TWI628072B - 沖壓裝置、真空框及沖壓成形方法 - Google Patents

沖壓裝置、真空框及沖壓成形方法 Download PDF

Info

Publication number: TWI628072B
Authority: TW; Taiwan
Prior art keywords: diaphragm; hot plate; chamber; air pressure; workpiece
Prior art date: 2013-05-20

Application number

TW102143417A

Other languages

English (en)

Chinese (zh)

Other versions

TW201444673A (zh

Inventor

岡崎靜明

則清功夫

弓戶良次

Original Assignee

北川精機股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2013-05-20

Filing date

2013-11-28

Publication date

2018-07-01

2013-11-28 Application filed by 北川精機股份有限公司 filed Critical 北川精機股份有限公司

2014-12-01 Publication of TW201444673A publication Critical patent/TW201444673A/zh

2018-07-01 Application granted granted Critical

2018-07-01 Publication of TWI628072B publication Critical patent/TWI628072B/zh

Links

238000000034 method Methods 0.000 title claims abstract description 19
238000010438 heat treatment Methods 0.000 claims abstract description 18
230000008569 process Effects 0.000 claims abstract description 8
238000003825 pressing Methods 0.000 claims abstract description 6
238000003475 lamination Methods 0.000 claims description 20
238000012545 processing Methods 0.000 claims description 14
230000002093 peripheral effect Effects 0.000 claims description 11
238000013022 venting Methods 0.000 claims description 5
239000000463 material Substances 0.000 claims description 4
239000012528 membrane Substances 0.000 claims description 4
230000005855 radiation Effects 0.000 claims description 3
238000004080 punching Methods 0.000 claims description 2
239000000470 constituent Substances 0.000 claims 2
230000000149 penetrating effect Effects 0.000 claims 2
230000007246 mechanism Effects 0.000 description 17
239000007789 gas Substances 0.000 description 11
238000010030 laminating Methods 0.000 description 10
238000010586 diagram Methods 0.000 description 9
229920005989 resin Polymers 0.000 description 9
239000011347 resin Substances 0.000 description 9
229920005992 thermoplastic resin Polymers 0.000 description 4
230000006866 deterioration Effects 0.000 description 3
230000001681 protective effect Effects 0.000 description 3
229920001187 thermosetting polymer Polymers 0.000 description 3
IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
239000005038 ethylene vinyl acetate Substances 0.000 description 2
230000009477 glass transition Effects 0.000 description 2
239000010720 hydraulic oil Substances 0.000 description 2
239000011261 inert gas Substances 0.000 description 2
238000005304 joining Methods 0.000 description 2
229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
230000009471 action Effects 0.000 description 1
238000004891 communication Methods 0.000 description 1
238000010276 construction Methods 0.000 description 1
238000013036 cure process Methods 0.000 description 1
230000006378 damage Effects 0.000 description 1
238000007599 discharging Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
229940044949 eucalyptus oil Drugs 0.000 description 1
239000010642 eucalyptus oil Substances 0.000 description 1
238000007667 floating Methods 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
229910052757 nitrogen Inorganic materials 0.000 description 1
239000003921 oil Substances 0.000 description 1
230000008520 organization Effects 0.000 description 1
238000005192 partition Methods 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
229920001296 polysiloxane Polymers 0.000 description 1
239000003566 sealing material Substances 0.000 description 1
230000000087 stabilizing effect Effects 0.000 description 1
229920003051 synthetic elastomer Polymers 0.000 description 1
239000005061 synthetic rubber Substances 0.000 description 1
230000003685 thermal hair damage Effects 0.000 description 1
238000009423 ventilation Methods 0.000 description 1
238000003466 welding Methods 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
- B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B7/00—Presses characterised by a particular arrangement of the pressing members
- B30B7/02—Presses characterised by a particular arrangement of the pressing members having several platens arranged one above the other
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy

Landscapes

Physics & Mathematics (AREA)
Fluid Mechanics (AREA)
Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Electromagnetism (AREA)
Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Press Drives And Press Lines (AREA)
Manufacturing & Machinery (AREA)
Lining Or Joining Of Plastics Or The Like (AREA)

TW102143417A 2013-05-20 2013-11-28 沖壓裝置、真空框及沖壓成形方法 TWI628072B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2013105986		2013-05-20
JP2013-105986		2013-05-20

Publications (2)

Publication Number	Publication Date
TW201444673A TW201444673A (zh)	2014-12-01
TWI628072B true TWI628072B (zh)	2018-07-01

Family

ID=51933198

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW102143417A TWI628072B (zh)	2013-05-20	2013-11-28	沖壓裝置、真空框及沖壓成形方法

Country Status (4)

Country	Link
JP (1)	JP6211074B2 (ja)
KR (1)	KR101737604B1 (ja)
TW (1)	TWI628072B (ja)
WO (1)	WO2014188619A1 (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP6365321B2 (ja) *	2015-01-21	2018-08-01	株式会社豊田自動織機	太陽電池モジュールの製造方法
KR102494018B1 (ko) *	2015-10-13	2023-02-01	삼성디스플레이 주식회사	라미네이션 장치 및 이를 이용한 라미네이션 방법
KR101911405B1 (ko) *	2016-09-30	2018-10-24	연세대학교 산학협력단	Mpf 기반 비정형 외장패널 3d 프린팅 시스템 및 방법
CN106976297B (zh) *	2017-03-01	2018-11-30	浙江尚越新能源开发有限公司	柔性太阳能电池组件热压装置
EP3587093A1 (en) *	2018-06-28	2020-01-01	Essilor International	Device and method for forming a functional film intended to be laminated on an optical article
FR3083155B1 (fr) *	2018-06-29	2020-12-18	Roset Sas	Presse pour le collage d'une housse sur une structure de mobilier utilisant une depression
KR102518624B1 (ko) *	2018-12-03	2023-04-10	엔트리움 주식회사	연성인쇄회로기판 제조용 핫프레스 장치
JP7272640B2 (ja) *	2019-04-26	2023-05-12	新光エンジニアリング株式会社	ワーク装着装置及びワーク貼合システム
CN110676335B (zh) *	2019-10-01	2022-02-01	秦皇岛博硕光电设备股份有限公司	光伏组件热压固化方法及热压固化所用的压制设备
CN111438974A (zh) *	2020-04-01	2020-07-24	洛阳广盈机械设备有限公司	一种移出式自升降多层负压制板装置
CN111688326A (zh) *	2020-07-18	2020-09-22	常州富工机械设备有限公司	层压***及其层压工艺
CN115384046A (zh) *	2021-05-24	2022-11-25	深圳市易天自动化设备股份有限公司	一种大尺寸面板加压加热脱泡平台
KR102372464B1 (ko) *	2021-06-23	2022-03-10	에너진(주)	가압상태에서 가열과 냉각이 가능한 등방압 프레스장치, 및 이를 이용한 가압성형방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS63276542A (ja) *	1987-05-08	1988-11-14	Nippon Sheet Glass Co Ltd	積層接着装置
JP2001102614A (ja) *	1999-09-28	2001-04-13	Mitsubishi Heavy Ind Ltd	太陽電池パネルの製造方法
JP2012030381A (ja) *	2010-07-28	2012-02-16	Npc Inc	ラミネート装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN102627017A (zh) *	2009-09-10	2012-08-08	北川精机株式会社	层压装置、载体板、层压加工***和层压方法
JP2012196835A (ja)	2011-03-18	2012-10-18	Showa Shell Sekiyu Kk	ラミネート装置及びこれを用いた太陽電池モジュールの製造方法

2013
- 2013-11-25 WO PCT/JP2013/081609 patent/WO2014188619A1/ja active Application Filing
- 2013-11-25 JP JP2015518039A patent/JP6211074B2/ja active Active
- 2013-11-25 KR KR1020157035031A patent/KR101737604B1/ko active IP Right Grant
- 2013-11-28 TW TW102143417A patent/TWI628072B/zh active

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS63276542A (ja) *	1987-05-08	1988-11-14	Nippon Sheet Glass Co Ltd	積層接着装置
JP2001102614A (ja) *	1999-09-28	2001-04-13	Mitsubishi Heavy Ind Ltd	太陽電池パネルの製造方法
JP2012030381A (ja) *	2010-07-28	2012-02-16	Npc Inc	ラミネート装置

Also Published As

Publication number	Publication date
KR20160006223A (ko)	2016-01-18
JP6211074B2 (ja)	2017-10-11
TW201444673A (zh)	2014-12-01
KR101737604B1 (ko)	2017-05-18
WO2014188619A1 (ja)	2014-11-27
JPWO2014188619A1 (ja)	2017-02-23

Publication	Publication Date	Title
TWI628072B (zh)	2018-07-01	沖壓裝置、真空框及沖壓成形方法
US5108532A (en)	1992-04-28	Method and apparatus for shaping, forming, consolidating and co-consolidating thermoplastic or thermosetting composite products
JP5438121B2 (ja)	2014-03-12	キュア処理装置及びラミネート加工システム
JP4491049B1 (ja)	2010-06-30	熱板加熱による熱成形装置および熱成形方法
WO2014021198A1 (ja)	2014-02-06	基板貼合装置及び貼合方法
US20120273126A1 (en)	2012-11-01	System and method for laminating modules
WO2015166889A1 (ja)	2015-11-05	熱成形装置
US20100243147A1 (en)	2010-09-30	Laminating apparatus and method of manufacturing sealed structure body
EP2934892A1 (en)	2015-10-28	Laminator for solar modules using a tube like pressing member
KR20130096133A (ko)	2013-08-29	라미네이팅 장치
JP4373494B1 (ja)	2009-11-25	真空貼り合わせ装置
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JP2657540B2 (ja)	1997-09-24	伸縮形減圧形成枠