TWI628673B - Anisotropic conductive film, connection method, and connection structure - Google Patents

Anisotropic conductive film, connection method, and connection structure Download PDF

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TWI628673B
TWI628673B TW101112898A TW101112898A TWI628673B TW I628673 B TWI628673 B TW I628673B TW 101112898 A TW101112898 A TW 101112898A TW 101112898 A TW101112898 A TW 101112898A TW I628673 B TWI628673 B TW I628673B
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layer
electronic component
curing agent
conductive film
anisotropic conductive
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TW201308358A (en
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淺羽康祐
松島隆行
佐藤大祐
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日商迪睿合股份有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Abstract

本發明係提供一種異向性導電膜，其於低溫下且以良好之接著力將含有具極性基之化合物的可撓性印刷基板與鹼玻璃基板加以連接。將形成有端子(10)之第1電子零件(11)、與形成有端子(12)之第2電子零件(13)電性連接的異向性導電膜(21)具有：含有自由基系硬化劑、丙烯酸系樹脂、環氧樹脂及導電性粒子(20)之含導電性粒子層(22)、及含有陽離子系硬化劑、環氧樹脂、丙烯酸系樹脂及自由基系硬化劑之絕緣性接著層(23)。 The present invention provides an anisotropic conductive film which bonds a flexible printed substrate containing a compound having a polar group to an alkali glass substrate at a low temperature and with good adhesion. The first electronic component (11) having the terminal (10) and the anisotropic conductive film (21) electrically connected to the second electronic component (13) on which the terminal (12) is formed have a radical hardening type Insulation of the conductive particle layer (22) containing the agent, the acrylic resin, the epoxy resin, and the conductive particles (20), and the cationic curing agent, the epoxy resin, the acrylic resin, and the radical curing agent Layer (23).

Description

異向性導電膜、連接方法及連接構造體 Anisotropic conductive film, connection method and connection structure

本發明係有關於一種將形成有端子之電子零件連接之異向性導電膜、連接方法及連接構造體。本申請案係以2011年4月12日在日本提出申請之日本專利申請案編號日本專利特願2011-088457為基礎且主張其優先權者，並且將該申請案以參照之方式引用於本申請案中。 The present invention relates to an anisotropic conductive film, a connection method, and a connection structure for connecting electronic components in which terminals are formed. The present application is based on Japanese Patent Application No. 2011-088457, filed on Jan. In the case.

先前以來，作為連接電子零件之方法，例如一直使用將分散有導電性粒子之熱硬化性樹脂塗佈於剝離膜上所成之帶狀連接材料。作為此種連接材料之一例，可列舉異向性導電膜(ACF，Anisotropic Conductive Film)。異向性導電膜除了用於例如將可撓性印刷基板(FPC：Flexible Printed Circuits)與形成於LCD面板之玻璃基板上的ITO電極連接之情形以外，亦用於將各種端子彼此接著並且電性連接之情形(例如參照專利文獻1)。 Conventionally, as a method of connecting electronic components, for example, a strip-shaped connecting material obtained by applying a thermosetting resin in which conductive particles are dispersed to a release film has been used. An example of such a connecting material is an anisotropic conductive film (ACF). The anisotropic conductive film is used for, for example, connecting a flexible printed circuit board (FPC) to an ITO electrode formed on a glass substrate of the LCD panel, and is also used to connect various terminals to each other and to be electrically In the case of connection (for example, refer to Patent Document 1).

於觸模面板用途之ITO玻璃、金屬玻璃、ITO膜、銀膏膜等中，會因高溫壓接而異向性導電膜產生應變等從而導致產生故障。因此，謀求一種可於更低之溫度下進行壓接之異向性導電膜，且謀求確保接著強度。 In the ITO glass, the metal glass, the ITO film, the silver paste film, or the like used for the touch panel, strain is generated by the anisotropic conductive film due to high-temperature pressure bonding, and a failure occurs. Therefore, an anisotropic conductive film which can be pressure-bonded at a lower temperature is sought, and the adhesion strength is secured.

另外，作為構成可撓性印刷基板之構件之一，有表面保護膜(覆蓋層(cover lay))。該表面保護膜係發揮賦予可撓性印刷基板電氣絕緣性、表面保護、耐折射性等作用。專利文獻2中，記載有藉由以具極性基之樹脂組成物形成 表面保護膜，而使表面保護膜之機械特性良好。 Further, as one of the members constituting the flexible printed circuit board, there is a surface protective film (cover lay). The surface protective film functions to impart electrical insulation, surface protection, and refractive index resistance to the flexible printed circuit board. Patent Document 2 describes that a resin composition having a polar group is formed. The surface protective film gives the surface protective film good mechanical properties.

然而，含有具極性基(例如醌基(quinone group)等)之化合物的可撓性印刷基板，極性基會捕捉自由基。因此，當使用含有自由基系(丙烯酸系)樹脂之異向性導電膜進行此種含有具極性基之化合物的可撓性印刷基板側之連接時，會產生硬化不良。又，於基板使用鹼玻璃基板之情形時，若使用含有陽離子系樹脂之異向性導電膜進行鹼玻璃基板側之連接，則會產生硬化不良。 However, in a flexible printed substrate containing a compound having a polar group (for example, a quinone group), a polar group captures a radical. Therefore, when the connection to the flexible printed circuit board side containing the polar group-containing compound is carried out using an anisotropic conductive film containing a radical-based (acrylic) resin, a curing failure occurs. In the case where an alkali glass substrate is used as the substrate, when an anisotropic conductive film containing a cationic resin is used for the connection on the alkali glass substrate side, a curing failure occurs.

[專利文獻1]日本特開2010-123418號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-123418

[專利文獻2]日本特開2004-2592號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2004-2592

因此，本發明係鑒於如上所述之先前之實際情況而提出者，本發明之目的尤其在於提供一種可於低溫下且以良好之接著力將含有具極性基之化合物的可撓性印刷基板與鹼玻璃基板連接之異向性導電膜、連接方法及連接構造體。 Accordingly, the present invention has been made in view of the foregoing actual circumstances as described above, and it is an object of the present invention to provide a flexible printed substrate which can contain a compound having a polar group at a low temperature and with good adhesion. An anisotropic conductive film to which an alkali glass substrate is connected, a connection method, and a connection structure.

本發明之異向性導電膜係將形成有端子之第1電子零件、與形成有端子之第2電子零件電性連接，其具有第1層與第2層，該第1層含有自由基系硬化劑、丙烯酸系樹脂及環氧樹脂；該第2層含有陽離子系硬化劑、環氧樹脂、丙烯酸系樹脂及自由基系硬化劑；且第1層或第2層進而含有導電性粒子。 The anisotropic conductive film of the present invention electrically connects the first electronic component in which the terminal is formed and the second electronic component in which the terminal is formed, and has a first layer and a second layer, and the first layer contains a radical system A curing agent, an acrylic resin, and an epoxy resin; the second layer contains a cationic curing agent, an epoxy resin, an acrylic resin, and a radical curing agent; and the first layer or the second layer further contains conductive particles.

本發明之連接方法具有壓接步驟，經由異向性導電膜，將形成有端子之第1電子零件、與形成有端子之第2電子零件一邊加熱一邊壓接而電性連接；異向性導電膜具 有第1層與第2層，該第1層含有自由基系硬化劑、丙烯酸系樹脂及環氧樹脂；該第2層含有陽離子系硬化劑、環氧樹脂、丙烯酸系樹脂及自由基系硬化劑；且第1層或第2層進而含有導電性粒子。 The connection method of the present invention has a pressure bonding step of electrically connecting the first electronic component in which the terminal is formed and the second electronic component in which the terminal is formed while being heated by the anisotropic conductive film; Membrane There are a first layer and a second layer, and the first layer contains a radical curing agent, an acrylic resin, and an epoxy resin; and the second layer contains a cationic curing agent, an epoxy resin, an acrylic resin, and a radical hardening. And the first layer or the second layer further contains conductive particles.

本發明之連接構造體係經由異向性導電膜，藉由將形成有端子之第1電子零件、與形成有端子之第2電子零件一邊加熱一邊壓接而將第1電子零件與第2電子零件電性連接所成者；異向性導電膜具有第1層與第2層，該第1層含有自由基系硬化劑、丙烯酸系樹脂及環氧樹脂；該第2層含有陽離子系硬化劑、環氧樹脂、丙烯酸系樹脂及自由基系硬化劑；且第1層或第2層進而含有導電性粒子。 In the connection structure system of the present invention, the first electronic component and the second electronic component are bonded by heating the first electronic component in which the terminal is formed and the second electronic component in which the terminal is formed, via the anisotropic conductive film. The electrically conductive film has a first layer and a second layer, and the first layer contains a radical curing agent, an acrylic resin, and an epoxy resin; and the second layer contains a cationic curing agent, An epoxy resin, an acrylic resin, and a radical curing agent; and the first layer or the second layer further contains conductive particles.

根據本發明，尤其可於低溫下且以良好之接著力將含有具極性基之化合物的可撓性印刷基板與鹼玻璃基板連接。 According to the present invention, a flexible printed substrate containing a compound having a polar group can be attached to an alkali glass substrate in particular at a low temperature and with good adhesion.

以下，對本發明之具體實施形態(以下稱作「本實施形態」)之一例進行說明。 Hereinafter, an example of a specific embodiment (hereinafter referred to as "this embodiment") of the present invention will be described.

1.連接構造體 Connection structure

1-1.第1電子零件 1-1. The first electronic part

1-2.第2電子零件 1-2. 2nd electronic part

1-3.異向性導電膜 1-3. Anisotropic conductive film

1-3-1.第1層(含導電性粒子層) 1-3-1. Layer 1 (containing conductive particle layer)

1-3-2.第2層(絕緣性接著層) 1-3-2. Layer 2 (insulating adhesive layer)

2.連接方法 2. Connection method

3.其他實施形態 3. Other embodiments

<1.連接構造體> <1. Connection structure>

圖1係表示本實施形態之連接構造體之構成例的剖面圖。如圖1所示般，連接構造體1具有：形成有端子10之第1電子零件11、形成有端子12之第2電子零件13、及含有導電性粒子20之異向性導電膜21。連接構造體1藉由使第1電子零件11中之端子10、異向性導電膜21中之導電性粒子20、及第2電子零件13中之端子12導通，而將第1電子零件11與第2電子零件13電性連接。 Fig. 1 is a cross-sectional view showing a configuration example of a connection structure according to the embodiment. As shown in FIG. 1 , the connection structure 1 includes a first electronic component 11 in which the terminal 10 is formed, a second electronic component 13 in which the terminal 12 is formed, and an anisotropic conductive film 21 including the conductive particles 20 . The connection structure 1 connects the first electronic component 11 with the terminal 10 in the first electronic component 11 , the conductive particles 20 in the anisotropic conductive film 21 , and the terminal 12 in the second electronic component 13 . The second electronic component 13 is electrically connected.

<1-1.第1電子零件> <1-1. 1st electronic part>

第1電子零件11例如為形成有含有具極性基之化合物之膜的可撓性印刷基板等配線材。又，第1電子零件11形成有用以與第2電子零件13連接之端子10。 The first electronic component 11 is, for example, a wiring material such as a flexible printed circuit board on which a film containing a compound having a polar group is formed. Further, the first electronic component 11 forms a terminal 10 for connection to the second electronic component 13.

<1-2.第2電子零件> <1-2. Second electronic part>

第2電子零件13例如為鹼玻璃基板、玻璃製LCD基板(LCD面板)、玻璃製PDP(Plasma Display Panel，電漿顯示器)基板(PDP面板)、玻璃製有機EL(Electro-luminescence，電致發光)基板(有機EL面板)等玻璃基板。第2電子零件13中形成有用以與第1電子零件11連接之端子12。 The second electronic component 13 is, for example, an alkali glass substrate, a glass LCD panel (LCD panel), a glass PDP (Plasma Display Panel) substrate (PDP panel), or an organic EL (Electro-luminescence). A glass substrate such as a substrate (organic EL panel). The terminal 12 for connecting to the first electronic component 11 is formed in the second electronic component 13.

<1-3.異向性導電膜> <1-3. Anisotropic conductive film>

異向性導電膜21具備：於絕緣性樹脂中分散有導電性粒子20之第1層22(以下稱作「含導電性粒子層22」)、及絕緣性樹脂中不含導電性粒子20之第2層23(以下稱作「絕緣性接著層23」)。異向性導電膜21之形狀係形成為膜 狀，因此操作性優異，並且可容易地使連接後之厚度均勻化。 The anisotropic conductive film 21 includes a first layer 22 in which the conductive particles 20 are dispersed in the insulating resin (hereinafter referred to as "the conductive particle-containing layer 22"), and the conductive resin 20 is not contained in the insulating resin. The second layer 23 (hereinafter referred to as "insulating adhesive layer 23"). The shape of the anisotropic conductive film 21 is formed into a film It is excellent in handleability, and the thickness after joining can be easily made uniform.

如圖2所示般，異向性導電膜21例如具有：剝離層(隔離膜)24、形成於剝離層24上之絕緣性接著層23、及形成於絕緣性接著層23上之含導電性粒子層22。 As shown in FIG. 2, the anisotropic conductive film 21 has, for example, a peeling layer (separator) 24, an insulating adhesive layer 23 formed on the peeling layer 24, and electrical conductivity formed on the insulating adhesive layer 23. Particle layer 22.

異向性導電膜21中之含導電性粒子層22含有自由基系硬化劑、丙烯酸系樹脂及環氧樹脂。此種含導電性粒子層22於將第1電子零件11與第2電子零件13壓接時，產生丙烯酸系樹脂與自由基系硬化劑所致之自由基硬化，另外環氧樹脂於自由基系硬化劑之存在下會開環，因此可提高接著力。 The conductive particle-containing layer 22 in the anisotropic conductive film 21 contains a radical-based curing agent, an acrylic resin, and an epoxy resin. When the first electronic component 11 and the second electronic component 13 are pressure-bonded, the conductive particle layer 22 generates radical scavenging by an acrylic resin and a radical curing agent, and the epoxy resin is free radical. In the presence of the hardener, the ring is opened, so the adhesion can be increased.

又，異向性導電膜21中之絕緣性接著層23含有陽離子系硬化劑、環氧樹脂、丙烯酸系樹脂及自由基系硬化劑。此種絕緣性接著層23於將第1電子零件11與第2電子零件13加以壓接時，會產生丙烯酸系樹脂與自由基系硬化劑所致之自由基硬化、及環氧樹脂與陽離子系硬化劑之陽離子硬化，且藉由自由基硬化與陽離子硬化之協同效果，可提高與第1電子零件11之接著力。 Further, the insulating adhesive layer 23 in the anisotropic conductive film 21 contains a cationic curing agent, an epoxy resin, an acrylic resin, and a radical curing agent. When the first electronic component 11 and the second electronic component 13 are pressure-bonded, the insulating adhesive layer 23 generates radical curing by an acrylic resin and a radical curing agent, and an epoxy resin and a cation system. The cation of the hardener is hardened, and the adhesion with the first electronic component 11 can be improved by the synergistic effect of the radical hardening and the cationic hardening.

如此，根據異向性導電膜21，當將第1電子零件11與第2電子零件13壓接時，可藉由含導電性粒子層22及絕緣性接著層23而提高接著力。因此，例如如上述般將會產生硬化不良之含有具極性基之化合物的可撓性印刷基板與鹼玻璃基板壓接之時，可於低溫下且以良好之接著力連接。 As described above, when the first electronic component 11 and the second electronic component 13 are pressure-bonded by the anisotropic conductive film 21, the adhesion force can be improved by the conductive particle layer 22 and the insulating adhesive layer 23. Therefore, for example, when a flexible printed circuit board containing a compound having a polar group which is poor in curing is bonded to an alkali glass substrate as described above, it can be joined at a low temperature and with good adhesion.

又，於異向性導電膜21中，絕緣性接著層23中所含 之自由基系硬化劑與陽離子系硬化劑之質量比([自由基系硬化劑]/[陽離子系硬化劑])較佳為0.5~1.2。藉由將絕緣性接著層23中之自由基系硬化劑與陽離子系硬化劑之質量比設在如此之範圍內，可良好地產生丙烯酸系樹脂與自由基系硬化劑所致之自由基硬化、及環氧樹脂與陽離子系硬化劑所致之陽離子硬化，從而賦予更佳之接著力。 Further, in the anisotropic conductive film 21, the insulating adhesive layer 23 is included The mass ratio of the radical-based curing agent to the cationic curing agent ([radical curing agent] / [cationic curing agent]) is preferably from 0.5 to 1.2. By setting the mass ratio of the radical curing agent to the cationic curing agent in the insulating adhesive layer 23 within such a range, radical curing due to the acrylic resin and the radical curing agent can be favorably produced. And cation hardening by epoxy resin and cationic hardener to give better adhesion.

又，於異向性導電膜21中，較佳為將絕緣性接著層23中所含之自由基系硬化劑之量與陽離子系硬化劑之量之合計定為12~17質量份。 Further, in the anisotropic conductive film 21, the total amount of the radical curing agent contained in the insulating adhesive layer 23 and the amount of the cationic curing agent are preferably 12 to 17 parts by mass.

藉由將絕緣性接著層23中所含之自由基系硬化劑之量與陽離子系硬化劑之量之合計定在如此之範圍內，可較佳地產生丙烯酸系樹脂與自由基系硬化劑所致之自由基硬化、及環氧樹脂與陽離子系硬化劑所致之陽離子硬化，從而賦予更佳之接著力。 By setting the total amount of the radical curing agent contained in the insulating adhesive layer 23 to the total amount of the cationic curing agent in such a range, it is possible to preferably produce an acrylic resin and a radical curing agent. The radical hardening, and the cationic hardening caused by the epoxy resin and the cationic hardener, thereby giving a better adhesion.

異向性導電膜21較佳為於含導電性粒子層22側配置第2電子零件13，於絕緣性接著層23側配置第1電子零件11。藉由以如此之方式配置，可提高自第1電子零件11側進行壓接時導電性粒子20之捕捉率。 The anisotropic conductive film 21 preferably has the second electronic component 13 disposed on the conductive particle layer 22 side and the first electronic component 11 on the insulating adhesive layer 23 side. By arranging in this manner, the capture ratio of the conductive particles 20 when the pressure is applied from the first electronic component 11 side can be improved.

<1-3-1.含導電性粒子層> <1-3-1. Conductive particle layer>

含導電性粒子層22如上述般，含有自由基系硬化劑、丙烯酸系樹脂、環氧樹脂及導電性粒子20。 The conductive particle-containing layer 22 contains a radical-based curing agent, an acrylic resin, an epoxy resin, and conductive particles 20 as described above.

(自由基系硬化劑) (free radical hardener)

自由基系硬化劑並無特別限定，例如可使用有機過氧化物。 The radical curing agent is not particularly limited, and for example, an organic peroxide can be used.

(丙烯酸系樹脂) (acrylic resin)

丙烯酸系樹脂並無特別限定，例如可使用以下丙烯酸系樹脂：丙烯酸甲酯、丙烯酸乙酯、丙烯酸異丙脂、丙烯酸異丁酯、環氧丙烯酸酯、乙二醇二丙烯酸酯、二乙二醇二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、二羥甲基三環癸烷二丙烯酸酯、丁二醇四丙烯酸酯(tetramethylene glycol tetraacrylate)、2-羥基-1,3-二丙烯醯氧基丙烷、2,2-雙[4-(丙烯醯氧基甲氧基)苯基]丙烷、2,2-雙[4-(丙烯醯氧基乙氧基)苯基]丙烷、丙烯酸二環戊烯酯、丙烯酸三環癸酯、異氰尿酸三(丙烯醯氧基乙基)酯、丙烯酸胺基甲酸酯等。丙烯酸系樹脂可單獨使用1種，亦可併用2種以上。 The acrylic resin is not particularly limited, and for example, the following acrylic resins can be used: methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol. Diacrylate, trimethylolpropane triacrylate, dimethylol tricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy-1,3-dipropenyloxy Propane, 2,2-bis[4-(acryloxymethoxy)phenyl]propane, 2,2-bis[4-(acryloxyethoxy)phenyl]propane, dicyclopentyl acrylate Ester ester, tricyclodecyl acrylate, tris(propylene methoxyethyl) isocyanurate, urethane acrylate, and the like. The acrylic resin may be used alone or in combination of two or more.

(環氧樹脂) (epoxy resin)

環氧樹脂並無特別限定，例如可使用雙酚A型環氧樹脂、雙酚F型環氧樹脂、酚醛清漆型環氧樹脂、該等之改質環氧樹脂等熱硬化性環氧樹脂。環氧樹脂可單獨使用1種，亦可併用2種以上。 The epoxy resin is not particularly limited, and for example, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a novolak type epoxy resin, or a thermosetting epoxy resin such as the modified epoxy resin can be used. The epoxy resin may be used alone or in combination of two or more.

(導電性粒子) (conductive particles)

導電性粒子20並無特別限定，可使用公知之導電性粒子。例如可列舉：鎳、鐵、銅、鋁、錫、鉛、鉻、鈷、銀、金等各種金屬或金屬合金粒子、金屬氧化物；於碳、石墨、玻璃、陶瓷、塑膠等之粒子之表面塗佈金屬所得者；及於該等粒子之表面進而塗佈絕緣薄膜所得者等。 The conductive particles 20 are not particularly limited, and known conductive particles can be used. Examples thereof include various metals or metal alloy particles such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, gold, and metal oxides; and surfaces of particles such as carbon, graphite, glass, ceramics, and plastics. Those obtained by coating a metal; and those obtained by further coating an insulating film on the surface of the particles.

<1-3-2.絕緣性接著層> <1-3-2. Insulating adhesive layer>

絕緣性接著層23如上述般含有陽離子系硬化劑、環氧 樹脂、丙烯酸系樹脂及自由基系硬化劑。 The insulating adhesive layer 23 contains a cationic hardener and epoxy as described above. Resin, acrylic resin and free radical curing agent.

(陽離子系硬化劑) (cationic hardener)

作為陽離子系硬化劑，並無特別限定，例如可列舉藉由加熱會活化之潛伏性硬化劑，具體可列舉鋶鹽、鎓鹽等，其中，較佳為使用芳香族鋶鹽。 The cationic curing agent is not particularly limited, and examples thereof include a latent curing agent which is activated by heating, and specific examples thereof include a phosphonium salt and a phosphonium salt. Among them, an aromatic onium salt is preferably used.

(環氧樹脂) (epoxy resin)

作為環氧樹脂，並無特別限定，例如可使用與上述含導電性粒子層22中之環氧樹脂相同者。 The epoxy resin is not particularly limited, and for example, the same as the epoxy resin in the conductive particle-containing layer 22 described above can be used.

(丙烯酸系樹脂) (acrylic resin)

作為丙烯酸系樹脂，並無特別限定，例如可使用與上述含導電性粒子層22中之丙烯酸系樹脂相同者。 The acrylic resin is not particularly limited, and for example, the same as the acrylic resin in the conductive particle-containing layer 22 described above can be used.

(自由基系硬化劑) (free radical hardener)

作為自由基系硬化劑，並無特別限定，可根據目的而適當選擇，例如可使用與上述含導電性粒子層22中之自由基系硬化劑相同者。 The radical curing agent is not particularly limited, and may be appropriately selected depending on the intended purpose. For example, the same as the radical curing agent in the conductive particle-containing layer 22 may be used.

<2.連接方法> <2. Connection method>

對使用圖2所示之異向性導電膜21的連接構造體1之連接方法之一例進行說明。於本實施形態之連接方法中，係經由異向性導電膜21，藉由將第1電子零件11與第2電子零件13一邊加熱一邊壓接而電性連接，而獲得上述之連接構造體1。 An example of a method of connecting the connection structure 1 using the anisotropic conductive film 21 shown in Fig. 2 will be described. In the connection method of the present embodiment, the first electronic component 11 and the second electronic component 13 are electrically connected to each other while being heated by the anisotropic conductive film 21, thereby obtaining the above-described connection structure 1 .

具體而言，本實施形態之連接方法具有以下步驟：暫時貼附步驟，於第2電子零件13之端子12上暫時貼附異向性導電膜21之含導電性粒子層22側；暫時配置步驟， 於異向性導電膜21之絕緣性接著層23側暫時配置第1電子零件11；及壓接步驟，使用熱壓方式自暫時配置之第1電子零件11側進行按壓而壓接。 Specifically, the connection method of the present embodiment has a step of temporarily attaching the conductive particle layer 22 side of the anisotropic conductive film 21 to the terminal 12 of the second electronic component 13 in a temporary attaching step; , The first electronic component 11 is temporarily disposed on the insulating adhesive layer 23 side of the anisotropic conductive film 21, and the pressure bonding step is performed by pressing and pressing the first electronic component 11 side that is temporarily disposed by a hot press method.

於暫時貼附步驟中，例如以使圖2所示之異向性導電膜21之含導電性粒子層22成為第2電子零件13側之方式，將異向性導電膜21貼附於第2電子零件13上。 In the temporary attaching step, for example, the conductive conductive particle layer 22 of the anisotropic conductive film 21 shown in FIG. 2 is placed on the second electronic component 13 side, and the anisotropic conductive film 21 is attached to the second. On the electronic part 13.

於暫時配置步驟中，自異向性導電膜21將剝離層24剝離，自絕緣性接著層23側壓接第1電子零件11，形成連接構造體1。 In the temporary arrangement step, the peeling layer 24 is peeled off from the anisotropic conductive film 21, and the first electronic component 11 is pressure-bonded from the side of the insulating adhesive layer 23 to form the bonded structure 1.

於壓接步驟中，經由上述異向性導電膜21，使用熱壓方式將第1電子零件11與第2電子零件13一邊加熱一邊壓接，藉此使第1電子零件11之端子10與第2電子零件13之端子12電性連接。 In the pressure bonding step, the first electronic component 11 and the second electronic component 13 are pressure-bonded by heating by the above-described anisotropic conductive film 21, whereby the terminal 10 of the first electronic component 11 is connected to the first electronic component 11 2 The terminal 12 of the electronic component 13 is electrically connected.

此處，於第1電子零件11為形成有含有具極性基之化合物之膜的可撓性印刷基板，第2電子零件13為鹼玻璃基板之情形時，壓接步驟中較佳為自可撓性印刷基板進行按壓而壓接。藉由如此般自可撓性印刷基板側進行按壓，熱壓機與可撓性印刷基板接觸，含導電性粒子層22之樹脂受到加熱，因此熔融黏度降低而變得容易流動。藉此，可使樹脂自端子10與端子12之間流出，從而可高效率地捕捉含導電性粒子層22之導電性粒子20。 Here, in the case where the first electronic component 11 is a flexible printed circuit board on which a film containing a compound having a polar group is formed, and when the second electronic component 13 is an alkali glass substrate, the crimping step is preferably self-flexible. The printed circuit board is pressed and pressed. By pressing the flexible printed circuit board side as described above, the hot press is in contact with the flexible printed circuit board, and the resin containing the conductive particle layer 22 is heated, so that the melt viscosity is lowered and the flow easily flows. Thereby, the resin can flow out from between the terminal 10 and the terminal 12, and the conductive particles 20 containing the conductive particle layer 22 can be efficiently captured.

壓接步驟中之加熱方法係由總熱量決定，欲以10秒以下之連接時間完成接合之情形時，可於加熱溫度120℃~220℃下進行。壓接方法根據電子零件11之種類而不同，例 如於可撓性印刷基板之情形時，可設為於壓力0.5~2 MPa下進行3~10秒。再者，亦可併用超音波與熱而進行壓接。 The heating method in the pressure bonding step is determined by the total amount of heat. When the bonding is to be completed at a connection time of 10 seconds or less, the heating can be carried out at a heating temperature of 120 ° C to 220 ° C. The crimping method differs depending on the type of the electronic component 11, for example In the case of a flexible printed circuit board, it can be carried out at a pressure of 0.5 to 2 MPa for 3 to 10 seconds. Furthermore, it is also possible to use a combination of ultrasonic waves and heat to perform pressure bonding.

<3.其他實施形態> <3. Other Embodiments>

上述之說明中，係作為如圖1所示般，將絕緣性接著層23配置於第2電子零件13側者而進行說明，但並不限定於該例，亦可將絕緣性接著層23配置於第1電子零件11側。 In the above description, the insulating adhesive layer 23 is disposed on the side of the second electronic component 13 as shown in FIG. 1, but the present invention is not limited to this example, and the insulating adhesive layer 23 may be disposed. On the side of the first electronic component 11.

又，異向性導電膜21中，作為上述材料以外之材料，例如亦可含有矽烷偶合劑、界面活性劑等。 Further, in the anisotropic conductive film 21, a material other than the above material may contain, for example, a decane coupling agent or a surfactant.

進而，於上述連接方法之說明中，係使用膜狀之異向性導電膜21，但並不限定於該例，例如亦可使用膏狀之異向性導電接著劑。於該情形時，例如只要於上述連接方法之暫時貼附步驟中，使用由含導電性粒子層22所構成之接著材、與由絕緣性接著層23所構成之接著材即可。 Further, in the above description of the connection method, the film-shaped anisotropic conductive film 21 is used. However, the present invention is not limited to this example. For example, a paste-like anisotropic conductive adhesive may be used. In this case, for example, a bonding material composed of the conductive particle layer 22 and a bonding material composed of the insulating adhesive layer 23 may be used in the temporary attaching step of the above-described connection method.

[實施例] [Examples]

以下，說明本發明之具體之實施例。再者，本發明之範圍並不限定於下述任一實施例。 Hereinafter, specific embodiments of the present invention will be described. Furthermore, the scope of the present invention is not limited to any of the following embodiments.

以下例子中，首先，於製造例1~製造例7中製作由絕緣性接著層所構成之片材，於製造例8~製造例10中製作由含導電性粒子層所構成之片材。又，於實施例1~實施例5及比較例1~比較例5中，使用由製造例1~製造例10中所獲得之片材而製作之異向性導電膜，製作連接構造體。進而，關於實施例1~實施例5及比較例1~比較例5中所製作之連接構造體，評價接著力及導通電阻。 In the following examples, first, a sheet composed of an insulating adhesive layer was produced in Production Examples 1 to 7, and a sheet composed of a conductive particle-containing layer was produced in Production Examples 8 to 10. Further, in Examples 1 to 5 and Comparative Examples 1 to 5, an anisotropic conductive film produced from the sheets obtained in Production Examples 1 to 10 was used to produce a bonded structure. Further, regarding the connection structures produced in Examples 1 to 5 and Comparative Examples 1 to 5, the adhesion and the on-resistance were evaluated.

(製造例1) (Manufacturing Example 1)

於製造例1中，由如下之接著劑製作厚度6μm之由絕緣性接著層所構成之片材，該接著劑係由下述者構成：苯氧樹脂(品名：YP-50，新日鐵化學股份有限公司製造)25質量份、環氧樹脂(品名：jER828，三菱化學股份有限公司製造)30質量份、丙烯酸系樹脂(品名：M1600，東亞合成公司製造)20質量份、丙烯酸系樹脂(品名：M-315，東亞合成公司製造)10質量份、矽烷偶合劑(品名：A-187，Momentive Performance Materials公司製造)2質量份、自由基系硬化劑(品名：PEROYL L，日本油脂公司製造)5質量份、及陽離子系硬化劑(品名：SI-60L，三新化學工業公司製造)7質量份。 In Production Example 1, a sheet made of an insulating backing layer having a thickness of 6 μm was produced from the following adhesive, and the adhesive was composed of phenoxy resin (product name: YP-50, Nippon Steel Chemical Co., Ltd.) 30 parts by mass, epoxy resin (product name: jER828, manufactured by Mitsubishi Chemical Corporation), 30 parts by mass, acrylic resin (product name: M1600, manufactured by Toagosei Co., Ltd.), 20 parts by mass, acrylic resin (product name) :M-315, manufactured by Toagosei Co., Ltd.) 10 parts by mass, decane coupling agent (product name: A-187, manufactured by Momentive Performance Materials Co., Ltd.) 2 parts by mass, free radical curing agent (product name: PEROYL L, manufactured by Nippon Oil & Fats Co., Ltd.) 5 parts by mass and a cationic curing agent (product name: SI-60L, manufactured by Sanshin Chemical Industry Co., Ltd.) 7 parts by mass.

(製造例2) (Manufacturing Example 2)

於製造例2中，將製造例1中陽離子系硬化劑之添加量自7質量份變更為9質量份，除此之外以與製造例1相同之方式製作由絕緣性接著層所構成之片材。 In the production example 2, a sheet composed of an insulating adhesive layer was produced in the same manner as in Production Example 1 except that the amount of the cationic curing agent in the production example 1 was changed from 7 parts by mass to 9 parts by mass. material.

(製造例3) (Manufacturing Example 3)

於製造例3中，將製造例1中自由基系硬化劑之添加量自5質量份變更為6質量份，另外將陽離子系硬化劑之添加量自7質量份變更為8質量份，除此之外以與製造例1相同之方式製作由絕緣性接著層所構成之片材。 In Production Example 3, the amount of the radical curing agent added in Production Example 1 was changed from 5 parts by mass to 6 parts by mass, and the amount of the cationic curing agent added was changed from 7 parts by mass to 8 parts by mass. A sheet composed of an insulating adhesive layer was produced in the same manner as in Production Example 1.

(製造例4) (Manufacturing Example 4)

於製造例4中，將製造例1中自由基系硬化劑之添加量自5質量份變更為8質量份，除此之外以與製造例1相 同之方式製作由絕緣性接著層所構成之片材。 In Production Example 4, the amount of the radical-based curing agent in Production Example 1 was changed from 5 parts by mass to 8 parts by mass, and the production example 1 was used. In the same manner, a sheet composed of an insulating backing layer was produced.

(製造例5) (Manufacturing Example 5)

於製造例5中，將製造例1中自由基系硬化劑之添加量自5質量份變更為8質量份，另外將陽離子系硬化劑之添加量自7質量份變更為9質量份，除此之外以與製造例1相同之方式製作由絕緣性接著層所構成之片材。 In Production Example 5, the amount of the radical curing agent added in Production Example 1 was changed from 5 parts by mass to 8 parts by mass, and the amount of the cationic curing agent added was changed from 7 parts by mass to 9 parts by mass. A sheet composed of an insulating adhesive layer was produced in the same manner as in Production Example 1.

(製造例6) (Manufacturing Example 6)

於製造例6中，將製造例1中自由基系硬化劑之添加量自5質量份變更為6質量份，並且不添加陽離子系硬化劑，除此之外以與製造例1相同之方式製作由絕緣性接著層所構成之片材。 In the same manner as in Production Example 1, except that the amount of the radical-based curing agent in the production example 1 was changed from 5 parts by mass to 6 parts by mass, and the cationic curing agent was not added, in the same manner as in Production Example 1. A sheet composed of an insulating adhesive layer.

(製造例7) (Manufacturing Example 7)

製造例7中，於製造例1中不添加丙烯酸系樹脂及自由基系硬化劑，且將陽離子系硬化劑之添加量自7質量份變更為8質量份，除此之外以與製造例1相同之方式製作由絕緣性接著層所構成之片材。 In Production Example 7, the acrylic resin and the radical curing agent were not added, and the amount of the cationic curing agent was changed from 7 parts by mass to 8 parts by mass, and the production example 1 was used. A sheet composed of an insulating backing layer was produced in the same manner.

(製造例8) (Manufacturing Example 8)

於製造例8中，於以苯氧樹脂(品名：YP-50，新日鐵化學股份有限公司製造)25質量份、環氧樹脂(品名：jER828，三菱化學股份有限公司製造)30質量份、丙烯酸系樹脂(品名：M1600，東亞合成公司製造)20質量份、丙烯酸系樹脂(品名：M-315，東亞合成公司製造)10質量份、矽烷偶合劑(品名：A-187，Momentive Performance Materials公司製造)2質量份、自由基系硬化劑(品名： PEROYL L，日本油脂公司製造)6質量份、及導電粒子而構成之接著劑中，分散粒徑10μm之導電性粒子(經鍍敷Ni/Au之丙烯酸系樹脂粒子，日本化學工業公司製造)3質量份，製作厚度10μm之由含導電性粒子層所構成之片材。 In Production Example 8, 30 parts by mass of phenoxy resin (product name: YP-50, manufactured by Nippon Steel Chemical Co., Ltd.) and epoxy resin (product name: jER828, manufactured by Mitsubishi Chemical Corporation) 30 parts by mass, 20 parts by mass of acrylic resin (product name: M1600, manufactured by Toagosei Co., Ltd.), acrylic resin (product name: M-315, manufactured by Toagosei Co., Ltd.), 10 parts by mass, decane coupling agent (product name: A-187, Momentive Performance Materials, Inc.) Manufacture) 2 parts by mass, free radical hardener (product name: PEROYL L (manufactured by Nippon Oil & Fats Co., Ltd.), a conductive particle having a particle diameter of 10 μm (acrylic resin particles coated with Ni/Au, manufactured by Nippon Chemical Industry Co., Ltd.) A sheet composed of a layer containing a conductive particle having a thickness of 10 μm was produced in parts by mass.

(製造例9) (Manufacturing Example 9)

製造例9中，於製造例8中不添加丙烯酸系樹脂及自由基系硬化劑，且添加陽離子系硬化劑(品名：SI-60L，三新化學工業公司製造)8質量份，除此之外以與製造例1相同之方式製作由含導電性粒子層所構成之片材。 In Production Example 9, the acrylic resin and the radical curing agent were not added, and 8 parts by mass of a cationic curing agent (product name: SI-60L, manufactured by Sanshin Chemical Industry Co., Ltd.) was added. A sheet composed of a layer containing a conductive particle was produced in the same manner as in Production Example 1.

(製造例10) (Manufacturing Example 10)

製造例10中，於製造例8中添加陽離子系硬化劑(品名：SI-60L，三新化學工業公司製造)8質量份，除此之外以與製造例1相同之方式製作由含導電性粒子層所構成之片材。 In Production Example 10, conductivity was contained in the same manner as in Production Example 1 except that 8 parts by mass of a cationic curing agent (product name: SI-60L, manufactured by Sanshin Chemical Industry Co., Ltd.) was added to Production Example 8. A sheet composed of a particle layer.

將製造例1~製造例10之製作條件歸納示於以下之表1中。 The production conditions of Production Examples 1 to 10 are summarized in Table 1 below.

(實施例1) (Example 1)

於實施例1中，經由將製造例1中製作之由絕緣性接著層所構成之片材與製造例8中製作之由含導電性粒子層所構成之片材積層而成之雙層構造之異向性導電膜，將形成有含有具有醌基之化合物之膜的可撓性印刷基板(尺寸：430 mm×150 mm，厚度：90μm)、與ITO玻璃基板(鹼玻璃基板，尺寸：15 mm×80 mm×1.1 mm，表面電阻值：10 Ω/□)連接，製作連接構造體。 In the first embodiment, the sheet composed of the insulating backing layer produced in Production Example 1 and the sheet composed of the conductive particle layer produced in Production Example 8 were laminated in a two-layer structure. An anisotropic conductive film, a flexible printed substrate (size: 430 mm × 150 mm, thickness: 90 μm) having a film containing a compound having a mercapto group, and an ITO glass substrate (alkali glass substrate, size: 15 mm) ×80 mm × 1.1 mm, surface resistance: 10 Ω / □) connection, making a connection structure.

具體而言，於形成有含有具有醌基之化合物之膜的可撓性印刷基板側貼附由絕緣性接著層所構成之片材，於ITO玻璃基板側貼附由含導電性粒子層所構成之片材。又，可撓性印刷基板與ITO玻璃基板之連接係使用加熱工具於130℃或170℃、1 MPa、10秒之條件下進行。 Specifically, a sheet made of an insulating adhesive layer is attached to the flexible printed circuit board side on which a film containing a compound having a mercapto group is formed, and a layer containing a conductive particle layer is attached to the ITO glass substrate side. The sheet. Further, the connection between the flexible printed circuit board and the ITO glass substrate was carried out under the conditions of 130 ° C or 170 ° C, 1 MPa, and 10 seconds using a heating tool.

(實施例2) (Example 2)

實施例2中，於實施例1中將由絕緣性接著層所構成之片材替換成製造例2中製作之由絕緣性接著層所構成之片材，除此之外以與實施例1相同之方式製作連接構造體。 In the second embodiment, the sheet composed of the insulating adhesive layer was replaced with the sheet composed of the insulating backing layer produced in Production Example 2, except that the same manner as in Example 1 was carried out. The method is to make a connection structure.

(實施例3) (Example 3)

實施例3中，於實施例1中將由絕緣性接著層所構成之片材替換成製造例3中製作之由絕緣性接著層所構成之片材，除此之外以與實施例1相同之方式製作連接構造體。 In the third embodiment, the sheet composed of the insulating adhesive layer was replaced with the sheet composed of the insulating adhesive layer produced in Production Example 3, except that the same manner as in Example 1 was carried out. The method is to make a connection structure.

(實施例4) (Example 4)

實施例4中，於實施例1中將由絕緣性接著層所構成之片材替換成製造例4中製作之由絕緣性接著層所構成之 片材，除此之外以與實施例1相同之方式製作連接構造體。 In the fourth embodiment, the sheet composed of the insulating adhesive layer was replaced with the insulating adhesive layer produced in the production example 4 in the first embodiment. A connection structure was produced in the same manner as in Example 1 except for the sheet.

(實施例5) (Example 5)

實施例5中，於實施例1中將由絕緣性接著層所構成之片材替換成製造例5中製作之由絕緣性接著層所構成之片材，除此之外以與實施例1相同之方式製作連接構造體。 In the fifth embodiment, the sheet composed of the insulating adhesive layer was replaced with the sheet composed of the insulating adhesive layer produced in Production Example 5, except that the same manner as in Example 1 was carried out. The method is to make a connection structure.

(比較例1) (Comparative Example 1)

比較例1中，於實施例1中將由絕緣性接著層所構成之片材替換成製造例6中製作之由絕緣性接著層所構成之片材，且將由含導電性粒子層所構成之片材替換成製造例9中製作之由含導電性粒子層所構成之片材，除此之外以與實施例1相同之方式製作連接構造體。 In the first comparative example, in the first embodiment, the sheet composed of the insulating adhesive layer was replaced with the sheet composed of the insulating adhesive layer produced in Production Example 6, and the sheet composed of the conductive particle-containing layer was used. A bonded structure was produced in the same manner as in Example 1 except that the material was replaced with the sheet composed of the conductive particle-containing layer produced in Production Example 9.

(比較例2) (Comparative Example 2)

於比較例2中，於實施例1中將由絕緣性接著層所構成之片材替換成製造例7中製作之由絕緣性接著層所構成之片材，除此之外以與實施例1相同之方式製作連接構造體。 In Comparative Example 2, the sheet composed of the insulating adhesive layer was replaced with the sheet composed of the insulating backing layer produced in Production Example 7 in the first embodiment, except that it was the same as in Example 1. The connection structure is produced in the same manner.

(比較例3) (Comparative Example 3)

於比較例3中，僅使用製造例9中製作之由含導電性粒子層所構成之片材，除此之外以與實施例1相同之方式製作連接構造體。 In Comparative Example 3, a bonded structure was produced in the same manner as in Example 1 except that the sheet composed of the conductive particle-containing layer produced in Production Example 9 was used.

(比較例4) (Comparative Example 4)

於比較例4中，僅使用製造例8中製作之由含導電性粒子層所構成之片材，除此之外以與實施例1相同之方式製作連接構造體。 In Comparative Example 4, a bonded structure was produced in the same manner as in Example 1 except that the sheet composed of the conductive particle-containing layer produced in Production Example 8 was used.

(比較例5) (Comparative Example 5)

於比較例5中，僅使用製造例10中製作之由含導電性粒子層所構成之片材，除此之外以與實施例1相同之方式製作連接構造體。 In Comparative Example 5, a bonded structure was produced in the same manner as in Example 1 except that the sheet composed of the conductive particle-containing layer produced in Production Example 10 was used.

將實施例1~實施例5及比較例1~比較例5之製造條件歸納示於以下之表2中。 The production conditions of Examples 1 to 5 and Comparative Examples 1 to 5 are summarized in Table 2 below.

<導通電阻試驗> <On-resistance test>

對實施例1~實施例5及比較例1~比較例5中所製作之連接構造體，測定初期(Initial)之電阻及經溫度60℃、濕度95%RH、250小時之TH試驗(Thermal Humidity Test，濕熱試驗)後之電阻。測定係使用數位萬用表(數位萬用表7561，橫河電機公司製造)，利用四端子法測定流通1 mA之電流時之連接電阻。表2中所示之導通電阻試驗之評價中，係將連接電阻未達5 Ω者評價為「○」，連接電阻為5 Ω以上且未達20 Ω者評價為「△」，連接電阻為20 Ω以上者評價為「×」。 For the connection structures produced in Examples 1 to 5 and Comparative Examples 1 to 5, the initial resistance and the TH test at a temperature of 60 ° C, humidity of 95% RH, and 250 hours (Thermal Humidity) were measured. Resistance after test, damp heat test). In the measurement, a digital multimeter (a digital multimeter 7561, manufactured by Yokogawa Electric Co., Ltd.) was used, and the connection resistance at the time of flowing a current of 1 mA was measured by a four-terminal method. In the evaluation of the on-resistance test shown in Table 2, the connection resistance was less than 5 Ω and the evaluation was "○", and the connection resistance was 5 Ω or more and less than 20 Ω was evaluated as "△", and the connection resistance was 20 Those who are Ω or higher are evaluated as "X".

<接著強度試驗> <Continue strength test>

使用剝離強度試驗機(Tensilon，Orientec公司製造)，對實施例1~實施例5及比較例1~比較例5中所製作之連接構造體測定以拉伸強度50 cm/min沿90℃方向剝離時的剝離強度(N/cm)。表2所示之接著強度試驗之評價中，係將接著強度為7 N/cm以上者評價為「○」，接著強度為4 N/cm以上且未達7 N/cm者評價為「△」，接著強度未達4 N/cm者評價為「×」。 The joint structure produced in Examples 1 to 5 and Comparative Examples 1 to 5 was measured by a peel strength tester (Tensilon, manufactured by Orientec Co., Ltd.) and peeled at a tensile strength of 50 cm/min in a 90° C direction. Peel strength (N/cm) at the time. In the evaluation of the adhesion strength test shown in Table 2, the evaluation of the adhesion strength of 7 N/cm or more was evaluated as "○", and the strength of 4 N/cm or more and less than 7 N/cm was evaluated as "△". Then, the strength of less than 4 N/cm was evaluated as "X".

於實施例1~實施例5中，由於使用具有含有陽離子系硬化劑、環氧樹脂、丙烯酸系樹脂及自由基系硬化劑之絕緣性接著層與含有自由基系硬化劑、丙烯酸系樹脂、環氧樹脂及導電性粒子之含導電性粒子層所成之異向性導電膜，故而導通電阻試驗及接著強度試驗之結果良好。亦即，於實施例1~實施例5中，可於低溫下以較短時間將含有具 極性基之化合物的可撓性印刷基板與鹼玻璃基板連接。並且，可以良好之接著力將含有具極性基之化合物的可撓性印刷基板與鹼玻璃基板連接。進而，於導通電阻試驗後獲得良好之導通可靠性。 In the first to fifth embodiments, an insulating adhesive layer containing a cationic curing agent, an epoxy resin, an acrylic resin, and a radical curing agent, and a radical-containing curing agent, an acrylic resin, and a ring are used. Since the oxygen-containing resin and the conductive particles contained the anisotropic conductive film formed of the conductive particle layer, the results of the on-resistance test and the adhesion strength test were good. That is, in the first to fifth embodiments, the device can be contained in a short time at a low temperature. The flexible printed circuit board of the polar group compound is connected to the alkali glass substrate. Further, the flexible printed circuit board containing the compound having a polar group can be connected to the alkali glass substrate with good adhesion. Further, good conduction reliability was obtained after the on-resistance test.

於比較例1中，由於異向性導電膜之絕緣性接著層中不含陽離子系硬化劑，且含導電性粒子層中不含丙烯酸系樹脂與自由基系硬化劑，故而130℃下之接著強度試驗之結果不佳，170℃下之接著強度試驗之結果稍欠佳。又，比較例1中，導通電阻試驗之結果不佳。 In Comparative Example 1, since the insulating adhesive layer of the anisotropic conductive film does not contain a cationic curing agent, and the conductive particle layer does not contain an acrylic resin and a radical curing agent, it is followed by 130 ° C. The results of the strength test were poor, and the results of the subsequent strength test at 170 ° C were slightly less favorable. Further, in Comparative Example 1, the results of the on-resistance test were not good.

於比較例2中，由於異向性導電膜之絕緣性接著層中不含丙烯酸系樹脂與自由基系硬化劑，故而130℃下之接著強度試驗之結果不佳。又，比較例2中，導通電阻試驗結果稍欠佳。 In Comparative Example 2, since the insulating adhesive layer of the anisotropic conductive film did not contain the acrylic resin and the radical hardener, the result of the adhesion strength test at 130 ° C was not good. Further, in Comparative Example 2, the on-resistance test result was slightly unsatisfactory.

於比較例3中，由於異向性導電膜不含絕緣性接著層，且含導電性粒子層中不含丙烯酸系樹脂與自由基系硬化劑，故而130℃下之接著強度試驗之結果不佳，170℃下之接著強度試驗之結果稍欠佳。又，比較例3中，導通電阻試驗之結果不佳。 In Comparative Example 3, since the anisotropic conductive film does not contain an insulating adhesive layer, and the conductive particle layer does not contain an acrylic resin and a radical hardener, the result of the adhesion strength test at 130 ° C is not good. The results of the subsequent strength test at 170 ° C were slightly less favorable. Further, in Comparative Example 3, the results of the on-resistance test were not good.

於比較例4中，由於異向性導電膜不含絕緣性接著層，且含導電性粒子層中不含陽離子系硬化劑，故而130℃下之接著強度試驗之結果不佳。 In Comparative Example 4, since the anisotropic conductive film did not contain an insulating adhesive layer and the conductive particle layer did not contain a cationic hardener, the result of the adhesion strength test at 130 ° C was not good.

於比較例5中，由於異向性導電膜不含絕緣性接著層，故而130℃下之接著強度試驗之結果稍欠佳，170℃下之接著強度試驗結果之稍欠佳，導通電阻試驗之結果稍欠佳。 In Comparative Example 5, since the anisotropic conductive film did not contain an insulating adhesive layer, the result of the adhesion strength test at 130 ° C was slightly poor, and the result of the adhesion strength test at 170 ° C was slightly poor, and the on-resistance test was performed. The result is slightly less good.

1‧‧‧連接構造體 1‧‧‧Connection structure

10、12‧‧‧端子 10, 12‧‧‧ terminals

11‧‧‧第1電子零件 11‧‧‧1st electronic part

13‧‧‧第2電子零件 13‧‧‧2nd electronic parts

20‧‧‧導電性粒子 20‧‧‧Electrical particles

21‧‧‧異向性導電膜 21‧‧‧ Anisotropic conductive film

22‧‧‧第1層(含導電性粒子層) 22‧‧‧1st layer (with conductive particle layer)

23‧‧‧第2層(絕緣性接著層) 23‧‧‧2nd layer (insulating adhesive layer)

24‧‧‧剝離層 24‧‧‧ peeling layer

圖1係表示本實施形態之連接構造體之構成例的剖面圖。 Fig. 1 is a cross-sectional view showing a configuration example of a connection structure according to the embodiment.

圖2係表示本實施形態之異向性導電膜之構成例的剖面圖。 Fig. 2 is a cross-sectional view showing a configuration example of the anisotropic conductive film of the embodiment.

Claims (8)

一種異向性導電膜，係將形成有端子之第1電子零件、與形成有端子之第2電子零件電性連接，且具有第1層與第2層，該第1層含有自由基系硬化劑、丙烯酸系樹脂及環氧樹脂；該第2層含有陽離子系硬化劑、環氧樹脂、丙烯酸系樹脂及自由基系硬化劑；且該第1層或該第2層進而含有導電性粒子，該第1電子零件為形成有膜之配線材，該膜含有具極性基之化合物。 An anisotropic conductive film electrically connecting a first electronic component in which a terminal is formed and a second electronic component in which a terminal is formed, and having a first layer and a second layer, wherein the first layer contains a radical hardening The second layer contains a cationic curing agent, an epoxy resin, an acrylic resin, and a radical curing agent; and the first layer or the second layer further contains conductive particles. The first electronic component is a wiring material in which a film is formed, and the film contains a compound having a polar group. 如申請專利範圍第1項之異向性導電膜，其中，該配線材為可撓性印刷基板，該異向性導電膜將作為該第1電子零件之形成有含有具極性基之化合物之膜的可撓性印刷基板、與作為該第2電子零件之鹼玻璃基板電性連接。 The anisotropic conductive film of the first aspect of the invention, wherein the wiring material is a flexible printed circuit board, and the anisotropic conductive film is formed as a film containing a compound having a polar group as the first electronic component. The flexible printed circuit board is electrically connected to the alkali glass substrate as the second electronic component. 如申請專利範圍第2項之異向性導電膜，其中，該第2層中所含之自由基系硬化劑與陽離子系硬化劑之合計，為12~17質量份。 The anisotropic conductive film of the second aspect of the invention, wherein the total amount of the radical-based curing agent and the cationic curing agent contained in the second layer is 12 to 17 parts by mass. 如申請專利範圍第2項或第3項之異向性導電膜，其中，該第2層中所含之自由基系硬化劑與陽離子系硬化劑之質量比([自由基系硬化劑]/[陽離子系硬化劑])為0.5~1.2。 The anisotropic conductive film of the second or third aspect of the patent application, wherein the mass ratio of the radical hardener and the cationic hardener contained in the second layer ([radical hardener]/ [Cation-based curing agent]) is from 0.5 to 1.2. 一種連接方法，具有壓接步驟，經由異向性導電膜， 將形成有端子之第1電子零件、與形成有端子之第2電子零件一邊加熱一邊壓接而電性連接，該異向性導電膜具有有第1層與第2層：該第1層含有自由基系硬化劑、丙烯酸系樹脂及環氧樹脂；該第2層含有陽離子系硬化劑、環氧樹脂、丙烯酸系樹脂及自由基系硬化劑；且該第1層或該第2層進而含有導電性粒子，該第1電子零件為形成有膜之配線材，該膜含有具極性基之化合物。 A joining method having a crimping step via an anisotropic conductive film, The first electronic component in which the terminal is formed and the second electronic component in which the terminal is formed are electrically connected to each other while being heated, and the anisotropic conductive film has a first layer and a second layer: the first layer contains a radical-based curing agent, an acrylic resin, and an epoxy resin; the second layer contains a cationic curing agent, an epoxy resin, an acrylic resin, and a radical curing agent; and the first layer or the second layer further contains Conductive particles, the first electronic component is a wiring material in which a film is formed, and the film contains a compound having a polar group. 如申請專利範圍第5項之連接方法，其中，該配線材為可撓性印刷基板，該第1電子零件為形成有含有具極性基之化合物之膜的可撓性印刷基板，該第2電子零件為鹼玻璃基板，該連接方法具有以下步驟：暫時貼附步驟，於該第2電子零件之端子上暫時貼附該異向性導電膜之第1層側；及暫時配置步驟，於該異向性導電膜之第2層側暫時配置該第1電子零件；且於該壓接步驟中，使用熱壓方式自經該暫時配置步驟而暫時配置之該第1電子零件側進行按壓。 The connection method of the fifth aspect of the invention, wherein the wiring member is a flexible printed circuit board, and the first electronic component is a flexible printed circuit board on which a film containing a compound having a polar group is formed, the second electron The component is an alkali glass substrate, and the connection method has the following steps: a temporary attaching step of temporarily attaching the first layer side of the anisotropic conductive film to the terminal of the second electronic component; and temporarily disposing the step The first electronic component is temporarily disposed on the second layer side of the conductive film; and in the pressure bonding step, the first electronic component side temporarily placed through the temporary arrangement step is pressed by a hot pressing method. 一種連接方法，具有壓接步驟，經由接著劑，將形成有端子之第1電子零件、與形成有端子之第2電子零件一 邊加熱一邊壓接而電性連接，該接著劑由第1接著劑與第2接著劑構成，該第1接著劑含有自由基系硬化劑、丙烯酸系樹脂及環氧樹脂；該第2接著劑含有陽離子系硬化劑、環氧樹脂、丙烯酸系樹脂及自由基系硬化劑；且該第1接著劑或該第2接著劑進而含有導電性粒子，該第1電子零件為形成有膜之配線材，該膜含有具極性基之化合物。 A connection method comprising a pressure bonding step of forming a first electronic component having a terminal and a second electronic component having a terminal formed via an adhesive The adhesive is electrically connected by pressure bonding, and the adhesive is composed of a first adhesive and a second adhesive, and the first adhesive contains a radical curing agent, an acrylic resin, and an epoxy resin; and the second adhesive A cationic curing agent, an epoxy resin, an acrylic resin, and a radical curing agent are contained; and the first adhesive or the second adhesive further contains conductive particles, and the first electronic component is a wiring material in which a film is formed. The film contains a compound having a polar group. 一種連接構造體，係經由異向性導電膜，藉由將形成有端子之第1電子零件、與形成有端子之第2電子零件一邊加熱一邊壓接而將該第1電子零件與該第2電子零件電性連接所成者，該異向性導電膜具有第1層與第2層，該第1層含有自由基系硬化劑、丙烯酸系樹脂及環氧樹脂；該第2層含有陽離子系硬化劑、環氧樹脂、丙烯酸系樹脂及自由基系硬化劑；且該第1層或該第2層進而含有導電性粒子，該第1電子零件為形成有膜之配線材，該膜含有具極性基之化合物。 A connection structure is obtained by pressing a first electronic component in which a terminal is formed and a second electronic component in which a terminal is formed while being heated, and the first electronic component and the second component are passed through an anisotropic conductive film. The electronic component is electrically connected, and the anisotropic conductive film has a first layer and a second layer, and the first layer contains a radical curing agent, an acrylic resin, and an epoxy resin; and the second layer contains a cationic system a curing agent, an epoxy resin, an acrylic resin, and a radical curing agent; and the first layer or the second layer further contains conductive particles, and the first electronic component is a wiring material in which a film is formed, and the film contains A polar group of compounds.
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