TWI637141B - Heat treatment furnace and heat treatment method - Google Patents

Heat treatment furnace and heat treatment method Download PDF

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TWI637141B
TWI637141B TW103127567A TW103127567A TWI637141B TW I637141 B TWI637141 B TW I637141B TW 103127567 A TW103127567 A TW 103127567A TW 103127567 A TW103127567 A TW 103127567A TW I637141 B TWI637141 B TW I637141B
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space
conveying
heat treatment
conveyance
temperature
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TW103127567A
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TW201525395A (en
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橋本孝彥
新井誠
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日商日本碍子股份有限公司
日商Ｎｇｋ凱倫泰克股份有限公司
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/02—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity of multiple-track type; of multiple-chamber type; Combinations of furnaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/04—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity adapted for treating the charge in vacuum or special atmosphere
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/14—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment
    • F27B9/20—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path tunnel furnace
    • F27B9/24—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path tunnel furnace being carried by a conveyor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/14—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment
    • F27B9/20—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path tunnel furnace
    • F27B9/26—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path tunnel furnace on or in trucks, sleds, or containers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
    • F27B9/38—Arrangements of devices for charging
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D3/00—Charging; Discharging; Manipulation of charge
    • F27D3/12—Travelling or movable supports or containers for the charge
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D5/00—Supports, screens, or the like for the charge within the furnace
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D5/00—Supports, screens, or the like for the charge within the furnace
    • F27D2005/0081—Details

Abstract

在熱處理爐10，在藉第1加熱器21a對第1空間11a之環境氣體加熱，並藉第2加熱器21b對第2空間11b之環境氣體加熱成比第1空間11a更高溫的狀態，藉可變速搬運輥20c以比第1、第2搬運輥20a、20b更高速之可變速區域內的既定速度使藉第1搬運輥20a在第1空間11a內所搬運的被處理物96通過搬運通路11c，並搬運至第2搬運輥20b。搬運通路11c之間隙高度H係25mm以上且35mm以下。搬運通路11c之搬運方向長度L係該間隙高度H之3倍以上。 In the heat treatment furnace 10, the ambient gas in the first space 11a is heated by the first heater 21a, and the ambient gas in the second space 11b is heated by the second heater 21b to a higher temperature than the first space 11a. The variable-speed conveyance roller 20c passes the processing object 96 conveyed in the first space 11a by the first conveyance roller 20a at a predetermined speed in a variable-speed area that is faster than the first and second conveyance rollers 20a and 20b. 11c, and carry it to the 2nd conveyance roller 20b. The clearance height H of the conveyance path 11c is 25 mm or more and 35 mm or less. The length L of the transport path 11c in the transport direction is three times or more the height H of the gap.

Description

熱處理爐及熱處理方法 Heat treatment furnace and heat treatment method

本發明係有關於熱處理爐及熱處理方法。 The present invention relates to a heat treatment furnace and a heat treatment method.

以往，已知對被處理物進行熱處理之熱處理爐。例如在專利文獻1，記載一面以多個輥移送由基材與電極所構成之被烘烤品一面進行熱處理的輥道烤爐。記載在本輥道烤爐，在以平常速度搬運被烘烤品之平常搬運區域的途中，設置以比平常速度更高速搬運被烘烤品之高速搬運區域。又，記載在高速搬運區域之爐內，設置於輸出比平常搬運區域更高的加熱源。藉此，在高速搬運區域使被烘烤品急速升溫，而可使被烘烤品中之基材與電極的收縮時序接近。 Conventionally, a heat treatment furnace which heat-processes a to-be-processed object is known. For example, Patent Document 1 describes a roller table oven that heat-processes a to-be-baked product composed of a substrate and an electrode while transferring it by a plurality of rollers. It is described in this roller table oven that a high-speed conveying area for conveying to-be-baked products at a higher speed than usual is set in the normal conveying area for conveying to-be-baked products at normal speed. The furnace described in the high-speed conveyance area is installed in a heating source with a higher output than the normal conveyance area. Thereby, the to-be-baked product is rapidly heated in the high-speed conveyance area, and the shrinkage timing of the substrate and the electrode in the to-be-baked product can be made close.

【先行專利文獻】 [Leading Patent Literature]

【專利文獻】 [Patent Literature]

[專利文獻1]特開2009-229013號公報 [Patent Document 1] JP 2009-229013

可是，使被處理物急速升溫的情況，需要使升溫之前後的溫差變成因應於被處理物之適當的值。可是，由於升溫之前後之從空間的一方往另一方之輻射等的影響，升溫之前後的溫差不會變大，而有不會變成因應於被處理物之適當的溫 差的情況。又，關於使被處理物急速降溫的情況，亦一樣地有降溫之前後的溫差不會變成因應於被處理物之適當的溫差的情況。因此，希望作成可使前後之空間的溫差變成更大，而可實現對應於多種被處理物的急速升溫或急速降溫(急速升降溫)的熱處理爐。 However, in the case of rapidly increasing the temperature of the object to be processed, it is necessary to make the temperature difference before and after the temperature increase to an appropriate value according to the object to be processed. However, due to the influence of radiation from one side of the space to the other before and after the heating, the temperature difference before and after the heating will not increase, and it will not become an appropriate temperature according to the object to be processed. Poor situation. Also, regarding the case where the temperature of the object to be processed is rapidly lowered, the temperature difference between before and after the temperature reduction may not become an appropriate temperature difference according to the object to be processed. Therefore, it is desirable to create a heat treatment furnace that can increase the temperature difference between the space before and after and can rapidly increase or decrease the temperature (rapid temperature rise and fall) corresponding to a variety of objects to be processed.

本發明係為了解決這種課題而開發的，其主要目的在於可實現對應於多種被處理物之急速升降溫。 The present invention was developed in order to solve such a problem, and its main object is to enable rapid temperature rise and fall corresponding to a variety of objects to be processed.

本發明之熱處理爐係對被處理物進行熱處理的熱處理爐，其包括：爐體，係具有：第1空間；第2空間；及間壁，係形成搬運通路，而且將該第1空間與該第2空間隔開，而該搬運通路係使該第1空間與該第2空間連通並搬運該被處理物之通路，鉛垂方向之間隙高度H係25mm以上且35mm以下；溫度調整手段，係使該第1空間之環境氣體與該第2空間之環境氣體的溫度相異；及搬運手段，係按照該第1空間內、該搬運通路及該第2空間內之順序搬運該被處理物。 The heat treatment furnace of the present invention is a heat treatment furnace that heat-processes an object to be processed. The heat treatment furnace includes: a furnace body having: a first space; a second space; and a partition wall forming a conveying path, and the first space and the The second space is separated, and the conveying path is a path for communicating the first space with the second space and conveying the object to be processed. The vertical gap height H is 25 mm or more and 35 mm or less. The temperature of the ambient gas in the first space is different from the temperature of the ambient gas in the second space; and the transport means transports the object to be processed in the order of the first space, the transport path, and the second space.

在該本發明之熱處理爐在使第1空間之環境氣體與第2空間之環境氣體的溫度相異之狀態，按照第1空間內、搬運通路及第2空間內之順序搬運被處理物。藉此，被處理物係藉由從第1空間通過搬運通路內後，被搬運至溫度相異的第2空間，被急速升降溫。而且，搬運通路係鉛垂方向之間隙高度H成為25mm以上且35mm以下。藉由將間隙高度H設為35mm以下，抑制來自第1空間與第2空間之一方的輻射通過搬運通路後到達另一方。藉此，易使第1空間之環境氣體與第 2空間之環境氣體的溫差變大。因此，易使降溫之前後的溫差變成因應於被處理物之適當的值，而可實現對應於各種被處理物的急速升降溫。又，藉由將間隙高度H設為25mm以上，可充分確保被處理物所通過之間隙。在此，間隙高度H係作為在沿著搬運手段之搬運方向觀察搬運通路時之鉛垂方向之間隙的大小。又，在具有在沿著搬運手段之搬運方向觀察搬運通路時之鉛垂方向之間隙的大小相異之位置的情況，將最小值作為間隙高度H。在此，亦可該被處理物係採用在被載置於承載板之狀態被搬運至該搬運手段者。 In the heat treatment furnace of the present invention, in a state where the temperature of the ambient gas in the first space and the temperature of the ambient gas in the second space are different, the object to be processed is transported in the order of the first space, the transport path, and the second space. Thereby, the to-be-processed object is conveyed to the 2nd space with a different temperature after passing through a conveyance path from a 1st space, and it is heated up and down rapidly. The clearance height H in the vertical direction of the conveyance path is 25 mm or more and 35 mm or less. By setting the gap height H to 35 mm or less, radiation from one of the first space and the second space is suppressed from reaching the other side after passing through the conveyance path. As a result, the ambient gas in the first space and the The temperature difference of the ambient gas in 2 space becomes large. Therefore, it is easy to make the temperature difference before and after the temperature decrease to an appropriate value according to the object to be processed, and it is possible to realize rapid temperature rise and fall corresponding to various objects to be processed. In addition, by setting the gap height H to 25 mm or more, it is possible to sufficiently secure a gap through which an object to be processed passes. Here, the gap height H is the size of the gap in the vertical direction when the transport path is viewed along the transport direction of the transport means. When there is a difference in the size of the gap in the vertical direction when the conveyance path is viewed along the conveyance direction of the conveyance means, the minimum value is taken as the clearance height H. Here, the object to be processed may be a person who is transported to the transportation means while being placed on a carrier plate.

在本發明之熱處理爐，亦可該溫度調整手段係具備第1溫度調整手段與第2溫度調整手段之至少一方，而該第1溫度調整手段係對該第1空間之環境氣體的溫度加熱或冷卻，該第2溫度調整手段係對該第2空間之環境氣體的溫度加熱或冷卻。又，該第1溫度調整手段係亦可作為對該第1空間之環境氣體加熱的第1加熱手段，亦可作為對該第1空間之環境氣體冷卻的第1冷卻手段。該第2溫度調整手段係亦可作為對該第2空間之環境氣體加熱的第2加熱手段，亦可作為對該第2空間之環境氣體冷卻的第2冷卻手段。在具備該第1加熱手段的情況，該第2加熱手段係亦可作為將該第2空間之環境氣體加熱至比該第1空間更高溫的手段，亦可作為將該第2空間之環境氣體加熱至比該第1空間更低溫的手段。在具備該第1加熱手段的情況，該第2冷卻手段係亦可作為將該第2空間之環境氣體冷卻至比該第1空間更低溫的手段。在具備該第1冷卻手段的情況，該第2加熱手段係亦可作為將該第2空間之 環境氣體加熱至比該第1空間更高溫的手段。在具備該第1冷卻手段的情況，該第2冷卻手段係亦可作為將該第2空間之環境氣體冷卻至比該第1空間更高溫的手段，亦可作為將該第2空間之環境氣體冷卻至比該第1空間更低溫的手段。又，該第1加熱手段係亦可作為將該第1空間之環境氣體加熱至500℃~850℃者。該第2加熱手段係亦可作為將該第2空間之環境氣體加熱至1000℃~1350℃者。又，該溫度調整手段係亦可作為將該第1空間與該第2空間之至少一方加熱或冷卻成該第1空間之環境氣體與該第2空間之環境氣體的溫差成為400℃~600℃者。 In the heat treatment furnace of the present invention, the temperature adjustment means may include at least one of the first temperature adjustment means and the second temperature adjustment means, and the first temperature adjustment means may heat the temperature of the ambient gas in the first space or For cooling, the second temperature adjustment means is to heat or cool the temperature of the ambient gas in the second space. In addition, the first temperature adjustment means may be used as a first heating means for heating the ambient gas in the first space, or as a first cooling means for cooling the ambient gas in the first space. The second temperature adjustment means may be used as a second heating means for heating the ambient gas in the second space, or as a second cooling means for cooling the ambient gas in the second space. When the first heating means is provided, the second heating means may be used as a means for heating the ambient gas in the second space to a higher temperature than the first space, or may be used as the ambient gas in the second space. Means for heating to a lower temperature than the first space. When the first heating means is provided, the second cooling means may be used as a means for cooling the ambient gas in the second space to a lower temperature than the first space. When the first cooling means is provided, the second heating means can also be used as the second space. Means for heating the ambient gas to a higher temperature than the first space. When the first cooling means is provided, the second cooling means may be used as a means for cooling the ambient gas in the second space to a higher temperature than the first space, or may be used as the ambient gas in the second space. Means for cooling to a lower temperature than the first space. The first heating means can also be used to heat the ambient gas in the first space to 500 ° C to 850 ° C. The second heating means can also be used to heat the ambient gas in the second space to 1000 ° C to 1350 ° C. In addition, the temperature adjustment means may also be used to heat or cool at least one of the first space and the second space to a temperature difference between the ambient gas of the first space and the ambient gas of the second space of 400 ° C to 600 ° C. By.

在本發明之熱處理爐，亦可採用該搬運通路之搬運方向長度L係間隙高度H的3倍以上者。藉由將搬運方向長度L設為間隙高度H的3倍以上，抑制來自第1空間與第2空間之一方的輻射通過搬運通路後到達另一方。藉此，易使第1空間之環境氣體與第2空間之環境氣體的溫差變大，而可實現對應於更多種被處理物的急速升降溫。 In the heat treatment furnace of the present invention, the length L in the conveying direction of the conveying path may be three times or more the height H of the gap. By setting the length L in the conveying direction to three times or more the gap height H, radiation from one of the first space and the second space is suppressed from reaching the other side after passing through the conveying path. This makes it easy to increase the temperature difference between the ambient gas in the first space and the ambient gas in the second space, and enables rapid temperature rise and fall corresponding to more types of objects to be processed.

在本發明之熱處理爐，亦可該搬運手段係具有：第1搬運手段，係在該第1空間內搬運該被處理物；第2搬運手段，係在該第2空間內搬運該被處理物；及可變速搬運手段，係使該第1搬運手段所搬運之該被處理物在既定搬運方向通過該搬運通路內並搬運至該第2搬運手段，並可在比該第1搬運手段及該第2搬運手段更高速之可變速區域內變更該搬運速度。被處理物之升降溫速度(溫度變化速度)係因應於搬運通路內之搬運速度而變化，但是該搬運速度係可在可變速區域之範 圍內變更。因此，可因應於被處理物來變更升降溫速度，而可實現對應於各種被處理物的急速升降溫。在此，該可變速區域係亦可採用以可至少在150℃/min~750℃/min之範圍變更通過該搬運通路時之該被處理物的升降溫速度的方式所決定的區域，亦可採用以可至少在150℃/min~1000℃/min之範圍變更的方式所決定的區域。又，該被處理物係亦可採用在被載置於承載板之狀態被搬運至該第1、第2搬運手段及該可變速搬運手段者。此外，在可變速區域為相同之數值範圍的情況，第1、第2空間之溫差愈大，可變更之升降溫速度的範圍變成愈寬。又，在第1、第2空間之溫差等值的情況，可變速區域係愈寬之數值範圍，可變更之升降溫速度的範圍變成愈寬。 In the heat treatment furnace of the present invention, the conveying means may include: a first conveying means for conveying the object to be processed in the first space; and a second conveying means for conveying the object to be processed in the second space. ; And a variable-speed conveyance means that the object to be processed conveyed by the first conveyance means passes through the conveyance path in a predetermined conveyance direction and is conveyed to the second conveyance means, The second conveyance means changes the conveyance speed in a higher-speed variable speed region. The heating and cooling speed (temperature change speed) of the processed object changes according to the conveying speed in the conveying path, but the conveying speed can be within the range of the variable speed area. Changes in the area. Therefore, the temperature rise and fall speed can be changed according to the object to be processed, and rapid temperature rise and fall corresponding to various objects can be realized. Here, the variable speed region may be an area determined in such a manner that the temperature rise and fall speed of the object to be processed when passing through the conveyance path can be changed at least within a range of 150 ° C / min to 750 ° C / min, or An area determined in such a way that it can be changed at least from 150 ° C / min to 1000 ° C / min. In addition, the object to be processed may be a person who is transported to the first and second conveyance means and the variable speed conveyance means while being placed on a carrier plate. In addition, when the variable speed ranges are in the same numerical range, the larger the temperature difference between the first and second spaces, the wider the range of the temperature rise and fall speed that can be changed. Further, in the case of the temperature difference and the like in the first and second spaces, the wider the variable speed range is, the wider the range of the temperature rise and fall speed that can be changed becomes.

此外，在本發明之熱處理爐，亦可包括：速度取得手段，係取得在該熱處理時之該可變速區域內的既定速度；及可變速搬運控制手段，係將該可變速搬運手段控制成以該既定速度搬運該被處理物。在此情況，該速度取得手段係亦可採用從使用者輸入該既定速度之手段。又，該速度取得手段係亦可採用根據從使用者所輸入之資訊與預先記憶於記憶手段之資訊的至少任一個來導出該既定速度之手段。 In addition, the heat treatment furnace of the present invention may further include: a speed obtaining means for obtaining a predetermined speed in the variable speed area during the heat treatment; and a variable speed conveyance control means for controlling the variable speed conveying means to The object to be processed is transported at the predetermined speed. In this case, the speed obtaining means may be a means of inputting the predetermined speed from a user. The speed obtaining means may be a means for deriving the predetermined speed based on at least any one of information input from a user and information previously stored in the memory means.

在本發明之熱處理爐，亦可該搬運手段係具有複數個搬運輥，該搬運輥係在該搬運通路內在係搬運方向之水平方向搬運該被處理物；該間壁係具有：上部間壁，係位於該搬運通路之鉛垂上側；及下部間壁，係位於該搬運通路之鉛垂下側；該下部間壁之一個以上的上端部在該搬運方向位於該複數個該搬運輥之間，而且在鉛垂方向位於與該複數個該搬運輥之 下端相同或比其更上面的位置。藉由依此方式，可消除在沿著搬運方向觀察搬運通路時之輥的下端和下部間壁之上下的間隙。藉此，抑制來自第1空間與第2空間之一方的輻射通過此間隙後到達另一方。因此，易使第1空間之環境氣體與第2空間之環境氣體的溫差變大，而可實現對應於更多種類之被處理物的急速升降溫。此外，「水平地搬運」係意指包含發生熱處理爐之製造誤差或使用者所造成之變形的情況、或者熱處理爐之載置場所從水平傾斜的情況等大致水平地搬運的情況。 In the heat treatment furnace of the present invention, the conveying means may include a plurality of conveying rollers, and the conveying rollers convey the object to be processed in the horizontal direction of the conveying direction within the conveying path; the partition wall includes: an upper partition wall, Are located on the vertical upper side of the conveying path; and the lower partition wall is located on the vertical lower side of the conveying path; one or more upper end portions of the lower partition wall are located between the plurality of the conveying rollers in the conveying direction, and In the vertical direction with the plurality of the carrying rollers The lower end is the same or above it. In this way, the clearance between the lower end of the roller and the lower partition wall when the conveyance path is viewed in the conveyance direction can be eliminated. Thereby, radiation from one of the first space and the second space is suppressed from reaching the other side after passing through this gap. Therefore, it is easy to increase the temperature difference between the ambient gas in the first space and the ambient gas in the second space, and it is possible to achieve rapid temperature rise and fall corresponding to more types of objects to be processed. In addition, "horizontal conveyance" means a case where the manufacturing process of a heat treatment furnace or a deformation | transformation by a user generate | occur | produces, or the case where the installation place of a heat treatment furnace inclines from a horizontal direction, including a case where it is conveyed horizontally.

在此情況，亦可該下部間壁係具備1個以上之具有該上端部的凸狀部，該凸狀部係作成朝向該上端部愈往鉛垂上側該搬運方向的寬度愈窄的形狀。即，凸狀部係亦可作成從與在搬運手段之搬運通路的搬運方向和鉛垂方向垂直的方向觀察時，作成朝向上端部之錐形形狀。藉由依此方式，在搬運方向將下部間壁之上端部配置於複數個搬運輥之間下，在下部間壁熱膨脹的情況等易避免輥與下部間壁(凸狀部)接觸。 In this case, the lower partition wall may be provided with one or more convex portions having the upper end portion, and the convex portions may be formed in a shape in which the width becomes narrower toward the upper end portion in the vertical direction. That is, the convex portion may be formed in a tapered shape toward the upper end portion when viewed from a direction perpendicular to the conveying direction and the vertical direction of the conveying path of the conveying means. In this way, the upper end portion of the lower partition wall is arranged between the plurality of conveyance rollers in the conveying direction, and it is easy to prevent the roller from contacting the lower partition wall (convex portion) when the lower partition wall is thermally expanded.

本發明之熱處理方法係在具備爐體之熱處理爐之該被處理物的熱處理方法，該爐體係具有：第1空間；第2空間；及間壁，係形成搬運通路，而且將該第1空間與該第2空間隔開，而該搬運通路係使該第1空間與該第2空間連通並搬運該被處理物之通路，鉛垂方向之間隙高度H係25mm以上且35mm以下；該熱處理方法包含：搬運步驟，係在使該第1空間之環境氣體與該第2空間之環境氣體的溫度相異之狀態，按照該第1空間內、該搬運通路及該第2空間內之順序搬運該被處理物。 The heat treatment method of the present invention is a heat treatment method for the object to be treated in a heat treatment furnace provided with a furnace body. The furnace system includes: a first space; a second space; and a partition wall that forms a conveying path, and the first space It is separated from the second space, and the conveying path is a path that communicates the first space with the second space and conveys the object to be processed. The vertical gap height H is 25 mm or more and 35 mm or less. The heat treatment method Including: a transporting step of transporting the ambient gas in the first space and the ambient gas in the second space in a state where the ambient gas in the first space is different from the ambient gas in the first space, the transport path, and the second space. To be processed.

在本發明之熱處理方法，被處理物係藉由從第1空間通過搬運通路內後，被搬運至溫度相異的第2空間，被急速升降溫。而且，搬運通路係鉛垂方向之間隙高度H成為25mm以上且35mm以下。藉由將間隙高度H設為35mm以下，抑制來自第1空間與第2空間之一方的輻射通過搬運通路後到達另一方。藉此，易使第1空間之環境氣體與第2空間之環境氣體的溫差變大。因此，易使降溫之前後的溫差變成因應於被處理物之適當的值，而可實現對應於各種被處理物的急速升降溫。又，藉由將間隙高度H設為25mm以上，可充分確保被處理物所通過之間隙。 In the heat treatment method of the present invention, after the object to be processed passes from the first space to the inside of the conveying path, it is transferred to the second space having a different temperature, and is rapidly heated and lowered. The clearance height H in the vertical direction of the conveyance path is 25 mm or more and 35 mm or less. By setting the gap height H to 35 mm or less, radiation from one of the first space and the second space is suppressed from reaching the other side after passing through the conveyance path. This makes it easy to increase the temperature difference between the ambient gas in the first space and the ambient gas in the second space. Therefore, it is easy to make the temperature difference before and after the temperature decrease to an appropriate value according to the object to be processed, and it is possible to realize rapid temperature rise and fall corresponding to various objects to be processed. In addition, by setting the gap height H to 25 mm or more, it is possible to sufficiently secure a gap through which an object to be processed passes.

在本發明之熱處理方法，亦可採用該搬運通路之搬運方向長度L係間隙高度H的3倍以上。藉由將搬運方向長度L設為間隙高度H的3倍以上，抑制來自第1空間與第2空間之一方的輻射通過搬運通路後到達另一方。藉此，易使第1空間之環境氣體與第2空間之環境氣體的溫差變大，而可實現對應於更多種被處理物的急速升降溫。 In the heat treatment method of the present invention, the length L in the conveying direction of the conveying path may be more than three times the height H of the gap. By setting the length L in the conveying direction to three times or more the gap height H, radiation from one of the first space and the second space is suppressed from reaching the other side after passing through the conveying path. This makes it easy to increase the temperature difference between the ambient gas in the first space and the ambient gas in the second space, and enables rapid temperature rise and fall corresponding to more types of objects to be processed.

在本發明之熱處理方法，亦可該熱處理爐係包括：第1搬運手段，係在該第1空間內搬運該被處理物；第2搬運手段，係在該第2空間內搬運該被處理物；及可變速搬運手段，係使該第1搬運手段所搬運之該被處理物在既定搬運方向通過該搬運通路內並搬運至該第2搬運手段，並可在比該第1搬運手段及該第2搬運手段更高速之可變速區域內變更該搬運速度；在該步驟，在使該第1空間之環境氣體與該第2空間之環境氣體的溫度相異之狀態，藉該可變速搬運手段使藉該第 1搬運手段在該第1空間內所搬運之該被處理物以該可變速區域內之既定速度通過該搬運通路內並搬運至該第2搬運手段。被處理物之升降溫速度(溫度變化速度)係因應於搬運通路內之搬運速度而變化，但是該搬運速度係可在可變速區域之範圍內變更。因此，可因應於被處理物來變更升降溫速度，而可實現對應於各種被處理物的急速升降溫。 In the heat treatment method of the present invention, the heat treatment furnace system may include: a first conveying means for conveying the object to be processed in the first space; and a second conveying means for conveying the object to be processed in the second space. ; And a variable-speed conveyance means that the object to be processed conveyed by the first conveyance means passes through the conveyance path in a predetermined conveyance direction and is conveyed to the second conveyance means, The second conveying means changes the conveying speed in a higher-speed variable-speed area; in this step, the temperature of the ambient gas in the first space and the temperature of the ambient gas in the second space are different, and the variable-speed conveying means is borrowed. Make the first 1 conveying means The object to be processed conveyed in the first space passes through the conveying path at a predetermined speed in the variable speed region and is conveyed to the second conveying means. The heating and cooling speed (temperature change speed) of the object to be processed changes according to the conveying speed in the conveying path, but the conveying speed can be changed within the range of the variable speed. Therefore, the temperature rise and fall speed can be changed according to the object to be processed, and rapid temperature rise and fall corresponding to various objects can be realized.

在本發明之熱處理方法，亦可採用該可變速區域係以可至少在150℃/min~1000℃/min之範圍變更通過該搬運通路時之該被處理物的溫度變化速度的方式所決定的區域；在該步驟，該被處理物係在被載置於承載板之狀態被搬運；該承載板係分別作為在常溫的物性值，彎曲強度為100MPa~250MPa、楊氏係數為200GPa~350GPa、熱膨脹係數為4ppm/K~5ppm/K、導熱率為50W/mK~200W/mK。在可在該範圍變更被處理物之溫度變化速度(升降溫速度)的情況，藉由使用滿足上述之數值範圍的承載板，在可變更之升降溫速度的範圍內承載板之耐熱性及溫度追蹤性成為充分者。藉此，即使變更升降溫速度，亦可使用相同之承載板，進行熱處理，而不必準備因應於升降溫速度之複數種承載板。在此，承載板之彎曲強度係採用4點彎曲強度。 In the heat treatment method of the present invention, the variable speed region may be determined in such a manner that the temperature change rate of the object to be processed when passing through the conveying path can be changed at least within a range of 150 ° C / min to 1000 ° C / min. Area; at this step, the object to be processed is transported in a state of being placed on a carrier plate; the carrier plate is used as a physical property value at normal temperature, the bending strength is 100MPa ~ 250MPa, the Young's coefficient is 200GPa ~ 350GPa, The thermal expansion coefficient is 4ppm / K ~ 5ppm / K, and the thermal conductivity is 50W / mK ~ 200W / mK. When it is possible to change the temperature change rate (rise and fall temperature) of the object to be processed in this range, by using a load plate that satisfies the above numerical range, the heat resistance and temperature of the load plate are within the range of the changeable temperature Traceability becomes full. Thereby, even if the temperature rise and fall speed is changed, the same bearing plate can be used for heat treatment, without having to prepare a plurality of types of load plates corresponding to the temperature rise and fall speed. Here, the bending strength of the carrier plate is a 4-point bending strength.

在此情況，亦可採用該承載板係由Si鍵結SiC或再結晶SiC所構成者。由Si鍵結SiC或再結晶SiC所構成之承載板可比較易於滿足彎曲強度、楊氏係數、熱膨脹係數、導熱率之該數值範圍，而適合本發明之熱處理方法。 In this case, the carrier plate may be made of Si-bonded SiC or recrystallized SiC. A carrier plate composed of Si-bonded SiC or recrystallized SiC can relatively easily satisfy the numerical ranges of bending strength, Young's coefficient, thermal expansion coefficient, and thermal conductivity, and is suitable for the heat treatment method of the present invention.

在本發明之熱處理方法，亦可該搬運手段係具有 複數個搬運輥，該搬運輥係在該搬運通路內在係搬運方向之水平方向搬運該被處理物；該間壁係具有：上部間壁，係位於該搬運通路之鉛垂上側；及下部間壁，係位於該搬運通路之鉛垂下側；該下部間壁之一個以上的上端部在該搬運方向位於該複數個該搬運輥之間，而且在鉛垂方向位於與該複數個該搬運輥之下端相同或比其更上面的位置。藉由依此方式，可消除在沿著搬運方向觀察搬運通路時之輥的下端和下部間壁之上下的間隙。藉此，抑制來自第1空間與第2空間之一方的輻射通過此間隙後到達另一方。因此，易使第1空間之環境氣體與第2空間之環境氣體的溫差變大，而可實現對應於更多種類之被處理物的急速升溫。 In the heat treatment method of the present invention, the conveyance means may have A plurality of conveying rollers that convey the object to be processed in the conveying path in the horizontal direction of the conveying direction; the partition wall has an upper partition wall located on the vertical upper side of the conveying path; and a lower partition wall Is located at the vertical lower side of the conveying path; more than one upper end of the lower partition wall is located between the plurality of the conveying rollers in the conveying direction, and is located at the lower end of the conveying rollers in the vertical direction. The same or higher position. In this way, the clearance between the lower end of the roller and the lower partition wall when the conveyance path is viewed in the conveyance direction can be eliminated. Thereby, radiation from one of the first space and the second space is suppressed from reaching the other side after passing through this gap. Therefore, it is easy to increase the temperature difference between the ambient gas in the first space and the ambient gas in the second space, and it is possible to achieve rapid temperature rise corresponding to more types of objects to be processed.

在此情況，亦可該下部間壁係具備1個以上之具有該上端部的凸狀部，該凸狀部係作成朝向該上端部愈往鉛垂上側該搬運方向的寬度愈窄的形狀。藉由依此方式，在搬運方向將下部間壁之上端部配置於複數個搬運輥之間下，在下部間壁熱膨脹的情況等易避免輥與下部間壁(凸狀部)接觸。 In this case, the lower partition wall may be provided with one or more convex portions having the upper end portion, and the convex portions may be formed in a shape in which the width becomes narrower toward the upper end portion in the vertical direction. In this way, the upper end portion of the lower partition wall is arranged between the plurality of conveyance rollers in the conveying direction, and it is easy to prevent the roller from contacting the lower partition wall (convex portion) when the lower partition wall is thermally expanded.

10、110‧‧‧熱處理爐 10, 110‧‧‧ heat treatment furnace

10a、110a‧‧‧爐體 10a, 110a‧‧‧ furnace body

11、111‧‧‧外壁 11, 111‧‧‧ outer wall

11a、11b‧‧‧第1、第2空間 11a, 11b ‧‧‧ first, second space

11c、111c‧‧‧搬運通路 11c, 111c‧‧‧Transportation

12‧‧‧前端面 12‧‧‧ front face

13、113‧‧‧後端面 13, 113‧‧‧ rear face

14、15、115‧‧‧開口 14, 15, 115‧‧‧ opening

16、17、117‧‧‧氣體供給口 16, 17, 117‧‧‧ gas supply port

18、19、119‧‧‧流出口 18, 19, 119‧‧‧ Outflow

20a、20b‧‧‧第1、第2搬運輥 20a, 20b ‧‧‧ the first and second conveying rollers

20c‧‧‧可變速搬運輥 20c‧‧‧Variable speed carrying roller

21a、21b‧‧‧第1、第2加熱器 21a, 21b‧‧‧ first and second heater

22、24、124‧‧‧氣體供給裝置 22, 24, 124‧‧‧ gas supply device

26、28、128‧‧‧流量調整閥 26, 28, 128‧‧‧ flow regulating valve

30、130‧‧‧間壁部 30, 130‧‧‧partitions

31、131‧‧‧上部間壁 31, 131‧‧‧ Upper partition

32、132‧‧‧本體部 32, 132‧‧‧ Body

33、133‧‧‧樑 33, 133‧‧‧ Liang

35、135‧‧‧下部間壁 35, 135‧‧‧ lower partition

36、136‧‧‧本體部 36、136‧‧‧Body

37a、37b、137a、137b‧‧‧凸狀部 37a, 37b, 137a, 137b ‧‧‧ convex

38a、38b、138a、138b‧‧‧上端部 38a, 38b, 138a, 138b ‧‧‧ upper end

80‧‧‧控制器 80‧‧‧controller

81‧‧‧CPU 81‧‧‧CPU

82‧‧‧快閃記憶體 82‧‧‧Flash memory

83‧‧‧對應關係資料 83‧‧‧ Correspondence Data

84‧‧‧RAM 84‧‧‧RAM

85‧‧‧速度取得部 85‧‧‧Speed Acquisition Department

86‧‧‧搬運控制部 86‧‧‧Transportation Control Department

88‧‧‧操作面板 88‧‧‧operation panel

95‧‧‧承載板 95‧‧‧bearing plate

96‧‧‧被處理物 96‧‧‧ object

111b‧‧‧第3空間 111b‧‧‧3rd space

120b‧‧‧第3搬運輥 120b‧‧‧3rd conveying roller

140‧‧‧冷卻管 140‧‧‧cooling pipe

142、144‧‧‧氣冷套 142, 144‧‧‧Air-cooled jacket

146、148‧‧‧冷媒供給源 146, 148‧‧‧ Refrigerant supply source

第1圖係第1實施形態之熱處理爐10的縱向剖面圖。 Fig. 1 is a longitudinal sectional view of the heat treatment furnace 10 according to the first embodiment.

第2圖係從前方觀察第1圖之搬運通路11c周邊的A視圖。 Fig. 2 is an A view of the periphery of the conveyance path 11c of Fig. 1 as viewed from the front.

第3圖係搬運通路11c周邊之立體圖。 Fig. 3 is a perspective view of the periphery of the conveyance path 11c.

第4圖係第2實施形態之熱處理爐110的縱向剖面圖。 Fig. 4 is a longitudinal sectional view of the heat treatment furnace 110 according to the second embodiment.

[第1實施形態] [First Embodiment]

其次，使用圖面，說明本發明之實施形態。第1圖係本發明之第1實施形態之熱處理爐10的縱向剖面圖。第2圖係從前方觀察第1圖之搬運通路11c周邊的A視圖。第3圖係搬運通路11c周邊之立體圖。此外，在第3圖，省略外壁11之圖示。熱處理爐10包括爐體10a、第1、第2搬運輥20a、20b、可變速搬運輥20c、第1、第2加熱器21a、21b、氣體供給裝置22、24、流量調整閥26、28及控制器80。此熱處理爐10係作為輥道烤爐所構成，該輥道烤爐係在爐體10a之內部一面搬運已載置複數個被處理物96之承載板95，一面對被處理物96進行熱處理。 Next, embodiments of the present invention will be described using drawings. Fig. 1 is a longitudinal sectional view of a heat treatment furnace 10 according to a first embodiment of the present invention. Fig. 2 is an A view of the periphery of the conveyance path 11c of Fig. 1 as viewed from the front. Fig. 3 is a perspective view of the periphery of the conveyance path 11c. In FIG. 3, the illustration of the outer wall 11 is omitted. The heat treatment furnace 10 includes a furnace body 10a, first and second conveyance rollers 20a and 20b, variable speed conveyance rollers 20c, first and second heaters 21a and 21b, gas supply devices 22 and 24, flow adjustment valves 26 and 28, and Controller 80. This heat treatment furnace 10 is constituted as a roller table furnace. The roller table furnace is configured to carry a heat treatment plate 95 on which a plurality of objects to be processed 96 are placed on the inside of the furnace body 10a, and heat treatment is performed on the objects to be processed 96 .

爐體10a包括外壁11、及配置於外壁11內之間壁部30。外壁11係形成大致長方體的隔熱構造體，並具有：係內部之空間的第1空間11a、第2空間11b及搬運通路11c。又，外壁11具有：開口14，係形成於外壁11之前端面12(第1圖之左端面)，並成為往第1空間11a之入口；及開口15，係形成於外壁11之後端面13(第1圖之右端面)，並成為從第2空間11b往外部之出口。第1空間11a係由外壁11及間壁部30所包圍之空間。第2空間11b係由外壁11及間壁部30所包圍之空間。搬運通路11c係使第1空間11a與第2空間11b連通之空間，並藉間壁部30所形成。第1空間11a、搬運通路11c及第2空間11b係從開口14往開口15在前後方向(第1圖之左右方向)按照此順序所形成。 The furnace body 10 a includes an outer wall 11 and an intermediate wall portion 30 disposed inside the outer wall 11. The outer wall 11 is a substantially rectangular parallelepiped heat-insulating structure, and includes a first space 11a, a second space 11b, and a conveyance path 11c, which are internal spaces. The outer wall 11 has an opening 14 formed on the front end face 12 (the left end face in FIG. 1) of the outer wall 11 and serving as an entrance to the first space 11 a, and an opening 15 formed on the rear end face 13 of the outer wall 11 (the first end). The right end face of Figure 1), and becomes the exit from the second space 11b to the outside. The first space 11 a is a space surrounded by the outer wall 11 and the partition wall portion 30. The second space 11 b is a space surrounded by the outer wall 11 and the partition wall portion 30. The conveyance path 11c is a space that communicates the first space 11a and the second space 11b, and is formed by the partition wall portion 30. The first space 11a, the conveying path 11c, and the second space 11b are formed in this order from the opening 14 to the opening 15 in the front-rear direction (left-right direction in FIG. 1).

間壁部30係隔開第1空間11a與第2空間11b之隔熱構造體，並包括位於鉛垂上側之上部間壁31與位於鉛垂 下側之下部間壁35。作為以該上部間壁31與下部間壁35從鉛垂上下方向所夾的空間，形成搬運通路11c。上部間壁31包括本體部32與樑33(參照第1圖在左側所示之虛線框S的放大部分)。本體部32係例如以磚等所形成之大致長方體的構件，上端及左右端係與外壁11接觸。本體部32係亦可一體形成，亦可由複數個構件所組合形成。樑33係例如以金屬等所形成，且長邊方向係左右方向之板狀的構件。樑33係由外壁11之左右端所支撐，上面與本體部32的下端接觸，並從下支撐本體部32。下部間壁35係以磚等所形成之構件，並包括本體部36與凸狀部37a、37b。本體部36係大致長方體的構件，凸狀部37a、37b係下部間壁35中鉛垂上側的部分，並在下端與本體部36接觸。凸狀部37a、37b配置成在前後方向鄰接。凸狀部37a、37b係與左右方向垂直之截面成為三角形之三角柱狀的構件(參照第3圖)。因此，凸狀部37a、37b係以愈往鉛垂上側前後方向之寬度變成愈窄的方式所形成。而且，係凸狀部37a、37b之頂上部(在與左右方向垂直之截面觀察時成為三角形之頂點的部分)的上端部38a、38b成為下部間壁35的上端部。此外，本體部36或凸狀部37a、37b係亦可分別一體形成，亦可由複數個構件所組合形成。又，亦可下部間壁35整體一體形成。間壁部30係以導熱率低之材料所形成較佳。 The partition wall portion 30 is a heat-insulating structure that separates the first space 11a and the second space 11b, and includes a partition wall 31 located on the upper side of the vertical portion and a vertical portion Lower side lower part intermediate wall 35. A conveyance path 11 c is formed as a space sandwiched between the upper partition wall 31 and the lower partition wall 35 in the vertical direction. The upper partition wall 31 includes a main body portion 32 and a beam 33 (refer to an enlarged portion of a dotted frame S shown on the left side in FIG. 1). The main body portion 32 is a substantially rectangular parallelepiped member formed of, for example, a brick, and the upper end and the left and right ends are in contact with the outer wall 11. The body portion 32 may be integrally formed, or may be formed by combining a plurality of members. The beam 33 is a plate-shaped member formed of, for example, metal, and the longitudinal direction is a left-right direction. The beam 33 is supported by the left and right ends of the outer wall 11, the upper surface is in contact with the lower end of the main body portion 32, and the main body portion 32 is supported from below. The lower partition wall 35 is a member formed of a brick or the like, and includes a main body portion 36 and convex portions 37 a and 37 b. The main body portion 36 is a substantially rectangular parallelepiped member, and the convex portions 37 a and 37 b are portions on the upper side of the lower partition wall 35 vertically and are in contact with the main body portion 36 at the lower end. The convex portions 37a and 37b are arranged adjacent to each other in the front-rear direction. The convex portions 37a and 37b are triangular columnar members whose cross sections perpendicular to the left-right direction are triangular (see FIG. 3). Therefore, the convex portions 37 a and 37 b are formed so that the width becomes narrower toward the vertical direction. Furthermore, the upper end portions 38 a and 38 b of the top upper portions (portions that become vertexes of a triangle when viewed in a cross section perpendicular to the left-right direction) of the convex-shaped portions 37 a and 37 b become the upper end portions of the lower partition wall 35. In addition, the main body portion 36 or the convex portions 37a and 37b may be integrally formed separately, or may be formed by combining a plurality of members. The lower partition wall 35 may be integrally formed as a whole. The partition wall portion 30 is preferably formed of a material having a low thermal conductivity.

第1搬運輥20a係在第1空間11a內沿著既定搬運方向配置複數個(在本實施形態為8個)，並搬運承載板95之搬運輥。此外，在本實施形態，第1搬運輥20a之搬運方向係水平方向，並採用從前方往後方的方向(第1圖之從左側往右側 的方向)。藉由第1搬運輥20a轉動，從開口14朝向搬運方向在第1空間11a內搬運已載置複數個被處理物96之承載板95。 The first conveyance rollers 20 a are a plurality of conveyance rollers (eight in this embodiment) arranged in the first conveyance direction in the first space 11 a and conveying the carrier plate 95. In addition, in this embodiment, the conveying direction of the first conveying roller 20a is horizontal, and the direction from the front to the rear is adopted (from the left to the right in FIG. 1). Direction). By the rotation of the first conveyance roller 20a, the carrier plate 95 on which the plurality of objects to be processed 96 are placed is conveyed in the first space 11a from the opening 14 toward the conveyance direction.

第2搬運輥20b係在第2空間11b內沿著既定搬運方向配置複數個(在本實施形態為8個)，並搬運承載板95之搬運輥。此外，在本實施形態，第2搬運輥20b之搬運方向係採用與第1搬運輥20a之搬運方向相同的方向。藉由第2搬運輥20b轉動，在第2空間11b內在搬運方向將已載置複數個被處理物96之承載板95搬運至開口15。 The second conveying rollers 20 b are a plurality of conveying rollers (eight in the present embodiment) arranged in the second space 11 b along a predetermined conveying direction and conveying the carrier plate 95. In addition, in this embodiment, the conveyance direction of the 2nd conveyance roller 20b is the same direction as the conveyance direction of the 1st conveyance roller 20a. By the rotation of the second conveyance roller 20b, the carrier plate 95 on which the plurality of objects to be processed 96 have been placed is conveyed to the opening 15 in the conveyance direction in the second space 11b.

可變速搬運輥20c係配置於第1搬運輥20a與第2搬運輥20b之間，並搬運承載板95之搬運輥。可變速搬運輥20c係在從第1空間11a經由搬運通路11c後至第2空間11b內之範圍，沿著既定搬運方向配置複數個(在本實施形態為10個)。此外，在本實施形態，可變速搬運輥20c之搬運方向係採用與第1搬運輥20a之搬運方向相同的方向。藉由可變速搬運輥20c轉動，在搬運通路11c在搬運方向搬運已載置複數個被處理物96之承載板95。此外，可變速搬運輥20c中位於搬運方向之最上游的輥係配置於第1搬運輥20a中位於搬運方向之最下游的輥的旁邊，兩輥間之距離成為可彼此交換承載板95的距離。一樣地，可變速搬運輥20c中位於搬運方向之最下游的輥係配置於第2搬運輥20b中位於搬運方向之最上游的輥的旁邊，兩輥間之距離成為可彼此交換承載板95的距離。藉此，第1、第2搬運輥20a、20b係使藉第1搬運輥20a所搬運之承載板95通過搬運通路11c後，搬運至第2搬運輥20b。此外，在本實施形態，第1、第2搬運輥20a、20b、可變速搬運輥20c 之全部係相同的直徑，並採用在從開口14至開口15之範圍在前後方向等間隔地配置。又，此可變速搬運輥20c係藉未圖示之馬達可比第1、第2搬運輥20a、20b更高速地轉動，而且，可調整轉速。藉此，可變速搬運輥20c係在比第1、第2搬運輥20a、20b更高速的可變速區域內可變更承載板95的搬運速度。未特別限定如此，在本實施形態，可變速區域係採用90mm/min~600mm/min之範圍。 The variable speed conveyance roller 20c is a conveyance roller which is arranged between the first conveyance roller 20a and the second conveyance roller 20b and conveys the carrier plate 95. A plurality of variable-speed conveyance rollers 20c are arranged in a range from the first space 11a through the conveyance path 11c to the second space 11b, and are arranged in a predetermined conveyance direction (10 in this embodiment). In addition, in this embodiment, the conveyance direction of the variable speed conveyance roller 20c is the same direction as the conveyance direction of the 1st conveyance roller 20a. When the variable-speed conveyance roller 20c rotates, the carrier plate 95 on which a plurality of objects to be processed 96 are placed is conveyed in the conveyance direction in the conveyance path 11c. In addition, the roller located most upstream in the conveying direction among the variable speed conveying rollers 20c is arranged beside the roller located most downstream in the conveying direction among the first conveying rollers 20a, and the distance between the two rollers becomes a distance that can exchange the carrying plate 95 with each other. . Similarly, the roller located most downstream in the conveying direction among the variable speed conveying rollers 20c is arranged beside the roller located most upstream in the conveying direction among the second conveying rollers 20b, and the distance between the two rollers is such that the carrier plate 95 can be exchanged with each other. distance. Thereby, the 1st and 2nd conveyance rollers 20a and 20b pass the carrier plate 95 conveyed by the 1st conveyance roller 20a through the conveyance path 11c, and are conveyed to the 2nd conveyance roller 20b. In addition, in this embodiment, the first and second conveying rollers 20a, 20b and the variable-speed conveying roller 20c All of them have the same diameter, and are arranged at equal intervals in the front-rear direction in a range from the opening 14 to the opening 15. The variable speed conveyance roller 20c can rotate at a higher speed than the first and second conveyance rollers 20a and 20b by a motor (not shown), and the rotation speed can be adjusted. Thereby, the variable speed conveyance roller 20c can change the conveyance speed of the carrier plate 95 in the variable speed area | region which is faster than a 1st, 2nd conveyance roller 20a, 20b. This is not particularly limited. In the present embodiment, the variable speed range is in the range of 90 mm / min to 600 mm / min.

第1加熱器21a配置於第1空間11a內。此第1加熱器21a係以從上下隔著第1搬運輥20a及可變速搬運輥20c之方式於外壁11之頂部及底部配置複數個(在本實施形態為上下各4個)。第1加熱器21a係配置成長邊方向成為與搬運方向正交的方向(左右方向)，並沿著搬運方向配置複數個。第1加熱器21a係對通過第1空間11a內之被處理物96或第1空間11a之環境氣體加熱者，並作為例如SiC加熱器等之陶瓷加熱器所構成。 The first heater 21a is arranged in the first space 11a. The first heater 21a is provided with a plurality of first heaters 21a on the top and bottom of the outer wall 11 with the first transfer rollers 20a and the variable-speed transfer rollers 20c interposed therebetween (four in the present embodiment). The first heaters 21a are arranged in such a manner that the longitudinal direction is a direction orthogonal to the conveyance direction (left-right direction), and a plurality of first heaters 21a are arranged along the conveyance direction. The first heater 21a heats the ambient gas passing through the object 96 in the first space 11a or the first space 11a, and is configured as a ceramic heater such as a SiC heater.

第2加熱器21b配置於第2空間11b內。此第2加熱器21b係以從上下隔著第2搬運輥20b及可變速搬運輥20c之方式於外壁11之頂部及底部配置複數個(在本實施形態為上下各6個)。第2加熱器21b係配置成長邊方向成為與搬運方向正交的方向(左右方向)，並沿著搬運方向配置複數個。第2加熱器21b係對通過第2空間11b內之被處理物96或第2空間11b之環境氣體加熱至比第1空間11a更高溫者，並作為例如SiC加熱器等之陶瓷加熱器所構成。 The second heater 21b is arranged in the second space 11b. The second heater 21b is provided with a plurality of second heaters 21b on the top and bottom of the outer wall 11 with the second transfer roller 20b and the variable-speed transfer roller 20c interposed therebetween (in the present embodiment, there are six each). The second heaters 21b are arranged in such a manner that the growth direction is a direction orthogonal to the conveyance direction (left-right direction), and a plurality of second heaters 21b are arranged along the conveyance direction. The second heater 21b heats the ambient gas passing through the object 96 in the second space 11b or the second space 11b to a higher temperature than the first space 11a, and is configured as a ceramic heater such as a SiC heater. .

氣體供給裝置22、24係可將作為環境氣體之例氮 氣等的惰性氣體分別供給至第1、第2空間11a、11b。此氣體供給裝置22、24係亦可作為直接供給既定溫度(例如常溫等)之環境氣體的裝置，亦可作為將環境氣體加熱後供給的裝置。在外壁11之底部中第1空間11a的後端面13側，形成與氣體供給裝置22連接之氣體供給口16。經由此氣體供給口16，來自氣體供給裝置22的環境氣體被供給至第1空間11a。一樣地，在外壁11之底部中第2空間11b的後端面13側，形成與氣體供給裝置24連接之氣體供給口17。經由此氣體供給口17，來自氣體供給裝置24的環境氣體被供給至第2空間11b。 The gas supply devices 22 and 24 can use nitrogen as an example of the ambient gas. Inert gas such as gas is supplied to the first and second spaces 11a and 11b, respectively. The gas supply devices 22 and 24 can also be used as a device for directly supplying an ambient gas at a predetermined temperature (for example, normal temperature) or as a device for heating and supplying the ambient gas. A gas supply port 16 connected to the gas supply device 22 is formed on the rear end surface 13 side of the first space 11 a in the bottom of the outer wall 11. Through this gas supply port 16, the ambient gas from the gas supply device 22 is supplied to the first space 11a. Similarly, a gas supply port 17 connected to the gas supply device 24 is formed on the rear end surface 13 side of the second space 11 b in the bottom of the outer wall 11. Through this gas supply port 17, the ambient gas from the gas supply device 24 is supplied to the second space 11b.

流量調整閥26、28係調整從爐體10a內所流出之環境氣體之流量的裝置。在外壁11之頂部部分中第1空間11a的前端面12側，形成與流量調整閥26連接的流出口18。流量調整閥26係調整經由該流出口18使第1空間11a之環境氣體流出時的流量。一樣地，在外壁11之頂部部分中第2空間11b的前端面12側，形成與流量調整閥28連接的流出口19。流量調整閥28係調整經由該流出口19使第2空間11b之環境氣體流出時的流量。此外，已通過流量調整閥26、28之爐體10a內的環境氣體係亦可作為排出者，亦可在已除去例如氧氣、水等不要成分後作為氣體供給裝置22、24之吸入氣體，供循環者。 The flow adjustment valves 26 and 28 are devices for adjusting the flow rate of the ambient gas flowing out of the furnace body 10a. An outflow port 18 connected to the flow rate adjustment valve 26 is formed on the front end surface 12 side of the first space 11 a in the top portion of the outer wall 11. The flow rate adjustment valve 26 adjusts the flow rate when the ambient gas in the first space 11 a flows out through the outflow port 18. Similarly, an outflow port 19 connected to the flow rate adjustment valve 28 is formed on the front end surface 12 side of the second space 11 b in the top portion of the outer wall 11. The flow rate adjustment valve 28 adjusts the flow rate when the ambient gas in the second space 11 b flows out through the outflow port 19. In addition, the ambient gas system in the furnace body 10a that has passed through the flow control valves 26 and 28 can also be used as an exhaustor, and after removing unnecessary components such as oxygen and water, it can also be used as the inhaled gas of the gas supply devices 22 and 24 for supply. Cycler.

在此，說明可變速搬運輥20c與下部間壁35之位置關係、及搬運通路11c之間隙高度H與搬運方向長度L。首先，說明可變速搬運輥20c與下部間壁35之位置關係。如第1圖、第3圖所示，上述之下部間壁35的上端部38a、38b在搬 運方向分別位於可變速搬運輥20c中鄰接的2個輥之間。又，上端部38a、38b係彼此高度(鉛垂方向之位置)相同，而且，位於與可變速搬運輥20c之輥的下端相同的高度。 Here, the positional relationship between the variable speed conveyance roller 20c and the lower partition wall 35, and the clearance height H and the conveyance direction length L of the conveyance path 11c will be described. First, the positional relationship between the variable speed conveyance roller 20c and the lower partition wall 35 will be described. As shown in FIG. 1 and FIG. 3, the upper end portions 38 a and 38 b of the lower partition wall 35 are moving. The transport direction is located between two adjacent rollers among the variable-speed conveyance rollers 20c. The upper end portions 38a and 38b have the same height (position in the vertical direction), and are located at the same height as the lower end of the roller of the variable speed conveyance roller 20c.

其次，說明搬運通路11c之間隙高度H。搬運通路11c係鉛垂方向之間隙高度H(參照第1圖、第2圖)是25mm~35mm較佳。在此，間隙高度H係設為在沿著可變速搬運輥20c之搬運方向觀察搬運通路11c時(相當於在第1圖之A視)之鉛垂方向之間隙的大小。如第2圖所示，沿著可變速搬運輥20c之搬運方向觀察搬運通路11c時，作為搬運通路11c之間隙看得到的係從可變速搬運輥20c之上端至上部間壁31之下端的間隙。因此，此間隙之鉛垂方向的大小成為間隙高度H。此外，在本實施形態，上部間壁31的下端部係與搬運方向平行，採用在第2圖看起來是左右方向的直線者。若在上部間壁31的下端部看起來不是第2圖之左右方向的直線(具有凹凸、從左右方向傾斜等)的情況等根據左右方向之位置而搬運通路11c之間隙高度不是固定的情況，將在第2圖之間隙高度的最小值作為間隙高度H。即，在沿著可變速搬運輥20c之搬運方向觀察搬運通路11c時有鉛垂方向之間隙的大小相異之位置的情況，將最小值作為間隙高度H。又，在本實施形態，如上述所示，因為上端部38a、上端部38b位於與可變速搬運輥20c之輥的下端相同的高度，所以在下部間壁35與可變速搬運輥20c之間無間隙。若在兩者之間有間隙的情況，將上部間壁31與可變速搬運輥20c之間隙的高度(之最小值)、和下部間壁35與可變速搬運輥20c之間隙的高度(之最小值)之和作為間隙 高度H。依此方式，在沿著可變速搬運輥20c之搬運方向觀察搬運通路11c時有鉛垂方向之位置相異的複數個間隙的情況，將各個間隙之高度(之最小值)的和作為搬運通路11c之間隙高度H。 Next, the clearance height H of the conveyance path 11c is demonstrated. The conveyance path 11c is preferably a gap height H (see Figs. 1 and 2) in the vertical direction of 25 mm to 35 mm. Here, the gap height H is set as the size of the gap in the vertical direction when the conveyance path 11c is viewed along the conveyance direction of the variable-speed conveyance roller 20c (corresponding to a view in FIG. 1A). As shown in FIG. 2, when the conveying path 11 c is viewed in the conveying direction of the variable-speed conveying roller 20 c, the clearance seen from the conveying path 11 c is the clearance from the upper end of the variable-speed conveying roller 20 c to the lower end of the upper partition 31. . Therefore, the size of the gap in the vertical direction becomes the gap height H. In addition, in this embodiment, the lower end portion of the upper partition wall 31 is parallel to the conveying direction, and a straight line that looks right and left in the second figure is used. If the lower end portion of the upper partition wall 31 does not appear to be a straight line in the left-right direction in FIG. 2 (having unevenness, tilting from the left-right direction, etc.), the clearance height of the conveying path 11c may not be fixed depending on the position in the left-right direction, The minimum value of the gap height in FIG. 2 is defined as the gap height H. That is, when the position of the gap in the vertical direction is different when the conveyance path 11c is viewed along the conveyance direction of the variable speed conveyance roller 20c, the minimum value is taken as the clearance height H. In this embodiment, as described above, since the upper end portion 38a and the upper end portion 38b are located at the same height as the lower end of the roller of the variable speed conveyance roller 20c, there is no space between the lower partition wall 35 and the variable speed conveyance roller 20c. gap. If there is a gap between the two, the height (minimum value) of the gap between the upper partition wall 31 and the variable-speed transfer roller 20c and the height (minimum of the gap between the lower partition wall 35 and the variable-speed transfer roller 20c) Value) as the gap Height H. In this way, when there are a plurality of gaps having different positions in the vertical direction when the transport path 11c is viewed along the transport direction of the variable-speed transport roller 20c, the sum of the heights (minimum values) of the gaps is used as the transport path. The clearance height H of 11c.

接著，說明搬運通路11c之搬運方向長度L。搬運通路11c係搬運方向長度L是間隙高度H之3倍以上較佳，是4倍以上更佳。在此，搬運方向長度L係如圖所示，是間壁部30中從可變速搬運輥20c之搬運方向之上游側的開口至下游側之開口的距離。此外，在本實施形態，上部間壁31及下部間壁35之搬運方向長度(厚度)係在鉛垂上下方向設為定值，在從外壁11之頂部至底部的範圍，間壁部30之搬運方向長度(厚度)係設為與搬運方向長度L相同的值。 Next, the conveying direction length L of the conveying path 11c will be described. The conveying path 11c is preferably such that the length L in the conveying direction is three times or more the gap height H, and more preferably four times or more. Here, the conveyance direction length L is a distance from the opening on the upstream side to the opening on the downstream side of the partition wall portion 30 in the conveyance direction of the variable speed conveyance roller 20 c as shown in the figure. In addition, in this embodiment, the length (thickness) of the upper partition wall 31 and the lower partition wall 35 in the conveying direction is set to a fixed value in the vertical direction. In the range from the top to the bottom of the outer wall 11, The length (thickness) in the conveyance direction is set to the same value as the length L in the conveyance direction.

此外，搬運通路11c之左右方向長度(水平方向中與搬運方向垂直之方向的長度)例如是300mm~1500mm。 The length in the left-right direction of the conveyance path 11c (the length in the direction perpendicular to the conveyance direction in the horizontal direction) is, for example, 300 mm to 1500 mm.

控制器80係作為以CPU81為中心之微處理器所構成，並包括：快閃記憶體82，係已記憶各種處理程式或各種資料等；RAM84，係暫時記憶資料；及未圖示之內部通訊介面(I/F)，係與操作面板88等進行通訊。快閃記憶體82記憶對應關係資料83。對應關係資料83係表示第1、第2空間11a、11b之溫度、承載板95通過搬運通路11c時之升溫速度及可變速搬運輥20c之搬運速度之對應關係的資料。 The controller 80 is composed of a microprocessor centered around the CPU 81, and includes: a flash memory 82, which has stored various processing programs or various data, etc .; a RAM 84, which temporarily stores data; and internal communication (not shown) The interface (I / F) communicates with the operation panel 88 and the like. The flash memory 82 stores correspondence data 83. Correspondence data 83 are data showing the correspondence between the temperatures of the first and second spaces 11a and 11b, the heating speed of the carrier plate 95 when passing through the conveyance path 11c, and the conveyance speed of the variable-speed conveyance roller 20c.

此控制器80係向氣體供給裝置22、24輸出控制信號，而個別地控制經由氣體供給口16、氣體供給口17之往爐體10a內部之惰性氣體的供給量或供給溫度。控制器80係 向流量調整閥26、28輸出控制信號，而控制從流出口18、19所流出之環境氣體的量。進而，控制器80係向第1、第2加熱器21a、21b輸出控制信號，而個別地調整第1空間11a、第2空間11b的溫度，或向第1、第2搬運輥20a、20b及可變速搬運輥20c之未圖示的馬達輸出驅動信號，而使第1、第2搬運輥20a、20b及可變速搬運輥20c轉動。又，控制器80係輸入因應於操作面板88之操作所產生的操作信號，或將顯示指令輸出至操作面板88。 This controller 80 outputs a control signal to the gas supply devices 22 and 24, and individually controls the supply amount or temperature of the inert gas to the inside of the furnace body 10a through the gas supply port 16 and the gas supply port 17. Controller 80 series A control signal is output to the flow adjustment valves 26 and 28 to control the amount of ambient gas flowing from the outlets 18 and 19. Further, the controller 80 outputs a control signal to the first and second heaters 21a and 21b, and individually adjusts the temperature of the first space 11a and the second space 11b, or sends the temperature to the first, second conveying rollers 20a, 20b, and A motor (not shown) of the variable speed conveyance roller 20c outputs a driving signal to rotate the first, second conveyance rollers 20a, 20b, and the variable speed conveyance roller 20c. In addition, the controller 80 inputs an operation signal generated in response to an operation of the operation panel 88 or outputs a display instruction to the operation panel 88.

又，控制器80係如第1圖所示，作為功能方塊，包括速度取得部85、搬運控制部86等。速度取得部85具有如下的功能，根據關於從使用者經由操作面板88所輸入之第1、第2空間11a、11b的溫度之資訊、關於被處理物96通過搬運通路11c時之升溫速度的資訊、及對應關係資料83，取得關於所輸入之第1、第2空間11a、11b的溫度及對應於升溫速度之熱處理時的可變速搬運輥20c之搬運速度的值。搬運控制部86具有如下的功能，將可變速搬運輥20c之未圖示之馬達的轉速控制成承載板95以速度取得部85所取得之搬運速度通過搬運通路11c。此外，速度取得部85、搬運控制部86係亦可作為硬體所構成，亦可作為軟體所構成，該軟體係藉由CPU81執行快閃記憶體82所記憶之程式而發現功能。 The controller 80 includes, as shown in FIG. 1, functional blocks including a speed acquisition unit 85, a transport control unit 86, and the like. The speed acquisition unit 85 has a function based on information about the temperature of the first and second spaces 11a and 11b input from the user via the operation panel 88, and information about the temperature rise rate of the processed object 96 when passing through the conveyance path 11c. And the correspondence data 83 to obtain values regarding the input temperatures of the first and second spaces 11a and 11b and the transfer speed of the variable-speed transfer roller 20c during the heat treatment corresponding to the heating rate. The conveyance control unit 86 has a function of controlling the rotation speed of a motor (not shown) of the variable speed conveyance roller 20 c so that the carrier plate 95 passes the conveyance path 11 c at the conveyance speed obtained by the speed acquisition unit 85. In addition, the speed acquisition unit 85 and the conveyance control unit 86 may be configured as hardware or software, and the software system discovers a function by executing a program stored in the flash memory 82 by the CPU 81.

操作面板88包括顯示部、及包含該顯示部所構成之操作部。顯示部係作為觸控面板式之液晶顯示器所構成，顯示用以選擇功能表或項目之選擇/設定按鈕、用以輸入各種數值之數字按鈕、使熱處理開始之起動按鈕等，並受理觸控操 作，再將根據觸控操作之操作信號傳送至控制器80。又，收到來自控制器80之顯示指令時，將根據顯示指令之影像或文字、數值等顯示於顯示部。 The operation panel 88 includes a display section and an operation section including the display section. The display unit is constituted by a touch panel type liquid crystal display, and displays selection / setting buttons for selecting menus or items, numeric buttons for inputting various numerical values, start buttons for starting heat treatment, and the like, and accepts touch operations. The operation signal is transmitted to the controller 80 according to the touch operation. When a display instruction from the controller 80 is received, an image, a character, a numerical value, or the like according to the display instruction is displayed on the display unit.

承載板95係載置被處理物96者。承載板95係只要可在已載置被處理物96之狀態藉第1、第2搬運輥20a、20b及可變速搬運輥20c搬運即可，例如亦可採用平板狀，亦可採用網孔狀。又，承載板95係例如採用由複數片平板與一面使平板間在上下方向分開一面支撐的支撐構件所構成者，亦可採用具有複數段可載置被處理物96之面者。在本實施形態，承載板95之搬運方向的長度係採用比搬運通路11c之搬運方向長度L更長者。此外，承載板95係為了可承受在爐體10a內之被處理物96的熱處理，由具有高耐蝕性或耐熱性之材料所構成較佳。又，承載板95係為了能對複數個被處理物96更均勻地進行熱處理，由本身之溫度分布難發生的(溫度追蹤性高的)材料構成較佳。更具體而言，承載板95係彎曲強度為100MPa~250MPa、楊氏係數為200GPa~350GPa、熱膨脹係數為4ppm/K~5ppm/K、導熱率為50W/mK~200W/mK較佳。此外，該等數值係採用在常溫下之各個物性值。承載板95之彎曲強度係採用4點彎曲強度。承載板95係例如由陶瓷等所構成者，採用由Si鍵結SiC(Si-SiC)或再結晶SiC所構成者較佳。若承載板95採用由Si鍵結SiC或再結晶SiC所構成者，易於滿足彎曲強度、楊氏係數、熱膨脹係數、導熱率之該數值範圍。 The carrier plate 95 is a person on which a to-be-processed object 96 is placed. The carrier plate 95 is only required to be conveyed by the first and second conveying rollers 20a, 20b and the variable speed conveying roller 20c in a state where the object to be processed 96 is placed. For example, a flat plate shape or a mesh shape may be used. . In addition, the carrier plate 95 is constituted by, for example, a plurality of flat plates and a supporting member that supports a space between the flat plates in a vertical direction, and a surface having a plurality of stages on which the object 96 can be placed. In this embodiment, the length in the carrying direction of the carrier plate 95 is longer than the length L in the carrying direction of the carrying path 11c. In addition, the carrier plate 95 is preferably made of a material having high corrosion resistance or heat resistance in order to withstand the heat treatment of the object 96 in the furnace body 10a. In addition, the carrier plate 95 is preferably made of a material (high temperature traceability) that is difficult to generate its own temperature distribution in order to heat-treat the plurality of objects to be treated 96 more uniformly. More specifically, it is preferable that the bearing plate 95 has a bending strength of 100 MPa to 250 MPa, a Young's coefficient of 200 GPa to 350 GPa, a thermal expansion coefficient of 4 ppm / K to 5 ppm / K, and a thermal conductivity of 50 W / mK to 200 W / mK. In addition, these values are each physical property value at normal temperature. The bending strength of the carrier plate 95 is a 4-point bending strength. The carrier plate 95 is made of, for example, ceramics, and it is preferable to use one made of Si-bonded SiC (Si-SiC) or recrystallized SiC. If the carrier plate 95 is made of Si-bonded SiC or recrystallized SiC, it is easy to satisfy the numerical ranges of bending strength, Young's coefficient, thermal expansion coefficient, and thermal conductivity.

此外，滿足該數值範圍之由Si鍵結SiC所構成的承載板95係例如可如以下所示製造。首先，對包含以SiC粉 體為主成分之基材原料、黏合劑及水的成形用原料捏揉，成形成承載板95的形狀，作為成形體。接著，將該成形體中放在金屬Si環境氣體下、降壓之惰性氣體或真空中，將金屬矽注入成形體中(例如至氣孔率成為1%以下)，作為Si鍵結SiC之燒結體，並作為承載板95。此外，基材原料係亦可採用包含C粉體者，並作為微量成分含有Al、Fe、Co較佳。此外，由這種Si鍵結SiC所構成之承載板的製造方法係記載於例如特開2012-56831號公報。 In addition, a carrier plate 95 made of Si-bonded SiC that satisfies this numerical range can be manufactured, for example, as follows. First of all, A base material, a binder, and a molding raw material for water, which are the main components of the body, are kneaded to form a shape of a carrier plate 95 and used as a molded body. Next, the formed body is placed under a metallic Si ambient gas, a depressurized inert gas, or a vacuum, and metal silicon is injected into the formed body (for example, until the porosity becomes 1% or less) as a sintered body of Si bonded SiC And as a carrier plate 95. In addition, as the base material, one containing C powder may be used, and Al, Fe, and Co are preferably contained as trace components. The method for manufacturing a carrier plate made of such Si-bonded SiC is described in, for example, Japanese Patent Application Laid-Open No. 2012-56831.

被處理物96係在通過爐體10a內時藉來自第1、第2加熱器21a、21b之熱進行例如烘烤等的熱處理。無特別限定，在本實施形態，被處理物96係由陶瓷製之電介質(基材)與電極所積層的積層體(尺寸係例如縱橫為1mm以內)，採用在烘烤後成為陶瓷電容器之晶片。又，本實施形態，採用被處理物96係在熱處理爐10進行熱處理之前，預先在例如800℃~900℃等進行熱處理，而預先進行被處理物96之黏合劑的除去或半燒結。 The to-be-processed object 96 is heat-processed, such as baking, by the heat from the 1st, 2nd heaters 21a, 21b, when passing through the furnace body 10a. There is no particular limitation. In this embodiment, the object to be processed 96 is a laminated body (dimension is within 1 mm, for example) of a dielectric (base material) made of ceramic and an electrode, and a wafer that becomes a ceramic capacitor after baking is used. . In the present embodiment, before the heat treatment in the heat treatment furnace 10 is performed, the object 96 is heat-treated at 800 ° C. to 900 ° C., and the binder of the object 96 is removed or semi-sintered in advance.

其次，說明使用依此方式所構成之熱處理爐10進行被處理物96之熱處理的狀況。首先，使用者操作操作面板88，輸入熱處理條件等之各種設定值後，按下起動按鈕。此外，在從使用者對操作面板88所輸入之各種設定值，包含關於第1、第2空間11a、11b的溫度、或承載板95通過搬運通路11c時之升溫速度的資訊。又，在各種設定值，包含來自氣體供給裝置22、24之環境氣體的供給量(供給速度)及溫度、在流量調整閥26、28流動之環境氣體的流量等的資訊。 Next, a description will be given of a state in which the heat treatment of the object 96 is performed using the heat treatment furnace 10 configured in this manner. First, the user operates the operation panel 88, inputs various setting values such as heat treatment conditions, and presses a start button. The various setting values input from the user to the operation panel 88 include information on the temperature of the first and second spaces 11a and 11b and the temperature increase rate of the carrier plate 95 when the carrier plate 95 passes through the conveyance path 11c. The various set values include information such as the supply amount (supply speed) and temperature of the ambient gas from the gas supply devices 22 and 24, and the flow rate of the ambient gas flowing through the flow adjustment valves 26 and 28.

輸入這些值並按下起動按鈕後，控制器80係根據來自操作面板88之操作信號，輸入來自使用者之各種設定值等，並記憶於RAM84後，使根據所記憶之各種設定值的熱處理開始。具體而言，控制器80係根據關於所輸入之來自氣體供給裝置22、24之環境氣體的供給量(供給速度)及溫度、在流量調整閥26、28流動之環境氣體的流量等的資訊，將控制信號輸出至氣體供給裝置22、24、流量調整閥26、28。又，根據關於所輸入之第1、第2空間11a、11b之溫度的資訊，將控制信號輸出至第1、第2加熱器21a、21b。藉此，第1、第2空間11a、11b之環境氣體係變成惰性氣體，第1、第2空間11a、11b之環境氣體被加熱。此外，如上述所示，第2空間11b係被加熱至比第1空間11a更高溫。在本實施形態，採用第1空間11a被加熱至700℃，第2空間11b被加熱至1200℃。又，在本實施形態，採用將氣體供給裝置22、氣體供給裝置24對爐體10a內之環境氣體之流入量的和與藉流量調整閥26、流量調整閥28之來自爐體10a內之環境氣體之流出量的和設為相同，而且，使來自流量調整閥28之流出量比來自氣體供給裝置24之流入量更小。藉由依此方式，第2空間11b內之環境氣體的一部分係通過搬運通路11c及第1空間11a後，從流出口18流出。因此，亦可將在第2空間11b被加熱至高溫之環境氣體的一部分用於第1空間11a之加熱，而可對第1空間11a高效率地加熱。 After inputting these values and pressing the start button, the controller 80 inputs various setting values and the like from the user according to the operation signal from the operation panel 88, and stores them in the RAM 84 to start the heat treatment according to the various setting values memorized. . Specifically, the controller 80 is based on information about the input amount (supply speed) and temperature of the ambient gas from the gas supply devices 22 and 24, the flow rate of the ambient gas flowing through the flow adjustment valves 26, 28, and the like, The control signals are output to the gas supply devices 22 and 24 and the flow rate adjustment valves 26 and 28. The control signal is output to the first and second heaters 21a and 21b based on the inputted information about the temperatures of the first and second spaces 11a and 11b. Thereby, the ambient gas system in the first and second spaces 11a and 11b becomes an inert gas, and the ambient gas in the first and second spaces 11a and 11b is heated. As described above, the second space 11b is heated to a higher temperature than the first space 11a. In this embodiment, the first space 11a is heated to 700 ° C, and the second space 11b is heated to 1200 ° C. In addition, in this embodiment, the sum of the inflow amount of the ambient gas in the furnace body 10a with the gas supply device 22 and the gas supply device 24 and the environment from the furnace body 10a through the flow adjustment valve 26 and the flow adjustment valve 28 are used. The sum of the outflow amounts of the gas is made the same, and the outflow amount from the flow adjustment valve 28 is made smaller than the inflow amount from the gas supply device 24. In this way, a part of the ambient gas in the second space 11b passes through the conveyance passage 11c and the first space 11a, and then flows out from the outflow port 18. Therefore, a part of the ambient gas heated to a high temperature in the second space 11b can be used for heating the first space 11a, and the first space 11a can be efficiently heated.

在依此方式結束第1、第2空間11a、11b之環境氣體的調整後，控制器80將控制信號輸出至未圖示之馬達， 而使第1搬運輥20a、第2搬運輥20b及可變速搬運輥20c轉動。然後，藉使用者或未圖示之搬運裝置將被處理物96從開口14搬入爐體10a內。所搬入之被處理物96係藉第1搬運輥20a、可變速搬運輥20c及第2搬運輥20b在第1空間11a、搬運通路11c及第2空間11b內按照此順序被搬運後，從開口15被搬出。在此期間，進行被處理物96之熱處理。此外，在熱處理爐10，依序搬入已載置被處理物96之承載板95，逐漸連續地進行被處理物96之熱處理。此外，用以冷卻被處理物96之未圖示的空間形成於比開口15更靠近搬運方向下游側，從開口15所搬出之被處理物96係一面在此空間被搬運一面以既定降溫速度被降溫(例如從第2空間11b之溫度至常溫)。 After adjusting the ambient gas in the first and second spaces 11a and 11b in this way, the controller 80 outputs a control signal to a motor (not shown). The first conveyance roller 20a, the second conveyance roller 20b, and the variable speed conveyance roller 20c are rotated. Then, the object to be processed 96 is carried into the furnace body 10 a through the opening 14 by a user or a conveying device (not shown). The object to be processed 96 is conveyed in the first space 11a, the conveying path 11c, and the second space 11b in this order by the first conveying roller 20a, the variable speed conveying roller 20c, and the second conveying roller 20b, and then opens from the opening. 15 were moved out. During this period, heat treatment of the object to be processed 96 is performed. In addition, in the heat treatment furnace 10, the carrying plate 95 on which the to-be-processed object 96 is placed is sequentially carried in, and the heat treatment of the to-be-processed object 96 is performed gradually and continuously. In addition, a space (not shown) for cooling the object to be processed 96 is formed closer to the downstream side than the opening 15 in the conveying direction, and the object to be processed 96 removed from the opening 15 is conveyed in this space while being cooled at a predetermined cooling rate. The temperature is lowered (for example, from the temperature of the second space 11b to normal temperature).

此外，熱處理時之第1搬運輥20a、第2搬運輥20b的搬運速度係在本實施形態採用相同的速度，設為比上述之可變速搬運輥20c的可變速區域更低的速度，並採用預設。又，可變速搬運輥20c之搬運速度係採用如下之控制。首先，速度取得部85讀出RAM84所記憶之第1、第2空間11a、11b的溫度、與被處理物96通過搬運通路11c時之升溫速度。然後，速度取得部85根據所讀出之資料與對應關係資料83，取得關於用以使被處理物96以使用者所輸入之升溫速度的可變速搬運輥20c之搬運速度(上述之可變速區域之範圍內的搬運速度)的值。接著，搬運控制部86係將可變速搬運輥20c之未圖示之馬達的轉速控制成承載板95以速度取得部85所取得之搬運速度通過搬運通路11c。此外，以對應關係資料83所表示的對應關係係亦可採用表，亦可採用計算式。此對應關係資料 83係例如可藉實驗預先求得。 In addition, the conveying speed of the first conveying roller 20a and the second conveying roller 20b during the heat treatment is the same speed in this embodiment, and is set to a lower speed than the variable speed region of the variable speed conveying roller 20c described above. Preset. The conveyance speed of the variable-speed conveyance roller 20c is controlled as follows. First, the speed acquisition unit 85 reads the temperatures of the first and second spaces 11a and 11b stored in the RAM 84 and the temperature rise rate when the object 96 passes through the conveyance path 11c. Then, based on the read data and correspondence data 83, the speed obtaining unit 85 obtains the conveying speed of the variable-speed conveyance roller 20c (the above-mentioned variable-speed area) for the object 96 to be heated at the heating speed input by the user. Value). Next, the conveyance control unit 86 controls the rotation speed of a motor (not shown) of the variable speed conveyance roller 20 c so that the carrier plate 95 passes the conveyance path 11 c at the conveyance speed obtained by the speed acquisition unit 85. In addition, the correspondence relationship represented by the correspondence relationship data 83 may be a table or a calculation formula. This correspondence data The 83 series can be obtained in advance through experiments, for example.

此外，在本實施形態，在第1空間11a為700℃、第2空間11b為1200℃的情況，採用藉由在上述之可變速區域的範圍改變可變速搬運輥20c之搬運速度，可至少在150℃/min~1000℃/min之範圍變更通過搬運通路11c時之被處理物96的升溫速度。使用者係在此升溫速度之範圍，輸入因應於被處理物96的材質等之適當的升溫速度。藉由將升溫速度設為適當的值，可將被處理物96之溫度從第1空間11a急速地升溫至第2空間11b，而使被處理物96之基材與電極的收縮時序接近，可抑制升溫速度過低所造成之烘烤時的裂開或剝離等的發生。又，可抑制升溫速度過高所造成之不均勻的烘烤。此外，若將第1、第2空間11a、11b之溫度(尤其，兩空間之溫差)設定成其他的值，在相同之可變速區域亦可調整的升溫速度就變化。例如，亦可以第1空間11a與第2空間11b之溫差成為400℃~600℃的方式決定兩空間的溫度。 In addition, in the present embodiment, when the first space 11a is 700 ° C and the second space 11b is 1200 ° C, the transfer speed of the variable-speed transfer roller 20c can be changed at least in the range of the above-mentioned variable-speed area. The temperature range of 150 ° C./min to 1000 ° C./min changes the temperature increase rate of the object 96 to be processed when passing through the conveyance path 11 c. The user is in the range of this heating rate, and inputs an appropriate heating rate in accordance with the material and the like of the object 96 to be processed. By setting the heating rate to an appropriate value, the temperature of the object 96 can be rapidly increased from the first space 11a to the second space 11b, and the contraction timing of the substrate of the object 96 and the electrode can be approximated. Suppression of cracking or peeling during baking caused by an excessively low heating rate. In addition, uneven baking caused by an excessively high heating rate can be suppressed. In addition, if the temperatures of the first and second spaces 11a and 11b (especially, the temperature difference between the two spaces) are set to other values, the temperature increase rate that can be adjusted in the same variable speed region changes. For example, the temperature of the two spaces may be determined so that the temperature difference between the first space 11a and the second space 11b becomes 400 ° C to 600 ° C.

在此，弄清楚第1實施形態之構成元件與本發明之構成元件的對應關係。本實施形態之第1空間11a相當於本發明之第1空間，第2空間11b相當於第2空間，搬運通路11c相當於搬運通路，間壁部30相當於間壁，爐體10a相當於爐體，第1、第2加熱器21a、21b相當於溫度調整手段，第1加熱器21a相當於第1溫度調整手段及第1加熱手段，第2加熱器21b相當於第2溫度調整手段及第2加熱手段，第1、第2搬運輥20a、20b及可變速搬運輥20c相當於搬運手段，第1搬運輥20a相當於第1搬運手段，第2搬運輥20b相當於第2 搬運手段，可變速搬運輥20c相當於可變速搬運手段。又，速度取得部85相當於速度取得手段，搬運控制部86相當於搬運控制手段。 Here, the correspondence between the constituent elements of the first embodiment and the constituent elements of the present invention is clarified. The first space 11a of this embodiment corresponds to the first space of the present invention, the second space 11b corresponds to the second space, the conveyance path 11c corresponds to the conveyance path, the partition wall portion 30 corresponds to the partition wall, and the furnace body 10a corresponds to the furnace. The first and second heaters 21a and 21b correspond to the temperature adjustment means, the first heater 21a corresponds to the first temperature adjustment means and the first heating means, and the second heater 21b corresponds to the second temperature adjustment means and the first 2 heating means, the first and second conveying rollers 20a, 20b and the variable speed conveying roller 20c correspond to the conveying means, the first conveying roller 20a corresponds to the first conveying means, and the second conveying roller 20b corresponds to the second As the conveyance means, the variable speed conveyance roller 20c corresponds to the variable speed conveyance means. The speed acquisition unit 85 corresponds to a speed acquisition means, and the transportation control unit 86 corresponds to a transportation control means.

在以上所說明之第1實施形態的熱處理爐10，在藉第1加熱器21a對第1空間11a之環境氣體加熱，並藉第2加熱器21b將第2空間11b之環境氣體加熱成比第1空間11a更高溫的狀態，使藉第1搬運輥20a在第1空間11a內所搬運的被處理物96藉可變速搬運輥20c以比藉第1、第2搬運輥20a、20b更高速之可變速區域內的既定速度通過搬運通路11c內，並搬運至第2搬運輥20b。藉此，被處理物96係藉由從第1空間11a通過搬運通路11c後被高速地搬運至高溫的第2空間11b，而急速地升溫。而且，此時之升溫速度係因應於搬運通路11c內之搬運速度而變化，但是此搬運速度係可在可變速區域之範圍內變更。因此，可因應於被處理物96來變更升溫速度，而可實現對應於各種被處理物96之急速升溫。此外，在使被處理物96急速升溫的情況之適當的升溫速度係根據被處理物96所含的材料或被處理物96的大小等而異。而且，例如若升溫速度過低，有因被處理物96中相異之材料間的收縮差而發生裂開或剝離等的情況。又，若升溫速度過高，有僅被處理物96的表面先烘烤等烘烤變成不均勻的情況。在第1實施形態之熱處理爐10，抑制這種事情，而可作成可實現對應於各種被處理物96的急速升溫。 In the heat treatment furnace 10 according to the first embodiment described above, the ambient gas in the first space 11a is heated by the first heater 21a, and the ambient gas in the second space 11b is heated by the second heater 21b to be more than the first In the state where the first space 11a is at a higher temperature, the to-be-processed object 96 carried in the first space 11a by the first conveying roller 20a is moved at a higher speed by the variable-speed conveying roller 20c than by the first and second conveying rollers 20a, 20b. A predetermined speed in the variable speed region passes through the conveyance path 11c and is conveyed to the second conveyance roller 20b. Thereby, the to-be-processed object 96 is rapidly heated by being conveyed from the 1st space 11a through the conveyance path 11c to the 2nd space 11b of high temperature at high speed. In addition, the heating speed at this time varies depending on the conveyance speed in the conveyance path 11c, but this conveyance speed can be changed within the range of the variable speed region. Therefore, the heating rate can be changed in accordance with the object 96, and rapid temperature rise corresponding to various objects 96 can be realized. In addition, an appropriate temperature increase rate in the case where the temperature of the object to be processed 96 is rapidly increased depends on the material contained in the object to be processed 96, the size of the object to be processed 96, and the like. Further, for example, if the heating rate is too low, cracks or peeling may occur due to a difference in shrinkage between dissimilar materials in the object to be processed 96. In addition, if the heating rate is too high, the surface of the object to be processed 96 may not be uniformly baked, such as being baked first. In the heat treatment furnace 10 of the first embodiment, such a situation can be suppressed, and rapid temperature rise corresponding to various kinds of objects 96 can be achieved.

又，藉由將搬運通路11c之間隙高度H設為35mm以下，抑制來自第2空間11b的輻射通過搬運通路11c後到達 第1空間11a。藉此，易使第1空間11a之環境氣體與第2空間11b之環境氣體的溫差變大。此外，在可變速區域為相同之數值範圍的情況，第1、第2空間11a、11b之溫差愈大，可變更之升溫速度的範圍愈寬。又，要使被處理物96適當地急速升溫，需要不僅升溫速度，而且升溫前後之溫差亦設為適當的值。因此，由於易使第1、第2空間11a、11b的溫差變大，而可實現對應於更多種類之被處理物96的急速升溫。又，藉由將間隙高度H設為25mm以上，可充分確保被處理物96或承載板95所通過之間隙。此外，在間隙高度H，未考慮承載板95或被處理物96的高度。可是，在承載板95或被處理物96通過搬運通路11c時，實際之搬運通路11c之鉛垂方向的間隙成為更窄了承載板95、被處理物96的高度份量。因此，承載板95或被處理物96之存在係在易使第1空間11a之環境氣體與第2空間11b之環境氣體的溫差變大的方向作用。因此，在間隙高度H不考慮這些高度亦無問題。 In addition, by setting the gap height H of the conveyance path 11c to 35 mm or less, radiation from the second space 11b is prevented from reaching the passage 11c after passing through the conveyance path 11c. The first space 11a. This makes it easy to increase the temperature difference between the ambient gas in the first space 11a and the ambient gas in the second space 11b. In addition, when the variable speed ranges are in the same numerical range, the larger the temperature difference between the first and second spaces 11a and 11b, the wider the range of the temperature increase rate that can be changed. In addition, in order to rapidly increase the temperature of the object to be processed 96 appropriately, it is necessary to set not only the temperature increase rate but also the temperature difference before and after the temperature increase to an appropriate value. Therefore, since the temperature difference between the first and second spaces 11a and 11b is likely to increase, rapid temperature rise corresponding to a greater number of types of objects 96 can be achieved. In addition, by setting the gap height H to 25 mm or more, the gap through which the object 96 or the carrier plate 95 passes can be sufficiently secured. In addition, in the clearance height H, the height of the carrier plate 95 or the to-be-processed object 96 is not considered. However, when the carrier plate 95 or the object to be processed 96 passes through the conveying path 11c, the gap in the vertical direction of the actual conveying path 11c becomes narrower than the height of the carrier plate 95 and the object to be processed 96. Therefore, the presence of the carrier plate 95 or the to-be-processed object 96 acts in a direction that tends to increase the temperature difference between the ambient gas in the first space 11a and the ambient gas in the second space 11b. Therefore, it is not a problem to consider these heights at the gap height H.

進而，藉由將搬運通路11c之搬運方向長度L設為該間隙高度H之3倍以上，更抑制來自第2空間11b之輻射通過搬運通路11c後到達第1空間11b。藉此，易使第1空間11a之環境氣體與第2空間11b之環境氣體的溫差變大，而可實現對應於更多種類之被處理物96的急速升溫。 Furthermore, by setting the conveyance direction length L of the conveyance path 11c to be three times or more the gap height H, radiation from the second space 11b is further suppressed from reaching the first space 11b after passing through the conveyance path 11c. This makes it easy to increase the temperature difference between the ambient gas in the first space 11a and the ambient gas in the second space 11b, and enables rapid temperature rise corresponding to a greater number of types of objects 96 to be processed.

進而，可變速搬運輥20c具有在搬運通路11c內水平地搬運被處理物96的複數支輥，間壁部30具有：上部間壁31，係位於搬運通路11c之鉛垂上側；及下部間壁35，係位於搬運通路11c之鉛垂下側。而且，下部間壁35之上端部38a、 38b在搬運方向位於複數個可變速搬運輥20c之間，且在鉛垂方向位於與複數個可變速搬運輥20c之下端相同的高度。藉由依此方式，可消除在沿著搬運方向觀察搬運通路11c時之可變速搬運輥20c的下端和下部間壁35之上下的間隙。藉此，抑制來自第2空間11b之輻射通過此間隙後到達第1空間11a。因此，易使第1空間11a之環境氣體與第2空間11b之環境氣體的溫差變大，而可實現對應於更多種類之被處理物96的急速升溫。 Further, the variable-speed conveyance roller 20c includes a plurality of support rollers for horizontally conveying the object to be processed 96 in the conveyance path 11c, and the partition wall portion 30 includes an upper partition wall 31 positioned vertically above the conveyance path 11c, and a lower partition wall. 35, which is located on the vertical lower side of the conveying path 11c. The upper end portion 38a of the lower partition wall 35, 38b is located between the plurality of variable speed conveyance rollers 20c in the conveying direction, and is located at the same height as the lower end of the plurality of variable speed conveyance rollers 20c in the vertical direction. In this way, the gap between the lower end of the variable speed conveyance roller 20c and the upper and lower parts of the lower partition wall 35 when the conveyance path 11c is viewed in the conveyance direction can be eliminated. Thereby, the radiation from the second space 11b is suppressed from reaching the first space 11a after passing through the gap. Therefore, it is easy to increase the temperature difference between the ambient gas in the first space 11a and the ambient gas in the second space 11b, and it is possible to achieve rapid temperature rise corresponding to more types of the object 96 to be processed.

而且，下部間壁35具備具有上端部38a、38b之凸狀部37a、37b，凸狀部37a、37b作成朝向上端部38a、38b愈往鉛垂上側搬運方向的寬度變成愈小的形狀。藉由依此方式，在搬運方向將下部間壁35之上端部38a、38b配置於複數個可變速搬運輥20c之間下，在下部間壁35熱膨脹的情況等易避免可變速搬運輥20c與下部間壁35(尤其凸狀部37a、37b)接觸。 Further, the lower partition wall 35 includes convex portions 37a, 37b having upper end portions 38a, 38b, and the convex portions 37a, 37b are formed to have a smaller width toward the upper end portions 38a, 38b in the vertical upward transport direction. In this way, the upper end portions 38a and 38b of the lower partition wall 35 are arranged between the plurality of variable speed conveyance rollers 20c in the conveying direction, and it is easy to avoid the variable speed conveyance rollers 20c and the lower portion in the case of thermal expansion in the lower partition wall 35. The partition wall 35 (especially the convex portions 37a, 37b) is in contact.

而且，可變速搬運輥20c之可變速區域係以可至少在150℃/min~1000℃/min之範圍變更通過搬運通路11c時之被處理物96的升溫速度之方式所決定的區域。而且，在熱處理，被處理物96係在被載置於承載板95之狀態下被搬運。在此時，藉由對承載板95，分別作為在常溫的物性值，設定彎曲強度為100MPa~250MPa、楊氏係數為200GPa~350GPa、熱膨脹係數為4ppm/K~5ppm/K、導熱率為50W/mK~200W/mK，在可變更之升溫速度的範圍內承載板之耐熱性及溫度追蹤性成為充分者。藉此，即使變更升溫速度，亦可使用相同之承載板 95，進行熱處理，而不必準備因應於升溫速度之複數種承載板95。又，若承載板95採用由Si鍵結SiC或再結晶SiC所構成者，可比較易於滿足彎曲強度、楊氏係數、熱膨脹係數、導熱率之該數值範圍。此外，在本實施形態，承載板95之搬運方向的長度係採用比搬運通路11c之搬運方向長度L更長者。在這種承載板95通過搬運通路11c時，即使承載板95中搬運方向上游側之一部分到達第2空間11b，搬運方向下游側之一部分亦還存在於第1空間11a內。在此情況，承載板95係在上游側與下游側易發生溫差，本身之溫度分布易發生。藉由作成承載板95滿足該數值範圍中尤其導熱率為50W/mK~200W/mK，即使在這種情況，亦抑制承載板95的溫度分布，而可對被處理物96更均勻地進行熱處理。 In addition, the variable speed region of the variable speed conveyance roller 20c is an area determined so that the temperature rising speed of the to-be-processed object 96 when passing through the conveyance path 11c can be changed at least in the range of 150 ° C / min to 1000 ° C / min. In the heat treatment, the object 96 is transported while being placed on the carrier plate 95. At this time, with respect to the carrier plate 95, as the physical property values at normal temperature, the bending strength is set to 100 MPa to 250 MPa, the Young's coefficient is 200 GPa to 350 GPa, the thermal expansion coefficient is 4 ppm / K to 5 ppm / K, and the thermal conductivity is 50 W. / mK ~ 200W / mK, the heat resistance and temperature traceability of the carrier plate are sufficient within a range of a variable heating rate. This allows the same carrier plate to be used even if the heating rate is changed 95. Heat treatment is performed without having to prepare a plurality of types of carrier plates 95 corresponding to the heating rate. In addition, if the carrier plate 95 is made of Si-bonded SiC or recrystallized SiC, it is relatively easy to satisfy the numerical ranges of bending strength, Young's coefficient, thermal expansion coefficient, and thermal conductivity. In the present embodiment, the length in the carrying direction of the carrier plate 95 is longer than the length L in the carrying direction of the carrying path 11c. When such a carrier plate 95 passes through the conveyance path 11c, even if a part of the carrier plate 95 on the upstream side in the conveying direction reaches the second space 11b, a part of the carrier plate 95 on the downstream side still exists in the first space 11a. In this case, a temperature difference easily occurs between the upstream side and the downstream side of the carrier plate 95, and the temperature distribution itself is liable to occur. By making the carrier plate 95 to satisfy the thermal conductivity of 50 W / mK to 200 W / mK in this numerical range, even in this case, the temperature distribution of the carrier plate 95 is suppressed, and the to-be-treated object 96 can be more uniformly heat-treated .

[第2實施形態] [Second Embodiment]

其次，說明本發明之第2實施形態。第4圖係第2實施形態之熱處理爐110的縱向剖面圖。熱處理爐110係除了在第2空間11b之搬運方向下游(後方)更具備第3空間111b、及具備將第2空間11b與第3空間111b之間隔開的間壁部130以外，與熱處理爐10相同的構成。此外，在第4圖，關於熱處理爐110中比搬運通路11c更靠近搬運方向上游側的構成(例如第1空間11a等)，省略圖示。又，關於熱處理爐110，對與上述之熱處理爐10相同之構成元件附加相同的符號，在以下說明相異之構成元件。 Next, a second embodiment of the present invention will be described. Fig. 4 is a longitudinal sectional view of the heat treatment furnace 110 according to the second embodiment. The heat treatment furnace 110 is provided with a third space 111b and a partition wall portion 130 separating the second space 11b and the third space 111b from the downstream (rear) of the second space 11b in the conveying direction, and the heat treatment furnace 10 The same composition. In addition, in FIG. 4, the structure (for example, the 1st space 11a etc.) of the heat processing furnace 110 which is closer to the conveyance direction upstream side than the conveyance path 11c is abbreviate | omitted. In addition, regarding the heat treatment furnace 110, the same components as those of the heat treatment furnace 10 described above are assigned the same reference numerals, and the different components will be described below.

熱處理爐110包括爐體110a、第3搬運輥120b、氣體供給裝置124、流量調整閥128、冷卻管140、氣冷套142、 144及冷媒供給源146、148。爐體110a包括外壁111、及配置於外壁111內之間壁部130。外壁111係將外壁11更擴大至更後方，並在第2空間11b之後方，按照此順序具有係內部之空間的搬運通路111c及第3空間111b。又，外壁111具有從形成於外壁111之後端面113的第3空間111b往外部之出口的開口115。第3空間111b係由外壁111及間壁部130所包圍之空間。搬運通路111c係使第2空間11b與第3空間111b連通之空間，並藉間壁部130所形成。 The heat treatment furnace 110 includes a furnace body 110a, a third conveying roller 120b, a gas supply device 124, a flow adjustment valve 128, a cooling pipe 140, an air cooling jacket 142, 144 and refrigerant supply sources 146 and 148. The furnace body 110 a includes an outer wall 111 and an intermediate wall portion 130 disposed inside the outer wall 111. The outer wall 111 expands the outer wall 11 further to the rear, and behind the second space 11b, the outer wall 111 has a conveying path 111c and a third space 111b in the interior space in this order. The outer wall 111 has an opening 115 from the third space 111 b formed on the end surface 113 behind the outer wall 111 to the outside. The third space 111b is a space surrounded by the outer wall 111 and the partition wall portion 130. The conveying path 111c is a space that communicates the second space 11b and the third space 111b, and is formed by the partition 130.

間壁部130包括：上部間壁131，係包括本體部132及樑133；及下部間壁135，係包括本體部136及凸狀部137a、137b(參照第4圖之在左側所示之虛線框S2的放大部分)。凸狀部137a、137b具備係頂上部之上端部138a、138b。此間壁部130係除了在隔開第2空間11b與第3空間111b、及將替代可變速搬運輥20c之第3搬運輥120b配置於搬運通路111c以外，係與間壁部30相同的構成。 The partition wall portion 130 includes an upper partition wall 131 including a main body portion 132 and a beam 133, and a lower partition wall 135 including a main body portion 136 and convex portions 137a and 137b (refer to the dotted line shown on the left in FIG. 4). Enlarged part of box S2). The convex portions 137a and 137b include upper end portions 138a and 138b. The partition wall portion 130 has the same configuration as the partition wall portion 30 except that the third conveyance roller 120b instead of the variable-speed conveyance roller 20c is arranged in the conveyance path 111c, separating the second space 11b and the third space 111b.

第3搬運輥120b係在搬運通路111c及第3空間111b內沿著係既定搬運方向之水平方向配置複數個(在本實施形態為14個)，並搬運承載板95之搬運輥。藉由第3搬運輥120b轉動，藉第2搬運輥20b所搬運之承載板95係通過搬運通路111c及第3空間111b後，在搬運方向被搬運至開口115。 The third conveyance rollers 120b are arranged in the conveyance path 111c and the third space 111b along the horizontal direction of the predetermined conveyance direction (14 in this embodiment), and convey the conveyance rollers of the carrier plate 95. When the third conveyance roller 120b rotates, the carrier plate 95 conveyed by the second conveyance roller 20b passes through the conveyance path 111c and the third space 111b, and is conveyed to the opening 115 in the conveyance direction.

氣體供給裝置124係與氣體供給裝置24相同的構成，經由在外壁111之底部中形成於第3空間111b之後端面113側的氣體供給口117，將環境氣體供給至第3空間111b。此外，在本實施形態，氣體供給裝置124係採用供給例如20 ℃的環境氣體，並冷卻第3空間111b者。 The gas supply device 124 has the same configuration as the gas supply device 24, and supplies ambient gas to the third space 111b via a gas supply port 117 formed on the bottom surface of the outer wall 111 on the rear face 113 side of the third space 111b. In addition, in this embodiment, the gas supply device 124 uses a supply such as 20 Ambient air at ℃, and cooling the third space 111b.

流量調整閥128係與流量調整閥28相同的構成，並與在外壁111之頂部部分中形成於第3空間111b的前端面12側(前方)的流出口119連接，流量調整閥128係調整經由該流出口119使第3空間111b之環境氣體流出時的流量。 The flow adjustment valve 128 has the same configuration as the flow adjustment valve 28, and is connected to an outflow port 119 formed on the top portion of the outer wall 111 on the front side 12 side (front) of the third space 111b. The flow adjustment valve 128 is adjusted through This outflow port 119 is a flow rate when the ambient gas in the third space 111b flows out.

冷卻管140係以從上下隔著第3搬運輥120b之方式，在第3空間111b內於外壁111之頂部及底部配置複數個(在本實施形態為上下各3個)。冷卻管140係冷媒(例如空氣等)可通過內部，並藉該冷媒冷卻第3空間111b內。 A plurality of cooling tubes 140 are arranged on the top and bottom of the outer wall 111 in the third space 111b so as to sandwich the third conveyance roller 120b from above and below (three in the present embodiment). The cooling tube 140 is a refrigerant (for example, air) that can pass through the inside, and the third space 111b is cooled by the refrigerant.

氣冷套142、144係用以冷卻第3空間111b者，並分別配置於外壁111之頂部及底部。此氣冷套142、144係表面在第3空間111b內露出，來自冷媒供給源146、148之冷媒(空氣)係可通過內部。氣冷套142、144係藉該冷媒經由於第3空間111b所露出之表面，冷卻第3空間111b。此外，多個凹凸形成於氣冷套142、144之第3空間111b內的露出面，增加與第3空間111b的接觸面積，而提高冷卻效率。 The air cooling jackets 142 and 144 are used to cool the third space 111b, and are disposed on the top and bottom of the outer wall 111, respectively. The surfaces of the air cooling jackets 142 and 144 are exposed in the third space 111b, and the refrigerant (air) from the refrigerant supply sources 146 and 148 can pass through the inside. The air cooling jackets 142 and 144 cool the third space 111b by passing the refrigerant through the exposed surface of the third space 111b. In addition, a plurality of irregularities are formed on the exposed surface in the third space 111b of the air-cooling jackets 142 and 144, increasing the contact area with the third space 111b, and improving the cooling efficiency.

在依此方式所構成之熱處理爐110，被處理物96之熱處理開始時，控制器80控制來自氣體供給裝置124之環境氣體的供給量及溫度、在流量調整閥128流動之環境氣體的流量、通過冷卻管140、氣冷套142、144之冷媒(空氣)的供給量及溫度等。藉此，第3空間111b之環境氣體係變成惰性氣體環境氣體，而且第3空間111b被冷卻成比第2空間11b之溫度(例如1200℃)更低的溫度(例如500℃~650℃)。此外，第1空間11a、第2空間11b之環境氣體的調整係與熱處理爐10 一樣地進行。 In the heat treatment furnace 110 configured in this way, when the heat treatment of the object to be processed 96 is started, the controller 80 controls the supply amount and temperature of the ambient gas from the gas supply device 124, the flow rate of the ambient gas flowing through the flow adjustment valve 128, The supply amount and temperature of the refrigerant (air) passing through the cooling pipe 140 and the air cooling jackets 142 and 144. Thereby, the ambient gas system of the third space 111b becomes an inert gas ambient gas, and the third space 111b is cooled to a temperature (for example, 500 ° C to 650 ° C) lower than the temperature (for example, 1200 ° C) of the second space 11b. The adjustment system of the ambient gas in the first space 11a and the second space 11b and the heat treatment furnace 10 Do the same.

接著，結束第1空間11a、第2空間11b、第3空間111b之環境氣體的調整後，控制器80將控制信號輸出至未圖示之馬達，而使第1搬運輥20a、第2搬運輥20b、可變速搬運輥20c及第3搬運輥120b轉動。然後，藉使用者或未圖示之搬運裝置將被處理物96從開口14搬入爐體110a內。所搬入之被處理物96係藉第1搬運輥20a、可變速搬運輥20c及第2搬運輥20b在第1空間11a、搬運通路11c及第2空間11b內按照此順序被搬運，在此期間進行被處理物96之熱處理(烘烤)。然後，烘烤後之被處理物96係藉第3搬運輥120b在搬運通路111c及第3空間111b內按照此順序被搬運。在此時，根據第2空間11b與第3空間111b之溫差，將被處理物96以既定降溫速度急速降溫。然後，被處理物96係從開口115被搬出，並被降溫至外氣溫度(例如常溫)。此外，第3空間111b之溫度(與第2空間11b或外氣的溫差)係預先決定成可適當地冷卻烘烤後之被處理物96。例如，亦可將第3空間111b之溫度決定成第2空間11b與第3空間111b的溫差成為400℃~600℃。 Next, after the adjustment of the ambient gas in the first space 11a, the second space 11b, and the third space 111b is completed, the controller 80 outputs a control signal to a motor (not shown) to cause the first conveying roller 20a and the second conveying roller. 20b, the variable speed conveyance roller 20c and the third conveyance roller 120b rotate. Then, the object to be processed 96 is carried into the furnace body 110 a from the opening 14 by a user or a conveying device (not shown). The object to be processed 96 is conveyed in this order in the first space 11a, the conveying path 11c, and the second space 11b by the first conveying roller 20a, the variable speed conveying roller 20c, and the second conveying roller 20b. During this period, Heat treatment (baking) of the object 96 is performed. Then, the to-be-processed object 96 is conveyed in this order in the conveyance path 111c and the 3rd space 111b by the 3rd conveyance roller 120b. At this time, based on the temperature difference between the second space 11b and the third space 111b, the processed object 96 is rapidly cooled at a predetermined cooling rate. Then, the object to be processed 96 is carried out from the opening 115 and is cooled to the outside air temperature (for example, normal temperature). The temperature of the third space 111b (the temperature difference from the second space 11b or the outside air) is determined in advance so that the processed object 96 after the baking can be appropriately cooled. For example, the temperature of the third space 111b may be determined so that the temperature difference between the second space 11b and the third space 111b becomes 400 ° C to 600 ° C.

在此，弄清楚第2實施形態之構成元件與本發明之構成元件的對應關係。此外，在第2實施形態，包含與上述之第1實施形態相同的對應關係，對相同的對應關係省略記載，在以下記載與第1實施形態相異的對應關係(主要與第3空間111b相關的構成元件與本發明的對應關係)。本實施形態之第2空間11b相當於本發明之第1空間，第3空間111b相 當於第2空間，搬運通路111c相當於搬運通路，間壁部130相當於間壁，爐體110a相當於爐體，第2加熱21b、氣體供給裝置124、流量調整閥128、冷卻管140、氣冷套142、144及冷媒供給源146、148相當於溫度調整手段，第2加熱器21b相當於第1溫度調整手段及第1加熱手段，氣體供給裝置124、流量調整閥128、冷卻管140、氣冷套142、144及冷媒供給源146、148相當於第2溫度調整手段及第2冷卻手段，第2搬運輥20b及第3搬運輥120b相當於搬運手段。 Here, the correspondence between the constituent elements of the second embodiment and the constituent elements of the present invention is clarified. In addition, the second embodiment includes the same correspondence relationship as the first embodiment described above, the same correspondence relationship is omitted, and the correspondence relationship different from the first embodiment is described below (mainly related to the third space 111b). Corresponding relationship between the constituent elements of the present invention). The second space 11b of this embodiment corresponds to the first space of the present invention, and the third space 111b has a phase In the second space, the conveying path 111c corresponds to the conveying path, the partition wall portion 130 corresponds to the partition wall, the furnace body 110a corresponds to the furnace body, the second heating 21b, the gas supply device 124, the flow adjustment valve 128, the cooling pipe 140, The air cooling jackets 142 and 144 and the refrigerant supply sources 146 and 148 correspond to temperature adjustment means, and the second heater 21b corresponds to the first temperature adjustment means and the first heating means. The gas supply device 124, the flow rate adjustment valve 128, and the cooling pipe 140 The air cooling jackets 142 and 144 and the refrigerant supply sources 146 and 148 correspond to the second temperature adjustment means and the second cooling means, and the second conveyance roller 20b and the third conveyance roller 120b correspond to the conveyance means.

在以上所說明之第2實施形態的熱處理爐110，藉與第1實施形態相同的構成，得到相同之效果。例如，藉由將搬運通路111c之間隙高度H設為35mm以下，易使第2、第3空間11b、111b之溫差變大，而可實現對應於更多種類之被處理物96的急速降溫。又，藉由將間隙高度H設為25mm以上，可充分確保被處理物96或承載板95所通過之間隙。進而，藉由將搬運通路111c之搬運方向長度L設為該間隙高度H之3倍以上，易使第2空間11b之環境氣體與第3空間111b之環境氣體的溫差變大。 In the heat treatment furnace 110 according to the second embodiment described above, the same effects as those of the first embodiment can be obtained. For example, by setting the gap height H of the conveying path 111c to 35 mm or less, the temperature difference between the second and third spaces 11b and 111b can be easily increased, and rapid temperature reduction corresponding to more types of the object 96 can be achieved. In addition, by setting the gap height H to 25 mm or more, the gap through which the object 96 or the carrier plate 95 passes can be sufficiently secured. Furthermore, by setting the length L of the conveying direction of the conveying path 111c to be three times or more the height H of the gap, the temperature difference between the ambient gas in the second space 11b and the ambient gas in the third space 111b can easily increase.

進而，下部間壁135之上端部138a、138b在搬運方向位於複數個第3搬運輥120b之間，而且在鉛垂方向位於與複數個第3搬運輥120b之下端相同的高度。因此，可消除在沿著搬運方向觀察搬運通路111c時之第3搬運輥120b的下端和下部間壁135之上下的間隙。 Furthermore, the upper end portions 138a, 138b of the lower partition wall 135 are located between the plurality of third conveyance rollers 120b in the conveying direction, and are positioned at the same height as the lower ends of the plurality of third conveyance rollers 120b in the vertical direction. Therefore, the gap between the lower end of the third conveyance roller 120b and the upper and lower portions of the lower partition wall 135 when the conveyance path 111c is viewed in the conveyance direction can be eliminated.

進而，下部間壁135具備具有上端部138a、138b之凸狀部137a、137b，凸狀部137a、137b作成朝向上端部 138a、138b愈往鉛垂上側搬運方向的寬度變成愈小的形狀。因此，在搬運方向將下部間壁135之上端部138a、138b配置於複數個第3搬運輥120b之間下，在下部間壁135熱膨脹的情況等易避免第3搬運輥120b與下部間壁135(尤其凸狀部137a、137b)接觸。 Furthermore, the lower partition wall 135 includes convex portions 137a and 137b having upper end portions 138a and 138b, and the convex portions 137a and 137b are oriented toward the upper end portion. The widths of 138a and 138b in the vertical conveyance direction become smaller and smaller. Therefore, it is easy to avoid the third transfer roller 120b and the lower partition wall 135 by arranging the upper end portions 138a and 138b of the lower partition wall 135 between the plurality of third transfer rollers 120b in the conveying direction and thermal expansion of the lower partition wall 135. (Especially the convex portions 137a, 137b) are in contact.

進而，藉由對承載板95採用與第1實施形態一樣的物性值(在常溫之彎曲強度為100MPa~250MPa、楊氏係數為200GPa~350GPa、熱膨脹係數為4ppm/K~5ppm/K、導熱率為50W/mK~200W/mK)，對在承載板95通過第2空間11b、搬運通路111c、第3空間111b時之降低的溫差及降溫速度之耐熱性及溫度追蹤性成為充分者。例如，在與升溫速度一樣地150℃/min~1000℃/min之範圍的降溫速度，承載板95之耐熱性及溫度追蹤性成為充分者。 Furthermore, the same physical properties as those of the first embodiment are adopted for the carrier plate 95 (bending strength at room temperature is 100 MPa to 250 MPa, Young's coefficient is 200 GPa to 350 GPa, thermal expansion coefficient is 4 ppm / K to 5 ppm / K, and thermal conductivity (50W / mK to 200W / mK), which is sufficient for the heat resistance and temperature traceability of the reduced temperature difference and cooling rate when the carrier plate 95 passes through the second space 11b, the conveying path 111c, and the third space 111b. For example, the heat resistance and temperature traceability of the carrier plate 95 are sufficient at a temperature reduction rate in the range of 150 ° C./min to 1000 ° C./min, similarly to the temperature increase rate.

此外，本發明係絲毫未限定為上述之實施形態，當然只要屬於本發明之技術性範圍，能以各種形態實施。 In addition, the present invention is not limited to the above-mentioned embodiments at all, and as long as it belongs to the technical scope of the present invention, it can be implemented in various forms.

例如，在上述之實施形態，採用上端部38a、38b係位於與可變速搬運輥20c之下端相同的高度者，但是亦可上端部38a、38b位於比可變速搬運輥20c之下端上方的位置。關於第2實施形態之上端部138a、138b亦一樣。 For example, in the above-mentioned embodiment, the upper end portions 38a and 38b are positioned at the same height as the lower end of the variable speed conveyance roller 20c, but the upper end portions 38a and 38b may be located higher than the lower end of the variable speed conveyance roller 20c. The same applies to the upper end portions 138a and 138b of the second embodiment.

在上述之實施形態，採用凸狀部37a、37b係與左右方向垂直之截面為三角形，並以愈往鉛垂上側前後方向之寬度變成愈窄的方式所形成者，但是未限定為如截面為三角形的情況般愈往鉛垂上側前後方向之寬度連續地變成愈窄者，亦可採用成步級函數變小者。例如，亦可凸狀部37a、37b係與左 右方向垂直之截面為階梯狀。凸狀部37a、37b係未限定為愈往鉛垂上側前後方向之寬度連續地變成愈窄者，例如亦可採用與左右方向垂直之截面為四角形者。在此情況，亦若使凸狀部37a、37b之搬運方向的寬度比可變速搬運輥20c之搬運方向的間隔更小，則可將下部間壁35的上端部配置於可變速搬運輥20c之間，而且配置於可變速搬運輥20c之下端以上的高度。關於第2實施形態之凸狀部137a、137b亦一樣。 In the above-mentioned embodiment, the convex portions 37a and 37b are formed in a triangle with a cross section perpendicular to the left-right direction, and are formed so that the width in the front-back direction becomes narrower toward the vertical upper side, but it is not limited to such a cross-section as In the case of a triangle, as the width in the front-back direction continuously becomes narrower, the stepwise function can also be used. For example, the convex portions 37a and 37b may be connected to the left side. The right vertical cross section is stepped. The convex portions 37a and 37b are not limited to those whose widths become narrower and narrower toward the vertical upper side. For example, those having a rectangular cross section perpendicular to the left and right directions may be used. In this case, if the width in the conveyance direction of the convex portions 37a and 37b is smaller than the interval in the conveyance direction of the variable-speed conveyance roller 20c, the upper end portion of the lower partition wall 35 can be arranged on the variable-speed conveyance roller 20c. It is also arranged at a height above the lower end of the variable speed conveyance roller 20c. The same applies to the convex portions 137a and 137b of the second embodiment.

在上述之實施形態，採用藉第1、第2加熱器21a、21b對第1、第2空間11a、11b進行加熱者，但是只要是對第1、第2空間11a、11b進行加熱者，亦可使用其他的加熱手段。例如，亦可使用燃氣器，替代加熱器。或者，亦可採用從氣體供給裝置22、24供給高溫之環境氣體者，藉該環境氣體對第1、第2空間11a、11b進行加熱。 In the above embodiment, the first and second spaces 11a and 11b are heated by the first and second heaters 21a and 21b. However, as long as the first and second spaces 11a and 11b are heated, Other heating means can be used. For example, a gas burner may be used instead of a heater. Alternatively, a person supplying high-temperature ambient gas from the gas supply devices 22 and 24 may be used to heat the first and second spaces 11a and 11b by the ambient gas.

在上述之實施形態，採用使以間壁部30所隔開之第2空間11b的環境氣體比第1空間11a更高溫者，但是未限定如此。只要以間壁所隔開之第1空間11a的環境氣體與第2空間11b之環境氣體的溫度相異即可。又，只要是使以間壁所隔開之兩空間之環境氣體的溫度相異者，亦可將對空間加熱之手段與對空間冷卻之手段任意地組合。 In the above-mentioned embodiment, the ambient gas in the second space 11b partitioned by the partition wall portion 30 is used at a higher temperature than the first space 11a, but it is not limited to this. The temperature of the ambient gas in the first space 11a and the ambient gas in the second space 11b separated by the partition wall may be different. In addition, as long as the temperature of the ambient gas in the two spaces separated by the partition wall is different, the means for heating the space and the means for cooling the space may be arbitrarily combined.

在上述之第2實施形態，採用藉以間壁部130所隔開之第2空間11b與第3空間111b的溫差，對被處理物96進行烘烤後之急速降溫者，但是未限定如此。例如，亦可採用在對烘烤後之被處理物96進行退火處理(例如在1000℃之熱處理等)後，進行急速降溫者。即，亦可將進行該退火處理之空 間作為本發明的第1空間，將接著被搬運被處理物96之空間作為本發明的第2空間，並以間壁部130將兩空間隔開，再將該第2空間調整至比第1空間低的溫度，對被處理物進行退火後之急速降溫。 In the second embodiment described above, the temperature difference between the second space 11b and the third space 111b separated by the partition wall portion 130 is used to rapidly reduce the temperature of the object 96 after baking, but it is not limited to this. For example, an annealing treatment (for example, a heat treatment at 1000 ° C.) for the to-be-processed object 96 may be adopted, followed by rapid temperature reduction. That is, it is also possible to remove The space is the first space of the present invention, the space next to the object to be processed 96 is taken as the second space of the present invention, the two spaces are separated by the partition wall portion 130, and the second space is adjusted to be larger than the first space. The temperature in the space is low, and the object to be processed is rapidly cooled after annealing.

在上述之第2實施形態，採用使用替代可變速搬運輥之第3搬運輥120b，在搬運通路111c內搬運被處理物96，但是與搬運通路11c一樣，亦可藉可變速搬運輥搬運。依此方式，可因應於搬運通路111c內之搬運速度改變急速降溫的降溫速度，而可實現對應於更多種類之被處理物96的急速降溫。 In the second embodiment described above, the third conveyance roller 120b instead of the variable speed conveyance roller is used to convey the object 96 in the conveyance path 111c. However, the conveyance path 11c can also be conveyed by the variable speed conveyance roller. In this way, the rapid cooling temperature can be changed in accordance with the conveying speed in the conveying path 111c, and rapid cooling corresponding to more types of the object 96 can be realized.

在上述之實施形態，採用間壁部30、130係將爐體內之2個空間隔開者，但是亦可在爐體之成為搬入口或搬出口的位置亦配置與間壁部30、130一樣之間壁部。即，亦可採用與間壁部30、130一樣之間壁部將爐體內之空間與外部空間隔開者。 In the above-mentioned embodiment, the partition walls 30 and 130 are used to separate the two spaces in the furnace body. However, the partition wall portions 30 and 130 can also be arranged in the same position as the partition wall portions 30 and 130. Between the walls. That is, it is also possible to use a partition wall portion similar to the partition wall portions 30 and 130 to separate the space in the furnace body from the external space.

[實施例] [Example]

[第1實施例] [First embodiment]

作為第1實施例之熱處理爐，製作了第1圖~第3圖所示之熱處理爐10。此熱處理爐10係將間隙高度H設為30.0mm、並將搬運方向長度L設為100mm。又，將搬運通路11c之左右方向長度設為700mm。又，將可變速搬運輥20c之可變速區域設為90mm/min~600mm/min。 As a heat treatment furnace of the first embodiment, a heat treatment furnace 10 shown in Figs. 1 to 3 was produced. In this heat treatment furnace 10, the gap height H is set to 30.0 mm, and the conveyance direction length L is set to 100 mm. The length in the left-right direction of the conveyance path 11c is 700 mm. The variable speed area of the variable speed conveyance roller 20c is set to 90 mm / min to 600 mm / min.

[第1比較例] [First Comparative Example]

製作除了將間隙高度H設為36mm、並將搬運方向長度L設為50mm以外，係與第1實施例一樣的熱處理爐10， 作為第1比較例。 The heat treatment furnace 10 was produced in the same manner as in the first embodiment except that the gap height H was 36 mm and the length L in the conveying direction was 50 mm. As a first comparative example.

[第2實施例] [Second embodiment]

作為第2實施例之熱處理爐，製作了第4圖所示之熱處理爐110。此熱處理爐110係將搬運通路111c之間隙高度H設為30.0mm、並將搬運方向長度L設為100mm。又，將搬運通路111c之左右方向長度設為700mm。 As a heat treatment furnace of the second embodiment, a heat treatment furnace 110 shown in FIG. 4 was produced. In this heat treatment furnace 110, the clearance height H of the conveyance path 111c is 30.0 mm, and the conveyance direction length L is 100 mm. The length in the left-right direction of the conveyance path 111c is set to 700 mm.

在第1實施例之熱處理爐10，藉氣體供給裝置22、24將第1、第2空間11a、11b之環境氣體作為氮氣環境氣體。然後，設為來自氣體供給裝置22、24之氣體的供給及來自流量調整閥26、流量調整閥28之氣體的流出都無之狀態。在此狀態，將熱處理時之第1空間11a的溫度(目標溫度)設為700℃，並將第2空間11b的溫度(目標溫度)設為1200℃，在藉控制器80控制第1、第2加熱器21a、21b之輸出時，第1、第2空間11a、11b之任一空間之環境氣體的溫度都可調整至目標溫度。此外，第1、第2空間11a、11b之環境氣體的溫度係都採用在空間內之中心所測量之溫度。 In the heat treatment furnace 10 of the first embodiment, the ambient gas in the first and second spaces 11a and 11b is used as the nitrogen ambient gas by the gas supply devices 22 and 24. Then, the state where neither the supply of gas from the gas supply devices 22 and 24 nor the outflow of the gas from the flow adjustment valve 26 and the flow adjustment valve 28 is set. In this state, the temperature (target temperature) of the first space 11a during the heat treatment is set to 700 ° C, and the temperature (target temperature) of the second space 11b is set to 1200 ° C. When the heaters 21a and 21b output, the temperature of the ambient gas in any of the first and second spaces 11a and 11b can be adjusted to the target temperature. In addition, the temperature of the ambient gas in the first and second spaces 11a and 11b is the temperature measured at the center of the space.

在第1比較例之熱處理爐10，藉氣體供給裝置22、24將第1、第2空間11a、11b之環境氣體作為氮氣環境氣體。然後，設為來自氣體供給裝置22、24之氣體的供給及來自流量調整閥26、流量調整閥28之氣體的流出都無之狀態。在此狀態，將熱處理時之第1空間11a的溫度(目標溫度)設為800℃，並將第2空間11b的溫度(目標溫度)設為1200℃，藉控制器80控制第1、第2加熱器21a、21b之輸出。第2空間11b的溫度係可調整至目標溫度的1200℃，但是第1空間 11a的溫度係即使將第1加熱器21a之輸出設為0%，亦只能成為900℃，無法成為目標溫度之800℃。即，在第1比較例，第1、第2空間11a、11b之溫差未超過300℃。 In the heat treatment furnace 10 of the first comparative example, the ambient gas in the first and second spaces 11 a and 11 b is used as the nitrogen ambient gas by the gas supply devices 22 and 24. Then, the state where neither the supply of gas from the gas supply devices 22 and 24 nor the outflow of the gas from the flow adjustment valve 26 and the flow adjustment valve 28 is set. In this state, the temperature (target temperature) of the first space 11a during the heat treatment is set to 800 ° C, and the temperature (target temperature) of the second space 11b is set to 1200 ° C. Output of the heaters 21a and 21b. The temperature of the second space 11b can be adjusted to 1200 ° C of the target temperature, but the first space 11b The temperature of 11a is only 900 ° C even if the output of the first heater 21a is set to 0%, and cannot be 800 ° C of the target temperature. That is, in the first comparative example, the temperature difference between the first and second spaces 11a and 11b did not exceed 300 ° C.

在第2實施例之熱處理爐110，藉氣體供給裝置24、124將第2、第3空間11b、111b之環境氣體作為氮氣環境氣體。然後，設為來自氣體供給裝置24、124之氣體的供給及來自流量調整閥28、128之氣體的流出都無之狀態。在此狀態，將熱處理時之第2空間11b的溫度(目標溫度)設為1000℃，並將第3空間111b的溫度(目標溫度)設為300℃，藉控制器80控制第2加熱器21b之輸出及通過冷卻管140與氣冷套142、144之空氣的流量與溫度。結果，第2、第3空間11b、111b之任一空間之環境氣體的溫度都可調整至目標溫度。此外，第2、第3空間11b、111b之環境氣體的溫度係都採用在空間內之中心所測量之溫度。 In the heat treatment furnace 110 of the second embodiment, the ambient gas in the second and third spaces 11b and 111b is used as the nitrogen ambient gas by the gas supply devices 24 and 124. Then, it is assumed that neither the supply of gas from the gas supply devices 24 or 124 nor the outflow of the gas from the flow control valves 28 and 128 is present. In this state, the temperature (target temperature) of the second space 11b during heat treatment is set to 1000 ° C, and the temperature (target temperature) of the third space 111b is set to 300 ° C, and the second heater 21b is controlled by the controller 80 Output and the flow rate and temperature of the air passing through the cooling pipe 140 and the air cooling jackets 142 and 144. As a result, the temperature of the ambient gas in any of the second and third spaces 11b and 111b can be adjusted to the target temperature. In addition, the temperature of the ambient gas in the second and third spaces 11b and 111b is the temperature measured at the center of the space.

根據上述，認為在第1實施例藉由將間隙高度H設為25mm以上且35mm以下，並將搬運方向長度L設為間隙高度H之3倍以上，可使第1、第2空間11a、11b之溫差變成比第1比較例更大500℃。 Based on the above, it is considered that in the first embodiment, the first and second spaces 11a, 11b can be made by setting the gap height H to be 25 mm or more and 35 mm or less, and setting the transport direction length L to be three times or more the gap height H. The temperature difference was 500 ° C larger than that of the first comparative example.

又，認為在第2實施例，亦藉由將間隙高度H設為25mm以上且35mm以下，並將搬運方向長度L設為間隙高度H之3倍以上，可使第2、第3空間11b、111b之溫差變成700℃。 Further, in the second embodiment, it is considered that by setting the gap height H to be 25 mm or more and 35 mm or less and setting the length L in the conveying direction to three times or more the gap height H, the second, third spaces 11b, The temperature difference of 111b becomes 700 ° C.

在第1實施例之熱處理爐10，在將熱處理時之第1空間11a的溫度調整至700℃，並將第2空間11b之溫度調 整至1200℃的狀態，將已載置被處理物96之承載板95從開口14搬運至開口15。在此時，測量了通過搬運通路11c時之搬運速度及被處理物96的升溫速度。具體而言，承載板95係採用Si鍵結SiC製之承載板，並使用前後長度(搬運方向長度)為250mm、左右長度為250mm、厚度為4mm者。承載板95係作為在常溫之物性值，彎曲強度為250MPa、楊氏係數為350GPa、熱膨脹係數為4.5ppm/K、導熱率為150W/mK。被處理物96係採用在烘烤後成為陶瓷電容器之晶片者，並載置於承載板95之上面的中央。又，將偵測承載板95之非接觸感測器配置於在爐體10a內之中從間壁部30在搬運方向上游相距100mm的位置、與從間壁部30在搬運方向下游相距150mm的位置。然後，搬運承載板95，並測量在上游側之感測器偵測到承載板95時(=在承載板95之下游端來到從間壁部30在搬運方向上游相距100mm的位置時)、與在下游側之感測器偵測到承載板95時(=在承載板95之下游端來到從間壁部30在搬運方向下游相距150mm的位置時)的兩點之被處理物96的溫度及時刻。從在該兩點之被處理物96的溫差及時間差，算出被處理物96的升溫速度。在改變可變速搬運輥20c之搬運速度後，算出這種升溫速度，並進行複數次。在100mm/min~600mm/min之範圍改變可變速搬運輥20c之搬運速度後，測量升溫速度複數次時，被處理物96之升溫速度係在167℃/min~1000℃/min之範圍變化。又，所搬運之承載板95係在任一量側都使用相同者，都未發生裂開等。 In the heat treatment furnace 10 of the first embodiment, the temperature of the first space 11a during the heat treatment was adjusted to 700 ° C, and the temperature of the second space 11b was adjusted. After the temperature is adjusted to 1200 ° C., the carrier plate 95 on which the object to be processed 96 is placed is carried from the opening 14 to the opening 15. At this time, the conveyance speed when passing through the conveyance path 11c and the temperature rise rate of the to-be-processed object 96 were measured. Specifically, the carrier plate 95 is a carrier plate made of Si-bonded SiC, and a front-to-back length (conveying direction length) of 250 mm, a left-to-right length of 250 mm, and a thickness of 4 mm are used. The carrier plate 95 is a physical property value at normal temperature, a bending strength of 250 MPa, a Young's coefficient of 350 GPa, a thermal expansion coefficient of 4.5 ppm / K, and a thermal conductivity of 150 W / mK. The object to be processed 96 is a wafer which becomes a ceramic capacitor after baking, and is placed on the center of the upper surface of the carrier plate 95. In addition, a non-contact sensor for detecting the carrier plate 95 is disposed in the furnace body 10a at a position 100 mm upstream from the partition wall portion 30 in the conveyance direction upstream and 150 mm from the partition wall portion 30 downstream in the conveyance direction. position. Then, carry the carrier plate 95, and measure when the sensor on the upstream side detects the carrier plate 95 (= when the downstream end of the carrier plate 95 comes to a position 100 mm away from the partition 30 in the transport direction upstream), When the carrier plate 95 is detected by the sensor on the downstream side (= when the downstream end of the carrier plate 95 arrives at a position 150 mm downstream from the partition 30 in the conveying direction), the object 96 is at two points. Temperature and time. The temperature increase rate of the to-be-processed object 96 is calculated from the temperature difference and time difference of the to-be-processed object 96 at these two points. After changing the conveyance speed of the variable speed conveyance roller 20c, this temperature increase speed is calculated, and it is performed several times. After changing the conveying speed of the variable-speed conveying roller 20c in a range of 100 mm / min to 600 mm / min, when measuring the temperature increase rate several times, the temperature increase rate of the object to be processed 96 changes within a range of 167 ° C / min to 1000 ° C / min. In addition, the carrier plate 95 to be transported is the same one on any quantity side, and no cracking or the like occurs.

本發明係將於2013年8月26日所申請之日本專 利申請第2013-174887號與於2013年11月5日所申請之日本專利申請第2013-229630號作為優先權主張的基礎，藉由引用，其內容之全部包含於本專利說明書。 This invention is a Japanese patent filed on August 26, 2013. Application No. 2013-174887 and Japanese Patent Application No. 2013-229630 filed on November 5, 2013 serve as a basis for claiming priority, and the entire contents of which are incorporated herein by reference.

【工業上的可應用性】 [Industrial applicability]

本發明係可利用於對成為陶瓷電容器之晶片的積層體烘烤之處理等之對被處理物進行熱處理的熱處理爐。 The present invention is a heat treatment furnace that can be used for heat-treating an object to be processed, such as baking a laminated body of a ceramic capacitor wafer.

Claims (12)

一種熱處理爐，對被處理物進行熱處理，其包括：爐體，係具有：第1空間；第2空間；及間壁，係形成搬運通路，而且將該第1空間與該第2空間隔開，而該搬運通路係使該第1空間與該第2空間連通並搬運該被處理物之通路，鉛垂方向之間隙高度H係25mm以上且35mm以下；溫度調整手段，係使該第1空間之環境氣體與該第2空間之環境氣體的溫度相異；及搬運手段，係按照該第1空間內、該搬運通路及該第2空間內之順序搬運該被處理物。A heat-treating furnace for heat-treating an object to be processed includes a furnace body including: a first space; a second space; and a partition wall forming a conveying path, and separating the first space from the second space. And the conveying path is a path that communicates the first space with the second space and conveys the object to be processed, and the vertical gap height H is 25 mm or more and 35 mm or less; the temperature adjusting means is the first space The temperature of the ambient gas is different from the temperature of the ambient gas in the second space; and the transport means is to transport the object to be processed in the order of the first space, the transport path, and the second space. 如申請專利範圍第1項之熱處理爐，其中該搬運通路之搬運方向長度L係間隙高度H的3倍以上。For example, the heat treatment furnace of the first patent application range, wherein the transport direction length L of the transport path is more than 3 times the gap height H. 如申請專利範圍第1或2項之熱處理爐，其中該搬運手段係具有：第1搬運手段，係在該第1空間內搬運該被處理物；第2搬運手段，係在該第2空間內搬運該被處理物；及可變速搬運手段，係使該第1搬運手段所搬運之該被處理物在既定搬運方向通過該搬運通路內並搬運至該第2搬運手段，並可在比該第1搬運手段及該第2搬運手段更高速之可變速區域內變更該搬運速度。For example, the heat treatment furnace of the first or second scope of the patent application, wherein the conveying means includes: a first conveying means for conveying the object to be processed in the first space; and a second conveying means for the second space. Conveying the object to be processed; and a variable-speed conveying means that causes the object to be conveyed by the first conveying means to pass through the conveying path in the predetermined conveying direction and to the second conveying means, The first conveyance means and the second conveyance means change the conveyance speed in a higher-speed variable speed region. 如申請專利範圍第1或2項之熱處理爐，其中該搬運手段係具有複數個搬運輥，該搬運輥係在該搬運通路內在係搬運方向之水平方向搬運該被處理物；該間壁係具有：上部間壁，係位於該搬運通路之鉛垂上側；及下部間壁，係位於該搬運通路之鉛垂下側；該下部間壁之一個以上的上端部在該搬運方向位於該複數個該搬運輥之間，而且在鉛垂方向位於與該複數個該搬運輥之下端相同或比其更上面的位置。For example, the heat treatment furnace of the first or second patent application range, wherein the conveying means has a plurality of conveying rollers, and the conveying rollers convey the object to be processed in the horizontal direction of the conveying direction in the conveying path; the partition wall has : The upper partition wall is located on the vertical upper side of the conveying path; and the lower partition wall is located on the vertical lower side of the conveying path; one or more upper ends of the lower partition wall are located in the plurality of the conveying directions in the conveying direction; It is located between the rollers in the vertical direction at the same position as or lower than the lower end of the plurality of conveyance rollers. 如申請專利範圍第4項之熱處理爐，其中該下部間壁係具備1個以上之具有該上端部的凸狀部，該凸狀部係作成朝向該上端部愈往鉛垂上側該搬運方向的寬度愈窄的形狀。For example, the heat treatment furnace for the fourth scope of the patent application, wherein the lower partition wall is provided with more than one convex portion having the upper end portion, and the convex portion is formed toward the upper end portion toward the vertical upper side in the conveying direction. A narrower shape. 一種熱處理方法，係在具備爐體之熱處理爐之該被處理物的熱處理方法，該爐體係具有：第1空間；第2空間；及間壁，係形成搬運通路，而且將該第1空間與該第2空間隔開，而該搬運通路係使該第1空間與該第2空間連通並搬運該被處理物之通路，鉛垂方向之間隙高度H係25mm以上且35mm以下；該熱處理方法包含：搬運步驟，係在使該第1空間之環境氣體與該第2空間之環境氣體的溫度相異之狀態，按照該第1空間內、該搬運通路及該第2空間內之順序搬運該被處理物。A heat treatment method is a heat treatment method for the object to be treated in a heat treatment furnace provided with a furnace body. The furnace system includes: a first space; a second space; and a partition wall forming a conveying path, and the first space and the The second space is separated, and the conveying path is a path that communicates the first space with the second space and conveys the object to be processed. The vertical gap height H is 25 mm or more and 35 mm or less. The heat treatment method includes : The transporting step is to transport the quilt in the order of the first space, the transport path, and the second space in a state where the temperature of the ambient gas in the first space and the temperature of the ambient gas in the second space are different. Treatment. 如申請專利範圍第6項之熱處理方法，其中該搬運通路之搬運方向長度L係間隙高度H的3倍以上。For example, the heat treatment method of the sixth aspect of the patent application, wherein the length L of the conveying path in the conveying direction is more than three times the height H of the gap. 如申請專利範圍第6或7項之熱處理方法，其中該熱處理爐係包括：第1搬運手段，係在該第1空間內搬運該被處理物；第2搬運手段，係在該第2空間內搬運該被處理物；及可變速搬運手段，係使該第1搬運手段所搬運之該被處理物在既定搬運方向通過該搬運通路內並搬運至該第2搬運手段，並可在比該第1搬運手段及該第2搬運手段更高速之可變速區域內變更該搬運速度；在該步驟，在使該第1空間之環境氣體與該第2空間之環境氣體的溫度相異之狀態，藉該可變速搬運手段使藉該第1搬運手段在該第1空間內所搬運之該被處理物以該可變速區域內之既定速度通過該搬運通路內並搬運至該第2搬運手段。For example, the heat treatment method of the 6th or 7th in the scope of patent application, wherein the heat treatment furnace includes: a first conveying means for conveying the object to be processed in the first space; and a second conveying means for the second space. Conveying the object to be processed; and a variable-speed conveying means that causes the object to be conveyed by the first conveying means to pass through the conveying path in the predetermined conveying direction and to the second conveying means, 1 conveying means and the second conveying means change the conveying speed in a higher-speed variable-speed area; in this step, in a state where the temperature of the ambient gas in the first space and the temperature of the ambient gas in the second space are different, The variable speed conveyance means allows the object to be conveyed in the first space by the first conveyance means to pass through the conveyance path at a predetermined speed in the variable speed area and convey to the second conveyance means. 如申請專利範圍第8項之熱處理方法，其中該可變速區域係以可至少在150℃/min~1000℃/min之範圍變更通過該搬運通路時之該被處理物的溫度變化速度的方式所決定的區域；在該步驟，該被處理物係在被載置於承載板之狀態被搬運；該承載板係分別作為在常溫的物性值，彎曲強度為100MPa~250MPa、楊氏係數為200GPa~350GPa、熱膨脹係數為4ppm/K~5ppm/K、導熱率為50W/mK~200W/mK。For example, the heat treatment method of the eighth aspect of the patent application, wherein the variable speed region is such that the temperature change rate of the object to be processed when passing through the conveying path can be changed at least in the range of 150 ° C / min to 1000 ° C / min. The determined area; at this step, the object to be treated is transported in a state of being placed on a carrier plate; the carrier plate is used as a physical property value at normal temperature, the bending strength is 100MPa ~ 250MPa, and the Young's coefficient is 200GPa ~ 350GPa, thermal expansion coefficient is 4ppm / K ~ 5ppm / K, thermal conductivity is 50W / mK ~ 200W / mK. 如申請專利範圍第9項之熱處理方法，其中該承載板係由Si鍵結SiC或再結晶SiC所構成。For example, the heat treatment method according to item 9 of the application, wherein the carrier plate is composed of Si-bonded SiC or recrystallized SiC. 如申請專利範圍第6或7項之熱處理方法，其中該搬運手段係具有複數個搬運輥，該搬運輥係在該搬運通路內在係搬運方向之水平方向搬運該被處理物；該間壁係具有：上部間壁，係位於該搬運通路之鉛垂上側；及下部間壁，係位於該搬運通路之鉛垂下側；該下部間壁之一個以上的上端部在該搬運方向位於該複數個該搬運輥之間，而且在鉛垂方向位於與該複數個該搬運輥之下端相同或比其更上面的位置。For example, the heat treatment method of item 6 or 7 of the patent application scope, wherein the conveying means has a plurality of conveying rollers, and the conveying rollers convey the object to be processed in the horizontal direction of the conveying direction in the conveying path; the partition wall has : The upper partition wall is located on the vertical upper side of the conveying path; and the lower partition wall is located on the vertical lower side of the conveying path; one or more upper ends of the lower partition wall are located in the plurality of the conveying directions in the conveying direction; It is located between the rollers in the vertical direction at the same position as or lower than the lower end of the plurality of conveyance rollers. 如申請專利範圍第11項之熱處理方法，其中該下部間壁係具備1個以上之具有該上端部的凸狀部，該凸狀部係作成朝向該上端部愈往鉛垂上側該搬運方向的寬度愈窄的形狀。For example, the heat treatment method according to the scope of application for patent No. 11, wherein the lower partition wall is provided with more than one convex portion having the upper end portion, and the convex portion is formed toward the upper end portion toward the vertical upper side in the conveying direction. A narrower shape.
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