TWI626696B - Die splicer - Google Patents
Die splicer Download PDFInfo
- Publication number
- TWI626696B TWI626696B TW106101873A TW106101873A TWI626696B TW I626696 B TWI626696 B TW I626696B TW 106101873 A TW106101873 A TW 106101873A TW 106101873 A TW106101873 A TW 106101873A TW I626696 B TWI626696 B TW I626696B
- Authority
- TW
- Taiwan
- Prior art keywords
- die
- adsorber
- adsorption surface
- foreign matter
- brush
- Prior art date
Links
- 238000001179 sorption measurement Methods 0.000 claims abstract description 51
- 239000013078 crystal Substances 0.000 claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 239000002184 metal Substances 0.000 claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 claims abstract description 30
- 238000004140 cleaning Methods 0.000 claims description 60
- 229910001111 Fine metal Inorganic materials 0.000 claims description 28
- 238000005406 washing Methods 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 238000011156 evaluation Methods 0.000 description 18
- 239000000843 powder Substances 0.000 description 16
- 238000012360 testing method Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 238000005304 joining Methods 0.000 description 8
- 238000005259 measurement Methods 0.000 description 7
- 238000003825 pressing Methods 0.000 description 7
- 229910001220 stainless steel Inorganic materials 0.000 description 7
- 239000010935 stainless steel Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 241000309551 Arthraxon hispidus Species 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 101100299500 Caenorhabditis elegans daf-18 gene Proteins 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 2
- 206010047571 Visual impairment Diseases 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02096—Cleaning only mechanical cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014184214A JP6391378B2 (ja) | 2014-09-10 | 2014-09-10 | ダイボンダ及びボンディング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201719774A TW201719774A (zh) | 2017-06-01 |
TWI626696B true TWI626696B (zh) | 2018-06-11 |
Family
ID=55471181
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104127507A TWI575613B (zh) | 2014-09-10 | 2015-08-24 | Grain adapter and bonding method |
TW106101873A TWI626696B (zh) | 2014-09-10 | 2015-08-24 | Die splicer |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104127507A TWI575613B (zh) | 2014-09-10 | 2015-08-24 | Grain adapter and bonding method |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6391378B2 (ja) |
KR (2) | KR20160030451A (ja) |
CN (1) | CN105405774B (ja) |
TW (2) | TWI575613B (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6589050B2 (ja) * | 2016-03-22 | 2019-10-09 | ヤマハモーターロボティクスホールディングス株式会社 | ボンディング装置及びボンディング方法 |
JP6797569B2 (ja) * | 2016-06-13 | 2020-12-09 | ファスフォードテクノロジ株式会社 | 半導体製造装置および半導体装置の製造方法 |
JP6705727B2 (ja) | 2016-09-26 | 2020-06-03 | ファスフォードテクノロジ株式会社 | フリップチップボンダおよび半導体装置の製造方法 |
JP6827836B2 (ja) * | 2017-02-13 | 2021-02-10 | 株式会社Screenホールディングス | 異物除去処理評価方法 |
JP6846958B2 (ja) * | 2017-03-09 | 2021-03-24 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
JP6694404B2 (ja) * | 2017-03-17 | 2020-05-13 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
JP6705765B2 (ja) * | 2017-03-23 | 2020-06-03 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
KR102042268B1 (ko) * | 2018-03-19 | 2019-11-27 | 주식회사 아이플렉스 | 픽커 유닛 |
JP7520637B2 (ja) * | 2020-08-18 | 2024-07-23 | ファスフォードテクノロジ株式会社 | ダイボンディング装置、クリーニングヘッドおよび半導体装置の製造方法 |
JP7039675B2 (ja) * | 2020-11-18 | 2022-03-22 | ファスフォードテクノロジ株式会社 | 半導体製造装置および半導体装置の製造方法 |
KR102280950B1 (ko) * | 2021-03-31 | 2021-07-26 | 주식회사 에스에프이 | 반도체 패키지 이송 장치 |
CN113113336B (zh) * | 2021-04-21 | 2022-06-14 | 莆田学院 | 一种阳极键合设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005166993A (ja) * | 2003-12-03 | 2005-06-23 | Toray Eng Co Ltd | ヘッド加圧面の清掃方法および装置 |
TW200639956A (en) * | 2005-05-13 | 2006-11-16 | King Yuan Electronics Co Ltd | Apparatus and method of automatically claeaning a pick-up head |
TW201115669A (en) * | 2009-10-20 | 2011-05-01 | Mpi Corporaion | Automatic nozzle cleaning/wiping device and method thereof |
TW201312675A (zh) * | 2011-09-15 | 2013-03-16 | Hitachi High Tech Instr Co Ltd | 晶粒接合器及接合方法 |
TW201334665A (zh) * | 2011-11-11 | 2013-08-16 | Vale Sa | 掃描器保護機殼及讀取具有由該機殼所保護之掃描器之網柵爐內網柵車之顆粒床高度的系統 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06302630A (ja) * | 1993-04-16 | 1994-10-28 | Sumitomo Electric Ind Ltd | ダイボンディング方法及び装置 |
JP2000252305A (ja) * | 1999-03-02 | 2000-09-14 | Toshiba Corp | チップマウント装置 |
JP2004146477A (ja) * | 2002-10-23 | 2004-05-20 | Nec Kansai Ltd | 吸着ノズルの清掃装置及び清掃方法 |
JP5171524B2 (ja) * | 2007-10-04 | 2013-03-27 | 株式会社日立ハイテクノロジーズ | 物体表面の欠陥検査装置および方法 |
JP5018750B2 (ja) * | 2008-11-25 | 2012-09-05 | パナソニック株式会社 | 部品実装装置 |
JP5805411B2 (ja) * | 2011-03-23 | 2015-11-04 | ファスフォードテクノロジ株式会社 | ダイボンダのピックアップ方法およびダイボンダ |
JP5815345B2 (ja) * | 2011-09-16 | 2015-11-17 | ファスフォードテクノロジ株式会社 | ダイボンダ及びボンディング方法 |
JP2014060249A (ja) * | 2012-09-18 | 2014-04-03 | Hitachi High-Tech Instruments Co Ltd | ダイボンダ、および、ダイの位置認識方法 |
-
2014
- 2014-09-10 JP JP2014184214A patent/JP6391378B2/ja active Active
-
2015
- 2015-08-24 TW TW104127507A patent/TWI575613B/zh active
- 2015-08-24 TW TW106101873A patent/TWI626696B/zh active
- 2015-09-07 KR KR1020150126227A patent/KR20160030451A/ko active Application Filing
- 2015-09-08 CN CN201510566562.7A patent/CN105405774B/zh active Active
-
2017
- 2017-05-08 KR KR1020170057605A patent/KR101938476B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005166993A (ja) * | 2003-12-03 | 2005-06-23 | Toray Eng Co Ltd | ヘッド加圧面の清掃方法および装置 |
TW200639956A (en) * | 2005-05-13 | 2006-11-16 | King Yuan Electronics Co Ltd | Apparatus and method of automatically claeaning a pick-up head |
TW201115669A (en) * | 2009-10-20 | 2011-05-01 | Mpi Corporaion | Automatic nozzle cleaning/wiping device and method thereof |
TW201312675A (zh) * | 2011-09-15 | 2013-03-16 | Hitachi High Tech Instr Co Ltd | 晶粒接合器及接合方法 |
TW201334665A (zh) * | 2011-11-11 | 2013-08-16 | Vale Sa | 掃描器保護機殼及讀取具有由該機殼所保護之掃描器之網柵爐內網柵車之顆粒床高度的系統 |
Also Published As
Publication number | Publication date |
---|---|
KR101938476B1 (ko) | 2019-01-14 |
JP6391378B2 (ja) | 2018-09-19 |
TW201719774A (zh) | 2017-06-01 |
TW201628102A (zh) | 2016-08-01 |
JP2016058575A (ja) | 2016-04-21 |
KR20160030451A (ko) | 2016-03-18 |
CN105405774A (zh) | 2016-03-16 |
KR20170054371A (ko) | 2017-05-17 |
TWI575613B (zh) | 2017-03-21 |
CN105405774B (zh) | 2019-06-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI626696B (zh) | Die splicer | |
TWI671846B (zh) | 黏晶裝置及半導體裝置的製造方法 | |
KR101528852B1 (ko) | 콜릿 클리닝 방법 및 그것을 사용한 다이 본더 | |
KR101729335B1 (ko) | 보호 테이프 박리 방법 및 그 장치 | |
JP4680362B2 (ja) | 電子部品の製造方法及び製造装置 | |
TWI676226B (zh) | 半導體製造裝置及半導體裝置的製造方法 | |
JP2018056169A (ja) | フリップチップボンダおよび半導体装置の製造方法 | |
TWI713991B (zh) | 黏晶裝置及半導體裝置的製造方法 | |
JP3583868B2 (ja) | ボンディング装置 | |
TWI677047B (zh) | 半導體製造裝置及半導體裝置的製造方法 | |
JP4364755B2 (ja) | 電子部品の実装装置及び実装装置の清掃方法 | |
JP2839673B2 (ja) | ボンディングツールのクリーニング方法およびクリーニング装置 | |
JP4992881B2 (ja) | 電子部品実装装置 | |
JP6604873B2 (ja) | 加工方法 | |
JP4694928B2 (ja) | 電子部品の実装装置及び実装装置の清掃方法 | |
JP2006324580A (ja) | 接合ヘッドの清掃装置および電子部品の接合装置 | |
JP2002231768A (ja) | インナーリードボンディング装置 | |
JP4627730B2 (ja) | 半導体チップの実装装置 | |
JP2003303851A (ja) | チップ実装方法およびそれを用いた装置 | |
JP2011258626A (ja) | 部品実装装置および部品実装方法 | |
JPH0344047A (ja) | ボンディング装置 |