TW201623172A - Scribe line forming method and scribe line forming device - Google Patents
Scribe line forming method and scribe line forming device Download PDFInfo
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- TW201623172A TW201623172A TW104132606A TW104132606A TW201623172A TW 201623172 A TW201623172 A TW 201623172A TW 104132606 A TW104132606 A TW 104132606A TW 104132606 A TW104132606 A TW 104132606A TW 201623172 A TW201623172 A TW 201623172A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
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- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Mining & Mineral Resources (AREA)
Abstract
Description
本發明係有關於一種劃線(scribe)方法及劃線裝置。 The present invention relates to a scribe method and a scribing device.
包含第1基板與第2基板之貼合基板係沿著分別形成於第1及第2基板之劃線(scribe line)而斷裂。例如，專利文獻1中揭示了一種於貼合基板之第1及第2基板上形成劃線之裝置。該劃線裝置藉由第1切割器自上表面擠壓基板，並且藉由第2切割器自下表面擠壓基板，從而於基板之兩面形成劃線。 The bonded substrate including the first substrate and the second substrate is broken along a scribe line formed on each of the first and second substrates. For example, Patent Document 1 discloses an apparatus for forming a scribe line on the first and second substrates of a bonded substrate. The scribing device presses the substrate from the upper surface by the first cutter, and presses the substrate from the lower surface by the second cutter to form a scribe line on both surfaces of the substrate.
[專利文獻1]日本專利特開2011-194628號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2011-194628
近年來，基板之薄化不斷得到推進。此種薄基板中，形成於基板之上表面之劃線或形成於基板之下表面之劃線之加工精度變得重要，因而較佳為提高劃線之加工精度。 In recent years, the thinning of substrates has been continuously advanced. In such a thin substrate, the processing accuracy of the scribe line formed on the upper surface of the substrate or the scribe line formed on the lower surface of the substrate becomes important, and therefore it is preferable to improve the processing accuracy of the scribe line.
本發明之課題在於提高劃線之加工精度。 An object of the present invention is to improve the processing accuracy of scribing.
本發明之第1態樣之劃線方法係於基板之兩面形成劃線之方法。該劃線方法包含步驟(a)及步驟(b)。步驟(a)中，藉由第1切割器於基板之一面形成第1劃線。第1切割器於步驟(a)中配置於基板之一面側， 於朝向基板之方向被施加負載。步驟(b)中，藉由第2切割器於基板之另一面形成第2劃線。第2切割器於步驟(b)中配置於基板之另一面側，於朝向基板之方向上被固定。 The scribing method according to the first aspect of the present invention is a method of forming a scribe line on both surfaces of a substrate. The scribing method comprises the steps (a) and (b). In the step (a), the first scribing line is formed on one surface of the substrate by the first cutter. The first cutter is disposed on one side of the substrate in the step (a). A load is applied in a direction toward the substrate. In the step (b), the second scribing line is formed on the other surface of the substrate by the second cutter. The second cutter is disposed on the other surface side of the substrate in the step (b), and is fixed in the direction toward the substrate.
根據該方法，僅自基板之一面側施加負載，而不自基板之另一面側施加負載。因此，可提高形成劃線時之加工精度。 According to this method, the load is applied only from one side of the substrate without applying a load from the other side of the substrate. Therefore, the processing accuracy at the time of forming the scribe line can be improved.
較佳為，於步驟(a)中，藉由第1支承輥與第1切割器而壓接基板。第1支承輥於步驟(a)中配置於基板之另一面側，且於朝向基板之方向上被固定。較佳為，於步驟(b)中，藉由第2支承輥與上述第2切割器而壓接上述基板。第2支承輥於步驟(b)中配置於基板之一面側，於朝向基板之方向上被施加負載。 Preferably, in the step (a), the substrate is pressure-bonded by the first backup roller and the first cutter. The first backup roll is disposed on the other surface side of the substrate in the step (a), and is fixed in the direction toward the substrate. Preferably, in the step (b), the substrate is pressure-bonded by the second backup roller and the second cutter. The second backup roll is disposed on one surface side of the substrate in the step (b), and a load is applied in the direction toward the substrate.
亦可藉由第1切割器與第2切割器壓接基板。 The substrate may be pressure-bonded to the second cutter by the first cutter.
較佳為，第1切割器及第2切割器中之至少一者為刀輪。 Preferably, at least one of the first cutter and the second cutter is a cutter wheel.
本發明之第2態樣之劃線裝置為於基板之兩面形成劃線之裝置。該劃線裝置包括第1切割器與第2切割器。第1切割器配置於基板之一面側，且於朝向基板之方向被施加負載。第2切割器配置於基板之另一面側，且於朝向基板之方向上被固定。 A scribing device according to a second aspect of the present invention is a device for forming a scribe line on both surfaces of a substrate. The scribing device includes a first cutter and a second cutter. The first cutter is disposed on one surface side of the substrate, and a load is applied in a direction toward the substrate. The second cutter is disposed on the other surface side of the substrate and is fixed in a direction toward the substrate.
根據本發明，可提高劃線之加工精度。 According to the present invention, the processing accuracy of the scribing can be improved.
1‧‧‧第1切割器 1‧‧‧1st cutter
2‧‧‧第2切割器 2‧‧‧2nd cutter
3‧‧‧第1支承輥 3‧‧‧1st support roll
4‧‧‧第2支承輥 4‧‧‧2nd support roll
10‧‧‧劃線裝置 10‧‧‧ scribe device
101‧‧‧第1基板 101‧‧‧1st substrate
102‧‧‧第2基板 102‧‧‧2nd substrate
W‧‧‧基板 W‧‧‧Substrate
圖1係劃線裝置之概略側視圖。 Figure 1 is a schematic side view of a scribing device.
圖2係劃線裝置之概略前視圖。 Figure 2 is a schematic front view of the scribing device.
圖3係變化例之劃線裝置之側視圖。 Figure 3 is a side view of a scribe apparatus of a variation.
以下，一面參照圖式一面對本發明之劃線方法及劃線裝置之實施形態進行說明。圖1係劃線裝置之概略側視圖，圖2係劃線裝置之概略前視圖。再者，加工對象之基板W為貼合基板，其具有第1基板101 與第2基板102。以下之實施形態中，第1基板101朝向上方，第2基板102朝向下方。 Hereinafter, an embodiment of the scribing method and the scribing apparatus of the present invention will be described with reference to the drawings. 1 is a schematic side view of a scribing apparatus, and FIG. 2 is a schematic front view of a scribing apparatus. Furthermore, the substrate W to be processed is a bonded substrate having a first substrate 101 And the second substrate 102. In the following embodiment, the first substrate 101 faces upward and the second substrate 102 faces downward.
如圖1所示，劃線裝置10具備第1切割器1、第2切割器2、第1支承輥3及第2支承輥4。 As shown in FIG. 1 , the scribing device 10 includes a first cutter 1 , a second cutter 2 , a first backup roller 3 , and a second backup roller 4 .
第1切割器1配置於基板W之一面側。再者，本實施形態中，第1切割器1配置於基板W之上表面側。即，第1切割器1係用以於第1基板101形成第1劃線之構件。 The first cutter 1 is disposed on one surface side of the substrate W. Further, in the present embodiment, the first cutter 1 is disposed on the upper surface side of the substrate W. In other words, the first cutter 1 is a member for forming a first scribe line on the first substrate 101.
如圖1及圖2所示，第1切割器1為刀輪，其可旋轉地被保持於第1保持器(圖示省略)。該第1切割器1係於形成第1劃線之期間，於朝向基板W之方向被施加負載。即，第1切割器1朝向下方被施加負載。 As shown in FIGS. 1 and 2, the first cutter 1 is a cutter wheel that is rotatably held by a first holder (not shown). The first cutter 1 is loaded in a direction toward the substrate W while the first scribe line is being formed. That is, the first cutter 1 is biased downward.
第2切割器2配置於基板W之另一面側。具體而言，第2切割器2配置於基板W之下表面側。即，第2切割器2係用以於第2基板102形成第2劃線之構件。 The second cutter 2 is disposed on the other surface side of the substrate W. Specifically, the second cutter 2 is disposed on the lower surface side of the substrate W. In other words, the second cutter 2 is a member for forming the second scribe line on the second substrate 102.
第2切割器2為刀輪，其可旋轉地被保持於第2保持器(圖示省略)。該第2切割器2係於形成第2劃線之期間，於朝向基板W之方向上被固定。即，第2切割器2於形成第2劃線之期間，於朝向基板W之方向上未被施加負載。再者，亦可使第2切割器2於未形成第2劃線時能夠朝上下方向移動。 The second cutter 2 is a cutter wheel that is rotatably held by a second holder (not shown). The second cutter 2 is fixed in the direction toward the substrate W during the formation of the second scribe line. In other words, during the formation of the second scribe line, the second cutter 2 is not loaded in the direction toward the substrate W. Further, the second cutter 2 can be moved in the vertical direction when the second scribing line is not formed.
第1支承輥3配置於基板W之另一面側。具體而言，第1支承輥3配置於基板W之下表面側。第1支承輥3可旋轉地被保持。第1支承輥3配置於第1切割器1之下方。藉由該第1支承輥3與第1切割器1而壓接基板W。 The first backup roll 3 is disposed on the other surface side of the substrate W. Specifically, the first backup roll 3 is disposed on the lower surface side of the substrate W. The first backup roller 3 is rotatably held. The first backup roll 3 is disposed below the first cutter 1 . The substrate W is pressure-bonded by the first backup roll 3 and the first cutter 1.
第1支承輥3係於形成第1劃線之期間，於朝向基板W之方向上被固定。即，第1支承輥3於形成第1劃線之期間，於朝向基板W之方向上未被施加負載。再者，亦可於未形成第1劃線時，使第1支承輥3能夠朝上下方向移動。 The first backup roll 3 is fixed in the direction toward the substrate W during the formation of the first scribe line. In other words, during the formation of the first scribe line, the first backup roll 3 is not loaded in the direction toward the substrate W. Further, the first backup roll 3 can be moved in the vertical direction when the first scribe line is not formed.
第2支承輥4配置於基板W之一面側。具體而言，第2支承輥4配置於基板W之上表面側。第2支承輥4能夠旋轉地得到保持。第2支承輥4配置於第2切割器2之上方。藉由該第2支承輥4與第2切割器2壓接基板W。 The second backup roll 4 is disposed on one surface side of the substrate W. Specifically, the second backup roll 4 is disposed on the upper surface side of the substrate W. The second backup roll 4 is rotatably held. The second backup roll 4 is disposed above the second cutter 2 . The substrate W is pressure-bonded to the second cutter 2 by the second backup roller 4.
第2支承輥4於形成第2劃線之期間，於朝向基板W之方向上被施加負載。即，第2支承輥4被朝向下方施加負載。 The second backup roller 4 is biased in the direction toward the substrate W while the second scribe line is being formed. That is, the second backup roll 4 is biased downward.
其次，對使用上述劃線裝置10之劃線方法進行說明。該劃線方法具有如下之步驟(a)及步驟(b)。再者，步驟(a)與步驟(b)並列進行。即，第1劃線與第2劃線同時形成。 Next, a scribing method using the scribing device 10 described above will be described. The scribing method has the following steps (a) and (b). Furthermore, step (a) is carried out in parallel with step (b). That is, the first scribe line and the second scribe line are formed at the same time.
步驟(a)中，於基板W上形成第1劃線。即，於基板W之第1基板101形成第1劃線。詳細而言，藉由第1切割器1與第1支承輥3壓接基板W。此處，第1支承輥3於朝向基板W之方向上被固定。即，使第1切割器1向被固定之第1支承輥3側移動，藉此壓接基板W。再者，施加至第1切割器1之負載為0.1~1.0N左右。 In the step (a), a first scribe line is formed on the substrate W. That is, the first scribe line is formed on the first substrate 101 of the substrate W. Specifically, the substrate W is pressure-bonded to the first backup roller 3 by the first cutter 1 . Here, the first backup roll 3 is fixed in the direction toward the substrate W. In other words, the first cutter 1 is moved toward the fixed first backup roller 3 side, thereby pressing the substrate W. Further, the load applied to the first cutter 1 is about 0.1 to 1.0 N.
如上述般，於藉由第1切割器1與第1支承輥3壓接基板W之狀態下，使第1切割器1及第1支承輥3向基板W延伸之方向移動。即，使第1切割器1及第1支承輥3向水平方向移動。或者，於藉由第1切割器1與第1支承輥3壓接基板W之狀態下，使基板W向水平方向移動。藉此，形成第1劃線。 As described above, the first cutter 1 and the first backup roller 3 are moved in the direction in which the substrate W extends in a state where the substrate W is pressed against the first backup roller 3 by the first cutter 1 . In other words, the first cutter 1 and the first backup roller 3 are moved in the horizontal direction. Alternatively, the substrate W is moved in the horizontal direction while the substrate W is pressed against the first support roller 3 by the first cutter 1 . Thereby, the first scribe line is formed.
步驟(b)中，於基板W形成第2劃線。即，於基板W之第2基板102形成第2劃線。詳細而言，藉由第2切割器2與第2支承輥4壓接基板W。此處，第2切割器2於朝向基板W之方向上被固定。即，使第2支承輥4向被固定之第2切割器2側移動，藉此壓接基板W。再者，施加到第2支承輥4之負載與施加到第1切割器1之負載實質相同。 In the step (b), a second scribe line is formed on the substrate W. That is, the second scribe line is formed on the second substrate 102 of the substrate W. Specifically, the substrate W is pressure-bonded to the second backup roller 4 by the second cutter 2 . Here, the second cutter 2 is fixed in the direction toward the substrate W. In other words, the second backup roller 4 is moved toward the second cutter 2 side to be fixed, thereby pressing the substrate W. Further, the load applied to the second backup roll 4 is substantially the same as the load applied to the first cutter 1.
如上述般，於藉由第2切割器2與第2支承輥4壓接基板W之狀態下，使第2切割器2及第2支承輥4向基板W延伸之方向移動。即，使第 2切割器2及第2支承輥4向水平方向移動。或者，於藉由第2切割器2與第2支承輥4壓接基板W之狀態下，使基板W向水平方向移動。藉此，形成第2劃線。 As described above, the second cutter 2 and the second backup roller 4 are moved in the direction in which the substrate W extends in a state in which the substrate W is pressed against the second backup roller 4 by the second cutter 2 . That is, make the first The cutter 2 and the second backup roller 4 move in the horizontal direction. Alternatively, the substrate W is moved in the horizontal direction while the substrate W is pressed against the second backup roller 4 by the second cutter 2 . Thereby, the second scribe line is formed.
如以上般，本實施形態中，僅對配置於基板W之上方之第1切割器1及第2支承輥4施加負載。即，不對配置於基板W之下方之第2切割器2及第1支承輥3施加負載。因此，可提高形成第1及第2劃線時之加工精度。又，用以施加負載之裝置僅配置於基板W之上方，因而可簡化劃線裝置10。 As described above, in the present embodiment, the load is applied only to the first cutter 1 and the second backup roller 4 disposed above the substrate W. In other words, no load is applied to the second cutter 2 and the first backup roller 3 disposed below the substrate W. Therefore, the processing accuracy at the time of forming the first and second scribe lines can be improved. Further, since the device for applying a load is disposed only above the substrate W, the scribing device 10 can be simplified.
[變化例] [variation]
以上，對本發明之實施形態進行了說明，但本發明並不限定於該些，於不脫離本發明之主旨之範圍內可進行各種變更。 The embodiments of the present invention have been described above, but the present invention is not limited thereto, and various modifications can be made without departing from the spirit and scope of the invention.
變化例1Change 1
如圖3所示，亦可藉由第1切割器1與第2切割器2壓接基板W。該情況下，僅對第1切割器1施加負載，而未對第2切割器2施加負載。 As shown in FIG. 3, the substrate W may be pressure-bonded by the first cutter 1 and the second cutter 2. In this case, only the load is applied to the first cutter 1, and no load is applied to the second cutter 2.
1‧‧‧第1切割器 1‧‧‧1st cutter
2‧‧‧第2切割器 2‧‧‧2nd cutter
3‧‧‧第1支承輥 3‧‧‧1st support roll
4‧‧‧第2支承輥 4‧‧‧2nd support roll
10‧‧‧劃線裝置 10‧‧‧ scribe device
101‧‧‧第1基板 101‧‧‧1st substrate
102‧‧‧第2基板 102‧‧‧2nd substrate
W‧‧‧基板 W‧‧‧Substrate
Claims (5)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014260021A JP6471491B2 (en) | 2014-12-24 | 2014-12-24 | Scribing method |
| JP2014-260021 | 2014-12-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201623172A true TW201623172A (en) | 2016-07-01 |
| TWI680953B TWI680953B (en) | 2020-01-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104132606A TWI680953B (en) | 2014-12-24 | 2015-10-02 | Crossing method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6471491B2 (en) |
| KR (1) | KR20160078217A (en) |
| CN (1) | CN105729640B (en) |
| TW (1) | TWI680953B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7171305B2 (en) * | 2018-08-10 | 2022-11-15 | 株式会社ジャパンディスプレイ | Glass substrate cutting method |
| DE102021100315A1 (en) * | 2021-01-11 | 2022-07-14 | Lisec Austria Gmbh | DEVICE FOR CUTTING PANELS OF COATED MULTIPLE GLASS, ESPECIALLY LAMINATED OR LAMINATED SAFETY GLASS |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR608181A (en) * | 1925-05-01 | 1926-07-22 | Device for cutting tiles, slabs or other | |
| JP2007076953A (en) * | 2005-09-14 | 2007-03-29 | Nippon Sheet Glass Co Ltd | Method and device for cutting glass plate |
| TWI430968B (en) * | 2008-04-28 | 2014-03-21 | Mitsuboshi Diamond Ind Co Ltd | Fracture material of brittle material and cracking method of brittle material |
| CN102057313B (en) * | 2008-06-17 | 2013-06-05 | 三星钻石工业股份有限公司 | Method for processing substrate of mother board |
| JP2011194628A (en) | 2010-03-18 | 2011-10-06 | Mitsuboshi Diamond Industrial Co Ltd | Scribe head |
| JP5348430B2 (en) * | 2011-05-24 | 2013-11-20 | 三星ダイヤモンド工業株式会社 | Scribing equipment |
| JP5767595B2 (en) * | 2012-02-23 | 2015-08-19 | 三星ダイヤモンド工業株式会社 | Scribing device for brittle material substrate |
| CN202556466U (en) * | 2012-05-11 | 2012-11-28 | 江阴市北国包装设备有限公司 | Edge material shearing and positioning device |
| CN202984920U (en) * | 2012-12-07 | 2013-06-12 | 江苏三环实业股份有限公司 | Laser edge cutting machine |
| CN203471850U (en) * | 2013-08-23 | 2014-03-12 | 九鼎环保纸业股份有限公司 | Paper-trimming mechanism with laser-monitoring function |
-
2014
- 2014-12-24 JP JP2014260021A patent/JP6471491B2/en not_active Expired - Fee Related
-
2015
- 2015-09-08 KR KR1020150127278A patent/KR20160078217A/en not_active Application Discontinuation
- 2015-10-02 TW TW104132606A patent/TWI680953B/en not_active IP Right Cessation
- 2015-11-11 CN CN201510767588.8A patent/CN105729640B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN105729640B (en) | 2020-02-14 |
| TWI680953B (en) | 2020-01-01 |
| KR20160078217A (en) | 2016-07-04 |
| JP6471491B2 (en) | 2019-02-20 |
| CN105729640A (en) | 2016-07-06 |
| JP2016120598A (en) | 2016-07-07 |
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