TWI626696B - Die splicer - Google Patents

Die splicer Download PDF

Info

Publication number: TWI626696B
Authority: TW; Taiwan
Prior art keywords: die; adsorber; adsorption surface; foreign matter; brush
Prior art date: 2014-09-10

Application number

TW106101873A

Other languages

English (en)

Chinese (zh)

Other versions

TW201719774A (zh

Inventor

岡本直樹

Original Assignee

捷進科技有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2014-09-10

Filing date

2015-08-24

Publication date

2018-06-11

2015-08-24 Application filed by 捷進科技有限公司 filed Critical 捷進科技有限公司

2017-06-01 Publication of TW201719774A publication Critical patent/TW201719774A/zh

2018-06-11 Application granted granted Critical

2018-06-11 Publication of TWI626696B publication Critical patent/TWI626696B/zh

Links

238000001179 sorption measurement Methods 0.000 claims abstract description 51
239000013078 crystal Substances 0.000 claims abstract description 49
239000000758 substrate Substances 0.000 claims abstract description 48
239000002184 metal Substances 0.000 claims abstract description 30
229910052751 metal Inorganic materials 0.000 claims abstract description 30
238000004140 cleaning Methods 0.000 claims description 60
229910001111 Fine metal Inorganic materials 0.000 claims description 28
238000005406 washing Methods 0.000 claims description 13
239000000853 adhesive Substances 0.000 abstract description 4
230000001070 adhesive effect Effects 0.000 abstract description 4
238000011156 evaluation Methods 0.000 description 18
239000000843 powder Substances 0.000 description 16
238000012360 testing method Methods 0.000 description 11
238000000034 method Methods 0.000 description 10
238000005304 joining Methods 0.000 description 8
238000005259 measurement Methods 0.000 description 7
238000003825 pressing Methods 0.000 description 7
229910001220 stainless steel Inorganic materials 0.000 description 7
239000010935 stainless steel Substances 0.000 description 7
230000008569 process Effects 0.000 description 6
241000309551 Arthraxon hispidus Species 0.000 description 5
230000009471 action Effects 0.000 description 4
101100299500 Caenorhabditis elegans daf-18 gene Proteins 0.000 description 3
238000005520 cutting process Methods 0.000 description 3
230000000694 effects Effects 0.000 description 3
239000000463 material Substances 0.000 description 3
238000012545 processing Methods 0.000 description 3
239000004677 Nylon Substances 0.000 description 2
206010047571 Visual impairment Diseases 0.000 description 2
239000002390 adhesive tape Substances 0.000 description 2
230000015556 catabolic process Effects 0.000 description 2
238000010586 diagram Methods 0.000 description 2
230000005611 electricity Effects 0.000 description 2
238000009434 installation Methods 0.000 description 2
230000007246 mechanism Effects 0.000 description 2
238000012986 modification Methods 0.000 description 2
230000004048 modification Effects 0.000 description 2
229920001778 nylon Polymers 0.000 description 2
230000001681 protective effect Effects 0.000 description 2
230000008901 benefit Effects 0.000 description 1
238000007664 blowing Methods 0.000 description 1
239000007767 bonding agent Substances 0.000 description 1
230000001680 brushing effect Effects 0.000 description 1
230000008859 change Effects 0.000 description 1
230000008878 coupling Effects 0.000 description 1
238000010168 coupling process Methods 0.000 description 1
238000005859 coupling reaction Methods 0.000 description 1
238000006073 displacement reaction Methods 0.000 description 1
239000000428 dust Substances 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
238000002474 experimental method Methods 0.000 description 1
229910052732 germanium Inorganic materials 0.000 description 1
GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
239000003292 glue Substances 0.000 description 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
239000010931 gold Substances 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
239000007788 liquid Substances 0.000 description 1
239000002245 particle Substances 0.000 description 1
238000007747 plating Methods 0.000 description 1
238000002360 preparation method Methods 0.000 description 1
239000011347 resin Substances 0.000 description 1
229920005989 resin Polymers 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
229910000679 solder Inorganic materials 0.000 description 1
230000003068 static effect Effects 0.000 description 1
210000002268 wool Anatomy 0.000 description 1

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02096—Cleaning only mechanical cleaning
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically

Landscapes

Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Die Bonding (AREA)
Cleaning Or Drying Semiconductors (AREA)

TW106101873A 2014-09-10 2015-08-24 Die splicer TWI626696B (zh)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2014184214A JP6391378B2 (ja)	2014-09-10	2014-09-10	ダイボンダ及びボンディング方法

Publications (2)

Publication Number	Publication Date
TW201719774A TW201719774A (zh)	2017-06-01
TWI626696B true TWI626696B (zh)	2018-06-11

Family

ID=55471181

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
TW104127507A TWI575613B (zh)	2014-09-10	2015-08-24	Grain adapter and bonding method
TW106101873A TWI626696B (zh)	2014-09-10	2015-08-24	Die splicer

Family Applications Before (1)

Application Number	Title	Priority Date	Filing Date
TW104127507A TWI575613B (zh)	2014-09-10	2015-08-24	Grain adapter and bonding method

Country Status (4)

Country	Link
JP (1)	JP6391378B2 (ja)
KR (2)	KR20160030451A (ja)
CN (1)	CN105405774B (ja)
TW (2)	TWI575613B (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP6589050B2 (ja) *	2016-03-22	2019-10-09	ヤマハモーターロボティクスホールディングス株式会社	ボンディング装置及びボンディング方法
JP6797569B2 (ja) *	2016-06-13	2020-12-09	ファスフォードテクノロジ株式会社	半導体製造装置および半導体装置の製造方法
JP6705727B2 (ja)	2016-09-26	2020-06-03	ファスフォードテクノロジ株式会社	フリップチップボンダおよび半導体装置の製造方法
JP6827836B2 (ja) *	2017-02-13	2021-02-10	株式会社Ｓｃｒｅｅｎホールディングス	異物除去処理評価方法
JP6846958B2 (ja) *	2017-03-09	2021-03-24	ファスフォードテクノロジ株式会社	ダイボンディング装置および半導体装置の製造方法
JP6694404B2 (ja) *	2017-03-17	2020-05-13	ファスフォードテクノロジ株式会社	ダイボンディング装置および半導体装置の製造方法
JP6705765B2 (ja) *	2017-03-23	2020-06-03	ファスフォードテクノロジ株式会社	ダイボンディング装置および半導体装置の製造方法
KR102042268B1 (ko) *	2018-03-19	2019-11-27	주식회사 아이플렉스	픽커 유닛
JP7520637B2 (ja) *	2020-08-18	2024-07-23	ファスフォードテクノロジ株式会社	ダイボンディング装置、クリーニングヘッドおよび半導体装置の製造方法
JP7039675B2 (ja) *	2020-11-18	2022-03-22	ファスフォードテクノロジ株式会社	半導体製造装置および半導体装置の製造方法
KR102280950B1 (ko) *	2021-03-31	2021-07-26	주식회사 에스에프이	반도체 패키지 이송 장치
CN113113336B (zh) *	2021-04-21	2022-06-14	莆田学院	一种阳极键合设备

Citations (5)

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JP2005166993A (ja) *	2003-12-03	2005-06-23	Toray Eng Co Ltd	ヘッド加圧面の清掃方法および装置
TW200639956A (en) *	2005-05-13	2006-11-16	King Yuan Electronics Co Ltd	Apparatus and method of automatically claeaning a pick-up head
TW201115669A (en) *	2009-10-20	2011-05-01	Mpi Corporaion	Automatic nozzle cleaning/wiping device and method thereof
TW201312675A (zh) *	2011-09-15	2013-03-16	Hitachi High Tech Instr Co Ltd	晶粒接合器及接合方法
TW201334665A (zh) *	2011-11-11	2013-08-16	Vale Sa	掃描器保護機殼及讀取具有由該機殼所保護之掃描器之網柵爐內網柵車之顆粒床高度的系統

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JPH06302630A (ja) *	1993-04-16	1994-10-28	Sumitomo Electric Ind Ltd	ダイボンディング方法及び装置
JP2000252305A (ja) *	1999-03-02	2000-09-14	Toshiba Corp	チップマウント装置
JP2004146477A (ja) *	2002-10-23	2004-05-20	Nec Kansai Ltd	吸着ノズルの清掃装置及び清掃方法
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2014
- 2014-09-10 JP JP2014184214A patent/JP6391378B2/ja active Active
2015
- 2015-08-24 TW TW104127507A patent/TWI575613B/zh active
- 2015-08-24 TW TW106101873A patent/TWI626696B/zh active
- 2015-09-07 KR KR1020150126227A patent/KR20160030451A/ko active Application Filing
- 2015-09-08 CN CN201510566562.7A patent/CN105405774B/zh active Active
2017
- 2017-05-08 KR KR1020170057605A patent/KR101938476B1/ko active IP Right Grant

Patent Citations (5)

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Publication number	Priority date	Publication date	Assignee	Title
JP2005166993A (ja) *	2003-12-03	2005-06-23	Toray Eng Co Ltd	ヘッド加圧面の清掃方法および装置
TW200639956A (en) *	2005-05-13	2006-11-16	King Yuan Electronics Co Ltd	Apparatus and method of automatically claeaning a pick-up head
TW201115669A (en) *	2009-10-20	2011-05-01	Mpi Corporaion	Automatic nozzle cleaning/wiping device and method thereof
TW201312675A (zh) *	2011-09-15	2013-03-16	Hitachi High Tech Instr Co Ltd	晶粒接合器及接合方法
TW201334665A (zh) *	2011-11-11	2013-08-16	Vale Sa	掃描器保護機殼及讀取具有由該機殼所保護之掃描器之網柵爐內網柵車之顆粒床高度的系統

Also Published As

Publication number	Publication date
KR101938476B1 (ko)	2019-01-14
JP6391378B2 (ja)	2018-09-19
TW201719774A (zh)	2017-06-01
TW201628102A (zh)	2016-08-01
JP2016058575A (ja)	2016-04-21
KR20160030451A (ko)	2016-03-18
CN105405774A (zh)	2016-03-16
KR20170054371A (ko)	2017-05-17
TWI575613B (zh)	2017-03-21
CN105405774B (zh)	2019-06-21

Publication	Publication Date	Title
TWI626696B (zh)	2018-06-11	Die splicer
TWI671846B (zh)	2019-09-11	黏晶裝置及半導體裝置的製造方法
KR101528852B1 (ko)	2015-06-17	콜릿 클리닝 방법 및 그것을 사용한 다이 본더
KR101729335B1 (ko)	2017-04-21	보호 테이프 박리 방법 및 그 장치
JP4680362B2 (ja)	2011-05-11	電子部品の製造方法及び製造装置
TWI676226B (zh)	2019-11-01	半導體製造裝置及半導體裝置的製造方法
JP2018056169A (ja)	2018-04-05	フリップチップボンダおよび半導体装置の製造方法
TWI713991B (zh)	2020-12-21	黏晶裝置及半導體裝置的製造方法
JP3583868B2 (ja)	2004-11-04	ボンディング装置
TWI677047B (zh)	2019-11-11	半導體製造裝置及半導體裝置的製造方法
JP4364755B2 (ja)	2009-11-18	電子部品の実装装置及び実装装置の清掃方法
JP2839673B2 (ja)	1998-12-16	ボンディングツールのクリーニング方法およびクリーニング装置
JP4992881B2 (ja)	2012-08-08	電子部品実装装置
JP6604873B2 (ja)	2019-11-13	加工方法
JP4694928B2 (ja)	2011-06-08	電子部品の実装装置及び実装装置の清掃方法
JP2006324580A (ja)	2006-11-30	接合ヘッドの清掃装置および電子部品の接合装置
JP2002231768A (ja)	2002-08-16	インナーリードボンディング装置
JP4627730B2 (ja)	2011-02-09	半導体チップの実装装置
JP2003303851A (ja)	2003-10-24	チップ実装方法およびそれを用いた装置
JP2011258626A (ja)	2011-12-22	部品実装装置および部品実装方法
JPH0344047A (ja)	1991-02-25	ボンディング装置