TWI624675B - Pushing apparatus of handler for testing electronic devices - Google Patents
Pushing apparatus of handler for testing electronic devices Download PDFInfo
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- TWI624675B TWI624675B TW106104218A TW106104218A TWI624675B TW I624675 B TWI624675 B TW I624675B TW 106104218 A TW106104218 A TW 106104218A TW 106104218 A TW106104218 A TW 106104218A TW I624675 B TWI624675 B TW I624675B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C2301/00—Sorting according to destination
- B07C2301/0008—Electronic Devices, e.g. keyboard, displays
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
一種用於測試電子部件的分選機的加壓裝置。加壓裝置包括：加壓板，具有用於對裝載於測試托盤的電子部件加壓的推動件；第一驅動源，使加壓板朝向測試機前進，以借助加壓板將裝載於測試托盤的電子部件朝向測試機側加壓，從而使電子部件電連接到測試機，或使加壓板後退而解除借助加壓板的電子部件的加壓，從而使電子部件從測試機電分離；握持導軌，用於握持位於測試位置的測試托盤；第二驅動源，使握持導軌從標準位置朝向加壓板側後退，以使握持導軌握持的測試托盤中的電子部件接觸到推動件，或使握持導軌前進而接觸電子部件和推動件之間的接觸。根據本發明，即時電子部件的規格變換的情況下也無需更換部件，因此具有能夠提升設備的操作率的效果。A pressurizing device for a sorter for testing electronic components. The pressurizing device includes a pressurizing plate having a pusher for pressurizing the electronic components loaded on the test tray, and a first driving source that advances the pressurizing plate toward the testing machine to load the test plate by the pressurizing plate. The electronic components are pressurized toward the testing machine side, so that the electronic components are electrically connected to the testing machine, or the pressure plate is retracted to release the pressure of the electronic components by the pressure plate, so that the electronic components are separated from the testing machine; Guide rail for holding the test tray at the test position; the second drive source causes the holding guide to retract from the standard position toward the pressure plate side so that the electronic components in the test tray held by the guide rail contact the pusher , Or advance the holding rail to contact the contact between the electronic component and the pusher. According to the present invention, there is no need to replace components even when the specifications of the electronic components are changed in real time, and therefore, there is an effect that the operation rate of the equipment can be improved.
Description
本發明涉及一種支援針對所生產的電子部件進行的測試的分選機。本發明尤其涉及一種用於將電子部件向測試機側加壓或支撐的加壓裝置。The present invention relates to a sorting machine that supports testing of produced electronic components. The present invention particularly relates to a pressurizing device for pressurizing or supporting an electronic component to a tester side.
用於測試電子部件的分選機（以下，簡稱為「分選機」）用於對通過預定的製造工序而製造出的電子部件進行測試。A sorting machine for testing electronic components (hereinafter simply referred to as a "sorting machine") is used to test electronic components manufactured by a predetermined manufacturing process.
分選機將電子部件電連接到測試機，以使電子部件能夠被測試機測試，而且如果完成電子部件的測試，則根據測試結果而將電子部件分類。在此，電子部件可以是半導體元件、SSD及模組RAM等多樣的部件。因此，分選機應與將要被測試的電子部件的種類對應地被製作成多樣的形態。The sorting machine electrically connects the electronic components to the testing machine so that the electronic components can be tested by the testing machine, and if the testing of the electronic components is completed, the electronic components are classified according to the test results. Here, the electronic component may be various components such as a semiconductor element, an SSD, and a module RAM. Therefore, the sorting machine should be made into various forms according to the type of electronic components to be tested.
通常，分選機分為如下的種類：將電子部件直接電連接到測試機；將裝載於測試盤的狀態下的電子部件電連接到測試機。本發明與在電子部件裝載於測試盤的狀態下進行測試的後者的分選機相關。Generally, a sorting machine is classified into the following types: an electronic component is directly electrically connected to a test machine; and an electronic component in a state of being mounted on a test disc is electrically connected to the test machine. The present invention relates to the latter sorter which tests the electronic components while they are mounted on a test disc.
如圖1所示，測試托盤TT沿著經由裝載位置LP、測試位置TP、卸載位置UP並重新回到裝載位置LP的封閉的循環路徑C而在分選機HD的內部循環。 As shown in FIG. 1, the test tray TT circulates inside the sorting machine HD along a closed circulation path C that passes through the loading position LP, the test position TP, the unloading position UP, and returns to the loading position LP.
在裝載位置LP，電子部件被裝載到測試托盤TT；在測試位置TP，裝載於測試托盤TT的電子部件電連接到測試機；在卸載位置UP，完成測試的電子部件從測試托盤TT被卸載。 In the loading position LP, the electronic components are loaded on the test tray TT; in the test position TP, the electronic components loaded on the test tray TT are electrically connected to the testing machine; in the unloading position UP, the electronic components that have completed the test are unloaded from the test tray TT.
另外，圖1將測試托盤TT在水平式分選機中保持水平狀態而循環的情況作為一例而示出，但是，對如在韓國專利公開號10-2013-0047204號(以下，稱之為「現有技術」)中公開的垂直式分選機的情況而言，測試盤需要在測試位置中處於垂直的狀態。無論是水平式分選機還是垂直式分選機，都需要一種握持導軌(Rail)GRa、GRb(現有技術中命名為「托盤導軌」)，用於在沿著循環路徑C移動的測試托盤TT移動至測試位置TP時引導測試托盤TT的移動，同時能夠握持位於測試位置TP的測試托盤TT。 In addition, FIG. 1 shows as an example a case where the test tray TT is kept horizontal in the horizontal sorter and is circulated. However, for example, in Korean Patent Publication No. 10-2013-0047204 (hereinafter, referred to as " In the case of the vertical sorter disclosed in the prior art "), the test disc needs to be in a vertical state in the test position. Regardless of whether it is a horizontal sorter or a vertical sorter, a grip rail (Rail) GR a , GR b (named "tray rail" in the prior art) is needed for moving along the circulation path C. When the test tray TT is moved to the test position TP, the test tray TT is guided to move, and at the same time, the test tray TT located at the test position TP can be held.
如在現有技術中說明，握持導軌GRa、GRb位於測試機的測試用插槽和加壓板(現有技術中分為「設置板」和「推動件(pusher)」而進行了說明，本領域中還命名為「雙面範本(match plate)」)的推動件之間。而且，如同作為垂直式分選機的一例的圖2，握持導軌GRa、GRb可進退地固定於分選機的牆面W。在如圖2所示的結構中，如果加壓裝置100***作而導致加壓板 110向測試機TESTER側移動，則如圖3所示，推動件P接觸到電子部件ED，同時推動件P的基底PB接觸到測試托盤TT的嵌件I，而且支撐加壓板110的支撐導軌SRa、SRb也接觸到握持導軌GRa、GRb。從而能夠防止推動件P的加壓力被過度施加到電子部件ED。 As described in the prior art, the grip rails GR a and GR b are located in the test slot and the pressure plate of the testing machine (the prior art is divided into "setting plate" and "pusher"), Also known in the art as a "match plate". In addition, like FIG. 2 as an example of the vertical sorter, the grip rails GR a and GR b are fixed to the wall surface W of the sorter so as to be able to advance and retreat. In the structure shown in FIG. 2, if the pressure device 100 is operated and the pressure plate 110 is moved to the TESTER side of the tester, as shown in FIG. 3, the pusher P contacts the electronic component ED and pushes the member P The substrate P B contacts the insert I of the test tray TT, and the support rails SR a and SR b that support the pressure plate 110 also contact the holding rails GR a and GR b . It is thereby possible to prevent the pressing force of the pusher P from being excessively applied to the electronic component ED.
在圖3的狀態下，如果加壓板110向測試機TESTER側進一步前進，則彈性支撐握持導軌GRa、GRb的彈簧S被壓縮，且握持導軌GRa、GRb也隨之向測試機TESTER側移動，從而如圖4所示，裝載於測試機TT的電子部件ED電連接於測試機TESTER的測試插槽(Test Socket)TS。當然，如果完成測試且加壓板110後退，則借助彈簧S的彈性反作用力，握持導軌GRa、GRb也將後退並返回到標準位置。 In the state of FIG. 3, if the pressure plate 110 is further advanced toward the TESTER side of the testing machine, the spring S that elastically supports the holding rails GR a and GR b is compressed, and the holding rails GR a and GR b also follow The TESTER side of the testing machine moves so that the electronic component ED mounted on the testing machine TT is electrically connected to the testing socket (Test Socket) TS of the testing machine TESTER as shown in FIG. 4. Of course, if the test is completed and the pressure plate 110 is retracted, the grip rails GR a and GR b will also be retracted and returned to the standard position by the elastic reaction force of the spring S.
如上所提及，現有技術具有如下的機構性的構成：為了防止推動件P的過度的加壓而將推動件P的基底PB接觸到嵌件I，同時也將支撐導軌SRa、SRb接觸在握持導軌GRa、GRb。然而，如果電子部件ED的厚度(沿著加壓板移動的方向的厚度)變厚，則即使推動件P接觸到電子部件ED，也無法實現推動件P的基底PB和嵌件I之間的接觸，而且也無法實現支撐導軌SRa、SRb與握持導軌GRa、GRb之間的接觸。在此情況下，存在著由於推動件P的過度的加壓力被施加到電子部件ED而導致電子部件ED受損的問題。由於存在著上述的問題，如果改變所需要測試的電子部件的厚度，則必須得更換加壓板110及支撐導軌SRa 、SRb 等。因此，會伴隨重加壓板110的更換所帶來的繁瑣和操作率的降低。As mentioned above, the prior art has a mechanical structure in which the base PB of the pusher P is brought into contact with the insert I in order to prevent excessive pressing of the pusher P, and the support rails SR a and SR b are also brought into contact. Hold the rails GR a and GR b . However, if the thickness of the electronic component ED (thickness in the direction in which the pressure plate moves) becomes thick, even if the pusher P comes into contact with the electronic component ED, it cannot be achieved between the base PB of the pusher P and the insert I. The contact between the support rails SR a and SR b and the holding rails GR a and GR b cannot be achieved. In this case, there is a problem that the electronic component ED is damaged due to the excessive pressing force of the pusher P being applied to the electronic component ED. Due to the aforementioned problems, if the thickness of the electronic component to be tested is changed, the pressure plate 110 and the supporting rails SR a , SR b and the like must be replaced. Therefore, it is accompanied by tediousness and a reduction in operation rate due to replacement of the heavy pressure plate 110.
本發明的目的在於提供一種即使所需要測試的電子部件的厚度或長度改變也無需進行加壓板的更換的技術。An object of the present invention is to provide a technology that does not require replacement of a pressure plate even if the thickness or length of an electronic component to be tested changes.
用於實現上述目的的用於測試電子部件的分選機的加壓裝置包括：加壓板，具有用於對裝載於測試托盤的電子部件進行加壓的推動件；第一驅動源，使所述加壓板朝向測試機前進，以借助所述加壓板而對裝載於所述測試托盤的電子部件朝向測試機側進行加壓，從而使電子部件電連接到測試機，或者使加壓板後退而解除借助所述加壓板的針對電子部件的加壓，從而使電子部件從測試機電分離，其中所述前進表示加壓板朝向測試機側移動，所述後退表示加壓板朝向從測試機遠離的方向移動；握持導軌，用於握持位於測試位置的所述測試托盤；及第二驅動源，使所述握持導軌從標準位置朝向所述加壓板側後退，以使被所述握持導軌握持的測試托盤中的電子部件接觸到所述推動件，或者使所述握持導軌前進而解除電子部件和所述推動件之間的接觸。A pressing device of a sorting machine for testing electronic components for achieving the above-mentioned purpose includes: a pressing plate having a pusher for pressing the electronic components loaded on the test tray; a first driving source, The pressing plate is advanced toward the testing machine to press the electronic components loaded on the test tray toward the testing machine side by the pressing plate, so that the electronic components are electrically connected to the testing machine, or the pressing plate is pressed. Backward to release the pressure on the electronic component by the pressure plate, thereby separating the electronic component from the test electromechanical, wherein the advance indicates that the pressure plate moves toward the testing machine side, and the backward indicates that the pressure plate faces from the test The machine moves away from the direction; a holding guide for holding the test tray at the test position; and a second drive source to make the holding guide back from the standard position toward the pressure plate side so that the The electronic components in the test tray held by the holding guide contact the pushing member, or the holding guide is advanced to release the contact between the electronic components and the pushing member.
所述第二驅動源以能夠與所述加壓板的前進和後退聯動地前進或後退的方式結合於所述加壓板側。The second drive source is coupled to the pressure plate side so as to be able to move forward or backward in association with the forward and backward movement of the pressure plate.
還包括：設置框架，固定於所述加壓板，並與所述加壓板一同前進和後退，而且所述第二驅動源結合於所述設置框架。 The method further includes a setting frame fixed to the pressure plate and moving forward and backward together with the pressure plate, and the second driving source is coupled to the setting frame.
如果所述第二驅動源使所述握持導軌向所述加壓板側後退，則所述第一驅動源使所述加壓板朝向測試機前進，從而實現電子部件和測試機之間的電連接，如果所述第一驅動源使所述加壓板後退而解除電子部件和測試機之間的電連接，則所述第二驅動源使所述握持導軌前進而使測試機和加壓板之間的間距變大。 If the second driving source moves the holding rail backward toward the pressure plate side, the first driving source advances the pressure plate toward the testing machine, thereby realizing a gap between the electronic component and the testing machine. Electrical connection, if the first drive source retracts the pressure plate and releases the electrical connection between the electronic component and the test machine, the second drive source advances the holding rail to advance the test machine and the The distance between the pressure plates becomes larger.
當所述加壓板借助所述第一驅動源的操作而向測試機前進時，在所述握持導軌和所述加壓板之間的間距被保持的狀態下，所述握持導軌也一起前進。 When the pressure plate is advanced to the testing machine by the operation of the first driving source, in a state where the distance between the holding rail and the pressure plate is maintained, the holding rail is also Go forward together.
所述握持導軌借助所述第二驅動源而後退的距離由所述握持導軌移動的方向上的電子部件的厚度或長度所決定。 The distance that the holding rail is retracted by the second driving source is determined by the thickness or length of the electronic component in the direction in which the holding rail moves.
所述握持導軌借助所述第一驅動源而前進的距離由所述握持導軌移動的方向上的電子部件的厚度或長度所決定。 The distance that the holding rail advances by the first drive source is determined by the thickness or length of the electronic component in the direction in which the holding rail moves.
根據如前述的本發明，可以採用如下的方法：握持導軌預先朝向加壓板側移動，從而電子部件和推動件接觸，之後加壓板和握持導軌在握持導軌和加壓板之間的間距被保持的狀態下朝向測試機側前進，從而電子部件電連接到測試機。因此，即使電子部件的厚度或長度(表示沿著加壓板進行前進和後退的方向的厚度或長度)改變，只要設定好握持導軌的後退距離和加壓板的前進距離即可，因此無需更換加壓板，從而具有能夠提高設備的操作率的效果。According to the present invention as described above, a method may be adopted in which the holding rail is moved in advance toward the pressure plate side so that the electronic component and the pusher are in contact, and then the pressure plate and the holding rail are between the holding rail and the pressure plate. The electronic components are electrically connected to the tester by advancing toward the tester side while the pitch is maintained. Therefore, even if the thickness or length of the electronic component (indicating the thickness or length along the direction in which the pressure plate advances and retracts) is changed, it is only necessary to set the retreat distance of the holding rail and the advance distance of the pressure plate. Replacing the pressure plate has the effect of improving the operating rate of the equipment.
以下，參照附圖而對如前述的根據本發明的優選實施例進行說明，在此，為了實現說明的簡潔性，儘量減少或壓縮重複的說明。 ＜ 針對基本構成的說明 ＞ Hereinafter, preferred embodiments according to the present invention will be described with reference to the accompanying drawings. Here, in order to achieve conciseness of the description, redundant descriptions are reduced or compressed as much as possible. ＜ Explanation of basic structure ＞
圖5是關於具有實現本發明所需要的基本構成的用於測試電子部件的分選機的加壓裝置500（以下，簡稱為「加壓裝置」）的示意圖。FIG. 5 is a schematic diagram of a pressurizing device 500 (hereinafter, simply referred to as a “pressurizing device”) for a sorting machine for testing electronic components having a basic configuration required to implement the present invention.
加壓裝置500包括：加壓板510、第一驅動源520、握持導軌530a和530b、第二驅動源540、移動框架550、設置框架560。The pressurizing device 500 includes a pressurizing plate 510, a first driving source 520, holding rails 530a and 530b, a second driving source 540, a moving frame 550, and a setting frame 560.
加壓板510具有用於對裝載於測試盤TT的電子部件ED（例如，半導體元件）進行加壓的推動件P。當然，如同韓國公開專利10-2015-0014357等，推動件P配備成如下的形態：以使加壓板510能夠沿著前進和後退的方向進退預定間距的方式被彈性支撐。The pressure plate 510 includes a pusher P for pressing an electronic component ED (for example, a semiconductor element) mounted on the test disk TT. Of course, like Korean Published Patent No. 10-2015-0014357, etc., the pusher P is provided in a form that is elastically supported so that the pressure plate 510 can advance and retreat by a predetermined distance in the forward and backward directions.
第一驅動源520使加壓板510朝向測試機TESTER側方向前進，或者使其向反方向後退。據此，如果加壓板510向測試機TESTER側方向前進，則加壓板510的推動件P將電子部件ED朝向測試機TESTER側加壓，從而電子部件ED電連接到測試機TESTER的測試插槽（Test Socket）TS，並且如果加壓板510後退，則借助加壓板510的電子部件ED的加壓將會被解除，從而電子部件ED從測試機TESTER電分離。在此，前進表示加壓板510朝向測試機TESTER而移動，後退表示加壓板510朝向從測試機TESTER遠離的方向移動。因此，前進方向和後退方向可以根據將要採用加壓裝置500的分選機的結構（水平式或垂直式）或者方向定義而採用上下方向、前後方向、左右方向中的任意一種。如前述的第一驅動源520優選地配備為伺服電機，以能夠調整加壓板510的前進和後退的距離。The first driving source 520 advances the pressurizing plate 510 toward the TESTER side of the testing machine, or retreats it in the opposite direction. According to this, if the pressure plate 510 is advanced toward the tester TESTER side, the pusher P of the pressure plate 510 presses the electronic component ED toward the tester TESTER side, so that the electronic component ED is electrically connected to the test plug of the tester TESTER. Test Socket TS, and if the pressure plate 510 is retracted, the pressure of the electronic component ED by the pressure plate 510 is released, and the electronic component ED is electrically separated from the tester TESTER. Here, forward indicates that the pressure plate 510 is moving toward the tester TESTER, and backward indicates that the pressure plate 510 is moving in a direction away from the tester TESTER. Therefore, the forward direction and the backward direction may adopt any one of the up-down direction, the front-rear direction, and the left-right direction according to the structure (horizontal type or vertical type) or the direction definition of the sorter to which the pressurizing device 500 is to be used. The first driving source 520 as described above is preferably equipped as a servo motor to be able to adjust the forward and backward distances of the pressure plate 510.
握持導軌530a、530b配備成彼此對應的一對，並握持在循環路徑上移動至測試位置的測試盤TT的兩端。The grip rails 530a, 530b are provided as a pair corresponding to each other, and hold both ends of the test disc TT that moves to the test position on the circulation path.
第二驅動源540使握持導軌530a、530b從標準位置P1 向加壓板510側後退，以使被握持導軌530a、530b握持的測試托盤TT的電子部件ED接觸到推動件P，或者使握持導軌530a、530b前進，從而解除電子部件ED和推動件P之間的接觸。這種第二驅動源540也優選地配備為伺服電機，以能夠調整前進和後退的距離。而且，第二驅動源540結合於加壓板510側，以能夠與加壓板510的前進和後退聯動而一起前進或後退。A second driving source 540 so that the grip rail 530a, 530b. 1 is retracted from the normal position P toward the pressing plate 510 side, so that the grip rail 530a, 530b grip the test tray TT of the electronic component in contact with the pusher ED P, Alternatively, the holding rails 530a, 530b are advanced to release the contact between the electronic component ED and the pusher P. Such a second driving source 540 is also preferably equipped as a servo motor to be able to adjust the forward and backward distances. Further, the second drive source 540 is coupled to the pressure plate 510 side so as to be able to move forward or backward in conjunction with the forward and backward movement of the pressure plate 510.
移動框架550根據第二驅動源540的操作而前進或後退，並且借助結合台JR而固定結合於握持導軌530a、530b。這種移動框架550與多個結合台JR一同使第二驅動源540的驅動力被均勻地傳遞至握持導軌530a、530b。The moving frame 550 moves forward or backward in accordance with the operation of the second driving source 540, and is fixedly coupled to the holding rails 530a, 530b via a coupling table JR. Such a moving frame 550, together with a plurality of coupling tables JR, uniformly transmits the driving force of the second driving source 540 to the holding rails 530a and 530b.
設置框架560為了設置第二驅動源540而配備。即，第二驅動源540固定設置於設置框架560。而且，設置框架560借助結合棒JB而固定於加壓板510，因此與加壓板510一同前進或後退。因此，第二驅動源540可以通過設置框架560而結合於加壓板510側，從而與加壓板510聯動而前進或後退。The setting frame 560 is provided for setting the second driving source 540. That is, the second driving source 540 is fixed to the installation frame 560. Furthermore, since the installation frame 560 is fixed to the pressure plate 510 by a bonding rod JB, the installation frame 560 moves forward or backward together with the pressure plate 510. Therefore, the second driving source 540 may be coupled to the pressure plate 510 side by providing the frame 560 so as to move forward or backward in conjunction with the pressure plate 510.
繼續對如前述的加壓裝置500的操作進行說明。The operation of the pressurizing device 500 as described above is continued.
如圖5所示，如果裝載有需要被測試的電子部件ED的測試托盤TT被握持導軌530a、530b握持，則第二驅動源540進行操作而使位於標準位置P1 的握持導軌530a、530b朝向加壓板510側後退。據此，如圖6所示，握持導軌530a、530b後退至接觸位置P2 ，從而測試托盤TT的電子部件ED將被推動件P接觸支撐。As shown in FIG. 5, if the test tray TT loaded with the electronic component ED to be tested is held by the holding rails 530 a and 530 b, the second driving source 540 is operated to make the holding rail 530 a located at the standard position P 1 . 530b moves backward toward the pressure plate 510 side. Accordingly, as shown in FIG. 6, the holding rails 530 a and 530 b are retracted to the contact position P 2 , so that the electronic component ED of the test tray TT is contacted and supported by the pusher P.
在圖6的狀態下，第一驅動源520進行操作而使加壓板510朝向測試機TESTER而前進。因此，結合於加壓板510側的設置框架560、第二驅動源540、移動框架550及握持導軌530a、530b聯動而一同前進。而且，顯然，被握持導軌530a、530b握持的測試托盤TT也將前進，從而如圖7所示，電子部件ED電連接到測試機TESTER的測試插槽TS。顯然，握持導軌530a、530b會將其與加壓板510之間的間距D保持圖6的狀態並前進。In the state of FIG. 6, the first driving source 520 is operated to advance the pressure plate 510 toward the tester TESTER. Therefore, the installation frame 560, the second drive source 540, the moving frame 550, and the holding rails 530a and 530b coupled to the pressure plate 510 side advance in unison. Moreover, it is clear that the test tray TT held by the holding rails 530a, 530b will also advance, so that as shown in FIG. 7, the electronic component ED is electrically connected to the test slot TS of the tester TESTER. Obviously, holding the guide rails 530a and 530b keeps the distance D between the guide rails 530a and 530b in the state shown in FIG. 6 and advances.
在如圖7所示的狀態下，如果完成針對電子部件ED的測試，則第一驅動源520使加壓板510後退，從而解除電子部件ED和測試機TESTER之間的電連接，從而返回到圖6的狀態，接著，第二驅動源540使握持導軌530a、530b前進，從而使測試托盤TT和加壓板510之間的間距變大。據此，握持導軌530a、530b將會返回至能夠在循環路徑上適當地引導測試托盤TT的移動的標準位置P1。 In the state shown in FIG. 7, if the test for the electronic component ED is completed, the first driving source 520 retracts the pressure plate 510, thereby releasing the electrical connection between the electronic component ED and the tester TESTER, and returns to In the state shown in FIG. 6, the second driving source 540 advances the holding rails 530 a and 530 b, thereby increasing the distance between the test tray TT and the pressure plate 510. Accordingly, gripping the rail 530a, 530b will return to the normal position can be appropriately guided to move the test tray TT P 1 of the circulation path.
另外，所需要測試的電子部件ED的厚度(表示沿著加壓板移動的方向上的厚度)變厚，則握持導軌530a、530b的前進距離和後退距離以及加壓板510的前進距離和後退距離也應與電子部件的變厚的長度對應地調整為較短的距離。因此，管理者可以利用未圖示的分選機的輸入裝置而輸入電子部件ED的厚度，從而可以預先設定握持導軌530a、530b的前進和後退距離以及加壓板510的前進和後退距離。當然，根據實施方式，還可以實現為如下：在最初的操作時感測基於握持導軌530a、530b的後退的第二驅動源540的負荷，從而使未圖示的控制裝置能夠自動設定握持導軌530a、530b的前進和後退距離以及加壓板510的前進和後退距離。據此，借助推動件P而被施加到電子部件ED的加壓力將會與電子部件ED的厚度無關地保持恒定。 In addition, as the thickness of the electronic component ED to be tested (thickness in the direction along which the pressure plate moves) becomes thicker, the forward and backward distances of the holding rails 530a, 530b and the forward distance and The back-off distance should also be adjusted to a shorter distance corresponding to the thickened length of the electronic component. Therefore, the manager can input the thickness of the electronic component ED by using an input device of a sorting machine (not shown), so that the forward and backward distances of the holding rails 530 a and 530 b and the forward and backward distances of the pressure plate 510 can be set in advance. Of course, according to the embodiment, it can also be implemented as follows: sensing the load of the second driving source 540 based on the backward movement of the holding guides 530a and 530b during the initial operation, so that a control device (not shown) can automatically set the holding The forward and backward distances of the guide rails 530a, 530b and the forward and backward distances of the pressure plate 510. According to this, the pressing force applied to the electronic component ED by the pusher P will remain constant regardless of the thickness of the electronic component ED.
在如前述的加壓裝置500中，第一驅動源520或第二驅動源540的設置位置、移動框架550或設置框架560的配備與否或結構等可以與多樣的形態的分選機對應地實現多樣的變形。此外，在圖5的例中，構成了一種動力傳遞結構，以能夠利用滑輪Pa、Pb、Pc、Pd和螺紋結合方式而將來自第一驅動源520或第二驅動源540的驅動力傳遞給設置框架560或移動框架550，然而驅動力的傳遞結構可以根據實施方式而變形為多樣的形態。In the pressurizing device 500 as described above, the installation position of the first drive source 520 or the second drive source 540, whether or not the mobile frame 550 or the installation frame 560 is provided, or the structure, etc. can correspond to various types of sorters. Achieve various transformations. In addition, in the example of FIG. 5, a power transmission structure is constituted so that the driving force from the first driving source 520 or the second driving source 540 can be combined by using the combination of the pulleys P a , P b , P c , P d and the screw. The driving force is transmitted to the setting frame 560 or the moving frame 550. However, the driving force transmission structure may be modified into various forms according to the embodiment.
＜< 參考例Reference example ＞＞
圖8圖示關於一種加壓裝置500A的參考例，所述加壓裝置500A可用於將沿著上下方向而長長地裝載於測試托盤TT的電子部件ED'（例如，SSD或模組RAM）電連接到下方的測試機TESTER。FIG. 8 illustrates a reference example of a pressurizing device 500A that can be used to load electronic components ED ′ (for example, SSD or module RAM) that are long and vertically loaded on the test tray TT in the up-down direction. Electrically connected to the lower tester TESTER.
圖8的加壓裝置500A也同樣包含加壓板510A、第一驅動源520A、握持導軌530Aa 、530Ab 、第二驅動源540A、移動框架550A及設置框架560A，且與圖5的加壓裝置500相同地操作。＜ 具體的應用例 ＞ The pressurizing device 500A of FIG. 8 also includes a pressurizing plate 510A, a first driving source 520A, holding rails 530A a , 530A b , a second driving source 540A, a moving frame 550A, and a setting frame 560A. The pressing device 500 operates the same. ＜ Specific application examples ＞
圖9示出在用於支撐針對SSD或模組RAM等電子部件的測試的分選機中實際應用的加壓裝置500B。FIG. 9 shows a pressurizing device 500B that is practically used in a sorter for supporting testing of electronic components such as SSDs or module RAMs.
圖9中，為了一次性測試記載於兩個測試托盤TT1、TT2的電子部件，配備有兩個加壓板510B1 、510B2 。而且，與該結構（使兩個加壓板一同前進和後退的結構）和基於空間的確保的設計條件等對應地，如下要素會變形而配備：加壓板510B1 、510B2 ；第一驅動源520B；握持導軌530Ba1 、530Bb1 、530Ba2 、530Bb2 ；第二驅動源540B；移動框架550B1 、550B2 ；及設置框架560B。In FIG. 9, in order to test electronic components recorded on two test trays TT1 and TT2 at one time, two pressure plates 510B 1 and 510B 2 are provided . Further, in accordance with this structure (a structure that advances and retreats the two pressure plates together) and design conditions based on securing space, the following elements are deformed and provided: the pressure plates 510B 1 , 510B 2 ; the first drive source 520B; a grip rail 530Ba 1, 530Bb 1, 530Ba 2 , 530Bb 2; second driving source 540B; moving frame 550B 1, 550B 2; and a set frame 560B.
對圖9的加壓裝置500B的情況而言，除了兩個加壓板510B1 、510B2 一起聯動而升降的情況不同以外，與圖5的加壓裝置500或圖8的加壓裝置500A相同地操作。The case of the pressurizing device 500B of FIG. 9 is the same as that of the pressurizing device 500A of FIG. 5 or the pressurizing device 500A of FIG. 8 except that the two pressurizing plates 510B 1 and 510B 2 interlock and lift together.地 OPERATION.
未說明的標號G是用於引導握持導軌530Ba1 、530Bb1 、530Ba2 、530Bb2 和移動框架550B1 、550B2 的適當的前進和後退的引導裝置。The unexplained reference numeral G is a guide for appropriately advancing and retreating the holding rails 530Ba 1 , 530Bb 1 , 530Ba 2 , 530Bb 2 and the moving frames 550B 1 , 550B 2 .
供作為參考，圖9中，為了能夠被相互比較，附圖標號530Ba1 和530Bb1 的握持導軌示出為朝向附圖標號510B1 的加壓板側後退的狀態，而附圖標號530Ba2 和530Bb2 的握持導軌示出為位於標準位置的狀態。當然，在實際的操作程序中，實現為所有的握持導軌530Ba1 、530Bb1 、530Ba2 、530Bb2 一起前進和後退，然而根據實施方式，如圖9所示，還可以僅使兩側的握持導軌530Ba1 、530Bb1 /530Ba2 、530Bb2 獨立地前進和後退。For reference, in FIG. 9, in order to be able to be compared with each other, the holding rails of the reference numerals 530Ba 1 and 530Bb 1 are shown in a state of receding toward the pressure plate side of the reference numeral 510B 1 , and the reference numeral 530Ba 2 The 530Bb 2 and 530Bb 2 are shown in a standard position. Of course, in the actual operation procedure, it is realized that all the holding rails 530Ba 1 , 530Bb 1 , 530Ba 2 , and 530Bb 2 move forward and backward together. However, according to the embodiment, as shown in FIG. The grip rails 530Ba 1 , 530Bb 1 / 530Ba 2 , 530Bb 2 move forward and backward independently.
如前述，已根據參照附圖說明的實施例而進行了針對本發明的具體的說明，然而，上述實施例僅僅將本發明的優選實施例作為一例而進行了說明，因此，本發明不應被理解為局限於上述的實施例，本發明的權利範圍應被理解為申請專利範圍的範圍及與此等同的概念。As mentioned above, the specific description of the present invention has been made based on the embodiments described with reference to the drawings. However, the above embodiments have only described the preferred embodiments of the present invention as an example, and therefore, the present invention should not be It is understood that it is limited to the above-mentioned embodiments, and the scope of rights of the present invention should be understood as the scope of the scope of patent application and the concepts equivalent thereto.
C‧‧‧循環路徑
D‧‧‧間距
ED‧‧‧電子部件
ED'‧‧‧電子部件
G‧‧‧引導位置
GRa、GRb‧‧‧握持導軌
HD‧‧‧分選機
I‧‧‧嵌件
JB‧‧‧結合棒
JR‧‧‧結合台
LP‧‧‧裝載位置
P‧‧‧推動件
PB‧‧‧基底
Pa、Pb、Pc、Pd‧‧‧滑輪
P1‧‧‧標準位置
P2‧‧‧接觸位置
S‧‧‧彈簧
SRa、SRb‧‧‧支撐導軌
TESTER‧‧‧測試機
TP‧‧‧測試位置
TS‧‧‧測試插槽
TT‧‧‧測試托盤
TT1、TT2‧‧‧測試托盤
UP‧‧‧卸載位置
W‧‧‧牆面
100‧‧‧加壓裝置
110‧‧‧加壓板
500‧‧‧用於測試電子部件的分選機的加壓裝置（加壓裝置）
500A‧‧‧加壓裝置
500B‧‧‧加壓裝置
510‧‧‧加壓板
510A‧‧‧加壓板
510B1、510B2‧‧‧加壓板
520‧‧‧第一驅動源
520A‧‧‧第一驅動源
520B‧‧‧第一驅動源
530a、530b‧‧‧握持導軌
530Aa、530Ab‧‧‧握持導軌
530Ba1、530Bb1、530Ba2、530Bb2‧‧‧握持導軌
540‧‧‧第二驅動源
540A‧‧‧第二驅動源
540B‧‧‧第二驅動源
550‧‧‧移動框架
550A‧‧‧移動框架
550B1、550B2‧‧‧移動框架
560‧‧‧設置框架
560A‧‧‧設置框架
560B‧‧‧設置框架C‧‧‧Circulation path
D‧‧‧Pitch
ED‧‧‧Electronic components
ED'‧‧‧Electronic components
G‧‧‧Guide position
GR a 、 GR b ‧‧‧ Holding rail
HD‧‧‧ Sorting Machine
I‧‧‧ Insert
JB‧‧‧Combination Stick
JR‧‧‧Combination Station
LP‧‧‧ Loading position
P‧‧‧ Pusher
P B ‧‧‧ substrate
P a , P b , P c , P d ‧‧‧ pulley
P 1 ‧‧‧standard position
P 2 ‧‧‧Contact position
S‧‧‧Spring
SR a , SR b ‧‧‧ support rail
TESTER‧‧‧Tester
TP‧‧‧Test location
TS‧‧‧test slot
TT‧‧‧test tray
TT1, TT2‧‧‧test tray
UP‧‧‧ unload location
W‧‧‧Wall
100‧‧‧Pressure device
110‧‧‧Pressure plate
500‧‧‧ Pressing device (pressurizing device) of a sorting machine for testing electronic components
500A‧‧‧Pressure device
500B‧‧‧Pressure device
510‧‧‧Pressure plate
510A‧‧‧Pressure plate
510B 1 , 510B 2 ‧‧‧Pressure plate
520‧‧‧First drive source
520A‧‧‧First drive source
520B‧‧‧First drive source
530a, 530b‧‧‧ Holding rail
530A a , 530A b ‧‧‧ Holding rail
530Ba 1 , 530Bb 1 , 530Ba 2 , 530Bb 2 ‧‧‧ Holding rail
540‧‧‧Second drive source
540A‧‧‧Second drive source
540B‧‧‧Second drive source
550‧‧‧mobile frame
550A‧‧‧Mobile Frame
550B 1 , 550B 2 ‧‧‧ mobile frame
560‧‧‧Setting the frame
560A‧‧‧Setting the frame
560B‧‧‧Setting the frame
圖1是用於說明測試盤在水平式分選機中循環的路徑的示意性的平面圖。FIG. 1 is a schematic plan view for explaining a path in which a test disc circulates in a horizontal sorter.
圖2是用於說明在現有的分選機中設置握持導軌的結構的參考圖。FIG. 2 is a reference diagram for explaining a structure in which a holding rail is provided in a conventional sorter.
圖3及圖4是用於說明在圖2的分選機中的握持導軌的前進和後退的參考圖。3 and 4 are reference views for explaining the forward and backward movement of the grip rail in the sorting machine of FIG. 2.
圖5是針對具有實現本發明所需要的基本構成的用於測試電子部件的分選機的加壓裝置的示意圖。FIG. 5 is a schematic view of a pressurizing device for a sorting machine for testing electronic components having a basic configuration required to implement the present invention.
圖6及圖7是用於說明圖5的加壓裝置的操作的按各個階段的操作狀態圖。6 and 7 are operation state diagrams for explaining the operation of the pressurizing device of FIG. 5 at each stage.
圖8是為了實現不同種類的電子部件的加壓而應用圖5的加壓裝置的、關於加壓裝置的示意圖。FIG. 8 is a schematic diagram of a pressurizing device to which the pressurizing device of FIG. 5 is applied in order to pressurize different types of electronic components.
圖9是關於根據採用兩個加壓板的具體應用例的加壓裝置的立體圖。FIG. 9 is a perspective view of a pressure device according to a specific application example using two pressure plates.
無no
Claims (7)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ??10-2016-0019708 | 2016-02-19 | ||
| KR1020160019708A KR102473315B1 (en) | 2016-02-19 | 2016-02-19 | Pushing apparatus of handler for testing electronic devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201732308A TW201732308A (en) | 2017-09-16 |
| TWI624675B true TWI624675B (en) | 2018-05-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106104218A TWI624675B (en) | 2016-02-19 | 2017-02-09 | Pushing apparatus of handler for testing electronic devices |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102473315B1 (en) |
| CN (1) | CN107096731B (en) |
| TW (1) | TWI624675B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102432981B1 (en) * | 2017-11-03 | 2022-08-18 | (주)테크윙 | Picking apparatus for handler supporting test of electronic components |
| KR20200071357A (en) * | 2018-12-11 | 2020-06-19 | (주)테크윙 | Handler for testing electronic components |
| KR20230060187A (en) * | 2021-10-27 | 2023-05-04 | (주)테크윙 | Holder for handler of electronic component |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1752778A2 (en) * | 2005-08-09 | 2007-02-14 | Mirae Corporation | IC Sorter |
| TW200848758A (en) * | 2007-04-13 | 2008-12-16 | Tech Wing Co Ltd | Insert for carrier board of test handler |
| JP2011247908A (en) * | 2011-09-14 | 2011-12-08 | Seiko Epson Corp | Maintenance method of positioning device and positioning device of ic handler |
| TW201439557A (en) * | 2013-04-03 | 2014-10-16 | Techwing Co Ltd | Handler for testing semiconductor |
| TW201539637A (en) * | 2014-04-10 | 2015-10-16 | Techwing Co Ltd | Test sorting machine and its advancing device, test tray and test machine interface board |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008032397A1 (en) | 2006-09-15 | 2008-03-20 | Advantest Corporation | Electronic component testing apparatus |
| KR100993196B1 (en) * | 2007-10-31 | 2010-11-10 | (주)테크윙 | Carrier board circulation method of test handler and test handler |
| CN201522544U (en) * | 2009-06-09 | 2010-07-07 | 常熟阿特斯阳光电力科技有限公司 | Detecting device used for diodes inside terminal box |
| KR101104413B1 (en) * | 2009-09-25 | 2012-01-16 | 세크론 주식회사 | Connecting apparatus for testing a semiconductor device and test handler including the same |
| KR101559416B1 (en) * | 2011-10-31 | 2015-10-13 | (주)테크윙 | Pushing apparatus for test handler and test handler |
| CN105259413B (en) * | 2015-11-02 | 2018-01-05 | 天津卡锐智科技发展有限公司 | The miniature resistance automatic test machine of mobile phone |
-
2016
- 2016-02-19 KR KR1020160019708A patent/KR102473315B1/en active IP Right Grant
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2017
- 2017-02-09 TW TW106104218A patent/TWI624675B/en active
- 2017-02-16 CN CN201710084862.0A patent/CN107096731B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1752778A2 (en) * | 2005-08-09 | 2007-02-14 | Mirae Corporation | IC Sorter |
| TW200848758A (en) * | 2007-04-13 | 2008-12-16 | Tech Wing Co Ltd | Insert for carrier board of test handler |
| JP2011247908A (en) * | 2011-09-14 | 2011-12-08 | Seiko Epson Corp | Maintenance method of positioning device and positioning device of ic handler |
| TW201439557A (en) * | 2013-04-03 | 2014-10-16 | Techwing Co Ltd | Handler for testing semiconductor |
| TW201539637A (en) * | 2014-04-10 | 2015-10-16 | Techwing Co Ltd | Test sorting machine and its advancing device, test tray and test machine interface board |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201732308A (en) | 2017-09-16 |
| CN107096731B (en) | 2019-07-19 |
| CN107096731A (en) | 2017-08-29 |
| KR102473315B1 (en) | 2022-12-02 |
| KR20170097960A (en) | 2017-08-29 |
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