TWI661986B - 物品之支撐裝置及支撐方法 - Google Patents
物品之支撐裝置及支撐方法 Download PDFInfo
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- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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Abstract
本發明目的在於對高度不同之複數個物品進行定位並且防止掉落,且不妨礙高度高之物品對高度低之物品掉落的防止。支撐裝置具備具有分別對第1及第2物品之底部進行定位而禁止其等進行水平移動之第1及第2定位構件的支撐部,且第1及第2定位構件當物品一上升便將定位解除。支撐裝置具備有第1及第2掉落防止構件,第1定位構件位於較第2定位構件高之位置。將第1及第2掉落防止構件側之第1物品之端部定位在與第2物品之端部相同、或較第2物品之端部靠近第1及第2掉落防止構件側。於第1定位構件定位第1物品時,第2掉落防止構件係自第1物品之端部退避。
Description
本發明係關於物品之支撐裝置及支撐方法。
專利文獻1(JP4543567B)揭示有具備掉落防止構件之多關節型機械臂。掉落防止構件係安裝於多關節型機械臂之手臂上,前進至移載對象之FOUP(Front Opening Unified Pod;前開式晶圓傳送盒)之上部用以防止其掉落。然而,如300mm晶圓用之FOUP與450mm晶圓用之FOUP般高度不同之2種類之物品,必須利用支撐裝置加以支撐。不過,JP4543567B之多關節型機械臂,難以同時支撐2種類之物品,並同時防止其等掉落。
專利文獻1:JP4543567B
本發明之課題,在於對高度不同之複數個物品進行定位並防止其等掉落與傾倒,且不妨礙高度高之物品對高度低之物品掉落之防止。
本發明之物品之支撐裝置,其支撐第1物品、及高度
較第1物品低之第2物品;其具備有:支撐部,該支撐部具有:對第1物品之底部進行定位,禁止第1物品進行水平移動之第1定位構件;及對第2物品之底部進行定位,禁止第2物品進行水平移動之第2定位構件;第1定位構件與第2定位構件皆構成為藉由使第1物品或第2物品下降至支撐部上而進行定位,且一上升定位便被解除,支撐裝置進一步具備有:第1掉落防止構件,其於上述第1定位構件定位第1物品時,位於第1物品之上方,防止第1物品上升導致定位被解除;及第2掉落防止構件,其於上述第2定位構件定位第2物品時,位於第2物品之上方,防止第2物品上升導致定位被解除,上述第1定位構件位於較上述第2定位構件高之位置,上述第1掉落防止構件及上述第2掉落防止構件,於俯視時相對於上述支撐部位於相同側,上述第1定位構件與上述第2定位構件係構成為將第1物品之端部定位在與第2物品之端部相同、或較第2物品之端部靠近上述第1掉落防止構件及上述第2掉落防止構件側,該第1物品之端部位於上述第1掉落防止構件及上述第2掉落防止構件側,且上述第2掉落防止構件係構成為於上述第1定位構件定位第1物品時,自第1物品之上述端部退避。
本發明之物品之支撐方法,其藉由支撐裝置支撐第1物品、及高度較第1物品低之第2物品,且藉由支撐部之第1定位構件對第1物品之底部進行定位,禁止第1物品進行水平移動,並且當第1物品一上升便解除定位,
藉由支撐部之第2定位構件對第2物品之底部進行定位,禁止第2物品進行水平移動,並且當第2物品一上升便解除定位,於上述第1定位構件定位第1物品定位時,使第1掉落防止構件位於第1物品之上方,防止第1物品上升導致定位被解除,於上述第2定位構件定位第2物品時,使第2掉落防止構件位於第2物品之上方,防止第2物品上升導致定位被解除,上述第1定位構件位於較上述第2定位構件高之位置,上述第1掉落防止構件及上述第2掉落防止構件,於俯視時相對於上述支撐部位於相同側,上述第1定位構件及上述第2定位構件係將第1物品之端部定位在與第2物品之端部相同、或較第2物品之端部靠近上述第1掉落防止構件及上述第2掉落防止構件側,該第1物品之端部位於上述第1掉落防止構件及上述第2掉落防止構件側,且於上述第1定位構件定位第1物品時,使上述第2掉落防止構件自第1物品之上述端部退避。再者,該等步驟例如可同步地進行。又,本說明書中關於支撐裝置之記載,亦可直接適用於支撐方法。
於實施例中,第1及第2定位構件雖對第1及第2物品之底部進行定位並且加以支撐,但亦可藉由另外之支撐構件對第1及第2物品之底部進行支撐。第1掉落防止構件與第2掉落防止構件,於俯視時相對於上述支撐部位於相同側。而且,第1及第2掉落防止構件側之第1物品之端部,係定位在與第2物品之端部相同、或更靠近第1及第2掉落防止構件側。
由於第1物品與第2物品一自支撐部上升定位便被解除,因此存在有掉落、傾倒之可能性。因此,使第1掉落防止構件
與第2掉落防止構件位於該等物品之上部,以防止物品上升導致定位被解除。此處,第1物品之端部由於被定位在與第2物品之端部相同,或更靠近第1及第2掉落防止構件側,因此第2掉落防止構件會與高度較高之第1物品產生干擾。因此,於第1定位構件定位第1物品時,使上述第2掉落防止構件自第1物品之上述端部退避。
於本發明中,對高度不同之2種類之物品進行定位,並且藉由第1掉落防止構件防止第1物品之掉落或傾倒,並藉由第2掉落防止構件防止第2物品之掉落或傾倒。而且,使第2掉落防止構件退避,而使第1物品不會妨礙到第2掉落防止構件之設置。本發明雖可防止物品之掉落與傾倒,但以下有時會省略傾倒而僅記載防止掉落。
較佳為,第2掉落防止構件係構成為於第2物品之上方與自第1物品之端部退避之位置之間前進後退自如,且被第1物品推壓而退避,且其進一步具備有:附加勢能構件,其對第2掉落防止構件以使其朝第2物品之上方前進之方式附加勢能。如此一來,第2掉落防止構件無需驅動機構即可朝第2物品之上方前進,且被第1物品推壓而退避。藉此,可不需要驅動機構之空間,而且也不需要對驅動機構進行維護。
更佳為,具備有:移動部,其使上述支撐部在與移載對象之間交接物品之前進位置與原點位置之間前進後退,且第1掉落防止構件與第2掉落防止構件係藉由皆被設於移動部而構成為:在前進位置時皆自物品之上部隔離,在原點位置時,第1掉落防止構件朝第1及第2物品之上部前進,而第2掉落防止構件朝第2物品之上部前進。如此一來,支撐裝置係組入於物品之移載裝置中,
可藉由移動部之運動,使第1掉落防止構件與第2掉落防止構件在物品之上方與自物品隔離之位置之間移動。再者,第2掉落防止構件,除了移動部之運動外,還藉由附加勢能構件之附加勢能被第1物品推壓而前進後退。
較佳為,第1掉落防止構件與第2掉落防止構件以使第1掉落防止構件位於上方,第2掉落防止構件位於下方之方式,被安裝於共同之支柱,而且第2掉落防止構件係可繞鉛垂軸轉動自如地被安裝於上述支柱。若使第2掉落防止構件繞鉛垂軸轉動,則相較於例如使其水平前進後退之情形,能以較小空間之機構簡單地使其進退。
更佳為,第2掉落防止構件具備有與第1物品之端部接觸之輥。如此一來,可使第2掉落防止構件與第1物品平穩地接觸,而可減少例如接觸時所產生之塵埃。
最佳為,進一步具備有以使第2掉落防止構件在第2物品之上部停止之方式限制轉動範圍之擋止器。如此一來,由於可利用附加勢能構件對第2掉落防止構件附加勢能,並利用擋止器進行定位,因此可確實地朝第2物品之上部前進。
2‧‧‧手部(支撐部)
4‧‧‧多關節型機械臂(物品之支撐裝置)
6‧‧‧板
8、9‧‧‧厚壁部
10‧‧‧薄壁部
12、16‧‧‧定位導引(第1定位構件)
13、17‧‧‧錐面
14、18‧‧‧支撐面
19‧‧‧止轉部
20‧‧‧定位突起(第1定位構件)
22‧‧‧連動運動聯結銷(第2定位構件);銷
30‧‧‧基部
32、34‧‧‧機械臂
36~40‧‧‧軸
42‧‧‧機械手臂
44‧‧‧第1掉落防止構件
46‧‧‧第2掉落防止構件
48‧‧‧支柱
50‧‧‧輥
52‧‧‧450mm晶圓用之FOUP(第1物品)
54‧‧‧傳送面
55‧‧‧傳送導引面
56‧‧‧V溝槽
58‧‧‧門部
59、69‧‧‧端面
60‧‧‧彈性片
64‧‧‧300mm晶圓用之FOUP(第2物品)
65‧‧‧傳送面
66‧‧‧V溝槽
68‧‧‧門部
70‧‧‧軸
71、72‧‧‧支架
73、78‧‧‧軸承
74‧‧‧扭力彈簧(附加勢能構件)
76‧‧‧擋止器
77‧‧‧軸
80、81‧‧‧棚架支承件
82、86、90‧‧‧定位導引
83、87、91、92‧‧‧錐面
84、88、93‧‧‧支撐面
94‧‧‧定位銷
100‧‧‧掉落防止機構
102‧‧‧支柱
104‧‧‧滾珠螺桿
106‧‧‧馬達
D‧‧‧壁厚差
圖1為顯示具備有實施例之支撐裝置之多關節型機械臂支撐第1物品(450mm晶圓用之FOUP)之狀態之俯視圖。
圖2為顯示多關節型機械臂支撐第1物品之狀態之側視圖。
圖3為顯示藉由定位突起進行對第1物品之定位之圖2之主要部分放大側視圖。
圖4為顯示多關節型機械臂支撐第2物品(300mm晶圓用之FOUP)之狀態之俯視圖。
圖5為顯示多關節型機械臂支撐第2物品之狀態之側視圖。
圖6為顯示掉落防止機構之圖5之主要部分放大側視圖。
圖7為棚架支承件之俯視圖,顯示載置著第1物品之狀態。
圖8為棚架支承件之俯視圖,顯示載置著第2物品之狀態。
圖9為參考例之掉落防止機構之側視圖。
以下,顯示用以實施本發明之最佳實施例。本發明之範圍,應根據申請專利範圍之記載,參酌說明書之記載與本領域之周知技術,並依照本發明所屬技術領域中具有通常知識者之理解而決定。
於圖1至圖6顯示實施例之多關節型機械臂4。多關節型機械臂4係藉由手部2(支撐部)對物品進行定位並且加以支撐,而在與棚架支承件80、81等移載對象之間,藉由機械臂32、34之進退動作等來移載(交接)物品。再者,圖7、圖8顯示多關節型機械臂4移載物品之棚架支承件80、81。
物品雖為450mm晶圓用之FOUP52(第1物品)、及300mm晶圓用之FOUP64(第2物品)之2種類,但物品之種類本身可為任意。第2物品之尺寸係設為尺寸較第1物品小,尤其高度較第1物品低者。於各圖中,鏈線係顯示FOUP52、64,並將如FOUP52、64之側面凸緣等與本發明無關之部分省略而加以顯示。於圖1、圖4、圖7、圖8中,為了顯示手部2及棚架支承件80、
81之定位,而顯示FOUP52、64底部之構造。
圖1、圖2顯示在支撐450mm晶圓用之FOUP52之狀態下之多關節型機械臂4。手部2具備有板6,於板前後方向之前端與基部存在有厚壁部8、9,而於中間存在有薄壁部10。於基部之厚壁部9存在有軸40,軸40係使手部2轉動。於本說明書中,將手部2之軸40側設為基端,將其相反側之厚壁部8側設為前端,並將連結前端與基端之方向稱為前後方向。又,將水平面內相對於前後方向呈直角之方向稱為左右方向。
板6左右方向之寬度,係設為較FOUP52、64左右方向之寬度窄,以使棚架支承件80、81能支撐FOUP52、64。於前端側之厚壁部8之左右方向中央部,存在有定位導引12,而於基端側之厚壁部9,存在有左右例如為一對之定位導引16、16。定位導引12、16雖然左右方向之長度不同,但基本構造相同,具備有以使薄壁部10側變低之方式傾斜之錐面13、17、及自錐面13、17之下端朝薄壁部10側延伸之水平之支撐面14、18。又,於錐面13、17與支撐面14、18之交界上,且定位導引12、16之左右方向外側之端部之點19,成為FOUP52之止轉部。
於厚壁部8之左右方向中央部靠近薄壁部10處,存在有例如俯視時呈長方形狀之定位突起20,而於定位突起20左右方向之端部,設置有R部(圓角部)。於薄壁部10,設置有例如3個連動運動聯結銷(kinematic coupling pin)22(以下稱為銷22),銷22之高度係設為較支撐面14、18之高度低。將薄壁部10之上表面配置於較厚壁部8之上表面低壁厚差D之位置,因此,於厚壁部8、9與薄壁部10之間,存在有壁厚差D。而且,由於薄壁部10之上
表面位於較厚壁部8之上表面低之位置,因此可減小定位導引12、16之高度。
多關節型機械臂4具備有以設於基部30之軸36為中心進行轉動之機械臂32、及以機械臂32之前端側之軸38為中心進行轉動之機械臂34,並於機械臂34之前端側具備有上述之軸40。多關節型機械臂4係搭載於升降與水平往返運動自如之移動體上,該移動體係設置於暫時保管FOUP52、64之倉儲等,沿著棚架進行往復運動,並藉由機械手臂42支撐多關節型機械臂4使其進行升降。而且,組合多關節型機械臂4之伸縮與基部30之升降,而在與棚架支承件80、81之間移載FOUP52、64。
元件符號44係第1掉落防止構件,46係第2掉落防止構件。掉落防止構件44、46係安裝於自機械臂34朝向鉛垂上方直立之支柱48,其高度固定,而掉落防止構件44係安裝於支柱48之上端附近,掉落防止構件46則被安裝在其下部。第2掉落防止構件46係以朝向支柱48之安裝軸為中心而於水平面內轉動自如,並於前端安裝有繞鉛垂軸轉動之輥50。第1掉落防止構件44係防止450mm晶圓用之FOUP52之掉落,第2掉落防止構件46係防止300mm晶圓用之FOUP64之掉落。掉落防止構件44係限制FOUP52之門部58之上端,掉落防止構件46係限制FOUP64之門部68之上端。而且,掉落防止構件46係藉由輥50被門部58之端面59推壓而相對於FOUP52後退。由掉落防止構件44、46等所構成之掉落防止機構之構造,將參照圖6而於後詳細地說明。再者,元件符號69係FOUP64之門部68之端面,端面59位於較端面69更靠近支柱48側。
如圖1、圖2所示,450mm晶圓用之FOUP52係沿著底部之4周而設置有傳送面54,在側面之下部與傳送面54相交之面,係設為傳送導引面55,傳送面54與傳送導引面55,係位於特定位置之平滑面。又,於FOUP52之底部,設置有用於連動聯結之3個V溝槽(截面為逆V字狀之溝槽),並將門部58側之V溝槽稱為V溝槽56,將相反側之V溝槽稱為V溝槽57。手部2係藉由前後之傳送導引面55與定位導引12、16,對前後方向之位置進行定位,並利用支撐面14、18來支撐傳送面54。又,藉由利用定位突起20對門部58與相反側之V溝槽57進行定位,而進行左右方向之定位。由於僅利用定位突起20,存在有FOUP52繞鉛垂軸之方向會改變之可能性,因此藉由止轉部19來禁止FOUP52之旋轉。
於圖1至圖3顯示450mm晶圓用之FOUP52之支撐。如圖3所示,藉由定位導引12之錐面13對傳送導引面55進行導引,並藉由支撐面14來支撐傳送面54。於定位導引16也同樣地,藉由錐面17對傳送導引面55進行導引,並藉由支撐面18來支撐傳送面54。藉此,FOUP52朝前後方向被定位,且繞鉛垂軸之旋轉係藉由止轉部19所防止。如此一來,由於FOUP52被定位在水平面內,因此所剩之運動之自由度僅為上下運動。若藉由多關節型機械臂4之動作、或搭載多關節型機械臂4之移動體之動作來對FOUP52施加較大的加速度,FOUP52便存在掉落或傾倒之可能性。因此,藉由第1掉落防止構件44,來限制FOUP52之高度,以防止其掉落及傾倒。
於圖4、圖5顯示300mm晶圓用之FOUP64之支撐。薄壁部10前後方向之長度,係較FOUP64之縱向長度長,且於薄
壁部10上支撐FOUP64。不採用傳送面65來進行定位,而使3根銷22連動聯結於連動聯結用之3個V溝槽66,並依據FOUP64原本之規格來進行定位。能得以實現,是因為FOUP64較FOUP52小,而可將銷22配置於V溝槽66之位置所致。又,由於銷22位於薄壁部10上,因此不與FOUP52之底部接觸。此外,定位突起20位於自FOUP64之底面偏離之位置。由於FOUP64係藉由銷22被定位在水平面內,因此藉由第2掉落防止構件46,來限制FOUP64之高度,以防止其掉落及傾倒。
如圖6所示,支柱48係設於機械臂34,於機械臂32、34自圖1、圖4之狀態伸展時,掉落防止構件44、46會與FOUP52、64之上部分開。因此,掉落防止構件44、46不會與FOUP52、64發生干涉。若機械臂32、34如圖1、圖4所示返回原點位置,移動體便可進行移行。而且,若機械臂34返回原點位置,掉落防止構件44、46便欲朝FOUP52、64之上部前進,藉由掉落防止構件44朝門部58之上部前進,來防止FOUP52之掉落及傾倒。再者,元件符號60係彈性片,被設於掉落防止構件44、46之底部,用以吸收FOUP52、64接觸時之撞擊。亦可不設置彈性片60。
掉落防止構件46係可繞鉛垂之軸70轉動自如地被支撐,且藉由附加勢能構件朝向FOUP52、64之上部前進之方向被附加勢能。元件符號71、72係支架,73係軸承,74係扭力彈簧,為附加勢能構件之一例。於掉落防止構件46前端之底部,雖設置有上述彈性片60,但亦可不設置。又,藉由擋止器76限制掉落防止構件46之方向,而使其朝FOUP52之門部68之上部前進。輥50係繞鉛垂之軸77轉動自如地由軸承78所支撐。而且,輥50係藉
由被門部之正面推壓而相對於FOUP52後退,使掉落防止構件46如圖6般相對於FOUP64前進至門部68之上部,以防止其掉落及傾倒。
於實施例中,為了使掉落防止構件46根據FOUP52、64之種類而進退,雖採用附加勢能構件與擋止器76,但也可取代該等,而藉由電磁線圈或馬達等之驅動構件,來使掉落防止構件46進退。只是如此一來,掉落防止機構就會大型化,而且需要維護之部位會增加。
圖7顯示藉由棚架支承件80、81所進行對450mm晶圓用之FOUP52之支撐。棚架支承件80、81分別具備有前後方向之定位導引82、左右方向之定位導引86、及前後左右兼用之定位導引90,用以於前後左右對FOUP52進行定位。元件符號83、91係朝前後方向傾斜之錐面,87、92係朝左右方向傾斜之錐面,該等錐面對傳送導引面55進行導引。元件符號84、88、93係水平之支撐面,該等支撐面對傳送面54進行支撐。
圖8顯示藉由棚架支承件80、81所進行對300mm晶圓用之FOUP64之支撐。定位銷94係與FOUP64之堆高機銷用之孔卡合而進行定位。再者,定位銷94係收納於450mm晶圓用之FOUP52之V溝槽56,而不與FOUP52接觸。
圖9顯示參考例之掉落防止機構100,可對FOUP52、64共用。藉由適當之感測器來判斷FOUP52、64之種類,或自上位之控制器通知FOUP52、64之種類。而且,沿著被設於機械臂34之鉛垂之支柱102,藉由滾珠螺桿104與馬達106所構成之直線運動機構,並依據FOUP52、64之種類使掉落防止構件44進行升降。
若將該參考例與實施例進行比較,直線運動機構需要空間,直線運動機構有可產生塵埃之可能性,且維護之對象部位會增加。
於實施例中雖使用多關節型機械臂,但亦也可於滑動叉之頂板設置定位導引12、16、定位突起20、銷22等,而於中間板設置支柱48與掉落防止構件44、46。
Claims (7)
- 一種物品之支撐裝置,其支撐第1物品、及高度較第1物品低之第2物品;其具備有:支撐部,該支撐部具有:對第1物品之底部進行定位,禁止第1物品進行水平移動之第1定位構件;及對第2物品之底部進行定位,禁止第2物品進行水平移動之第2定位構件;第1定位構件與第2定位構件皆構成為藉由使第1物品或第2物品下降至支撐部上而進行定位,且一上升定位便被解除,支撐裝置進一步具備有:第1掉落防止構件,其於上述第1定位構件定位第1物品時,位於第1物品之上方,防止第1物品上升導致定位被解除;及第2掉落防止構件,其於上述第2定位構件定位第2物品時,位於第2物品之上方,防止第2物品上升導致定位被解除;上述第1定位構件位於較上述第2定位構件高之位置,上述第1掉落防止構件及上述第2掉落防止構件,於俯視時相對於上述支撐部位於相同側,上述第1定位構件與上述第2定位構件係構成為將第1物品之端部定位在與第2物品之端部相同、或較第2物品之端部靠近上述第1掉落防止構件及上述第2掉落防止構件側,該第1物品之端部位於上述第1掉落防止構件及上述第2掉落防止構件側,且上述第2掉落防止構件係構成為於上述第1定位構件定位第1物品時,自第1物品之上述端部退避。
- 如請求項1之物品之支撐裝置,其中,第2掉落防止構件係構成為於第2物品之上方與自第1物品之端部退避之位置之間前進後退自如,且被第1物品推壓而退避,且其進一步具備有:附加勢能構件,其對第2掉落防止構件以使其朝第2物品之上方前進之方式附加勢能。
- 如請求項2之物品之支撐裝置,其中,具備有:移動部,其使上述支撐部在與移載對象之間交接物品之前進位置與原點位置之間前進後退;且第1掉落防止構件與第2掉落防止構件係藉由皆被設於移動部而構成為:在前進位置時皆自物品之上部隔離,在原點位置時,第1掉落防止構件朝第1及第2物品之上部前進,而第2掉落防止構件朝第2物品之上部前進。
- 如請求項1至3中任一項之物品之支撐裝置,其中,第1掉落防止構件與第2掉落防止構件係以使第1掉落防止構件位於上方,第2掉落防止構件位於下方之方式,被安裝於共同之支柱,而且第2掉落防止構件係可繞鉛垂軸轉動自如地被安裝於上述支柱。
- 如請求項4之物品之支撐裝置,其中,第2掉落防止構件具備有與第1物品之端部接觸之輥。
- 如請求項5之物品之支撐裝置,其中,進一步具備有以使第2掉落防止構件在第2物品之上部停止之方式限制轉動範圍之擋止器。
- 一種物品之支撐方法,其藉由支撐裝置支撐第1物品、及高度較第1物品低之第2物品,且藉由支撐部之第1定位構件對第1物品之底部進行定位,禁止第1物品進行水平移動,並且當第1物品一上升便解除定位,藉由支撐部之第2定位構件對第2物品之底部進行定位,禁止第2物品進行水平移動,並且當第2物品一上升便解除定位,於上述第1定位構件定位第1物品時,使第1掉落防止構件位於第1物品之上方,防止第1物品上升導致定位被解除,於上述第2定位構件定位第2物品定位時,使第2掉落防止構件位於第2物品之上方,防止第2物品上升導致定位被解除,上述第1定位構件位於較上述第2定位構件高之位置,上述第1掉落防止構件及上述第2掉落防止構件,於俯視時相對於上述支撐部位於相同側,上述第1定位構件及上述第2定位構件係將第1物品之端部定位在與第2物品之端部相同、或較第2物品之端部靠近上述第1掉落防止構件及上述第2掉落防止構件側,該第1物品之端部位於上述第1掉落防止構件及上述第2掉落防止構件側,且於上述第1定位構件定位第1物品時,使上述第2掉落防止構件自第1物品之上述端部退避。
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Also Published As
Publication number | Publication date |
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TW201641231A (zh) | 2016-12-01 |
SG11201706227SA (en) | 2017-10-30 |
US20180047591A1 (en) | 2018-02-15 |
CN107406195A (zh) | 2017-11-28 |
WO2016152276A1 (ja) | 2016-09-29 |
US10475684B2 (en) | 2019-11-12 |
IL253640A0 (en) | 2017-09-28 |
EP3275809A1 (en) | 2018-01-31 |
EP3275809B1 (en) | 2019-10-23 |
KR20170129241A (ko) | 2017-11-24 |
IL253640B (en) | 2019-07-31 |
JPWO2016152276A1 (ja) | 2018-01-11 |
EP3275809A4 (en) | 2018-11-21 |
CN107406195B (zh) | 2019-04-09 |
JP6410068B2 (ja) | 2018-10-24 |
KR101967272B1 (ko) | 2019-04-09 |
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