TWI636264B - Non-contact substrate inspection device and inspection method - Google Patents
Non-contact substrate inspection device and inspection method Download PDFInfo
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- TWI636264B TWI636264B TW106118090A TW106118090A TWI636264B TW I636264 B TWI636264 B TW I636264B TW 106118090 A TW106118090 A TW 106118090A TW 106118090 A TW106118090 A TW 106118090A TW I636264 B TWI636264 B TW I636264B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/304—Contactless testing of printed or hybrid circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
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- General Engineering & Computer Science (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
本發明係一種非接觸型基板檢查裝置及其檢查方法，其具備將皆以非接觸方式配置於具有分歧部位之配線圖案之基準感測器及信號感測器之檢測信號放大之增益調整部，且生成藉由差動放大器將增益被調整後之各檢測信號之差放大之判定用信號，並以預定之基準值除以判定用信號而求得變化率，將上述變化率與預先設定之臨限值進行比較，而進行不良判定。 The present invention relates to a non-contact substrate inspection device and an inspection method thereof, which include a gain adjustment section that amplifies detection signals of a reference sensor and a signal sensor that are all arranged in a non-contact manner on a wiring pattern having a divergent part A determination signal is generated by amplifying the difference between the detection signals whose gains have been adjusted by a differential amplifier, and the predetermined reference value is divided by the determination signal to obtain a change rate. The change rate is compared with a preset setting. The limit values are compared to make a bad judgment.
Description
本發明係關於一種非接觸式地對具有分歧部位之配線圖案進行不良檢查之非接觸型基板檢查裝置。 The present invention relates to a non-contact type substrate inspection device that performs non-contact inspection of a wiring pattern having a branched portion in a non-contact manner.
習知，已知一種檢查裝置，其對於形成在基板上之複數個配線圖案，以非接觸方式即、與配線圖案鄰近且電容耦合，施加及檢測交流之檢查信號，以檢查該配線圖案之斷線或絕緣不良。例如，於專利文獻1：日本專利特開2000-019213號公報中揭示有一種檢查裝置，其使探針接觸於設置在被檢查基板之複數條配線之一端，一面選擇性地切換作為檢查對象之配線圖案，一面施加具有正弦波或脈波狀之波形之檢查信號，且以配置於另一端之上方且電容耦合之感測器，檢測所傳遞之檢查信號而作為檢測信號，然後根據此檢測信號之大小，進行斷線檢查及絕緣檢查。 Conventionally, there is known an inspection device that applies and detects an AC inspection signal to a plurality of wiring patterns formed on a substrate in a non-contact manner, that is, adjacent to and is capacitively coupled to the wiring patterns to check the breakage of the wiring patterns. Poor wiring or insulation. For example, Patent Document 1: Japanese Patent Laid-Open No. 2000-019213 discloses an inspection device that allows a probe to contact one end of a plurality of wirings provided on a substrate to be inspected, and selectively switches the inspection object as an inspection target. Wiring pattern, with a sine wave or pulse wave-shaped inspection signal applied on one side, and a capacitively coupled sensor placed above the other end to detect the transmitted inspection signal as a detection signal, and then based on this detection signal Size, perform disconnection inspection and insulation inspection.
上述專利文獻1：日本專利特開2000-019213號公報揭示之檢查裝置，係以在橫斷基板上之複數個配線圖案之方向與之鄰接之方式，設置有桿狀之感測電極。藉由電容耦合檢測由探針施加且傳遞於檢查對象之配線圖案之檢查信號，而作為檢測信號。於作為檢查對象之配線圖案為無分歧部位之獨立配線(獨立網)之情況下，可於作為檢查對象之配線之兩端分別配置作為供電電極之探針、及作為受電電極之感測電極，且根據是否有傳遞檢查信號來判 定不良。 The inspection device disclosed in the aforementioned Patent Document 1: Japanese Patent Laid-Open No. 2000-019213 is provided with a rod-shaped sensing electrode so as to be adjacent to a direction in which a plurality of wiring patterns traverse a substrate. The detection signal applied by the probe and transmitted to the wiring pattern of the inspection object is detected by capacitive coupling as a detection signal. In the case where the wiring pattern to be inspected is an independent wiring (independent network) without a divergent portion, a probe as a power supply electrode and a sensing electrode as a power receiving electrode may be arranged at both ends of the wiring as an inspection object, And based on whether there is a transmission check signal 定 itis bad.
與此相對，於具有被分歧為複數個之分歧部位之配線圖案(分歧網)中，即使於分歧後之複數個中的一個配線圖案處於因斷線不良等而造成檢查信號之不傳遞之狀態，由於分歧後之其他配線圖案仍會傳遞檢查信號，因而被檢測之檢查信號與良品之信號位準的差少，不能進行正確之不良判定。 On the other hand, in a wiring pattern (branching network) having a plurality of branched portions, even if one of the plurality of wiring patterns after the branching is in a state where the inspection signal is not transmitted due to a broken wire or the like Since the other wiring patterns after the divergence will still pass the inspection signal, the difference between the detected inspection signal and the signal level of the good product is small, and a correct bad judgment cannot be made.
因此，本發明之目的在於提供一種非接觸型基板檢查裝置及其檢查方法，其對於作為檢查對象之具有分歧部位之配線圖案，除了配置藉由電容耦合而檢測檢測信號之信號感測器外，還配置電容耦合於分歧後之位置之至少一個基準感測器，且比較各自之檢測信號而進行不良判定。 Therefore, an object of the present invention is to provide a non-contact type substrate inspection device and an inspection method thereof. For a wiring pattern having a divergent portion as an inspection object, in addition to a signal sensor configured to detect a detection signal by capacitive coupling, At least one reference sensor that is capacitively coupled to the branched position is also configured, and the respective detection signals are compared to perform a bad determination.
根據本發明之實施形態之非接觸型基板檢查裝置，其具備有：電源供給部，其對形成於基板上且於途中具有至少一個分歧部位之配線圖案，供給交流或脈波之檢查信號；基準感測器，其鄰近上述配線圖案之分歧後之附近之上方，且以非接觸方式電容耦合；信號感測器，其於上述配線圖案之上述分歧後，鄰近上述配線圖案之端部附近之上方，且以非接觸方式電容耦合；檢測信號處理部，其保持上述基準感測器自供給有上述檢查信號之上述配線圖案檢測出之第1檢測信號、及上述信號感測器自上述配線圖案檢測出之第2檢測信號之各自之峰值，統一定在相同時刻，取得上述第1檢測信號與上述第2檢測信號之差，將該差放大而作為判定信號加以輸出；及缺陷判定部，其以預定之基準值除上述判定用信號而求得變化率，將上述變化率與預先設定之臨限值進行比較，而進行不 良判定。 A non-contact substrate inspection apparatus according to an embodiment of the present invention includes a power supply unit that supplies an inspection signal of an alternating current or a pulse to a wiring pattern formed on a substrate and having at least one branched portion in the middle; a reference A sensor, which is adjacent to and above the vicinity of the divergence of the wiring pattern, and is capacitively coupled in a non-contact manner; a signal sensor, which is adjacent to the vicinity of an end of the wiring pattern after the divergence of the wiring pattern And is capacitively coupled in a non-contact manner; the detection signal processing unit holds a first detection signal detected by the reference sensor from the wiring pattern supplied with the inspection signal, and the signal sensor detects from the wiring pattern The respective peaks of the second detection signals are uniformly determined at the same time, the difference between the first detection signal and the second detection signal is obtained, and the difference is amplified and output as a determination signal; and the defect determination unit, which uses Divide the determination signal by a predetermined reference value to obtain a rate of change, and compare the rate of change with a preset threshold Compare without proceeding Good judgment.
此外，根據本發明之實施形態之基板檢查方法，係使用皆以非接觸方式配置於形成在基板上且於途中具有至少一個分歧部位之配線圖案之基準感測器及信號感測器，藉由電容耦合進行斷線不良檢查者，該基板檢查方法係包含下述：以對正常之配線圖案輸出上述基準感測器及上述信號感測器之輸出為相同峰值之檢測信號之方式，調整增益，自以非接觸方式配置於上述分歧部位之分歧後之附近的配線圖案上方之基準感測器，檢測第1檢測信號，自以非接觸方式配置於上述分歧後之配線圖案之端部附近之上方的信號感測器，檢測第2檢測信號，保持上述第1檢測信號及上述第2檢測信號之各自之峰值，於相同時刻輸出上述峰值，對各上述峰值進行差運算，且將運算出之電壓差放大而生成判定用信號，以預定之基準值除上述判定用信號而求得變化率，將上述變化率與預先設定之臨限值進行比較，而進行不良判定。 In addition, according to the substrate inspection method of the embodiment of the present invention, a reference sensor and a signal sensor are used which are arranged in a non-contact manner on a wiring pattern formed on a substrate and have at least one branched portion in the middle. Those who perform capacitive disconnection inspection for a broken wire, the substrate inspection method includes the following: adjusting the gain by outputting a detection signal with the same peak output from the reference sensor and the signal sensor to a normal wiring pattern, The reference sensor is arranged above the wiring pattern in the vicinity of the branched portion in a non-contact manner above the branch pattern to detect the first detection signal, and is arranged in a non-contact manner above the end of the wiring pattern after the branching in the branched region. The signal sensor detects the second detection signal, maintains the respective peak values of the first detection signal and the second detection signal, outputs the peak values at the same time, performs a difference operation on each of the peak values, and calculates the calculated voltage. Amplify the difference to generate a judgment signal, divide the judgment signal by a predetermined reference value to obtain a change rate, and change the change. The rate is compared with a pre-set threshold, and a bad judgment is made.
1‧‧‧檢查裝置 1‧‧‧Inspection device
2‧‧‧基準感測器 2‧‧‧ reference sensor
3‧‧‧信號感測器 3‧‧‧Signal Sensor
4‧‧‧檢測信號處理部 4‧‧‧ Detection Signal Processing Department
5‧‧‧缺陷判定部 5‧‧‧Defect determination department
6‧‧‧控制部 6‧‧‧Control Department
7‧‧‧運算處理部(CPU) 7‧‧‧ Operation Processing Unit (CPU)
8‧‧‧電源部 8‧‧‧Power Supply Department
9‧‧‧檢查信號供給部 9‧‧‧ Inspection signal supply department
11、12‧‧‧檢測信號 11, 12‧‧‧ detection signal
13‧‧‧顯示部 13‧‧‧Display
14‧‧‧探針 14‧‧‧ Probe
15‧‧‧斷線部位 15‧‧‧ disconnection
20‧‧‧檢測信號處理部 20‧‧‧ Detection Signal Processing Department
21‧‧‧峰值保持電路 21‧‧‧Peak hold circuit
22‧‧‧差動放大器 22‧‧‧ Differential Amplifier
23‧‧‧A/D轉換部 23‧‧‧A / D Conversion Department
24、24a‧‧‧檢測信號 24, 24a‧‧‧ Detection signal
25‧‧‧增益調整部 25‧‧‧Gain adjustment section
26、27‧‧‧判定用信號 26, 27‧‧‧ Judgment signals
30‧‧‧差動放大器增益設定部 30‧‧‧ Differential amplifier gain setting section
31、32‧‧‧增益可變放大器(VGA) 31, 32‧‧‧Gain Variable Amplifier (VGA)
100‧‧‧基板 100‧‧‧ substrate
101、104‧‧‧配線圖案(獨立網) 101, 104‧‧‧wiring pattern (independent network)
102、103‧‧‧配線圖案(分歧網) 102, 103‧‧‧wiring pattern (divergent network)
102a、103a‧‧‧分歧部位 102a, 103a ‧‧‧ divergent parts
105‧‧‧配線圖案(電路圖案) 105‧‧‧wiring pattern (circuit pattern)
P11‧‧‧峰值 P11‧‧‧peak
P12‧‧‧峰值 P12‧‧‧peak
Vdiff‧‧‧輸出信號 Vdiff‧‧‧ output signal
VR1、VR2‧‧‧可變電阻(數位電位計) VR1, VR2‧‧‧ Variable resistor (digital potentiometer)
Vsig‧‧‧檢測信號 Vsig‧‧‧ detection signal
圖1為顯示本發明之非接觸型基板檢查裝置之概念性構成之圖。 FIG. 1 is a diagram showing a conceptual configuration of a non-contact type substrate inspection apparatus of the present invention.
圖2為顯示第1實施形態之檢測信號處理部之構成例之圖。 Fig. 2 is a diagram showing a configuration example of a detection signal processing unit according to the first embodiment.
圖3為顯示藉由感測器自正常之配線圖案檢測之輸出電壓與配線圖案之關係之圖。 FIG. 3 is a graph showing a relationship between an output voltage and a wiring pattern detected from a normal wiring pattern by a sensor.
圖4為顯示藉由感測器自具有斷線不良之配線圖案檢測之輸出電壓與配線圖案之關係之圖。 FIG. 4 is a graph showing a relationship between an output voltage and a wiring pattern detected by a sensor from a wiring pattern having a bad disconnection.
圖5為概念性顯示不良判定之步驟之流程圖。 FIG. 5 is a flowchart showing the steps of conceptually determining a bad decision.
圖6為顯示第2實施形態之非接觸型基板檢查裝置之檢測信號處理部之構成例之圖。 FIG. 6 is a diagram showing a configuration example of a detection signal processing section of a non-contact type substrate inspection apparatus according to a second embodiment.
圖7為顯示圖6所示之增益調整部之具體構成例之圖。 FIG. 7 is a diagram showing a specific configuration example of the gain adjustment section shown in FIG. 6.
圖8為顯示自藉由增益調整部調整增益後之感測器輸出之信號位準之圖。 FIG. 8 is a diagram showing a signal level of a sensor output after a gain is adjusted by a gain adjustment section.
圖9A為顯示搭載有檢測信號處理部之情況之差動放大器之輸出之圖。 FIG. 9A is a diagram showing an output of a differential amplifier in a case where a detection signal processing section is mounted.
圖9B為顯示未搭載檢測信號處理部之情況之差動放大器之輸出之圖。 FIG. 9B is a diagram showing an output of a differential amplifier in a case where a detection signal processing section is not installed.
圖10為用以對實施非接觸檢查之調整進行說明之流程圖。 FIG. 10 is a flowchart for explaining adjustment for performing non-contact inspection.
圖11為用以對非接觸檢查之作業順序進行說明之流程圖。 FIG. 11 is a flowchart for explaining the operation sequence of the non-contact inspection.
以下，參照圖式，對本發明之實施形態進行詳細說明。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
圖1為顯示本發明之非接觸型基板檢查裝置之概念性構成之圖。此非接觸型基板檢查裝置1(以下，稱為檢查裝置)，可應用於作為檢查對象之基板(被檢查工件)但不限於印刷電路配線基板，例如可應用於可撓性基板、多層配線基板、液晶封裝基板等之各種之電性配線之檢查。於以下之說明中，將其等統稱為「基板」。此外，如圖1所示，形成於該等基板100上之配線圖案，係混合形成有於途中具有分歧部位且自一條配線分歧為複數條配線之配線圖案(作為分歧網)102、103、及無分歧部位之配線圖案(作為獨立網)101、104之配線圖案105。於圖1中，作為配線圖案，例示了4分歧之分歧網102及2分歧之分歧網103，但分歧數並無限定。 FIG. 1 is a diagram showing a conceptual configuration of a non-contact type substrate inspection apparatus of the present invention. This non-contact type substrate inspection apparatus 1 (hereinafter, referred to as an inspection apparatus) can be applied to a substrate (inspected workpiece) to be inspected, but is not limited to a printed circuit wiring substrate. For example, it can be applied to a flexible substrate or a multilayer wiring substrate. Inspection of various electrical wiring such as liquid crystal packaging substrates. In the following description, these are collectively referred to as "substrates". In addition, as shown in FIG. 1, the wiring patterns formed on the substrates 100 are mixed to form wiring patterns (as branch networks) 102, 103, which have branched portions on the way and branch from a plurality of wirings to one another Wiring patterns 105 (as independent networks) 101 and 104 without branching portions. In FIG. 1, as the wiring pattern, the four-divided branch network 102 and the two-divided branch network 103 are illustrated, but the number of branches is not limited.
檢查裝置1具備：感測器部，其由基準感測器2及信號感測器3構成；檢測信號處理部4，其根據基準感測器2及信號感測器3檢測之檢測信號11、12，生成判定用信號26(27)；運算處理部(CPU)7，其具備進行良或不良判定之缺陷判定部5及控制裝置整體之控制部6；顯示部13，其顯示與檢查相關之操作資訊或判定結果；電源部8，其生成檢查信號；及檢查信號供給部9，其選擇性地對檢查對象之配線圖案施加檢查信號。再者，雖未圖示，運算處理部7係搭載有記憶體，該記憶體係記憶用以進行判定之程式、基準值及設定值(增益等)。除此之外，為了輸入及設定各種之資訊，還具備鍵盤或觸控面板等之輸入裝置。 The inspection device 1 includes a sensor section including a reference sensor 2 and a signal sensor 3, and a detection signal processing section 4 based on a detection signal 11 detected by the reference sensor 2 and the signal sensor 3. 12, generating a judgment signal 26 (27); an arithmetic processing unit (CPU) 7, which includes a defect judgment unit 5 for performing a good or bad judgment and a control unit 6 for the entire control device; and a display unit 13 which displays information related to the inspection Operation information or determination result; the power supply unit 8 that generates an inspection signal; and the inspection signal supply unit 9 that selectively applies an inspection signal to a wiring pattern of an inspection object. In addition, although not shown, the arithmetic processing unit 7 is equipped with a memory, and the memory system stores a program, a reference value, and a set value (gain, etc.) used for determination. In addition, in order to input and set various information, input devices such as a keyboard or a touch panel are also provided.
基準感測器2及信號感測器3，係以相同之規格、即使用相同之金屬材料、且以相同之電極面積形成為相同之桿狀，且具有相同之特性。藉此，基準感測器2及信號感測器3，只要以相同間隔(電極間距離)與作為對向電極之配線圖案對向，即可取得相同峰值之檢測信號。如圖1所示，基準感測器2，係以於基板100上之分歧網102、103之一端側且鄰近自分歧部位102a、103a分歧後之配線圖案上方而與之電容耦合之方式配置。此外，信號感測器3，係以鄰近分歧網102、103之另一端側之配線圖案上方而與之電容耦合之方式配置。 The reference sensor 2 and the signal sensor 3 are formed in the same rod shape with the same specifications, that is, using the same metal material, and the same electrode area, and have the same characteristics. Thereby, as long as the reference sensor 2 and the signal sensor 3 are opposed to the wiring pattern as the counter electrode at the same interval (distance between the electrodes), detection signals with the same peak value can be obtained. As shown in FIG. 1, the reference sensor 2 is configured to be capacitively coupled to one end of the branching networks 102 and 103 on the substrate 100 and adjacent to the wiring pattern branched from the branching portions 102 a and 103 a. In addition, the signal sensor 3 is arranged so as to be capacitively coupled to the wiring pattern adjacent to the other end side of the branch networks 102 and 103.
電源部8係生成例如在20KHz~1MHz左右之頻帶內之交流波、或脈波之檢查信號。本發明中，由於藉由電容耦合進行信號之檢測，因此不使用直流之檢查信號。檢查信號供給部9，係具有多個探針14，且於全部或可檢查之範圍內，使各個探針14之前端接觸於各配線圖案，而進行電性連接。藉由根據控制部6之指 示之設置於檢查信號供給部9內之開關機構，選擇性地對檢查對象施加檢查信號。 The power supply unit 8 generates an inspection signal of an AC wave or a pulse wave in a frequency band of about 20 KHz to 1 MHz, for example. In the present invention, since the detection of signals is performed by capacitive coupling, no DC inspection signal is used. The inspection signal supply unit 9 is provided with a plurality of probes 14, and the front ends of the probes 14 are in contact with the wiring patterns to be electrically connected within the entirety or the inspectable range. By following the instructions of the control section 6 The switching mechanism shown in the inspection signal supply section 9 selectively applies an inspection signal to an inspection object.
其次，對第1實施形態進行說明。 Next, a first embodiment will be described.
圖2顯示第1實施形態之檢測信號處理部4之詳細構成例。此檢測信號處理部4，係由峰值保持電路21、差動放大器22、及A/D轉換部23構成。 FIG. 2 shows a detailed configuration example of the detection signal processing section 4 of the first embodiment. The detection signal processing section 4 is composed of a peak hold circuit 21, a differential amplifier 22, and an A / D conversion section 23.
峰值保持電路21，係公知之電路構成，用以保持自基準感測器2輸出之交流波形之檢測信號11及自信號感測器3輸出之交流波形的檢測信號12之既定期間內之峰值。差動放大器22，係進行求取基準感測器2及信號感測器3分別輸出之檢測信號之差(電壓差)之差運算，且將算出之差放大，而作為檢測信號24加以輸出。這點只要為相同之檢測信號，就不會有差值，因此差動放大器輸出0(V)之檢測信號。A/D轉換部23，係將差動放大器22輸出之類比波形之檢測信號24轉換為數位信號之公知電路。 The peak hold circuit 21 is a well-known circuit structure for holding the peak value of the AC signal detection signal 11 output from the reference sensor 2 and the AC signal detection signal 12 output from the signal sensor 3 within a predetermined period. The differential amplifier 22 performs a difference operation to obtain a difference (voltage difference) between the detection signals respectively output by the reference sensor 2 and the signal sensor 3, amplifies the calculated difference, and outputs it as a detection signal 24. As long as this is the same detection signal, there will be no difference, so the differential amplifier outputs a detection signal of 0 (V). The A / D conversion section 23 is a known circuit that converts the analog waveform detection signal 24 output by the differential amplifier 22 into a digital signal.
圖9A顯示搭載有檢測信號處理部4之情況之差動放大器22之輸出、圖9B顯示未搭載之情況之差動放大器22之輸出之特性。差動放大器之輸出值(1)，係藉由設定之增益而決定。 FIG. 9A shows the characteristics of the output of the differential amplifier 22 when the detection signal processing unit 4 is mounted, and FIG. 9B shows the characteristics of the output of the differential amplifier 22 when the detection signal processing unit 4 is not mounted. The output value (1) of the differential amplifier is determined by the set gain.
差動放大器之輸出值={(基準感測器之檢測值)-(信號感測器之檢測值)}×差動放大器之增益 (1) Output value of differential amplifier = ((detection value of reference sensor)-(detection value of signal sensor)) × gain of differential amplifier (1)
若將基準感測器2及信號感測器3分別輸出之檢測信號11、12直接輸入差動放大器22，則時常會將信號之時間(相位)成分之差放大而作為檢測信號加以輸出。因此，若於本來一致之峰值之時刻產生有偏移，則會將此差量放大，因而會輸出與所希望之結果不同之檢測信號24。因此，例如，可設置峰值保持電路，求得 生成去除時間成分之檢測信號之情況。 If the detection signals 11 and 12 respectively output by the reference sensor 2 and the signal sensor 3 are directly input to the differential amplifier 22, the difference in time (phase) components of the signals is often amplified and output as detection signals. Therefore, if there is an offset at the time when the peaks are originally consistent, the difference will be amplified, and a detection signal 24 different from the desired result will be output. Therefore, for example, a peak hold circuit can be provided to obtain A case where a detection signal with time components removed is generated.
具體而言，如圖9A所示，於對配線圖案施加有脈波之檢查信號之情況下，藉由接通或截止等之作用，於基準感測器2之檢測信號11產生正負之峰值P11、及於信號感測器3之檢測信號產生正負之峰值P12。 Specifically, as shown in FIG. 9A, when a pulse wave inspection signal is applied to the wiring pattern, a positive or negative peak value P11 is generated at the detection signal 11 of the reference sensor 2 by the effect of turning on or off, etc. , And the detection signal from the signal sensor 3 generates a positive and negative peak value P12.
於正常之配線圖案之情況下，峰值P11及峰值P12，雖成為大致相同之值，但會有在檢測之時刻產生些微之時間差之情況。由於差動放大器22會將因該時間差而產生之信號差放大，因而輸出波形變成具有正負之峰值之不穩定之波形。 In the case of a normal wiring pattern, although the peak value P11 and the peak value P12 are approximately the same value, a slight time difference may occur at the time of detection. Since the differential amplifier 22 amplifies the signal difference caused by the time difference, the output waveform becomes an unstable waveform with positive and negative peaks.
與此相對，如圖9B所示，於搭載有峰值保持電路21之情況下，僅分別自基準感測器2及信號感測器3輸出之檢測信號之正的峰值P11、P12被保持。因此，於輸入信號之上昇時，雖於時間差部分會產生差動放大器22之輸出，但以後則成為相同之峰值，因此差動放大器22之輸出變成0(V)，從而可去除時間成分。若將穩定在此0(V)之期間作為資料取得期間T而取得檢測結果，則可聯繫至正確之判定。 In contrast, as shown in FIG. 9B, when the peak hold circuit 21 is mounted, only the positive peaks P11 and P12 of the detection signals output from the reference sensor 2 and the signal sensor 3, respectively, are held. Therefore, when the input signal rises, although the output of the differential amplifier 22 will be generated in the time difference portion, it will become the same peak later, so the output of the differential amplifier 22 becomes 0 (V), so that the time component can be removed. If the detection result is obtained by using the period stabilized at 0 (V) as the data acquisition period T, the correct determination can be linked.
進行判定之缺陷判定部5，係對變化率與預定之臨限值進行比較，判定配線圖案之良或不良。具體而言，首先將使用調整用配線圖案、或良品之配線圖案而檢測之檢測值，設定作為基準值。接著，以上述基準值除自檢測信號處理部4輸出之判定用信號26，求得變化率[變化率=測定值/基準值]。然後，將此變化率與預先設定之臨限值進行比較，且根據判定基準(變化率>臨限值)，判定配線圖案之良或不良。 The defect determination unit 5 that performs the determination compares the change rate with a predetermined threshold value and determines whether the wiring pattern is good or bad. Specifically, a detection value detected using an adjustment wiring pattern or a good-quality wiring pattern is first set as a reference value. Next, the determination signal 26 output from the detection signal processing unit 4 is divided by the reference value to obtain a change rate [change rate = measured value / reference value]. Then, this change rate is compared with a preset threshold value, and a good or bad wiring pattern is determined according to a determination criterion (change rate> threshold value).
此外，臨限值係根據設定之基準值，設定有將基準值 作為中心而具有上限位準與下限位準之寬度之判定寬度。由於取得之檢測信號為微小之信號，因此於來自外部之雜訊重疊、或對於基準感測器2及信號感測器3之與配線圖案之距離上具有差異之情況下，產生有誤差。臨限值係將此上下限設定為將誤差考慮在內之值。 In addition, the threshold value is set based on the set reference value. As the center, there is a determination width having a width of an upper limit level and a lower limit level. Since the obtained detection signal is a small signal, there is an error when the noise from the outside overlaps or there is a difference in the distance between the reference sensor 2 and the signal sensor 3 and the wiring pattern. The threshold value is set to a value that takes the error into account.
參照圖5所示之流程圖，對本實施形態之配線圖案之良或不良判定進行說明。 Referring to the flowchart shown in FIG. 5, the determination of the good or bad of the wiring pattern in this embodiment will be described.
首先，與作為檢查對象之電路圖案105電容耦合之基準感測器2及信號感測器3，自流動於配線圖案105之交流或脈波之檢查信號，檢測其檢測信號。該等檢測信號被傳送至檢測信號處理部4。然後，以上述基準值除自檢測信號處理部4輸出之判定用信號26(測定值)，求得變化率(步驟S1)。 First, the reference sensor 2 and the signal sensor 3 that are capacitively coupled to the circuit pattern 105 as an inspection target detect the detection signal from an inspection signal of an AC or pulse wave flowing through the wiring pattern 105. These detection signals are transmitted to the detection signal processing section 4. Then, the determination signal 26 (measured value) output from the detection signal processing unit 4 is divided by the reference value to obtain a change rate (step S1).
對於作為檢查對象之配線圖案，比較此變化率與臨限值(變化率>臨限值)(步驟S2)，若變化率小於等於臨限值(No)，則此配線圖案被判定為良品(步驟S3)。 For the wiring pattern to be inspected, the change rate is compared with a threshold value (change rate> threshold value) (step S2). If the change rate is less than or equal to the threshold value (No), the wiring pattern is judged to be good ( Step S3).
運算處理部7內之缺陷判定部5，於圖1所示之配線圖案105正常之情況下，如圖3所示，基準感測器2及信號感測器3，輸出相同之峰值且時間上一致之檢測信號11、12。因差動放大器22在該等之檢測信號11、12上並無電壓差，因此輸出0V(檢測信號24)。因此，上述之變化率為0，且成為預定之臨限值以下，從而被判定為良品。 The defect determination unit 5 in the arithmetic processing unit 7 is in a normal state when the wiring pattern 105 shown in FIG. 1 is normal. As shown in FIG. 3, the reference sensor 2 and the signal sensor 3 output the same peak value and time. Consistent detection signals 11,12. Since the differential amplifier 22 has no voltage difference among the detection signals 11 and 12, it outputs 0V (detection signal 24). Therefore, the above-mentioned change rate is 0, and it is less than a predetermined threshold, and it is judged as a good product.
另一方面，若檢測信號24不是0V，且變化率大於臨限值(Yes)，則判斷為包含斷線等之不良品(步驟S4)。例如，於配線圖案105且分歧網102中的一個配線圖案具有斷線部位15之情況下，如圖4所示，基準感測器2之檢測信號減少，且產生有差電壓。 由於差動放大器22將此電壓差放大後輸出，因此，相對於自獨立網101、104及其他之分歧網103檢測之檢測信號之值為0V，而自分歧網102取得之檢測信號，具有某電壓值。因此，以基準值除此檢測信號而得之變化率，不會成為0。若此變化率超過臨限值，則判定為不良。該等之判定結果，被顯示於顯示部13(步驟S5)。 On the other hand, if the detection signal 24 is not 0V and the change rate is larger than the threshold value (Yes), it is determined that defective products such as disconnection are included (step S4). For example, when the wiring pattern 105 and one wiring pattern in the branch network 102 has a disconnection portion 15, as shown in FIG. 4, the detection signal of the reference sensor 2 decreases and a differential voltage is generated. Since the differential amplifier 22 amplifies this voltage difference and outputs it, the value of the detection signal detected from the independent networks 101, 104 and other branch networks 103 is 0V, and the detection signal obtained from the branch network 102 has a certain Voltage value. Therefore, the change rate obtained by dividing the detection signal by the reference value does not become zero. If this rate of change exceeds a threshold value, it is judged as bad. These determination results are displayed on the display unit 13 (step S5).
再者，於自基準感測器2及信號感測器3取得檢測信號時，為了防止配線間之雜散電容混入檢查信號，較佳為，檢查對象以外之獨立網或分歧網係連接於接地電位。 Furthermore, when detecting signals are obtained from the reference sensor 2 and the signal sensor 3, in order to prevent stray capacitance between wirings from being mixed into the inspection signal, it is preferable that an independent network or a branch network other than the inspection object is connected to the ground Potential.
本實施形態，若檢查對象之配線圖案正常，因無基準感測器2及信號感測器3之間之輸出差，因而自差動放大器22輸出0之檢測信號24，且求得之變化率也為0，因此可判定為正常。另一方面，若於檢查對象之配線圖案具有斷線部位，則基準感測器2及信號感測器3之間之輸出差增大，差動放大器22將此差量放大，而作為檢測信號輸出，且求得不是0之變化率，只要此變化率超過預先設定之臨限值，即可判定為不良。 In this embodiment, if the wiring pattern of the inspection object is normal, because there is no output difference between the reference sensor 2 and the signal sensor 3, a detection signal 24 of 0 is output from the differential amplifier 22, and the obtained change rate Since it is also 0, it can be judged as normal. On the other hand, if there is a disconnection part in the wiring pattern of the inspection object, the output difference between the reference sensor 2 and the signal sensor 3 increases, and the differential amplifier 22 amplifies the difference as a detection signal The output is obtained and a change rate other than 0 is obtained. As long as the change rate exceeds a predetermined threshold value, it can be judged as defective.
根據本實施形態，由於差動放大器22僅將被檢測出之2個檢測信號之電壓差放大，因而即使較大地設定增益，輸出仍不會飽和，即使藉由非接觸感測器輸出之檢測信號之差小，仍可進行不良檢測。 According to this embodiment, since the differential amplifier 22 only amplifies the voltage difference between the two detected signals, even if the gain is set to a large value, the output will not be saturated, even if the detection signal is output by a non-contact sensor. The difference is small, and bad detection can still be performed.
此外，由於使用差動放大器22，因此藉由差運算之同相除去功能，可於基準感測器2及信號感測器3，消去共同重疊之外來雜訊。此外，由於具備峰值保持電路，因此可同步取得基準感測器2及信號感測器3之輸出，且具有抗雜訊量，減輕因外來之雜訊引起之檢測誤差，提高取得之檢測信號之精度。 In addition, since the differential amplifier 22 is used, by the in-phase removal function of the difference operation, noise can be eliminated from the reference sensor 2 and the signal sensor 3 except for common overlap. In addition, because it has a peak hold circuit, it can simultaneously obtain the output of the reference sensor 2 and the signal sensor 3, and has anti-noise volume, reduce detection errors caused by external noise, and improve the detection signal obtained. Precision.
其次，參照圖1及圖6，對第2實施形態進行說明。 Next, a second embodiment will be described with reference to Figs. 1 and 6.
本實施形態，係於檢查裝置1之檢測信號處理部，具備調整差動放大器之增益之增益調整部及差動放大器增益設定部之構成。本實施形態中，除了檢測信號處理部外之構成，係與上述第1實施形態之構成相同，且賦予相同之參照符號，省略詳細之說明。 This embodiment is configured by a detection signal processing unit of the inspection device 1 and includes a gain adjustment unit and a differential amplifier gain setting unit that adjust the gain of the differential amplifier. In this embodiment, the configuration other than the detection signal processing unit is the same as the configuration of the first embodiment described above, and the same reference numerals are assigned, and detailed descriptions are omitted.
圖6所示之檢測信號處理部20，係由增益調整部25、峰值保持電路21、差動放大器22、差動放大器增益設定部30、及A/D轉換部23構成。 The detection signal processing section 20 shown in FIG. 6 includes a gain adjustment section 25, a peak hold circuit 21, a differential amplifier 22, a differential amplifier gain setting section 30, and an A / D conversion section 23.
增益調整部25，係由設置於每個感測器之增益調整用放大器構成。本實施形態之增益調整用放大器，例如使用2個增益可變放大器(VGA)31、32，進行基準感測器2及信號感測器3之輸出調整。該等增益可變放大器31、32，可獲得與設置在運算放大器之輸出端側之可變電阻(數位電位計)VR1、VR2之值成比例之增益。增益可變放大器31、32，係以分別成為相同輸出之方式調整基準感測器2及信號感測器3檢測出之檢測信號11、12，以使差動放大器22之輸出成為最小。 The gain adjustment unit 25 is configured by a gain adjustment amplifier provided in each sensor. The gain adjustment amplifier of this embodiment uses, for example, two gain variable amplifiers (VGA) 31 and 32 to adjust the output of the reference sensor 2 and the signal sensor 3. The gain variable amplifiers 31 and 32 can obtain a gain proportional to the values of the variable resistors (digital potentiometers) VR1 and VR2 provided on the output side of the operational amplifier. The gain variable amplifiers 31 and 32 adjust the detection signals 11 and 12 detected by the reference sensor 2 and the signal sensor 3 so as to have the same output, so that the output of the differential amplifier 22 is minimized.
藉由該等之增益可變放大器31、32將基準感測器2及信號感測器3輸出之檢測信號放大，因在外觀上，可使得基準感測器2及信號感測器3之感度上昇，而進一步提高差動放大器22之增益，因此，結果等同於檢測感度上昇。此時，差動放大器增益設定部30，藉由控制部6，以使差動放大器22之增益與來自增益可變放大器31、32之輸出值相吻合之方式，而被切換設定。 The gain detection amplifiers 31 and 32 amplify the detection signals output from the reference sensor 2 and the signal sensor 3, because in appearance, the sensitivity of the reference sensor 2 and the signal sensor 3 can be made. And the gain of the differential amplifier 22 is further increased, so that the result is equivalent to an increase in detection sensitivity. At this time, the differential amplifier gain setting unit 30 is switched and set by the control unit 6 so that the gain of the differential amplifier 22 matches the output values from the variable gain amplifiers 31 and 32.
峰值保持電路21，係藉由運算處理部(控制部)7之控 制且於相同時刻，將自增益調整部25輸出之檢測信號11、12，保持峰值而輸出至差動放大器22。 The peak hold circuit 21 is controlled by an arithmetic processing section (control section) 7 At the same time, the detection signals 11 and 12 output from the gain adjustment unit 25 are output to the differential amplifier 22 while maintaining the peak value.
如圖8所示，於無斷線等之缺陷之配線圖案之情況下，自各感測器輸出之檢測信號11、12，雖然原本具有大致相同之峰值，但亦有因雜訊或感測器與配線圖案之距離等原因而變成不同之峰值之檢測信號11、12之情況。例如，於檢測信號12被較低地輸出，且在與檢測信號11之間產生有電壓差之情況下，自差動放大器22輸出之增益調整前之輸出，係如檢測信號24a而具有某電壓值。然而，藉由進行上述增益調整，將檢測信號12放大，且放大至與檢測信號11相同之峰值。若將此調整後之檢測信號11、12輸入差動放大器22，則輸出有大致0(V)之檢測信號24。 As shown in FIG. 8, in the case of a wiring pattern having no defects such as disconnection, the detection signals 11 and 12 output from each sensor have approximately the same peak value, but there are also noise or sensors. The detection signals 11 and 12 having different peaks due to the distance from the wiring pattern. For example, when the detection signal 12 is output low and a voltage difference is generated between the detection signal 11 and the output before the gain adjustment from the differential amplifier 22, the output has a voltage such as the detection signal 24a. value. However, by performing the gain adjustment described above, the detection signal 12 is amplified and amplified to the same peak value as the detection signal 11. If the adjusted detection signals 11 and 12 are input to the differential amplifier 22, a detection signal 24 of approximately 0 (V) is output.
其次，參照圖1、圖8、圖9A及圖9B，對檢查前進行之增益調整進行說明。 Next, the gain adjustment performed before the inspection will be described with reference to FIGS. 1, 8, 9A, and 9B.
首先，自探針14朝用於設定之調整用配線圖案或正常之配線圖案105施加包含交流信號或脈波之檢查信號(步驟S11)。 First, an inspection signal including an AC signal or a pulse wave is applied from the probe 14 to the adjustment wiring pattern for setting or the normal wiring pattern 105 (step S11).
其次，自網絡101將藉由信號感測器3檢測出之檢測信號Vsig輸入增益可變放大器32。增益可變放大器32，以可變電阻VR2調整增益(步驟S12)，判定被放大之檢測信號Vsig是否在預定之基準值之範圍內(步驟S13)。再者，基準值之範圍，係指基準值±基準值範圍<臨限值，且於基準值之外側具有臨限值。藉由此判定，若在基準電壓之範圍內(Yes)，則與調整後之網絡101建立關聯，將設定之增益及輸出電壓記憶於設置在運算處理部7內之記憶體(步驟S14)。 Next, from the network 101, the detection signal Vsig detected by the signal sensor 3 is input to the variable gain amplifier 32. The gain variable amplifier 32 adjusts the gain with the variable resistor VR2 (step S12), and determines whether the amplified detection signal Vsig is within a predetermined reference value range (step S13). Moreover, the range of the reference value means the reference value ± the range of the reference value <the threshold value, and has a threshold value outside the reference value. Based on this determination, if it is within the range of the reference voltage (Yes), it is associated with the adjusted network 101, and the set gain and output voltage are stored in the memory provided in the arithmetic processing unit 7 (step S14).
接著，自探針14朝用於設定之調整用配線圖案或正 常之配線圖案105施加包含交流信號或脈波之檢查信號(步驟S15)。然後自網絡101將藉由基準感測器2檢測之檢測信號輸入增益可變放大器31。增益可變放大器31，以差動放大器22之輸出信號(Vdiff)之值變成最少之方式調整可變電阻VR1，而使增益可變動(步驟S16)。然後藉由此調整來判定差動放大器22之輸出信號(Vdiff)之值是否成為最少(步驟S17)。藉由此調整，若輸出電壓(Vdiff)為最少值(Yes)，則與調整之網絡101建立關聯，將設定之增益與輸出電壓(Vdiff)之最少值記憶於設置在運算處理部7內之記憶體(步驟S18)。 Next, from the probe 14 toward the adjustment wiring pattern or The normal wiring pattern 105 applies an inspection signal including an AC signal or a pulse wave (step S15). Then, the detection signal detected by the reference sensor 2 is input from the network 101 to the variable gain amplifier 31. The variable gain amplifier 31 adjusts the variable resistor VR1 so that the value of the output signal (Vdiff) of the differential amplifier 22 becomes the smallest, so that the gain can be changed (step S16). Then, it is determined whether the value of the output signal (Vdiff) of the differential amplifier 22 is minimized by this adjustment (step S17). With this adjustment, if the output voltage (Vdiff) is the minimum value (Yes), it is associated with the adjusted network 101, and the minimum value of the set gain and the output voltage (Vdiff) is stored in the set in the arithmetic processing section 7. Memory (step S18).
對全部之網絡101~104進行此一連串之增益調整之動作，待全部之網絡結束之後(步驟S19)，結束調整操作。 This series of gain adjustment operations are performed on all the networks 101 to 104. After all the networks are finished (step S19), the adjustment operation is ended.
其次，參照圖11所示之流程圖，對被增益調整後之檢查裝置1之基板檢查進行說明。 Next, the substrate inspection of the inspection device 1 after gain adjustment will be described with reference to the flowchart shown in FIG. 11.
於檢查裝置1安裝作為檢查對象之基板100，且如上述，配置探針14、基準感測器2及信號感測器3。接著，自記憶體讀出在調整時設定之增益，且設定增益可變放大器32之增益(步驟S21)，及設定增益可變放大器31之增益(步驟S22)。 A substrate 100 to be inspected is mounted on the inspection device 1, and the probe 14, the reference sensor 2, and the signal sensor 3 are arranged as described above. Then, the gain set during the adjustment is read from the memory, and the gain of the variable gain amplifier 32 is set (step S21), and the gain of the variable gain amplifier 31 is set (step S22).
於該等之設定之後，自探針14朝作為檢查對象之配線圖案105施加交流信號或脈波之檢查信號(步驟S23)。以後，與上述圖5所示之作業順序相同，與電路圖案電容耦合之基準感測器2及信號感測器3，自配線圖案檢測檢測信號11、12。該等之檢測信號11、12，被送出至檢測信號處理部20。 After these settings, an inspection signal of an AC signal or a pulse wave is applied from the probe 14 to the wiring pattern 105 as an inspection target (step S23). Thereafter, the reference sensor 2 and the signal sensor 3 capacitively coupled to the circuit pattern are the same as the operation sequence shown in FIG. 5 described above, and the detection signals 11 and 12 are detected from the wiring pattern. These detection signals 11 and 12 are sent to a detection signal processing unit 20.
於檢測信號處理部20中，在藉由上述被調整增益之增益可變放大器31、32進行放大之後，通過峰值保持電路21，將 時間被統一之、各檢測信號11、12之峰值輸入差動放大器22。差動放大器22將檢測信號11與檢測信號12之差放大後，輸出檢測信號24。類比信號之檢測信號(Vdiff)24，藉由A/D轉換部23而被數位化處理，且作為判定用信號26輸出至運算處理部7。此外，自峰值保持電路21輸出之檢測信號Vsig，係與輸入差動放大器22之信號分歧，而直接藉由A/D轉換部23被數位化處理，且作為判定用信號27輸出至運算處理部7。此判定用信號27，於形成有未被分歧之獨立網之基板檢查中，即使不使用基準感測器2，仍可僅使用信號感測器3來進行檢查，因而被並排設置。於實際之產品檢查中，可配合檢查之配線圖案，切換使用該等之判定用信號26及判定用信號27。 In the detection signal processing unit 20, after the gain is adjusted by the gain variable amplifiers 31 and 32 whose gain is adjusted, the peak hold circuit 21 is used to The time is unified, and the peaks of the detection signals 11 and 12 are input to the differential amplifier 22. The differential amplifier 22 amplifies the difference between the detection signal 11 and the detection signal 12 and outputs a detection signal 24. The detection signal (Vdiff) 24 of the analog signal is digitized by the A / D conversion section 23 and is output to the arithmetic processing section 7 as a determination signal 26. In addition, the detection signal Vsig output from the peak hold circuit 21 differs from the signal input to the differential amplifier 22, is directly digitized by the A / D conversion section 23, and is output to the arithmetic processing section as a determination signal 27. 7. This determination signal 27 is arranged side by side in the inspection of a substrate on which an independent network that is not divided is formed. Even if the reference sensor 2 is not used, only the signal sensor 3 can be used for inspection. In the actual product inspection, the judgment signal 26 and the judgment signal 27 can be switched and used according to the wiring pattern of the inspection.
其次，於運算處理部7中，以上述基準值除自檢測信號處理部20輸出之判定用信號26，求得變化率(步驟S24)。然後對作為檢查對象之配線圖案，比較此變化率與臨限值(變化率>臨限值)(步驟S25)。藉由此判定，若變化率為小於等於臨限值(No)，則此配線圖案被判定為良品(步驟S26)。另一方面，若檢測信號24不是0V，且變化率大於臨限值(Yes)，則判斷為包含有斷線等之不良品(步驟S27)。 Next, in the arithmetic processing unit 7, the determination signal 26 output from the detection signal processing unit 20 is divided by the reference value to obtain a change rate (step S24). Then, for the wiring pattern to be inspected, the change rate is compared with a threshold value (change rate> threshold value) (step S25). Based on this determination, if the rate of change is less than or equal to the threshold value (No), the wiring pattern is determined to be a good product (step S26). On the other hand, if the detection signal 24 is not 0V and the change rate is greater than the threshold value (Yes), it is determined that defective products such as disconnection are included (step S27).
對每一網路依序進行此檢測及判定，且反復地進行至所有之網絡之檢查結束為止(步驟S28)，於對所有網路之判定結束之後，結束檢查。 This detection and determination is sequentially performed for each network, and is repeatedly performed until the inspection of all the networks is completed (step S28), and the inspection is terminated after the judgment of all the networks is completed.
根據本實施形態，可以於差動放大器22設置增益設定而可調整感度之方式構成。藉由設置峰值保持電路之檢波電路，可去除信號之時間(相位)成分。設置於差動放大器22之輸入側之增 益調整部，係與先前之檢測信號相同，因此可利用習知方法而使用於斷線或短路之判定。 According to this embodiment, a configuration can be adopted in which the gain setting is set in the differential amplifier 22 and the sensitivity can be adjusted. By using a detection circuit with a peak hold circuit, the time (phase) component of the signal can be removed. Increased on the input side of the differential amplifier 22 The benefit adjustment section is the same as the previous detection signal, so it can be used to determine the disconnection or short circuit using conventional methods.
並且，根據本實施形態，即使對於在途中具有將配線圖案分歧為複數個之分歧部位之分歧網路，也可對分歧之各個配線圖案，進行斷線檢查。 In addition, according to this embodiment, even for a branch network having a branched portion where a wiring pattern is branched into a plurality of branched portions, a disconnection check can be performed on each branched wiring pattern.
並且，第1、第2實施形態，具有以下之作用功效。 In addition, the first and second embodiments have the following effects.
將基準感測器及信號感測器之2個感測器配置於被檢查對象之分歧後之配線圖案之上方，以差動放大器檢測其等之感測器輸出之差。若被檢查對象之配線正常，由於無感測器間之輸出差，因此不會自差動放大器輸出，若於被檢查對象之配線具有斷線，由於感測器間之輸出差變大，因此會自差動放大器輸出。 The two sensors of the reference sensor and the signal sensor are arranged above the wiring pattern after the object to be inspected is divided, and a difference amplifier is used to detect the difference between the outputs of the sensors. If the wiring of the inspected object is normal, it will not output from the differential amplifier because there is no output difference between the sensors. If there is a disconnection in the wiring of the inspected object, the output difference between the sensors will increase, so Will output from the differential amplifier.
為了進行感測器輸出之放大及調整，藉由於感測器後段設置放大器，以增大差動放大器之增益，因此即使感測器間之輸出差小，仍可進行不良檢測。此外，由於使用差動放大器，因此可利用其同相除去功能，消去被重疊於感測器之檢測信號之外來雜訊，並且，由於可同步取得2個感測器之輸出，因此具有抗雜訊量，且可減輕因雜訊而引起之測定誤差，因而可提高測定精度。 In order to amplify and adjust the output of the sensor, by setting an amplifier at the back of the sensor to increase the gain of the differential amplifier, even if the output difference between the sensors is small, defective detection can still be performed. In addition, because of the use of a differential amplifier, it can use its in-phase removal function to eliminate noise that is superimposed on the detection signal of the sensor, and because it can simultaneously obtain the output of the two sensors, it has anti-noise. It can reduce the measurement error caused by noise, so it can improve the measurement accuracy.
再者，於上述第1、第2實施形態中，對使用一個基準感測器，用於鄰近圖1所示之一個分歧部位而配置之配線圖案之例子進行了說明，但藉由具備複數個基準感測器，即使於一個配線圖案存在有2個以上之分歧部位之情況，仍可應對。此外，雖然為將基準感測器配置於分歧後之配線圖案上方之例子，但在配線圖案中，由於自探針14接觸之位置至分歧部位102a、103a前之配線圖案之不良，變成基準感測器2之檢測信號為0(V)之輸出，因此可進 行不良檢測。 Furthermore, in the first and second embodiments described above, an example in which a reference sensor is used and a wiring pattern is arranged adjacent to a branched portion shown in FIG. 1 has been described. The reference sensor can cope with the case where there are two or more divergent parts in one wiring pattern. In addition, although the reference sensor is arranged above the branched wiring pattern, in the wiring pattern, the defective wiring pattern from the position where the probe 14 contacts to the branched areas 102a and 103a becomes the reference sense. The detection signal of detector 2 is 0 (V) output, so Perform bad detection.
根據本發明，可提供一種非接觸型基板檢查裝置及其檢查方法，其對於作為檢查對象之具有分歧部位之配線圖案，除了配置藉由電容耦合而檢測檢測信號之信號感測器外，還配置電容耦合於分歧後之位置之至少一個基準感測器，且比較各自之檢測信號而進行不良判定。 According to the present invention, it is possible to provide a non-contact type substrate inspection device and an inspection method thereof. For a wiring pattern having a divergent portion as an inspection object, in addition to a signal sensor configured to detect a detection signal by capacitive coupling, it is also provided. At least one reference sensor is capacitively coupled to the branched positions, and the respective detection signals are compared to perform a bad determination.
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| TW200613754A (en) * | 2004-08-27 | 2006-05-01 | Oht Inc | Inspection apparatus, inspection method and sensor for inspection apparatus |
| TW200632339A (en) * | 2005-01-19 | 2006-09-16 | Oht Inc | Inspection device, inspection method, and sensor for inspection device |
| TW201435373A (en) * | 2013-01-08 | 2014-09-16 | Oht Inc | Circuit pattern inspection apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107449990A (en) | 2017-12-08 |
| TW201805641A (en) | 2018-02-16 |
| JP2017215257A (en) | 2017-12-07 |
| JP6202452B1 (en) | 2017-09-27 |
| KR101926978B1 (en) | 2018-12-07 |
| KR20170136450A (en) | 2017-12-11 |
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