CN107710888B - Conductor forming apparatus and conductor manufacturing method - Google Patents
Conductor forming apparatus and conductor manufacturing method Download PDFInfo
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- CN107710888B CN107710888B CN201680001048.1A CN201680001048A CN107710888B CN 107710888 B CN107710888 B CN 107710888B CN 201680001048 A CN201680001048 A CN 201680001048A CN 107710888 B CN107710888 B CN 107710888B
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- pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
Abstract
The conveying device (11) continuously conveys the base material (1) in a posture of approximately vertically standing in the whole range from the developing device (12) to the pattern plating device (13) in the whole area of a conveying path (20) from the developing device (12) to the etching device (15) through the pattern plating device (13) and the stripping device (14).
Description
Technical Field
The present invention relates to a conductor forming apparatus such as a printed circuit board and a conductor manufacturing method.
Background
As a method for forming a circuit on a printed board or the like, an additive (additive) method is known. In the additive method, as described in, for example, patent document 1, a plating resist having a pattern opposite to that of a conductor pattern is formed on a conductive thin film on the surface of an object to be processed (development step), a conductor pattern is formed in a surface region of the conductive thin film where the plating resist is not formed (pattern plating step), the plating resist is peeled off from the conductive thin film (peeling step), and the conductive thin film except for a region under the conductor pattern is removed by chemical etching using a predetermined etching solution (etching step), thereby forming a circuit pattern.
In a conventional general conductor forming apparatus, there are a horizontal conveyance in which a processing object is conveyed in a state of being inclined substantially horizontally, and a vertical conveyance in which the processing object is conveyed in a state of being raised substantially vertically. The object to be processed is horizontally conveyed in, for example, a developing process (developing apparatus), vertically conveyed in a pattern plating process (pattern plating apparatus), and horizontally conveyed in a peeling process (peeling apparatus) and an etching process (etching apparatus).
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 6-164104
Summary of the invention
Problems to be solved by the invention
In the above-described conventional general conductor forming apparatus, the object to be processed is horizontally conveyed in each step of the developing device, the peeling device, and the etching device. In such horizontal conveyance, since the conveying roller is in contact with the object to be processed, a load on the surface (circuit pattern) of the object to be processed is large, and as the line becomes thinner, the resist is more likely to be damaged or chipped, and as a result, defects such as pattern disconnection or short circuit are likely to occur.
Further, between the developing device and the pattern plating device, the processing object needs to be detached from the horizontal conveyance type conveyance device of the developing device (taken from the conveyance roller) and reattached to the vertical conveyance type conveyance device of the pattern plating device. Similarly, between the pattern plating device and the peeling device, the processing object needs to be detached from the vertical conveyance type conveyance device of the pattern plating device and reattached to the horizontal conveyance type conveyance device of the peeling device (placed again on the conveyance roller). Therefore, the reduction in work efficiency, the increase in man-hours, and the increase in size and complexity of the apparatus due to the division of the conveying device are caused, and the defects due to the removal and attachment of the processing object are likely to occur.
Disclosure of Invention
Accordingly, an object of the present invention is to provide a conductor forming apparatus and a conductor manufacturing method capable of achieving stable quality and improved operation efficiency.
Means for solving the problems
In order to achieve the above object, a conductor forming apparatus according to the present invention includes a conveying mechanism, a developing device, a pattern plating device, a peeling device, and an etching device.
The conveying mechanism conveys the object to be processed having the conductive thin film on the surface of the insulating substrate from the upstream side to the downstream side along a predetermined conveying path. The developing device forms a plating resist having a pattern opposite to the conductor pattern on the conductive thin film of the object to be processed conveyed along the conveying path. The pattern plating device is disposed downstream of the developing device, and forms a conductor pattern on a surface region of the conductive thin film where the plating resist is not formed. The stripping device is arranged at the downstream side of the pattern plating device and strips the plating resist from the conductive film. The etching device is disposed downstream of the stripping device, and removes the conductive thin film except the region under the conductive pattern by chemical etching using a predetermined etching liquid.
In the conductor forming apparatus according to the first aspect of the present invention, the conveying mechanism continuously conveys the object to be processed in a substantially vertically standing posture at least in a range from the developing device to the pattern plating device in a conveying path from the developing device to the etching device via the pattern plating device and the stripping device.
The conductor manufacturing method of the present invention includes a developing step, a pattern plating step, a peeling step, and an etching step.
In the developing step, a plating resist layer having a pattern opposite to the conductor pattern is formed on the conductive thin film of the object to be processed, which has the conductive thin film on the surface of the insulating substrate and is conveyed along a predetermined conveying path. In the pattern plating step, a conductor pattern is formed in a region where the plating resist layer is not formed in the conductive thin film of the processing object conveyed from the developing step along the conveyance path. In the stripping step, the plating resist is stripped from the conductive film of the object to be processed conveyed from the pattern plating step along the conveying path. In the etching step, the conductive thin film of the object to be processed conveyed from the peeling step along the conveying path is removed except for the region under the conductor pattern by chemical etching using a predetermined etching liquid.
In the conductor manufacturing method according to the first aspect of the present invention, the object to be processed is continuously conveyed in a substantially vertically upright posture in at least a range from the developing step to the pattern plating step in a conveyance path from the developing step to the etching step through the pattern plating step and the peeling step.
According to the apparatus and method of the first aspect, the object to be processed is continuously conveyed in a substantially vertically standing posture in a range from the developing apparatus (developing step) to the pattern plating apparatus (pattern plating step) in the conveyance path. Therefore, in the developing step and the pattern plating step, contact between the object to be processed and the conveying roller or the like can be prevented, damage, chipping, or the like of the resist is less likely to occur, and occurrence of defects such as pattern disconnection or short-circuiting can be suppressed.
Further, since the conveyance path is continuous between the developing step and the pattern plating step, there is no need to detach or attach the processing object between the steps. Therefore, the reduction in work efficiency, the increase in man-hours, and the increase in size and complexity of the apparatus due to the division of the conveying device do not occur, and the failure due to the removal and attachment of the processing object does not occur.
In the conductor forming apparatus according to the second aspect of the present invention, the conveying mechanism continuously conveys the object to be processed in a substantially vertically standing posture at least in a range from the pattern plating device to the stripping device in a conveying path from the developing device to the etching device through the pattern plating device and the stripping device.
In the conductor manufacturing method according to the second aspect of the present invention, the object to be processed is continuously conveyed in a substantially vertically upright posture in at least a range from the pattern plating step to the stripping step in a conveyance path from the developing step to the etching step through the pattern plating step and the stripping step.
According to the apparatus and method of the second aspect, the processing object is continuously conveyed in a substantially vertically standing posture in a range from the pattern plating apparatus (pattern plating step) to the peeling apparatus (peeling step) in the conveyance path. Therefore, in the pattern plating step and the peeling step, contact between the object to be processed and the conveyance roller or the like can be prevented, damage to the pattern can be reduced or eliminated, and occurrence of defects such as pattern disconnection or short-circuiting can be suppressed.
Further, since the conveyance path is continuous between the pattern plating step and the peeling step, there is no need to detach or attach the processing object between the steps. Therefore, the reduction in work efficiency, the increase in man-hours, and the increase in size and complexity of the apparatus due to the division of the conveying device are not caused, and the failure due to the removal and attachment of the processing object is not caused.
In the conductor forming apparatus according to the third aspect of the present invention, the conveying mechanism continuously conveys the object to be processed in a substantially vertically standing posture over the entire conveying path from the developing device to the etching device via the pattern plating device and the stripping device.
In the conductor manufacturing method according to the third aspect of the present invention, the object to be processed is continuously conveyed in a posture of substantially vertically rising over the entire area of the conveyance route from the developing step through the pattern plating step and the stripping step to the etching step.
According to the apparatus and method of the third aspect, the object to be processed is conveyed in a vertically standing posture over the entire area of the conveyance path which continues from the developing step to the etching step through the pattern plating step and the peeling step. Therefore, contact between the object to be processed and the transport rollers and the like can be prevented, damage, chipping, and the like of the resist are less likely to occur, and occurrence of defects such as pattern disconnection and short-circuiting can be suppressed.
Further, since the conveyance path is continuous between the respective steps, there is no need to detach or attach the processing object between the steps. Therefore, the reduction in work efficiency, the increase in man-hours, and the increase in size and complexity of the apparatus due to the division of the conveying device are not caused, and the failure due to the removal and attachment of the processing object is not caused.
A conductor forming apparatus according to a fourth aspect of the present invention is the conductor forming apparatus according to the first or third aspect, and includes a first conveyance chamber disposed between the developing device and the pattern plating device and through which the object to be processed conveyed along the conveyance path passes. The first transport chamber is provided with a first humidifying mechanism for humidifying the first transport chamber to prevent drying of the object to be processed.
According to the conductor forming apparatus of the fourth aspect, the object to be processed can be supplied to the pattern plating apparatus in a state in which substantially the entire area of the substrate surface is covered with the water film. This makes it possible to minimize air oxidation on the substrate surface, and eliminates the need for a chemical-based strong oxide film removal treatment in the pre-plating treatment. Further, since the wettability of the substrate surface can be maintained well, the amount of water required for the water washing treatment can be significantly reduced.
Further, since the entire surface of the substrate is continuously maintained in a state of being covered with a water film from the development to the pattern plating, deposition failure of the plating due to bubbles trapped in the recesses of the resist film circuit formed on the surface of the substrate can be significantly reduced.
A conductor forming apparatus according to a fifth aspect of the present invention is the conductor forming apparatus according to the second or third aspect, wherein the conductor forming apparatus includes a second conveyance chamber which is disposed between the pattern plating apparatus and the peeling apparatus and through which the object to be processed conveyed along the conveyance path passes. The second transport chamber is provided with a second humidifying mechanism for humidifying the second transport chamber to prevent drying of the object to be processed.
According to the conductor forming apparatus of the fifth aspect, the object to be processed in a non-dry state (wet state) can be supplied to the peeling step. This makes it possible to always keep the substrate surface in a state of being immersed in water, and to keep the substrate surface in a good wettability.
Further, since the object to be treated is transferred to the stripping step in a state where a thin water film is formed over the entire area of the substrate after pattern plating, an effect of preventing adhesion of an oil film or foreign matter particularly to the resist film is obtained, and an obstacle factor of contact between the resist stripping liquid and the resist film can be sufficiently and reliably eliminated.
The invention has the following effects:
according to the present invention, the quality can be stabilized and the operation efficiency can be improved.
Drawings
Fig. 1 is a plan view schematically showing the whole of a conductor forming apparatus according to an embodiment of the present invention.
Fig. 2 is a plan view schematically showing the developing device and the 1 st direction switching mechanism of fig. 1.
Fig. 3 is a side view schematically showing the developing device of fig. 1.
Fig. 4 is a plan view schematically showing the 2 nd direction switching mechanism, the peeling device, and the etching device in fig. 1.
Fig. 5 is a perspective view schematically showing a state in which the processing object is vertically conveyed.
Fig. 6 is a schematic diagram for explaining the steps of the additive method, in which fig. 6(a) shows a substrate, fig. 6(b) shows a state in which a conductive thin film is formed, fig. 6(c) shows a state in which a plating resist is formed, fig. 6(d) shows a state in which a conductive layer is formed, fig. 6(e) shows a state in which the plating resist is peeled off, and fig. 6(f) shows a state in which the conductive thin film is removed by chemical etching.
Detailed Description
Hereinafter, a conductor forming apparatus 10 according to an embodiment of the present invention will be described with reference to the drawings.
First, an outline of a method for manufacturing a printed wiring board by an additive method using the conductor forming apparatus 10 will be described with reference to fig. 6.
As shown in fig. 6(a), in the additive method, a base material (substrate) 1 composed of an insulating layer is prepared. The substrate 1 is an insulating thin film or sheet made of, for example, epoxy resin, polyimide, or another resin. The substrate 1 may be formed by applying a resin to a copper-clad laminate or a substrate made of a metal foil.
Next, as shown in fig. 6(b), a conductive thin film 2 is formed on the surface of the base 1 by sputtering, electroless copper plating, or the like to a predetermined film thickness (for example, 10 μm or less). Alternatively, a copper clad laminate may be used on the substrate 1, and the copper foil may be used as the conductive film 2.
Next, as shown in fig. 6 c, a plating resist 3 having a pattern opposite to that of the conductive pattern 4 formed in the subsequent step is formed on the conductive film 2 by exposing and developing a coating (plating) such as a dry film (film) (developing step).
Next, as shown in fig. 6 d, a conductive pattern 4 made of copper is formed by electroplating using, for example, a copper sulfate plating solution on the surface region of the conductive thin film 2 where the plating resist layer 3 is not formed (pattern plating step). As a material of the conductor pattern 4, a metal or an alloy other than copper may be used.
Next, as shown in fig. 6(e), the plating resist layer 3 is removed by peeling or the like (peeling step).
Next, as shown in fig. 6(f), the conductive thin film (removed layer) 2 is removed except the region under the conductive pattern 4 by chemical etching using a predetermined etching liquid (for example, a sulfuric acid/hydrogen peroxide solution) (etching step). Thereby, a printed wiring board having the predetermined conductor pattern 4 on the base material 1 is formed. The substrate 1 on which the conductive thin film 2 is formed is a treatment target, but the treatment target may be referred to as the substrate 1 only.
As shown in fig. 1, the conductor forming apparatus 10 includes a conveying device (conveying mechanism) 11, a developing device 12, a pattern plating device 13, a stripping device 14, an etching device 15, and a plurality of cleaning devices 16. The cleaning device 16 is additionally provided on each of the developing device 12, the pattern plating device 13, the peeling device 14, and the etching device 15. Fig. 6 illustrates a case where the conductive pattern 4 is formed only on one surface of the base material 1, but in the present embodiment, a case where the conductive pattern 4 is formed on both surfaces of the base material 1 will be described. That is, the conductive thin films 2 are formed on both surfaces (both surfaces) of the substrate 1, and the processes from the developing step to the etching step are performed. The base material 1 of the present embodiment is a flat plate material cut into a predetermined size.
The transport device 11 transports the substrate 1 on which the conductive thin film 2 is formed from the upstream side to the downstream side along a predetermined transport path 20. The conveyance path 20 is a rectangular ring shape having a 1 st line 21 extending linearly, a 2 nd line 22 arranged substantially parallel to the 1 st line 21 and extending linearly, a 3 rd line 23 connecting one end of the 1 st line 21 and one end of the 2 nd line 22, and a 4 th line 24 connecting the other end of the 2 nd line 22 and the other end of the 1 st line 21. The stripping device 14, the etching device 15, and the developing device 12 are arranged along the 1 st line 21, and the pattern plating device 13 is arranged to extend along the 2 nd line 22. Between the etching device 15 and the developing device 12 in the 1 st line 21, a workpiece supply position 25 at which the operator M supplies the substrate 1 to the transport line 20 is set on the upstream side of the developing device 12, and a workpiece take-out position 26 at which the operator M takes out the substrate 1 with the circuit formed thereon from the transport line 20 is set on the downstream side of the etching device 15. The transport path 20 passes through the developing device 12, the pattern plating device 13, the peeling device 14, and the etching device 15 in this order from the work supply position 25 and then returns to the developing device 12.
The conveying device 11 includes a workpiece holding member 30 for holding the base material 1, linear guide rails 31 (see fig. 5) provided corresponding to the 1 st line 21 and the 2 nd line 22, a 1 st direction switching mechanism 32 and a 2 nd direction switching mechanism 33 provided corresponding to the 3 rd line 23 and the 4 th line 24, respectively, and a driving mechanism 37 (see fig. 3).
As shown in fig. 5, the workpiece holding member 30 includes a workpiece grip 34 that detachably grips the upper edge portion of the base material 1, an arm portion 35 extending from the workpiece grip 34 in a substantially horizontal direction, and a movable portion 36 movable along the guide rail 31, and the movable portion 36 is moved along the guide rail 31 by a drive mechanism 37 (see fig. 3). That is, in the 1 st lane 21 and the 2 nd lane 22, the workpiece holding member 30 moves along the guide rail 31. Further, the base material 1 attached to the workpiece holding member 30 at the workpiece supply position 25 is moved to the workpiece take-out position 26 in a state of being attached to the workpiece holding member 30, and then is detached from the workpiece holding member 30 at the workpiece take-out position 26.
As shown in fig. 2, the 1 st direction switching mechanism 32 slides the workpiece holding member 30 reaching the one end of the 1 st lane 21 to the one end of the 2 nd lane 22 along the 3 rd lane 23 in the first conveyance chamber 41. Then, as shown in fig. 4, the 2 nd direction switching mechanism 33 slides the workpiece holding member 30 reaching the other end of the 2 nd lane 22 to the other end of the 1 st lane 21 along the 4 th lane 24 in the second conveyance chamber 42. Thus, in the 1 st lane 21 and the 2 nd lane 22, the moving direction 38 of the workpiece holding member 30 is reversed.
In the first transfer chamber 41 and the second transfer chamber 42, a plurality of spray nozzles (humidifying mechanisms) 43 and 44 for humidifying the inside of the chamber by spraying fine water (mist) are provided for the purpose of preventing the moving substrate 1 from drying. By humidifying the inside of the first transfer chamber 41, the substrate 1 can be supplied in a state in which substantially the entire surface is covered with the water film in the pattern plating step. This can minimize the air oxidation of the exposed copper surface of the base material 1, and thus eliminates the need for a strong chemical removal treatment of the oxide film in the pre-plating treatment. Furthermore, the surface of the substrate 1 can be kept well moist, and the conventional washing process which is excessively needed can be greatly omitted, thereby providing a great effect of saving water resources. Further, by humidifying the inside of the second conveyance chamber 42, the substrate 1 in a non-dry state (wet state) can be supplied in the peeling step. This makes it possible to always keep the surface of the substrate 1 in a state of being immersed in water, and to keep the wettability of water well. The mechanism for humidifying the inside of each of the transport chambers 41 and 42 is not limited to the mist spray nozzles 43 and 44 that spray mist, and may be another mechanism (e.g., a humidifier using ultrasonic waves).
As shown in fig. 2, the operator M attaches the upper end edge of the base material 1 to the workpiece holding portion 34 (see fig. 5) of the workpiece holding member 30 at the workpiece supply position 25, and detaches the base material 1 from the workpiece holding portion 34 (see fig. 5) of the workpiece holding member 30 at the workpiece removal position 26 as shown in fig. 4. The substrate 1 attached to the workpiece holding member 30 hangs down from the workpiece holding portion 34 in a substantially vertical direction, moves substantially horizontally in a posture in which the surface direction of the substrate 1 is along the lines 21 and 22 (the moving direction 38 of the substrate 1) in the 1 st line 21 and the 2 nd line 22, and moves substantially horizontally in a posture in which the surface direction of the substrate 1 is substantially orthogonal to the lines 23 and 24 (the moving direction 38 of the substrate 1) in the 3 rd line 23 and the 4 th line 24. Thus, the conveying device 11 conveys the base material 1 in a substantially vertically upright posture over the entire area of the conveying path 20 extending from the workpiece supply position 25 to the workpiece removal position 26 via the developing device 12, the pattern plating device 13, the peeling device 14, and the etching device 15. The moving direction 38 of the base material 1 (the workpiece holding member 30) in the present embodiment is counterclockwise in fig. 1, but the moving direction 38 may be set to the opposite direction (clockwise).
The developing device 12 forms a plating resist 3 having a pattern opposite to that of the conductive pattern 4 on the conductive thin film 2 of the substrate 1 conveyed along the conveying path 20 (developing step). Specifically, a dry film resist is coated on the conductive thin film 2, and is subjected to image exposure by irradiating ultraviolet rays through a photomask, and then, a developing solution (for example, carbonate) is sprayed from a plurality of spray nozzles 40 toward both surfaces of the base material 1 to develop the film, thereby forming the plating resist layer 3 (see fig. 3).
The pattern plating device 13 has a plurality of plating chambers 13a arranged downstream of the developing device 12 and arranged in a straight line along the 2 nd line 22, and the conductor pattern 4 is formed in a surface region of the conductive thin film 2 where the plating resist layer 3 is not formed in each plating chamber 13a (pattern plating step). Specifically, the conductive pattern 4 is formed by immersing the base material 1 in a predetermined plating solution (for example, a copper sulfate plating solution) in a plating tank (not shown) while transferring the base material in an upright state, and performing plating while transferring the base material.
The pattern plating process performed by the pattern plating apparatus 13 includes a pre-plating treatment, a plating treatment, and a post-plating treatment. The substrate 1 is moved in sequence by immersing a plurality of treatment tanks for pre-plating treatment, a plurality of treatment tanks (plating tanks) for plating treatment, and a plurality of treatment tanks for post-plating treatment in the treatment liquid in each treatment tank. The guide rail 31 of the 2 nd line 22 is provided with a lifting device which is set at a height position at which the substrate 1 is sufficiently immersed in the treatment liquid in each treatment tank, and which performs loading (lowering) and unloading (raising) of the substrate 1 with respect to the treatment liquid before and after each treatment tank. The lifting device raises the workpiece holding member 30, disengages the movable portion 36 from the guide rail 31, moves the workpiece holding member 30 downward after moving a predetermined distance to the downstream side, and places the movable portion 36 on the guide rail 31 again. Thus, the substrate 1 that has reached the plating pretreatment is moved to the plating treatment after repeating the operation of descending and immersing in the treatment liquid at the upstream end of the treatment tank, moving in the treatment liquid, ascending at the downstream end of the treatment tank, and moving to the next treatment tank, from the first (most upstream) treatment tank to the last (most downstream) treatment tank. The base material 1 that has reached the plating treatment is moved to the post-plating treatment after repeating the operation of descending and immersing into the treatment liquid at the upstream end of the plating tank, moving in the treatment liquid, ascending at the downstream end of the plating tank, and moving to the next plating tank, from the first (most upstream) plating tank to the last (most downstream) plating tank. The substrate 1 that has reached the post-plating treatment is moved to the 4 th line 24 (second conveyance chamber 42) after repeating the operation of descending and immersing into the treatment liquid at the upstream end of the treatment tank, moving in the treatment liquid, ascending at the downstream end of the treatment tank, and moving to the next treatment tank from the first (most upstream) treatment tank to the last (most downstream) treatment tank.
The stripping device 14 is disposed downstream of the pattern plating device 13 and strips the plating resist 3 from the conductive thin film 2 (stripping step). Specifically, as in the case of the developing device 12, a predetermined stripping liquid (for example, an amine-based stripping liquid) is sprayed from a plurality of spray nozzles (not shown) toward both surfaces of the base material 1 to strip the plating resists 3.
The etching device 15 is disposed downstream of the peeling device 14, and removes the conductive thin film 2 except for the region under the conductive pattern 4 by chemical etching using a predetermined etching liquid (etching step). Specifically, as in the case of the developing device 12, a predetermined etching liquid (treatment liquid) is sprayed from a plurality of spray nozzles (not shown) toward both surfaces of the base material 1 to remove the conductive thin film 2 except for the region under the conductive pattern 4.
The cleaning device 16 is additionally provided downstream of each process (each step) of the devices 12, 13, 14, and 15 (downstream of the developing process in the developing device 12, downstream of the pre-plating process in the pattern plating device 13, downstream of the plating process, and downstream of the post-plating process in the pattern plating device 13, downstream of the peeling process in the peeling device 14, and downstream of the etching process in the etching device 15), respectively, and cleans both surfaces of the substrate 1. Specifically, as in the case of the developing device 12, water or warm water is sprayed from a plurality of spray nozzles (not shown) toward both surfaces of the substrate 1 to clean both surfaces of the substrate 1. The cleaning device 16 attached to the pattern plating device 13 may be a cleaning tank for storing a cleaning liquid. In this case, lifting devices for loading and unloading the substrate 1 into and from the cleaning liquid are provided in front and rear of the cleaning tank, and the substrate 1 is cleaned while being immersed in the cleaning liquid.
According to the present embodiment, the base material 1 is conveyed in a substantially vertical posture (vertically conveyed) in the entire region of the conveyance route 20 from the workpiece supply position 25 to the workpiece removal position 26 through the developing step, the pattern plating step, the peeling step, and the etching step. Therefore, the substrate 1 can be prevented from contacting the conveying roller or the like, and the occurrence of defects such as disconnection can be suppressed.
Further, since the conveyance path 20 is continuous between the respective steps, it is not necessary to detach and attach the substrate 1 between the steps. Therefore, the reduction in work efficiency, the increase in man-hours, and the enlargement and complication of the apparatus caused by the division of the conveying apparatus do not occur, and the trouble caused by the removal and attachment of the base material 1 does not occur.
The present invention has been described above based on the above embodiments, but the present invention is not limited to the contents of the above embodiments, and it goes without saying that appropriate modifications can be made without departing from the scope of the present invention.
For example, in the above-described embodiment, the substrate 1 is continuously and vertically conveyed in the entire area of the conveyance route 20 from the developing device 12 to the etching device 15 via the pattern plating device 13 and the peeling device 14, but the substrate 1 may be vertically conveyed in the range from the developing device 12 to the pattern plating device 13, the substrate 1 may be horizontally conveyed in another range, the substrate 1 may be vertically conveyed in the range from the pattern plating device 13 to the peeling device 14 (or the etching device 15), and the substrate 1 may be horizontally conveyed in another range.
Further, the conveyance path 20 may be linear (for example, linear) instead of annular. Further, the guide rail may be formed in a ring shape without providing the 1 st direction conversion mechanism 32 and the 2 nd direction conversion mechanism 33. By using a conveying device not provided with the direction conversion mechanisms 32 and 33 (for example, when the conveying path is linear or the guide rail is annular), the base material pulled out from the web can be continuously conveyed in a long state.
Industrial applicability
The present invention can be widely used as a conductor forming apparatus such as a printed wiring board and a conductor manufacturing method.
Description of the reference symbols
1: base material (substrate, object to be processed)
2: conductive thin film
3: plating resist
4: conductor pattern
10: conductor forming apparatus
11: conveying device (conveying mechanism)
12: developing device
13: pattern plating device
14: stripping device
15: etching device
16: cleaning device
20: conveying line
21: 1 st line
22: 2 nd line
23: no. 3 line
24: 4 th line
25: work supply position
26: workpiece removal position
30: workpiece holding member
31: guide rail
32: 1 st direction switching mechanism
33: 2 nd direction switching mechanism
41: a first conveying chamber
42: second conveying chamber
43: spray nozzle (first humidifying mechanism)
44: spray nozzle (second humidifying mechanism)
M: operator
Claims (6)
1. A conductor forming apparatus is characterized by comprising:
a conveying mechanism for conveying the object to be processed having the conductive thin film on the surface of the insulating substrate from the upstream side to the downstream side along a predetermined conveying path;
a developing device for forming a plating resist layer having a pattern opposite to the conductor pattern on the conductive thin film of the object to be processed conveyed along the conveying path;
a pattern plating device disposed downstream of the developing device and configured to form the conductor pattern in a surface region of the conductive thin film where the plating resist is not formed;
a stripping device arranged at the downstream side of the pattern plating device for stripping the plating resist from the conductive film; and
an etching device disposed downstream of the peeling device for removing the conductive thin film except for a region under the conductive pattern by chemical etching using a predetermined etching liquid,
the transport path has a 1 st path and a 2 nd path which are substantially parallel to each other, and a 3 rd path which connects one end of the 1 st path and one end of the 2 nd path,
the developing device and the pattern plating device are disposed on the 1 st line and the 2 nd line, respectively,
the conveying mechanism includes a workpiece holding member for holding the processing object, linear guide rails provided corresponding to the 1 st line and the 2 nd line, respectively, and a direction switching mechanism provided corresponding to the 3 rd line, and continuously conveys the processing object in a substantially vertically standing posture in a range at least from the developing device to the pattern plating device in the conveying path from the developing device to the etching device through the pattern plating device and the peeling device,
the workpiece holding member is moved along the guide rail in the 1 st line and the 2 nd line,
the direction switching mechanism slides and moves the workpiece holding member reaching the one end of the 1 st lane to the one end of the 2 nd lane along the 3 rd lane so that the moving direction of the workpiece holding member in the 1 st lane and the 2 nd lane is reversed.
2. The conductor forming apparatus as claimed in claim 1,
a conveying chamber which is provided with the 3 rd line arranged between the developing device and the pattern plating device and is used for the object to be processed conveyed along the 3 rd line to pass through,
the transport chamber is provided with a humidifying mechanism for humidifying the transport chamber to prevent drying of the processing object.
3. The conductor forming apparatus according to claim 1 or claim 2,
the workpiece holding member includes a movable portion movable along the guide rail, a grip portion detachably gripping an upper portion of the processing object, and an arm portion connecting the movable portion and the grip portion.
4. A conductor forming apparatus is characterized by comprising:
a conveying mechanism for conveying the object to be processed having the conductive thin film on the surface of the insulating substrate from the upstream side to the downstream side along a predetermined conveying path;
a developing device for forming a plating resist layer having a pattern opposite to a conductor pattern on the conductive thin film of the object to be processed conveyed along the conveying path;
a pattern plating device disposed downstream of the developing device and configured to form the conductor pattern in a surface region of the conductive thin film where the plating resist is not formed;
a stripping device arranged at the downstream side of the pattern plating device for stripping the plating resist from the conductive film; and
an etching device disposed downstream of the peeling device for removing the conductive thin film except for a region under the conductive pattern by chemical etching using a predetermined etching liquid,
the transport path has a 1 st path and a 2 nd path which are substantially parallel to each other, and a 4 th path which connects the other end of the 1 st path and the other end of the 2 nd path,
the pattern plating device and the peeling device are disposed on the 2 nd wiring and the 1 st wiring, respectively,
the conveying mechanism includes a workpiece holding member for holding the processing object, linear guide rails provided corresponding to the 1 st line and the 2 nd line, respectively, and a direction changing mechanism provided corresponding to the 4 th line, and continuously conveys the processing object in a substantially vertically standing posture in a range at least from the pattern plating device to the peeling device in the conveying path from the developing device to the etching device through the pattern plating device and the peeling device,
the workpiece holding member is moved along the guide rail in the 1 st line and the 2 nd line,
the direction switching mechanism slides and moves the workpiece holding member reaching the other end of the 2 nd lane to the other end of the 1 st lane along the 4 th lane so that the moving direction of the workpiece holding member in the 1 st lane and the 2 nd lane is reversed.
5. A method for manufacturing a conductor, comprising the steps of:
a developing step of forming a plating resist layer having a pattern opposite to the conductor pattern on the conductive thin film of the object to be processed, which has the conductive thin film on the surface of the insulating substrate and is conveyed along a predetermined conveying path;
a pattern plating step of forming the conductor pattern in a surface region of the conductive thin film of the processing object conveyed from the developing step along the conveying path, on which the plating resist is not formed;
a stripping step of stripping the plating resist from the conductive thin film of the object to be processed conveyed from the pattern plating step along the conveying path; and
an etching step of removing the conductive thin film except for a region under the conductor pattern of the object to be processed conveyed from the peeling step along the conveying path by chemical etching using a predetermined etching liquid,
the transport path has a 1 st path and a 2 nd path which are substantially parallel to each other, and a 3 rd path which connects one end of the 1 st path and one end of the 2 nd path,
the developing step and the pattern plating step are provided on the 1 st wiring and the 2 nd wiring, respectively,
continuously conveying the object to be processed in a substantially vertically standing posture in the conveying path from the developing step to the etching step through the pattern plating step and the peeling step at least in a range from the developing step to the pattern plating step,
in the 1 st line and the 2 nd line, the processing object is held by a workpiece holding member that moves along a linear guide rail,
in the 3 rd lane, the workpiece holding member reaching one end of the 1 st lane is slidably moved to one end of the 2 nd lane by a direction switching mechanism so that the moving direction of the workpiece holding member in the 1 st lane and the 2 nd lane is reversed.
6. A method for manufacturing a conductor, comprising the steps of:
a developing step of forming a plating resist layer having a pattern opposite to the conductor pattern on the conductive thin film of the object to be processed, which has the conductive thin film on the surface of the insulating substrate and is conveyed along a predetermined conveying path;
a pattern plating step of forming the conductor pattern in a surface region of the conductive thin film of the processing object conveyed from the developing step along the conveying path, on which the plating resist is not formed;
a stripping step of stripping the plating resist from the conductive thin film of the object to be processed conveyed from the pattern plating step along the conveying path; and
an etching step of removing the conductive thin film except for a region under the conductor pattern of the object to be processed conveyed from the peeling step along the conveying path by chemical etching using a predetermined etching liquid,
the transport path has a 1 st path and a 2 nd path which are substantially parallel to each other, and a 4 th path which connects the other end of the 1 st path and the other end of the 2 nd path,
the pattern plating step and the peeling step are provided in the 2 nd wiring and the 1 st wiring, respectively,
continuously conveying the object to be processed in a substantially vertically standing posture at least in a range from the pattern plating step to the peeling step in the conveying route from the developing step to the etching step through the pattern plating step and the peeling step,
in the 1 st line and the 2 nd line, the processing object is held by a workpiece holding member that moves along a linear guide rail,
in the 4 th line, the workpiece holding member reaching the other end of the 2 nd line is slidably moved to the other end of the 1 st line by a direction switching mechanism so that the moving direction of the workpiece holding member in the 2 nd line and the 1 st line is reversed.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2016/060872 WO2017168745A1 (en) | 2016-04-01 | 2016-04-01 | Conductor-forming device and conductor-manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107710888A CN107710888A (en) | 2018-02-16 |
| CN107710888B true CN107710888B (en) | 2020-04-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680001048.1A Active CN107710888B (en) | 2016-04-01 | 2016-04-01 | Conductor forming apparatus and conductor manufacturing method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2017168745A1 (en) |
| CN (1) | CN107710888B (en) |
| TW (2) | TWI699833B (en) |
| WO (1) | WO2017168745A1 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6555178B2 (en) * | 2000-04-11 | 2003-04-29 | Toshiba Tec Kabushiki Kaisha | Process and apparatus for nickel plating and nickel-plated product |
| TW579306B (en) * | 2002-01-28 | 2004-03-11 | Tokyo Kakoki Co Ltd | Substrate processing equipment |
| CN101102647A (en) * | 2006-07-04 | 2008-01-09 | 株式会社第4纪韩国 | Plasma semi-additive process method for manufacturing pcb |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05235506A (en) * | 1992-02-24 | 1993-09-10 | Fujitsu Ltd | Manufacture of printed board |
| JP3296992B2 (en) * | 1996-09-27 | 2002-07-02 | イビデン株式会社 | Manufacturing method of multilayer printed wiring board |
| JP4044722B2 (en) * | 2000-10-10 | 2008-02-06 | 上村工業株式会社 | Device for changing the direction of conveyance of plate workpieces |
| JP4677216B2 (en) * | 2004-10-25 | 2011-04-27 | アルメックスＰｅ株式会社 | Flat surface treatment equipment |
| US9404194B2 (en) * | 2010-12-01 | 2016-08-02 | Novellus Systems, Inc. | Electroplating apparatus and process for wafer level packaging |
-
2016
- 2016-04-01 CN CN201680001048.1A patent/CN107710888B/en active Active
- 2016-04-01 WO PCT/JP2016/060872 patent/WO2017168745A1/en active Application Filing
- 2016-04-01 JP JP2016564116A patent/JPWO2017168745A1/en active Pending
- 2016-10-04 TW TW107139032A patent/TWI699833B/en active
- 2016-10-04 TW TW105132073A patent/TWI648793B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6555178B2 (en) * | 2000-04-11 | 2003-04-29 | Toshiba Tec Kabushiki Kaisha | Process and apparatus for nickel plating and nickel-plated product |
| TW579306B (en) * | 2002-01-28 | 2004-03-11 | Tokyo Kakoki Co Ltd | Substrate processing equipment |
| CN101102647A (en) * | 2006-07-04 | 2008-01-09 | 株式会社第4纪韩国 | Plasma semi-additive process method for manufacturing pcb |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107710888A (en) | 2018-02-16 |
| WO2017168745A1 (en) | 2017-10-05 |
| TWI699833B (en) | 2020-07-21 |
| TWI648793B (en) | 2019-01-21 |
| JPWO2017168745A1 (en) | 2018-04-05 |
| TW201737347A (en) | 2017-10-16 |
| TW201907484A (en) | 2019-02-16 |
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