TWI638753B - Adhering device, production system of optical display device, adhering method, and method of producing optical display device - Google Patents

Adhering device, production system of optical display device, adhering method, and method of producing optical display device Download PDF

Info

Publication number
TWI638753B
TWI638753B TW104124415A TW104124415A TWI638753B TW I638753 B TWI638753 B TW I638753B TW 104124415 A TW104124415 A TW 104124415A TW 104124415 A TW104124415 A TW 104124415A TW I638753 B TWI638753 B TW I638753B
Authority
TW
Taiwan
Prior art keywords
layer
bonding
optical display
optical
component
Prior art date
Application number
TW104124415A
Other languages
Chinese (zh)
Other versions
TW201612071A (en
Inventor
土岡達也
田中大充
Original Assignee
日商住友化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商住友化學股份有限公司 filed Critical 日商住友化學股份有限公司
Publication of TW201612071A publication Critical patent/TW201612071A/en
Application granted granted Critical
Publication of TWI638753B publication Critical patent/TWI638753B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
    • B65C9/00—Details of labelling machines or apparatus
    • B65C9/08—Label feeding
    • B65C9/18—Label feeding from strips, e.g. from rolls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7858—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus characterised by the feeding movement of the parts to be joined
    • B29C65/7888—Means for handling of moving sheets or webs
    • B29C65/7891—Means for handling of moving sheets or webs of discontinuously moving sheets or webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7855—Provisory fixing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/834—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools moving with the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
    • B65C9/00—Details of labelling machines or apparatus
    • B65C9/08—Label feeding
    • B65C9/18—Label feeding from strips, e.g. from rolls
    • B65C9/1803—Label feeding from strips, e.g. from rolls the labels being cut from a strip
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
    • B65C9/00—Details of labelling machines or apparatus
    • B65C9/26—Devices for applying labels
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Polarising Elements (AREA)

Abstract

本發明的貼合裝置1係於層片F11的保持動作開始之瞬間的特定期間中，進行將捲取於分離滾筒R2的分離層F3a反捲，讓分離層F3a鬆弛使得層片F11不會從分離層F3a剝離的反捲動作。 In the bonding apparatus 1 of the present invention, the separation layer F3a wound up in the separation drum R2 is rewinded in a specific period immediately after the start of the holding operation of the layer sheet F11, and the separation layer F3a is loosened so that the layer sheet F11 does not escape. The rewinding action of the separation layer F3a peeling off.

Description

貼合裝置、光學顯示設備的生產系統、貼合方法及光學顯示設備的生產方法 Fitting device, production system of optical display device, bonding method, and production method of optical display device

本發明係關於貼合裝置、光學顯示設備的生產系統、貼合方法及光學顯示設備的生產方法。 The present invention relates to a bonding apparatus, a production system of an optical display device, a bonding method, and a production method of the optical display device.

本發明係基於2014年8月6日於日本提出申請之特願第2014-160753號而主張其優先權，並引用其內容。 The present invention claims priority based on Japanese Patent Application No. 2014-160753, filed on Jan.

過去以來，於液晶顯示器等光學顯示設備的生產系統，使用具有彎曲形狀的保持面之貼合頭。 In the past, in a production system of an optical display device such as a liquid crystal display, a bonding head having a curved shape of a holding surface has been used.

即，偏光板等的層片在貼附於表面形成有剝離層的底板(以下，稱為「分離層」。)上之狀態下被供給之情況中，貼合頭之彎曲的保持面沿著層片的表面轉動。藉由此製程製程，能將層片從分離層剝離，並貼附於保持面。 In other words, when a layer sheet such as a polarizing plate is supplied in a state of being attached to a bottom plate (hereinafter referred to as a "separating layer") on which a peeling layer is formed on the surface, the curved holding surface of the bonding head is along The surface of the ply rotates. By this process, the layer can be peeled off from the separation layer and attached to the holding surface.

然後，貼合頭將層片保持於保持面並移動後，彎曲的保持面沿著液晶面板等光學顯示部件的表面轉動。藉由此一連串的製程，能將保持於彎曲的保持面上之層片貼合於光學顯示部件(舉例來說，參照專利文獻 1)。 Then, after the bonding head holds the layer on the holding surface and moves, the curved holding surface rotates along the surface of the optical display member such as the liquid crystal panel. By this series of processes, the layer held on the curved holding surface can be attached to the optical display member (for example, refer to the patent document) 1).

[先前技術文獻] [Previous Technical Literature]

[專利文獻] [Patent Literature]

[專利文獻1]日本特許第4482757號公報 [Patent Document 1] Japanese Patent No. 4482757

然而，於使用具有彎曲形狀的保持面之貼合頭的生產系統，層片中，最先貼附於貼合頭的位置沒有密合於貼合頭。因為這樣，所以層片貼合於光學顯示部件時，容易產生氣泡，該貼合精度下降，會發生層片從貼合頭脫落等貼合不良。 However, in the production system using the bonding head having the curved shape of the holding surface, the position of the layer which is first attached to the bonding head is not adhered to the bonding head. Because of this, when the layer sheet is bonded to the optical display member, air bubbles are likely to be generated, and the bonding accuracy is lowered, and the lamination failure such as peeling of the layer sheet from the bonding head occurs.

另一方面，為了解決此問題，若增強貼合頭的黏著力，在層片以多層薄膜構成的情況下，則會發生只有黏著於貼合頭的薄膜層剝離的問題。並且，於貼合層片後，也會發生光學顯示部件因貼合頭的黏著力抬起而破損的問題。 On the other hand, in order to solve this problem, if the adhesion of the bonding head is enhanced, when the layer is composed of a multilayer film, there is a problem that only the film layer adhered to the bonding head is peeled off. Further, after the lamination of the plies, the optical display member may be damaged by the adhesion of the bonding head.

本發明鑑於這樣的情事，目的在於提供一種可抑制貼合不良的貼合裝置、貼合方法、光學顯示設備的生產系統及光學顯示設備的生產方法。 The present invention has been made in view of such circumstances, and an object of the invention is to provide a bonding apparatus, a bonding method, a production system of an optical display device, and a production method of an optical display device capable of suppressing poor bonding.

關於本發明的第一態樣之貼合裝置係為於光學顯示部件貼合層片的貼合裝置，包含：捲出部，從料捲滾筒與分離層一同捲出光學組件層；切斷部，殘留該分離層地將該光學組件層切斷以形成該層片；層平台，支撐貼附有該層片的分離層；貼合平台，保持該光學顯示部件；貼合組件，具有保持該層片之彎曲的保持面，可藉由一邊將層片(藉由該層平台 從該分離層側所支撐)接觸於該保持面而一邊轉動，來進行將該層片保持於該保持面的保持動作，以及可藉由一邊將保持於該保持面的層片接觸於保持在該貼合平台上的光學顯示部件而一邊轉動，來進行貼合該光學顯示部件的貼合動作；及捲取機構，可進行將通過該層平台的分離層往分離滾筒捲取的捲取動作，以及可於該層片之保持動作開始的瞬間之特定期間中，進行將捲取於該分離滾筒的分離層反捲，讓該分離層鬆弛使得該層片不會從該分離層剝離的反捲動作。 A bonding apparatus according to a first aspect of the present invention is a bonding apparatus for bonding a layer to an optical display member, comprising: a winding portion that winds out an optical component layer together with a separation layer; Retaining the separation layer to cut the optical component layer to form the layer; the layer platform supporting the separation layer to which the layer is attached; the bonding platform to hold the optical display component; and the bonding component having the The curved retaining surface of the ply, which can be layered by one side (by the platform The support layer is rotatably contacted with the holding surface, and the holding operation of holding the layer on the holding surface is performed, and the layer held by the holding surface is held in contact with each other. The optical display member on the bonding platform rotates to perform bonding operation for bonding the optical display member, and the winding mechanism can perform winding operation for winding the separation layer passing through the platform to the separation roller And in a specific period of the moment when the holding operation of the layer is started, the separation layer wound up on the separation drum is rewinded, and the separation layer is relaxed so that the layer does not peel off from the separation layer. Volume action.

關於本發明的第一態樣之貼合裝置中，該捲取機構較佳係由捲取部及夾壓滾筒部構成；該捲取部保持該分離滾筒的同時，可進行該捲取動作及該反捲動作；及該夾壓滾筒部可與該捲取部同步，進行該捲取動作及該反捲動作。 In the first aspect of the present invention, the winding mechanism preferably comprises a winding portion and a nip roller portion; and the winding portion holds the separation roller and performs the winding operation and The rewinding operation and the nip roller unit are synchronized with the winding unit to perform the winding operation and the rewinding operation.

關於本發明的第一態樣之貼合裝置中，該捲取機構較佳係由捲取部構成；該捲取部保持該分離滾筒的同時，可進行該捲取動作及該反捲動作。 In the first aspect of the present invention, the winding mechanism preferably comprises a winding portion, and the winding portion holds the separation roller and performs the winding operation and the rewinding operation.

關於本發明的第一態樣之貼合裝置，較佳係更具備：加壓組件，於該保持動作時，從上方加壓已剝離該層片的分離層。 Preferably, the bonding apparatus according to the first aspect of the present invention further includes: a pressurizing unit that presses the separation layer from which the layer is peeled off from above when the holding operation is performed.

關於本發明的第一態樣之貼合裝置，較佳係更具備：檢測部，檢測保持於該貼合組件的層片相對於該貼合組件之相對位置；及控制裝置，基於該檢測部的檢測結果，相對於保持該層片的貼合組件，控制保持於該貼合平台上的光學顯示部件之相對位置。 Preferably, the bonding apparatus of the first aspect of the present invention further includes: a detecting unit that detects a relative position of the layer held by the bonding unit with respect to the bonding unit; and a control device based on the detecting unit As a result of the detection, the relative position of the optical display member held on the bonding platform is controlled with respect to the bonding assembly holding the layer.

關於本發明的第一態樣之貼合裝置，較佳係更具有：檢測構件，檢測印記於該光學組件層的缺陷標記；其中，該貼合組件將檢測出該光學組件層的缺陷標記之部位保持於保持面，並搬送於廢棄位置。 The bonding apparatus of the first aspect of the present invention preferably further includes: a detecting member that detects a defect mark imprinted on the optical component layer; wherein the bonding component detects the defect mark of the optical component layer The part is held on the holding surface and transported to the disposal position.

關於本發明的第一態樣之光學顯示設備的生產系統係為於 光學顯示部件貼合光學組件來形成光學顯示設備的生產系統，包含：貼合裝置，於該光學顯示部件貼合作為該光學組件的層片；其中，該貼合裝置係為關於本發明的第一態樣之貼合裝置。 The production system of the optical display device according to the first aspect of the present invention is The optical display component is attached to the optical component to form a production system of the optical display device, comprising: a bonding device, wherein the optical display component is bonded to form a layer of the optical component; wherein the bonding device is related to the invention A fitting device.

關於本發明的第二態樣之光學顯示設備的生產系統係為於光學顯示部件貼合光學組件來形成光學顯示設備的生產系統，包含：貼合裝置，於該光學顯示部件貼合較該光學組件大的層片；檢測裝置，拍攝貼合有該層片的光學顯示部件，基於此拍攝資訊，檢測該層片的切斷線；及切斷裝置，藉由沿該切斷線切斷貼合於該光學顯示部件的層片，以從該層片切出該光學組件；其中，該貼合裝置係為關於本發明的第一態樣之貼合裝置。 A production system for an optical display device according to a second aspect of the present invention is a production system in which an optical display member is bonded to an optical component to form an optical display device, comprising: a bonding device, wherein the optical display member is attached to the optical device a large layer of components; a detecting device that captures an optical display component to which the layer is attached, detects a cutting line of the layer based on the shooting information; and a cutting device, which cuts the sticker along the cutting line A ply of the optical display member is incorporated to cut the optical component from the ply; wherein the laminating device is a bonding device in accordance with the first aspect of the present invention.

關於本發明的第一態樣之貼合方法係為於光學顯示部件貼合層片的貼合方法，具有：捲出製程，從料捲滾筒與分離層一同捲出光學組件層；切斷製程，殘留該分離層地將該光學組件層切斷以形成該層片；保持製程，對於藉由層平台從該分離層側支撐的層片，藉由一邊接觸貼合組件的保持面，而一邊轉動該貼合組件，來將該層片保持於該保持面；貼合製程，將保持於該保持面的層片一邊接觸保持於貼合平台上的光學顯示部件，而一邊轉動該貼合組件，來將該層片貼合於該光學顯示部件；捲取製程，將通過該層平台的分離層往分離滾筒捲取；及反捲製程，於該層片之保持動作開始的瞬間之特定期間中，將捲取於該分離滾筒的分離層反捲，讓該分離層鬆弛使得該層片不會從該分離層剝離。 The bonding method of the first aspect of the present invention is a method for bonding an optical display member to a laminated sheet, comprising: a winding-out process for winding the optical component layer together with the separation layer from the winding roller; And leaving the optical component layer to form the layer; the process is maintained, and the layer supported from the side of the separation layer by the layer platform is contacted by the holding surface of the bonding component while Rotating the bonding assembly to hold the layer on the holding surface; the bonding process rotates the bonding component while contacting the optical display member held on the bonding platform by the layer held on the holding surface And attaching the layer to the optical display member; the winding process, winding the separation layer through the layer platform to the separation roller; and the rewinding process, during a specific period of the moment when the layer holding operation is started In the process, the separation layer wound up on the separation drum is rewinded, and the separation layer is allowed to relax so that the layer does not peel off from the separation layer.

關於本發明的第一態樣之光學顯示設備的生產方法係為係為於光學顯示部件貼合光學組件來形成光學顯示設備的生產方法，包含：貼合製程，於該光學顯示部件貼合作為該光學組件的層片；其中，該貼合製程係使用關於本發明的第一態樣之貼合方法來進行。 A method of producing an optical display device according to a first aspect of the present invention is a method for producing an optical display device by bonding an optical component to an optical display member, comprising: a bonding process, wherein the optical display component is bonded to A ply of the optical component; wherein the lamination process is carried out using a bonding method in accordance with the first aspect of the present invention.

關於本發明的第二態樣之光學顯示設備的生產方法係為於光學顯示部件貼合光學組件來形成光學顯示設備的生產方法，包含：貼合製程，於該光學顯示部件貼合較該光學組件大的層片；檢測製程，拍攝貼合有該層片的光學顯示部件，基於此拍攝資訊，檢測該層片的切斷線；及切斷製程，藉由沿該切斷線切斷貼合於該光學顯示部件的層片，以從該層片切出該光學組件；其中，該貼合製程係使用關於本發明的第一態樣之貼合方法來進行。 A method for producing an optical display device according to a second aspect of the present invention is a method for producing an optical display device by bonding an optical component to an optical display member, comprising: a bonding process, wherein the optical display member is attached to the optical device a large layer of components; a detection process, photographing an optical display component to which the layer is attached, detecting a cutting line of the layer based on the shooting information; and cutting the process by cutting the sticker along the cutting line A ply of the optical display member is incorporated to cut the optical component from the ply; wherein the lamination process is performed using a bonding method in accordance with the first aspect of the present invention.

根據本發明，能提供一種可抑制貼合不良的貼合裝置、貼合方法、光學顯示設備的生產系統及光學顯示設備的生產方法。 According to the present invention, it is possible to provide a bonding apparatus, a bonding method, a production system of an optical display device, and a production method of an optical display device which can suppress poor bonding.

1-4‧‧‧貼合裝置 1-4‧‧‧Fitting device

10‧‧‧層搬送裝置 10‧‧‧layer conveyor

11‧‧‧捲出部 11‧‧‧Departure

12‧‧‧切斷部 12‧‧‧cutting department

13‧‧‧層平台 13‧‧‧ platform

14‧‧‧貼合平台 14‧‧‧Fitting platform

15‧‧‧貼合頭 15‧‧‧Fitting head

15a‧‧‧保持面 15a‧‧‧ Keep face

15b‧‧‧旋轉軸 15b‧‧‧Rotary axis

16‧‧‧頭部驅動裝置 16‧‧‧ head drive

17‧‧‧捲取部 17‧‧‧Winding Department

18‧‧‧夾壓滾筒部 18‧‧‧ pinch roller

18a‧‧‧第一夾壓滾筒 18a‧‧‧First pinch roller

18b‧‧‧第二夾壓滾筒 18b‧‧‧Second pinch roller

19‧‧‧頭部裝置 19‧‧‧ head unit

25‧‧‧控制裝置 25‧‧‧Control device

31‧‧‧層搬送裝置 31‧‧‧ layer conveyor

31a‧‧‧捲出部 31a‧‧‧Departure

31b‧‧‧切斷裝置 31b‧‧‧cutting device

31c‧‧‧刀刃 31c‧‧‧ Blade

31d‧‧‧捲取部 31d‧‧‧Winding Department

31e‧‧‧端部 31e‧‧‧End

32‧‧‧貼合筒 32‧‧‧Fitting tube

32a‧‧‧保持面 32a‧‧‧ Keep face

33‧‧‧層平台 33‧‧‧ platform

34‧‧‧第一檢測攝影機 34‧‧‧First inspection camera

35‧‧‧第二檢測攝影機 35‧‧‧Second detection camera

36‧‧‧第三檢測攝影機 36‧‧‧ Third detection camera

40‧‧‧貼合部 40‧‧‧Fitting Department

41‧‧‧萜合平台 41‧‧‧Combined platform

42‧‧‧驅動裝置 42‧‧‧ drive

50‧‧‧控制裝置 50‧‧‧Control device

183‧‧‧拍攝裝置 183‧‧‧Photographing device

184‧‧‧切斷裝置 184‧‧‧cutting device

185‧‧‧切斷平台 185‧‧‧ cut off the platform

189‧‧‧檢測裝置 189‧‧‧Detection device

190‧‧‧控制裝置 190‧‧‧Control device

1000‧‧‧生產系統 1000‧‧‧Production System

1001‧‧‧洗淨裝置 1001‧‧‧cleaning device

1002‧‧‧第一貼合裝置 1002‧‧‧First bonding device

1003‧‧‧第二貼合裝置 1003‧‧‧Second fitting device

1004‧‧‧剝離裝置 1004‧‧‧ peeling device

1005‧‧‧第三貼合裝置 1005‧‧‧ Third bonding device

1006‧‧‧檢查裝置 1006‧‧‧Checking device

2000‧‧‧生產系統 2000‧‧‧Production System

2001‧‧‧洗淨裝置 2001‧‧‧cleaning device

2002‧‧‧第一貼合裝置 2002‧‧‧First bonding device

2003‧‧‧第一切斷裝置 2003‧‧‧First cutting device

2004‧‧‧第二貼合裝置 2004‧‧‧Second fitting device

2005‧‧‧第二切斷裝置 2005‧‧‧Second cutting device

2006‧‧‧剝離裝置 2006‧‧‧ peeling device

2007‧‧‧第三貼合裝置 2007‧‧‧ Third bonding device

2008‧‧‧第三切斷裝置 2008‧‧‧ Third cutting device

2009‧‧‧檢查裝置 2009‧‧‧Inspection device

AFD‧‧‧轉動方向 AFD‧‧‧ direction of rotation

CL‧‧‧切割線 CL‧‧‧ cutting line

CP‧‧‧檢查點 CP‧‧‧ checkpoint

DP‧‧‧光學顯示設備 DP‧‧‧Optical display device

EL‧‧‧邊緣線 EL‧‧‧ edge line

Ep1‧‧‧起點 The starting point of Ep1‧‧

Ep2‧‧‧終點 Ep2‧‧‧ End

F1‧‧‧光學組件層 F1‧‧‧ optical component layer

F11‧‧‧層片 F11‧‧‧ layer

F11e‧‧‧端部 F11e‧‧‧ end

F1a‧‧‧光學組件本體 F1a‧‧‧Optical component body

F2a‧‧‧黏著層 F2a‧‧‧Adhesive layer

F3a‧‧‧分離層 F3a‧‧‧Separation layer

F3a1‧‧‧彎曲部 F3a1‧‧‧Bend

F4a‧‧‧表面保護薄膜 F4a‧‧‧Surface protection film

F5‧‧‧貼合層 F5‧‧‧Fitting layer

F6‧‧‧偏光鏡 F6‧‧‧ polarizer

F7‧‧‧第一薄膜 F7‧‧‧ first film

F8‧‧‧第二薄膜 F8‧‧‧second film

FB‧‧‧第一區域 FB‧‧‧ first area

FO‧‧‧光學組件 FO‧‧‧Optical components

FS‧‧‧第二區域 FS‧‧‧Second area

G1‧‧‧導引滾筒 G1‧‧‧ Guide roller

G2‧‧‧導引滾筒 G2‧‧‧ Guide roller

GR1‧‧‧導引滾筒 GR1‧‧‧ Guide roller

GR2‧‧‧導引滾筒 GR2‧‧‧ Guide roller

GR3‧‧‧導引滾筒 GR3‧‧‧ Guide roller

GR4‧‧‧加壓滾筒 GR4‧‧‧Pressure roller

Lc‧‧‧攝影機間隔距離 Lc‧‧‧ camera separation distance

Le‧‧‧距離 Le‧‧‧ distance

P‧‧‧光學顯示部件 P‧‧‧Optical display parts

P4‧‧‧顯示區域 P4‧‧‧ display area

Pm‧‧‧標記 Pm‧‧‧ mark

Pm1‧‧‧第一標記 Pm1‧‧‧ first mark

Pm2‧‧‧第二標記 Pm2‧‧‧ second mark

Pm3‧‧‧第三標記 Pm3‧‧‧ third mark

R1‧‧‧料捲滾筒 R1‧‧‧ Roller

R2‧‧‧分離滾筒 R2‧‧‧Separation roller

WCL‧‧‧切斷線 WCL‧‧‧ cut line

α‧‧‧角度 ‧‧‧‧ angle

θmax‧‧‧最大偏移角 Maxmax‧‧‧maximum offset angle

θmid‧‧‧最小偏移角 Midmid‧‧‧minimum offset angle

θmin‧‧‧平均偏移角 Θmin‧‧‧average offset angle

〔圖1〕係為關於本發明的第一實施形態之貼合裝置的側面概略圖。 Fig. 1 is a schematic side view showing a bonding apparatus according to a first embodiment of the present invention.

〔圖2A〕係為關於本發明的第一實施形態之貼合裝置的動作說明圖。 FIG. 2A is an operation explanatory view of the bonding apparatus according to the first embodiment of the present invention.

〔圖2B〕係為關於本發明的第一實施形態之貼合裝置的動作說明圖。 Fig. 2B is an operation explanatory view of the bonding apparatus according to the first embodiment of the present invention.

〔圖2C〕係為關於本發明的第一實施形態之貼合裝置的動作說明圖。 Fig. 2C is an operation explanatory view of the bonding apparatus according to the first embodiment of the present invention.

〔圖2D〕係為關於本發明的第一實施形態之貼合裝置的動作說明圖。 Fig. 2D is an operation explanatory view of the bonding apparatus according to the first embodiment of the present invention.

〔圖3〕係為偏光薄膜的剖面示意圖。 [Fig. 3] is a schematic cross-sectional view of a polarizing film.

〔圖4〕係為關於本發明的第二實施形態之貼合裝置的側面概略圖。 Fig. 4 is a schematic side view showing a bonding apparatus according to a second embodiment of the present invention.

〔圖5〕係為關於本發明的第三實施形態之貼合裝置的側面概略圖。 Fig. 5 is a schematic side view showing a bonding apparatus according to a third embodiment of the present invention.

〔圖6A〕係為關於本發明的第三實施形態之貼合裝置的動作說明圖。 Fig. 6A is an operation explanatory view of a bonding apparatus according to a third embodiment of the present invention.

〔圖6B〕係為關於本發明的第三實施形態之貼合裝置的動作說明圖。 Fig. 6B is an operation explanatory view of the bonding apparatus according to the third embodiment of the present invention.

〔圖6C〕係為關於本發明的第三實施形態之貼合裝置的動作說明圖。 Fig. 6C is an operation explanatory view of the bonding apparatus according to the third embodiment of the present invention.

〔圖6D〕係為關於本發明的第三實施形態之貼合裝置的動作說明圖。 Fig. 6D is an operation explanatory view of the bonding apparatus according to the third embodiment of the present invention.

〔圖7〕係為關於本發明的第四實施形態之貼合裝置的側面概略圖。 Fig. 7 is a schematic side view showing a bonding apparatus according to a fourth embodiment of the present invention.

〔圖8〕係為用於說明層片相對於貼合頭的相對位置之檢測的圖。 Fig. 8 is a view for explaining the detection of the relative position of the layer sheet with respect to the bonding head.

〔圖9A〕係為用於說明相對於層片之貼合平台的相對位置之修正的圖。 Fig. 9A is a view for explaining correction of the relative position with respect to the bonding platform of the ply.

〔圖9B〕係為用於說明相對於層片之貼合平台的相對位置之修正的圖。 FIG. 9B is a view for explaining correction of the relative position with respect to the bonding platform of the ply.

〔圖10〕係為關於本發明的第五實施形態之光學顯示設備的生產系統之概略圖。 Fig. 10 is a schematic view showing a production system of an optical display device according to a fifth embodiment of the present invention.

〔圖11〕係為關於本發明的第六實施形態之層片切斷製程的說明圖。 Fig. 11 is an explanatory view showing a layer cutting process according to a sixth embodiment of the present invention.

〔圖12A〕係為說明決定關於本發明的第六實施形態之層片的貼合位置之方法的說明圖。 [ Fig. 12A] is an explanatory view for explaining a method of determining a bonding position of a layer sheet according to a sixth embodiment of the present invention.

〔圖12B〕係為說明決定關於本發明的第六實施形態之層片的貼合位置之方法的說明圖。 [Fig. 12B] is an explanatory view for explaining a method of determining a bonding position of a layer sheet according to a sixth embodiment of the present invention.

〔圖13〕係為關於本發明的第六實施形態之光學顯示設備的生產系統之概略圖。 Fig. 13 is a schematic view showing a production system of an optical display device according to a sixth embodiment of the present invention.

〔第一實施形態〕 [First Embodiment]

以下，使用圖1至圖3，來說明關於本發明的第一實施形態之貼合裝置。 Hereinafter, a bonding apparatus according to a first embodiment of the present invention will be described with reference to Figs. 1 to 3 .

圖1係為本實施形態的貼合裝置1之側面概略圖。本實施形態的貼合裝置1係於光學顯示部件P的一面，貼合半切斷長條狀的光學組件層F1而得的層片F11。 Fig. 1 is a schematic side view showing a bonding apparatus 1 of the present embodiment. The bonding apparatus 1 of the present embodiment is a layer sheet F11 obtained by laminating an optical component layer F1 of a semi-cut shape on one surface of the optical display member P.

舉例來說，就光學顯示部件P而言，能使用液晶面板或有機電致發光(OEL,Organic Electro-Luminescence)面板等的面板狀之光學顯示部件。舉例來說，就光學組件層F1而言，能使用偏光薄膜、相位差薄膜、輝度增加薄膜等。舉例來說，本實施形態中，就光學組件層F1而言，使用如圖3所示之偏光薄膜。 For example, as the optical display member P, a panel-shaped optical display member such as a liquid crystal panel or an organic electroluminescence (OEL) panel can be used. For example, as the optical component layer F1, a polarizing film, a retardation film, a luminance increasing film, or the like can be used. For example, in the present embodiment, as the optical component layer F1, a polarizing film as shown in FIG. 3 is used.

圖3的光學組件層F1係包含：薄膜狀的光學組件本體F1a、設置於光學組件本體F1a的一側之面(圖3的上側面)的黏著層F2a、隔著黏著層F2a而可分離地層積於光學組件本體F1a的一側之面的分離層F3a、及層積於光學組件本體F1a的另一側之面(圖3的下側面)之表面保護薄膜F4a。 The optical component layer F1 of FIG. 3 includes a film-shaped optical component body F1a, an adhesive layer F2a provided on one side of the optical component body F1a (upper side in FIG. 3), and a separable layer interposed via the adhesive layer F2a. A separation layer F3a which is formed on one surface of the optical module body F1a, and a surface protection film F4a which is laminated on the other side of the optical module body F1a (the lower side of FIG. 3).

舉例來說，光學組件本體F1a有作為偏光板之功能，貼合於光學顯示部件P的顯示區域全部、或橫跨貼合於顯示區域及其周邊區域。光學組件本體F1a係於其一側之面殘留有黏著層F2a且與分離層F3a分離之狀 態下，隔著黏著層F2a貼合於光學顯示部件P。以下，從光學組件層F1去除分離層F3a後的部分稱為貼合層F5。層片F11係為將長條狀的貼合層F5以特定尺寸切斷而得的貼合層F5之層片。 For example, the optical module body F1a has a function as a polarizing plate, and is attached to all of the display regions of the optical display member P or across the display region and its peripheral regions. The optical module body F1a has an adhesive layer F2a remaining on one side thereof and separated from the separation layer F3a. In the state, the optical display member P is bonded to each other via the adhesive layer F2a. Hereinafter, a portion after the separation layer F3a is removed from the optical module layer F1 is referred to as a bonding layer F5. The layer sheet F11 is a layer sheet of the bonding layer F5 obtained by cutting the long strip-shaped bonding layer F5 into a specific size.

從黏著層F2a分離前之期間，分離層F3a保護黏著層F2a及光學組件本體F1a。表面保護薄膜F4a係與光學組件本體F1a一起保護光學顯示部件P。另外，光學組件層F1亦可為不包含表面保護薄膜F4a之構成，表面保護薄膜F4a亦可為無法從光學組件本體F1a分離之構成。 The separation layer F3a protects the adhesive layer F2a and the optical module body F1a from the time before the separation from the adhesive layer F2a. The surface protective film F4a protects the optical display member P together with the optical module body F1a. Further, the optical component layer F1 may be configured not to include the surface protective film F4a, and the surface protective film F4a may not be separated from the optical module body F1a.

光學組件本體F1a係具有：層狀的偏光鏡F6、於偏光鏡F6的一側之面以接著劑等接合的第一薄膜F7、及於偏光鏡F6的另一側之面以接著劑等接合的第二薄膜F8。舉例來說，第一薄膜F7及第二薄膜F8係為保護偏光鏡F6的保護薄膜。 The optical module main body F1a has a layered polarizer F6, a first film F7 joined to one surface of the polarizer F6 by an adhesive or the like, and a surface of the other side of the polarizer F6 joined by an adhesive or the like. The second film F8. For example, the first film F7 and the second film F8 are protective films for protecting the polarizer F6.

如圖1所示，舉例來說，本實施形態的貼合裝置1係包含：層搬送裝置10、頭部裝置19、貼合平台14、及控制裝置50。 As shown in FIG. 1 , for example, the bonding apparatus 1 of the present embodiment includes a layer conveying device 10 , a head device 19 , a bonding platform 14 , and a control device 50 .

舉例來說，層搬送裝置10係包含：捲出部11、切斷部12、層平台13、捲取部17、及夾壓滾筒部18。層搬送裝置10係具有：複數導引滾筒G1,G2，將光學組件層F1沿著特定的搬送路徑捲繞。 For example, the layer conveying device 10 includes a winding portion 11 , a cutting portion 12 , a layer platform 13 , a winding portion 17 , and a nip roller portion 18 . The layer conveyance device 10 has a plurality of guide rollers G1 and G2 that wind the optical component layer F1 along a specific conveyance path.

捲出部11保持捲繞長條狀的光學組件層F1之料捲滾筒R1的同時，將光學組件層F1從料捲滾筒R1與分離層F3a一同朝長邊方向捲出。舉例來說，光學組件層F1在與其搬送方向垂直的水平方向(層寬度方向)，具有與光學顯示部件P的顯示區域之第一邊(舉例來說，短邊側)長度相同之寬度。 While the winding portion 11 holds the roll drum R1 of the long optical component layer F1, the optical module layer F1 is taken up from the roll drum R1 and the separation layer F3a in the longitudinal direction. For example, the optical component layer F1 has a width equal to the length of the first side (for example, the short side) of the display region of the optical display member P in the horizontal direction (layer width direction) perpendicular to the conveyance direction.

以下，光學組件層F1(分離層F3a)從捲出部11捲出並搬送的方向稱為層搬送方向。並且，層搬送方向的上游側稱為層搬送上游側，層搬送方向的下游側稱為層搬送下游側。 Hereinafter, the direction in which the optical component layer F1 (separation layer F3a) is taken up and transported from the unwinding portion 11 is referred to as a layer transport direction. Further, the upstream side in the layer transport direction is referred to as the layer transport upstream side, and the downstream side in the layer transport direction is referred to as the layer transport downstream side.

切斷部12係將從料捲滾筒R1捲出的光學組件層F1，殘留分 離層F3a地朝厚度方向切斷，以形成層片F11(以下，將這樣的切斷方式稱為「半切斷」。)。舉例來說，切斷部12係在與光學組件層F1之層寬度方向垂直的長度方向，只要每捲出光學顯示部件P的顯示區域之第二邊(舉例來說，長邊側)長度相同的長度，便橫跨層寬度方向的整個寬度，半切斷光學組件層F1。 The cutting portion 12 is an optical component layer F1 that is unwound from the roll drum R1, and has a residual portion. The layer F3a is cut in the thickness direction to form the layer sheet F11 (hereinafter, such a cutting method is referred to as "semi-cut"). For example, the cutting portion 12 is in the longitudinal direction perpendicular to the layer width direction of the optical component layer F1 as long as the second side (for example, the long side) of the display region of the optical display member P is wound up to have the same length The length is across the entire width of the layer width direction, and the optical component layer F1 is half cut.

於半切斷後的光學組件層F1，形成橫跨光學組件層F1的層寬度方向之整個寬度的切割線。光學組件層F1藉由切割線，於長邊方向，劃分出具有相當於顯示區域的第二邊長度之長度的分區。此分區各自成為貼合層F5中的一個層片F11。 The optical component layer F1 after the half cut is formed into a dicing line spanning the entire width of the optical component layer F1 in the layer width direction. The optical component layer F1 divides a section having a length corresponding to the length of the second side of the display region in the longitudinal direction by the dicing line. This partition each becomes a layer F11 in the bonding layer F5.

層平台13支撐從料捲滾筒R1捲出的光學組件層F1支下面(如圖3中所示的分離層F3a側的面)。舉例來說，層平台13橫跨藉由切斷部12半切斷光學組件層F1的切斷位置、及層片F11從分離層剝離的剝離位置兩者來設置。藉由該半切斷來形成層片F11後，層平台13支撐貼附有層片F11的分離層F3a。 The layer stage 13 supports the lower side of the optical component layer F1 taken up from the take-up reel R1 (the side on the side of the separation layer F3a as shown in Fig. 3). For example, the layer stage 13 is provided across both the cutting position at which the optical module layer F1 is half-cut by the cutting portion 12 and the peeling position at which the layer F11 is peeled off from the separation layer. After the layer sheet F11 is formed by the half cut, the layer stage 13 supports the separation layer F3a to which the layer sheet F11 is attached.

捲取部17保持分離滾筒R2的同時，藉由貼合頭15從分離層F3a剝離層片F11後，將通過層平台13的分離層F3a往分離滾筒R2捲取。捲取部17藉由與後述的夾壓滾筒部18同步旋轉，來進行分離層F3a的捲取及反捲。 While the winding portion 17 holds the separation roller R2, the separation sheet F11 is peeled off from the separation layer F3a by the bonding head 15, and then the separation layer F3a passing through the layer stage 13 is taken up to the separation roller R2. The winding unit 17 performs winding and rewinding of the separation layer F3a by rotating in synchronization with a nip roller unit 18 to be described later.

夾壓滾筒部18係包含：於旋轉軸方向相互平行配置的第一夾壓滾筒18a及第二夾壓滾筒18b。第一夾壓滾筒18a及第二夾壓滾筒18b藉由相互同步旋轉，能夠將分離層F3a從層搬送上游側朝層搬送下游側(往捲取部17捲取的方向)搬送、或將分離層F3a從層搬送下游側朝層搬送上游側(從捲取部17反捲的方向)搬送。夾壓滾筒部18可進行將捲取於分離滾筒R2的分離層F3a反捲，讓該分離層F3a鬆弛使得層片F11不會從分離層F3a剝離的反捲動 作。 The nip roller portion 18 includes a first nip roller 18a and a second nip roller 18b that are disposed in parallel with each other in the rotation axis direction. The first nip roller 18a and the second nip roller 18b are rotated in synchronization with each other, and the separation layer F3a can be transported from the layer transport upstream side toward the layer transport downstream side (the direction taken up by the take-up portion 17) or separated. The layer F3a is conveyed from the layer transport downstream side toward the layer transport upstream side (the direction in which the take-up portion 17 is reversed). The nip roller portion 18 is capable of rewinding the separation layer F3a wound up on the separation roller R2, and relaxing the separation layer F3a so that the layer F11 is not peeled off from the separation layer F3a. Work.

因此，捲取部17及夾壓滾筒部18構成捲取機構，可進行以下動作：將通過層平台13的分離層F3a往分離滾筒R2捲取的捲取動作、及將捲取於分離滾筒R2的分離層F3a反捲的反捲動作。 Therefore, the winding unit 17 and the nip roller unit 18 constitute a winding mechanism, and the winding operation of winding the separation layer F3a of the layer platform 13 to the separation drum R2 and winding it on the separation drum R2 can be performed. The separation layer F3a reverses the rewinding action.

舉例來說，頭部裝置19係包含：貼合頭15、及頭部驅動裝置16。 For example, the head device 19 includes a fitting head 15 and a head driving device 16.

貼合頭15(貼合組件)係具有：可保持層片F11的保持面15a。保持面15a平行於光學組件層F1的層寬度方向，並為朝層片F11彎曲的曲面。即，保持面15a沿著光學組件層F1的進行方向彎曲。舉例來說，保持面15a係為將黏著性的矽氧橡膠等作為材料的黏著層之黏著面。保持面15a例如具有較層片F11的貼合面弱的黏著力，可反覆貼附、剝離層片F11的表面保護薄膜F4a。 The bonding head 15 (a bonding assembly) has a holding surface 15a that can hold the layer F11. The holding surface 15a is parallel to the layer width direction of the optical component layer F1 and is a curved surface curved toward the layer sheet F11. That is, the holding surface 15a is curved along the proceeding direction of the optical component layer F1. For example, the holding surface 15a is an adhesive surface of an adhesive layer using an adhesive silicone rubber or the like as a material. The holding surface 15a has, for example, a weak adhesive force to the bonding surface of the layer sheet F11, and the surface protective film F4a of the layer sheet F11 can be peeled off and peeled off.

頭部驅動裝置16能將貼合頭15轉動於光學組件層F1上及光學顯示部件P上。即，頭部驅動裝置16可將貼合頭15以旋轉軸15b為軸心旋轉並水平移動。並且，頭部驅動裝置16能將貼合頭15於垂直方向升降。 The head driving device 16 can rotate the bonding head 15 on the optical component layer F1 and the optical display component P. That is, the head driving device 16 can rotate the bonding head 15 about the rotation axis 15b and move it horizontally. Further, the head driving device 16 can raise and lower the bonding head 15 in the vertical direction.

控制裝置50係包含電腦系統來構成。電腦系統係包含：CPU等的計算處理部、記憶體或硬碟等的記憶部。控制裝置50係包含能與電腦系統的外部裝置進行通訊的介面，來統一控制構成貼合裝置1的各種裝置及貼合裝置1的外部各種裝置之動作。 The control device 50 is constructed by including a computer system. The computer system includes a calculation unit of a CPU or the like, a memory unit such as a memory or a hard disk. The control device 50 includes an interface that can communicate with an external device of the computer system to collectively control the operations of various devices constituting the bonding device 1 and various external devices of the bonding device 1.

藉由控制裝置50控制頭部驅動裝置16，貼合頭15能進行升降運動、及層搬送裝置10與貼合平台14間的水平移動。並且，藉由控制裝置50控制頭部驅動裝置16，貼合頭15能進行以下動作：一邊將保持面15a接觸於層片F11(該層片F11藉由層平台13從分離層F3a側所支撐)而一邊轉動，來將層片F11保持於保持面15a的保持動作；及一邊將保持於保持面15a的層片 F11接觸於保持在貼合平台14上的光學顯示部件P而一邊轉動，來貼合於光學顯示部件P的貼合動作。 The head driving device 16 is controlled by the control device 50, and the bonding head 15 can perform the lifting movement and the horizontal movement between the layer conveying device 10 and the bonding platform 14. Further, when the head driving device 16 is controlled by the control device 50, the bonding head 15 can perform the following operation: the holding surface 15a is brought into contact with the layer F11 (the layer F11 is supported by the layer platform 13 from the side of the separation layer F3a) While rotating, the layer F11 is held by the holding surface 15a; and the layer held by the holding surface 15a F11 is rotated by contact with the optical display member P held by the bonding stage 14, and is bonded to the optical display member P.

舉例來說，貼合平台14藉由吸附光學顯示部件P的下面(與貼合層片F11的面相反側之面)，來保持光學顯示部件P。 For example, the bonding platform 14 holds the optical display member P by adsorbing the lower surface of the optical display member P (the surface opposite to the surface on which the layer F11 is bonded).

以下，使用圖2A至圖2D，來說明貼合層F5貼附至貼合頭15的動作。 Hereinafter, an operation of attaching the bonding layer F5 to the bonding head 15 will be described with reference to FIGS. 2A to 2D.

首先，貼合頭15水平移動至前述層片之剝離位置的垂直上方之位置為止(以下，將此位置稱為「待機位置」。)。於待機位置，貼合頭15以旋轉軸15b為軸心旋轉，使得保持面15a的層搬送下游側末端位於最垂直下方。在此狀態，貼合頭15在進行半切斷期間，於待機位置待機。 First, the bonding head 15 is horizontally moved to a position vertically above the peeling position of the layer (hereinafter, this position is referred to as a "standby position"). In the standby position, the bonding head 15 is rotated about the rotation axis 15b so that the layer conveyance downstream end of the holding surface 15a is located at the most vertical lower side. In this state, the bonding head 15 stands by at the standby position during the half-cut period.

在貼合層F5的層搬送下游側之端部F11e到達待機於待機位置之貼合頭15的保持面15a之層搬送下游側末端的下方之時機，捲出部11、捲取部17及夾壓滾筒部18暫時停止驅動。 When the end portion F11e on the layer transport downstream side of the bonding layer F5 reaches the lower side of the layer transport downstream end of the holding surface 15a of the bonding head 15 waiting for the standby position, the winding portion 11, the winding portion 17, and the clip The press roller unit 18 temporarily stops driving.

接著，控制裝置50藉由切斷部12實施貼合層F5的半切斷。藉此，如圖2A所示，貼合層F5的層搬送下游側之部分中，切出與光學顯示部件P的顯示區域之第二邊(舉例來說，長邊側)長度相同的長度之部分，作為層片F11。 Next, the control device 50 performs half cutting of the bonding layer F5 by the cutting unit 12. Thereby, as shown in FIG. 2A, in the portion on the downstream side of the layer conveyance of the bonding layer F5, the length of the second side (for example, the long side) of the display region of the optical display member P is cut out to the same length. Partly, as a layer F11.

藉由上述的半切斷形成層片F11後，如圖2A所示，貼合頭15藉由頭部驅動裝置16下降特定量。藉此，貼合層F5的層搬送下游側之端部F11e鄰接於保持面15a的層搬送下游側之端部15e，並貼附於保持面15a。 After the layer sheet F11 is formed by the above-described half cut, as shown in FIG. 2A, the bonding head 15 is lowered by the head driving device 16 by a specific amount. Thereby, the end portion F11e on the layer transport downstream side of the bonding layer F5 is adjacent to the end portion 15e on the layer transport downstream side of the holding surface 15a, and is attached to the holding surface 15a.

於此之後，如圖2B所示，頭部驅動裝置16將貼附於保持面15a的層片F11朝捲取方向(圖2B中的逆時針旋轉方向)旋轉於貼合頭15，與此同步，將貼合頭15往層搬送上游側(圖中的左側)移動。藉此，於保持面15a貼附整個層片F11。 After that, as shown in FIG. 2B, the head driving device 16 rotates the layer F11 attached to the holding surface 15a in the winding direction (counterclockwise rotation direction in FIG. 2B) to the bonding head 15, in synchronization with this. The bonding head 15 is moved to the upstream side (the left side in the drawing) of the layer. Thereby, the entire layer sheet F11 is attached to the holding surface 15a.

此處，層片F11貼附於貼合頭15時，捲取部17(參照圖1)及夾壓滾筒部18與貼合頭15的旋轉及移動同步地旋轉驅動，讓分離層F3a往反捲方向，使得層片F11的端部F11e持續密合於保持面15a的狀態。藉此，分離層F3a輸送於層搬送上游側(圖2B中的左側)，變成產生鬆弛的狀態。藉由將層片F11的端部F11e持續密合於保持面15a的狀態，層片F11的端部F11e變得確實地貼附於保持面15a。 Here, when the layer F11 is attached to the bonding head 15, the winding portion 17 (see FIG. 1) and the nip roller portion 18 are rotationally driven in synchronization with the rotation and movement of the bonding head 15, and the separation layer F3a is reversed. The winding direction is such that the end portion F11e of the layer F11 is kept in close contact with the holding surface 15a. Thereby, the separation layer F3a is conveyed to the layer conveyance upstream side (the left side in FIG. 2B), and it becomes a state which becomes slack. By keeping the end portion F11e of the layer sheet F11 in close contact with the holding surface 15a, the end portion F11e of the layer sheet F11 is surely attached to the holding surface 15a.

貼合頭15為了貼附層片F11，繼續該旋轉及移動。 The bonding head 15 continues the rotation and movement in order to attach the layer F11.

藉此，如圖2B所示，通過層平台13的分離層F3a變成具有朝層搬送上游側彎曲的彎曲部F3a1之狀態。 As a result, as shown in FIG. 2B, the separation layer F3a passing through the layer stage 13 is in a state of having the curved portion F3a1 bent toward the upstream side of the layer conveyance.

如圖2C所示，捲取部17(參照圖1)及夾壓滾筒部18於特定的期間結束後，旋轉驅動使分離層F3a往捲取方向(圖2C中的右側)。藉此，於層片F11及分離層F3a的交界面，產生剝離兩者的力。藉此，能從層片F11剝離分離層F3a。於此之間，彎曲部F3a1逐漸變小，最後會消失。此處，舉例來說，捲取部17及夾壓滾筒部18的旋轉方向從逆時針方向切換成順時針方向的時機，係層片F11完成5%-70%貼附至保持面15a的時機，較佳係完成10%-50%的時機。 As shown in FIG. 2C, after the winding up portion 17 (see FIG. 1) and the nip roller portion 18 are completed for a predetermined period of time, the separation layer F3a is rotationally driven in the winding direction (the right side in FIG. 2C). Thereby, the force of both peeling is generated at the interface of the layer F11 and the separation layer F3a. Thereby, the separation layer F3a can be peeled off from the layer sheet F11. Between the two, the curved portion F3a1 gradually becomes smaller and eventually disappears. Here, for example, when the rotation direction of the winding portion 17 and the nip roller portion 18 is switched from the counterclockwise direction to the clockwise direction, the timing at which the layer sheet F11 is 5%-70% attached to the holding surface 15a is completed. Preferably, the timing is 10%-50%.

如此，層片F11的表面保護薄膜F4a(參照圖3：與貼合面相反側的面)依序貼附於保持面15a。此時，貼合層F5的黏著層F2a(參照圖3：與光學顯示部件P貼合的面)變成朝下。 In this manner, the surface protective film F4a of the layer F11 (see FIG. 3: the surface opposite to the bonding surface) is sequentially attached to the holding surface 15a. At this time, the adhesive layer F2a of the bonding layer F5 (refer FIG. 3: the surface joined with the optical display member P) turns into a downward direction.

於保持面15a貼附整個層片F11後，如圖2D所示，頭部驅動裝置16將貼合頭15朝上方移動特定量。隨著貼合頭15的移動，貼合層F5與貼合頭15一同朝上方移動。此時，貼合層F5從分離層F3a完全地分離，變成貼合於保持面15a的狀態。於保持面15a貼附有貼合層F5的貼合頭15移動至貼合平台14上，將貼附於保持面15a的貼合層F5貼合於光學顯示部件P。 After the entire layer F11 is attached to the holding surface 15a, as shown in FIG. 2D, the head driving device 16 moves the bonding head 15 upward by a certain amount. As the bonding head 15 moves, the bonding layer F5 moves upward together with the bonding head 15. At this time, the bonding layer F5 is completely separated from the separation layer F3a, and is brought into a state of being bonded to the holding surface 15a. The bonding head 15 to which the bonding layer F5 is attached to the holding surface 15a is moved to the bonding stage 14, and the bonding layer F5 adhered to the holding surface 15a is bonded to the optical display member P.

如以上說明所述，在本實施形態中的貼合裝置1，於層片F11之保持動作開始的瞬間之特定期間中，進行將捲取於分離滾筒R2的分離層F3a反捲，讓分離層F3a鬆弛使得層片F11不會從分離層F3a剝離的反捲動作。 As described above, in the bonding apparatus 1 of the present embodiment, the separation layer F3a wound up in the separation drum R2 is rewinded in a specific period of time at which the holding operation of the layer sheet F11 is started, and the separation layer is allowed to be separated. The F3a is loosened so that the layer F11 does not peel off from the separation layer F3a.

根據此構成，層片F11的保持動作期間，層片F11中，最先貼附於貼合頭15的端部15e之端部F11e持續密合於貼合頭15。藉此，層片F11貼合至光學顯示部件P時，可抑制氣泡或皺褶產生、貼合的精度下降、層片F11從貼合頭15脫落等貼合不良。 According to this configuration, during the holding operation of the layer sheet F11, the end portion F11e of the edge portion F11 which is first attached to the end portion 15e of the bonding head 15 is continuously adhered to the bonding head 15. As a result, when the layer sheet F11 is bonded to the optical display member P, it is possible to suppress the occurrence of bubbles or wrinkles, the decrease in the precision of bonding, and the poor adhesion of the layer sheet F11 from the bonding head 15.

並且，因為不需增強用於抑制該貼合不良的貼合頭15之黏著力，在層片F11以多層薄膜構成之情況下，能避免只有黏著於貼合頭15的薄膜層剝離的問題，也能避免貼合層片後，光學顯示部件P因貼合頭15的黏著力抬起而破損的問題。 Further, since it is not necessary to enhance the adhesion of the bonding head 15 for suppressing the bonding failure, when the layer sheet F11 is formed of a multilayer film, the problem that only the film layer adhered to the bonding head 15 is peeled off can be avoided. It is also possible to avoid the problem that the optical display member P is broken due to the adhesion of the bonding head 15 after the bonding of the layer.

〔第二實施形態〕 [Second embodiment]

以下，使用圖4，來說明關於本發明的第二實施形態之貼合裝置。 Hereinafter, a bonding apparatus according to a second embodiment of the present invention will be described with reference to Fig. 4 .

圖4係為本實施形態的貼合裝置2之側面概略圖。以下，關於與第一實施形態共通的構成要素，賦予相同的符號，並省略詳細說明。 Fig. 4 is a schematic side view showing the bonding apparatus 2 of the embodiment. In the following, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

於第一實施形態，夾壓滾筒部18藉由與捲取部17的旋轉同步地朝送出方向旋轉，使分離層F3a往層搬送上游側，來實現該反捲動作。對此，於本實施形態，貼合裝置2不具有夾壓滾筒部，該反捲動作僅藉由捲取部17的旋轉來進行。藉此，在本實施形態，捲取部17構成捲取機構，可進行以下動作：將通過層平台13的分離層F3a往分離滾筒R2捲取的捲取動作、及將捲取於分離滾筒R2的分離層F3a反捲的反捲動作。於此特點，與第一實施形態大大地不同。 In the first embodiment, the nip roller unit 18 is rotated in the feeding direction in synchronization with the rotation of the winding unit 17, and the separation layer F3a is conveyed to the upstream side in the layer to realize the rewinding operation. On the other hand, in the present embodiment, the bonding apparatus 2 does not have the nip roller portion, and the rewinding operation is performed only by the rotation of the winding portion 17. Therefore, in the present embodiment, the winding unit 17 constitutes a winding mechanism, and the winding operation of winding the separation layer F3a of the layer platform 13 to the separation drum R2 and winding it on the separation drum R2 can be performed. The separation layer F3a reverses the rewinding action. This feature is greatly different from the first embodiment.

捲取部17藉由貼合頭15從分離層F3a剝離層片F11後，進行將通過層平台13的分離層F3a往分離滾筒R2捲取的捲取動作。 The winding unit 17 peels the layer sheet F11 from the separation layer F3a by the bonding head 15, and then performs a winding operation of winding the separation layer F3a of the layer platform 13 to the separation drum R2.

並且，於層片F11之保持動作開始的瞬間之特定期間中，捲取部17進行將捲取於分離滾筒R2的分離層F3a反捲，讓分離層F3a鬆弛使得層片F11不會從分離層F3a剝離的反捲動作。此處，舉例來說，捲取部17的旋轉方向從逆時針方向切換成順時針方向的時機，係層片F11完成5%-70%貼附至保持面15a的時機，較佳係完成10%-50%的時機。 In the specific period of the moment when the holding operation of the layer F11 is started, the winding unit 17 rewinds the separation layer F3a wound up in the separation drum R2, and the separation layer F3a is loosened so that the layer F11 does not escape from the separation layer. F3a stripping reverse roll action. Here, for example, when the rotation direction of the winding portion 17 is switched from the counterclockwise direction to the clockwise direction, the timing of attaching the layer sheet F11 to the holding surface 15a by 5% to 70% is completed, preferably 10 %-50% timing.

關於貼合層F5貼附至貼合頭15的動作，除了該反捲動作僅藉由捲取部17來進行的特點以外，與第一實施形態相同。 The operation of attaching the bonding layer F5 to the bonding head 15 is the same as that of the first embodiment except that the rewinding operation is performed only by the winding unit 17.

如以上說明所述，即使於本實施形態中的貼合裝置2，層片F11之保持動作的期間，層片F11中，最先貼附於貼合頭15的端部15e之端部F11e也持續密合於貼合頭15。藉此，層片F11貼合至光學顯示部件P時，可抑制氣泡或皺褶產生、貼合的精度下降、層片F11從貼合頭15脫落等貼合不良。 As described above, even in the bonding apparatus 2 of the present embodiment, during the holding operation of the layer sheet F11, the end portion F11e of the layer portion F11 which is first attached to the end portion 15e of the bonding head 15 is also It is continuously adhered to the fitting head 15. As a result, when the layer sheet F11 is bonded to the optical display member P, it is possible to suppress the occurrence of bubbles or wrinkles, the decrease in the precision of bonding, and the poor adhesion of the layer sheet F11 from the bonding head 15.

並且，因為不需增強用於抑制該貼合不良的貼合頭15之黏著力，在層片F11以多層薄膜構成之情況下，能避免只有黏著於貼合頭15的薄膜層剝離的問題，也能避免貼合層片後，光學顯示部件P因貼合頭15的黏著力抬起而破損的問題。 Further, since it is not necessary to enhance the adhesion of the bonding head 15 for suppressing the bonding failure, when the layer sheet F11 is formed of a multilayer film, the problem that only the film layer adhered to the bonding head 15 is peeled off can be avoided. It is also possible to avoid the problem that the optical display member P is broken due to the adhesion of the bonding head 15 after the bonding of the layer.

〔第三實施形態〕 [Third embodiment]

以下，參照圖5、圖6A至圖6D、圖8、圖9A及圖9B，來說明關於本發明的第三實施形態之貼合裝置3。圖5係為貼合裝置3的側面概略圖。 Hereinafter, the bonding apparatus 3 according to the third embodiment of the present invention will be described with reference to Figs. 5, 6A to 6D, 8 and 9A and 9B. FIG. 5 is a schematic side view of the bonding apparatus 3.

如圖5所示，貼合裝置3係具備：層搬送裝置31，從捲繞光學組件層F1的料捲滾筒R1捲出光學組件層F1，並將光學組件層F1沿著其長邊方向搬送；及貼合部40，層搬送裝置31保持從光學組件層F1切出的貼合層F5之層片F11的同時，將層片F11貼合於光學顯示部件P的上面。 As shown in FIG. 5, the bonding apparatus 3 is equipped with the layer conveyance apparatus 31, and the optical component layer F1 is wound up from the roll drum R1 of the winding optical component layer F1, and the optical component layer F1 is conveyed along the longitudinal direction. And the bonding unit 40, the layer conveying device 31 holds the layer F11 of the bonding layer F5 cut out from the optical component layer F1, and bonds the layer F11 to the upper surface of the optical display member P.

層搬送裝置31係具有：捲出部31a，將分離層F3a(參照圖3) 作為載件搬送貼合層F5，保持捲繞有帶狀的光學組件層F1之料捲滾筒R1的同時，將光學組件層F1沿著其長邊方向捲出；切斷裝置31b，對從料捲滾筒R1捲出的光學組件層F1施予半切斷。再者，層搬送裝置31係具有：刀刃31c(加壓組件)，在貼合來自施予半切斷的光學組件層F1之貼合層F5時，將分離層F3a從上方加壓；捲取部31d，保持捲取有分離層F3a的分離滾筒R2；層平台33，與前述同時地支撐光學組件層F1的下面。 The layer conveying device 31 has a winding portion 31a and a separation layer F3a (see FIG. 3). As the carrier conveyance bonding layer F5, while holding the roll drum R1 of the belt-shaped optical component layer F1, the optical component layer F1 is wound up along the longitudinal direction thereof; the cutting device 31b is used for the material The optical component layer F1 taken up by the roll cylinder R1 is half cut. Further, the layer conveying device 31 has a blade 31c (pressurizing unit), and presses the separation layer F3a from above when the bonding layer F5 from the half-cut optical component layer F1 is bonded; the winding portion 31d, the separation roller R2 that holds the separation layer F3a is wound; the layer platform 33 supports the lower surface of the optical component layer F1 simultaneously with the foregoing.

層搬送裝置31係具有夾壓滾筒部18。夾壓滾筒部18係包含：於旋轉軸方向相互平行配置的第一夾壓滾筒18a及第二夾壓滾筒18b。第一夾壓滾筒18a及第二夾壓滾筒18b藉由相互同步旋轉，能夠將分離層F3a從層搬送上游側朝層搬送下游側、或將分離層F3a從層搬送下游側朝層搬送上游側搬送。夾壓滾筒部18於層片F11的保持動作開始之瞬間的特定期間中，可進行將捲取於分離滾筒R2的分離層F3a反捲，讓分離層F3a鬆弛使得層片F11不會從分離層F3a剝離的反捲動作。 The layer conveying device 31 has a nip roller portion 18. The nip roller portion 18 includes a first nip roller 18a and a second nip roller 18b that are disposed in parallel with each other in the rotation axis direction. By rotating the first nip roller 18a and the second nip roller 18b in synchronization with each other, the separation layer F3a can be transported from the layer transport upstream side toward the layer transport downstream side, or the separation layer F3a can be transported from the layer transport downstream side toward the layer transport upstream side. Transfer. The nip roller portion 18 can rewind the separation layer F3a wound around the separation drum R2 during a specific period of time at which the holding operation of the layer sheet F11 is started, and the separation layer F3a is loosened so that the layer sheet F11 does not escape from the separation layer. F3a stripping reverse roll action.

層搬送裝置31係具有：複數導引滾筒GR1,GR2,GR3，將光學組件層F1沿著特定的搬送路徑捲繞；及加壓滾筒GR4。光學組件層F1在與其搬送方向垂直的水平方向(層寬度方向)，具有與光學顯示部件P的顯示區域P4(參照圖12B)之寬度(相當於本實施形態中的顯示區域P4之短邊長度)相同的寬度。 The layer conveyance device 31 has a plurality of guide rollers GR1, GR2, and GR3 that wind the optical component layer F1 along a specific conveyance path, and a pressure roller GR4. The optical module layer F1 has a width corresponding to the display region P4 (see FIG. 12B) of the optical display member P in the horizontal direction (layer width direction) perpendicular to the conveyance direction (corresponding to the short side length of the display region P4 in the present embodiment). ) the same width.

舉例來說，位於層搬送裝置31的起點之捲出部31a及位於層搬送裝置31的終點之捲取部31d相互同步驅動。藉此，捲出部31a將光學組件層F1往其搬送方向捲出，並且捲取部31d捲取經過刀刃31c的分離層F3a。 For example, the winding portion 31a located at the starting point of the layer conveying device 31 and the winding portion 31d at the end of the layer conveying device 31 are driven in synchronization with each other. Thereby, the winding portion 31a winds up the optical component layer F1 in the conveying direction thereof, and the winding portion 31d winds up the separation layer F3a passing through the blade 31c.

切斷裝置31b在與光學組件層F1之層寬度方向垂直的長度方向，只要每捲出顯示區域P4的長度(相當於本實施形態中的顯示區域P4之長邊長度)相同的長度，便橫跨該層寬度方向的整個寬度，施予該半切斷。 The cutting device 31b has the same length as the length of the display region P4 (corresponding to the length of the long side of the display region P4 in the present embodiment) in the longitudinal direction perpendicular to the layer width direction of the optical module layer F1. The half cut is applied across the entire width of the layer in the width direction.

切斷裝置31b藉由光學組件層F1的搬送中之張力，在不使得光學組件層F1(分離層F3a)破損斷裂(使得分離層F3a殘留特定的厚度)的情況下，調整切斷刀的進退位置，並施予該半切斷至黏著層F2a及分離層F3a的交界面附近為止。另外，也可使用雷射裝置取代上述的切斷刀。 By the tension in the conveyance of the optical component layer F1, the cutting device 31b adjusts the advance and retreat of the cutting blade without causing the optical component layer F1 (separation layer F3a) to be broken or broken (so that the separation layer F3a remains a specific thickness). The position is applied to the vicinity of the interface between the adhesive layer F2a and the separation layer F3a. Alternatively, a laser device may be used instead of the above-described cutting blade.

於半切斷後的光學組件層F1，在其厚度方向，藉由切斷光學組件本體F1a及表面保護薄膜F4a，來形成橫跨光學組件層F1的層寬度方向之整個寬度的切割線。光學組件層F1藉由該切割線，在長邊方向，劃分出具有相當於顯示區域P4的長邊長度之長度的分區。此分區各自成為貼合層F5中的一個層片F11。 The optical component layer F1 after the half cut is formed in the thickness direction by cutting the optical module body F1a and the surface protective film F4a to form a dicing line spanning the entire width of the optical module layer F1 in the layer width direction. The optical component layer F1 divides a section having a length corresponding to the length of the long side of the display region P4 in the longitudinal direction by the dicing line. This partition each becomes a layer F11 in the bonding layer F5.

刀刃31c(加壓組件)位於從圖5的左側往右側大概水平地搬送之光學組件層F1的上方，在光學組件層F1的層寬度方向，至少橫跨其整個寬度地延伸。刀刃31c可沿著光學組件層F1的搬送方向進退，並加壓從半切斷後的光學組件層F1所分離的分離層F3a之上方。 The blade 31c (pressurizing unit) is located above the optical component layer F1 which is conveyed substantially horizontally from the left side to the right side of FIG. 5, and extends at least across the entire width thereof in the layer width direction of the optical component layer F1. The blade edge 31c can advance and retreat along the conveyance direction of the optical component layer F1, and pressurizes above the separation layer F3a separated from the half-cut optical component layer F1.

貼合部40係具備：貼合平台41，保持貼合時的光學顯示部件P；及驅動裝置42，驅動貼合筒32，使得貼合筒32旋轉或移動等。驅動裝置42電性連接控制裝置25，藉由控制裝置25可控制驅動裝置42的驅動。 The bonding unit 40 includes a bonding platform 41 that holds the optical display member P at the time of bonding, and a driving device 42 that drives the bonding cylinder 32 to rotate or move the bonding cylinder 32. The driving device 42 is electrically connected to the control device 25, and the driving device 42 can be controlled by the control device 25.

貼合平台41係用於保持貼合有層片F11的光學顯示部件P。貼合平台41藉由例如吸附，來保持光學顯示部件P。 The bonding platform 41 is for holding the optical display member P to which the layer sheet F11 is bonded. The bonding stage 41 holds the optical display part P by, for example, adsorption.

貼合筒32(貼合組件)具有與該層寬度方向平行的圓筒狀之保持面32a。舉例來說，保持面32a具有較貼合層F5的貼合面(黏著層F2a)弱的貼附力，可反覆貼附、剝離貼合層F5的表面保護薄膜F4a。 The bonding cylinder 32 (bonding unit) has a cylindrical holding surface 32a parallel to the width direction of the layer. For example, the holding surface 32a has a weak adhesion force to the bonding surface (adhesive layer F2a) of the bonding layer F5, and the surface protective film F4a of the bonding layer F5 can be attached and peeled off.

圖6A至圖6D係為用於說明貼合層F5貼附至貼合筒32的動作之圖。 6A to 6D are views for explaining an operation of attaching the bonding layer F5 to the bonding cylinder 32.

在貼合層F5的層搬送下游側之端部31e到達貼合筒32的待機位置之下 方的時機，捲出部31a及捲取部31d(參照圖5)暫時停止驅動。如圖6A所示，若貼合層F5的層搬送下游側之端部31e到達貼合筒32的下方，則驅動裝置42將貼合筒32下降特定量。藉此，貼合筒32的保持面32a鄰接於貼合層F5，且貼合層F5的端部31e貼附於保持面32a。 The end portion 31e on the layer transport downstream side of the bonding layer F5 reaches the standby position of the bonding cylinder 32. At the timing, the winding portion 31a and the winding portion 31d (see FIG. 5) temporarily stop driving. As shown in FIG. 6A, when the end portion 31e of the layer conveyance downstream side of the bonding layer F5 reaches below the bonding cylinder 32, the driving device 42 lowers the bonding cylinder 32 by a certain amount. Thereby, the holding surface 32a of the bonding cylinder 32 is adjacent to the bonding layer F5, and the edge part 31e of the bonding layer F5 is attached to the holding surface 32a.

在本實施形態，於刀刃31c的前端部之下方，設置第一檢測攝影機34，檢測此部位中的貼合層F5之層片的層搬送下游側之前端。 In the present embodiment, the first detecting camera 34 is provided below the front end portion of the blade 31c, and the layer transport downstream side front end of the layer of the bonding layer F5 in the portion is detected.

第一檢測攝影機34透過設置於層平台33的貫通孔33a，拍攝貼合層F5的端部31e。第一檢測攝影機34的檢測資訊輸送於控制裝置25。舉例來說，控制裝置25在第一檢測攝影機34檢測端部31e的時間點，暫時停止層搬送裝置31。 The first detecting camera 34 images the end portion 31e of the bonding layer F5 through the through hole 33a provided in the layer stage 33. The detection information of the first detecting camera 34 is sent to the control device 25. For example, the control device 25 temporarily stops the layer transport device 31 at the time when the first detecting camera 34 detects the end portion 31e.

第一檢測攝影機34檢測貼合層F5的下游側端(端部31e)，並暫時停止層搬送裝置31時，控制裝置25藉由切斷裝置31b實施貼合層F5的切斷。即，沿著第一檢測攝影機34的檢測位置(第一檢測攝影機34的光軸延伸位置)及切斷裝置31b的切斷位置(切斷裝置31b的切斷刀進退位置)間之層搬送路徑的距離，相當於貼合層F5的層片F11之長度。 When the first detecting camera 34 detects the downstream side end (end portion 31e) of the bonding layer F5 and temporarily stops the layer conveying device 31, the control device 25 performs cutting of the bonding layer F5 by the cutting device 31b. In other words, the layer transport path between the detection position of the first detecting camera 34 (the optical axis extending position of the first detecting camera 34) and the cutting position of the cutting device 31b (the cutting blade advancing and retracting position of the cutting device 31b) The distance corresponds to the length of the layer F11 of the bonding layer F5.

切斷裝置31b可沿著層搬送路徑移動，藉由此移動，變化沿著第一檢測攝影機34的檢測位置及切斷裝置31b的切斷位置間之層搬送路徑的距離。切斷裝置31b的移動藉由控制裝置25來控制，舉例來說，藉由切斷裝置31b切斷貼合層F5後，只捲出一個貼合層F5的層片F11時，此切斷端從特定的基準位置偏移之情況下，將此偏移藉由切斷裝置31b的移動來修正。另外，也可藉由切斷裝置31b的移動，對應長度不同的貼合層F5之切斷。 The cutting device 31b is movable along the layer transport path, and by this movement, changes the distance along the layer transport path between the detection position of the first detection camera 34 and the cutting position of the cutting device 31b. The movement of the cutting device 31b is controlled by the control device 25. For example, when the bonding layer F5 is cut by the cutting device 31b, only the layer F11 of the bonding layer F5 is wound out, the cutting end In the case of shifting from a specific reference position, this offset is corrected by the movement of the cutting device 31b. Further, the cutting of the bonding layer F5 having different lengths may be performed by the movement of the cutting device 31b.

第一檢測攝影機34也檢測印於貼合層F5的缺陷標記。該缺陷標記係為在料捲滾筒R1製造時，於第一光學組件層F1中發現的缺陷位置處，從此表面保護薄膜F4a側藉由噴墨等來標記。第一檢測攝影機34係為檢 測印於光學組件層F1的缺陷標記之檢測手段。 The first detecting camera 34 also detects the defective mark printed on the bonding layer F5. The defect mark is a defect position found in the first optical component layer F1 when the roll drum R1 is manufactured, and is marked by inkjet or the like from the side of the surface protective film F4a. The first detection camera 34 is for inspection A means of detecting a defect mark printed on the optical component layer F1.

此處，舉例來說，上述的光學組件層F1之缺陷係指，於光學組件層F1的內部存在由固體、液體、及氣體的至少一者所組成的異物之部分、於光學組件層F1的表面存在凹凸或傷痕之部分、因光學組件層F1的歪斜或材質的偏差等而產生亮點之部分等。 Here, for example, the defect of the optical component layer F1 described above means that a portion of a foreign matter composed of at least one of a solid, a liquid, and a gas exists inside the optical component layer F1 in the optical component layer F1. A portion where irregularities or scratches are present on the surface, a portion where a bright spot is generated due to a skew of the optical component layer F1, a deviation of a material, or the like.

另外，如上所述，於貼合層F5檢測有缺陷標記的情況下，檢測有缺陷標記的資訊從第一檢測攝影機34輸送至控制裝置25。貼合層F5貼附於貼合筒32後，控制裝置25控制驅動裝置42的驅動。藉此，驅動裝置42係將貼合頭32移動至避開貼合平台41的廢棄位置(圖未示)，在設置於廢棄位置的廢棄材料層等，將貼附於貼合筒32的貼合層F5重複貼合。即，貼合筒32(貼合組件)將檢測出光學組件層F1的缺陷標記之部位保持於保持面32a，並搬送於廢棄位置。此結果，能避免具有缺陷標記的貼合層F5貼合於光學顯示部件P。 Further, as described above, when the defective layer is detected by the bonding layer F5, the information for detecting the defective mark is sent from the first detecting camera 34 to the control device 25. After the bonding layer F5 is attached to the bonding cylinder 32, the control device 25 controls the driving of the driving device 42. As a result, the driving device 42 moves the bonding head 32 to a disposal position (not shown) that avoids the bonding platform 41, and attaches the sticker to the bonding tube 32 in a waste material layer or the like provided at the disposal position. The layer F5 is repeatedly laminated. In other words, the bonding cylinder 32 (bonding unit) holds the portion of the optical component layer F1 where the defective mark is detected on the holding surface 32a, and conveys it to the disposal position. As a result, it is possible to prevent the bonding layer F5 having the defect mark from being attached to the optical display member P.

貼合層F5的切斷後，如圖6B所示，驅動裝置42將貼附於保持面32a的貼合層F5朝捲取方向(逆時針旋轉方向)旋轉的同時，將貼合筒32沿著搬送上游側(圖6B中的左方向)移動。如此，一邊捲出貼合層F5，一邊旋轉貼合筒32，使貼合層F5的層片整體貼附於保持面32a。 After the cutting layer F5 is cut, as shown in FIG. 6B, the driving device 42 rotates the bonding layer F5 attached to the holding surface 32a in the winding direction (counterclockwise direction), and transports the bonding cylinder 32 along the same. The upstream side (the left direction in Fig. 6B) moves. As described above, the bonding tube 32 is rotated while the bonding layer F5 is wound up, and the entire layer of the bonding layer F5 is attached to the holding surface 32a.

此處，夾壓滾筒部18及捲取部31d(參照圖5)與貼合筒32的驅動同步地旋轉驅動，讓分離層F3a朝捲開方向，使得貼合層F5貼附於貼合筒32時分離層F3a不會破損斷裂。分離層F3a輸送於層搬送上游側，變成產生鬆弛的狀態。貼合筒32為了進行貼附於保持面32a的貼合層F5之捲取，繼續上述的旋轉及移動。藉此，貼合層F5在貼附於貼合筒32(保持面32a)的部分(端部31e)之附近產生鬆弛，使分離層F3a變成具有朝層平台33的上方彎曲的彎曲部F3a1之狀態。 Here, the nip roller portion 18 and the winding portion 31d (see FIG. 5) are rotationally driven in synchronization with the driving of the bonding cylinder 32, and the separation layer F3a is caused to be in the winding direction, so that the bonding layer F5 is attached to the bonding cylinder 32. The separation layer F3a does not break and break. The separation layer F3a is transported to the upstream side of the layer transport, and is in a state of being slack. The bonding cylinder 32 continues the above-described rotation and movement in order to wind up the bonding layer F5 attached to the holding surface 32a. Thereby, the bonding layer F5 is slackened in the vicinity of the portion (end portion 31e) attached to the bonding cylinder 32 (holding surface 32a), and the separation layer F3a becomes the curved portion F3a1 which is curved upward toward the layer platform 33. status.

因此，夾壓滾筒部18及捲取部31d構成捲取機構，可進行以下動作：將通過層平台33的分離層F3a往分離滾筒R2捲取的捲取動作及將捲取於分離滾筒R2的分離層F3a反捲的反捲動作。 Therefore, the nip roller portion 18 and the winding portion 31d constitute a winding mechanism, and the winding operation of winding the separation layer F3a of the layer platform 33 to the separation drum R2 and winding the same on the separation drum R2 can be performed. The reverse winding action of the separation layer F3a.

另外，為了防止分離層F3a的抬起，與捲開分離層F3a的時機同步，將刀刃31c從待機位置靠近貼合筒32側，如圖6C所示，將前端部鄰接於分離層F3a。 Further, in order to prevent the lifting of the separation layer F3a, the blade 31c is brought closer to the bonding tube 32 side from the standby position in synchronization with the timing of the separation of the separation layer F3a, and the front end portion is adjacent to the separation layer F3a as shown in Fig. 6C.

夾壓滾筒部18及捲取部31d在刀刃31c的前端部鄰接於分離層F3a的時機旋轉驅動，使分離層F3a朝捲取方向。此時，貼合筒32為了進行貼附於保持面32a的貼合層F5之捲取，繼續上述的旋轉及移動。 The nip roller portion 18 and the winding portion 31d are rotationally driven at a timing when the tip end portion of the blade edge 31c is adjacent to the separation layer F3a, and the separation layer F3a is directed in the winding direction. At this time, the bonding cylinder 32 continues the above-described rotation and movement in order to wind up the bonding layer F5 attached to the holding surface 32a.

藉此，貼合層F5持續沿著貼合筒32的保持面32a之圓周方向捲取。因此，貼合裝置3一邊藉由貼合筒32捲取貼合層F5，一邊藉由捲取部31d捲取分離層F3a。此時，分離層F3a係為藉由刀刃31c加壓上方的狀態。 Thereby, the bonding layer F5 continues to be wound in the circumferential direction of the holding surface 32a of the bonding cylinder 32. Therefore, the bonding apparatus 3 winds up the bonding layer F5 by the bonding cylinder 32, and winds up the separation layer F3a by the winding part 31d. At this time, the separation layer F3a is in a state of being pressurized upward by the blade 31c.

藉此，於貼合層F5及分離層F3a的交界面，產生剝離兩者的力，能從貼合層F5剝離分離層F3a。彎曲部F3a1逐漸變小，最後會消失。如此，貼合層F5的層片之表面保護薄膜F4a(參照圖3：與貼合面相反側的面)依序貼附於貼合筒32的保持面32a。此時、貼合層F5的黏著層F2a(參照圖3：與光學顯示部件P貼合的面)變成朝下。 Thereby, the force of peeling is generated at the interface between the bonding layer F5 and the separation layer F3a, and the separation layer F3a can be peeled off from the bonding layer F5. The curved portion F3a1 gradually becomes smaller and eventually disappears. In this manner, the surface protective film F4a (see FIG. 3: the surface opposite to the bonding surface) of the layer of the bonding layer F5 is sequentially attached to the holding surface 32a of the bonding cylinder 32. At this time, the adhesive layer F2a of the bonding layer F5 (refer FIG. 3: the surface joined with the optical display member P) turns into the downward direction.

驅動裝置42將貼合筒32旋轉驅動特定量，將貼合層F5貼附於保持面32a直到形成有切割線的部分為止後，如圖6D所示，將貼合筒32朝上方移動特定量。此時，層搬送裝置31停止分離層F3a的送出動作。並且，刀刃31c回到該待機位置。 The driving device 42 rotationally drives the bonding cylinder 32 by a specific amount, and after attaching the bonding layer F5 to the holding surface 32a until the portion where the cutting line is formed, as shown in FIG. 6D, the bonding cylinder 32 is moved upward by a specific amount. . At this time, the layer conveying device 31 stops the feeding operation of the separation layer F3a. Further, the blade 31c returns to the standby position.

隨著貼合筒32的移動，貼附於保持面32a的貼合層F5與貼合筒32一同朝上方移動。此時，貼合層F5從分離層F3a完全地分離，變成貼合於保持面32a的狀態。於保持面32a貼附有貼合層F5的貼合筒32移動至貼合 平台41上，如後所述，將貼附於貼合筒32的貼合層F5貼合於光學顯示部件P。 As the bonding cylinder 32 moves, the bonding layer F5 attached to the holding surface 32a moves upward together with the bonding cylinder 32. At this time, the bonding layer F5 is completely separated from the separation layer F3a, and is brought into a state of being bonded to the holding surface 32a. The bonding cylinder 32 to which the bonding layer F5 is attached to the holding surface 32a is moved to the bonding The bonding layer F5 attached to the bonding cylinder 32 is bonded to the optical display member P on the stage 41 as will be described later.

於本實施形態，貼附有貼合層F5的貼合筒32從層平台33上移動至貼合平台41上為止時，貼附並保持於保持面32a的貼合層F5(層片F11)之四個角部分別於作為拍攝裝置的第二檢測攝影機35(參照圖8)來拍攝。各第二檢測攝影機35的檢測資訊輸送於控制裝置25。 In the present embodiment, when the bonding cylinder 32 to which the bonding layer F5 is attached is moved from the layer platform 33 to the bonding platform 41, the bonding layer F5 (ply F11) attached to and held by the holding surface 32a is attached. The four corners are respectively taken by the second detecting camera 35 (see FIG. 8) as an imaging device. The detection information of each of the second detecting cameras 35 is sent to the control device 25.

舉例來說，控制裝置25基於各第二檢測攝影機35的拍攝資料，確認相對於貼合筒32的貼合層F5之配置位置。控制裝置25基於各第二檢測攝影機35之拍攝資料，藉由驅動裝置(圖未示)將貼合平台41分別於與貼合筒32的旋轉軸垂直的方向及與貼合筒32的旋轉軸平行的方向移動，並藉由旋轉裝置(圖未示)將貼合平台41在水平面內旋轉。藉此，為了調整保持於貼合平台41的光學顯示部件P及保持於貼合筒32的貼合層F5之相對貼合位置，進行校準。因此，第二檢測攝影機35係為檢測保持於貼合筒32(貼合組件)的層片F11相對於貼合筒32(貼合組件)的相對位置之檢測部。 For example, the control device 25 confirms the arrangement position of the bonding layer F5 with respect to the bonding cylinder 32 based on the imaging data of each of the second detecting cameras 35. The control device 25 sets the bonding platform 41 in a direction perpendicular to the rotation axis of the bonding cylinder 32 and a rotation axis of the bonding cylinder 32 by a driving device (not shown) based on the imaging data of each of the second detecting cameras 35. The parallel direction is moved, and the bonding platform 41 is rotated in a horizontal plane by a rotating device (not shown). Thereby, the alignment is performed in order to adjust the relative bonding position of the optical display member P held by the bonding stage 41 and the bonding layer F5 held by the bonding cylinder 32. Therefore, the second detecting camera 35 is a detecting portion that detects the relative position of the layer sheet F11 held by the bonding tube 32 (bonding unit) with respect to the bonding tube 32 (the bonding unit).

並且，於本實施形態，貼合裝置3於作為貼合位置的貼合平台41之上方，設置一對第三檢測攝影機36，用於進行光學顯示部件P的水平方向之校準的校準(參照圖9A及圖9B)。 Further, in the present embodiment, the bonding apparatus 3 is provided above the bonding platform 41 as the bonding position, and is provided with a pair of third detecting cameras 36 for performing calibration of the alignment of the optical display member P in the horizontal direction (refer to the figure). 9A and Figure 9B).

圖8係為用於說明藉由貼合裝置3調整貼合位置的圖。於圖8，右方的圖係為貼附於貼合筒32的貼合層F5之配置位置的說明圖，左方的圖係為保持於貼合平台41的光學顯示部件P之配置位置的說明圖，下方的圖係為貼合平台41的調整量之說明圖。於圖8，為了方便，四個第二檢測攝影機35中，顯示一個第二檢測攝影機35。 FIG. 8 is a view for explaining adjustment of the bonding position by the bonding device 3. 8 is a view for explaining the arrangement position of the bonding layer F5 attached to the bonding cylinder 32, and the left drawing is the position where the optical display member P of the bonding platform 41 is held. The figure below is an explanatory diagram of the adjustment amount of the bonding platform 41. In Fig. 8, for convenience, a second detecting camera 35 is displayed in the four second detecting cameras 35.

如圖8的右方所示，藉由第二檢測攝影機35拍攝貼附於保持面32a的貼合層F5(層片F11)之角部。 As shown on the right side of FIG. 8, the corner portion of the bonding layer F5 (layer sheet F11) attached to the holding surface 32a is imaged by the second detecting camera 35.

於以下的說明，將沿著貼合筒32之旋轉方向配置的兩個第二 檢測攝影機35之檢測位置(兩個第二檢測攝影機35的光軸延伸位置)間沿著貼合筒32之圓周方向的距離稱為攝影機間隔距離Lc。攝影機間隔距離Lc係與上述的貼合層F5之層片的長度大概相同。 In the following description, two seconds are arranged along the rotation direction of the bonding cylinder 32. The distance between the detection position of the detection camera 35 (the optical axis extension position of the two second detection cameras 35) along the circumferential direction of the bonding cylinder 32 is referred to as the camera separation distance Lc. The camera separation distance Lc is approximately the same as the length of the layer of the above-described bonding layer F5.

舉例來說，隨著貼合筒32的旋轉，貼合層F5只在攝影機間隔距離Lc移動時，貼合層F5的角部位置從起點Ep1移動至終點Ep2。第二檢測攝影機35的檢測資訊(起點Ep1及終點Ep2的位置資訊)輸送於控制裝置25。如圖8的下方所示，控制裝置25基於攝影機間隔距離Lc及距離Le(以下，稱為起點/終點偏差Le。)，算出修正角度α(tanα=Le/Lc)，距離Le係為與貼合筒32的旋轉軸平行的方向中之起點Ep1、終點Ep2間的距離。 For example, as the bonding layer 32 moves, the corner layer position of the bonding layer F5 moves from the starting point Ep1 to the end point Ep2 as the bonding layer F5 moves only at the camera spacing distance Lc. The detection information of the second detection camera 35 (the position information of the start point Ep1 and the end point Ep2) is sent to the control device 25. As shown in the lower part of FIG. 8, the control device 25 calculates the correction angle α (tanα=Le/Lc) based on the camera separation distance Lc and the distance Le (hereinafter referred to as the start/end deviation Le), and the distance Le is attached to The distance between the starting point Ep1 and the ending point Ep2 in the direction in which the axis of rotation of the splicing cylinder 32 is parallel.

如圖8的左方所示，藉由第三檢測攝影機36(參照圖9A及圖9B)，拍攝保持於貼合平台41的光學顯示部件P之角部。舉例來說，於光學顯示部件P的各角部附有標記Pm(舉例來說，在本實施形態為三個標記(第一標記Pm1、第二標記Pm2、第三標記Pm3))。第三檢測攝影機36的檢測資訊(第一標記Pm1、第二標記Pm2及第三標記Pm3的位置資訊)輸送於控制裝置25。控制裝置25基於第三檢測攝影機36的檢測資訊，驅動控制貼合平台41，進行保持於貼合平台41的液晶面板P之校準。控制裝置25基於修正角度α，驅動控制旋轉裝置(圖未示)，將貼合平台41在水平面內只旋轉角度α。藉此，進行相對於貼合筒32的光學顯示部件P之校準。 As shown on the left side of FIG. 8, the corner portion of the optical display member P held by the bonding stage 41 is imaged by the third detecting camera 36 (see FIGS. 9A and 9B). For example, the mark Pm is attached to each corner portion of the optical display member P (for example, three marks (first mark Pm1, second mark Pm2, and third mark Pm3) in the present embodiment). The detection information (the position information of the first mark Pm1, the second mark Pm2, and the third mark Pm3) of the third detecting camera 36 is sent to the control device 25. The control device 25 drives and controls the bonding platform 41 based on the detection information of the third detection camera 36, and performs calibration of the liquid crystal panel P held by the bonding platform 41. The control device 25 drives and controls the rotating device (not shown) based on the correction angle α to rotate the bonding platform 41 by only the angle α in the horizontal plane. Thereby, the alignment of the optical display member P with respect to the bonding cylinder 32 is performed.

圖9A及圖9B係為用於說明藉由貼合筒32將貼合層F5貼合至光學顯示部件P的製程之圖。如圖9A所示，控制裝置25將貼合筒32移動至貼合平台41的上方之特定位置為止。控制裝置25進行貼合筒32及貼合平台41的校準，使得貼附於保持面32a的貼合層F5之前端部及保持於貼合平台41上的光學顯示部件P之端部的位置平面重疊。 9A and 9B are views for explaining a process of bonding the bonding layer F5 to the optical display member P by the bonding cylinder 32. As shown in FIG. 9A, the control device 25 moves the bonding cylinder 32 to a specific position above the bonding platform 41. The control device 25 performs alignment of the bonding cylinder 32 and the bonding stage 41 so that the front end portion of the bonding layer F5 attached to the holding surface 32a and the position flat surface of the end portion of the optical display member P held on the bonding stage 41 are attached. overlapping.

控制裝置25於貼合時，因為下降貼合筒32，而形成貼附於保 持面32a的貼合層F5之前端部從光學顯示部件P的端部之上方壓迫的狀態。 When the control device 25 is attached, it is attached to the protective cover 32 because it is lowered. The front end portion of the bonding layer F5 of the holding surface 32a is pressed from above the end portion of the optical display member P.

貼合筒32下降，變成貼合層F5加壓於光學顯示部件P的狀態。此時，貼合筒32藉由將保持於保持面32a的貼合層F5壓迫並旋轉於光學顯示部件P，將貼合層F5的整體貼合於光學顯示部件P。 The bonding cylinder 32 is lowered, and the bonding layer F5 is pressurized to the optical display member P. At this time, the bonding tube 32 is pressed against the optical display member P by pressing the bonding layer F5 held on the holding surface 32a, and the entire bonding layer F5 is bonded to the optical display member P.

如圖9B所示，控制裝置25於貼合時，隨著貼合筒32的旋轉，貼合平台41於與貼合筒32的旋轉軸垂直之方向相對移動。在本實施形態，貼合筒32逆時針旋轉，貼合平台41朝圖9B的紙面右方向移動。另外，也可為不移動貼合平台41，一邊旋轉貼合筒32，一邊將貼合筒32朝圖9B的紙面左方向移動之構成。 As shown in FIG. 9B, when the control device 25 is attached, the bonding platform 41 relatively moves in a direction perpendicular to the rotation axis of the bonding cylinder 32 as the bonding cylinder 32 rotates. In the present embodiment, the bonding cylinder 32 is rotated counterclockwise, and the bonding stage 41 is moved in the right direction of the paper surface of Fig. 9B. In addition, the bonding cylinder 32 may be rotated in the left direction of the paper surface of FIG. 9B while the bonding cylinder 32 is rotated without moving the bonding platform 41.

舉例來說，貼合筒32的旋轉驅動、及藉由貼合平台41的光學顯示部件P之移動動作係同步進行。藉此，能抑制貼合層F5及光學顯示部件P間產生摩擦。因此，能抑制位移地將貼合層F5貼合於光學顯示部件P。 For example, the rotational driving of the bonding cylinder 32 and the movement operation of the optical display member P of the bonding platform 41 are performed in synchronization. Thereby, friction between the bonding layer F5 and the optical display member P can be suppressed. Therefore, the bonding layer F5 can be bonded to the optical display member P while suppressing displacement.

舉例來說，貼合筒32具有較貼合層F5的貼合面(黏著層F2a)弱的貼附力，因為可反覆貼附、剝離貼合層F5的表面保護薄膜F4a(參照圖3)，於黏著層F2a(參照圖3)側加壓於光學顯示部件P的貼合層F5從保持面32a剝離而貼合於光學顯示部件P側。於本實施形態，光學顯示部件P藉由貼合裝置3，沿著顯示區域P4的短邊方向貼合有貼合層F5。 For example, the bonding cylinder 32 has a weak adhesion force to the bonding surface (adhesive layer F2a) of the bonding layer F5, because the surface protective film F4a of the bonding layer F5 can be attached and peeled off (see FIG. 3). The bonding layer F5 which is pressed against the optical display member P on the side of the adhesive layer F2a (see FIG. 3) is peeled off from the holding surface 32a and bonded to the optical display member P side. In the present embodiment, the optical display member P is bonded to the bonding layer F5 along the short-side direction of the display region P4 by the bonding device 3.

以下，相同地，藉由反覆進行圖8、圖9A及圖9B的動作，來反覆進行貼合層F5貼合至光學顯示部件P的處理。 Hereinafter, in the same manner, by repeating the operations of FIGS. 8 , 9A, and 9B, the process of bonding the bonding layer F5 to the optical display member P is repeatedly performed.

如以上所述，貼合裝置3中的貼合平台41基於檢測與相對於光學顯示部件P的貼合筒32之相對位置、及相對於貼附至貼合筒32的貼合層F5之貼合筒32的相對位置之各檢測攝影機(第一檢測攝影機34至第三檢測攝影機36)的檢測資訊，藉由控制裝置25來驅動控制。藉此，修正相對於貼合筒32的貼合平台41之相對位置。其結果，進行相對於貼合筒32的光學顯示 部件P之校準。另外，也可使用感測器來取代檢測攝影機。 As described above, the bonding platform 41 in the bonding apparatus 3 is based on the relative position of the bonding cylinder 32 with respect to the optical display member P and the bonding layer F5 attached to the bonding cylinder 32. The detection information of each of the detection cameras (the first detection camera 34 to the third detection camera 36) of the relative positions of the splicing cylinders 32 is driven and controlled by the control device 25. Thereby, the relative position with respect to the bonding platform 41 of the bonding cylinder 32 is corrected. As a result, optical display with respect to the bonding cylinder 32 is performed. Calibration of component P. Alternatively, a sensor can be used instead of the detection camera.

如以上說明所述，於本實施形態中的貼合裝置3，層片F11的保持動作期間，層片F11中，最先貼附於貼合筒32的端部31e持續密合於貼合筒32。藉此，貼合至光學顯示部件P時，可抑制氣泡或皺褶產生、貼合的精度下降、層片F11從貼合筒32脫落等貼合不良。並且，因為不需增強用於抑制該貼合不良的貼合筒32之黏著力，在層片F11以多層薄膜構成之情況下，能避免只有黏著於貼合筒32的薄膜層剝離的問題，也能避免貼合層片後，光學顯示部件P因貼合筒32的黏著力抬起而破損的問題。 As described above, in the bonding apparatus 3 of the present embodiment, during the holding operation of the layer sheet F11, the end portion 31e of the layer sheet F11 which is first attached to the bonding tube 32 is continuously adhered to the bonding tube. 32. Thereby, when bonding to the optical display member P, it is possible to suppress the occurrence of bubbles or wrinkles, the decrease in the precision of bonding, and the poor adhesion of the layer sheet F11 from the bonding tube 32. Further, since it is not necessary to enhance the adhesion of the bonding cylinder 32 for suppressing the bonding failure, in the case where the layer sheet F11 is formed of a multilayer film, it is possible to avoid the problem that only the film layer adhered to the bonding cylinder 32 is peeled off. It is also possible to avoid the problem that the optical display member P is broken due to the adhesion of the bonding cylinder 32 after the lamination is applied.

再加上，於本實施形態中的貼合裝置3，基於第三檢測攝影機36的檢測資訊，進行保持於貼合平台41的光學顯示部件P之校準的同時，基於修正角度α，藉由將貼合平台41在水平面內只旋轉角度α，來進行相對於貼合筒32的光學顯示部件P之校準。因此，能提高層片F11及光學顯示部件P的貼合精度。並且，於本實施形態中的貼合裝置3，因為在對應於層片F11的四個角部之位置，配置第二檢測攝影機35，所以能高精度確認層片F11相對於貼合筒32的保持面32a之貼附位置。因此，能提高層片F11及光學顯示部件P的貼合精度。 Further, the bonding apparatus 3 according to the present embodiment performs calibration of the optical display unit P held by the bonding stage 41 based on the detection information of the third detecting camera 36, and based on the correction angle α, The bonding platform 41 is calibrated with respect to the optical display member P of the bonding cylinder 32 by rotating only the angle α in the horizontal plane. Therefore, the bonding precision of the layer sheet F11 and the optical display member P can be improved. Further, in the bonding apparatus 3 of the present embodiment, since the second detecting camera 35 is disposed at a position corresponding to the four corner portions of the layer sheet F11, the layer sheet F11 can be accurately confirmed with respect to the bonding tube 32. The attachment position of the face 32a is maintained. Therefore, the bonding precision of the layer sheet F11 and the optical display member P can be improved.

並且，於本實施形態中的貼合裝置3，具有第一檢測攝影機34，作為檢測印於光學組件層F1的缺陷標記之檢測手段，並且貼合筒32(貼合組件)之特徵在於將檢測有光學組件層F11的缺陷標記之部位保持於保持面32a，並搬送於廢棄位置。因此，提高光學顯示設備的良率。 Further, the bonding apparatus 3 of the present embodiment includes the first detecting camera 34 as a detecting means for detecting a defect mark printed on the optical component layer F1, and the bonding cylinder 32 (a bonding component) is characterized in that it is to be detected. The portion of the defect mark of the optical component layer F11 is held by the holding surface 32a and transported to the disposal position. Therefore, the yield of the optical display device is improved.

〔第四實施形態〕 [Fourth embodiment]

以下，參照圖7，來說明關於本發明的第四實施形態之貼合裝置4。圖7係為貼合裝置4的側面概略圖。以下，關於與第三實施形態共通的構成要素，賦予相同的符號，並省略詳細說明。 Hereinafter, a bonding apparatus 4 according to a fourth embodiment of the present invention will be described with reference to Fig. 7 . FIG. 7 is a schematic side view of the bonding apparatus 4. In the following, the same components as those in the third embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

於第三實施形態，夾壓滾筒部18藉由與捲取部31d的旋轉同步地朝送出方向旋轉，使分離層F3a(參照圖3)往層搬送上游側，來實現該反捲動作。對此，於本實施形態，貼合裝置4不具有夾壓滾筒部，該反捲動作僅藉由捲取部31d的旋轉來進行。於此點，與第三實施形態大大地不同。 In the third embodiment, the nip roller unit 18 is rotated in the feeding direction in synchronization with the rotation of the winding unit 31d, and the separation layer F3a (see FIG. 3) is conveyed to the upstream side in the layer to realize the rewinding operation. On the other hand, in the present embodiment, the bonding apparatus 4 does not have the nip roller portion, and the rewinding operation is performed only by the rotation of the winding portion 31d. This point is greatly different from the third embodiment.

捲取部31d藉由貼合筒32從分離層F3a剝離層片F11後，進行將通過層搬送裝置31的分離層F3a往分離滾筒R2捲取的捲取動作。 The take-up portion 31d peels the layer sheet F11 from the separation layer F3a by the bonding cylinder 32, and then performs a winding operation of winding the separation layer F3a of the layer conveyance device 31 to the separation drum R2.

並且，於層片F11之保持動作開始的瞬間之特定期間中，捲取部31d進行將捲取於分離滾筒R2的分離層F3a反捲，讓分離層F3a鬆弛使得層片F11不會從分離層F3a剝離的反捲動作。 In the specific period of the moment when the holding operation of the layer F11 is started, the winding unit 31d rewinds the separation layer F3a wound up on the separation drum R2, and the separation layer F3a is loosened so that the layer F11 does not escape from the separation layer. F3a stripping reverse roll action.

關於貼合層F5貼付至貼合筒32的動作，除了該反捲動作僅藉由捲取部17來進行的特點以外，與第三實施形態相同。 The operation of attaching the bonding layer F5 to the bonding cylinder 32 is the same as that of the third embodiment except that the rewinding operation is performed only by the winding unit 17.

如以上說明所述，即使於本實施形態中的貼合裝置4，層片F11之保持動作的期間，層片F11中，最先貼附於合筒32的端部31e也持續密合於貼合筒32。藉此，貼合至光學顯示部件P時，可抑制氣泡或皺褶產生、貼合的精度下降、層片F11從貼合筒32脫落等貼合不良。並且，因為不需增強用於抑制該貼合不良的貼合筒32之黏著力，在層片F11以多層薄膜構成的情況下，能避免只有黏著於貼合筒32的薄膜層剝離的問題，也能避免貼合層片後，光學顯示部件P因貼合筒32的黏著力抬起而破損的問題。 As described above, even in the bonding apparatus 4 of the present embodiment, during the holding operation of the layer sheet F11, the end portion 31e of the layer sheet F11 which is first attached to the splicing cylinder 32 is kept in close contact with the affixing sheet. Coupling 32. Thereby, when bonding to the optical display member P, it is possible to suppress the occurrence of bubbles or wrinkles, the decrease in the precision of bonding, and the poor adhesion of the layer sheet F11 from the bonding tube 32. Further, since it is not necessary to enhance the adhesion of the bonding cylinder 32 for suppressing the bonding failure, when the layer sheet F11 is formed of a multilayer film, it is possible to avoid the problem that only the film layer adhered to the bonding cylinder 32 is peeled off. It is also possible to avoid the problem that the optical display member P is broken due to the adhesion of the bonding cylinder 32 after the lamination is applied.

再加上，即使於本實施形態中的貼合裝置4，也是基於第三檢測攝影機36的檢測資訊，進行保持於貼合平台41的光學顯示部件P之校準的同時，基於修正角度α，藉由將貼合平台41在水平面內只旋轉角度α，來進行相對於貼合筒32的光學顯示部件P之校準。因此，能提高層片F11及光學顯示部件P的貼合精度。並且，即使於本實施形態中的貼合裝置3，因為在對應於層片F11的四個角部之位置，也配置第二檢測攝影機35，所以能高 精度確認層片F11相對於貼合筒32的保持面32a之貼附位置。因此，能提高層片F11及光學顯示部件P的貼合精度。 Further, even in the bonding apparatus 4 of the present embodiment, the optical display unit P held by the bonding stage 41 is calibrated based on the detection information of the third detecting camera 36, and is based on the correction angle α. The alignment of the optical display member P with respect to the bonding cylinder 32 is performed by rotating the bonding platform 41 by only the angle α in the horizontal plane. Therefore, the bonding precision of the layer sheet F11 and the optical display member P can be improved. Further, even in the bonding apparatus 3 of the present embodiment, since the second detecting camera 35 is disposed at a position corresponding to the four corner portions of the layer sheet F11, the height can be high. The accuracy confirmation layer F11 is attached to the holding surface 32a of the bonding cylinder 32. Therefore, the bonding precision of the layer sheet F11 and the optical display member P can be improved.

並且，即使於本實施形態中的貼合裝置4，也具有第一檢測攝影機34，作為檢測印於光學組件層F1的缺陷標記之檢測手段，並且貼合筒32(貼合組件)之特徵在於將檢測出光學組件層F11的缺陷標記之部位保持於保持面32a，並搬送於廢棄位置。因此，提高光學顯示設備的良率。 Further, even in the bonding apparatus 4 of the present embodiment, the first detecting camera 34 is provided as a detecting means for detecting a defect mark printed on the optical component layer F1, and the bonding cylinder 32 (a bonding component) is characterized in that The portion where the defect mark of the optical component layer F11 is detected is held by the holding surface 32a, and is transported to the disposal position. Therefore, the yield of the optical display device is improved.

〔第五實施形態〕 [Fifth Embodiment]

以下，使用圖10來說明關於本發明的第五實施形態之光學顯示設備的生產系統。圖10係為關於本實施形態之光學顯示設備的生產系統之概略圖。 Hereinafter, a production system of an optical display device according to a fifth embodiment of the present invention will be described using FIG. Fig. 10 is a schematic view showing a production system of the optical display device of the embodiment.

本實施形態的生產系統1000係包含：洗淨裝置1001、第一貼合裝置1002、第二貼合裝置1003、剝離裝置1004、第三貼合裝置1005、及檢查裝置1006。 The production system 1000 of the present embodiment includes a cleaning device 1001, a first bonding device 1002, a second bonding device 1003, a peeling device 1004, a third bonding device 1005, and an inspection device 1006.

洗淨裝置1001洗淨從裝填機(圖未示)所搬入的光學顯示部件P，去除附著於光學顯示部件P的異物等。舉例來說，洗淨裝置1001能為水洗式，對光學顯示部件P的第一面(舉例來說，目視顯示於顯示區域的影像之側的面)及第二面(舉例來說，與目視顯示於顯示區域的影像之側為反對側的面)進行刷洗及水洗，於此之後，進行光學顯示部件P的第一面及第二面的排液。舉例來說，洗淨裝置1001也能為乾式，進行光學顯示部件P的正反面之静電去除及集塵。舉例來說，光學顯示部件P為液晶面板。 The cleaning device 1001 cleans the optical display member P carried in from a loading machine (not shown), and removes foreign matter or the like adhering to the optical display member P. For example, the cleaning device 1001 can be water-washed, with a first side of the optical display member P (for example, a side that is visually displayed on the side of the image of the display area) and a second side (for example, with visual inspection) The surface on the side opposite to the image displayed on the display area is brushed and washed with water, and thereafter, the first surface and the second surface of the optical display member P are drained. For example, the cleaning device 1001 can also be dry, and perform electrostatic removal and dust collection on the front and back surfaces of the optical display member P. For example, the optical display part P is a liquid crystal panel.

第一貼合裝置1002於光學顯示部件P的第一面貼合第一層片。舉例來說，第一貼合裝置係為第一實施形態的貼合裝置。舉例來說，第一層片係為對應於光學顯示部件P的外形尺寸之大小而切斷的片狀偏光板。於此，上述所謂的「對應於光學顯示部件P的外形尺寸之大小」係意味著，將該層片貼合於光學顯示部件P時，不會產生實際使用上會有問題的剩 餘部分之大小。第一層片具有與如圖3所示的層片相同之構成。舉例來說，於光學顯示部件P的中央部設置有顯示影像的顯示區域，於光學顯示部件P的端部設置有電路部件安裝部，電路部件安裝部具備有連接半導體晶片或可撓性印刷配線等的複數端子。舉例來說，此情況中，就第一層片而言，係使用具有較光學顯示部件P的顯示區域大且較光學顯示部件P的外形(平面視圖中之輪廓形狀)小的區域，且避開光學顯示部件P中之電路部件安裝部等功能部分的區域之大小的層片。 The first bonding apparatus 1002 adheres to the first layer on the first surface of the optical display member P. For example, the first bonding device is the bonding device of the first embodiment. For example, the first layer is a sheet-shaped polarizing plate that is cut corresponding to the size of the outer shape of the optical display member P. Here, the above-mentioned "corresponding to the size of the outer dimensions of the optical display member P" means that when the layer is bonded to the optical display member P, there is no problem in practical use. The size of the remaining part. The first ply has the same configuration as the ply shown in FIG. For example, a display area for displaying an image is provided at a central portion of the optical display member P, and a circuit component mounting portion is provided at an end of the optical display member P. The circuit component mounting portion is provided with a connection semiconductor wafer or a flexible printed wiring. Wait for the multiple terminals. For example, in this case, in the case of the first layer, a region having a larger display area than the optical display member P and smaller than the outer shape (contour shape in the plan view) of the optical display member P is used, and is avoided. A layer of a size of a region of a functional portion such as a circuit component mounting portion in the optical display member P is opened.

第二貼合裝置1003於光學顯示部件P的第二面貼合第二層片。舉例來說，第二層片係為對應光學顯示部件P的外形尺寸之大小而切斷的片狀偏光板。第一層片的穿透軸與第二層片的穿透軸相互垂直。 The second bonding device 1003 is attached to the second layer on the second surface of the optical display member P. For example, the second layer is a sheet-shaped polarizing plate that is cut to correspond to the size of the outer shape of the optical display member P. The transmission axis of the first ply is perpendicular to the transmission axis of the second ply.

舉例來說，於第一貼合裝置1002及第二貼合裝置1003間的搬送線上，設置有反轉光學顯示部件的正反之反轉裝置(圖未示)。 For example, a reverse-opposing device (not shown) that reverses the optical display member is provided on the transport line between the first bonding device 1002 and the second bonding device 1003.

剝離裝置1004從貼合於光學顯示部件P的第二面之第二層片剝離表面保護薄膜F4a。 The peeling device 1004 peels off the surface protective film F4a from the second layer bonded to the second surface of the optical display member P.

第三貼合裝置1005於藉由剝離裝置1004剝離表面保護薄膜F4a的第二層片之表面貼合第三層片。舉例來說，第三層片係為對應於光學顯示部件P的外形尺寸之大小而切斷的片狀輝度增加薄膜。輝度增加薄膜係為反射直線偏光的反射型偏光板，直線偏光係與穿透軸垂直。第二層片的穿透軸與第三層片的穿透軸相互垂直。 The third bonding apparatus 1005 bonds the surface of the second layer of the surface protective film F4a by the peeling device 1004 to the third layer. For example, the third layer is a sheet-like luminance increasing film that is cut corresponding to the size of the outer shape of the optical display member P. The luminance increasing film is a reflective polarizing plate that reflects linear polarization, and the linear polarizing system is perpendicular to the transmission axis. The transmission axis of the second ply is perpendicular to the transmission axis of the third ply.

檢查裝置1006對於光學顯示部件P，進行第一層片、第二層片及第三層片之位置是否正確(位置偏移是否於容許範圍內)等檢查。位置被判定不正確的光學顯示部件P藉由排出構件(圖未示)排出。 The inspection device 1006 checks whether the positions of the first layer, the second layer, and the third layer are correct (whether the positional shift is within an allowable range) for the optical display member P. The optical display member P whose position is determined to be incorrect is discharged by a discharge member (not shown).

貼合有第一層片至第三層片的光學顯示部件P，因應必要，於進行缺陷檢查(異物檢查等)、或電路部件的安裝等的附帶處理後，作為光 學顯示設備來出貨。 The optical display member P to which the first layer to the third layer are bonded is used as a light after performing a defect inspection (such as a foreign matter inspection) or a mounting of a circuit component, if necessary. Learn to display equipment to ship.

於以上之光學顯示設備的生產系統，就第一貼合裝置1002及第二貼合裝置1003而言，使用關於第一實施形態至第四實施形態的貼合裝置。藉此，能提供抑制該貼合不良的光學顯示設備。 In the production system of the optical display device described above, the first bonding apparatus 1002 and the second bonding apparatus 1003 use the bonding apparatus according to the first to fourth embodiments. Thereby, it is possible to provide an optical display device that suppresses the poor bonding.

〔第六實施形態〕 [Sixth embodiment]

以下，使用圖11、圖12A及圖12B，來說明關於本發明的第六實施形態之光學顯示設備的生產系統。 Hereinafter, a production system of an optical display device according to a sixth embodiment of the present invention will be described with reference to FIGS. 11, 12A and 12B.

於本實施形態，與第五實施形態相異的點在於：藉由貼合頭貼合於光學顯示部件P的層片F11係為較作為指定尺寸之光學組件大一些的層片之點；以及將層片F11貼合於光學顯示部件P後，將層片F11的剩餘部分藉由切斷裝置切斷的點。藉此，以下的說明中，主要說明層片F11的切斷製程。並且，關於與第一實施形態至第五實施形態共通的構成要素，賦予相同的符號，並省略詳細說明。 In the present embodiment, the difference from the fifth embodiment is that the layer F11 bonded to the optical display member P by the bonding head is a layer larger than the optical module having a predetermined size; After the layer F11 is bonded to the optical display member P, the remaining portion of the layer F11 is cut by the cutting device. Therefore, in the following description, the cutting process of the layer sheet F11 will be mainly described. The components that are the same as those of the first embodiment to the fifth embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

如圖11中的(a)、(b)所示，其係為說明本實施形態的光學顯示設備生產系統中的層片F11之切斷製程的圖。 As shown in (a) and (b) of FIG. 11, it is a view explaining the cutting process of the layer sheet F11 in the optical display device production system of the present embodiment.

舉例來說，層片F11係較對應於光學顯示部件P的外形尺寸之大小大一些。此處，上述的「對應光學顯示部件P的外形尺寸之大小」係意味著，貼合光學顯示部件P時，不會產生實際使用上會有問題的剩餘部分之大小。層片F11因為較對應於光學顯示部件P的外形尺寸大，所以將實際使用上會有問題的剩餘部分藉由切斷裝置184切斷。舉例來說，於光學顯示部件P的中央部設置有顯示影像的顯示區域，於光學顯示部件P的端部設置有電路部件安裝部，電路部件安裝部具備有半導體晶片或可撓性印刷配線等的複數端子。舉例來說，此情況中，將較光學顯示部件P的顯示區域大且較光學顯示部件P的外形(平面視圖中之輪廓形狀)小的區域，且避開光學顯 示部件P中之電路部件安裝部等功能部分的區域之大小的光學組件FO從層片F11切出。 For example, the layer F11 is larger than the outer size corresponding to the optical display part P. Here, the above-mentioned "the size of the external dimensions of the corresponding optical display member P" means that the size of the remaining portion which is problematic in actual use does not occur when the optical display member P is bonded. Since the layer F11 is larger in size corresponding to the outer shape of the optical display member P, the remaining portion which is problematic in practical use is cut by the cutting device 184. For example, a display region for displaying an image is provided at a central portion of the optical display member P, a circuit component mounting portion is provided at an end portion of the optical display member P, and the circuit component mounting portion is provided with a semiconductor wafer or a flexible printed wiring. Multiple terminals. For example, in this case, the display area larger than the display area of the optical display part P and smaller than the outer shape (the outline shape in the plan view) of the optical display part P, and avoiding the optical display The optical component FO of the size of the functional portion such as the circuit component mounting portion in the component P is cut out from the layer F11.

舉例來說，將層片F11貼合於光學顯示部件P的貼合裝置係與在第一實施形態說明的貼合裝置1相同。本實施形態中，於此貼合裝置的下游側之搬送線上，設置有檢測裝置189及切斷裝置184。 For example, the bonding apparatus in which the layer sheet F11 is bonded to the optical display member P is the same as that of the bonding apparatus 1 described in the first embodiment. In the present embodiment, the detecting device 189 and the cutting device 184 are provided on the conveying line on the downstream side of the bonding apparatus.

檢測裝置189係包含：拍攝裝置183，拍攝貼合有層片F11的光學顯示部件P。檢測裝置189基於拍攝裝置183的拍攝資訊，檢測層片F11的切斷線WCL(應切斷層片F11的位置)。 The detecting device 189 includes an imaging device 183 that captures an optical display member P to which a layer F11 is bonded. The detecting device 189 detects the cutting line WCL of the layer F11 (the position at which the layer sheet F11 should be cut) based on the photographing information of the photographing device 183.

舉例來說，拍攝裝置183從載置於切斷平台185的光學顯示部件P之上方，越過層片F11，拍攝光學顯示部件P。舉例來說，拍攝裝置183拍攝貼合有層片F11的光學顯示部件P之基板(舉例來說，濾色基板)的四角之影像。舉例來說，檢測裝置189影像處理此拍攝資訊來檢測基板的外周緣之位置，並檢測作為層片F11的切斷線WCL之外周緣的位置。 For example, the imaging device 183 photographs the optical display member P from above the optical display member P placed on the cutting platform 185 over the layer F11. For example, the imaging device 183 captures images of the four corners of the substrate (for example, the color filter substrate) to which the optical display member P of the layer F11 is attached. For example, the detecting device 189 image-processes the shooting information to detect the position of the outer circumference of the substrate, and detects the position of the outer periphery of the cutting line WCL as the layer F11.

藉由檢測裝置189所檢測的切斷線WCL之資訊，輸送至控制裝置190。控制裝置190基於從檢測裝置189所輸送的切斷線WCL之資訊，控制切斷裝置184，將層片F11沿著切斷線WCL切斷。藉此，切開與層片F11的顯示區域相對之第一區域FB、及第一區域FB的外側之第二區域FS，以將作為指定尺寸(基於光學顯示設備的規格而設定的大小)的光學組件FO從層片F11切出。 The information of the cutting line WCL detected by the detecting device 189 is sent to the control device 190. The control device 190 controls the cutting device 184 based on the information of the cutting line WCL conveyed from the detecting device 189, and cuts the layer F11 along the cutting line WCL. Thereby, the first region FB opposite to the display region of the layer F11 and the second region FS outside the first region FB are cut to have an optical size which is a designated size (a size set based on the specifications of the optical display device) The component FO is cut out from the layer F11.

層片F11的切斷線WCL係為對搬送線上所搬送的每個光學顯示部件P所檢測的切斷線WCL。藉此，即使每個光學顯示部件P有尺寸的偏差，也能將對應於光學顯示部件P的外形尺寸之大小的光學組件FO從層片F11確實地切出。 The cutting line WCL of the layer sheet F11 is a cutting line WCL detected by each of the optical display members P conveyed on the conveying line. Thereby, even if the optical display member P has a dimensional deviation, the optical component FO corresponding to the outer size of the optical display member P can be surely cut out from the layer F11.

於本說明書，將較作為指定大小的光學組件FO大的層片F11 貼合於光學顯示部件P後，將基於光學顯示部件P的拍攝資訊切斷層片F11的剩餘部分之方式稱為「窗型切斷方式」。本實施形態中，藉由採用窗型切斷方式，於光學顯示部件P目標位置，貼合目標大小之光學組件FO。藉由採用窗型切斷方式，得到以下的效果。 In this specification, a layer F11 which is larger than the optical component FO of a specified size will be used. After bonding to the optical display unit P, the method of cutting the remaining portion of the layer sheet F11 based on the photographing information of the optical display unit P is referred to as a "window type cutting method". In the present embodiment, the optical component FO of the target size is bonded to the target position of the optical display member P by the window type cutting method. By adopting the window type cutting method, the following effects are obtained.

(1)將光學組件貼合於光學顯示部件P之情況中，考慮光學顯示部件P及光學組件FO的各尺寸偏差、及相對於光學顯示部件P之光學組件FO的貼合偏差(位置偏移)等，原本必須將大一些的光學組件FO貼合於光學顯示部件P。然而，此方法中，在顯示於光學顯示部件P的顯示區域之周邊部形成沒有作用之額外區域(框緣區域)，阻礙機器的小型化。於採用窗型切斷方式之情況，拍攝貼合層片F11後的光學顯示部件P，因為基於此拍攝資訊切斷層片F11，所以能於作為指定位置確實地配置作為指定大小的光學組件FO。 (1) In the case where the optical component is bonded to the optical display component P, the dimensional deviation of the optical display component P and the optical component FO and the alignment deviation (positional offset) with respect to the optical component FO of the optical display component P are considered. ), etc., it is necessary to attach a larger optical component FO to the optical display component P. However, in this method, an additional area (frame area) which does not function is formed in the peripheral portion of the display region displayed on the optical display member P, which hinders the miniaturization of the machine. In the case of the window type cutting method, the optical display unit P after the bonding of the layer F11 is photographed, and since the layer F11 is cut based on the photographing information, the optical unit FO having a predetermined size can be reliably disposed as the designated position.

(2)層片F11的光學軸之方向藉由製造誤差，會有從原本設計的方向偏移之情況。此情況，預先測定準備的層片F11(光學組件層F1)之光學軸方向，基於此測定結果，雖然較佳係調整層片F11及光學顯示部件P的相對貼合位置，但若層片F11的大小與作為指定光學組件FO的大小一致，則不能進行這樣的調整。窗型切斷方式中，將較光學組件FO大的層片F11貼合於光學顯示部件P，因為於此之後切斷層片F11的剩餘部分，所以能進行這樣的調整。 (2) The direction of the optical axis of the layer F11 may be shifted from the original design direction due to manufacturing errors. In this case, the optical axis direction of the prepared layer F11 (optical element layer F1) is measured in advance, and based on the measurement result, although the relative bonding position of the layer F11 and the optical display member P is preferably adjusted, if the layer F11 is used, The size is the same as the size of the specified optical component FO, and such adjustment cannot be made. In the window type cutting method, the layer F11 larger than the optical unit FO is bonded to the optical display unit P, and since the remaining portion of the layer sheet F11 is cut thereafter, such adjustment can be performed.

舉例來說，相對於光學顯示部件P之層片F11的貼合位置(相對貼合位置)能如以下所述來決定。 For example, the bonding position (relative bonding position) with respect to the layer F11 of the optical display member P can be determined as described below.

首先，如圖12A所示，於光學組件層F1的寬度方向設定複數檢查點CP，於各檢查點CP檢測光學組件層F1的光學軸之方向。檢測光學軸的時機，可以是料捲滾筒R1(參照圖1)的製造時，也可以是從料捲滾筒R1 將、光學組件層F1捲出直到半切斷為止的期間。光學組件層F1的光學軸方向之資訊結合光學組件層F1的長邊方向之位置及寬度方向之位置後，記憶於記憶裝置(圖未示)。 First, as shown in FIG. 12A, a plurality of checkpoints CP are set in the width direction of the optical component layer F1, and the direction of the optical axis of the optical component layer F1 is detected at each of the inspection points CP. The timing of detecting the optical axis may be when the roll drum R1 (refer to FIG. 1) is manufactured, or may be from the roll drum R1. The period until the optical component layer F1 is wound up until half cut. The information of the optical axis direction of the optical component layer F1 is combined with the position of the optical component layer F1 in the longitudinal direction and the position in the width direction, and then stored in a memory device (not shown).

控制裝置190從該記憶裝置取得各檢查點CP的光學軸之資訊(光學軸的面內分佈之檢查資訊)，檢測切出層片F11的部分之光學組件層F1(藉由切割線CL分區的區域)的平均光學軸之方向。 The control device 190 acquires the information of the optical axis of each checkpoint CP (inspection information of the in-plane distribution of the optical axis) from the memory device, and detects the optical component layer F1 of the portion where the slice F11 is cut out (by the cutting line CL) The direction of the average optical axis of the area).

舉例來說，如圖12B所示，以光學軸方向及層片F11的邊緣線EL所夾角度(偏移角)作為θ，最大角度(最大偏移角)作為θmax，最小角度(最小偏移角)作為θmin時，檢測最大偏移角θmax及最小偏移角θmin的平均值θmid(=(θmax+θmin)/2)作為平均偏移角。然後，檢測相對於層片F11的邊緣線EL之平均偏移角θmid方向作為層片F11的平均光學軸方向。另外，舉例來說，該偏移角係以相對於層片F11的邊緣線EL逆時針方向為正角度，順時針方向為負角度而加以算出。 For example, as shown in FIG. 12B, the angle (offset angle) between the optical axis direction and the edge line EL of the layer F11 is taken as θ, the maximum angle (maximum offset angle) is taken as θmax, and the minimum angle (minimum offset) When θmin is θmin, the average value θmid (=(θmax+θmin)/2) of the maximum offset angle θmax and the minimum offset angle θmin is detected as the average offset angle. Then, the average offset angle θmid direction with respect to the edge line EL of the layer F11 is detected as the average optical axis direction of the layer F11. Further, for example, the offset angle is calculated by a positive angle in the counterclockwise direction with respect to the edge line EL of the layer sheet F11 and a negative angle in the clockwise direction.

然後，以上述的方法所檢測的光學組件層F1之平均光學軸方向，決定相對於光學顯示部件P之層片F11的貼合位置(相對貼合位置)，使得相對於光學顯示部件P的顯示區域P4之一邊呈目標角度。舉例來說，藉由設計規格將光學組件的光學軸方向設定為相對於顯示區域P4之一邊呈90°之方向的情況中，光學組件層F1的平均光學軸方向係相對於顯示區域P4之一邊呈90°地，將層片F11貼合於光學顯示部件P。 Then, the bonding position (relative bonding position) with respect to the layer F11 of the optical display member P is determined by the average optical axis direction of the optical component layer F1 detected by the above method, so that the display with respect to the optical display member P is made. One side of the area P4 is at a target angle. For example, in the case where the optical axis direction of the optical component is set to a direction of 90° with respect to one side of the display region P4 by design specifications, the average optical axis direction of the optical component layer F1 is relative to one side of the display region P4. The layer sheet F11 was bonded to the optical display member P at 90°.

於此之後，藉由如圖11中的(a)所示之檢測裝置189，檢測層片F11的切斷線WCL，藉由切斷裝置184，將層片F11沿著切斷線WCL切斷。藉此，精密地控制光學軸方向的光學組件FO於目標大小及目標位置來配置。藉此，能提供一種顯示品質優異的窄框緣之光學顯示設備DP。 After that, the cutting line WCL of the layer F11 is detected by the detecting device 189 shown in (a) of FIG. 11, and the layer F11 is cut along the cutting line WCL by the cutting device 184. . Thereby, the optical component FO precisely controlling the optical axis direction is disposed at the target size and the target position. Thereby, it is possible to provide an optical display device DP having a narrow frame edge excellent in display quality.

圖13係為關於本實施形態之光學顯示設備的生產系統2000 之概略圖。生產系統2000係為採用窗型切斷方式的生產系統。舉例來說，就於光學顯示部件P貼合較該光學組件大的層片之貼合裝置而言，生產系統2000係具備：在第一實施形態所說明的貼合裝置1。 Figure 13 is a production system 2000 for an optical display device of the present embodiment. Schematic diagram. The production system 2000 is a production system using a window type cutting method. For example, in the bonding apparatus in which the optical display member P is bonded to a layer larger than the optical unit, the production system 2000 includes the bonding apparatus 1 described in the first embodiment.

本實施形態的生產系統2000係包含：洗淨裝置2001、第一貼合裝置2002、第一切斷裝置2003、第二貼合裝置2004、第二切斷裝置2005、剝離裝置2006、第三貼合裝置2007、第三切斷裝置2008、及檢查裝置2009。 The production system 2000 of the present embodiment includes a cleaning device 2001, a first bonding device 2002, a first cutting device 2003, a second bonding device 2004, a second cutting device 2005, a peeling device 2006, and a third sticker. The device 2007, the third cutting device 2008, and the inspection device 2009.

洗淨裝置2001、第一貼合裝置2002、第二貼合裝置2004、剝離裝置2006、第三貼合裝置2007及檢查裝置2009各自具有與第六實施形態之洗淨裝置1001、第一貼合裝置1002、第二貼合裝置1003、剝離裝置1004、第三貼合裝置1005及檢查裝置1006相同的構成。 The cleaning device 2001, the first bonding device 2002, the second bonding device 2004, the peeling device 2006, the third bonding device 2007, and the inspection device 2009 each have the first bonding device with the cleaning device 1001 of the sixth embodiment. The device 1002, the second bonding device 1003, the peeling device 1004, the third bonding device 1005, and the inspection device 1006 have the same configuration.

但是，第一貼合裝置2002、第二貼合裝置2004及第三貼合裝置2007中，將較作為指定大小的光學組件大一些的層片貼合於光學顯示部件P。 However, in the first bonding apparatus 2002, the second bonding apparatus 2004, and the third bonding apparatus 2007, a layer larger than an optical component of a predetermined size is attached to the optical display part P.

第一切斷裝置2003、第二切斷裝置2005及第三切斷裝置2008具有與上述的切斷裝置184及檢測裝置189相同的構成。換言之，第一切斷裝置2003、第二切斷裝置2005及第三切斷裝置2008中，採用將貼合有較作為指定大小之光學組件大的層片F11之光學顯示部件P藉由拍攝裝置來拍攝後，基於此拍攝資訊切斷層片的剩餘部分之窗型切斷方式。藉此，能提供一種顯示品質優異的窄框緣之光學顯示設備DP。 The first cutting device 2003, the second cutting device 2005, and the third cutting device 2008 have the same configuration as the above-described cutting device 184 and detecting device 189. In other words, in the first cutting device 2003, the second cutting device 2005, and the third cutting device 2008, the optical display member P to which the layer F11 larger than the optical component of a predetermined size is attached is used by the imaging device After the shooting, the window cut mode of the remaining portion of the layer is cut based on the shooting information. Thereby, it is possible to provide an optical display device DP having a narrow frame edge excellent in display quality.

以上，一邊參考所附加之圖式，一邊說明關於本發明之合適實施形態例，但並不是說限定於關於本發明之例。上述的例中所示之各構成組件的多個形狀或組合等係為一例，於不偏離本發明之主旨的範圍中，基於設計要求等的各種變化皆為可能。 Although the preferred embodiments of the present invention have been described above with reference to the attached drawings, the present invention is not limited to the examples of the present invention. The various shapes, combinations, and the like of the respective constituent elements shown in the above-described examples are merely examples, and various changes based on design requirements and the like are possible without departing from the gist of the invention.

【產業上的可利用性】 [Industrial availability]

根據關於本發明之貼合裝置、光學顯示設備的生產系統、貼 合方法及光學顯示設備的生產方法，能提供一種可抑制貼合不良的貼合裝置、貼合方法、光學顯示設備的生產系統及光學顯示設備的生產方法。 According to the laminating device, the production system of the optical display device, and the sticker according to the present invention The method and the method for producing an optical display device can provide a bonding apparatus, a bonding method, a production system of an optical display device, and a production method of an optical display device capable of suppressing poor bonding.

Claims (11)

一種貼合裝置，係為於光學顯示部件貼合層片的貼合裝置，包含：捲出部，從料捲滾筒與分離層一同捲出光學組件層；切斷部，殘留該分離層地將該光學組件層切斷以形成該層片；層平台，支撐貼附有該層片的分離層；貼合平台，保持該光學顯示部件；貼合組件，具有保持該層片之彎曲的保持面，對於藉由該層平台從該分離層側支撐的層片，可藉由一邊接觸該保持面而一邊轉動，來進行將該層片保持於該保持面的保持動作，以及可藉由一邊將保持於該保持面的層片接觸於保持在該貼合平台上的光學顯示部件而一邊轉動，來進行貼合該光學顯示部件的貼合動作；及捲取機構，可進行將通過該層平台的分離層往分離滾筒捲取的捲取動作，以及可於該層片之保持動作開始的瞬間之特定期間中，進行將捲取於該分離滾筒的分離層反捲，讓該分離層鬆弛使得該層片不會從該分離層剝離的反捲動作。 A bonding device is a bonding device for bonding a layer to an optical display member, comprising: a winding portion that winds out an optical component layer together with a separation layer from a roll roller; and a cutting portion that remains the separation layer The optical component layer is cut to form the layer; the layer platform supports the separation layer to which the layer is attached; the bonding platform holds the optical display component; and the bonding component has a holding surface that maintains the bending of the layer The layer piece supported from the separation layer side by the layer platform can be rotated while being in contact with the holding surface to perform the holding operation of holding the layer sheet on the holding surface, and can be performed by one side The layer held on the holding surface is rotated while being in contact with the optical display member held on the bonding platform to perform bonding operation for bonding the optical display member; and the winding mechanism can pass through the platform The winding operation of the separation layer to the separation drum, and the separation of the separation layer wound on the separation drum during the specific period of the moment when the holding operation of the layer is started, the separation layer is relaxed Plies from the separating operation is not exfoliated rewind. 如請求項1所述之貼合裝置，其中，該捲取機構由捲取部及夾壓滾筒部構成；該捲取部保持該分離滾筒的同時，可進行該捲取動作及該反捲動作；及該夾壓滾筒部可與該捲取部同步，進行該捲取動作及該反捲動作。 The bonding apparatus according to claim 1, wherein the winding mechanism is constituted by a winding portion and a pinch roller portion; and the winding portion holds the separation roller and performs the winding operation and the rewinding operation And the nip roller portion is synchronized with the winding portion to perform the winding operation and the rewinding operation. 如請求項1所述之貼合裝置，其中，該捲取機構由捲取部構成；該捲取部保持該分離滾筒的同時，可進行該捲取動作及該反捲動作。 The bonding apparatus according to claim 1, wherein the winding mechanism is constituted by a winding portion, and the winding portion holds the separation roller and performs the winding operation and the rewinding operation. 如請求項1至3中任一項所述之貼合裝置，更具備：加壓組件，於該保持動作時，從上方加壓已剝離該層片的分離層。 The bonding apparatus according to any one of claims 1 to 3, further comprising: a pressurizing unit that presses the separation layer from which the layer is peeled off from above when the holding operation is performed. 如請求項1至3中任一項所述之貼合裝置，更具備：檢測部，檢測保持於該貼合組件的層片相對於該貼合組件之相對位 置；及控制裝置，基於該檢測部的檢測結果，相對於保持該層片的貼合組件，控制保持於該貼合平台上的光學顯示部件之相對位置。 The bonding apparatus according to any one of claims 1 to 3, further comprising: a detecting unit that detects a relative position of the layer held by the bonding component relative to the bonding component And the control device controls the relative position of the optical display member held on the bonding platform with respect to the bonding assembly holding the layer based on the detection result of the detecting portion. 如請求項1至3中任一項所述之貼合裝置，更具有：檢測構件，檢測印記於該光學組件層的缺陷標記；其中，該貼合組件將檢測出該光學組件層的缺陷標記之部位保持於保持面，並搬送於廢棄位置。 The bonding apparatus according to any one of claims 1 to 3, further comprising: a detecting member that detects a defect mark imprinted on the optical component layer; wherein the bonding component detects a defect mark of the optical component layer The part is held on the holding surface and transported to the disposal position. 一種光學顯示設備的生產系統，係為於光學顯示部件貼合光學組件來形成光學顯示設備的生產系統，包含：貼合裝置，於該光學顯示部件貼合作為該光學組件的層片；其中，該貼合裝置係為如請求項1至6中任一項所述之貼合裝置。 A production system for an optical display device is a production system for forming an optical display device by attaching an optical component to an optical display component, comprising: a bonding device, wherein the optical display component is bonded to a layer of the optical component; The bonding device is the bonding device according to any one of claims 1 to 6. 一種光學顯示設備的生產系統，係為於光學顯示部件貼合光學組件來形成光學顯示設備的生產系統，包含：貼合裝置，於該光學顯示部件貼合較該光學組件大的層片；檢測裝置，拍攝貼合有該層片的光學顯示部件，基於此拍攝資訊，檢測該層片的切斷線；及切斷裝置，藉由沿該切斷線切斷貼合於該光學顯示部件的層片，以從該層片切出該光學組件；其中，該貼合裝置係為如請求項1至6中任一項所述之貼合裝置。 A production system for an optical display device is a production system for forming an optical display device by attaching an optical component to an optical display component, comprising: a bonding device, wherein the optical display component is attached to a layer larger than the optical component; a device that photographs an optical display member to which the layer is attached, detects a cutting line of the layer based on the photographing information, and a cutting device that cuts and attaches to the optical display member along the cutting line And a laminating device for cutting the optical component from the ply; wherein the bonding device is a laminating device according to any one of claims 1 to 6. 一種貼合方法，係為於光學顯示部件貼合層片的貼合方法，具有：捲出製程，從料捲滾筒與分離層一同捲出光學組件層；切斷製程，殘留該分離層地將該光學組件層切斷以形成該層片；保持製程，對於藉由層平台從該分離層側支撐的層片，藉由一邊接觸貼合組件的保持面，而一邊轉動該貼合組件，來將該層片保持於該保 持面；貼合製程，將保持於該保持面的層片一邊接觸保持於貼合平台上的光學顯示部件，而一邊轉動該貼合組件，來將該層片貼合於該光學顯示部件；捲取製程，將通過該層平台的分離層往分離滾筒捲取；及反捲製程，於該層片之保持動作開始的瞬間之特定期間中，將捲取於該分離滾筒的分離層反捲，讓該分離層鬆弛使得該層片不會從該分離層剝離。 A bonding method is a method for bonding an optical display member to a laminated sheet, comprising: a winding-out process, winding out the optical component layer together with the separation roller and the separation layer; cutting the process, leaving the separation layer The optical component layer is cut to form the layer; and the process is maintained, and the layer supported from the side of the separation layer by the layer platform is rotated while the bonding component is rotated while contacting the bonding surface of the bonding component. Keep the layer in the insurance a bonding process, the optical display member held on the holding surface is contacted with the optical display member held on the bonding platform, and the bonding assembly is rotated to bond the layer to the optical display member; The take-up process, which is taken up by the separation layer of the platform to the separation drum; and the rewinding process, in a specific period of the moment when the holding operation of the layer is started, the separation layer wound up on the separation drum is rewinded The separation layer is allowed to relax so that the plies are not peeled off from the separation layer. 一種光學顯示設備的生產方法，係為於光學顯示部件貼合光學組件來形成光學顯示設備的生產方法，包含：貼合製程，於該光學顯示部件貼合作為該光學組件的層片；其中，該貼合製程係使用如請求項9所述之貼合方法來進行。 A method for producing an optical display device is a method for producing an optical display device by bonding an optical component to an optical display component, comprising: a bonding process, wherein the optical display component is bonded to a layer of the optical component; wherein The bonding process is carried out using the bonding method as described in claim 9. 一種光學顯示設備的生產方法，係為於光學顯示部件貼合光學組件來形成光學顯示設備的生產方法，包含：貼合製程，於該光學顯示部件貼合較該光學組件大的層片；檢測製程，拍攝貼合有該層片的光學顯示部件，基於此拍攝資訊，檢測該層片的切斷線；及切斷製程，藉由沿該切斷線切斷貼合於該光學顯示部件的層片，以從該層片切出該光學組件；其中，該貼合製程係使用如請求項9所述之貼合方法來進行。 A method for producing an optical display device, which is a method for producing an optical display device by bonding an optical component to an optical display component, comprising: a bonding process, wherein the optical display component is attached to a layer larger than the optical component; a process of photographing an optical display member to which the layer is attached, detecting a cutting line of the layer based on the photographing information; and cutting a process by cutting the optical display member along the cutting line A layer is formed to cut the optical component from the ply; wherein the lamination process is performed using the lamination method as described in claim 9.
TW104124415A 2014-08-06 2015-07-28 Adhering device, production system of optical display device, adhering method, and method of producing optical display device TWI638753B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2014-160753 2014-08-06
JP2014160753A JP2016038447A (en) 2014-08-06 2014-08-06 Pasting device, production system of optical display device, pasting method, and production method of optical display device

Publications (2)

Publication Number Publication Date
TW201612071A TW201612071A (en) 2016-04-01
TWI638753B true TWI638753B (en) 2018-10-21

Family

ID=55263717

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104124415A TWI638753B (en) 2014-08-06 2015-07-28 Adhering device, production system of optical display device, adhering method, and method of producing optical display device

Country Status (5)

Country Link
JP (1) JP2016038447A (en)
KR (1) KR102325151B1 (en)
CN (1) CN106536355B (en)
TW (1) TWI638753B (en)
WO (1) WO2016021446A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2907383A1 (en) 2013-04-26 2014-11-27 Avery Dennison Corporation Apparatus for dispensing pressure sensitive adhesive labels onto a substrate
US20210141269A1 (en) * 2017-05-23 2021-05-13 Sakai Display Products Corporation Polarizer attachment device and polarizer attachment method
CN113716166B (en) * 2021-08-27 2022-05-27 杭州中芯微信息技术有限公司 Electronic tags fixes a position and pastes device
CN115057296B (en) * 2022-08-18 2022-11-25 苏州奇达创机械有限公司 Adhesive tape pasting equipment for automobile overlong curved surface display screen

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08217036A (en) * 1995-02-17 1996-08-27 Tec Corp Device for peeling off label
JP2002167117A (en) 2000-11-30 2002-06-11 Sumitomo Bakelite Co Ltd Film peeling-off device and peeling-off method
JP2004017623A (en) 2002-06-20 2004-01-22 Murata Mfg Co Ltd Method for releasing carrier film and carrier film releasing device
JP2006044152A (en) * 2004-08-06 2006-02-16 Nitto Denko Corp Adhesive film pasting device
JP2006056584A (en) * 2004-08-23 2006-03-02 Sato Corp Label pasting apparatus
JP2006076587A (en) * 2004-09-07 2006-03-23 Sato Corp Label releasing apparatus
JP4482757B2 (en) 2005-01-19 2010-06-16 Ｊｐテック株式会社 Sheet material pasting device
JP4885483B2 (en) * 2005-06-06 2012-02-29 リンテック株式会社 Transfer device and method, peeling device and method, sticking device and method
JP4775948B2 (en) * 2005-11-17 2011-09-21 日東電工株式会社 Optical display device manufacturing system and manufacturing method thereof
TWI541569B (en) * 2008-03-31 2016-07-11 住友化學股份有限公司 Apparatus and method for manufacturing polarizing plate
CN102395918B (en) * 2010-04-23 2014-07-02 住友化学株式会社 Lamination device of polarizing film, and system for producing liquid crystal display device provided with same
US20130126100A1 (en) 2010-08-10 2013-05-23 Lintec Corporation Sheet separation apparatus and separation method, and sheet attaching apparatus and attaching method
JP5667522B2 (en) * 2011-06-09 2015-02-12 住友化学株式会社 Optical display device manufacturing system and optical display device manufacturing method

Also Published As

Publication number Publication date
KR102325151B1 (en) 2021-11-12
WO2016021446A1 (en) 2016-02-11
CN106536355B (en) 2018-10-30
TW201612071A (en) 2016-04-01
KR20170041216A (en) 2017-04-14
JP2016038447A (en) 2016-03-22
CN106536355A (en) 2017-03-22

Similar Documents

Publication Publication Date Title
JP4371709B2 (en) Optical film sticking apparatus and method
JP4503691B1 (en) Method and apparatus for continuous production of liquid layer display element
JP5692712B2 (en) Optical display device production system
WO2009128115A1 (en) Optical film layered roll and method and device for manufacturing the same
TWI661943B (en) Adhering device,adhering method, production device of optical display device, and production method of thereof
KR102172312B1 (en) Bonding apparatus, bonding method, system for manufacturing optical display devices, and method for manufacturing optical display device
TWI638753B (en) Adhering device, production system of optical display device, adhering method, and method of producing optical display device
TW201350988A (en) Production system of optical display device
TWI551913B (en) A manufacturing method of a liquid crystal display element, and a manufacturing system of a liquid crystal display device
TWI656033B (en) Adhering device, adhering method, production device of optical display device, and production method thereof
WO2014129353A1 (en) Production system and production method for optical display device
WO2015029998A1 (en) Film bonding device, optical-display-device production system, and optical-display-device production method
TWI665497B (en) Adhering device, adhering method, production device of optical display device, and production method thereof
TW201506491A (en) Production system for optical display device