TWI680953B - Crossing method - Google Patents

Crossing method Download PDF

Info

Publication number
TWI680953B
TWI680953B TW104132606A TW104132606A TWI680953B TW I680953 B TWI680953 B TW I680953B TW 104132606 A TW104132606 A TW 104132606A TW 104132606 A TW104132606 A TW 104132606A TW I680953 B TWI680953 B TW I680953B
Authority
TW
Taiwan
Prior art keywords
substrate
cutter
support roller
scribe line
scribing
Prior art date
Application number
TW104132606A
Other languages
Chinese (zh)
Other versions
TW201623172A (en
Inventor
曾山正信
Original Assignee
日商三星鑽石工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三星鑽石工業股份有限公司 filed Critical 日商三星鑽石工業股份有限公司
Publication of TW201623172A publication Critical patent/TW201623172A/en
Application granted granted Critical
Publication of TWI680953B publication Critical patent/TWI680953B/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Mining & Mineral Resources (AREA)

Abstract

本發明之課題在於提高劃線之加工精度。 The subject of the present invention is to improve the processing accuracy of scribing.

劃線方法包括步驟(a)及步驟(b)。步驟(a)中，藉由第1切割器1於基板W之上表面形成第1劃線。第1切割器1於步驟(a)中，配置於基板W之上表面側，且於朝向基板W之方向被施加負載。步驟(b)中，藉由第2切割器2於基板W之下表面形成第2劃線。第2切割器2於步驟(b)中，配置於基板W之下表面側，且於朝向基板W之方向上被固定。 The scribing method includes step (a) and step (b). In step (a), a first scribe line is formed on the upper surface of the substrate W by the first cutter 1. In the step (a), the first cutter 1 is disposed on the upper surface side of the substrate W, and a load is applied in the direction toward the substrate W. In step (b), a second scribe line is formed on the lower surface of the substrate W by the second cutter 2. In step (b), the second cutter 2 is arranged on the lower surface side of the substrate W, and is fixed in a direction toward the substrate W.

Description

劃線方法 Crossing method

本發明係有關於一種劃線(scribe)方法及劃線裝置。 The invention relates to a scribe method and a scribe device.

包含第1基板與第2基板之貼合基板係沿著分別形成於第1及第2基板之劃線(scribe line)而斷裂。例如，專利文獻1中揭示了一種於貼合基板之第1及第2基板上形成劃線之裝置。該劃線裝置藉由第1切割器自上表面擠壓基板，並且藉由第2切割器自下表面擠壓基板，從而於基板之兩面形成劃線。 The bonded substrate including the first substrate and the second substrate is broken along scribe lines formed on the first and second substrates, respectively. For example, Patent Document 1 discloses a device for forming scribe lines on the first and second substrates of a bonded substrate. In this scribing device, the substrate is pressed from the upper surface by the first cutter, and the substrate is pressed from the lower surface by the second cutter, thereby forming scribing on both sides of the substrate.

[背景技術文獻] [Background Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1] 日本專利特開2011-194628號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2011-194628

近年來，基板之薄化不斷得到推進。此種薄基板中，形成於基板之上表面之劃線或形成於基板之下表面之劃線之加工精度變得重要，因而較佳為提高劃線之加工精度。 In recent years, the thinning of substrates has been continuously promoted. In such a thin substrate, the processing accuracy of the scribe line formed on the upper surface of the substrate or the scribe line formed on the lower surface of the substrate becomes important, so it is preferable to improve the processing accuracy of the scribe line.

本發明之課題在於提高劃線之加工精度。 The subject of the present invention is to improve the processing accuracy of scribing.

本發明之第1態樣之劃線方法係於基板之兩面形成劃線之方法。該劃線方法包含步驟(a)及步驟(b)。步驟(a)中，藉由第1切割器於基板之一面形成第1劃線。第1切割器於步驟(a)中配置於基板之一面側， 於朝向基板之方向被施加負載。步驟(b)中，藉由第2切割器於基板之另一面形成第2劃線。第2切割器於步驟(b)中配置於基板之另一面側，於朝向基板之方向上被固定。 The scribing method of the first aspect of the present invention is a method of forming scribing on both sides of the substrate. The scribing method includes step (a) and step (b). In step (a), the first scribe line is formed on one surface of the substrate by the first cutter. The first cutter is arranged on one side of the substrate in step (a), A load is applied in the direction toward the substrate. In step (b), the second scribe line is formed on the other surface of the substrate by the second cutter. The second cutter is arranged on the other surface side of the substrate in step (b), and is fixed in a direction toward the substrate.

根據該方法，僅自基板之一面側施加負載，而不自基板之另一面側施加負載。因此，可提高形成劃線時之加工精度。 According to this method, a load is applied only from one side of the substrate, and no load is applied from the other side of the substrate. Therefore, the processing accuracy when forming the scribe line can be improved.

較佳為，於步驟(a)中，藉由第1支承輥與第1切割器而壓接基板。第1支承輥於步驟(a)中配置於基板之另一面側，且於朝向基板之方向上被固定。較佳為，於步驟(b)中，藉由第2支承輥與上述第2切割器而壓接上述基板。第2支承輥於步驟(b)中配置於基板之一面側，於朝向基板之方向上被施加負載。 Preferably, in step (a), the substrate is pressure-bonded by the first support roller and the first cutter. The first support roller is arranged on the other surface side of the substrate in step (a), and is fixed in a direction toward the substrate. Preferably, in step (b), the substrate is pressure-bonded by the second support roller and the second cutter. The second support roller is arranged on one side of the substrate in step (b), and a load is applied in a direction toward the substrate.

亦可藉由第1切割器與第2切割器壓接基板。 The substrate may be crimped by the first cutter and the second cutter.

較佳為，第1切割器及第2切割器中之至少一者為刀輪。 Preferably, at least one of the first cutter and the second cutter is a cutter wheel.

本發明之第2態樣之劃線裝置為於基板之兩面形成劃線之裝置。該劃線裝置包括第1切割器與第2切割器。第1切割器配置於基板之一面側，且於朝向基板之方向被施加負載。第2切割器配置於基板之另一面側，且於朝向基板之方向上被固定。 The scribing device of the second aspect of the present invention is a device for forming scribing on both sides of the substrate. The scribing device includes a first cutter and a second cutter. The first cutter is arranged on one surface side of the substrate, and a load is applied in a direction toward the substrate. The second cutter is arranged on the other surface side of the substrate and is fixed in a direction toward the substrate.

根據本發明，可提高劃線之加工精度。 According to the present invention, the processing accuracy of scribing can be improved.

1‧‧‧第1切割器 1‧‧‧ 1st cutter

2‧‧‧第2切割器 2‧‧‧ 2nd cutter

3‧‧‧第1支承輥 3‧‧‧The first support roller

4‧‧‧第2支承輥 4‧‧‧Second backup roller

10‧‧‧劃線裝置 10‧‧‧Line marking device

101‧‧‧第1基板 101‧‧‧1st substrate

102‧‧‧第2基板 102‧‧‧ 2nd substrate

W‧‧‧基板 W‧‧‧Substrate

圖1係劃線裝置之概略側視圖。 Fig. 1 is a schematic side view of a scribing device.

圖2係劃線裝置之概略前視圖。 Fig. 2 is a schematic front view of the scribing device.

圖3係變化例之劃線裝置之側視圖。 Fig. 3 is a side view of a scribing device according to a modification.

以下，一面參照圖式一面對本發明之劃線方法及劃線裝置之實施形態進行說明。圖1係劃線裝置之概略側視圖，圖2係劃線裝置之概略前視圖。再者，加工對象之基板W為貼合基板，其具有第1基板101 與第2基板102。以下之實施形態中，第1基板101朝向上方，第2基板102朝向下方。 Hereinafter, an embodiment of the scribing method and scribing device of the present invention will be described with reference to the drawings. Fig. 1 is a schematic side view of the scribing device, and Fig. 2 is a schematic front view of the scribing device. Furthermore, the substrate W to be processed is a bonded substrate, which has a first substrate 101 The second substrate 102. In the following embodiments, the first substrate 101 faces upward and the second substrate 102 faces downward.

如圖1所示，劃線裝置10具備第1切割器1、第2切割器2、第1支承輥3及第2支承輥4。 As shown in FIG. 1, the scribing device 10 includes a first cutter 1, a second cutter 2, a first backup roller 3, and a second backup roller 4.

第1切割器1配置於基板W之一面側。再者，本實施形態中，第1切割器1配置於基板W之上表面側。即，第1切割器1係用以於第1基板101形成第1劃線之構件。 The first cutter 1 is disposed on one surface side of the substrate W. Furthermore, in this embodiment, the first cutter 1 is disposed on the upper surface side of the substrate W. That is, the first cutter 1 is a member for forming a first scribe line on the first substrate 101.

如圖1及圖2所示，第1切割器1為刀輪，其可旋轉地被保持於第1保持器(圖示省略)。該第1切割器1係於形成第1劃線之期間，於朝向基板W之方向被施加負載。即，第1切割器1朝向下方被施加負載。 As shown in FIGS. 1 and 2, the first cutter 1 is a cutter wheel, and is rotatably held by a first holder (not shown). The first cutter 1 is applied with a load in the direction toward the substrate W while the first scribe line is formed. That is, the first cutter 1 is loaded downward.

第2切割器2配置於基板W之另一面側。具體而言，第2切割器2配置於基板W之下表面側。即，第2切割器2係用以於第2基板102形成第2劃線之構件。 The second cutter 2 is arranged on the other surface side of the substrate W. Specifically, the second cutter 2 is disposed on the lower surface side of the substrate W. That is, the second cutter 2 is a member for forming the second scribe line on the second substrate 102.

第2切割器2為刀輪，其可旋轉地被保持於第2保持器(圖示省略)。該第2切割器2係於形成第2劃線之期間，於朝向基板W之方向上被固定。即，第2切割器2於形成第2劃線之期間，於朝向基板W之方向上未被施加負載。再者，亦可使第2切割器2於未形成第2劃線時能夠朝上下方向移動。 The second cutter 2 is a cutter wheel, and is rotatably held by a second holder (not shown). The second cutter 2 is fixed in the direction toward the substrate W while the second scribe line is formed. That is, while the second cutter 2 is forming the second scribe line, no load is applied in the direction toward the substrate W. In addition, the second cutter 2 can be moved in the vertical direction when the second scribe line is not formed.

第1支承輥3配置於基板W之另一面側。具體而言，第1支承輥3配置於基板W之下表面側。第1支承輥3可旋轉地被保持。第1支承輥3配置於第1切割器1之下方。藉由該第1支承輥3與第1切割器1而壓接基板W。 The first support roller 3 is arranged on the other surface side of the substrate W. Specifically, the first support roller 3 is disposed on the lower surface side of the substrate W. The first support roller 3 is rotatably held. The first support roller 3 is arranged below the first cutter 1. The substrate W is crimped by the first support roller 3 and the first cutter 1.

第1支承輥3係於形成第1劃線之期間，於朝向基板W之方向上被固定。即，第1支承輥3於形成第1劃線之期間，於朝向基板W之方向上未被施加負載。再者，亦可於未形成第1劃線時，使第1支承輥3能夠朝上下方向移動。 The first support roller 3 is fixed in the direction toward the substrate W while the first scribe line is formed. That is, while the first support roller 3 is forming the first scribe line, no load is applied in the direction toward the substrate W. In addition, when the first scribe line is not formed, the first support roller 3 may be moved in the vertical direction.

第2支承輥4配置於基板W之一面側。具體而言，第2支承輥4配置於基板W之上表面側。第2支承輥4能夠旋轉地得到保持。第2支承輥4配置於第2切割器2之上方。藉由該第2支承輥4與第2切割器2壓接基板W。 The second support roller 4 is arranged on one surface side of the substrate W. Specifically, the second support roller 4 is disposed on the upper surface side of the substrate W. The second support roller 4 is rotatably held. The second support roller 4 is arranged above the second cutter 2. The substrate W is pressed against the second support roller 4 and the second cutter 2.

第2支承輥4於形成第2劃線之期間，於朝向基板W之方向上被施加負載。即，第2支承輥4被朝向下方施加負載。 While the second support roller 4 is forming the second scribe line, a load is applied in the direction toward the substrate W. That is, the second support roller 4 is loaded downward.

其次，對使用上述劃線裝置10之劃線方法進行說明。該劃線方法具有如下之步驟(a)及步驟(b)。再者，步驟(a)與步驟(b)並列進行。即，第1劃線與第2劃線同時形成。 Next, the scribing method using the scribing device 10 described above will be described. The scribing method has the following steps (a) and (b). Furthermore, step (a) and step (b) are performed in parallel. That is, the first scribe line and the second scribe line are formed simultaneously.

步驟(a)中，於基板W上形成第1劃線。即，於基板W之第1基板101形成第1劃線。詳細而言，藉由第1切割器1與第1支承輥3壓接基板W。此處，第1支承輥3於朝向基板W之方向上被固定。即，使第1切割器1向被固定之第1支承輥3側移動，藉此壓接基板W。再者，施加至第1切割器1之負載為0.1~1.0N左右。 In step (a), a first scribe line is formed on the substrate W. That is, the first scribe line is formed on the first substrate 101 of the substrate W. In detail, the substrate W is pressed against the first cutter 1 and the first support roller 3. Here, the first support roller 3 is fixed in a direction toward the substrate W. That is, the substrate W is crimped by moving the first cutter 1 to the fixed first support roller 3 side. In addition, the load applied to the first cutter 1 is about 0.1 to 1.0 N.

如上述般，於藉由第1切割器1與第1支承輥3壓接基板W之狀態下，使第1切割器1及第1支承輥3向基板W延伸之方向移動。即，使第1切割器1及第1支承輥3向水平方向移動。或者，於藉由第1切割器1與第1支承輥3壓接基板W之狀態下，使基板W向水平方向移動。藉此，形成第1劃線。 As described above, in a state where the substrate W is pressed against the first cutter 1 and the first support roller 3, the first cutter 1 and the first support roller 3 are moved in the direction in which the substrate W extends. That is, the first cutter 1 and the first support roller 3 are moved in the horizontal direction. Alternatively, the substrate W is moved in the horizontal direction with the first cutter 1 and the first support roller 3 being pressed against the substrate W. With this, the first scribe line is formed.

步驟(b)中，於基板W形成第2劃線。即，於基板W之第2基板102形成第2劃線。詳細而言，藉由第2切割器2與第2支承輥4壓接基板W。此處，第2切割器2於朝向基板W之方向上被固定。即，使第2支承輥4向被固定之第2切割器2側移動，藉此壓接基板W。再者，施加到第2支承輥4之負載與施加到第1切割器1之負載實質相同。 In step (b), a second scribe line is formed on the substrate W. That is, a second scribe line is formed on the second substrate 102 of the substrate W. In detail, the substrate W is pressed against the second cutter 2 and the second support roller 4. Here, the second cutter 2 is fixed in a direction toward the substrate W. That is, by moving the second support roller 4 toward the fixed second cutter 2 side, the substrate W is pressed. In addition, the load applied to the second support roller 4 is substantially the same as the load applied to the first cutter 1.

如上述般，於藉由第2切割器2與第2支承輥4壓接基板W之狀態下，使第2切割器2及第2支承輥4向基板W延伸之方向移動。即，使第 2切割器2及第2支承輥4向水平方向移動。或者，於藉由第2切割器2與第2支承輥4壓接基板W之狀態下，使基板W向水平方向移動。藉此，形成第2劃線。 As described above, in a state where the substrate W is pressed against the second cutter 2 and the second support roller 4, the second cutter 2 and the second support roller 4 are moved in the direction in which the substrate W extends. That is, make the first 2 The cutter 2 and the second support roller 4 move in the horizontal direction. Alternatively, the substrate W is moved in the horizontal direction in a state where the substrate W is pressed against the second cutter 2 and the second support roller 4. With this, the second scribe line is formed.

如以上般，本實施形態中，僅對配置於基板W之上方之第1切割器1及第2支承輥4施加負載。即，不對配置於基板W之下方之第2切割器2及第1支承輥3施加負載。因此，可提高形成第1及第2劃線時之加工精度。又，用以施加負載之裝置僅配置於基板W之上方，因而可簡化劃線裝置10。 As described above, in this embodiment, only the first cutter 1 and the second support roller 4 disposed above the substrate W are applied with a load. That is, no load is applied to the second cutter 2 and the first support roller 3 disposed below the substrate W. Therefore, the processing accuracy when forming the first and second scribing lines can be improved. In addition, the device for applying the load is only disposed above the substrate W, so that the scribing device 10 can be simplified.

[變化例] [Variation]

以上，對本發明之實施形態進行了說明，但本發明並不限定於該些，於不脫離本發明之主旨之範圍內可進行各種變更。 The embodiments of the present invention have been described above, but the present invention is not limited to these, and various modifications can be made without departing from the gist of the present invention.

變化例1Variation 1

如圖3所示，亦可藉由第1切割器1與第2切割器2壓接基板W。該情況下，僅對第1切割器1施加負載，而未對第2切割器2施加負載。 As shown in FIG. 3, the substrate W may be pressure-bonded by the first cutter 1 and the second cutter 2. In this case, only the first cutter 1 is loaded, and the second cutter 2 is not loaded.

1‧‧‧第1切割器 1‧‧‧ 1st cutter

2‧‧‧第2切割器 2‧‧‧ 2nd cutter

3‧‧‧第1支承輥 3‧‧‧The first support roller

4‧‧‧第2支承輥 4‧‧‧Second backup roller

10‧‧‧劃線裝置 10‧‧‧Line marking device

101‧‧‧第1基板 101‧‧‧1st substrate

102‧‧‧第2基板 102‧‧‧ 2nd substrate

W‧‧‧基板 W‧‧‧Substrate

Claims (2)

一種劃線方法，其係於基板之兩面形成劃線，且包括：(a)步驟，藉由配置於上述基板之一面側且於朝向上述基板之方向被施加負載之第1切割器，於上述基板之一面形成第1劃線；(b)步驟，藉由配置於上述基板之另一面側且於朝向上述基板之方向上被固定之第2切割器，於上述基板之另一面形成第2劃線；其中上述步驟(a)中，藉由配置於上述基板之另一面側且於朝向上述基板之方向上被固定之第1支承輥、及上述第1切割器而壓接上述基板，上述步驟(b)中，藉由配置於上述基板之一面側且於朝向上述基板之方向被施加負載之第2支承輥、及上述第2切割器而壓接上述基板。 A scribing method, which forms scribing on both sides of a substrate, and includes: (a) step, by a first cutter disposed on one side of the substrate and applied with a load in a direction toward the substrate, on the above A first scribe line is formed on one surface of the substrate; (b) step, a second scribe is formed on the other surface of the substrate by a second cutter disposed on the other surface side of the substrate and fixed in a direction toward the substrate Line; wherein in the step (a) above, the first support roller arranged on the other surface side of the substrate and fixed in the direction toward the substrate is pressed against the substrate by the first cutter, the step In (b), the substrate is pressure-bonded by a second support roller disposed on one surface side of the substrate and applied with a load in a direction toward the substrate, and the second cutter. 如請求項1之劃線方法，其中上述第1切割器及上述第2切割器中之至少一者為刀輪。 The scribing method according to claim 1, wherein at least one of the first cutter and the second cutter is a cutter wheel.
TW104132606A 2014-12-24 2015-10-02 Crossing method TWI680953B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014260021A JP6471491B2 (en) 2014-12-24 2014-12-24 Scribing method
JP2014-260021 2014-12-24

Publications (2)

Publication Number Publication Date
TW201623172A TW201623172A (en) 2016-07-01
TWI680953B true TWI680953B (en) 2020-01-01

Family

ID=56296174

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104132606A TWI680953B (en) 2014-12-24 2015-10-02 Crossing method

Country Status (4)

Country Link
JP (1) JP6471491B2 (en)
KR (1) KR20160078217A (en)
CN (1) CN105729640B (en)
TW (1) TWI680953B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7171305B2 (en) * 2018-08-10 2022-11-15 株式会社ジャパンディスプレイ Glass substrate cutting method
DE102021100315A1 (en) * 2021-01-11 2022-07-14 Lisec Austria Gmbh DEVICE FOR CUTTING PANELS OF COATED MULTIPLE GLASS, ESPECIALLY LAMINATED OR LAMINATED SAFETY GLASS

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR608181A (en) * 1925-05-01 1926-07-22 Device for cutting tiles, slabs or other
CN102795767A (en) * 2011-05-24 2012-11-28 三星钻石工业股份有限公司 Marking device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007076953A (en) * 2005-09-14 2007-03-29 Nippon Sheet Glass Co Ltd Method and device for cutting glass plate
TWI430968B (en) * 2008-04-28 2014-03-21 Mitsuboshi Diamond Ind Co Ltd Fracture material of brittle material and cracking method of brittle material
WO2009154012A1 (en) * 2008-06-17 2009-12-23 三星ダイヤモンド工業株式会社 Method for processing substrate of mother board
JP2011194628A (en) 2010-03-18 2011-10-06 Mitsuboshi Diamond Industrial Co Ltd Scribe head
JP5767595B2 (en) * 2012-02-23 2015-08-19 三星ダイヤモンド工業株式会社 Scribing device for brittle material substrate
CN202556466U (en) * 2012-05-11 2012-11-28 江阴市北国包装设备有限公司 Edge material shearing and positioning device
CN202984920U (en) * 2012-12-07 2013-06-12 江苏三环实业股份有限公司 Laser edge cutting machine
CN203471850U (en) * 2013-08-23 2014-03-12 九鼎环保纸业股份有限公司 Paper-trimming mechanism with laser-monitoring function

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR608181A (en) * 1925-05-01 1926-07-22 Device for cutting tiles, slabs or other
CN102795767A (en) * 2011-05-24 2012-11-28 三星钻石工业股份有限公司 Marking device

Also Published As

Publication number Publication date
CN105729640A (en) 2016-07-06
JP6471491B2 (en) 2019-02-20
TW201623172A (en) 2016-07-01
CN105729640B (en) 2020-02-14
JP2016120598A (en) 2016-07-07
KR20160078217A (en) 2016-07-04

Similar Documents

Publication Publication Date Title
TWI625313B (en) Scribing method
WO2015010862A3 (en) Method and device for separating a flat workpiece into a plurality of sections
WO2014022681A8 (en) Apparatus, method, and process with laser induced channel edge
EP2765843A3 (en) Substrate fixing apparatus, substrate working apparatus and substrate fixing method
MY177495A (en) Wafer thinning method
WO2014147048A3 (en) Device and method for cutting out contours from planar substrates by means of a laser
EP4293706A3 (en) Direct and sequential formation of monolayers of boron nitride and graphene on substrates
EP4220709A3 (en) Ground via clustering for crosstalk mitigation
WO2013173468A3 (en) Method and device for using substrate geometry to determine substrate analysis sampling
JP6105414B2 (en) Bonded substrate processing equipment
EP3121647A3 (en) Display device and method of fabricating the same
GB2541146A (en) Method of manufacturing a germanium-on-insulator substrate
TWI680953B (en) Crossing method
WO2012148862A3 (en) Eddy current monitoring of metal residue or metal pillars
MX2017002941A (en) Welding material and method for producing an assembly by means of a bonded connection.
WO2016102457A3 (en) Method and apparatus for manufacturing a sandwich component
EP3522687A4 (en) Machine for performing work on substrate, and insertion method
WO2010147331A3 (en) Method for cutting liquid crystal panel
MX2018014320A (en) Method for preparing a precoated sheet and associated installation.
WO2013144709A3 (en) Method of forming a freestanding semiconductor wafer
TW201613834A (en) Segmentation method of single crystal substrate
JP2016047628A5 (en) Break device
MY187267A (en) Method for producing nanowires
EP2894552A3 (en) Touch panel and method for fabricating the touch panel
SG10201911507UA (en) Substrate processing apparatus, and method for specifying area to be partially polished by substrate processing apparatus

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees