2，對應於工件2的停止位置可讓至少一根、例如2根噴管60相對於工件2進行掃描移動。如此，俯視下成為位於工件2和陽極20間之噴管60的影子而使陽極-陰極間之電場受干擾的區域，會隨著噴管60的移動而移動。因此，電場受噴管60干擾的區域不是固定的，而使被處理之工件2的面內均一性提高。又噴管60之掃描移動方向並不限定於水平方向。例如將噴管60水平地配置而沿著垂直方向掃描移動亦可，掃描移動方向可為水平、垂直等的任一方向。According to the present embodiment, at least one, for example, two nozzles 60 can be scanned and moved with respect to the workpiece 2 according to the stop position of the workpiece 2 with respect to the workpiece 2 that is intermittently stopped. In this way, the area that becomes the shadow of the nozzle 60 located between the workpiece 2 and the anode 20 and interferes with the electric field between the anode and the cathode in plan view moves as the nozzle 60 moves. Therefore, the area where the electric field is disturbed by the nozzle 60 is not fixed, and the in-plane uniformity of the workpiece 2 to be processed is improved. The scanning movement direction of the nozzle 60 is not limited to the horizontal direction. For example, the nozzles 60 may be horizontally arranged to scan and move in the vertical direction, and the scanning movement direction may be any of horizontal and vertical directions.
噴管60，可利用公知的構造，將分割處理槽內之噴出口60A附近的電鍍液捲入後噴出。如此，可將陽極20附近之金屬離子豐富的電鍍液朝向工件2噴出，而使處理量提高。The nozzle 60 may have a well-known structure and wind up the plating solution in the vicinity of the nozzle 60A in the divided processing tank and discharge the plating solution. In this way, a plating solution rich in metal ions in the vicinity of the anode 20 can be sprayed toward the workpiece 2 and the throughput can be increased.
又噴管60之掃描移動，可廣泛運用於間歇搬運方式的表面處理裝置，並不限定於上述實施形態般的構造，亦即不限定於複數個處理單元的連結構造、陰極分割構造、陽極分割構造等。此外，本發明不一定要運用於間歇搬運式的表面處理裝置，在連續搬運式的表面處理裝置，至少1根的噴管配置成固定的。The scanning movement of the nozzle 60 can be widely applied to the surface treatment device of the intermittent conveyance method, and is not limited to the structure of the above embodiment, that is, it is not limited to the connection structure of a plurality of processing units, the cathode division structure, and the anode division Construction, etc. In addition, the present invention does not necessarily need to be applied to a batch type surface treatment device. In a continuous type surface treatment device, at least one nozzle is arranged to be fixed.
6.處理液循環裝置
圖9係顯示與圖1所示的各處理單元3-1~3-n各個連接之處理液循環裝置100的示意圖。圖9中，處理液循環裝置100連結於處理單元3-1的分割處理槽6。然而，在分割處理槽6連結複數個處理液循環裝置100亦可，在例如圖3所示之4個槽室11-1~11-4連結一個處理液循環裝置100亦可。或是，在複數個分割處理槽6連結一個處理液循環裝置100亦可。但與處理液循環裝置100連結之分割區域，並不限定於處理單元3-1~3-n、槽室11-1~11-4等之物理性分割而成者。6. Process Liquid Circulation Device FIG. 9 is a schematic diagram showing a process liquid circulation device 100 connected to each of the processing units 3-1 to 3-n shown in FIG. 1. In FIG. 9, the processing liquid circulation device 100 is connected to the divided processing tank 6 of the processing unit 3-1. However, a plurality of processing liquid circulation devices 100 may be connected to the divided processing tank 6. For example, one processing liquid circulation device 100 may be connected to the four tank chambers 11-1 to 11-4 shown in FIG. 3. Alternatively, one processing liquid circulation device 100 may be connected to the plurality of divided processing tanks 6. However, the divided areas connected to the processing liquid circulation device 100 are not limited to those obtained by physically dividing the processing units 3-1 to 3-n, the tank chambers 11-1 to 11-4, and the like.
圖9中，處理液循環裝置100，是將從分割處理槽6回收的電鍍液調整後送回：在分割處理槽6的各槽室11-1~11-4設置於工件2的兩側之各2組、合計8組的噴管60。處理液循環裝置100具有調整槽110。調整槽110，是透過例如常開閥111而與分割處理槽6的底部連通。如圖9所示般，當在分割處理槽6之寬度方向之例如兩側具有溢流槽7A, 7B的情況，調整槽110也與溢流槽7A, 7B的底部連通。In FIG. 9, the processing liquid circulation device 100 adjusts and returns the electroplating solution recovered from the divided processing tank 6: each of the tank chambers 11-1 to 11-4 of the divided processing tank 6 is disposed on both sides of the workpiece 2 Nozzles 60 of 2 groups each, 8 groups in total. The treatment liquid circulation device 100 includes an adjustment tank 110. The adjustment tank 110 communicates with the bottom of the division processing tank 6 through, for example, a normally open valve 111. As shown in FIG. 9, when there are overflow grooves 7A and 7B on both sides in the width direction of the division processing tank 6, the adjustment tank 110 is also communicated with the bottoms of the overflow grooves 7A and 7B.
調整槽110可具備：氧化銅投入部112、添加劑投入部113及溫度調整部114。為了補充隨著銅電鍍而被消耗的成分而將氧化銅及添加劑投入。溫度調整，是依表面處理固有的最佳溫度而將處理液進行溫度調整。在調整槽110之下游側連接2條的返回路徑120A, 120B。返回路徑120A連接於：在分割處理槽6之各槽室11-1~11-4設置於工件2的表側之各1組、合計4組的噴管60。返回路徑120B連接於：在分割處理槽6的各槽室11-1~11-4設置於工件2的背側之各1組、合計4組的噴管60。在2條的返回路徑120A, 120B各個設有循環泵121、過濾器122及流量計123。The adjustment tank 110 may include a copper oxide input section 112, an additive input section 113, and a temperature adjustment section 114. Copper oxide and additives are added in order to supplement the components consumed by copper plating. The temperature adjustment is to adjust the temperature of the treatment liquid according to the optimal temperature inherent to the surface treatment. Two return paths 120A, 120B are connected downstream of the adjustment tank 110. The return path 120A is connected to a set of four nozzles 60 provided in each of the tank chambers 11-1 to 11-4 of the divided processing tank 6 on the front side of the workpiece 2 in total. The return path 120B is connected to a set of four nozzle pipes 60 provided in each of the tank chambers 11-1 to 11-4 of the divided processing tank 6 on the back side of the workpiece 2 in total. A circulation pump 121, a filter 122, and a flow meter 123 are provided in each of the two return paths 120A and 120B.
依據本實施形態，複數個處理液循環裝置100各個，調整從將處理槽在長度方向分割而成之分割處理槽6各個回收的電鍍液後，作為再供給用處理液送回設置於分割處理槽6各個之合計8組的噴管60。如此，調整後之新生的電鍍液濃度，在複數個分割處理槽6間成為大致均等。而且，在各分割處理槽6內，從被移動掃描之合計8組的噴管60將新生的電鍍液朝向工件2噴出。如此，在各分割處理槽6內新生的電鍍液被分散，連在各分割處理槽6內電鍍液的濃度也成為大致均等。此外，如果從噴管60的上部側供給再供給用處理液，可進行排氣。According to this embodiment, each of the plurality of processing liquid circulation apparatuses 100 adjusts the plating liquid recovered from each of the divided processing tanks 6 that divides the processing tanks in the longitudinal direction, and sends them back as the processing liquid for resupply to the divided processing tanks. 6 nozzles 60 in total of 8 groups. In this way, the adjusted concentration of the newly-generated plating solution becomes substantially equal among the plurality of divided processing tanks 6. In each of the divided processing tanks 6, the newly generated plating solution is ejected toward the workpiece 2 from the nozzles 60 of a total of eight groups scanned and scanned. In this way, the plating solution newly formed in each of the divided processing tanks 6 is dispersed, and the concentration of the plating solution in each of the divided processing tanks 6 is also substantially uniform. In addition, if the resupplying treatment liquid is supplied from the upper side of the nozzle 60, exhaust can be performed.
調整槽110，可對於回收後的電鍍液，實施被消耗的成分、例如氧化銅及/或添加劑的投入、以及溫度調整之至少一方。藉由其中任一方的調整，將回收後的電鍍調整成新生的再供給用處理液。The adjustment tank 110 may perform at least one of the consumed components, such as the input of copper oxide and / or additives, and the temperature adjustment on the recovered plating solution. By any of these adjustments, the recovered electroplating is adjusted to a fresh resupplying treatment liquid.
從分割處理槽6之具有傾斜面6C的底部回收之電鍍液中所含之比重較重的雜質(金屬系、例如氧化銅的銅粉)、從溢流槽7A, 7B回收之電鍍液所含之比重較輕的雜質(例如樹脂系)，可藉由過濾器122除去。如此，可防止再供給的電鍍液之汙染，還能防止噴管60的阻塞。特別是當形成於工件2之配線的線距變小時，縱使是微小的垃圾也會造成短路不良。這樣的垃圾，可藉由過濾器122除去，因此可從再供給的電鍍液中排除。又比重較重的垃圾，藉由從處理槽的底部透過常開閥111回收，可防止對流而殘存於處理槽。Heavier impurities (metals, such as copper powder of copper oxide) contained in the plating solution recovered from the bottom of the divided processing tank 6 having the inclined surface 6C, contained in the plating solution recovered from the overflow tanks 7A, 7B Lighter impurities (for example, resin) can be removed by the filter 122. In this way, contamination of the resupplying plating solution can be prevented, and clogging of the nozzle pipe 60 can be prevented. In particular, when the line pitch of the wiring formed on the work 2 becomes small, even a small amount of garbage can cause short-circuit failure. Since such garbage can be removed by the filter 122, it can be removed from the re-supplying plating solution. The heavy specific gravity garbage can be collected from the bottom of the processing tank through the normally open valve 111 to prevent convection from remaining in the processing tank.
又雖如上述般針對本實施形態做詳細地說明，但所屬技術領域具有通常知識者應可輕易地理解到，在實質上不脫離本發明的新事項及效果的範圍內存在有許多的變形。因此，這樣的變形例全都包含於本發明的範圍。例如，說明書或圖式中至少出現一次之與更廣義或同義的不同用語一起記載之用語，在說明書或圖式之任何部分都能置換成該不同的用語。又本實施形態及變形例之所有的組合都包含於本發明的範圍。Although the present embodiment has been described in detail as described above, those skilled in the art can easily understand that there are many variations within the scope of not substantially departing from the new matters and effects of the present invention. Therefore, all such modifications are included in the scope of the present invention. For example, a term that appears together with a different broader or synonymous different term that appears at least once in the description or the drawing can be replaced with the different term in any part of the description or the drawing. All combinations of the embodiment and the modifications are included in the scope of the present invention.
1‧‧‧表面處理裝置1‧‧‧ surface treatment device
2‧‧‧工件 2‧‧‧ Workpiece
3-1~3-n‧‧‧處理單元 3-1 ~ 3-n‧‧‧ processing unit
6‧‧‧分割處理槽 6‧‧‧ Split processing tank
6C‧‧‧傾斜面 6C‧‧‧inclined surface
7A,7B‧‧‧溢流槽 7A, 7B‧‧‧ Overflow tank
20(20A1,20A2,20B1,20B2)‧‧‧陽極 20 (20A1,20A2,20B1,20B2) ‧‧‧Anode
30‧‧‧搬運治具 30‧‧‧handling jig
40,40-1,40-2‧‧‧陰極軌道(分割陰極軌道) 40, 40-1, 40-2‧‧‧ cathode track (split cathode track)
41‧‧‧絕緣軌道 41‧‧‧ insulated track
42‧‧‧間隔(非導電部) 42‧‧‧space (non-conductive part)
43‧‧‧導電部 43‧‧‧Conducting part
50‧‧‧整流器 50‧‧‧ Rectifier
51‧‧‧正端子 51‧‧‧Positive terminal
52‧‧‧負端子 52‧‧‧Negative terminal
60‧‧‧噴管 60‧‧‧ Nozzle
60A‧‧‧噴出口 60A‧‧‧Spout
100‧‧‧處理液循環裝置 100‧‧‧ treatment liquid circulation device
110‧‧‧調整槽 110‧‧‧adjusting groove
111‧‧‧常開閥 111‧‧‧Normally Open Valve
112‧‧‧氧化銅投入部 112‧‧‧Copper oxide input department
113‧‧‧添加劑投入部 113‧‧‧Additive input department
114‧‧‧溫度調整部 114‧‧‧Temperature Adjustment Department
120A,120B‧‧‧第1,第2返回路徑 120A, 120B‧‧‧1st, 2nd return path
121‧‧‧循環泵 121‧‧‧Circulation pump
122‧‧‧過濾器 122‧‧‧ Filter
123‧‧‧流量計 123‧‧‧Flowmeter
圖1係本發明的實施形態之間歇搬運方式的電鍍裝置之電鍍處理部的概略剖面圖。FIG. 1 is a schematic cross-sectional view of an electroplating treatment section of an electroplating apparatus of a batch conveying system according to an embodiment of the present invention.
圖2係圖1所示的電鍍裝置之一處理單元的概略俯視圖。 FIG. 2 is a schematic plan view of a processing unit which is one of the plating apparatus shown in FIG. 1.
圖3係顯示停止於一處理單元內之工件和陽極的位置關係。 Figure 3 shows the positional relationship between the workpiece and the anode stopped in a processing unit.
圖4係用於搬運工件之搬運治具的立體圖。 Fig. 4 is a perspective view of a transport jig for transporting a workpiece.
圖5係顯示陽極、陰極軌道上的導電部及整流器的連接之示意圖。 FIG. 5 is a schematic diagram showing the connection of the conductive part and the rectifier on the anode and cathode tracks.
圖6(A)(B)係陰極軌道之前視圖及剖面圖。 Figure 6 (A) (B) is a front view and a sectional view of a cathode track.
圖7係顯示在槽室內往復水平掃描移動之噴管的俯視圖。 FIG. 7 is a top view showing a nozzle that is reciprocated horizontally and scanned in a tank chamber.
圖8係顯示噴管的噴出口之排列節距。 Fig. 8 shows the arrangement pitch of the nozzles of the nozzle.
圖9係顯示連接於分割處理槽之處理液循環裝置的示意圖。 FIG. 9 is a schematic diagram showing a processing liquid circulation device connected to a divided processing tank.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1265425C (en) * | 2001-01-17 | 2006-07-19 | 株式会社荏原制作所 | Substrate processing apparatus |
| TWI281516B (en) * | 2000-03-17 | 2007-05-21 | Ebara Corp | Plating apparatus and plating method |
| JP2014129592A (en) * | 2012-12-27 | 2014-07-10 | Samsung Electro-Mechanics Co Ltd | Electrolytic plating shield board and electrolytic plating device possessing the same |
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|---|---|---|---|---|
| JP3088562B2 (en) * | 1992-04-09 | 2000-09-18 | 川崎製鉄株式会社 | Circulation method of plating solution in electroplating |
| JP2003013291A (en) * | 2001-06-29 | 2003-01-15 | Almex Inc | Plating apparatus |
| JP3989864B2 (en) * | 2003-03-20 | 2007-10-10 | 木田精工株式会社 | Plating equipment and plating line for plating line |
| JP5650899B2 (en) * | 2009-09-08 | 2015-01-07 | 上村工業株式会社 | Electroplating equipment |
| JP5613499B2 (en) * | 2010-08-25 | 2014-10-22 | アルメックスＰｅ株式会社 | Surface treatment equipment |
| JP5795965B2 (en) * | 2011-05-30 | 2015-10-14 | 株式会社荏原製作所 | Plating equipment |
| JP5795514B2 (en) * | 2011-09-29 | 2015-10-14 | アルメックスＰｅ株式会社 | Continuous plating equipment |
| JP2014237865A (en) * | 2013-06-06 | 2014-12-18 | 株式会社荏原製作所 | Electrolytic copper plating apparatus |
| CN104862767B (en) * | 2015-05-29 | 2017-05-10 | 东莞市开美电路板设备有限公司 | Copper plating tank |
| CN106637331A (en) * | 2015-10-28 | 2017-05-10 | 东莞市希锐自动化科技股份有限公司 | Flexible PCB electroplating copper cylinder with board feeding device and jet flow mechanism |
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2018
- 2018-10-10 WO PCT/JP2018/037758 patent/WO2019078065A1/en active Application Filing
- 2018-10-10 JP JP2019549225A patent/JP6875758B2/en active Active
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- 2018-10-10 KR KR1020207013366A patent/KR20200073243A/en unknown
- 2018-10-17 TW TW107136455A patent/TWI677599B/en active
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI281516B (en) * | 2000-03-17 | 2007-05-21 | Ebara Corp | Plating apparatus and plating method |
| CN1265425C (en) * | 2001-01-17 | 2006-07-19 | 株式会社荏原制作所 | Substrate processing apparatus |
| JP2014129592A (en) * | 2012-12-27 | 2014-07-10 | Samsung Electro-Mechanics Co Ltd | Electrolytic plating shield board and electrolytic plating device possessing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20200073243A (en) | 2020-06-23 |
| JPWO2019078065A1 (en) | 2020-08-06 |
| CN111247274A (en) | 2020-06-05 |
| WO2019078065A1 (en) | 2019-04-25 |
| TW201923165A (en) | 2019-06-16 |
| PH12020550789A1 (en) | 2021-04-12 |
| JP6875758B2 (en) | 2021-05-26 |
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