TWI648793B - Conductor forming device and conductor manufacturing method - Google Patents
Conductor forming device and conductor manufacturing method Download PDFInfo
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- TWI648793B TWI648793B TW105132073A TW105132073A TWI648793B TW I648793 B TWI648793 B TW I648793B TW 105132073 A TW105132073 A TW 105132073A TW 105132073 A TW105132073 A TW 105132073A TW I648793 B TWI648793 B TW I648793B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
Abstract
搬運裝置(11)在從顯影裝置(12)經過圖案鍍覆裝置(13)及剝離裝置(14)到蝕刻裝置(15)的搬運路徑(20)的全域中，至少從顯影裝置(12)到圖案鍍覆裝置(13)為止的範圍內，以把基材(1)立起成略垂直的姿勢進行連續搬運。 The conveying device (11) covers at least the developing device (12) to Within the range up to the pattern plating device (13), the base material (1) is continuously transported in a slightly vertical posture.
Description
本發明有關印刷基板等的導體形成裝置及導體製造方法。 The present invention relates to a conductor forming device such as a printed board and a conductor manufacturing method.
作為在印刷基板等形成電路的方法，添加法(additive process)是廣為人知的。在添加法中，例如如專利文獻1所記載，在處理對象物的表面的導電性薄膜上，形成與導體圖案為逆圖案的鍍覆阻材(顯影製程)，在導電性薄膜中尚未形成鍍覆阻材的表面區域，形成導體圖案(圖案鍍覆製程)，從導電性薄膜上剝離鍍覆阻材(剝離製程)，把導體圖案下的區域以外的導電性薄膜，經由用了指定的蝕刻液之化學蝕刻來去除(蝕刻製程)，形成電路圖案。 As a method of forming a circuit on a printed board or the like, an additive process is widely known. In the addition method, for example, as described in Patent Document 1, a plating resist is formed on the conductive film on the surface of the object to be processed in a reverse pattern to the conductor pattern (development process), and no plating is formed on the conductive film Conducting a conductive pattern on the surface area of the resist material (pattern plating process), peeling the plating resist material from the conductive film (stripping process), and passing the conductive film outside the area under the conductor pattern through a specified etching Liquid chemical etching to remove (etching process) to form circuit patterns.
在以往一般的導體形成裝置中，混合存在有：以倒伏成略水平的狀態搬運處理對象物之水平搬運、以及以立起成略垂直的狀態搬運處理對象物之垂直搬運。處理對象物，係例如在顯影製程(顯影裝置)被水平搬運，在圖案鍍覆製程(圖案鍍覆裝置)被垂直搬運，在剝 離製程(剝離裝置)及蝕刻製程(蝕刻裝置)被水平搬運。 In the conventional general conductor forming apparatus, there are a mixture of horizontal conveyance that conveys the object to be processed while lying down to be slightly horizontal, and vertical conveyance that conveys the object to be processed while standing upright to be slightly vertical. The object to be processed is, for example, transported horizontally in the development process (development device), transported vertically in the pattern plating process (pattern plating device), and peeled The separation process (stripping device) and the etching process (etching device) are transported horizontally.
[專利文獻1]日本特開平6-164104號專利公報 [Patent Document 1] Japanese Patent Laid-Open No. 6-164104
在上述以往一般的導體形成裝置中，在顯影裝置、剝離裝置及蝕刻裝置之各製程中，處理對象物被水平搬運。在這樣的水平搬運中，搬運滾子與處理對象物接觸的緣故，對處理對象物的表面(電路圖案)的負載越大，越細線化的話，會發生阻材的崩潰或缺角等，其結果，變得容易發生圖案斷線或短路等的不良。 In the above-mentioned conventional general conductor forming apparatus, in each process of the developing apparatus, the peeling apparatus, and the etching apparatus, the object to be processed is transported horizontally. In such horizontal conveyance, the larger the load on the surface (circuit pattern) of the object to be processed due to the contact of the conveying rollers with the object to be processed, and the thinner the wire, the more likely the collapse of the resist material or missing corners, etc. As a result, defects such as pattern disconnection or short circuit are likely to occur.
而且，在顯影裝置與圖案鍍覆裝置之間，把處理對象物，從顯影裝置的水平搬運型的搬運裝置拆卸下來(從搬運滾子上接收過來)，改安裝到圖案鍍覆裝置的垂直搬運型的搬運裝置是有必要的。同樣，在圖案鍍覆裝置與剝離裝置之間，把處理對象物，從圖案鍍覆裝置的垂直搬運型的搬運裝置拆卸下來，改安裝到剝離裝置的水平搬運型的搬運裝置(再次放置在搬運滾子上)是有必要的。為此，會招致作業效率的下降、工時的增加、或搬運裝置的分割所致之裝置的大型化或複雜化，而且變得容易 發生處理對象物的拆卸及安裝所致之不良。 Furthermore, between the developing device and the pattern plating device, the object to be processed is detached from the horizontal conveying type conveying device of the developing device (received from the conveying roller), and reinstalled to the vertical conveying of the pattern plating device Type of transport device is necessary. Similarly, between the pattern plating device and the peeling device, the object to be processed is removed from the vertical conveying type conveying device of the pattern plating device, and the horizontal conveying type conveying device (replaced in the conveying) On the roller) is necessary. For this reason, it will cause a decrease in operating efficiency, an increase in working hours, or a large-scale or complicated device due to the division of the conveying device, and it becomes easier Defects caused by disassembly and installation of the processing object.
在此，本發明其目的在於提供一種導體形成裝置及導體製造方法，係可以圖求品質的安定化及作業效率的提升。 Here, an object of the present invention is to provide a conductor forming apparatus and a conductor manufacturing method, which can seek to stabilize quality and improve work efficiency.
為了達成上述目的，本發明的導體形成裝置具備：搬運單元、顯影裝置、圖案鍍覆裝置、剝離裝置、蝕刻裝置。 In order to achieve the above-mentioned object, the conductor forming device of the present invention includes a conveying unit, a developing device, a pattern plating device, a peeling device, and an etching device.
搬運單元，係把在絕緣性的基板的表面具有導電性薄膜之處理對象物，沿指定的搬運路徑從上游側朝下游側搬運。顯影裝置，係在沿搬運路徑被搬運之處理對象物的導電性薄膜上，形成與導體圖案為逆圖案的鍍覆阻材。圖案鍍覆裝置，係被配置在顯影裝置的下游側，在導電性薄膜中尚未形成鍍覆阻材之表面區域，形成導體圖案。剝離裝置，係被配置在圖案鍍覆裝置的下游側，從導電性薄膜上剝離鍍覆阻材。蝕刻裝置，係被配置在剝離裝置的下游側，把導體圖案下的區域以外的導電性薄膜，經由用了指定的蝕刻液之化學蝕刻來去除。 The conveying unit conveys the object to be processed having a conductive thin film on the surface of the insulating substrate from the upstream side to the downstream side along the designated conveying path. The developing device forms a plating resist material in a reverse pattern to the conductor pattern on the conductive thin film of the object to be transported along the transport path. The pattern plating device is arranged on the downstream side of the developing device, and the surface area of the plating resist material has not yet been formed in the conductive film to form a conductor pattern. The peeling device is arranged on the downstream side of the pattern plating device, and peels the plating resist from the conductive film. The etching device is arranged on the downstream side of the peeling device, and removes the conductive thin film except the area under the conductor pattern by chemical etching using a specified etching solution.
在本發明的第1樣態的導體形成裝置中，搬運單元在從顯影裝置經過圖案鍍覆裝置及剝離裝置到蝕刻裝置的搬運路徑中，至少從顯影裝置到圖案鍍覆裝置為止的範圍內，以把處理對象物立起成略垂直的姿勢進行連續搬運。 In the conductor forming apparatus according to the first aspect of the present invention, the conveying unit has at least a range from the developing apparatus to the pattern plating apparatus in the conveying path from the developing apparatus through the pattern plating apparatus and the peeling apparatus to the etching apparatus, The object to be processed is continuously conveyed in a slightly vertical posture.
而且，本發明的導體製造方法具備：顯影製程、圖案鍍覆製程、剝離製程、以及蝕刻製程。 Furthermore, the conductor manufacturing method of the present invention includes a development process, a pattern plating process, a peeling process, and an etching process.
在顯影製程中，於在絕緣性的基板的表面具有導電性薄膜且沿指定的搬運路徑被搬運的處理對象物的導電性薄膜上，形成與導體圖案為逆圖案的鍍覆阻材。在圖案鍍覆製程中，在自顯影製程沿搬運路徑被搬運的處理對象物的導電性薄膜中尚未形成鍍覆阻材的區域，形成導體圖案。在剝離製程中，從自圖案鍍覆製程沿搬運路徑被搬運的處理對象物的導電性薄膜上，剝離鍍覆阻材。在蝕刻製程中，把自剝離製程沿搬運路徑被搬運的處理對象物的導體圖案下的區域以外的導電性薄膜，經由用了指定的蝕刻液之化學蝕刻來去除。 In the development process, a plating resist having a reverse pattern to the conductor pattern is formed on the conductive thin film of the object to be processed that has the conductive thin film on the surface of the insulating substrate and is transported along the designated transport path. In the pattern plating process, a conductive pattern is formed in a region where the plating resist is not formed in the conductive thin film of the object to be transported along the transport path in the self-development process. In the peeling process, the plating resist is peeled from the conductive film of the object to be transported along the transport path from the pattern plating process. In the etching process, the conductive thin film except the area under the conductor pattern of the object to be transported along the transport path in the self-peeling process is removed by chemical etching using a specified etchant.
在本發明的第1樣態的導體製造方法中，從顯影製程經過圖案鍍覆製程及剝離製程到蝕刻製程的搬運路徑中，至少從顯影製程到圖案鍍覆製程為止的範圍內，以把處理對象物立起成略垂直的姿勢進行連續搬運。 In the conductor manufacturing method of the first aspect of the present invention, the transportation path from the development process through the pattern plating process and the peeling process to the etching process is at least within the range from the development process to the pattern plating process The object is continuously transported while standing in a slightly vertical posture.
根據上述第1樣態的裝置及方法，處理對象物係在搬運路徑中從顯影裝置(顯影製程)到圖案鍍覆裝置(圖案鍍覆製程)為止的範圍內，以立起成略垂直的姿勢進行連續搬運。為此，在顯影製程及圖案鍍覆製程中，可以防止處理對象物與搬運滾子等的接觸，得以難以發生阻材的崩潰或缺角等，可以抑制圖案斷線或短路等的不良的發生。 According to the apparatus and method of the first aspect described above, the object to be processed stands in a slightly vertical posture in the range from the developing device (development process) to the pattern plating device (pattern plating process) in the conveyance path Perform continuous handling. For this reason, in the development process and the pattern plating process, the object to be processed can be prevented from contacting the conveying rollers, etc., so that the breakage of the resist material or the lack of corners can be prevented, and the occurrence of defects such as pattern disconnection or short circuit can be suppressed .
而且，在顯影製程與圖案鍍覆製程之間搬運 路徑為連續的緣故，在製程間沒有必要進行處理對象物的拆卸或安裝。為此，不會招致作業效率的下降、工時的增加、或搬運裝置的分割所致之裝置的大型化或複雜化，而且也不會發生因處理對象物的拆卸及安裝所致之不良。 Moreover, it is transported between the development process and the pattern plating process Because the path is continuous, there is no need to disassemble or install the processing object during the manufacturing process. For this reason, it does not incur a decrease in operating efficiency, an increase in working hours, or a large-scale or complicated device caused by the division of the conveying device, and also does not cause defects caused by disassembly and installation of the processing object.
在本發明的第2樣態的導體形成裝置中，搬運單元在從顯影裝置經過圖案鍍覆裝置及剝離裝置到蝕刻裝置的搬運路徑中，至少從圖案鍍覆裝置到剝離裝置為止的範圍內，以把處理對象物立起成略垂直的姿勢進行連續搬運。 In the conductor forming device according to the second aspect of the present invention, the conveying unit has at least the range from the pattern plating device to the peeling device in the conveying path from the developing device through the pattern plating device and the peeling device to the etching device The object to be processed is continuously conveyed in a slightly vertical posture.
在本發明的第2樣態的導體製造方法中，從顯影製程經過圖案鍍覆製程及剝離製程到蝕刻製程的搬運路徑中，至少從圖案鍍覆製程到剝離製程為止的範圍內，以把處理對象物立起成略垂直的姿勢進行連續搬運。 In the conductor manufacturing method of the second aspect of the present invention, in the transportation path from the development process through the pattern plating process and the peeling process to the etching process, at least the range from the pattern plating process to the peeling process is used to process The object is continuously transported while standing in a slightly vertical posture.
根據上述第2樣態的裝置及方法，處理對象物係在搬運路徑中從圖案鍍覆裝置(圖案鍍覆製程)到剝離裝置(剝離製程)為止的範圍內，以立起成略垂直的姿勢進行連續搬運。為此，在圖案鍍覆製程及剝離製程中，可以防止處理對象物與搬運滾子等的接觸，可以減低或是消除對圖案的損害，可以抑制圖案斷線或短路等的不良的發生。 According to the apparatus and method of the second aspect described above, the object to be processed stands in a slightly vertical posture in the range from the pattern plating apparatus (pattern plating process) to the peeling apparatus (peeling process) in the conveyance path Perform continuous handling. Therefore, in the pattern plating process and the peeling process, the object to be processed can be prevented from contacting the conveying roller, etc., damage to the pattern can be reduced or eliminated, and occurrence of defects such as disconnection or short circuit of the pattern can be suppressed.
而且，在圖案鍍覆製程與剝離製程之間搬運路徑為連續的緣故，在製程間沒有必要進行處理對象物的拆卸或安裝。為此，不會招致作業效率的下降、工時的增加、或搬運裝置的分割所致之裝置的大型化或複雜化，而 且也不會發生因處理對象物的拆卸及安裝所致之不良。 Moreover, since the conveying path is continuous between the pattern plating process and the peeling process, there is no need to disassemble or install the object to be processed between the processes. For this reason, it does not incur a decrease in operating efficiency, an increase in working hours, or a large-scale or complicated device due to the division of the conveying device, and And there will be no defects caused by the disassembly and installation of the object to be processed.
在本發明的第3樣態的導體形成裝置中，搬運單元在從顯影裝置經過圖案鍍覆裝置及剝離裝置到蝕刻裝置的搬運路徑的全域中，以把處理對象物立起成略垂直的姿勢進行連續搬運。 In the conductor forming apparatus of the third aspect of the present invention, the conveying unit stands the object to be processed in a slightly vertical posture over the entire conveying path from the developing device through the pattern plating device and the peeling device to the etching device Perform continuous handling.
在本發明的第3樣態的導體製造方法中，從顯影製程經過圖案鍍覆製程及剝離製程到蝕刻製程的搬運路徑的全域中，以把處理對象物立起成略垂直的姿勢進行連續搬運。 In the conductor manufacturing method according to the third aspect of the present invention, in the entire area of the conveyance path from the development process through the pattern plating process and the peeling process to the etching process, the object to be processed is continuously conveyed in a slightly vertical posture .
根據上述第3樣態的裝置及方法，處理對象物係在從顯影製程經過圖案鍍覆製程及剝離製程到蝕刻製程為止連續之搬運路徑的全域中，以立起成略垂直的姿勢進行搬運。為此，可以防止處理對象物與搬運滾子等的接觸，得以難以發生阻材的崩潰或缺角等，可以抑制圖案斷線或短路等的不良的發生。 According to the apparatus and method of the third aspect described above, the object to be processed is transported in a substantially vertical posture throughout the entire transport path from the development process through the pattern plating process and the peeling process to the etching process. For this reason, it is possible to prevent the object to be processed from contacting with the conveying rollers, etc., and it is possible to prevent the breakage of the resist material and the lack of corners from occurring, and it is possible to suppress the occurrence of defects such as pattern disconnection and short circuit.
而且，在各製程間搬運路徑為連續的緣故，在製程間沒有必要進行處理對象物的拆卸或安裝。為此，不會招致作業效率的下降、工時的增加、或搬運裝置的分割所致之裝置的大型化或複雜化，而且也不會發生因處理對象物的拆卸及安裝所致之不良。 In addition, since the conveying path is continuous between the processes, it is not necessary to disassemble or attach the object to be processed between the processes. For this reason, it does not incur a decrease in operating efficiency, an increase in working hours, or a large-scale or complicated device caused by the division of the conveying device, and also does not cause defects caused by disassembly and installation of the processing object.
本發明的第4樣態的導體形成裝置，係在第1或是第3樣態的導體形成裝置中，具備：配置在顯影製程與圖案鍍覆裝置之間，沿搬運路徑被搬運的處理對象物所通過之第1搬運室。在第1搬運室，為了防止處理對象物 乾燥，設有把第1搬運室加溼之第1加溼單元。 The fourth aspect of the conductor forming apparatus of the present invention is the first or third aspect of the conductor forming apparatus, and includes: a processing object that is disposed between the development process and the pattern plating apparatus and is transported along the transport path The first transfer room through which objects pass. In the first transfer room, in order to prevent processing objects For drying, there is a first humidifying unit that humidifies the first transfer room.
根據第4樣態的導體形成裝置，可以把基板的表面的略全域被水膜覆蓋的狀態的處理對象物供給到圖案鍍覆裝置。經此，可以把基板的表面的空氣氧化抑制在最小限，在鍍覆前處理之因化學藥品所致之強力的氧化被覆膜去除處理變成非必要。而且，可以良好保持基板的表面的親水性的緣故，可以大幅削減在水洗處理所需要的水量。 According to the conductor forming device of the fourth aspect, the object to be processed in a state where a substantially entire area of the surface of the substrate is covered with the water film can be supplied to the pattern plating device. As a result, the air oxidation on the surface of the substrate can be suppressed to a minimum, and the strong oxidation coating removal treatment due to the chemical treatment before plating becomes unnecessary. Moreover, the hydrophilicity of the surface of the substrate can be maintained well, and the amount of water required for the water washing process can be greatly reduced.
而且，從顯影到圖案鍍覆為止連續保持基板的全表面被水膜覆蓋的狀態的緣故，可以顯著降低起因於在基板表面所形成的阻材皮膜電路的凹部所陷入的氣泡所致之鍍覆的析出不良。 Moreover, since the entire surface of the substrate is continuously covered with the water film from development to pattern plating, it is possible to significantly reduce the plating caused by bubbles trapped in the concave portion of the resist film circuit formed on the surface of the substrate Poor precipitation.
本發明的第5樣態的導體形成裝置，係在第2或是第3樣態的導體形成裝置中，具備：配置在圖案鍍覆裝置與剝離裝置之間，沿搬運路徑被搬運的處理對象物所通過之第2搬運室。在第2搬運室，為了防止處理對象物乾燥，設有把第2搬運室加溼之第2加溼單元。 The fifth aspect of the conductor forming apparatus of the present invention is the second or third aspect of the conductor forming apparatus, and includes: a processing object that is disposed between the pattern plating device and the peeling device and is transported along the transport path The second transfer room through which objects pass. In order to prevent the processing object from drying in the second transfer room, a second humidification unit that humidifies the second transfer room is provided.
根據第5樣態的導體形成裝置，可以把非乾燥狀態(溼潤狀態)的處理對象物供給到剝離製程。經此，可以把基板的表面保持在總是被水浸溼的狀態，可以良好地保持親水性。 According to the conductor forming apparatus of the fifth aspect, the object to be processed in a non-dry state (wet state) can be supplied to the peeling process. Through this, the surface of the substrate can be kept always wetted with water, and the hydrophilicity can be maintained well.
而且，涵蓋圖案鍍覆後的基板全域保持已被形成薄的水膜的情況下處理對象物朝剝離製程遞送的緣故，特別是可以得到防止朝阻材皮膜上附著油膜或異物的 效果，可以充分且確實排除阻礙阻材剝離液與阻材皮膜接觸的因子。 In addition, it is possible to prevent the adhesion of the oil film or foreign matter to the barrier material film because the object to be processed is delivered toward the peeling process even if the substrate after the pattern plating is kept in a thin water film. The effect can sufficiently and surely eliminate factors that hinder the contact of the barrier material peeling liquid with the barrier material film.
根據本發明，可以圖求品質的安定化及作業效率的提升。 According to the present invention, the quality can be stabilized and the work efficiency can be improved.
1‧‧‧基材(基板、處理對象物) 1‧‧‧ Base material (substrate, object to be processed)
2‧‧‧導電性薄膜 2‧‧‧ conductive film
3‧‧‧鍍覆阻材 3‧‧‧plating resist
4‧‧‧導體圖案 4‧‧‧Conductor pattern
10‧‧‧導體形成裝置 10‧‧‧Conductor forming device
11‧‧‧搬運裝置(搬運單元) 11‧‧‧Conveying device (conveying unit)
12‧‧‧顯影裝置 12‧‧‧Developing device
13‧‧‧圖案鍍覆裝置 13‧‧‧pattern plating device
14‧‧‧剝離裝置 14‧‧‧Stripping device
15‧‧‧蝕刻裝置 15‧‧‧Etching device
16‧‧‧洗淨裝置 16‧‧‧Washing device
20‧‧‧搬運路徑 20‧‧‧Handling path
21‧‧‧第1路線 21‧‧‧ Route 1
22‧‧‧第2路線 22‧‧‧ Route 2
23‧‧‧第3路線 23‧‧‧ Route 3
24‧‧‧第4路線 24‧‧‧ Route 4
25‧‧‧工件供給位置 25‧‧‧Workpiece supply position
26‧‧‧工件取出位置 26‧‧‧Workpiece removal position
30‧‧‧工件保持構件 30‧‧‧Workpiece holding member
31‧‧‧軌條 31‧‧‧rail
32‧‧‧第1方向轉換機構 32‧‧‧The first direction conversion mechanism
33‧‧‧第2方向轉換機構 33‧‧‧ 2nd direction switching mechanism
41‧‧‧第1搬運室 41‧‧‧ First Carrying Room
42‧‧‧第2搬運室 42‧‧‧ 2nd Carrying Room
43‧‧‧噴霧噴嘴(第1加溼單元) 43‧‧‧Spray nozzle (1st humidification unit)
44‧‧‧噴霧噴嘴(第2加溼單元) 44‧‧‧Spray nozzle (2nd humidification unit)
M‧‧‧作業者 M‧‧‧Operator
[圖1]為示意地表示有關本發明的一實施方式之導體形成裝置的整體之俯視圖。 FIG. 1 is a plan view schematically showing the entire conductor forming apparatus according to an embodiment of the present invention.
[圖2]為示意地表示圖1的顯影裝置及第1方向轉換機構之俯視圖。 [FIG. 2] is a plan view schematically showing the developing device of FIG. 1 and the first direction changing mechanism.
[圖3]為示意地表示圖1的顯影裝置之側視圖。 [Fig. 3] A side view schematically showing the developing device of Fig. 1.
[圖4]為示意地表示圖1的第2方向轉換機構、剝離裝置及蝕刻裝置之俯視圖。 FIG. 4 is a plan view schematically showing the second direction conversion mechanism, the peeling device, and the etching device of FIG. 1.
[圖5]為示意地表示垂直搬運處理對象物的狀態之立體圖。 [Fig. 5] Fig. 5 is a perspective view schematically showing a state in which the processing object is vertically transported.
[圖6]為用於說明添加法所致之製程的示意圖，分別表示(a)基材、(b)形成了導電性薄膜的狀態、(c)形成了鍍覆阻材的狀態、(d)形成了導電層的狀態、(e)剝離了鍍覆阻材的狀態、(f)經由化學蝕刻去除了導電性薄膜的狀態。 [Fig. 6] Schematic diagrams for explaining the process due to the addition method, showing (a) a substrate, (b) a state where a conductive thin film is formed, (c) a state where a plating resist is formed, (d ) A state where a conductive layer is formed, (e) a state where a plating resist is peeled off, and (f) a state where a conductive thin film is removed via chemical etching.
以下，就有關本發明的一實施方式之導體形成裝置10，根據圖面說明之。 Hereinafter, the conductor forming apparatus 10 according to an embodiment of the present invention will be described based on the drawings.
首先，有關用了導體形成裝置10之添加法所致之印刷配線板的製造方法的概要，參閱圖6說明之。 First, the outline of the manufacturing method of the printed wiring board by the addition method of the conductor forming device 10 will be explained with reference to FIG. 6.
在添加法中，如圖6(a)所表示，準備利用絕緣層所構成之基材(基板)1。基材1為利用例如環氧或聚醯亞胺(polyimide)、其他的樹脂所構成之絕緣性薄肉狀的膜或薄板等。尚且，也可以經由在利用鋪銅層積板或是金屬箔所構成的基板上塗佈樹脂，來形成基材1。 In the addition method, as shown in FIG. 6 (a), a base material (substrate) 1 composed of an insulating layer is prepared. The base material 1 is an insulating thin meat-like film or sheet made of, for example, epoxy, polyimide, or other resin. Furthermore, the substrate 1 may be formed by coating resin on a substrate composed of a copper-clad laminate or metal foil.
接著，如圖6(b)所表示，在基材1的表面上藉由濺鍍或無電解銅鍍覆等以指定的膜厚(例如10μm以下)形成導電性薄膜2。尚且，也可以以在基材1使用鋪銅層積板的方式，把其銅箔作為導電性薄膜2。 Next, as shown in FIG. 6 (b), the conductive thin film 2 is formed on the surface of the base material 1 by sputtering or electroless copper plating or the like with a predetermined film thickness (for example, 10 μm or less). Furthermore, the copper foil may be used as the conductive film 2 so that a copper-clad laminate is used as the base material 1.
接著，如圖6(c)所表示，經由在導電性薄膜2上例如疊層、曝光及顯影乾膜等，形成與在後製程所形成的導體圖案4為逆圖案的鍍覆阻材3(顯影製程)。 Next, as shown in FIG. 6 (c), by laminating, exposing, and developing a dry film on the conductive thin film 2, for example, a plating resist 3 that is a reverse pattern to the conductor pattern 4 formed in the post-process is formed ( Development process).
接著，如圖6(d)所表示，在導電性薄膜2中尚未形成鍍覆阻材3的表面區域，例如使用硫酸銅鍍覆液，利用電性鍍覆，形成利用銅所構成的導體圖案4(圖案鍍覆製程)。作為導體圖案4的材料也可以使用銅以外的金屬或是合金。 Next, as shown in FIG. 6 (d), in the surface area of the conductive film 2 where the plating resist 3 is not formed, for example, a copper sulfate plating solution is used, and electroplating is performed to form a conductor pattern made of copper 4 (pattern plating process). As the material of the conductor pattern 4, a metal or alloy other than copper may be used.
接著，如圖6(e)所表示，經由剝離等去除鍍覆阻材3(剝離製程)。 Next, as shown in FIG. 6 (e), the plating resist 3 is removed via peeling or the like (peeling process).
接著，如圖6(f)所表示，把導體圖案4下的區域以外的導電性薄膜(被去除層)2，經由用了指定的蝕刻液(例如硫酸過氧化氫水混合液)之化學蝕刻來去除(蝕刻製程)。經此，形成在基材1上具有指定的導體圖案4之印刷配線板。尚且，形成導電性薄膜2之基材1成為處理對象物，以下，是有把處理對象物簡單稱為基材1的情況。 Next, as shown in FIG. 6 (f), the conductive thin film (removed layer) 2 except the area under the conductor pattern 4 is chemically etched using a specified etchant (for example, sulfuric acid hydrogen peroxide water mixture) To remove (etching process). Through this, a printed wiring board having a prescribed conductor pattern 4 on the base material 1 is formed. In addition, the substrate 1 forming the conductive thin film 2 is the object to be processed. Hereinafter, the object to be processed may be simply referred to as the substrate 1.
如圖1所表示，導體形成裝置10具備：搬運裝置(搬運單元)11、顯影裝置12、圖案鍍覆裝置13、剝離裝置14、蝕刻裝置15、複數個洗淨裝置16。洗淨裝置16係附帶設置在各個顯影裝置12、圖案鍍覆裝置13、剝離裝置14及蝕刻裝置15。尚且，在圖6，是例示了僅在基材1的其中一面形成導體圖案4的情況，但在本實施方式，是就在基材1的兩面形成導體圖案4的情況進行說明。亦即，在基材1的兩面(兩側的表面)，形成導電性薄膜2，施以從顯影製程到蝕刻製程之處理。而且，本實施方式的基材1乃是被切斷成指定的大小之平板材。 As shown in FIG. 1, the conductor forming device 10 includes a conveying device (conveying unit) 11, a developing device 12, a pattern plating device 13, a peeling device 14, an etching device 15, and a plurality of washing devices 16. The cleaning device 16 is provided with each of the developing device 12, the pattern plating device 13, the peeling device 14, and the etching device 15. In addition, in FIG. 6, the case where the conductor pattern 4 is formed on only one side of the base material 1 is illustrated, but in this embodiment, the case where the conductor pattern 4 is formed on both sides of the base material 1 will be described. That is, the conductive thin film 2 is formed on both sides (surfaces on both sides) of the base material 1, and a process from the development process to the etching process is applied. Furthermore, the base material 1 of the present embodiment is a flat plate material that is cut into a predetermined size.
搬運裝置11，係把形成了導電性薄膜2的基材1，沿指定的搬運路徑20從上游側朝下游側搬運。搬運路徑20，係具有延伸成直線狀之第1路線21、排列成與第1路線21略平行且延伸成直線狀之第2路線22、連繫第1路線21的其中一端與第2路線22的其中一端之第3路線23、以及連繫第2路線22的另一端與第1路線21的另一端之第4路線24，乃是矩形環狀。剝離裝置14與 蝕刻裝置15與顯影裝置12，係沿第1路線21排列，圖案鍍覆裝置13配置成沿第2路線22延伸。在第1路線21的蝕刻裝置15與顯影裝置12之間，設定：在顯影裝置12的上游側作業者M把基材1供給到搬運路徑20之工件供給位置25、以及在蝕刻裝置15的下游側作業者M從搬運路徑20取出完成電路形成的基材1之工件取出位置26。搬運路徑20，係從工件供給位置25，依序經由顯影裝置12、圖案鍍覆裝置13、剝離裝置14、以及蝕刻裝置15，回到顯影裝置12。 The conveying device 11 conveys the base material 1 on which the conductive thin film 2 is formed, from the upstream side toward the downstream side along the designated conveying path 20. The conveying path 20 has a first route 21 extending linearly, a second route 22 arranged slightly parallel to the first route 21 and extending linearly, one end connecting the first route 21 and the second route 22 The third route 23 at one end and the fourth route 24 connecting the other end of the second route 22 and the other end of the first route 21 are rectangular rings. Stripping device 14 and The etching device 15 and the developing device 12 are arranged along the first route 21, and the pattern plating device 13 is arranged to extend along the second route 22. Between the etching device 15 of the first route 21 and the developing device 12, it is set that the worker M upstream of the developing device 12 supplies the substrate 1 to the workpiece supply position 25 of the transport path 20 and downstream of the etching device 15 The side operator M takes out the workpiece taking-out position 26 of the substrate 1 on which the circuit formation is completed from the conveying path 20. The conveyance path 20 returns from the workpiece supply position 25 via the developing device 12, the pattern plating device 13, the peeling device 14, and the etching device 15 in order to return to the developing device 12.
搬運裝置11具備：保持基材1之工件保持構件30、與第1路線21及第2路線22對應而分別設置之直線狀的軌條31(參閱圖5)、與第3路線23及第4路線24而分別設置之第1方向轉換機構32及第2方向轉換機構33、以及驅動機構37(參閱圖3)。 The conveying device 11 includes a workpiece holding member 30 that holds the base material 1, linear rails 31 (see FIG. 5) provided corresponding to the first route 21 and the second route 22, and the third route 23 and the fourth The first direction changing mechanism 32, the second direction changing mechanism 33, and the driving mechanism 37 (see FIG. 3) provided for the route 24, respectively.
如圖5所表示，工件保持構件30具有：自由裝卸地握持基材1的上端緣部之工件握持部34、從工件握持部34往略水平方向延伸之臂部35、以及可以沿軌條31移動之可動部36；可動部36係藉由驅動機構37(圖3參閱)沿軌條31移動。亦即，在第1路線21及第2路線22，工件保持構件30沿軌條31移動。尚且，在工件供給位置25被安裝到工件保持構件30之基材1，係保持被安裝到該工件保持構件30的狀態一直移動到工件取出位置26為止後，在工件取出位置26從工件保持構件30被取出。 As shown in FIG. 5, the work holding member 30 has a work holding portion 34 that detachably holds the upper edge of the base material 1, an arm portion 35 that extends from the work holding portion 34 in a slightly horizontal direction, and can The movable portion 36 for the rail 31 to move; the movable portion 36 is moved along the rail 31 by a driving mechanism 37 (see FIG. 3). That is, in the first route 21 and the second route 22, the workpiece holding member 30 moves along the rail 31. Furthermore, after the base material 1 attached to the workpiece holding member 30 at the workpiece supply position 25 is held in the state where it is attached to the workpiece holding member 30 and moved to the workpiece extraction position 26, the workpiece extraction member 26 is removed from the workpiece holding member 26 30 was taken out.
如圖2所表示，第1方向轉換機構32係把到達了第1路線21的其中一端之工件保持構件30，沿第1搬運室41內的第3路線23滑動移動到第2路線22的其中一端。而且，如圖4所表示，第2方向轉換機構33，係把到達了第2路線22的另一端之工件保持構件30，沿第2搬運室42內的第4路線24滑動移動到第1路線21的另一端。從而，在第1路線21與第2路線22，工件保持構件30的移動方向38為反轉。 As shown in FIG. 2, the first direction conversion mechanism 32 slides the workpiece holding member 30 that has reached one end of the first route 21 along the third route 23 in the first transfer chamber 41 to the second route 22 One end. Furthermore, as shown in FIG. 4, the second direction conversion mechanism 33 slides the workpiece holding member 30 that has reached the other end of the second path 22 along the fourth path 24 in the second transfer chamber 42 to the first path The other end of 21. Therefore, in the first route 21 and the second route 22, the movement direction 38 of the workpiece holding member 30 is reversed.
而且，在第1搬運室41內與第2搬運室42內，把防止進行移動的基材1乾燥作為目的，分別設有噴霧細微的水(霧)加溼室內之複數個噴霧噴嘴(加溼單元)43、44。經由加溼第1搬運室41內的方式，可以把表面的略全域被水膜覆蓋的狀態的基材1供給到圖案鍍覆製程。經此，可以把基材1的露出銅表面的空氣氧化抑制在最小限，在鍍覆前處理之因化學藥品所致之強力的氧化被覆膜去除處理變成非必要。而且，可以良好地保持基材1的表面的親水性，可以大幅省略以往過剩之必要的水洗處理，可以對水資源的節省帶來極大的效果。而且，經由加溼第2搬運室42內的方式，可以把非乾燥狀態(溼潤狀態)的基材1供給到剝離製程。經此，可以把基材1的表面保持在總是被水浸溼的狀態，可以良好地保持親水性。尚且，加溼各搬運室41、42內之手段，係不限於把霧噴霧出之噴霧噴嘴43、44，其他的手段(例如使用超音波之加溼器等)也是可以的。 In addition, in the first transfer chamber 41 and the second transfer chamber 42, for the purpose of preventing the substrate 1 from moving, a plurality of spray nozzles (humidification) are provided in the humidification chamber for spraying fine water (mist) Unit) 43, 44. By means of humidifying the inside of the first transfer chamber 41, the substrate 1 in a state where almost the entire surface is covered with the water film can be supplied to the pattern plating process. As a result, the air oxidation of the exposed copper surface of the base material 1 can be suppressed to a minimum, and the strong oxidation coating removal process due to chemicals before the plating process becomes unnecessary. In addition, the hydrophilicity of the surface of the base material 1 can be maintained well, the water washing treatment necessary for the surplus in the past can be largely omitted, and a great effect can be brought about in saving water resources. Furthermore, the substrate 1 in a non-dry state (wet state) can be supplied to the peeling process by humidifying the inside of the second transfer chamber 42. Through this, the surface of the base material 1 can be kept in a state where it is always wetted by water, and the hydrophilicity can be kept well. In addition, the means for humidifying the transport chambers 41 and 42 is not limited to the spray nozzles 43 and 44 for spraying out mist, and other means (for example, using an ultrasonic humidifier, etc.) are also possible.
作業者M，係如圖2所表示，在工件供給位置25，把基材1的上端緣著裝在工件保持構件30的工件握持部34(參閱圖5)，如圖4所表示，在工件取出位置26，從工件保持構件30的工件握持部34(參閱圖5)取出基材1。被著裝在工件保持構件30之基材1，係從工件握持部34吊在略垂直方向，在第1路線21及第2路線22，以基材1的面方向沿各路線21、22(基材1的移動方向38)的姿勢做略水平地移動，在第3路線23及第4路線24，以基材1的面方向與各路線23、24(基材1的移動方向38)略正交的姿勢做略水平地移動。如此，搬運裝置11係在從工件供給位置25經過顯影裝置12、圖案鍍覆裝置13、剝離裝置14、蝕刻裝置15一直到工件取出位置26為連續之搬運路徑20的全域中，以把基材1立起成略垂直的姿勢進行搬運。尚且，本實施方式的基材1(工件保持構件30)的移動方向38，係在圖1中為逆時針旋轉，但也可以設定成與移動方向38為相反方向(順時針方向)。 The operator M, as shown in FIG. 2, puts the upper edge of the base material 1 on the workpiece holding portion 34 of the workpiece holding member 30 at the workpiece supply position 25 (see FIG. 5), as shown in FIG. At the take-out position 26, the base material 1 is taken out from the work holding portion 34 (see FIG. 5) of the work holding member 30. The base material 1 worn on the work holding member 30 is suspended from the work holding portion 34 in a slightly vertical direction, and along the first and second paths 21 and 22, along the respective paths 21 and 22 in the plane direction of the base material 1 ( The posture of the movement direction 38 of the base material 1 is slightly horizontally moved, and on the third route 23 and the fourth route 24, the surface direction of the base material 1 is slightly different from the respective paths 23 and 24 (the movement direction 38 of the base material 1). The orthogonal posture moves slightly horizontally. In this way, the conveying device 11 moves the substrate from the workpiece supply position 25 through the developing device 12, the pattern plating device 13, the peeling device 14, and the etching device 15 all the way to the workpiece take-out position 26 as the continuous conveying path 20 to remove the substrate 1 Stand up and carry it in a slightly vertical position. In addition, the movement direction 38 of the base material 1 (workpiece holding member 30) of the present embodiment is counterclockwise rotation in FIG. 1, but it may be set in the opposite direction (clockwise direction) to the movement direction 38.
顯影裝置12，係在沿搬運路徑20被搬運的基材1的導電性薄膜2上，形成與導體圖案4為逆圖案的鍍覆阻材3(顯影製程)。具體方面，在導電性薄膜2上疊層乾膜阻材，介隔著光罩照射紫外線進行影像曝光後，把顯影液(例如碳酸鈉)從複數個噴霧噴嘴40朝向基材1的兩面噴射進行顯影，形成鍍覆阻材3(參閱圖3)。 The developing device 12 is formed on the conductive film 2 of the base material 1 conveyed along the conveying path 20, and forms a plating resist 3 in a reverse pattern to the conductor pattern 4 (development process). Specifically, after laminating a dry film resist material on the conductive film 2 and irradiating ultraviolet light through the photomask to expose the image, a developing solution (such as sodium carbonate) is sprayed from a plurality of spray nozzles 40 toward both sides of the substrate 1 After development, a plating resist 3 (see FIG. 3) is formed.
圖案鍍覆裝置13，係具有：配置在顯影裝置 12的下游側，沿第2路線22排列成直線狀之複數個鍍覆室13a；在各鍍覆室13a內，在導電性薄膜2中尚未形成鍍覆阻材3的表面區域，形成導體圖案4(圖案鍍覆製程)。具體方面，把基材1以立起狀態一邊浸漬到鍍覆槽(省略圖示)內的指定的鍍覆液(例如硫酸銅鍍覆液)一邊搬運，一邊搬運一邊浸漬，藉由電性鍍覆的方式形成導體圖案4。 The pattern plating device 13 is provided with: disposed in the developing device On the downstream side of 12, a plurality of plating chambers 13a arranged in a straight line along the second route 22; in each plating chamber 13a, the surface area of the plating resist 3 has not yet been formed in the conductive film 2 to form a conductor pattern 4 (pattern plating process). Specifically, the substrate 1 is immersed in a standing state while being immersed in a specified plating solution (for example, copper sulfate plating solution) in a plating tank (not shown), and immersed while being conveyed by electroplating盖 的 方式 进行 进行 表 4。 Conductor pattern 4 is covered.
在圖案鍍覆裝置13進行的圖案鍍覆製程，包含：鍍覆前處理、鍍覆處理、以及鍍覆後處理。基材1，係在浸漬到各處理槽內的處理液的狀態下，依序移動在：鍍覆前處理用的複數個處理槽、鍍覆處理用的複數個處理槽(鍍覆槽)、以及鍍覆後處理用的複數個處理槽。第2路線22的軌條31，係被設定在使基材1充分浸漬到各處理槽內的處理液之高度位置，於各處理槽的前後，設有對處理液進行基材1的投入(下降)及取出(上升)之升降裝置。升降裝置，係使工件保持構件30上升，從軌條31使可動部36脫離，使工件保持構件30朝下游側移動指定距離後下降，再把可動部36載置到軌條31。經此，到達了鍍覆前處理之基材1，係從最初(最上游)的處理槽一直到最後(最下游)的處理槽，反覆進行把在處理槽的上游端下降後浸漬到處理液後在處理液內移動，在處理槽的下游端上升朝下個處理槽移動之動作後，朝鍍覆處理移動。到達了鍍覆處理之基材1，係從最初(最上游)的鍍覆槽一直到最後(最下游)的鍍覆槽，反覆進行把在鍍覆 槽的上游端下降後浸漬到處理液後在處理液內移動，在鍍覆槽的下游端上升朝下個鍍覆槽移動之動作後，朝鍍覆後處理移動。到達了鍍覆後處理之基材1，係從最初(最上游)的處理槽一直到最後(最下游)的處理槽，反覆進行把在處理槽的上游端下降後浸漬到處理液後再處理液內移動，在處理槽的下游端上升朝下個處理槽移動之動作後，朝第4路線24(第2搬運室42)移動。 The pattern plating process performed by the pattern plating apparatus 13 includes pre-plating treatment, plating treatment, and post-plating treatment. The substrate 1 is in a state of being immersed in the processing liquid in each processing tank, and sequentially moves in: a plurality of processing tanks for pre-plating processing, a plurality of processing tanks for plating processing (plating tank), And multiple treatment tanks for post-plating treatment. The rail 31 of the second route 22 is set at a height position where the substrate 1 is sufficiently immersed in the processing liquid in each processing tank, and before and after each processing tank, there is provided an input of the processing liquid to the substrate 1 ( (Descent) and take out (rise) lifting device. The lifting device raises the workpiece holding member 30, disengages the movable portion 36 from the rail 31, moves the workpiece holding member 30 downstream by a predetermined distance, and then lowers the movable portion 36 on the rail 31. After this, the substrate 1 before the plating process is reached, which is from the initial (most upstream) processing tank to the last (lowest downstream) processing tank, which is repeatedly immersed in the processing liquid after descending at the upstream end of the processing tank After moving in the processing liquid, after the downstream end of the processing tank moves upward and moves to the next processing tank, it moves to the plating process. The substrate 1 that has reached the plating process is from the initial (most upstream) plating tank to the last (most downstream) plating tank, and the plating is repeated After the upstream end of the tank is lowered, it is immersed in the treatment liquid, and then moves in the treatment liquid. After the downstream end of the plating tank moves up and moves to the next plating tank, it moves to the post-plating treatment. After reaching the substrate 1 for post-plating treatment, it is from the first (upstream) treatment tank to the last (downstream) treatment tank. The treatment tank is immersed in the treatment liquid after being lowered at the upstream end of the treatment tank. After moving in the liquid, the downstream end of the processing tank moves upward to move to the next processing tank, and then moves toward the fourth path 24 (second transfer chamber 42).
剝離裝置14，係被配置在圖案鍍覆裝置13的下游側，從導電性薄膜2上剝離鍍覆阻材3(剝離製程)。具體方面，把指定的剝離液(例如胺系剝離液)，與上述顯影裝置12的情況同樣從複數個噴霧噴嘴(省略圖示)朝向基材1的兩面噴射，剝離鍍覆阻材3。 The peeling device 14 is arranged on the downstream side of the pattern plating device 13 and peels off the plating resist 3 from the conductive film 2 (stripping process). Specifically, a predetermined peeling liquid (for example, an amine-based peeling liquid) is sprayed from both spray nozzles (not shown) toward both surfaces of the substrate 1 as in the case of the developing device 12 described above, and the plating resist 3 is peeled off.
蝕刻裝置15，係被配置在剝離裝置14的下游側，把導體圖案4下的區域以外的導電性薄膜2，經由用了指定的蝕刻液之化學蝕刻來去除(蝕刻製程)。具體方面，把指定的蝕刻液(處理液)，與上述顯影裝置12的情況同樣從複數個噴霧噴嘴(省略圖示)朝向基材1的兩面噴射，去除導體圖案4下的區域以外的導電性薄膜2。 The etching device 15 is disposed on the downstream side of the peeling device 14 and removes the conductive thin film 2 except the area under the conductor pattern 4 by chemical etching using a specified etching solution (etching process). Specifically, a specified etching liquid (treatment liquid) is sprayed from a plurality of spray nozzles (not shown) toward both surfaces of the base material 1 as in the case of the developing device 12 described above, to remove the conductivity outside the area under the conductor pattern 4 Film 2.
洗淨裝置16，係被分別附帶設置在各裝置12、13、14、15的各處理(各製程)的下游側(在顯影裝置12為顯影處理的下游側，在圖案鍍覆裝置13為鍍覆前處理的下游側與鍍覆處理的下游側與鍍覆後處理的下游側，在剝離裝置14為剝離處理的下游側，在蝕刻裝置15為蝕刻處理的下游側)，洗淨基材1的兩面。具體方面， 把水或是熱水，與上述顯影裝置12的情況同樣從複數個噴霧噴嘴(省略圖示)朝向基材1的兩面噴射，洗淨基材1的兩面。尚且，在圖案鍍覆裝置13所附帶的洗淨裝置16，亦可為儲留洗淨液之洗淨槽。該情況下，於洗淨槽的前後，設有相對於洗淨液進行基材1的投入及取出之升降裝置，基材1係以被浸漬到洗淨液的狀態被洗淨。 The cleaning device 16 is provided on the downstream side of each process (each process) of each device 12, 13, 14, 15 (the developing device 12 is the downstream side of the development process, and the pattern plating device 13 is plated The downstream side of the pre-coating process, the downstream side of the plating process, and the downstream side of the post-plating process, the stripping device 14 is the downstream side of the stripping process, and the etching device 15 is the downstream side of the etching process), the substrate 1 is washed On both sides. Specific aspects, Water or hot water is sprayed toward both sides of the substrate 1 from a plurality of spray nozzles (not shown) as in the case of the developing device 12 described above, and both sides of the substrate 1 are washed. Furthermore, the washing device 16 attached to the pattern plating device 13 may also be a washing tank for storing washing liquid. In this case, before and after the washing tank, a lifting device for inputting and removing the base material 1 with respect to the cleaning liquid is provided, and the base material 1 is washed while being immersed in the cleaning liquid.
根據本實施方式，在從工件供給位置25經過顯影製程、圖案鍍覆製程、剝離製程及蝕刻製程一直到工件取出位置26為連續之搬運路徑20的全域中，以把基材1立起成略垂直的姿勢進行搬運(垂直搬運)。為此，可以防止基材1與搬運滾子等的接觸，可以抑制斷線等的不良的發生。 According to the present embodiment, in the entire area of the continuous conveying path 20 from the workpiece supply position 25 through the development process, the pattern plating process, the peeling process and the etching process to the workpiece take-out position 26, the base material 1 is raised Carrying in a vertical posture (vertical transport). For this reason, it is possible to prevent the base material 1 from coming into contact with the conveying rollers and the like, and it is possible to suppress the occurrence of defects such as wire breakage.
而且，在各製程間搬運路徑20為連續的緣故，在製程間沒有必要進行基材1的拆卸或安裝。為此，不會招致作業效率的下降、工時的增加、或搬運裝置的分割所致之裝置的大型化或複雜化，而且也不會發生基材1的拆卸及安裝所致之不良。 Moreover, since the conveying path 20 is continuous between the processes, there is no need to remove or install the base material 1 between the processes. For this reason, it does not incur a decrease in work efficiency, an increase in man-hours, or an increase in size or complexity of the device due to the division of the conveying device, and no defects due to disassembly and installation of the substrate 1 occur.
以上，有關本發明，是根據上述實施方式進行了說明，但本發明不限定於上述實施方式的內容，當然在不逸脫本發明的範圍下可以適宜的變更。 In the above, the present invention has been described based on the above-mentioned embodiment, but the present invention is not limited to the content of the above-mentioned embodiment, and can of course be modified as appropriate without departing from the scope of the present invention.
例如，在上述實施方式，在從顯影裝置12經過圖案鍍覆裝置13及剝離裝置14到蝕刻裝置15之搬運路徑20的全域中連續的垂直搬運基材1；但也可以在從顯影裝置12一直到圖案鍍覆裝置13為止的範圍內垂直搬 運基材1，在其他的範圍內水平搬運基材1；而且，也可以在從圖案鍍覆裝置13一直到剝離裝置14(或是蝕刻裝置15)為止的範圍內垂直搬運基材1，在其他的範圍水平搬運基材1。 For example, in the above-described embodiment, the substrate 1 is vertically transported continuously over the entire conveyance path 20 from the developing device 12 through the pattern plating device 13 and the peeling device 14 to the etching device 15; Vertical transport within the range up to the pattern plating device 13 The substrate 1 is transported, and the substrate 1 is horizontally transported in other ranges; moreover, the substrate 1 can be vertically transported in the range from the pattern plating device 13 to the peeling device 14 (or the etching device 15). The substrate 1 is transported horizontally in other ranges.
而且，也可以把搬運路徑20不做成環狀，也可以作成線狀(例如直線狀)。而且，也可以不設置第1方向轉換機構32及第2方向轉換機構33，把軌條做成環狀。利用使用不具備方向轉換機構32、33之搬運裝置(例如，把搬運路徑做成線狀的情況或把軌條做成環狀的情況等)的方式，可以把從輥材抽出的基材連續保持長條狀而進行搬運。 Furthermore, the conveying path 20 may not be formed in a ring shape, but may be formed in a linear shape (for example, a linear shape). Furthermore, the rails may be formed in a ring shape without providing the first direction conversion mechanism 32 and the second direction conversion mechanism 33. By using a transport device that does not have the direction changing mechanisms 32 and 33 (for example, when the transport path is made linear or when the rail is made ring-shaped, etc.), the base material drawn from the roller can be continuously Keep it in a long shape and carry it.
本發明，係可以作為印刷配線板等的導體形成裝置及導體製造方法而廣泛使用。 The present invention can be widely used as a conductor forming device such as a printed wiring board and a conductor manufacturing method.
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| PCT/JP2016/060872 WO2017168745A1 (en) | 2016-04-01 | 2016-04-01 | Conductor-forming device and conductor-manufacturing method |
| ??PCT/JP2016/060872 | 2016-04-01 |
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| US20010041267A1 (en) * | 2000-04-11 | 2001-11-15 | Toshiba Tec Kabushiki Kaisha | Process and apparatus for nickel plating and nickel-plated product |
| TW579306B (en) * | 2002-01-28 | 2004-03-11 | Tokyo Kakoki Co Ltd | Substrate processing equipment |
| TW201246293A (en) * | 2010-12-01 | 2012-11-16 | Novellus Systems Inc | Electroplating apparatus and process for wafer level packaging |
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| JPH05235506A (en) * | 1992-02-24 | 1993-09-10 | Fujitsu Ltd | Manufacture of printed board |
| JP3296992B2 (en) * | 1996-09-27 | 2002-07-02 | イビデン株式会社 | Manufacturing method of multilayer printed wiring board |
| JP4044722B2 (en) * | 2000-10-10 | 2008-02-06 | 上村工業株式会社 | Device for changing the direction of conveyance of plate workpieces |
| JP4677216B2 (en) * | 2004-10-25 | 2011-04-27 | アルメックスＰｅ株式会社 | Flat surface treatment equipment |
| KR100794961B1 (en) * | 2006-07-04 | 2008-01-16 | 주식회사제4기한국 | Plasma semi additive process method for manufacturing pcb |
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| US20010041267A1 (en) * | 2000-04-11 | 2001-11-15 | Toshiba Tec Kabushiki Kaisha | Process and apparatus for nickel plating and nickel-plated product |
| TW579306B (en) * | 2002-01-28 | 2004-03-11 | Tokyo Kakoki Co Ltd | Substrate processing equipment |
| TW201246293A (en) * | 2010-12-01 | 2012-11-16 | Novellus Systems Inc | Electroplating apparatus and process for wafer level packaging |
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