201115669 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明關於一種自動潔拭吸嘴的裝置與方法，特別是有 關於一種具自動潔拭吸嘴功能的晶片挑揀設備以及其清 潔方法。 [0002] • 【先前技術】 晶圓（wafer)經切割形成晶片（die)後’單一晶片須透過 一晶片挑揀設備的取放（pick and place)以進行後續 的封裝、測試、分類等作業。如「圖1」所示，經切割後 的一晶圓1置於一承載平台（table)2上，一晶片挑揀設 備3藉由控制一機械手臂4的移動，將一吸嘴5移動至欲吸 附的晶片6上，並將晶片6吸離承載平台2，而後送往後續 的製程設備（圖中未示）中。 [0003] 「圖2」為一吸嘴結構示意圖，吸嘴5内部具一通洞51， 晶片挑揀設備3藉由控制該通洞51的氣壓狀態，進而控制 吸嘴5的吸附狀態而搡作晶片6的取放。举例來說，當吸 嘴5的吸附面52接近（或接觸）欲拾取之晶片6時·’透過抽 取通洞51内的空氣，使通洞51形成一真空或負壓狀態而 具吸力並吸取晶片6 ;當晶片6移動至定位點後，再回復 通洞51内的氣壓便可釋離晶片6。 [0004] 吸嘴5使用的過程中，除受到灰塵的污染外，吸嘴的吸附 面5 2亦容易沾附雜質，如：晶圓切割後的矽渣，以及晶 片上被掀離的金屬焊墊（1>3〇1)等。黏附在吸附面52上的雜 質會於吸嘴5吸附下一個晶片時刮傷晶片6，甚而損傷吸 嘴5，造成吸嘴5吸附能力的降低或失效。傳統的解決方 098135351 表單編號A0101 第3頁/共19頁 0982060634-0 201115669 法是在晶片挑揀設備3經歷固定數量的挑揀流程後，停機 並以人工方式清潔吸嘴5。然，以人工方式清潔吸嘴5不 僅耗費人力，晶片挑揀設備3於開關機的過程中，更大幅 降低工作效率與產能而有待改善。 [0005] [0006] [0007] 中華民國專利第1254397號之「自動清潔吸嘴的裝置與方 法」，係將吸嘴挺觸一膠帶，利用膠帶黏性將吸嘴上的 雜質移除。惟，利用膠帶黏取雜質，無法完全避免殘膠 的產生。殘膠黏附吸嘴會影響吸附能力嚴重者，甚至 會>了染其他晶片；再者，利用吸嘴碰觸膠帶的清潔方式 ，對於某些頑強黏附於吸嘴上的雜質，效果並不顯著， 而無法完全解決問題。 【發明内容】 综上所述，本發明的目的在於提供—種自動潔拭吸嘴的 方法’係於吸嘴挑揀晶片的過程巾，零_自動潔拭吸 嘴裳置自動清潔吸嘴，無須浪費人力手工清潔進而取 代人力並提升機台的稼動率及產能。 本發明之另-目的在於提供_種自動潔拭吸嘴裝置，能 適時地自動清潔吸嘴；並藉ά吸嘴接觸清潔部產生相對 位移’而除去㈣於吸嘴上的雜質’避免雜質損害、汙 染晶片。 [0008] 本發明提供之自動潔拭吸嘴裝置，包含—清潔部、一承 載件以及-清雜分佈件；清潔賴蓋於承載件上，並 藉由該清缝分佈件対或Μ«液於清料上，致 使吸嘴自動地與清潔部相互接觸並產生相對位移，進而 潔拭吸嘴。有關本發明的詳細技術内 098135351 表單編號Α0101 第4頁/共19頁 容及較佳實施例， 0982060634-0 201115669 配合圖式說明如後。 【實施方式】 [0009] ❹ 繁於傳統吸嘴5會損害W，本發明提出的自 動潔找吸嘴裝置，如「圖I和「圖3」所示。如「圖U 所顯不，本創作的自動潔^嘴裝置1㈣設置 挑揀設備3的移動路《圍内，但為節省電力能源明自動 潔拭吸嘴裝置10的設置點係以接近吸嘴5 ,且不影響晶片 挑揀工作位置者為考4 1自誠拭吸嘴包含〆 π潔411承載件12以及—清潔液分佈件u。該清潔 411輔蓋於承栽件12上，可根據使用狀況適時更換；該 清潔液分佈件13可容置清以130，並將適量之清潔液 130分佈於清潔部11上，敢使位於-晶片_設備3之〆 吸嘴5可自動接觸該㈣清潔㈣0之清潔和，並與清 潔部11產生相對位移，而達糾潔拭清潔該吸嘴5的效采 [0010] 須說明的是’上述「吸嘴5輿清潔部"產生相對位移」之 意，係指吸嘴5須與清潔部1丨產生接觸並相互摩擦，藉接 觸式的相對位移，帶離附著於吸嘴5上的雜質，而達到潔 拭之目的，而非僅是兩者碰觸，而無法完全達到清潔。 實際上，自動潔拭吸嘴裝置1〇和吸嘴5於潔拭時係藉由「 相對」位移來達成清潔的目的，至於何者位置固定，何 者須移動進行擦拭並無特別的限定。意即，該吸嘴5町透 過一機械手臂4自動潔拭於固定位置之自動潔拭吸嘴装置 10 ;或者吸嘴5本身定位不動，由自動潔拭吸嘴裝置1〇的 一機械手臂（圖中未示）控制清潔部11的移動，將清潔部 098135351 表單編號Α0101 第5頁/共19201115669 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to an apparatus and method for automatically cleaning a nozzle, and more particularly to a wafer picking apparatus having an automatic cleaning nozzle function and a cleaning method thereof . [0002] [Prior Art] After a wafer is cut to form a die, a single wafer is subjected to a pick and place of a wafer picking device for subsequent packaging, testing, sorting, and the like. As shown in FIG. 1, the cut wafer 1 is placed on a carrying table 2, and a wafer picking device 3 moves a nozzle 5 to the desired position by controlling the movement of a robot arm 4. The wafer 6 is adsorbed and the wafer 6 is sucked away from the carrier platform 2 and then sent to a subsequent process equipment (not shown). [0003] FIG. 2 is a schematic view of a nozzle structure. The nozzle 5 has a through hole 51 therein. The wafer picking device 3 controls the adsorption state of the nozzle 5 by controlling the air pressure state of the through hole 51. Pick and place. For example, when the adsorption surface 52 of the suction nozzle 5 approaches (or contacts) the wafer 6 to be picked up, 'through the air in the extraction hole 51, the through hole 51 is formed into a vacuum or negative pressure state to absorb and suck the wafer 6 After the wafer 6 is moved to the positioning point, the air pressure in the through hole 51 is restored to release the wafer 6. [0004] In the process of using the nozzle 5, in addition to being contaminated by dust, the adsorption surface 52 of the nozzle is also likely to adhere to impurities, such as: slag after wafer cutting, and metal welding on the wafer. Pad (1 > 3〇1), etc. The impurities adhering to the adsorption surface 52 may scratch the wafer 6 when the nozzle 5 adsorbs the next wafer, and even damage the nozzle 5, resulting in a decrease or failure of the suction function of the nozzle 5. The traditional solution 098135351 Form No. A0101 Page 3 of 19 0982060634-0 201115669 The method is to stop and manually clean the nozzle 5 after the wafer picking device 3 has undergone a fixed number of picking processes. However, the manual cleaning of the nozzle 5 is not only labor intensive, but also the wafer picking device 3 in the process of switching on and off, which greatly reduces the work efficiency and productivity and needs to be improved. [0006] [0007] The apparatus and method for automatically cleaning the nozzle of the Republic of China Patent No. 1254397 is to press the nozzle against a tape and remove the impurities on the nozzle by the adhesiveness of the tape. However, the use of adhesive tape to remove impurities does not completely prevent the generation of residual glue. Residual glue adheres to the nozzle, which will affect the adsorption capacity. Even the other wafers will be dyed. In addition, the cleaning method of using the nozzle to touch the tape will not be effective for some impurities that adhere to the nozzle. , and can't solve the problem completely. SUMMARY OF THE INVENTION In summary, the object of the present invention is to provide a method for automatically cleaning a nozzle, which is a process towel for picking a wafer by a nozzle, and a zero-automatic cleaning nozzle for automatically cleaning the nozzle, without Waste labor manual cleaning to replace manpower and increase the productivity and productivity of the machine. Another object of the present invention is to provide an automatic cleaning and wiping nozzle device capable of automatically cleaning the nozzle in a timely manner; and removing the impurity in the nozzle by the relative displacement of the nozzle contacting the cleaning portion to prevent impurity damage. , contaminated wafers. [0008] The invention provides an automatic cleaning and wiping nozzle device, comprising: a cleaning portion, a carrier member and a cleaning distribution member; the cleaning cover is disposed on the carrier member, and the cleaning distribution member is 対 or Μ«液On the clearing material, the nozzle is automatically brought into contact with the cleaning portion and a relative displacement is generated, thereby cleaning the nozzle. For a detailed description of the present invention, 098,135,351, Form No. 1010101, Page 4 of 19, and a preferred embodiment, 0982060634-0 201115669. [Embodiment] [0009] 繁 The conventional nozzle 5 may damage W. The automatic cleaning nozzle device proposed by the present invention is as shown in "Fig. 1 and Fig. 3". As shown in Figure U, the automatic cleaning nozzle device 1 (4) of this creation sets the moving path of the picking device 3, but in order to save power, the setting point of the automatic cleaning nozzle device 10 is close to the suction nozzle 5 And does not affect the wafer picking work position for the test 4 1 self-supplement wipe nozzle includes 〆π洁411 carrier 12 and - cleaning liquid distribution member u. The cleaning 411 is attached to the carrier 12, depending on the use condition The cleaning liquid distribution member 13 can be accommodated to be cleaned 130, and an appropriate amount of the cleaning liquid 130 is distributed on the cleaning portion 11, so that the suction nozzle 5 located at the wafer-device 3 can automatically contact the (four) cleaning (four). The cleaning and the relative displacement with the cleaning portion 11, and the cleaning and cleaning of the nozzle 5 [0010] must be described as "the above-mentioned "nozzle 5 舆 cleaning portion" "relative displacement" meaning , means that the nozzle 5 must be in contact with the cleaning part 1 并 and rub against each other, by the relative displacement of the contact, with the impurities attached to the nozzle 5, to achieve the purpose of cleaning, not just the two Touch, but not completely clean. In fact, the automatic wiping nozzle device 1 and the nozzle 5 are cleaned by "relative" displacement during cleaning, and there is no particular limitation as to which position is fixed and which must be moved for wiping. That is, the nozzle 5 is automatically cleaned by a robot arm 4 in a fixed position of the automatic cleaning nozzle device 10; or the nozzle 5 itself is not positioned, a robot arm of the automatic cleaning nozzle device 1 ( The movement of the cleaning unit 11 is controlled, and the cleaning unit 098135351 is numbered Α0101, page 5 of 19
I 0982060634-0 201115669 11移動至定位點的吸嘴5而產生接觸擦找，亦或是兩者皆 透過各自之機械手臂4位移至一定點進行接觸而擦拭。再 者，本發明自動潔拭吸嘴裝置1〇中「自動」之意，僅在 於表達利用該自動潔拭吸嘴裝置1 〇潔拭吸嘴5的過程係屬 自動化，無須藉由人工潔拭吸嘴5，而自動潔拭吸嘴5的 確切進行時間 '頻率、作用力等因素，係可根據使用狀 況與吸嘴5汙染情形而自行設定與調整。 [0011] 須再說明的是，本發明之「清潔部11」應廣義地定義為 一具上述清潔吸嘴5能力的材質，除人力清潔時所使用的 布料外，其可為此領域中，可使清潔液130分佈於其上， 親水性較佳並考量與吸嘴5可產生擦拭效果‘不損傷吸嘴 5的材質’而非僅限於紡織手段製成的布料Γ布體。舉例 來說凊潔部11可為習知之無塵室專用擦拭布，其具有 两密度、高吸水性、高吸附力、不掉棉屑等特性。其他 異於布體的材質如：海綿、具擦拭作用的紙製品或類毛 刷表面等’均可為本發明清潔部11之適用範圍。 [0012] 本發明之清潔液分佈件13，係用以容置清潔液13〇，並可 在吸嘴5接觸清潔部丨丨前，將適量之清潔液13〇分佈於清 潔。卩11的預定位置。其中，該清潔液130之成分並無嚴格 的限定’可為本領域中用以清潔吸嘴5之任意清潔液13〇 此外，為避免擦拭後，液態之清潔液130殘存於吸嘴5 而對後續吸嘴5所吸取的晶片產生不良的影響，清潔液 3〇以具揮發性質為佳。舉例來說，該清潔液130可為乙 醇、丙鲖等有機溶劑。其中，乙醇易揮發且具有潮解性 潮解性意指可將水分子帶走，避免有水分殘留於吸嘴 098135351 表單鵠號Α0Ι0】 0982060634-0 201115669 或晶粒。須說明的是，清潔液1 3〇分技^ 佈於清潔部11之目的 ，除使清潔部11欲與吸嘴5接觸的揪只占 、孩•處，沾附適量清潔 液130而達到清潔潔拭之效果外，亦 j補助頑強黏附的雜 質脫離吸嘴5。該清潔液130分佈於清潔部u之方气 為舉例說明。 [0013] 「圖4-1」為本發明清潔液分佈件13之—實施例，其藉由 一針孔133排出清潔液130於清潔部丨丨上。其中所述的針 孔133係指口徑相當微小的孔洞，對於其實際尺寸並未有 限制，但以針孔133不會自動釋出清潔液13〇為準。本實 施例之清潔濂分佈件13 ’包含1排量控制單元131、_容 置清潔液130之容置空間132以及一針孔133。排量控制 單元131可控制該容置空間132内之氣壓狀態，致使該清 潔液130能適時適量地自該針孔133排忠雨喷佈於該清潔 部11上。在一實施例中，該排量控制單元131為一控制壓 力闊，其可通入來自壓縮機之壓縮空氧，並藉由控制通 入適量的壓縮空氣於該容置空間13 2，致使適量的清潔液 130受壓而自該針孔133排出，而喷佈於清潔部11上。另 一方面’該排量控制單元131亦可控制該容置空間132之 氣壓呈一負壓狀態，使得清潔液130於非需要的時間下， 不會自針孔133漏出。 [0014] 「圖4一2」為本發明清潔液分佈件13之另一實施例，其與 清潔部11產生接觸而塗佈清潔液130。本實施例採滾珠原 理’藉由一滾珠134受壓，控制清潔液130之排出。該清 潔液分佈件13包含一容置清潔液130之容置空間132，該 098135351 表單编號A0101 第7頁/共19頁 0982060634-0 201115669 容置空間132底端具一圓孔135，以一直徑略大於圓孔 135孔徑的滾珠134覆蓋該圓孔135，致使滚珠134未接觸 清潔部11時，該容置空間13 2保持一密閉狀態，以防止清 潔液130的流出；在意欲塗佈清潔液13〇於清潔部η的情 況時，透過滾珠134觸壓清潔部π，或滾動於清潔部11平 面（x-y平面）之特定區域，致使滚珠134受壓提高其於z 轴的位置，因此於滾珠134與圓孔135之間形成間隙，使 清潔液130可自該間隙流出，而藉由滾珠134的滾動均勻 塗佈清潔液於清潔部11 (如「圖4-3」）。 .:.... .... ...: -..：* ...:..... ..... ...I 0982060634-0 201115669 11 Move to the nozzle 5 of the positioning point to generate contact rubbing, or both of them are wiped by contact with the respective robot arm 4 to a certain point. Furthermore, the automatic cleaning nozzle device of the present invention means "automatic" only to express that the process of using the automatic cleaning nozzle device 1 to clean the nozzle 5 is automated, without manual cleaning. The nozzle 5, and the exact time of the automatic cleaning nozzle 5 'frequency, force and other factors, can be set and adjusted according to the use condition and the contamination of the nozzle 5. [0011] It should be further noted that the "cleaning portion 11" of the present invention should be broadly defined as a material having the above-described ability to clean the nozzle 5, which can be used in this field in addition to the cloth used for manual cleaning. The cleaning liquid 130 can be distributed thereon, and the hydrophilicity is preferable and the wiping effect can be generated with the suction nozzle 5 to not damage the material of the suction nozzle 5, and is not limited to the fabric cloth body made of the textile means. For example, the cleaning portion 11 can be a conventional clean room-specific wiping cloth having characteristics of two densities, high water absorption, high adsorption force, and no cotton lint. Other materials different from the cloth body such as a sponge, a wiping paper product or a brush-like surface, etc. may be the scope of application of the cleaning unit 11 of the present invention. [0012] The cleaning liquid distribution member 13 of the present invention is for accommodating the cleaning liquid 13 〇, and can distribute an appropriate amount of the cleaning liquid 13 清 to the cleaning before the suction nozzle 5 contacts the cleaning portion.预定11's intended location. The composition of the cleaning liquid 130 is not strictly limited. It can be any cleaning liquid used to clean the nozzle 5 in the field. In addition, in order to avoid wiping, the liquid cleaning liquid 130 remains in the nozzle 5 and The wafer sucked by the subsequent nozzle 5 has an adverse effect, and the cleaning liquid 3 is preferably volatile. For example, the cleaning liquid 130 may be an organic solvent such as ethanol or propylene. Among them, ethanol is volatile and has deliquescent deliquescence meaning that water molecules can be taken away to avoid water remaining in the nozzle 098135351 Form No. Α0Ι0] 0982060634-0 201115669 or grain. It should be noted that the cleaning liquid is disposed on the cleaning portion 11 except that the cleaning portion 11 is intended to be in contact with the suction nozzle 5, and only a small amount of the cleaning liquid 130 is adhered to the cleaning portion. In addition to the effect of cleaning, it also subsidizes the stubborn adhesion of impurities from the nozzle 5. The cleaning liquid 130 is distributed in the cleaning unit u as an example. [0013] Fig. 4-1 is an embodiment of the cleaning liquid distribution member 13 of the present invention, which discharges the cleaning liquid 130 onto the cleaning portion by a pinhole 133. The pinhole 133 described therein refers to a hole having a relatively small diameter, and there is no limitation on the actual size thereof, but the pinhole 133 does not automatically release the cleaning liquid 13〇. The cleaning crucible distribution member 13' of the present embodiment includes a displacement control unit 131, an accommodation space 132 for accommodating the cleaning liquid 130, and a pinhole 133. The displacement control unit 131 can control the air pressure state in the accommodating space 132, so that the cleaning liquid 130 can be sprayed on the cleaning portion 11 from the pinhole 133 in a timely and appropriate amount. In an embodiment, the displacement control unit 131 is a control pressure wide, which can pass compressed air oxygen from the compressor, and controls an appropriate amount of compressed air to pass through the accommodating space 13 2 to cause an appropriate amount. The cleaning liquid 130 is pressed from the pinhole 133 and sprayed onto the cleaning portion 11. On the other hand, the displacement control unit 131 can also control the air pressure of the accommodating space 132 to be in a negative pressure state, so that the cleaning liquid 130 does not leak from the pinhole 133 at an undesired time. [0014] Fig. 4-2 shows another embodiment of the cleaning liquid distribution member 13 of the present invention which is brought into contact with the cleaning portion 11 to apply the cleaning liquid 130. In this embodiment, the ball bearing principle is controlled by a ball 134 to control the discharge of the cleaning liquid 130. The cleaning liquid distribution member 13 includes a receiving space 132 for accommodating the cleaning liquid 130. The 098135351 Form No. A0101 Page 7 / 19 pages 0982060634-0 201115669 The bottom of the accommodating space 132 has a circular hole 135, a diameter A ball 134 slightly larger than the aperture of the circular hole 135 covers the circular hole 135, so that when the ball 134 is not in contact with the cleaning portion 11, the accommodating space 13 2 is kept in a sealed state to prevent the outflow of the cleaning liquid 130; 13 in the case of the cleaning portion η, the ball 134 is pressed against the cleaning portion π, or is rolled over a specific region of the plane (xy plane) of the cleaning portion 11, causing the ball 134 to be pressed to increase its position on the z-axis, thus the ball A gap is formed between the 134 and the circular hole 135, so that the cleaning liquid 130 can flow out from the gap, and the cleaning liquid is uniformly applied to the cleaning portion 11 by the rolling of the balls 134 (as shown in Fig. 4-3). .:.... .... ...: -..:* ...:..... ..... ...
[0015]須再說明的是，本發明自動讀隹吸嘴裝置10的設置目的 ，在使吸嘴5淤挑揀晶片的遍黎中，轉__地被清潔，因 此自動潔拭吸嘴裝置10之設麵择之限定， 而以吸嘴5潔拭時較具效率、方便者為考量。因此，其可 設置於晶片挑揀設僙3上，或是為獨立設置之裝置。 098135351 [0016] 本發明另提出 劫漯拭吸嘴5的有法，係於吸嘴5進 行挑揀的流程時，於未吸附晶片的狀態下，自動與上述 自動潔拭吸裝置10產生接觸而潔拭吸嘴5。須瞭解到， 上述「吸嘴5未吸附晶片的狀態」係指挑棟晶片設備進行 挑揀時，吸嘴5於吸附晶片前或將晶片釋離吸嘴5後之時 2點；實際清潔吸嘴5的時間點、其作用力之制可根 11的^的挑棟抓㈣搭配。舉例來說，吸嘴5接觸清潔部 u的作用力可介於卜3牛 可於 ㈣範園，自動潔拭吸嘴裝置10 實施似由4订5000次拾取晶片後自動潔拭吸嘴；在另- =:=:__力，可根_部 次赁5凊潔狀態進行彈性調整。 住曰[0015] It should be further noted that the purpose of the automatic reading and sucking nozzle device 10 of the present invention is to clean the nozzles 5, and thus the automatic cleaning nozzle device 10 is cleaned. The setting of the surface is limited, and the cleaning of the nozzle 5 is more efficient and convenient. Therefore, it can be placed on the wafer picking unit 3 or as an independently arranged device. 098135351 [0016] The present invention further provides a method for the robber wiping nozzle 5, which is in the process of picking the nozzle 5, and automatically contacts the automatic cleaning and wiping device 10 in a state where the wafer is not adsorbed. Wipe the nozzle 5. It should be understood that the above-mentioned "state in which the nozzle 5 does not adsorb the wafer" refers to the point 2 when the nozzle 5 picks up the wafer before or after the wafer is removed from the nozzle 5; the actual cleaning nozzle At the time point of 5, the force of the system can be matched with the picking of the roots of the 11th. For example, the force of the suction nozzle 5 contacting the cleaning portion u may be between (4) Fanyuan, and the automatic cleaning nozzle device 10 is configured to automatically wipe the nozzle after picking up the wafer by 4 times; Another - =: =: __ force, can be rooted _ partial rent 5 chasing state for elastic adjustment. Live
表單編St A010I 第8頁/共19頁 09820： 201115669 [_ 「圖5-1」和「圖5_2」顯示一吸嘴5接觸清潔部u，兩 者產生相對位移的不同實施例，其中「圖52」以俯視方 向顯不吸嘴5於清潔部11平面上之位移情形：吸嘴5接觸 凊潔邛11後，可透過左右位移（X轴向）、前後位移&輪勹 )，旋轉、震動或是搭配旋轉與震動方式進行擦栻與清潔 ;此外，每次吸嘴5接觸清潔部π的位置，也未限定於同 —點，以免因擦拭位置固定而形成二次汙染，降低擦栻 效果。藉此，擦拭位置可隨機選取，或是於清潔部11表 面建立一自訂路徑（如：s型，徑），均勻分配清潔部"之 各個位置均可與吸嘴5發生擦魏效·。 [0018] . 惟以上所述者，僅為本發明之較佳實疼例，.非欲侷限本 發明專利之專利保護範圍，故舉凡運用本發明說明書及 圖式内容所為之等效變化與修飾，均同建包含於本發明 之權利保護範圍，合予陳明。 【圖式簡單說明】 [0019] 本發明的實施方式係結合圖式予以描述： [0020] 「圖1」為晶片挑棟設備挑棟一晶片的示意圖； [0021] 「圖2」為一吸嘴結構示意圖； [0022] 「圖3」為本發明自動潔拭吸嘴裝置之結構示意圖； [0023] 「圖4-1」為本發明清潔液分佈件之一實施例示意圖； [0024] 「圖4-2」為本發明清潔液分佈件之一實施例示意圖； [0025] 「圖4-3」為「圖4_2」部分區域之放大示意圖：以及 [0026] 「圖5-1」為本發明中’吸嘴接觸清潔部產生相對位移之 0982060634-0 098135351 表單編號A0101 第9頁/共19頁 201115669 示意圖； [0027] 「圖5-2」為本發明中’吸嘴接觸清潔部產生相對位移之 示意圖。 【主要元件符號說明】 [0028] 1............晶圓 2 ............承載平台 3 ............晶片挑揀設備 4 ............機械手臂 5 ............吸嘴 6 · ...........晶片 10 ............自動潔拭吸嘴裝置 11 ...........清潔部 12 .........••承載件 13 ...........清潔液分佈件 51 ...........通洞 52 ....... · · · *吸附面 130 ...........清潔液 131 ...........排量控制單元 132 ...........容置空間 133 ...........針孔 134··，........滚珠Forms St A010I Page 8 of 19 09820: 201115669 [_ "Figure 5-1" and "Figure 5_2" show a different embodiment in which a nozzle 5 contacts the cleaning portion u, which produces relative displacement, 52" shows the displacement of the nozzle 5 on the plane of the cleaning portion 11 in a plan view: after the nozzle 5 contacts the cleaning blade 11, it can be transmitted through the left and right displacement (X-axis), the front-rear displacement & rim, rotation, Vibrate or rub and clean with the method of rotation and vibration; in addition, each time the nozzle 5 contacts the position of the cleaning part π, it is not limited to the same point, so as to avoid secondary pollution due to the fixed wiping position, reducing rubbing effect. Thereby, the wiping position can be randomly selected, or a custom path (eg, s-type, diameter) can be established on the surface of the cleaning portion 11, and each position of the evenly-distributed cleaning portion can be rubbed with the nozzle 5. . [0018] However, the above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the patent protection of the present invention, so the equivalent changes and modifications of the present specification and the contents of the drawings are used. All of them are included in the scope of protection of the present invention and are combined with Chen Ming. BRIEF DESCRIPTION OF THE DRAWINGS [0019] Embodiments of the present invention are described in conjunction with the drawings: [0020] FIG. 1 is a schematic diagram of a wafer picking device picking up a wafer; [0021] "FIG. 2" is a suction [0022] FIG. 3 is a schematic structural view of an automatic wiper nozzle device of the present invention; [0023] FIG. 4-1 is a schematic view showing an embodiment of a cleaning liquid distribution member of the present invention; [0024] Figure 4-2" is a schematic view showing an embodiment of the cleaning liquid distribution member of the present invention; [0025] "Fig. 4-3" is an enlarged schematic view of a portion of "Fig. 4_2": and [0026] "Fig. 5-1" In the invention, the nozzle contact cleaning portion produces a relative displacement of 0982060634-0 098135351. Form No. A0101 Page 9/19 pages 201115669 Schematic; [0027] "Fig. 5-2" is a method in which the nozzle contact cleaning portion is relatively Schematic diagram of displacement. [Description of main component symbols] [0028] 1............ Wafer 2............Loading platform 3 .......... .. wafer picking equipment 4............mechanical arm 5............nozzle 6 · ........... wafer 10 ............Automatic cleaning wiper device 11 ...........cleaning part 12 .........••bearing part 13 ... ........cleaning liquid distribution piece 51 ...........through hole 52....... · · · *Adsorption surface 130 .......... . Cleaning liquid 131 ........... Displacement control unit 132 ...... accommodating space 133 ........... pinhole 134· ·,........ball
.135...........圓孑L 098135351 表單編號A0101 第10頁/共19頁 0982060634-0.135...........圆孑L 098135351 Form No. A0101 Page 10 of 19 0982060634-0