JP5690637B2 - Anisotropic conductive film, connection method and connection structure - Google Patents

Anisotropic conductive film, connection method and connection structure Download PDF

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JP5690637B2
JP5690637B2 JP2011088457A JP2011088457A JP5690637B2 JP 5690637 B2 JP5690637 B2 JP 5690637B2 JP 2011088457 A JP2011088457 A JP 2011088457A JP 2011088457 A JP2011088457 A JP 2011088457A JP 5690637 B2 JP5690637 B2 JP 5690637B2
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electronic component
curing agent
layer
anisotropic conductive
conductive film
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JP2011142103A (en
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康祐 浅羽
康祐 浅羽
隆行 松島
隆行 松島
佐藤　大祐
大祐 佐藤
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Dexerials Corp
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Priority to KR1020137029587A priority patent/KR101814235B1/en
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    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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Description

本発明は、端子が形成された電子部品を接続する異方性導電フィルム、接続方法及び接続構造体に関する。   The present invention relates to an anisotropic conductive film for connecting an electronic component on which a terminal is formed, a connection method, and a connection structure.

従来から、電子部品を接続する手段として、例えば、導電性粒子が分散された熱硬化性樹脂を剥離フィルムに塗布したテープ状の接続材料が用いられている。このような接続材料の一例として、異方性導電フィルム（ＡＣＦ：Anisotropic Conductive Film）が挙げられる。異方性導電フィルムは、例えば、フレキシブルプリント基板（ＦＰＣ：Flexible Printed Circuits）と、ＬＣＤ（Liquid Crystal Display）パネルのガラス基板上に形成されたＩＴＯ（Indium Tin Oxide）電極とを接続する場合の他、種々の端子同士を接着するとともに電気的に接続する場合に用いられる（例えば、特許文献１を参照）。   Conventionally, as a means for connecting electronic components, for example, a tape-shaped connection material in which a thermosetting resin in which conductive particles are dispersed is applied to a release film has been used. An example of such a connection material is an anisotropic conductive film (ACF). The anisotropic conductive film is used, for example, for connecting a flexible printed circuit (FPC) and an ITO (Indium Tin Oxide) electrode formed on a glass substrate of an LCD (Liquid Crystal Display) panel. It is used when various terminals are bonded together and electrically connected (see, for example, Patent Document 1).

タッチパネル用途のＩＴＯガラス、メタルガラス、ＩＴＯフィルム、Ａｇペーストフィルム等においては、高温圧着により異方性導電フィルムに歪み等が生じて不具合が発生してしまう。そのため、より低温で圧着が可能な異方性導電フィルムが求められ、かつ、接着強度の確保が求められている。   In ITO glass, metal glass, ITO film, Ag paste film, and the like for touch panel applications, distortion or the like occurs in the anisotropic conductive film due to high-temperature pressure bonding, resulting in problems. Therefore, an anisotropic conductive film that can be pressure-bonded at a lower temperature is required, and securing of adhesive strength is required.

ところで、フレキシブルプリント基板を構成する部材の一つとして、表面保護膜（カバーレイ）がある。この表面保護膜は、フレキシブルプリント基板の電気絶縁性、表面保護、耐屈折性付与等の役割を果たしている。特許文献２には、極性基を有する樹脂組成物で表面保護膜を構成することにより、表面保護膜の機械特性を良好にすることが記載されている。   By the way, there is a surface protective film (coverlay) as one of the members constituting the flexible printed circuit board. This surface protective film plays a role of providing electrical insulation, surface protection, and refraction resistance of the flexible printed circuit board. Patent Document 2 describes that the surface protective film is made of a resin composition having a polar group to improve the mechanical properties of the surface protective film.

しかしながら、極性基（例えばキノン基等）を有する化合物を含有するフレキシブルプリント基板では、極性基がラジカルを捕捉してしまう。そのため、このような極性基を有する化合物を含有するフレキシブルプリント基板側の接続で、ラジカル系（アクリル系）樹脂を含有する異方性導電フィルムを使用した場合には、硬化不良が発生してしまう。また、基板としてアルカリガラス基板を使用した場合には、アルカリガラス基板側の接続でカチオン系樹脂を含有する異方性導電フィルムを使用すると、硬化不良が発生してしまう。   However, in a flexible printed board containing a compound having a polar group (such as a quinone group), the polar group traps radicals. Therefore, when an anisotropic conductive film containing a radical (acrylic) resin is used for connection on the side of a flexible printed board containing a compound having such a polar group, curing failure occurs. . In addition, when an alkali glass substrate is used as the substrate, curing failure occurs when an anisotropic conductive film containing a cationic resin is used for connection on the alkali glass substrate side.

特開２０１０−１２３４１８号公報JP 2010-123418 A 特開２００４−２５９２号公報JP 2004-2592 A

そこで、本発明は、このような従来の実情に鑑みて提案されたものであり、特に、極性基を有する化合物を含有するフレキシブルプリント基板とアルカリガラス基板とを、低温かつ良好な接着力で接続することができる異方性導電フィルム、接続方法、接続構造体を提供することを目的とする。   Therefore, the present invention has been proposed in view of such a conventional situation, and in particular, a flexible printed board containing a compound having a polar group and an alkali glass board are connected at a low temperature with a good adhesive force. An object is to provide an anisotropic conductive film, a connection method, and a connection structure.

本発明に係る異方性導電フィルムは、端子が形成された第１の電子部品と、端子が形成された第２の電子部品とを電気的に接続する異方性導電フィルムにおいて、ラジカル系硬化剤と、アクリル樹脂と、エポキシ樹脂とを含有する第１の層と、カチオン系硬化剤と、エポキシ樹脂と、アクリル樹脂と、ラジカル系硬化剤とを含有する第２の層とを有し、第１の層又は第２の層は、導電性粒子をさらに含有し、第１の電子部品としての極性基を有する化合物を含有する膜が形成されたフレキシブルプリント基板と、第２の電子部品としてのアルカリガラス基板とを電気的に接続する。 An anisotropic conductive film according to the present invention is a radical curing in an anisotropic conductive film that electrically connects a first electronic component having a terminal and a second electronic component having a terminal. A first layer containing an agent, an acrylic resin, and an epoxy resin, a cationic curing agent, an epoxy resin, an acrylic resin, and a second layer containing a radical curing agent, The first layer or the second layer further includes conductive particles, a flexible printed circuit board on which a film containing a compound having a polar group as the first electronic component is formed, and the second electronic component Electrically connected to the alkali glass substrate.

本発明に係る接続方法は、異方性導電フィルムを介して、端子が形成された第１の電子部品と、端子が形成された第２の電子部品とを加熱しながら圧着して電気的に接続する圧着工程を有し、異方性導電フィルムは、ラジカル系硬化剤と、アクリル樹脂と、エポキシ樹脂とを含有する第１の層と、カチオン系硬化剤と、エポキシ樹脂と、アクリル樹脂と、ラジカル系硬化剤とを含有する第２の層とを有し、第１の層又は第２の層が、導電性粒子をさらに含有し、第１の電子部品としての極性基を有する化合物を含有する膜が形成されたフレキシブルプリント基板と、第２の電子部品としてのアルカリガラス基板とを電気的に接続する。 According to the connection method of the present invention, the first electronic component with the terminal formed thereon and the second electronic component with the terminal formed are pressed and electrically bonded via an anisotropic conductive film. The anisotropic conductive film includes a first step containing a radical curing agent, an acrylic resin, and an epoxy resin, a cationic curing agent, an epoxy resin, and an acrylic resin. And a second layer containing a radical curing agent, wherein the first layer or the second layer further contains conductive particles and has a polar group as the first electronic component. The flexible printed circuit board on which the film to be contained is formed and the alkali glass substrate as the second electronic component are electrically connected.

本発明に係る接続構造体は、異方性導電フィルムを介して、端子が形成された第１の電子部品と、端子が形成された第２の電子部品とを加熱しながら圧着することにより、第１の電子部品と第２の電子部品とが電気的に接続された接続構造体において、異方性導電フィルムは、ラジカル系硬化剤と、アクリル樹脂と、エポキシ樹脂とを含有する第１の層と、カチオン系硬化剤と、エポキシ樹脂と、アクリル樹脂と、ラジカル系硬化剤とを含有する第２の層とを有し、第１の層又は第２の層が、導電性粒子をさらに含有し、第１の電子部品は、極性基を有する化合物を含有する膜が形成されたフレキシブルプリント基板であり、第２の電子部品は、アルカリガラス基板である。 The connection structure according to the present invention is bonded to the first electronic component with the terminal formed thereon and the second electronic component with the terminal formed through an anisotropic conductive film while heating. In the connection structure in which the first electronic component and the second electronic component are electrically connected, the anisotropic conductive film includes a radical curing agent, an acrylic resin, and an epoxy resin. A second layer containing a layer, a cationic curing agent, an epoxy resin, an acrylic resin, and a radical curing agent, and the first layer or the second layer further includes conductive particles. The first electronic component is a flexible printed board on which a film containing a compound having a polar group is formed, and the second electronic component is an alkali glass substrate.

本発明によれば、特に、極性基を有する化合物を含有するフレキシブルプリント基板とアルカリガラス基板とを、低温かつ良好な接着力で接続することができる。   According to the present invention, in particular, a flexible printed circuit board containing a compound having a polar group and an alkali glass substrate can be connected with low temperature and good adhesive force.

本実施の形態に係る接続構造体の構成例を示す断面図である。It is sectional drawing which shows the structural example of the connection structure which concerns on this Embodiment. 本実施の形態に係る異方性導電フィルムの構成例を示す断面図である。It is sectional drawing which shows the structural example of the anisotropic conductive film which concerns on this Embodiment.

以下、本発明の具体的な実施の形態（以下、「本実施の形態」という）の一例について説明する。
１．接続構造体
１−１．第１の電子部品
１−２．第２の電子部品
１−３．異方性導電フィルム
１−３−１．第１の層（導電性粒子含有層）
１−３−２．第２の層（絶縁性接着層）
２．接続方法
３．他の実施の形態 Hereinafter, an example of a specific embodiment of the present invention (hereinafter referred to as “the present embodiment”) will be described.
1. Connection structure 1-1. First electronic component 1-2. Second electronic component 1-3. Anisotropic conductive film 1-3-1. First layer (conductive particle-containing layer)
1-3-2. Second layer (insulating adhesive layer)
2. Connection method 3. Other embodiments

＜１．接続構造体＞
図１は、本実施の形態に係る接続構造体の構成例を示す断面図である。図１に示すように、接続構造体１は、端子１０が形成された第１の電子部品１１と、端子１２が形成された第２の電子部品１３と、導電性粒子２０を含有する異方性導電フィルム２１とを有する。接続構造体１は、第１の電子部品１１における端子１０と、異方性導電フィルム２１における導電性粒子２０と、第２の電子部品１３における端子１２とが導通されることにより、第１の電子部品１１と第２の電子部品１３とが電気的に接続されている。 <1. Connection structure>
FIG. 1 is a cross-sectional view illustrating a configuration example of a connection structure according to the present embodiment. As shown in FIG. 1, the connection structure 1 is anisotropic, containing a first electronic component 11 in which terminals 10 are formed, a second electronic component 13 in which terminals 12 are formed, and conductive particles 20. Conductive film 21. In the connection structure 1, the terminal 10 in the first electronic component 11, the conductive particles 20 in the anisotropic conductive film 21, and the terminal 12 in the second electronic component 13 are electrically connected to each other. The electronic component 11 and the second electronic component 13 are electrically connected.

＜１−１．第１の電子部品＞
第１の電子部品１１は、例えば、極性基を有する化合物を含有する膜が形成されたフレキシブルプリント基板などの配線材である。また、第１の電子部品１１には、第２の電子部品１３と接続するための端子１０が形成されている。 <1-1. First electronic component>
The first electronic component 11 is, for example, a wiring material such as a flexible printed board on which a film containing a compound having a polar group is formed. In addition, the first electronic component 11 is formed with a terminal 10 for connecting to the second electronic component 13.

＜１−２．第２の電子部品＞
第２の電子部品１３は、例えば、アルカリガラス基板、ガラス製のＬＣＤ基板（ＬＣＤパネル）、ガラス製のＰＤＰ基板（ＰＤＰパネル）、ガラス製の有機ＥＬ基板（有機ＥＬパネル）等のガラス基板である。第２の電子部品１３には、第１の電子部品１１と接続するための端子１２が形成されている。 <1-2. Second electronic component>
The second electronic component 13 is, for example, a glass substrate such as an alkali glass substrate, a glass LCD substrate (LCD panel), a glass PDP substrate (PDP panel), or a glass organic EL substrate (organic EL panel). is there. A terminal 12 for connecting to the first electronic component 11 is formed on the second electronic component 13.

＜１−３．異方性導電フィルム＞
異方性導電フィルム２１は、絶縁性樹脂に導電性粒子２０が分散された第１の層２２（以下、「導電性粒子含有層２２」と呼ぶ。）と、絶縁性樹脂に導電性粒子２０が含まれていない第２の層２３（以下、「絶縁性接着層２３」と呼ぶ。）とを備える。異方性導電フィルム２１は、形状がフィルム状となっているので、取扱性に優れるとともに、接続後の厚みを容易に均一化することができる。 <1-3. Anisotropic Conductive Film>
The anisotropic conductive film 21 includes a first layer 22 in which conductive particles 20 are dispersed in an insulating resin (hereinafter referred to as “conductive particle-containing layer 22”), and conductive particles 20 in the insulating resin. 2 is included (hereinafter referred to as “insulating adhesive layer 23”). Since the anisotropic conductive film 21 has a film shape, the anisotropic conductive film 21 is excellent in handleability and can be easily made uniform in thickness after connection.

図２に示すように、異方性導電フィルム２１は、例えば、剥離層（セパレータ）２４と、剥離層２４上に形成された絶縁性接着層２３と、絶縁性接着層２３上に形成された導電性粒子含有層２２とを有する。   As shown in FIG. 2, the anisotropic conductive film 21 is formed on, for example, a release layer (separator) 24, an insulating adhesive layer 23 formed on the release layer 24, and the insulating adhesive layer 23. And a conductive particle-containing layer 22.

異方性導電フィルム２１における導電性粒子含有層２２は、ラジカル系硬化剤と、アクリル樹脂と、エポキシ樹脂とを含有する。このような導電性粒子含有層２２では、第１の電子部品１１と第２の電子部品１３との圧着時に、アクリル樹脂とラジカル系硬化剤とによるラジカル硬化が生じ、また、エポキシ樹脂がラジカル系硬化剤の存在下で開環するので、接着力を向上させることができる。   The conductive particle-containing layer 22 in the anisotropic conductive film 21 contains a radical curing agent, an acrylic resin, and an epoxy resin. In such a conductive particle-containing layer 22, radical curing by the acrylic resin and the radical curing agent occurs when the first electronic component 11 and the second electronic component 13 are pressure-bonded, and the epoxy resin is a radical system. Since the ring is opened in the presence of the curing agent, the adhesive force can be improved.

また、異方性導電フィルム２１における絶縁性接着層２３は、カチオン系硬化剤とエポキシ樹脂とアクリル樹脂とラジカル系硬化剤とを含有する。このような絶縁性接着層２３では、第１の電子部品１１と第２の電子部品１３との圧着時に、アクリル樹脂とラジカル系硬化剤とによるラジカル硬化と、エポキシ樹脂とカチオン系硬化剤とによるカチオン硬化とが生じ、また、ラジカル硬化とカチオン硬化との相乗効果によって、第１の電子部品１１との接着力を向上させることができる。 Moreover, the insulating adhesive layer 23 in the anisotropic conductive film 21 contains a cationic curing agent, an epoxy resin, an acrylic resin, and a radical curing agent. In such an insulating adhesive layer 23, when the first electronic component 11 and the second electronic component 13 are pressure-bonded, radical curing with an acrylic resin and a radical curing agent, and epoxy resin and a cationic curing agent are used. Cationic curing occurs, and the adhesive strength with the first electronic component 11 can be improved by a synergistic effect of radical curing and cationic curing.

このように、異方性導電フィルム２１によれば、第１の電子部品１１と第２の電子部品１３との圧着時に、導電性粒子含有層２２と絶縁性接着層２３とによって接着力を向上させることができる。したがって、例えば、上述したように硬化不良が発生してしまう極性基を有する化合物を含有するフレキシブルプリント基板とアルカリガラス基板とを圧着させる際に、低温かつ良好な接着力で接続することができる。   As described above, according to the anisotropic conductive film 21, the adhesive force is improved by the conductive particle-containing layer 22 and the insulating adhesive layer 23 when the first electronic component 11 and the second electronic component 13 are pressed. Can be made. Therefore, for example, when a flexible printed board containing a compound having a polar group that causes poor curing as described above and an alkali glass substrate are pressure-bonded, they can be connected at a low temperature and with a good adhesive force.

また、異方性導電フィルム２１においては、絶縁性接着層２３に含まれるラジカル系硬化剤と、カチオン系硬化剤との質量比（〔ラジカル系硬化剤〕／〔カチオン系硬化剤〕）が、０．５〜１．２であることが好ましい。絶縁性接着層２３におけるラジカル系硬化剤とカチオン系硬化剤との質量比をこのような範囲とすることにより、アクリル樹脂とラジカル系硬化剤とによるラジカル硬化と、エポキシ樹脂とカチオン系硬化剤とによるカチオン硬化とが良好に生じて、より良好な接着力を付与することができる。   In the anisotropic conductive film 21, the mass ratio of the radical curing agent and the cationic curing agent contained in the insulating adhesive layer 23 ([radical curing agent] / [cationic curing agent]) is It is preferable that it is 0.5-1.2. By setting the mass ratio of the radical curing agent to the cationic curing agent in the insulating adhesive layer 23 in such a range, radical curing with an acrylic resin and a radical curing agent, an epoxy resin and a cationic curing agent, The cation curing due to the above can be satisfactorily generated, and a better adhesive force can be imparted.

また、異方性導電フィルム２１において、絶縁性接着層２３に含まれるラジカル系硬化剤の量と、カチオン系硬化剤の量との合計を、１２〜１７質量部とすることが好ましい。絶縁性接着層２３に含まれるラジカル系硬化剤の量とカチオン系硬化剤の量との合計をこのような範囲とすることにより、アクリル樹脂とラジカル系硬化剤とによるラジカル硬化と、エポキシ樹脂とカチオン系硬化剤とによるカチオン硬化とが良好に生じて、より良好な接着力を付与することができる。   Moreover, in the anisotropic conductive film 21, it is preferable that the sum total of the quantity of the radical hardening agent contained in the insulating contact bonding layer 23 and the quantity of a cationic hardening agent shall be 12-17 mass parts. By setting the total of the amount of the radical curing agent and the amount of the cationic curing agent contained in the insulating adhesive layer 23 in such a range, radical curing with an acrylic resin and a radical curing agent, an epoxy resin, Cationic curing with the cationic curing agent is favorably generated, and better adhesive force can be imparted.

異方性導電フィルム２１は、導電性粒子含有層２２側に第２の電子部品１３が配置され、絶縁性接着層２３側に第１の電子部品１１が配置されることが好ましい。このように配置されていることにより、第１の電子部品１１側から圧着したときに導電性粒子２０の捕捉率を向上させることができる。   In the anisotropic conductive film 21, the second electronic component 13 is preferably disposed on the conductive particle-containing layer 22 side, and the first electronic component 11 is preferably disposed on the insulating adhesive layer 23 side. By being arranged in this way, the capture rate of the conductive particles 20 can be improved when the first electronic component 11 is pressure-bonded.

＜１−３−１．導電性粒子含有層＞
導電性粒子含有層２２は、上述したように、ラジカル系硬化剤と、アクリル樹脂と、エポキシ樹脂と、導電性粒子２０とを含有する。 <1-3-1. Conductive particle-containing layer>
As described above, the conductive particle-containing layer 22 contains a radical curing agent, an acrylic resin, an epoxy resin, and the conductive particles 20.

（ラジカル系硬化剤）
ラジカル系硬化剤は、特に限定されず、例えば、有機過酸化物を用いることができる。 (Radical curing agent)
A radical type hardening | curing agent is not specifically limited, For example, an organic peroxide can be used.

（アクリル樹脂）
アクリル樹脂は、特に限定されず、例えば、メチルアクリレート、エチルアクリレート、イソプロピルアクリレート、イソブチルアクリレート、エポキシアクリレート、エチレングリコールジアクリレート、ジエチレングリコールジアクリレート、トリメチロールプロパントリアクリレート、ジメチロールトリシクロデカンジアクリレート、テトラメチレングリコールテトラアクリレート、２−ヒドロキシ−１，３−ジアクリロキシプロパン、２，２−ビス[４−（アクリロキシメトキシ）フェニル]プロパン、２，２−ビス[４−（アクリロキシエトキシ）フェニル]プロパン、ジシクロペンテニルアクリレート、トリシクロデカニルアクリレート、トリス（アクリロキシエチル）イソシアヌレート、ウレタンアクリレートなどのアクリル樹脂を用いることができる。アクリル樹脂は、１種単独で使用してもよいし、２種以上を併用してもよい。 (acrylic resin)
The acrylic resin is not particularly limited. For example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylol propane triacrylate, dimethylol tricyclodecane diacrylate, tetra Methylene glycol tetraacrylate, 2-hydroxy-1,3-diacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxyethoxy) phenyl] Acrylic resins such as propane, dicyclopentenyl acrylate, tricyclodecanyl acrylate, tris (acryloxyethyl) isocyanurate, urethane acrylate Can be used. An acrylic resin may be used individually by 1 type, and may use 2 or more types together.

（エポキシ樹脂）
エポキシ樹脂は、特に限定されず、例えば、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ノボラック型エポキシ樹脂、これらの変性エポキシ樹脂などの熱硬化性エポキシ樹脂を用いることができる。エポキシ樹脂は、１種単独で使用してもよいし、２種以上を併用してもよい。 (Epoxy resin)
The epoxy resin is not particularly limited, and for example, thermosetting epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, and modified epoxy resins thereof can be used. An epoxy resin may be used individually by 1 type, and may use 2 or more types together.

（導電性粒子）
導電性粒子２０は、特に限定されず、公知の導電性粒子を用いることができる。例えば、ニッケル、鉄、銅、アルミニウム、錫、鉛、クロム、コバルト、銀、金等の各種金属や金属合金の粒子、金属酸化物、カーボン、グラファイト、ガラス、セラミック、プラスチック等の粒子の表面に金属をコートしたもの、これらの粒子の表面に更に絶縁薄膜をコートしたもの等が挙げられる。 (Conductive particles)
The electroconductive particle 20 is not specifically limited, A well-known electroconductive particle can be used. For example, on the surface of particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver and gold, particles of metal oxide, carbon, graphite, glass, ceramic, plastic, etc. The thing which coated the metal, the thing which coat | covered the insulating thin film further on the surface of these particle | grains, etc. are mentioned.

＜１−３−２．絶縁性接着層＞
絶縁性接着層２３は、上述したように、カチオン系硬化剤と、エポキシ樹脂と、アクリル樹脂と、ラジカル系硬化剤を含有する。 <1-3-2. Insulating adhesive layer>
As described above, the insulating adhesive layer 23 contains a cationic curing agent, an epoxy resin, an acrylic resin, and a radical curing agent.

（カチオン系硬化剤）
カチオン系硬化剤としては、特に限定されず、例えば、加熱により活性化する潜在性硬化剤、具体的には、スルホニウム塩、オニウム塩等を挙げることができ、これらの中でも、芳香族スルホニウム塩を用いることが好ましい。 (Cationic curing agent)
Examples of the cationic curing agent is not particularly limited, for example, latent curing agents activated by heating, specifically, scan sulfonium salts, there may be mentioned onium salts, among these, aromatic sulfonium salts Is preferably used.

（エポキシ樹脂）
エポキシ樹脂としては、特に限定されず、例えば、上述した導電性粒子含有層２２中のエポキシ樹脂と同様のものを用いることができる。 (Epoxy resin)
It does not specifically limit as an epoxy resin, For example, the thing similar to the epoxy resin in the electroconductive particle content layer 22 mentioned above can be used.

（アクリル樹脂）
アクリル樹脂としては、特に限定されず、例えば、上述した導電性粒子含有層２２中のアクリル樹脂と同様のものを用いることができる。 (acrylic resin)
The acrylic resin is not particularly limited, and for example, the same acrylic resin as that in the conductive particle-containing layer 22 described above can be used.

（ラジカル系硬化剤）
ラジカル系硬化剤としては、特に制限はなく、目的に応じて適宜選択することができ、例えば、上述した導電性粒子含有層２２中のラジカル系硬化剤と同様のものを用いることができる。 (Radical curing agent)
There is no restriction | limiting in particular as a radical type hardening | curing agent, According to the objective, it can select suitably, For example, the thing similar to the radical type hardening | curing agent in the electroconductive particle content layer 22 mentioned above can be used.

＜２．接続方法＞
図２に示す異方性導電フィルム２１を用いた接続構造体１の接続方法の一例について説明する。本実施の形態に係る接続方法では、異方性導電フィルム２１を介して、第１の電子部品１１と、第２の電子部品１３とを加熱しながら圧着して電気的に接続することにより、上述した接続構造体１が得られる。 <2. Connection method>
An example of the connection method of the connection structure 1 using the anisotropic conductive film 21 shown in FIG. 2 will be described. In the connection method according to the present embodiment, the first electronic component 11 and the second electronic component 13 are heated and bonded via the anisotropic conductive film 21 while being electrically connected, The connection structure 1 described above is obtained.

具体的には、本実施の形態に係る接続方法は、第２の電子部品１３の端子１２上に異方性導電フィルム２１の導電性粒子含有層２２側を仮貼する仮貼工程と、異方性導電フィルム２１の絶縁性接着層２３側に、第１の電子部品１１を仮配置する仮配置工程と、仮配置された第１の電子部品１１側から熱プレスを用いて押圧して圧着する圧着工程とを有する。   Specifically, the connection method according to the present embodiment is different from the temporary pasting step in which the conductive particle-containing layer 22 side of the anisotropic conductive film 21 is temporarily pasted on the terminal 12 of the second electronic component 13. Temporary placement step of temporarily placing the first electronic component 11 on the insulating adhesive layer 23 side of the isotropic conductive film 21, and pressing and crimping from the temporarily placed first electronic component 11 side using a hot press A crimping process.

仮貼工程では、例えば、図２に示す異方性導電フィルム２１の導電性粒子含有層２２が第２の電子部品１３側となるように、異方性導電フィルム２１を第２の電子部品１３に貼り付ける。   In the temporary pasting step, for example, the anisotropic conductive film 21 is attached to the second electronic component 13 such that the conductive particle-containing layer 22 of the anisotropic conductive film 21 shown in FIG. 2 is on the second electronic component 13 side. Paste to.

仮配置工程では、異方性導電フィルム２１から剥離層２４を剥がし、第１の電子部品１１が絶縁性接着層２３側から圧着されて、接続構造体１が形成される。   In the temporary placement step, the peeling layer 24 is peeled off from the anisotropic conductive film 21, and the first electronic component 11 is pressure-bonded from the insulating adhesive layer 23 side, whereby the connection structure 1 is formed.

圧着工程では、上述した異方性導電フィルム２１を介して、熱プレスを用いて、第１の電子部品１１と第２の電子部品１３とを加熱しながら圧着することにより、第１の電子部品１１の端子１０と、第２の電子部品１３の端子１２とを電気的に接続させる。   In the crimping process, the first electronic component 11 and the second electronic component 13 are heated and bonded through the anisotropic conductive film 21 described above while being heated, so that the first electronic component is heated. 11 terminals 10 and the terminals 12 of the second electronic component 13 are electrically connected.

ここで、第１の電子部品１１が極性基を有する化合物を含有する膜が形成されたフレキシブルプリント基板であり、第２の電子部品１３がアルカリガラス基板である場合には、圧着工程において、フレキシブルプリント基板から押圧して圧着することが好ましい。このようにフレキシブルプリント基板側から押圧することによって、熱プレス機とフレキシブルプリント基板とが接触して、導電性粒子含有層２２の樹脂が加熱されることにより、溶融粘度が低下して流動しやすくなる。これにより、端子１０と端子１２との間から樹脂を流出させて、導電性粒子含有層２２の導電性粒子２０を効率良く補捉することができる。   Here, when the first electronic component 11 is a flexible printed circuit board on which a film containing a compound having a polar group is formed, and the second electronic component 13 is an alkali glass substrate, the first electronic component 11 is flexible in the pressure-bonding step. It is preferable to press and press the printed circuit board. By pressing from the side of the flexible printed circuit board in this way, the hot press machine and the flexible printed circuit board come into contact with each other, and the resin of the conductive particle-containing layer 22 is heated, so that the melt viscosity is lowered and it is easy to flow. Become. Accordingly, the resin can flow out from between the terminal 10 and the terminal 12, and the conductive particles 20 of the conductive particle-containing layer 22 can be captured efficiently.

圧着工程における加熱の方法としては、トータル熱量により決定され、接続時間１０秒以下で接合を完了する場合は、加熱温度１２０℃〜２２０℃で行うことができる。圧着の方法としては、電子部品１１の種類によって異なり、例えば、フレキシブルプリント基板の場合には、圧力０．５〜２ＭＰａで、３〜１０秒間とすればよい。なお、超音波と熱とを併用して圧着を行うようにしてもよい。   The heating method in the crimping step is determined by the total amount of heat, and can be performed at a heating temperature of 120 ° C. to 220 ° C. when joining is completed in a connection time of 10 seconds or less. The method for pressure bonding varies depending on the type of the electronic component 11. For example, in the case of a flexible printed circuit board, the pressure may be 0.5 to 2 MPa and 3 to 10 seconds. Note that pressure bonding may be performed using ultrasonic waves and heat in combination.

＜３．他の実施の形態＞
上述した説明では、図１に示すように、絶縁性接着層２３は、第２の電子部品１３側に配置されたものとして説明したが、この例に限定されず、第１の電子部品１１側に配置するようにしてもよい。 <3. Other embodiments>
In the above description, as shown in FIG. 1, the insulating adhesive layer 23 has been described as being disposed on the second electronic component 13 side. However, the present invention is not limited to this example, and the first electronic component 11 side. You may make it arrange | position to.

また、異方性導電フィルム２１は、上述した材料以外の材料として、例えば、シランカップリング剤、界面活性剤などを含有してもよい。   Moreover, the anisotropic conductive film 21 may contain a silane coupling agent, surfactant, etc. as materials other than the material mentioned above, for example.

さらに、上述した接続方法の説明では、フィルム状の異方性導電フィルム２１を用いるものとしたが、この例に限定されず、例えば、ペースト状の異方性導電接着剤を用いるようにしてもよい。この場合には、例えば、上述した接続方法の仮貼工程において、導電性粒子含有層２２からなる接着材と、絶縁性接着層２３からなる接着材とを用いるようにすればよい。   Furthermore, in the description of the connection method described above, the film-like anisotropic conductive film 21 is used. However, the present invention is not limited to this example. For example, a paste-like anisotropic conductive adhesive may be used. Good. In this case, for example, in the temporary sticking step of the connection method described above, an adhesive made of the conductive particle-containing layer 22 and an adhesive made of the insulating adhesive layer 23 may be used.

以下、本発明の具体的な実施例について説明する。なお、下記のいずれかの実施例に本発明の範囲が限定されるものではない。   Hereinafter, specific examples of the present invention will be described. Note that the scope of the present invention is not limited to any of the following examples.

以下の例では、まず、製造例１〜製造例７において絶縁性接着層からなるシートを作製し、製造例８〜製造例１０において導電性粒子含有層からなるシートを作製した。また、実施例１〜実施例５及び比較例１〜比較例５では、製造例１〜製造例１０で得られたシートから作製した異方性導電フィルムを使用して接続構造体を作製した。さらに、実施例１〜実施例５及び比較例１〜比較例５で作製した接続構造体に関して、接着力及び導通抵抗について評価した。   In the following examples, first, sheets made of an insulating adhesive layer were produced in Production Examples 1 to 7, and sheets made of conductive particle-containing layers were produced in Production Examples 8 to 10. In Examples 1 to 5 and Comparative Examples 1 to 5, connection structures were prepared using anisotropic conductive films prepared from the sheets obtained in Production Examples 1 to 10. Furthermore, regarding the connection structures produced in Examples 1 to 5 and Comparative Examples 1 to 5, the adhesive strength and the conduction resistance were evaluated.

（製造例１）
製造例１では、フェノキシ樹脂（品名：ＹＰ−５０、新日鐵化学株式会社製）２５質量部、エポキシ樹脂（品名：ｊＥＲ８２８、三菱化学株式会社製）３０質量部、アクリル樹脂（品名：Ｍ１６００、東亜合成社製）２０質量部、アクリル樹脂（品名：Ｍ−３１５、東亜合成社製）１０質量部、シランカップリング剤（品名：Ａ−１８７、モメンティブ・パフォーマンス・マテリアルズ社製）２質量部、ラジカル系硬化剤（品名：パーロイルＬ、日本油脂社製）５質量部、カチオン系硬化剤（品名：ＳＩ−６０Ｌ、三新化学工業社製）７質量部で構成された接着剤から、厚み６μｍの絶縁性接着層からなるシートを作製した。 (Production Example 1)
In Production Example 1, 25 parts by mass of phenoxy resin (product name: YP-50, manufactured by Nippon Steel Chemical Co., Ltd.), 30 parts by mass of epoxy resin (product name: jER828, manufactured by Mitsubishi Chemical Corporation), acrylic resin (product name: M1600, 20 parts by mass of Toa Gosei Co., Ltd., 10 parts by mass of acrylic resin (product name: M-315, manufactured by Toa Gosei Co., Ltd.), 2 parts by mass of silane coupling agent (product name: A-187, manufactured by Momentive Performance Materials) From an adhesive composed of 5 parts by mass of a radical curing agent (product name: Parroyl L, manufactured by NOF Corporation) and 7 parts by mass of a cationic curing agent (product name: SI-60L, manufactured by Sanshin Chemical Industry Co., Ltd.), the thickness A sheet composed of a 6 μm insulating adhesive layer was prepared.

（製造例２）
製造例２では、製造例１において、カチオン系硬化剤の添加量を７質量部から９質量部に変更したこと以外は、製造例１と同様にして、絶縁性接着層からなるシートを作製した。 (Production Example 2)
In Production Example 2, a sheet made of an insulating adhesive layer was produced in the same manner as in Production Example 1 except that the addition amount of the cationic curing agent was changed from 7 parts by mass to 9 parts by mass in Production Example 1. .

（製造例３）
製造例３では、製造例１において、ラジカル系硬化剤の添加量を５質量部から６質量部に変更し、また、カチオン系硬化剤の添加量を７質量部から８質量部に変更したこと以外は、製造例１と同様にして、絶縁性接着層からなるシートを作製した。 (Production Example 3)
In Production Example 3, the addition amount of the radical curing agent in Production Example 1 was changed from 5 parts by mass to 6 parts by mass, and the addition amount of the cationic curing agent was changed from 7 parts by mass to 8 parts by mass. Except for the above, a sheet made of an insulating adhesive layer was produced in the same manner as in Production Example 1.

（製造例４）
製造例４では、製造例１において、ラジカル系硬化剤の添加量を５質量部から８質量部に変更したこと以外は、製造例１と同様にして、絶縁性接着層からなるシートを作製した。 (Production Example 4)
In Production Example 4, a sheet made of an insulating adhesive layer was produced in the same manner as in Production Example 1 except that the addition amount of the radical curing agent was changed from 5 parts by mass to 8 parts by mass in Production Example 1. .

（製造例５）
製造例５では、製造例１において、ラジカル系硬化剤の添加量を５質量部から８質量部に変更し、また、カチオン系硬化剤の添加量を７質量部から９質量部に変更したこと以外は、製造例１と同様にして、絶縁性接着層からなるシートを作製した。 (Production Example 5)
In Production Example 5, in Production Example 1, the addition amount of the radical curing agent was changed from 5 parts by mass to 8 parts by mass, and the addition amount of the cationic curing agent was changed from 7 parts by mass to 9 parts by mass. Except for the above, a sheet made of an insulating adhesive layer was produced in the same manner as in Production Example 1.

（製造例６）
製造例６では、製造例１において、ラジカル系硬化剤の添加量を５質量部から６質量部に変更し、また、カチオン系硬化剤を添加しなかったこと以外は、製造例１と同様にして、絶縁性接着層からなるシートを作製した。 (Production Example 6)
Production Example 6 was the same as Production Example 1 except that the amount of radical curing agent added in Production Example 1 was changed from 5 parts by mass to 6 parts by mass, and that no cationic curing agent was added. Thus, a sheet made of an insulating adhesive layer was produced.

（製造例７）
製造例７では、製造例１において、アクリル樹脂と、ラジカル系硬化剤とを添加せず、カチオン系硬化剤の添加量を７質量部から８質量部に変更したこと以外は、製造例１と同様にして、絶縁性接着層からなるシートを作製した。 (Production Example 7)
In Production Example 7, Production Example 1 is the same as Production Example 1 except that the acrylic resin and the radical curing agent are not added, and the addition amount of the cationic curing agent is changed from 7 parts by mass to 8 parts by mass. Similarly, a sheet made of an insulating adhesive layer was produced.

（製造例８）
製造例８では、フェノキシ樹脂（品名：ＹＰ−５０、新日鐵化学株式会社製）２５質量部、エポキシ樹脂（品名：ｊＥＲ８２８、三菱化学株式会社製）３０質量部、アクリル樹脂（品名：Ｍ１６００）、東亜合成社製）２０質量部、アクリル樹脂（品名：Ｍ−３１５、東亜合成社製）１０質量部、シランカップリング剤（品名：Ａ−１８７、モメンティブ・パフォーマンス・マテリアルズ社製）２質量部、ラジカル系硬化剤（品名：パーロイルＬ、日本油脂社製）６質量部、導電粒子で構成された接着剤中に、粒径１０μｍの導電性粒子（Ｎｉ／Ａｕメッキアクリル樹脂粒子、日本化学工業社製）３質量部を分散させて、厚み１０μｍの導電性粒子含有層からなるシートを作製した。 (Production Example 8)
In Production Example 8, 25 parts by mass of phenoxy resin (product name: YP-50, manufactured by Nippon Steel Chemical Co., Ltd.), 30 parts by mass of epoxy resin (product name: jER828, manufactured by Mitsubishi Chemical Corporation), acrylic resin (product name: M1600) 20 parts by mass, manufactured by Toa Gosei Co., Ltd., 10 parts by mass of acrylic resin (product name: M-315, manufactured by Toa Gosei Co., Ltd.), 2 masses of silane coupling agent (product name: A-187, manufactured by Momentive Performance Materials) Part, radical curing agent (product name: Parroyl L, manufactured by Nippon Oil & Fats Co., Ltd.), conductive particles (Ni / Au plated acrylic resin particles, Nippon Chemical Co., Ltd.) with an adhesive composed of conductive particles. A sheet made of a conductive particle-containing layer having a thickness of 10 μm was prepared by dispersing 3 parts by mass of Kogyo Co., Ltd.).

（製造例９）
製造例９では、製造例８において、アクリル樹脂とラジカル系硬化剤とを添加せず、また、カチオン系硬化剤（品名：ＳＩ−６０Ｌ、三新化学工業社製）８質量部を添加したこと以外は、製造例１と同様にして、導電性粒子含有層からなるシートを作製した。 (Production Example 9)
In Production Example 9, an acrylic resin and a radical curing agent were not added in Production Example 8, and 8 parts by mass of a cationic curing agent (product name: SI-60L, manufactured by Sanshin Chemical Industry Co., Ltd.) was added. Except for the above, a sheet made of a conductive particle-containing layer was produced in the same manner as in Production Example 1.

（製造例１０）
製造例１０では、製造例８において、カチオン系硬化剤（品名：ＳＩ−６０Ｌ、三新化学工業社製）８質量部を添加したこと以外は、製造例１と同様にして、導電性粒子含有層からなるシートを作製した。 (Production Example 10)
In Production Example 10, in the same manner as in Production Example 1 except that 8 parts by mass of a cationic curing agent (product name: SI-60L, manufactured by Sanshin Chemical Industry Co., Ltd.) was added in Production Example 8, containing conductive particles. A sheet composed of layers was prepared.

製造例１〜製造例１０の作製条件をまとめたものを以下の表１に示す。   Table 1 below summarizes the production conditions of Production Examples 1 to 10.

Figure 0005690637
Figure 0005690637

（実施例１）
実施例１では、製造例１で作製した絶縁性接着層からなるシートと、製造例８で作製した導電性粒子含有層からなるシートとを積層した２層構造の異方性導電フィルムを介して、キノン基を有する化合物を含有する膜が形成されたフレキシブルプリント基板（寸法：４３０ｍｍ×１５０ｍｍ、厚さ：９０μｍ）と、ＩＴＯガラス基板（アルカリガラス基板）寸法：１５ｍｍ×８０ｍｍ×１．１ｍｍ、面抵抗値：１０Ω／□）との接続を行い、接続構造体を作製した。 Example 1
In Example 1, through the anisotropic conductive film having a two-layer structure in which the sheet made of the insulating adhesive layer produced in Production Example 1 and the sheet made of the conductive particle-containing layer produced in Production Example 8 were laminated. A flexible printed circuit board (dimensions: 430 mm × 150 mm, thickness: 90 μm) on which a film containing a compound having a quinone group is formed, and an ITO glass substrate (alkali glass substrate) dimensions: 15 mm × 80 mm × 1.1 mm, surface Resistance value: 10Ω / □) to make a connection structure.

具体的には、キノン基を有する化合物を含有する膜が形成されたフレキシブルプリント基板側に絶縁性接着層からなるシートを貼り付け、ＩＴＯガラス基板側に導電性粒子含有層からなるシートを貼り付けた。また、フレキシブルプリント基板と、ＩＴＯガラス基板との接続は、加熱ツールを用いて、１３０℃又は１７０℃、１ＭＰａ、１０秒間で行った。   Specifically, a sheet made of an insulating adhesive layer is attached to the flexible printed circuit board side on which a film containing a compound having a quinone group is formed, and a sheet made of a conductive particle-containing layer is attached to the ITO glass board side. It was. Moreover, the connection between the flexible printed board and the ITO glass board was performed at 130 ° C. or 170 ° C., 1 MPa, 10 seconds using a heating tool.

（実施例２）
実施例２では、実施例１において、絶縁性接着層からなるシートを、製造例２で作製した絶縁性接着層からなるシートに代えたこと以外は、実施例１と同様にして、接続構造体を作製した。 (Example 2)
In Example 2, a connection structure was obtained in the same manner as in Example 1 except that the sheet made of the insulating adhesive layer in Example 1 was replaced with the sheet made of the insulating adhesive layer produced in Production Example 2. Was made.

（実施例３）
実施例３では、実施例１において、絶縁性接着層からなるシートを、製造例３で作製した絶縁性接着層からなるシートに代えたこと以外は、実施例１と同様にして、接続構造体を作製した。 (Example 3)
In Example 3, a connection structure was obtained in the same manner as in Example 1 except that the sheet made of the insulating adhesive layer in Example 1 was replaced with the sheet made of the insulating adhesive layer produced in Production Example 3. Was made.

（実施例４）
実施例４では、実施例１において、絶縁性接着層からなるシートを、製造例４で作製した絶縁性接着層からなるシートに代えたこと以外は、実施例１と同様にして、接続構造体を作製した。 Example 4
In Example 4, a connection structure was obtained in the same manner as in Example 1 except that the sheet made of the insulating adhesive layer in Example 1 was replaced with the sheet made of the insulating adhesive layer produced in Production Example 4. Was made.

（実施例５）
実施例５では、実施例１において、絶縁性接着層からなるシートを、製造例５で作製した絶縁性接着層からなるシートに代えたこと以外は、実施例１と同様にして、接続構造体を作製した。 (Example 5)
In Example 5, the connection structure was obtained in the same manner as in Example 1 except that the sheet made of the insulating adhesive layer in Example 1 was replaced with the sheet made of the insulating adhesive layer produced in Production Example 5. Was made.

（比較例１）
比較例１では、実施例１において、絶縁性接着層からなるシートを、製造例６で作製した絶縁性接着層からなるシートに代え、また、導電性粒子含有層からなるシートを、製造例９で作製した導電性粒子含有層からなるシートに代えたこと以外は、実施例１と同様にして、接続構造体を作製した。 (Comparative Example 1)
In Comparative Example 1, the sheet made of the insulating adhesive layer in Example 1 is replaced with the sheet made of the insulating adhesive layer produced in Production Example 6, and the sheet made of the conductive particle-containing layer is made in Production Example 9 A connection structure was produced in the same manner as in Example 1 except that the sheet was made of the conductive particle-containing layer produced in step 1 above.

（比較例２）
比較例２では、実施例１において、絶縁性接着層からなるシートを、製造例７で作製した絶縁性接着層からなるシートに代えたこと以外は、実施例１と同様にして、接続構造体を作製した。 (Comparative Example 2)
In Comparative Example 2, a connection structure was obtained in the same manner as in Example 1 except that the sheet made of the insulating adhesive layer in Example 1 was replaced with the sheet made of the insulating adhesive layer produced in Production Example 7. Was made.

（比較例３）
比較例３では、製造例９で作製した導電性粒子含有層からなるシートのみを使用したこと以外は、実施例１と同様にして、接続構造体を作製した。 (Comparative Example 3)
In Comparative Example 3, a connection structure was produced in the same manner as in Example 1 except that only the sheet composed of the conductive particle-containing layer produced in Production Example 9 was used.

（比較例４）
比較例４では、製造例８で作製した導電性粒子含有層からなるシートのみを使用したこと以外は、実施例１と同様にして、接続構造体を作製した。 (Comparative Example 4)
In Comparative Example 4, a connection structure was produced in the same manner as in Example 1 except that only the sheet composed of the conductive particle-containing layer produced in Production Example 8 was used.

（比較例５）
比較例５では、製造例１０で作製した導電性粒子含有層からなるシートのみを使用したこと以外は、実施例１と同様にして、接続構造体を作製した。 (Comparative Example 5)
In Comparative Example 5, a connection structure was produced in the same manner as in Example 1 except that only the sheet composed of the conductive particle-containing layer produced in Production Example 10 was used.

実施例１〜実施例５及び比較例１〜比較例５の製造条件についてまとめたものを以下の表２に示す。   Table 2 below summarizes the manufacturing conditions of Examples 1 to 5 and Comparative Examples 1 to 5.

Figure 0005690637
Figure 0005690637

＜導通抵抗試験＞
実施例１〜実施例５及び比較例１〜比較例５で作製した接続構造体について、初期（Initial）の抵抗と、温度６０℃、湿度９５％ＲＨ、２５０時間のＴＨテスト（Thermal Humidity Test）後の抵抗を測定した。測定は、デジタルマルチメーター（デジタルマルチメーター７５６１、横河電機社製）を用いて４端子法にて電流１ｍＡを流したときの接続抵抗を測定した。表２に示す導通抵抗試験の評価において、接続抵抗が５Ω未満のものを「○」、接続抵抗が５Ω以上２０Ω未満のものを「△」、接続抵抗が２０Ω以上のものを「×」とした。 <Conduction resistance test>
About the connection structure produced in Example 1 to Example 5 and Comparative Example 1 to Comparative Example 5, the initial resistance and the TH test (Thermal Humidity Test) at a temperature of 60 ° C., a humidity of 95% RH, and 250 hours Later resistance was measured. The measurement was performed using a digital multimeter (digital multimeter 7561, manufactured by Yokogawa Electric Corporation) to measure the connection resistance when a current of 1 mA was passed by the four-terminal method. In the evaluation of the continuity resistance test shown in Table 2, “◯” indicates that the connection resistance is less than 5Ω, “△” indicates that the connection resistance is 5Ω or more and less than 20Ω, and “×” indicates that the connection resistance is 20Ω or more. .

＜接着強度試験＞
実施例１〜実施例５及び比較例１〜比較例５で作製した接続構造体について、引張強度５０ｃｍ／ｍｉｎで９０℃方向に剥離したときの剥離強度（Ｎ／ｃｍ）を、剥離強度試験機（テンシロン、オリエンテック社製）を用いて測定した。表２に示す接着強度試験の評価において、接着強度が７Ｎ／ｃｍ以上のものを「○」、接着強度が４Ｎ／ｃｍ以上７Ｎ／ｃｍ未満のものを「△」、接着強度が４Ｎ／ｃｍ未満のものを「×」とした。 <Adhesive strength test>
For the connection structures produced in Examples 1 to 5 and Comparative Examples 1 to 5, the peel strength (N / cm) when peeled in the 90 ° C. direction at a tensile strength of 50 cm / min was measured using a peel strength tester. (Tensilon, manufactured by Orientec Co., Ltd.). In the evaluation of the adhesive strength test shown in Table 2, when the adhesive strength is 7 N / cm or more, “◯”, when the adhesive strength is 4 N / cm or more and less than 7 N / cm, “△”, and the adhesive strength is less than 4 N / cm The thing of "x" was made.

実施例１〜実施例５では、カチオン系硬化剤とエポキシ樹脂とアクリル樹脂とラジカル系硬化剤とを含有する絶縁性接着層と、ラジカル系硬化剤とアクリル樹脂とエポキシ樹脂と導電性粒子とを含有する導電性粒子含有層とを有する異方性導電フィルムを用いたため、導通抵抗試験及び接着強度試験の結果が良好であった。すなわち、実施例１〜実施例５では、極性基を有する化合物を含有するフレキシブルプリント基板と、アルカリガラス基板とを、低温短時間で接続することができた。また、極性基を有する化合物を含有するフレキシブルプリント基板と、アルカリガラス基板とを良好な接着力で接続することができた。さらに、導通抵抗試験後において、良好な導通信頼性が得られた。   In Examples 1 to 5, an insulating adhesive layer containing a cationic curing agent, an epoxy resin, an acrylic resin, and a radical curing agent, a radical curing agent, an acrylic resin, an epoxy resin, and conductive particles. Since an anisotropic conductive film having a conductive particle-containing layer was used, the results of the conduction resistance test and the adhesive strength test were good. That is, in Example 1 to Example 5, the flexible printed circuit board containing the compound having a polar group and the alkali glass substrate could be connected at a low temperature in a short time. Moreover, the flexible printed circuit board containing the compound which has a polar group, and the alkali glass substrate were able to be connected with favorable adhesive force. Furthermore, good conduction reliability was obtained after the conduction resistance test.

比較例１では、異方性導電フィルムの絶縁性接着層にカチオン系硬化剤が含有されておらず、また、導電性粒子含有層にアクリル樹脂とラジカル系硬化剤とが含有されていないため、１３０℃における接着強度試験の結果が良好でなく、１７０℃における接着強度試験の結果がやや良好でなかった。また、比較例１では、導通抵抗試験の結果が良好ではなかった。   In Comparative Example 1, a cationic curing agent is not contained in the insulating adhesive layer of the anisotropic conductive film, and an acrylic resin and a radical curing agent are not contained in the conductive particle-containing layer. The result of the adhesive strength test at 130 ° C. was not good, and the result of the adhesive strength test at 170 ° C. was slightly good. In Comparative Example 1, the result of the conduction resistance test was not good.

比較例２では、異方性導電フィルムの絶縁性接着層にアクリル樹脂とラジカル系硬化剤とが含有されていないため、１３０℃における接着強度試験の結果が良好でなかった。また、比較例２では、導通抵抗試験の結果がやや良好ではなかった。 In Comparative Example 2, since the acrylic resin and the radical curing agent were not contained in the insulating adhesive layer of the anisotropic conductive film, the result of the adhesive strength test at 130 ° C. was not good. Moreover, in the comparative example 2, the result of the conduction resistance test was not so good.

比較例３では、異方性導電フィルムの絶縁性接着層が含有されておらず、また、導電性粒子含有層にアクリル樹脂とラジカル系硬化剤とが含有されていないため、１３０℃における接着強度試験の結果が良好でなく、１７０℃における接着強度試験の結果がやや良好でなかった。また、比較例３では、導通抵抗試験の結果が良好ではなかった。   In Comparative Example 3, the insulating adhesive layer of the anisotropic conductive film is not contained, and the acrylic resin and the radical curing agent are not contained in the conductive particle-containing layer. The result of the test was not good, and the result of the adhesive strength test at 170 ° C. was slightly good. Further, in Comparative Example 3, the result of the conduction resistance test was not good.

比較例４では、異方性導電フィルムの絶縁性接着層が含有されておらず、また、導電性粒子含有層にカチオン系硬化剤が含有されていないため、１３０℃における接着強度試験の結果が良好でなかった。   In Comparative Example 4, the insulating adhesive layer of the anisotropic conductive film was not contained, and the cationic particle-containing agent was not contained in the conductive particle-containing layer. It was not good.

比較例５では、異方性導電フィルムの絶縁性接着層が含有されていないため、１３０℃における接着強度試験の結果がやや良好でなく、１７０℃における接着強度試験の結果がやや良好でなく、導通抵抗試験の結果がやや良好ではなかった。   In Comparative Example 5, since the insulating adhesive layer of the anisotropic conductive film is not contained, the result of the adhesive strength test at 130 ° C. is somewhat not good, and the result of the adhesive strength test at 170 ° C. is somewhat not good, The result of the continuity resistance test was not good.

１ 接続構造体、１０ 端子、１１ 第１の電子部品、１２ 端子、１３ 第２の電子部品、２０ 導電性粒子、２１ 異方性導電フィルム、２２ 第１の層（導電性粒子含有層）、２３ 第２の層（絶縁性接着層）、２４ 剥離層 DESCRIPTION OF SYMBOLS 1 Connection structure, 10 terminal, 11 1st electronic component, 12 terminal, 13 2nd electronic component, 20 electroconductive particle, 21 anisotropic conductive film, 22 1st layer (electroconductive particle content layer), 23 Second layer (insulating adhesive layer), 24 release layer

Claims (7)

端子が形成された第１の電子部品と、端子が形成された第２の電子部品とを電気的に接続する異方性導電フィルムにおいて、
ラジカル系硬化剤と、アクリル樹脂と、エポキシ樹脂とを含有する第１の層と、
カチオン系硬化剤と、エポキシ樹脂と、アクリル樹脂と、ラジカル系硬化剤とを含有する第２の層とを有し、
前記第１の層又は前記第２の層は、導電性粒子をさらに含有し、
前記第１の電子部品としての極性基を有する化合物を含有する膜が形成されたフレキシブルプリント基板と、前記第２の電子部品としてのアルカリガラス基板とを電気的に接続する異方性導電フィルム。 In the anisotropic conductive film that electrically connects the first electronic component in which the terminal is formed and the second electronic component in which the terminal is formed,
A first layer containing a radical curing agent, an acrylic resin, and an epoxy resin;
A second layer containing a cationic curing agent, an epoxy resin, an acrylic resin, and a radical curing agent;
The first layer or the second layer further contains conductive particles ,
An anisotropic conductive film for electrically connecting a flexible printed circuit board on which a film containing a compound having a polar group as the first electronic component is formed and an alkali glass substrate as the second electronic component . 前記第２の層に含まれるラジカル系硬化剤とカチオン系硬化剤との合計が、１２〜１７質量部である請求項１記載の異方性導電フィルム。 Total, the anisotropic conductive film according to claim 1, wherein 12 to 17 parts by weight of a radical curing agent and a cationic curing agent contained in the second layer. 前記第２の層に含まれるラジカル系硬化剤とカチオン系硬化剤との質量比（〔ラジカル系硬化剤〕／〔カチオン系硬化剤〕）が、０．５〜１．２である請求項１又は２記載の異方性導電フィルム。 The mass ratio of the radical curing agent and a cationic curing agent contained in the second layer ([Radical curing agent] / [cationic curing agent]) is, according to claim 1 is 0.5 to 1.2 Or the anisotropic conductive film of 2. 異方性導電フィルムを介して、端子が形成された第１の電子部品と、端子が形成された第２の電子部品とを加熱しながら圧着して電気的に接続する圧着工程を有し、
前記異方性導電フィルムは、
ラジカル系硬化剤と、アクリル樹脂と、エポキシ樹脂とを含有する第１の層と、
カチオン系硬化剤と、エポキシ樹脂と、アクリル樹脂と、ラジカル系硬化剤とを含有する第２の層とを有し、
前記第１の層又は前記第２の層が、導電性粒子をさらに含有し、
前記第１の電子部品としての極性基を有する化合物を含有する膜が形成されたフレキシブルプリント基板と、前記第２の電子部品としてのアルカリガラス基板とを電気的に接続する接続方法。 There is a crimping step in which the first electronic component with the terminal formed thereon and the second electronic component with the terminal formed are crimped and electrically connected to each other through the anisotropic conductive film,
The anisotropic conductive film is
A first layer containing a radical curing agent, an acrylic resin, and an epoxy resin;
A second layer containing a cationic curing agent, an epoxy resin, an acrylic resin, and a radical curing agent;
The first layer or the second layer further contains conductive particles ,
A connection method for electrically connecting a flexible printed circuit board on which a film containing a compound having a polar group as the first electronic component is formed and an alkali glass substrate as the second electronic component . 前記第２の電子部品の端子上に前記異方性導電フィルムの第１の層側を仮貼する仮貼工程と、
前記異方性導電フィルムの第２の層側に、前記第１の電子部品を仮配置する仮配置工程とを有し、
前記圧着工程では、前記仮配置工程で仮配置された前記第１の電子部品側から熱プレスを用いて押圧する請求項４記載の接続方法。 A temporary sticking step of the first layer side bonded provisionally before Symbol the anisotropic conductive film on the second terminals of the electronic component,
A temporary placement step of temporarily placing the first electronic component on the second layer side of the anisotropic conductive film;
The connection method according to claim 4 , wherein in the crimping step, pressing is performed from the first electronic component side temporarily placed in the temporary placement step using a hot press. 接着剤を介して、端子が形成された第１の電子部品と、端子が形成された第２の電子部品とを加熱しながら圧着して電気的に接続する圧着工程を有し、
前記接着材は、
ラジカル系硬化剤と、アクリル樹脂と、エポキシ樹脂とを含有する第１の接着剤と、
カチオン系硬化剤と、エポキシ樹脂と、アクリル樹脂と、ラジカル系硬化剤とを含有する第２の接着剤とからなり、
前記第１の接着剤又は前記第２の接着剤が、導電性粒子をさらに含有し、
前記第１の電子部品としての極性基を有する化合物を含有する膜が形成されたフレキシブルプリント基板と、前記第２の電子部品としてのアルカリガラス基板とを電気的に接続する接続方法。 There is a crimping step of crimping and electrically connecting the first electronic component on which the terminal is formed and the second electronic component on which the terminal is formed via an adhesive,
The adhesive is
A first adhesive containing a radical curing agent, an acrylic resin, and an epoxy resin;
A second adhesive containing a cationic curing agent, an epoxy resin, an acrylic resin, and a radical curing agent;
The first adhesive or the second adhesive further contains conductive particles ,
A connection method for electrically connecting a flexible printed circuit board on which a film containing a compound having a polar group as the first electronic component is formed and an alkali glass substrate as the second electronic component . 異方性導電フィルムを介して、端子が形成された第１の電子部品と、端子が形成された第２の電子部品とを加熱しながら圧着することにより、該第１の電子部品と該第２の電子部品とが電気的に接続された接続構造体において、
前記異方性導電フィルムは、
ラジカル系硬化剤と、アクリル樹脂と、エポキシ樹脂とを含有する第１の層と、
カチオン系硬化剤と、エポキシ樹脂と、アクリル樹脂と、ラジカル系硬化剤とを含有す
る第２の層とを有し、
前記第１の層又は前記第２の層が、導電性粒子をさらに含有し、
前記第１の電子部品は、極性基を有する化合物を含有する膜が形成されたフレキシブルプリント基板であり、前記第２の電子部品は、アルカリガラス基板である接続構造体。 The first electronic component and the second electronic component on which the terminal is formed are bonded to the first electronic component and the second electronic component on which the terminal is formed through an anisotropic conductive film while heating. In the connection structure in which the two electronic components are electrically connected,
The anisotropic conductive film is
A first layer containing a radical curing agent, an acrylic resin, and an epoxy resin;
A second layer containing a cationic curing agent, an epoxy resin, an acrylic resin, and a radical curing agent;
The first layer or the second layer further contains conductive particles ,
The first electronic component is a flexible printed circuit board on which a film containing a compound having a polar group is formed, and the second electronic component is an alkali glass substrate .
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