TWI645984B - 列印機、噴墨列印機及控制噴墨列印機和產生其控制資料之方法 - Google Patents

列印機、噴墨列印機及控制噴墨列印機和產生其控制資料之方法 Download PDF

Info

Publication number
TWI645984B
TWI645984B TW103114950A TW103114950A TWI645984B TW I645984 B TWI645984 B TW I645984B TW 103114950 A TW103114950 A TW 103114950A TW 103114950 A TW103114950 A TW 103114950A TW I645984 B TWI645984 B TW I645984B
Authority
TW
Taiwan
Prior art keywords
volume
nozzle
nozzles
print head
drop
Prior art date
Application number
TW103114950A
Other languages
English (en)
Chinese (zh)
Other versions
TW201509691A (zh
Inventor
那喜德 哈爾吉
魯卡斯D 巴克利
里斯多夫R 浩夫
伊莉亞 沃斯凱
寇諾F 馬狄剛
路易斯 格雷葛瑞
亞歷山大 守康 高
法樂利 賈森
Original Assignee
凱特伊夫公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/US2013/077720 external-priority patent/WO2014105915A1/en
Priority claimed from PCT/US2014/035193 external-priority patent/WO2014176365A2/en
Application filed by 凱特伊夫公司 filed Critical 凱特伊夫公司
Publication of TW201509691A publication Critical patent/TW201509691A/zh
Application granted granted Critical
Publication of TWI645984B publication Critical patent/TWI645984B/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/205Ink jet for printing a discrete number of tones
    • B41J2/2054Ink jet for printing a discrete number of tones by the variation of dot disposition or characteristics, e.g. dot number density, dot shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/12Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0291Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work the material being discharged on the work through discrete orifices as discrete droplets, beads or strips that coalesce on the work or are spread on the work so as to form a continuous coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/015Ink jet characterised by the jet generation process
    • B41J2/04Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/0456Control methods or devices therefor, e.g. driver circuits, control circuits detecting drop size, volume or weight
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/015Ink jet characterised by the jet generation process
    • B41J2/04Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04581Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads based on piezoelectric elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/015Ink jet characterised by the jet generation process
    • B41J2/04Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04588Control methods or devices therefor, e.g. driver circuits, control circuits using a specific waveform
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/015Ink jet characterised by the jet generation process
    • B41J2/04Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04593Dot-size modulation by changing the size of the drop
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/07Ink jet characterised by jet control
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/21Ink jet for multi-colour printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/21Ink jet for multi-colour printing
    • B41J2/2132Print quality control characterised by dot disposition, e.g. for reducing white stripes or banding
    • B41J2/2135Alignment of dots
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/21Ink jet for multi-colour printing
    • B41J2/2132Print quality control characterised by dot disposition, e.g. for reducing white stripes or banding
    • B41J2/2142Detection of malfunctioning nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/38Drives, motors, controls or automatic cut-off devices for the entire printing mechanism
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F22/00Methods or apparatus for measuring volume of fluids or fluent solid material, not otherwise provided for
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0203Containers; Encapsulations, e.g. encapsulation of photodiodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/54Encapsulations having a particular shape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/1201Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/12Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/191Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/811Controlling the atmosphere during processing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/005Processes relating to semiconductor body packages relating to encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Fluid Mechanics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Ink Jet (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW103114950A 2013-04-26 2014-04-25 列印機、噴墨列印機及控制噴墨列印機和產生其控制資料之方法 TWI645984B (zh)

Applications Claiming Priority (22)

Application Number Priority Date Filing Date Title
US201361816696P 2013-04-26 2013-04-26
US61/816,696 2013-04-26
US201361822855P 2013-05-13 2013-05-13
US61/822,855 2013-05-13
US201361842351P 2013-07-02 2013-07-02
US61/842,351 2013-07-02
US201361857298P 2013-07-23 2013-07-23
US61/857,298 2013-07-23
US201361866031P 2013-08-14 2013-08-14
US61/866,031 2013-08-14
US201361898769P 2013-11-01 2013-11-01
US61/898,769 2013-11-01
US201361920715P 2013-12-24 2013-12-24
PCT/US2013/077720 WO2014105915A1 (en) 2012-12-27 2013-12-24 Techniques for print ink volume control to deposit fluids within precise tolerances
??PCT/US13/77720 2013-12-24
US61/920,715 2013-12-24
US14/162,525 2014-01-23
US14/162,525 US9010899B2 (en) 2012-12-27 2014-01-23 Techniques for print ink volume control to deposit fluids within precise tolerances
US201461950820P 2014-03-10 2014-03-10
US61/950,820 2014-03-10
??PCT/US14/35193 2014-04-23
PCT/US2014/035193 WO2014176365A2 (en) 2013-04-26 2014-04-23 Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances

Publications (2)

Publication Number Publication Date
TW201509691A TW201509691A (zh) 2015-03-16
TWI645984B true TWI645984B (zh) 2019-01-01

Family

ID=53186549

Family Applications (2)

Application Number Title Priority Date Filing Date
TW103114950A TWI645984B (zh) 2013-04-26 2014-04-25 列印機、噴墨列印機及控制噴墨列印機和產生其控制資料之方法
TW107141748A TWI670184B (zh) 2013-04-26 2014-04-25 用於在基板上製作層的設備和方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW107141748A TWI670184B (zh) 2013-04-26 2014-04-25 用於在基板上製作層的設備和方法

Country Status (4)

Country Link
JP (3) JP6781733B2 (ja)
KR (1) KR20190138705A (ja)
CN (2) CN105142913B (ja)
TW (2) TWI645984B (ja)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190138705A (ko) * 2013-04-26 2019-12-13 카티바, 인크. 인쇄 잉크 액적 측정 및 정밀 공차 내로 유체를 증착하기 위한 제어 기법
US9961782B2 (en) * 2016-07-08 2018-05-01 Kateeva, Inc. Transport path correction techniques and related systems, methods and devices
CN109476158B (zh) * 2016-10-25 2020-12-01 惠普发展公司,有限责任合伙企业 用于维持打印质量参数的打印机和方法
CN106555186A (zh) * 2016-11-28 2017-04-05 惠州市宏赫精密模具有限公司 一种蚀刻刀模画线加工方法
CN108340679B (zh) * 2017-01-24 2019-08-27 京东方科技集团股份有限公司 液滴体积的调节装置和调节方法
JP2019051498A (ja) * 2017-09-19 2019-04-04 アイシン精機株式会社 検査装置
CN108944045B (zh) * 2017-12-25 2019-12-10 广东聚华印刷显示技术有限公司 喷墨打印方法、装置、存储介质和计算机设备
CN108287899B (zh) * 2018-01-23 2022-07-01 巫协森 双色配线标示用料制作***与方法
CA3084995A1 (en) * 2018-01-26 2019-08-01 Precision Planting Llc Method of mapping droplet size of agricultural sprayers
CN108031573A (zh) * 2018-01-28 2018-05-15 北京工业大学 单液滴静电喷射***稳定工作的调控方法
US10321002B1 (en) * 2018-02-14 2019-06-11 Xerox Corporation Variable data vector graphic pattern ink pantograph
CN110091604B (zh) * 2018-04-13 2020-07-10 广东聚华印刷显示技术有限公司 喷墨打印控制方法、喷墨打印控制装置及喷墨打印***
CN108646470A (zh) * 2018-05-04 2018-10-12 京东方科技集团股份有限公司 隔垫物制作方法及***、显示面板和显示装置
US11305284B2 (en) * 2018-11-26 2022-04-19 Tokitae, LLC Determining a bulk concentration of a target in a sample using a digital assay with compartments having nonuniform volumes
US11135854B2 (en) * 2018-12-06 2021-10-05 Kateeva, Inc. Ejection control using imager
CN109823051B (zh) * 2018-12-29 2019-12-24 华中科技大学 一种液滴喷射融合全过程体积控制方法、***及打印机
CN112517928B (zh) * 2019-08-28 2022-11-04 北京梦之墨科技有限公司 一种打印路径规划方法及打印装置
CN110455204B (zh) * 2019-09-18 2020-11-20 中北大学 一种固体火箭发动机封头段涂层厚度自动检测校正方法
CN110455203B (zh) * 2019-09-18 2020-12-15 中北大学 一种固体火箭发动机直筒段涂层厚度自动检测校正方法
WO2021141157A1 (ko) * 2020-01-08 2021-07-15 엘지전자 주식회사 디스플레이의 박막 패턴 제조 방법
JP7446854B2 (ja) * 2020-03-02 2024-03-11 住友重機械工業株式会社 インク塗布装置、インク塗布装置の制御装置、及びインク塗布方法
CN111746123B (zh) * 2020-06-08 2024-03-26 深圳圣德京粤科技有限公司 一种多喷头打印装置及其打印方法
CN111905982A (zh) * 2020-07-16 2020-11-10 苏州小蜂视觉科技有限公司 一种基于光纤传感器的喷射点胶胶量的实时测量设备
TWI785844B (zh) * 2020-10-28 2022-12-01 德商博斯特比勒費爾德有限公司 印刷系統
CN112387552B (zh) * 2020-11-05 2022-05-17 大连交通大学 一种腻子涂装机器人喷涂参数自整定的方法
KR20220075009A (ko) 2020-11-26 2022-06-07 삼성디스플레이 주식회사 검사 장치
CN114074478A (zh) * 2020-12-28 2022-02-22 广东聚华印刷显示技术有限公司 喷墨打印控制方法、控制装置以及喷墨打印***
JP7044932B1 (ja) * 2021-07-08 2022-03-30 アーベーベー・シュバイツ・アーゲー 塗装ヘッドの塗装判定装置及び塗装システム
JP7122451B1 (ja) 2021-07-08 2022-08-19 アーベーベー・シュバイツ・アーゲー 塗装ヘッドの塗装判定装置及び塗装システム
KR102641818B1 (ko) 2021-08-24 2024-02-27 세메스 주식회사 기판 처리 장치 및 방법
CN113771493A (zh) * 2021-09-10 2021-12-10 Tcl华星光电技术有限公司 喷墨打印头、喷墨打印设备、方法以及装置
CN114670547B (zh) * 2022-03-04 2023-02-10 华中科技大学 一种喷墨打印tfe图案化膜厚控制方法
CN114801477B (zh) * 2022-03-11 2023-01-06 华中科技大学 一种用于印刷显示的图案化规划方法、打印方法及***
US11820140B2 (en) * 2022-03-21 2023-11-21 Funai Electric Co., Ltd Dispense modes for multi-mode capable device
CN115107370B (zh) * 2022-05-25 2024-04-26 复旦大学 一种高效oled像素层打印方法、装置及存储介质
CN116899820B (zh) * 2023-09-14 2024-01-02 常州银河世纪微电子股份有限公司 一种用于芯片双孔点胶头及其点胶方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548530B (zh) * 2012-12-27 2016-09-11 凱特伊夫公司 噴墨印刷的方法以及印刷機

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0427552A (ja) * 1990-05-22 1992-01-30 Canon Inc 液体噴射記録装置
US6513906B1 (en) * 1991-06-06 2003-02-04 Canon Kabushiki Kaisha Recording apparatus and recording method
JP2963072B2 (ja) * 1996-09-30 1999-10-12 キヤノン株式会社 インクジェット記録方法及び装置及びカラーフィルタ及び表示装置及びこの表示装置を備えた装置
US5867194A (en) * 1995-05-16 1999-02-02 Videojet Systems International, Inc. Method and apparatus for automatic setting of nozzle drive voltage in an ink jet printer
JP3346454B2 (ja) * 1997-01-08 2002-11-18 セイコーエプソン株式会社 インクジェット式印刷装置及び印刷方法
JP2001071476A (ja) * 1999-09-03 2001-03-21 Canon Inc 吐出液滴評価装置および吐出液滴評価方法
US6495917B1 (en) * 2000-03-17 2002-12-17 International Business Machines Corporation Method and structure of column interconnect
JP2003014442A (ja) * 2001-07-03 2003-01-15 Canon Inc 液滴体積測定装置
JP3838964B2 (ja) * 2002-03-13 2006-10-25 株式会社リコー 機能性素子基板の製造装置
JP3951765B2 (ja) * 2002-03-20 2007-08-01 セイコーエプソン株式会社 チャンバ装置の運転方法、チャンバ装置、これを備えた電気光学装置および有機el装置
US7188919B2 (en) * 2002-07-08 2007-03-13 Canon Kabushiki Kaisha Liquid discharge method and apparatus using individually controllable nozzles
JP4040543B2 (ja) * 2002-07-08 2008-01-30 キヤノン株式会社 液体吐出装置及び方法、パネル製造装置及び製造方法、カラーフィルタ製造方法、液晶表示パネルの製造方法、液晶表示パネルを備えた装置の製造方法
JP4323879B2 (ja) * 2002-07-08 2009-09-02 キヤノン株式会社 液体吐出装置及び液体吐出方法
US7111755B2 (en) * 2002-07-08 2006-09-26 Canon Kabushiki Kaisha Liquid discharge method and apparatus and display device panel manufacturing method and apparatus
JP2004058627A (ja) * 2002-07-31 2004-02-26 Canon Inc 液滴計測方法およびその装置
JP2004223354A (ja) * 2003-01-21 2004-08-12 Seiko Epson Corp 液状組成物の塗布方法、el素子の製造方法、カラーフィルタの製造方法、電気光学装置、電子機器
JP4168788B2 (ja) * 2003-03-06 2008-10-22 セイコーエプソン株式会社 成膜方法、カラーフィルタ基板の製造方法、エレクトロルミネッセンス装置用基板の製造方法、表示装置の製造方法
ATE419121T1 (de) * 2003-05-02 2009-01-15 Tpo Displays Corp Verfahren zum präzisen regeln des volumens von aus einem druckkopf ausgestossenen tintentröpfchen
US7578951B2 (en) * 2004-01-27 2009-08-25 Hewlett-Packard Development Company, L.P. Method of making microcapsules utilizing a fluid ejector
JP4580706B2 (ja) * 2004-07-08 2010-11-17 株式会社東芝 インク塗布装置及び表示装置製造方法
EP1778496B1 (en) * 2004-08-06 2015-07-22 S. Dana Seccombe Method and means for higher speed inkjet printing
US8342636B2 (en) * 2004-08-23 2013-01-01 Kabushiki Kaisha Ishiihyoki Discharge rate control method for ink-jet printer, ink spread inspecting method, and oriented film forming method
JP4568800B2 (ja) * 2004-12-17 2010-10-27 国立大学法人埼玉大学 小滴の状態計測装置及び該装置におけるカメラの校正方法
JP4645812B2 (ja) * 2005-01-14 2011-03-09 富士フイルム株式会社 液体吐出装置及び画像形成装置並びに吐出検出方法
JP2007117833A (ja) * 2005-10-26 2007-05-17 Seiko Epson Corp 薄膜形成方法及び薄膜形成装置
JP2007315976A (ja) * 2006-05-26 2007-12-06 Japan Aerospace Exploration Agency 微小液滴・気泡・粒子の位置・粒径・速度測定の方法と装置
US20080024532A1 (en) * 2006-07-26 2008-01-31 Si-Kyoung Kim Methods and apparatus for inkjet printing system maintenance
GB0622784D0 (en) * 2006-11-15 2006-12-27 Cambridge Display Technology O Droplet volume control
JP2008183529A (ja) * 2007-01-31 2008-08-14 Seiko Epson Corp 液滴吐出装置
JP4840186B2 (ja) * 2007-02-19 2011-12-21 セイコーエプソン株式会社 チャンバ装置
US7648220B2 (en) * 2007-04-23 2010-01-19 Hewlett-Packard Development Company, L.P. Sensing of fluid ejected by drop-on-demand nozzles
JP4888346B2 (ja) * 2007-11-06 2012-02-29 セイコーエプソン株式会社 液状体の塗布方法、有機el素子の製造方法
US20090184990A1 (en) * 2007-12-06 2009-07-23 Applied Materials, Inc. Methods and apparatus for measuring deposited ink in pixel wells on a substrate using a line scan camera
JP2009189954A (ja) * 2008-02-14 2009-08-27 Seiko Epson Corp 駆動信号設定方法
WO2009149163A2 (en) * 2008-06-06 2009-12-10 Fujifilm Dimatix, Inc. Sensing objects for printing
US8333453B2 (en) * 2008-07-30 2012-12-18 Hewlett-Packard Development Company, L.P. Method of dispensing liquid
JP2009093189A (ja) * 2008-11-17 2009-04-30 Seiko Epson Corp 表示装置の製造方法
JP5287165B2 (ja) * 2008-11-19 2013-09-11 富士ゼロックス株式会社 液滴吐出装置、及びメンテナンスプログラム
JP2010227762A (ja) * 2009-03-26 2010-10-14 Seiko Epson Corp 液滴吐出装置、薄膜形成方法
JP2010231001A (ja) * 2009-03-27 2010-10-14 Toppan Printing Co Ltd パターン形成体の製造方法および製造装置、カラーフィルタの製造方法、インクジェット印刷装置
JP2012139655A (ja) * 2011-01-05 2012-07-26 Seiko Epson Corp 印刷装置
JP5754225B2 (ja) * 2011-04-19 2015-07-29 株式会社リコー トナーの製造方法及びトナーの製造装置
CN103026789B (zh) * 2011-06-03 2016-01-13 株式会社日本有机雷特显示器 有机el显示面板的制造方法以及有机el显示面板的制造装置
JP6659532B2 (ja) * 2013-04-26 2020-03-04 カティーバ, インコーポレイテッド 印刷インク液滴測定および精密な公差内で流体を堆積する制御のための技法
KR20190138705A (ko) * 2013-04-26 2019-12-13 카티바, 인크. 인쇄 잉크 액적 측정 및 정밀 공차 내로 유체를 증착하기 위한 제어 기법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548530B (zh) * 2012-12-27 2016-09-11 凱特伊夫公司 噴墨印刷的方法以及印刷機

Also Published As

Publication number Publication date
CN107364237B (zh) 2019-09-10
TW201906741A (zh) 2019-02-16
TW201509691A (zh) 2015-03-16
CN105142913B (zh) 2017-10-27
JP2020024943A (ja) 2020-02-13
JP6905761B2 (ja) 2021-07-21
CN107364237A (zh) 2017-11-21
JP6781733B2 (ja) 2020-11-04
TWI670184B (zh) 2019-09-01
JP2018120874A (ja) 2018-08-02
CN105142913A (zh) 2015-12-09
KR20190138705A (ko) 2019-12-13
JP2021087949A (ja) 2021-06-10

Similar Documents

Publication Publication Date Title
TWI645984B (zh) 列印機、噴墨列印機及控制噴墨列印機和產生其控制資料之方法
US11489146B2 (en) Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances
US9802403B2 (en) Techniques for print ink droplet measurement and control to deposit fluids within precise tolerances
JP6845829B2 (ja) 改良された速度および正確さをともなう永久層の整列印刷のための技術
JP6659532B2 (ja) 印刷インク液滴測定および精密な公差内で流体を堆積する制御のための技法
TWI648171B (zh) 用於工業印刷之設備,以及用於測量液滴參數之系統和方法