TWI505051B - A plurality of electronic components can be positioned at the same time positioning device and its application of the operating equipment - Google Patents
A plurality of electronic components can be positioned at the same time positioning device and its application of the operating equipment Download PDFInfo
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- TWI505051B TWI505051B TW103103154A TW103103154A TWI505051B TW I505051 B TWI505051 B TW I505051B TW 103103154 A TW103103154 A TW 103103154A TW 103103154 A TW103103154 A TW 103103154A TW I505051 B TWI505051 B TW I505051B
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Description
本發明係提供一種可一次同時對多顆電子元件作中心定位，以供移載裝置準確將電子元件置入承置器之容置槽，進而提升定位效能及作業品質之定位裝置。The invention provides a positioning device capable of centrally positioning a plurality of electronic components at the same time for the transfer device to accurately place the electronic components into the receiving slots of the socket, thereby improving positioning performance and work quality.
在現今，電子元件積極朝向小巧輕薄的小體積發展，並以料盤或載台等承置器盛裝複數個電子元件，請參閱第1圖，以具有複數個容置槽111之料盤11為例，料盤11為了使電子元件12可於容置槽111順利移入或移出，料盤11之容置槽111與電子元件12間勢必會有間隙，而該間隙的存在將導致電子元件12於容置槽111內任意漂移，使電子元件12之中心位置與容置槽111之中心位置具有偏移誤差；當自動化作業設備以移載裝置之取放器將小體積之電子元件由料盤11移載置入於測試座內時，其電性接觸部(如錫球)與測試座之電性接點(如探針)對位的精準度要求相當高，若精準度稍有偏差，即使得電子元件之電性接觸部無法與測試座之電性接點作有效接觸，而降低測試作業的品質，尤其在講求生產效能的趨勢下，自動化設備之移載裝置係一次移載多顆電子元件，若多顆電子元件分別於複數個容置槽內任意漂移，多顆電子元件之電性接觸部與複數個測試座之電性接點的對位精準度更容易產生問題而影響測試作業。Nowadays, electronic components are actively moving toward a small, compact and small size, and a plurality of electronic components are mounted on a tray or a carrier. Referring to FIG. 1, a tray 11 having a plurality of accommodating grooves 111 is used. For example, in order to enable the electronic component 12 to be smoothly moved in or out of the accommodating groove 111, there is a gap between the accommodating groove 111 of the tray 11 and the electronic component 12, and the presence of the gap will cause the electronic component 12 to be Any drift in the accommodating groove 111 causes the center position of the electronic component 12 to have an offset error with the center position of the accommodating groove 111; when the automated working device uses the pick-and-place device of the transfer device to take a small-volume electronic component from the tray 11 When the transfer is placed in the test socket, the accuracy of the alignment between the electrical contact (such as the solder ball) and the electrical contact (such as the probe) of the test stand is quite high. If the accuracy is slightly deviated, even if The electrical contact of the electronic component can not make effective contact with the electrical contact of the test stand, and the quality of the test operation is lowered, especially in the trend of production efficiency, the transfer device of the automatic device transfers multiple electrons at a time. Component, if multiple electronic elements A plurality of drift respectively receiving groove arbitrary, para electrical contact electrical contacts of the plurality pieces of electronic component test socket portion and a plurality of accuracy is more prone to problems affecting the test job.
然請參閱第2圖，係為移載裝置於料盤及測試座間移載多顆電子元件之示意圖，該料盤11係設有複數個容置槽111盛裝多顆待作業之電子元件12，由於容置槽111與電子元件12間具有間隙，使得電子元件12於容置槽111內會任意漂移，該移載裝置13係具有複數個可取放電子元件12之取放器131，移載裝置13係帶動複數個取放器131作第一、二方向(如X、Y方向)位移至料盤11上方，令複數個取放器131對應於料盤11之複數個容置槽111，並作第三方向(如 Z方向)位移而於容置槽111取出待作業之電子元件12，該移載裝置13之複數個取放器131再將多顆待作業之電子元件12移載置入於測試座14，令電子元件12之電性接觸部121與測試座14之電性接點141(如探針)相互接觸而執行測試作業；惟，於使用上卻產生下列缺失：Please refer to FIG. 2 , which is a schematic diagram of transferring a plurality of electronic components between the tray and the test socket for the transfer device. The tray 11 is provided with a plurality of receiving slots 111 for holding a plurality of electronic components 12 to be operated. The electronic component 12 has a random drift in the accommodating groove 111. The transfer device 13 has a plurality of pickers 131 for the electronic component 12, and the transfer device The 13 series drives the plurality of pickers 131 to be displaced in the first and second directions (such as the X and Y directions) to the top of the tray 11, so that the plurality of pickers 131 correspond to the plurality of receiving slots 111 of the tray 11, and Make the third direction (such as The Z-direction is displaced to take out the electronic component 12 to be operated in the accommodating slot 111, and the plurality of pick-and-place devices 131 of the transfer device 13 transfer the plurality of electronic components 12 to be operated into the test socket 14 The electrical contact portion 121 of the electronic component 12 and the electrical contact 141 (such as a probe) of the test socket 14 are in contact with each other to perform a test operation; however, the following defects are caused in use:
1．料盤11之容置槽111與電子元件12間具有間隙，使電子元件12於容置槽111內任意漂移，導致電子元件12之中心位置相對於容置槽111之中心位置會產生偏離誤差，當移載裝置13之取放器131於料盤11取出偏移擺置之電子元件12，並移載至測試座14時，即會因電子元件12之中心位置相對於測試座14之中心位置具有偏離誤差，以致取放器131無法準確將電子元件12移入測試座14而執行測試作業。1. There is a gap between the accommodating groove 111 of the tray 11 and the electronic component 12, so that the electronic component 12 is arbitrarily drifted in the accommodating groove 111, and the center position of the electronic component 12 is offset from the center position of the accommodating groove 111. When the pick-and-place device 131 of the transfer device 13 takes out the offset electronic component 12 from the tray 11 and transfers it to the test socket 14, the center position of the electronic component 12 is relative to the center of the test socket 14. There is a deviation error such that the picker 131 cannot accurately move the electronic component 12 into the test socket 14 to perform a test operation.
2．由於電子元件12會於料盤11之容置槽111內任意位移，導致取放器131於料盤11取出偏置之電子元件12，當取放器131將電子元件12置入測試座14時，電子元件12亦會偏置或無法置入於測試座14內，以致電子元件12之電性接觸部無法與測試座14之電性接點作精準對位，而無法有效的執行作業，進而降低測試作業的品質。2. Since the electronic component 12 is arbitrarily displaced in the accommodating groove 111 of the tray 11, the pick-and-placer 131 takes out the biased electronic component 12 at the tray 11, when the pick-and-placer 131 places the electronic component 12 into the test socket 14. The electronic component 12 is also biased or cannot be placed in the test socket 14, so that the electrical contact portion of the electronic component 12 cannot be accurately aligned with the electrical contact of the test socket 14, and the operation cannot be performed efficiently. Reduce the quality of test work.
3．當取放器131發生將電子元件12偏置於測試座14之情況時，工作人員必須停機，而以人工方式重新擺置電子元件12，造成作業不便及降低生產效能之缺失。3. When the pick-and-placer 131 occurs to bias the electronic component 12 to the test socket 14, the worker must stop and manually reposition the electronic component 12, resulting in inconvenience in operation and a lack of production efficiency.
本發明之目的一，係提供一種可同時多顆電子元件定位之定位裝置，包含定位機構及驅動機構，該定位機構係設有複數個夾掣器，夾掣器係設有複數個可抵靠多顆電子元件之抵靠部，該驅動機構係設有至少一驅動源，用以驅動定位機構之至少一夾掣器相對另一夾掣器作至少一方向位移，夾掣器並以複數個抵靠部推移多顆電子元件，進而定位機構之複數個夾掣器係以複數個抵靠部抵靠夾持多顆電子元件作中心定位而防止任意漂移；藉此，可利用定位裝置一次同時定位多顆電子元件，使電子元件之基準部固定位於預設基準位置，並與移載裝置之取放器取放時中心的相 對位置固定，進而可準確將電子元件移載置入於承置器之容置槽，達到提升定位效能及作業品質之實用效益。A first object of the present invention is to provide a positioning device capable of simultaneously positioning a plurality of electronic components, comprising a positioning mechanism and a driving mechanism, wherein the positioning mechanism is provided with a plurality of clamping devices, and the clamping device is provided with a plurality of abuttable devices. a plurality of electronic component abutting portions, wherein the driving mechanism is provided with at least one driving source for driving at least one of the clamping devices to be displaced in at least one direction relative to the other clamping device, and the clamping device is in plurality The plurality of electronic components are moved by the abutting portion, and the plurality of the clamping devices of the positioning mechanism prevent the arbitrary drift by holding the plurality of electronic components together by the plurality of the abutting portions; thereby, the positioning device can be used simultaneously Positioning a plurality of electronic components such that the reference portion of the electronic component is fixed at a preset reference position and is centered with the pick-and-place device of the transfer device The position is fixed, and the electronic component can be accurately placed and placed in the receiving groove of the socket to achieve the practical benefit of improving the positioning performance and the working quality.
本發明之目的二，係提供一種可同時多顆電子元件定位之定位裝置，其中，該定位機構可利用複數個夾掣器之複數個抵靠部一次同時推移抵靠多顆電子元件定位而防止任意漂移，以利移載裝置將電子元件移載置入承置器(如測試座)之容置槽時，使電子元件之電性接觸部與測試座之電性接點準確對位，達到提升測試品質之實用效益。A second object of the present invention is to provide a positioning device capable of simultaneously positioning a plurality of electronic components, wherein the positioning mechanism can prevent a plurality of electronic components from being positioned at the same time by using a plurality of abutting portions of the plurality of clamps. Arbitrarily drifting, so that the transfer device can transfer the electronic components into the receiving slots of the socket (such as the test socket), so that the electrical contacts of the electronic components and the electrical contacts of the test socket are accurately aligned. Improve the practical benefits of test quality.
本發明之目的三，係提供一種可同時多顆電子元件定位之定位裝置，其中，該定位機構可利用複數個夾掣器之複數個抵靠部一次同時推移抵靠多顆電子元件定位而防止任意漂移，以利移載裝置將電子元件準確置入於承置器之容置槽，進而避免電子元件偏斜擺置及停機重新置放，達到提升作業便利性之實用效益。A third object of the present invention is to provide a positioning device capable of positioning a plurality of electronic components at the same time, wherein the positioning mechanism can prevent multiple positioning of a plurality of electronic components by using a plurality of abutting portions of a plurality of clamps at the same time. Arbitrary drift, in order to facilitate the transfer device to accurately place the electronic components in the receiving slot of the socket, thereby avoiding the deflection of the electronic components and resetting them, thereby achieving the practical benefit of improving the convenience of the operation.
本發明之目的四，係提供一種可同時多顆電子元件定位之定位裝置，其中，該定位機構可利用複數個夾掣器之複數個抵靠部一次同時推移抵靠多顆電子元件定位，該多顆電子元件係可為整盤電子元件，使移載裝置一次將多顆電子元件準確置入於複數個承置器，以減少移載裝置之移載次數，進而縮減作業時間，達到提升生產效能之實用效益。A fourth aspect of the present invention provides a positioning device capable of simultaneously positioning a plurality of electronic components, wherein the positioning mechanism can simultaneously position a plurality of electronic components by using a plurality of abutting portions of the plurality of clamping devices. A plurality of electronic components can be a whole set of electronic components, so that the transfer device can accurately place a plurality of electronic components into a plurality of mounts at a time, thereby reducing the number of transfer times of the transfer device, thereby reducing the operation time and improving production. Practical benefits of performance.
本發明之目的五，係提供一種應用電子元件定位裝置之作業設備，包含機台、供料裝置、收料裝置、作業裝置、移載裝置、定位裝置及中央控制裝置，其中，該供料裝置係裝配於機台，並設有至少一供料機構，用以容置至少一待作業之電子元件，該收料裝置係裝配於機台，並設有至少一收料機構，用以容置至少一已作業之電子元件，該作業裝置係設有至少一具承置器之作業機構，用以對電子元件執行預設作業，該移載裝置係配置於機台，並設有至少一移料機構，用以移載電子元件，該定位裝置係設有定位機構及驅動機構，用以一次同時定位多顆電子元件，該中央控制裝置係用以控制及整合各裝置作動，而執行自動化作業，達到提升作業生產效能之實用效益。A fifth object of the present invention is to provide an operation device for applying an electronic component positioning device, comprising a machine table, a feeding device, a receiving device, a working device, a transfer device, a positioning device and a central control device, wherein the feeding device Mounted on the machine table, and provided with at least one feeding mechanism for accommodating at least one electronic component to be operated, the receiving device is assembled on the machine table, and is provided with at least one receiving mechanism for accommodating At least one electronic component that has been operated, the working device is provided with at least one operating mechanism for the mounting device for performing a preset operation on the electronic component, the transfer device being disposed on the machine table and provided with at least one shift a material mechanism for transferring electronic components, the positioning device is provided with a positioning mechanism and a driving mechanism for simultaneously positioning a plurality of electronic components, and the central control device is used for controlling and integrating the operations of the devices to perform an automated operation. To achieve the practical benefits of improving the production efficiency of the operation.
〔習知〕[study]
11‧‧‧料盤11‧‧‧Tray
111‧‧‧容置槽111‧‧‧ accommodating slots
12‧‧‧電子元件12‧‧‧Electronic components
121‧‧‧電性接觸部121‧‧‧Electrical contact
13‧‧‧移載裝置13‧‧‧Transfer device
131‧‧‧取放器131‧‧‧ picker
14‧‧‧測試座14‧‧‧ test seat
141‧‧‧電性接點141‧‧‧Electrical contacts
〔本發明〕〔this invention〕
20‧‧‧定位裝置20‧‧‧ Positioning device
21‧‧‧定位機構21‧‧‧ Positioning agency
211‧‧‧第一定位件211‧‧‧First positioning piece
2111‧‧‧第一容置空間2111‧‧‧First accommodation space
2112‧‧‧第一斜面2112‧‧‧First bevel
2113‧‧‧第一抵靠部2113‧‧‧First Abutment
212‧‧‧第一承置件212‧‧‧First Mountings
213‧‧‧第二定位件213‧‧‧Second positioning parts
2131‧‧‧第二容置空間2131‧‧‧Second accommodation space
2132‧‧‧第二抵靠部2132‧‧‧Second Abutment
22‧‧‧驅動機構22‧‧‧ drive mechanism
221‧‧‧驅動器221‧‧‧ drive
222‧‧‧第一活動件222‧‧‧First activity
223‧‧‧第二活動件223‧‧‧Second event
224‧‧‧板體224‧‧‧ board
225‧‧‧滑軌組225‧‧‧slide group
20A‧‧‧第一定位裝置20A‧‧‧First Positioning Device
211A‧‧‧第一定位件211A‧‧‧First positioning piece
2111A‧‧‧第一容置空間2111A‧‧‧First accommodation space
2113A‧‧‧第一抵靠部2113A‧‧‧First Abutment
212A‧‧‧第一承置件212A‧‧‧First Mounting
213A‧‧‧第二定位件213A‧‧‧Second positioning parts
2131A‧‧‧第二容置空間2131A‧‧‧Second accommodating space
2132A‧‧‧第二抵靠部2132A‧‧‧Second Abutment
22A‧‧‧驅動機構22A‧‧‧ drive mechanism
221A‧‧‧驅動器221A‧‧‧ drive
20B‧‧‧第二定位裝置20B‧‧‧Second positioning device
31‧‧‧料盤31‧‧‧Tray
311‧‧‧容置槽311‧‧‧ accommodating slots
32‧‧‧電子元件32‧‧‧Electronic components
321‧‧‧電性接觸部321‧‧‧Electrical contact
33‧‧‧移載裝置33‧‧‧Transfer device
331‧‧‧取放器331‧‧‧ picker
34‧‧‧測試座34‧‧‧ test seat
341‧‧‧電性接點341‧‧‧Electrical contacts
40‧‧‧機台40‧‧‧ machine
50‧‧‧供料裝置50‧‧‧Feeding device
51‧‧‧供料機構51‧‧‧Feeding agency
52‧‧‧料盤52‧‧‧Tray
60‧‧‧作業裝置60‧‧‧Working device
61‧‧‧載送機構61‧‧‧ Carriers
611‧‧‧第一動力源611‧‧‧First power source
612‧‧‧第一傳動器612‧‧‧First actuator
613‧‧‧第一夾移器613‧‧‧First clamper
6131‧‧‧第一夾具6131‧‧‧First fixture
614‧‧‧第二夾移器614‧‧‧Second clipper
6141‧‧‧第二夾具6141‧‧‧Second fixture
615‧‧‧載台615‧‧‧ stage
6151‧‧‧容置槽6151‧‧‧ accommodating slots
6152‧‧‧穿孔6152‧‧‧Perforation
62‧‧‧取像機構62‧‧‧Image agency
621‧‧‧取像器621‧‧‧Imager
63‧‧‧作業機構63‧‧‧ operating agencies
631‧‧‧第二動力源631‧‧‧second power source
632‧‧‧第二傳動器632‧‧‧Second actuator
633‧‧‧第三傳動器633‧‧‧ Third actuator
634‧‧‧第四傳動器634‧‧‧fourth actuator
635‧‧‧第一連結座635‧‧‧ first joint
636‧‧‧第一膜片636‧‧‧First diaphragm
637‧‧‧第一連結件637‧‧‧First link
638‧‧‧第一活動座638‧‧‧The first activity seat
6381‧‧‧第一導引部件6381‧‧‧First guiding part
639‧‧‧第一接合部件639‧‧‧First joint parts
640‧‧‧第二連結座640‧‧‧Second link
641‧‧‧第二膜片641‧‧‧second diaphragm
642‧‧‧第二連結件642‧‧‧Second link
643‧‧‧第二活動座643‧‧‧Second event
6431‧‧‧第二導引部件6431‧‧‧Second guiding part
644‧‧‧第二接合部件644‧‧‧Second joint parts
645‧‧‧第一電路板645‧‧‧First board
6451‧‧‧導接件6451‧‧‧Connector
646‧‧‧第二電路板646‧‧‧Second circuit board
647‧‧‧第一傳輸件647‧‧‧First transmission
648‧‧‧第二傳輸件648‧‧‧second transmission
70‧‧‧收料裝置70‧‧‧Receiving device
71‧‧‧收料機構71‧‧‧Receiving agency
72‧‧‧料盤72‧‧‧Tray
80‧‧‧移載裝置80‧‧‧Transfer device
81‧‧‧第一移料機構81‧‧‧First Transfer Mechanism
811‧‧‧第一取放器811‧‧‧First pick and place
82‧‧‧第二移料機構82‧‧‧Second transfer mechanism
821‧‧‧第二取放器821‧‧‧Second pick and place
91‧‧‧電子元件91‧‧‧Electronic components
第1圖：習知料盤盛裝電子元件之示意圖。Figure 1: Schematic diagram of a conventional tray containing electronic components.
第2圖：習知移載裝置於料盤與測試座間移載電子元件之示意圖。Figure 2: Schematic diagram of a conventional transfer device for transferring electronic components between a tray and a test stand.
第3圖：本發明定位裝置之示意圖。Figure 3: Schematic diagram of the positioning device of the present invention.
第4圖：本發明定位裝置之俯視圖。Figure 4: Top view of the positioning device of the present invention.
第5圖：係移載裝置於料盤取出電子元件之示意圖。Figure 5: Schematic diagram of the removal of electronic components from the tray by the transfer device.
第6圖：本發明定位裝置之使用示意圖(一)。Figure 6: Schematic diagram of the use of the positioning device of the present invention (1).
第7圖：本發明定位裝置之使用示意圖(二)。Figure 7: Schematic diagram of the use of the positioning device of the present invention (2).
第8圖：本發明定位裝置之使用示意圖(三)。Figure 8: Schematic diagram of the use of the positioning device of the present invention (3).
第9圖：係移載裝置將電子元件移載至測試座之示意圖。Figure 9: Schematic diagram of the transfer device transferring the electronic components to the test socket.
第10圖：本發明定位裝置應用於電子元件作業設備之配置圖。Fig. 10 is a view showing the arrangement of the positioning device of the present invention applied to an electronic component working device.
第11圖：本發明電子元件作業設備之作業裝置示意圖。Figure 11 is a schematic view showing the working device of the electronic component working device of the present invention.
第12圖：本發明作業裝置之局部示意圖。Figure 12 is a partial schematic view of the working device of the present invention.
第13圖：本發明電子元件作業設備之使用示意圖(一)。Figure 13 is a schematic view showing the use of the electronic component working device of the present invention (1).
第14圖：本發明電子元件作業設備之使用示意圖(二)。Figure 14: Schematic diagram of the use of the electronic component working device of the present invention (2).
第15圖：本發明電子元件作業設備之使用示意圖(三)。Fig. 15 is a schematic view showing the use of the electronic component working device of the present invention (3).
第16圖：本發明電子元件作業設備之使用示意圖(四)。Figure 16: Schematic diagram of the use of the electronic component working device of the present invention (4).
第17圖：本發明電子元件作業設備之使用示意圖(五)。Figure 17: Schematic diagram of the use of the electronic component working device of the present invention (5).
第18圖：本發明電子元件作業設備之使用示意圖(六)。Figure 18: Schematic diagram of the use of the electronic component working device of the present invention (6).
為使 貴審查委員對本發明作更進一步之瞭解，茲舉一較佳實施例並配合圖式，詳述如後：請參閱第3、4圖，本發明定位裝置20包含定位機構21及驅動機構22，該定位機構21係設有複數個夾掣器，夾掣器係設有複數個可抵靠多顆電子元件定位之抵靠部，更進一步，定位機構21之作動方式可分為單動推移方式及雙動推移方式，當定位機構21採單動推移方式，係可配置固定式夾掣器及活動式夾掣器，活動式夾掣器係相對固定式夾掣器位移，使固定式夾掣器及活動式夾掣器一次夾持多顆電子元件定位，當定位機構21採雙動推移方式，係可配置複數個活動式夾掣器，複數個活動式夾掣器係作相對位移，而可一次夾持多顆電子元件定位，於本實施例中，該定位機構21係採雙動推移方式，而設有二活動式第一夾掣器及第二夾掣器，第一、二夾掣器係分別具有複數個抵靠部，更進一步， 抵靠部可為定位角部或定位面部，用以抵靠於電子元件之一角部或一側面，於本實施例中，該第一夾掣器係設有第一定位件211及第一承置件212，第一定位件211係裝配於第一承置件212之上方，並設有複數個可容置電子元件之第一容置空間2111，各第一容置空間2111之內面係設有至少一第一斜面2112，而可縮短電子元件於移出時與第一容置空間2111之接觸面，以利取出電子元件，並以第一容置空間2111之一角部作為第一抵靠部2113，用以抵靠於電子元件之一角部，第一承置件212係用以承置多顆電子元件，該第二夾掣器係設有第二定位件213，第二定位件213係位於第一夾掣器之第一定位件211及第一承置件212間，並設有複數個可容置電子元件之第二容置空間2131，第二容置空間2131係相通第一定位件211之第一容置空間2111，第二定位件213並以第二容置空間2131之一角部作為第二抵靠部2132，用以抵靠於電子元件之另一相對角部；該驅動機構22係設有至少一驅動源，用以驅動定位機構21之至少一夾掣器相對另一夾掣器位移，令複數個夾掣器之複數個抵靠部一次推移多顆電子元件位移，使複數個夾掣器同時將多顆電子元件夾掣定位於預設基準位置，並與移載裝置之取放器取放時中心的相對位置固定，於本實施例中，驅動機構22之驅動源包含驅動器221、第一活動件222及第二活動件223，驅動器221(如壓缸)係斜向配置於台板上，該台板可為獨立板體或機台之板體，於本實施例中，驅動器221係斜向配置於一獨立之板體224上，用以驅動第一活動件222及第二活動件223作相對位移，其中，該第一活動件222係連結裝配第一夾掣器之第一承置件212，該第二活動件223係連結裝配第二夾掣器之第二定位件213，驅動器221係經由第一活動件222及第二活動件223帶動第一夾掣器及第二夾掣器作相對斜向位移，該斜向位移係為非垂直或平行於電子元件側面之方向位移，第一夾掣器及第二夾掣器並以相同位移量位移，令第一抵靠部2113及第二抵靠部2132抵靠於電子元件之二相對角部，第一夾掣器及第二夾掣器一次定位多顆電子元件，使電子元件之基準部固定位於預設基準位置，並與移載裝置(圖未示出)之取放器取放時中心的相對位置固定，該電子元件之基準部可為中心位置或待抵靠的兩側邊，另該驅動 機構22係於定位機構21之至少一夾掣器與台板間設有滑軌組，用以使夾掣器平穩位移，於本實施例中，係於第一夾掣器之第一承置件212與板體224間設有複數個滑軌組225。In order to make the present invention further understand the present invention, a preferred embodiment and a drawing will be described in detail as follows: Referring to Figures 3 and 4, the positioning device 20 of the present invention includes a positioning mechanism 21 and a driving mechanism. 22, the positioning mechanism 21 is provided with a plurality of clips, the clip device is provided with a plurality of abutting portions that can be positioned against a plurality of electronic components, and further, the action of the positioning mechanism 21 can be divided into single movements. The shifting mode and the double-action shifting mode, when the positioning mechanism 21 adopts the single-moving shifting mode, the fixed clamp and the movable clamp can be arranged, and the movable clamp is fixed relative to the fixed clamp, so that the fixed type The clamper and the movable clamp clamp the positioning of a plurality of electronic components at a time. When the positioning mechanism 21 adopts the double-action shifting mode, a plurality of movable clamps can be arranged, and a plurality of movable clamps are used for relative displacement. In this embodiment, the positioning mechanism 21 adopts a double-action shifting mode, and two movable first clamps and a second clamper are provided. The two clamps have a plurality of abutments Department, further, The abutting portion may be a positioning corner portion or a positioning portion for abutting against a corner or a side of the electronic component. In this embodiment, the first clamping device is provided with the first positioning member 211 and the first bearing. The first positioning member 211 is mounted on the first receiving member 212, and is provided with a plurality of first accommodating spaces 2111 for accommodating electronic components, and the inner surface of each of the first accommodating spaces 2111 is The at least one first inclined surface 2112 is disposed to shorten the contact surface of the electronic component with the first accommodating space 2111 when the electronic component is removed, so as to take out the electronic component, and use the corner of the first accommodating space 2111 as the first abutting. The portion 2113 is configured to abut against a corner of the electronic component, the first mounting member 212 is configured to receive a plurality of electronic components, and the second clamping device is provided with a second positioning component 213, and the second positioning component 213 The first locating member 211 and the first arranging member 212 are disposed between the first locating device and the second accommodating space 2131. The second accommodating space 2131 is connected to the first accommodating space 2131. The first accommodating space 2111 of the positioning member 211, and the second positioning member 213 is used as a corner of the second accommodating space 2131. The second abutting portion 2132 is configured to abut against another opposite corner of the electronic component; the driving mechanism 22 is provided with at least one driving source for driving at least one clamp of the positioning mechanism 21 relative to the other folder The displacement of the device causes a plurality of electronic components to be displaced at a plurality of abutting portions of the plurality of clampers, so that the plurality of clamps simultaneously position the plurality of electronic component clamps at the preset reference position, and the transfer device The relative position of the center of the pick-and-place device is fixed. In this embodiment, the driving source of the driving mechanism 22 includes the driver 221, the first movable member 222 and the second movable member 223, and the driver 221 (such as a pressure cylinder) is inclined. In the embodiment, the driver 221 is disposed obliquely on a separate board 224 for driving the first movable member 222. The board is disposed on the board. And the second movable member 223 is oppositely displaced, wherein the first movable member 222 is coupled to the first bearing member 212 of the first folder, and the second movable member 223 is coupled to the second clamping device. Two positioning members 213, the driver 221 is via the first movable member 222 and the second living The member 223 drives the first clamp and the second clamp to perform a relative oblique displacement, the oblique displacement is non-vertical or parallel to the direction of the side of the electronic component, and the first clamp and the second clamp are combined Displaceing with the same displacement amount, the first abutting portion 2113 and the second abutting portion 2132 abut against the opposite corners of the electronic component, and the first clipper and the second clipper position the plurality of electronic components at a time, so that The reference portion of the electronic component is fixedly located at a preset reference position and is fixed to a center relative to the pick-and-place device of the transfer device (not shown), and the reference portion of the electronic component can be a central position or to be abutted On both sides, the other drive The mechanism 22 is provided with a slide rail group between the at least one clamper and the platen of the positioning mechanism 21 for smoothly displacing the clamp. In this embodiment, the first clamp is attached to the first clamp. A plurality of slide rail sets 225 are disposed between the member 212 and the plate body 224.
請參閱第4、5、6圖，係本發明定位裝置20應用於電子元件作業設備，該作業設備包含機台(圖未示出)、定位裝置20、移載裝置33及中央控制裝置，該機台係設有至少一具承置器之裝置，該承置器係設有至少一容置槽，用以容置電子元件；更進一步，該裝置可為供料裝置，該供料裝置係設有具容置槽之承置器(如料盤)，該裝置或可為一對電子元件執行預設作業之作業裝置，該作業裝置係設有具容置槽之承置器(測試座)；該移載裝置33係配置於機台，並設有至少一具取放器之移料機構，用以移載電子元件；中央控制裝置係用以控制及整合各裝置作動，而執行自動化作業；該定位裝置20係裝配於機台，並包含定位機構21及驅動機構22，其中，該定位機構21之一夾掣器的抵靠部與另一夾掣器的抵靠部之開啟間距係大於承置器的容置槽開口尺寸，更進一步，該定位機構21之一夾掣器的抵靠部與另一夾掣器的抵靠部之開啟間距係大於供料裝置或作業裝置之承置器的容置槽開口尺寸；於本實施例中，係於機台設有複數個具承置器之裝置，複數個裝置係為供料裝置及作業裝置(圖未示出)，該供料裝置係設有具複數個容置槽311且為料盤31之承置器，用以盛裝多顆電子元件32，由於料盤31之容置槽311與電子元件32間具有間隙，該間隙將導致電子元件32於容置槽311內任意漂移，使電子元件32之中心位置與容置槽311之中心位置具有偏移誤差，該移載裝置33之複數個取放器331係可作第一、二方向(如X、Y方向)位移至料盤31上方，並令複數個取放器331作第三方向(如Z方向)位移於料盤31之容置槽311取出多顆電子元件32；為了使移載裝置33之複數個取放器331可準確將電子元件32置入作業裝置之承置器(如測試座)，必須先將電子元件32之基準部固定於預設基準位置，並與移載裝置33之取放器331取放時中心的相對位置固定，於本實施例中，電子元件32之基準部係為中心位置，因此，移載裝置33之取放器331係將多顆電子元件32移載至定位裝置20處，定位裝置20之第一夾掣器及第二夾掣器開啟時，其第一抵靠部2113及第二抵靠 部2132之間距係大於料盤31之容置槽311開口尺寸，而可便利移載裝置33之取放器331將電子元件32置入於第一定位件211及第二定位件213二者相通之第一容置空間2111及第二容置空間2131間，並置放於第一承置件212上。Referring to Figures 4, 5 and 6, the positioning device 20 of the present invention is applied to an electronic component working device, which includes a machine table (not shown), a positioning device 20, a transfer device 33, and a central control device. The machine is provided with at least one device for mounting the device, and the device is provided with at least one receiving groove for accommodating the electronic component; further, the device can be a feeding device, and the feeding device is The device is provided with a receiving device (such as a tray), which can be a working device for performing a preset operation on a pair of electronic components, and the working device is provided with a receiving device with a receiving groove (test seat) The transfer device 33 is disposed on the machine table, and is provided with at least one pick-and-place mechanism for picking up and loading electronic components; the central control device is used for controlling and integrating the operations of the devices, and performing automation The positioning device 20 is mounted on the machine table and includes a positioning mechanism 21 and a driving mechanism 22, wherein the opening distance of the abutting portion of the clamping device 21 and the abutting portion of the other clamping device The size is larger than the opening size of the receiving slot of the socket, and further, the positioning machine The opening distance of the abutting portion of one of the jaws and the abutting portion of the other jaw is larger than the opening of the receiving slot of the feeder or the mounting device of the working device; in this embodiment, The machine is provided with a plurality of devices with a receiver, and the plurality of devices are a feeding device and a working device (not shown). The feeding device is provided with a plurality of receiving slots 311 and is a tray. The holder of the 31 is used for accommodating a plurality of electronic components 32. Since the accommodating groove 311 of the tray 31 has a gap with the electronic component 32, the gap will cause the electronic component 32 to arbitrarily drift in the accommodating groove 311, so that the electronic device 32 The center position of the component 32 and the center position of the accommodating groove 311 have an offset error, and the plurality of pick and placeers 331 of the transfer device 33 can be displaced to the tray 31 in the first and second directions (eg, X, Y directions). Above, and the plurality of pickers 331 are displaced in the third direction (such as the Z direction) to the receiving slots 311 of the tray 31 to take out the plurality of electronic components 32; in order to make the plurality of pickers 331 of the transferring device 33 Accurately placing the electronic component 32 into the mounting device of the working device (such as the test socket), the reference portion of the electronic component 32 must first be solidified. In the preset reference position, and the position relative to the center of the pick-and-place device 331 of the transfer device 33 is fixed, in the embodiment, the reference portion of the electronic component 32 is a central position, and therefore, the transfer device 33 The pick-and-placer 331 transfers the plurality of electronic components 32 to the positioning device 20, and the first abutting portion 2113 and the second abutting device of the positioning device 20 are opened, and the first abutting portion 2113 and the second abutting portion The distance between the first positioning member 211 and the second positioning member 213 is the same. The first accommodating space 2111 and the second accommodating space 2131 are placed on the first receiving member 212.
請參閱第7、8圖，於定位裝置20承置多顆電子元件後，其夾放作動方式可概分為三種，第一種係定位裝置20夾持多顆電子元件定位後，再復位脫離電子元件，並與電子元件保持微小間距，以供移載裝置之取放器取出電子元件，第二種係定位裝置20夾持多顆電子元件定位，於移載裝置之取放器固定電子元件後，該定位裝置再釋放電子元件，使前述移載裝置可取出電子元件，又該取放器固定電子元件之方式可為吸住固定或壓抵固定或夾持固定，第三種係定位裝置20夾持多顆電子元件定位，並保持以微小力量夾持電子元件，使移載裝置之取放器於定位裝置20夾持電子元件狀態中可直接取出電子元件；於本實施例中，定位裝置20係採第二種夾放作動方式，於執行定位電子元件作業時，該驅動機構22之驅動器221係驅動第一活動件222及第二活動件223同時作相對位移，第一活動件222及第二活動件223係以相同位移量帶動第一夾掣器之第一定位件211、第一承置件212及第二夾掣器之第二定位件213作相對斜向位移，第一夾掣器之第一承置件212並承置多顆電子元件32同步作斜向位移，該第二定位件213係利用複數個第二抵靠部2132一次推移多顆電子元件32，並以第二抵靠部2132抵靠於電子元件32之一角部，由於第一定位件211及第一承置件212也持續作斜向位移，使得第一定位件211之第一抵靠部2113係推移電子元件32，並抵靠電子元件32之另一相對角部，進而第一定位件211之第一抵靠部2113及第二定位件213之第二抵靠部2132係夾持抵靠電子元件32之二相對角部，使電子元件32之中心位置固定位於預設基準位置而作一中心定位，另當電子元件32以一角部作為基準部時，只要使角部位置固定位於預設基準位置，亦可達到定位之目的，因此，定位裝置20可利用第一夾掣器及第二夾掣器一次同時定位多顆電子元件32。Referring to Figures 7 and 8, after the positioning device 20 is provided with a plurality of electronic components, the clamping operation mode can be roughly divided into three types. The first type of positioning device 20 holds the plurality of electronic components after positioning, and then resets and decouples. The electronic component is kept at a slight distance from the electronic component for the pick-and-place device of the transfer device to take out the electronic component, and the second type of positioning device 20 holds the positioning of the plurality of electronic components, and the electronic component of the pick-up device of the transfer device is fixed. After that, the positioning device releases the electronic component, so that the transfer device can take out the electronic component, and the pick-up device can fix the electronic component by suction or fixed or clamped, and the third system is positioned. 20 clamping a plurality of electronic components to position and holding the electronic components with a small force, so that the pick-and-place device of the transfer device can directly take out the electronic components in the state of clamping the electronic components by the positioning device 20; in this embodiment, positioning The device 20 adopts a second type of clamping operation. When the positioning electronic component is operated, the driver 221 of the driving mechanism 22 drives the first movable member 222 and the second movable member 223 to simultaneously perform relative displacement. The first movable member 222 and the second movable member 223 drive the first positioning member 211 of the first clamping device, the first bearing member 212 and the second positioning member 213 of the second clamping device to be relatively inclined with the same displacement. To the displacement, the first holder 212 of the first clamp and the plurality of electronic components 32 are synchronously displaced obliquely, and the second positioning member 213 uses a plurality of second abutting portions 2132 to move a plurality of electrons at a time. The first abutting portion 211 and the first receiving member 212 are also obliquely displaced, so that the first positioning member 211 is first. The abutting portion 2113 is configured to move the electronic component 32 and abut against the opposite corner of the electronic component 32. The first abutting portion 2113 of the first positioning member 211 and the second abutting portion 2132 of the second positioning member 213 are further Clamping against the opposite corners of the electronic component 32, the center position of the electronic component 32 is fixed at a predetermined reference position for central positioning, and when the electronic component 32 has a corner as a reference portion, the corner position is only required. Fixed at the preset reference position, and can also achieve the purpose of positioning, therefore, positioning Device 20 may utilize a first clip and the second clip latch is a latch is positioned at the same time the electronic component 32 more stars.
請參閱第8、9圖，於定位裝置20定位多顆電子元件32 後，移載裝置33係作第一、二方向位移至定位裝置20上方，並令複數個取放器331作第三方向位移於定位裝置20處取出多顆電子元件32，移載裝置33係將多顆電子元件32移載至作業裝置處之承置器上方，該承置器係為測試座34，由於電子元件32已作中心定位，即可令電子元件32之中心對位於測試座34之中心，使得取放器331可準確將電子元件32置入測試座34，不僅可防止電子元件偏斜而無法置入測試座的情形，亦可使電子元件32之電性接觸部321與測試座34之電性接點341作精準對位而相互接觸，達到提升測試作業品質之實用效益。Please refer to FIGS. 8 and 9 for positioning a plurality of electronic components 32 in the positioning device 20. After that, the transfer device 33 is displaced in the first and second directions to the top of the positioning device 20, and the plurality of pickers 331 are displaced in the third direction to take out the plurality of electronic components 32 at the positioning device 20, and the transfer device 33 is The plurality of electronic components 32 are transferred to the top of the mounting device at the working device. The mounting device is a test socket 34. Since the electronic component 32 has been centered, the center of the electronic component 32 can be placed in the test socket 34. The center of the device 331 allows the electronic component 32 to be accurately placed in the test socket 34, which not only prevents the electronic component from being deflected but can not be placed in the test socket, but also allows the electrical contact portion 321 of the electronic component 32 to be tested. The electrical contacts 341 of the seat 34 are precisely aligned and contact each other, thereby achieving the practical benefit of improving the quality of the test operation.
請參閱第3、10、11、12圖，係本發明定位裝置應用於電子元件作業設備之配置圖，該作業設備包含機台40、供料裝置50、第一定位裝置20A、作業裝置60、第二定位裝置20B、收料裝置70、移載裝置80及中央控制裝置(圖未示出)，該供料裝置50係裝配於機台40，並設有至少一供料機構51，用以容置至少一具待作業電子元件之料盤52；該第一定位裝置20A係相同上述之定位裝置20，並裝配於機台40上，而位於供料裝置50與作業裝置60間，用以一次定位多顆電子元件；該作業裝置60係設有至少一作業機構，用以對電子元件執行預設作業，於本實施例中，作業裝置60包含載送機構61、取像機構62及作業機構63，該載送機構61係設有第一動力結構，用以驅動至少一載送結構作至少一方向位移，該載送結構係承載電子元件，於本實施例中，第一動力結構係包含第一動力源611及第一傳動器612，第一動力源611可為馬達，並經由第一傳動器612而帶動載送結構作第一方向位移，載送結構係設有至少一承置電子元件之載台，並設有至少一帶動載台移動之夾移器，於本實施例中，載送結構包含第一夾移器613、第二夾移器614及載台615，第一夾移器613係設有可作第三方向位移啟閉之第一夾具6131，用以夾持於載台615之一側，載台615係設有複數個容置槽6151，用以承置多顆電子元件，第二夾移器614係設有可作第三方向位移啟閉之第二夾具6141，用以夾持於載台615之另一側，第一夾移器613及第二夾移器614係由至少一板體連結而可同步位移，該取像機構62係設有至少一取像器，用以取像電子元件，於本實施例中，取像機構62係裝配於作業機構63上，並設有可 為CCD之取像器621，用以取像載台615承置之多顆電子元件是否擺置正確，並將取像資料傳輸至中央控制裝置，該作業機構63係包含第二動力結構、至少一浮動結構及處理結構，該第二動力結構係用以帶動至少一浮動結構及處理結構作第三方向位移，該浮動結構係用以使處理結構可浮動位移，該處理結構係用以對電子元件執行預設作業，於本實施例中，該作業機構63包含第二動力結構、第一浮動結構、第二浮動結構及處理結構，該第二動力結構係包含第二動力源631、第二傳動器632、第三傳動器633及第四傳動器634，第二動力源631可為馬達，並經由第二傳動器632帶動第一浮動結構相對載台615作第三方向向上位移，第二傳動器632再經由第三傳動器633及第四傳動器634而帶動第二浮動結構相對載台615作第三方向向下位移，該第一浮動結構係設有一連結第二傳動器632之第一連結座635，第一連結座635係裝配有至少一浮動器，於本實施例中，係設有複數個浮動器，該浮動器係設有第一膜片636，並於第一膜片636上設有第一連結件637，第一連結件637則連結一第一活動座638，另於第一連結座635與第一活動座638間設有第一導位結構，用以導引第一連結座635與第一活動座638相互卡掣定位而連結作動，該第一導位結構係於第一連結座635與第一活動座638間設有相互配合之第一導引部件及第一接合部件，於本實施例中，第一導位結構係於第一連結座635設有具錐狀頭部之第一接合部件639，並於第一活動座638設有為階級孔之第一導引部件6381，第一導引部件6381可供第一接合部件639之錐狀頭部置入頂抵而相互卡掣連結，該第二浮動結構係設有一連結第四傳動器634之第二連結座640，第二連結座640係裝配有至少一浮動器，於本實施例中，係設有複數個浮動器，該浮動器係設有複數個第二膜片641，並於第二膜片641上設有第二連結件642，第二連結件642則連結一第二活動座643，另於第二連結座640與第二活動座643間設有第二導位結構，用以導引第二連結座640與第二活動座643相互卡掣定位而連結作動，該第二導位結構係於第二連結座640與第二活動座643間設有相互配合之第二導引部件及第二接合部件，於本實施例中，第二導位結構係於第二連結座640設有具錐狀頭部之第二接合部件 644，並於第二活動座643設有為階級孔之第二導引部件6431，第二導引部件6431可供第二接合部件644之錐狀頭部置入頂抵而相互連結，該處理結構係設有至少一電路板，電路板係以至少一傳輸件電性連接電子元件之電性接觸部，用以測試電子元件，於本實施例中，該處理結構係設有一具複數個導接件6451之第一電路板645，第一電路板645係連結第一浮動結構之第一活動座638，另處理結構係於載台615相對應第一電路板645之複數個導接件6451的位置開設有複數個穿孔6152，一裝配於第二浮動結構之第二活動座643處的第二電路板646，第二電路板646係設有第一傳輸件647及第二傳輸件648，其第一傳輸件647係用以電性接觸電子元件之電性接觸部，第二傳輸件648係穿伸出載台615之穿孔6152，而電性接觸第一電路板645之導接件6451；該第二定位裝置20B係相同上述之定位裝置20，並裝配於機台40上，而位於作業裝置60與收料裝置70間，用以一次定位多顆電子元件；該收料裝置70係裝配於機台40，並設有至少一收料機構，用以容置至少一具已作業電子元件之料盤，於本實施例中，係設有複數個收料機構71，收料機構71係設有至少一料盤72，用以收置良品電子元件及不同等級之電子元件；該移載裝置80係設有至少一移料機構，用以移載電子元件，於本實施例中，係設有第一移料機構81及第二移料機構82，第一移料機構81係設有複數個可作第一、三方向位移之第一取放器811，用以於供料裝置50、第一定位裝置20A及作業裝置60間移載多顆待作業之電子元件，第二移料機構82係設有複數個可作第一、三方向位移之第二取放器821，用以於作業裝置60、第二定位裝置20B及收料裝置70間移載多顆已作業之電子元件，中央控制裝置係用以控制及整合各裝置作動，以執行自動化作業。Please refer to the figures 3, 10, 11, and 12, which are diagrams of the positioning device of the present invention applied to an electronic component working device, which includes a machine table 40, a feeding device 50, a first positioning device 20A, a working device 60, a second positioning device 20B, a receiving device 70, a transfer device 80 and a central control device (not shown), the feeding device 50 is mounted on the machine table 40, and is provided with at least one feeding mechanism 51 for A tray 52 for accommodating at least one electronic component to be operated; the first positioning device 20A is the same as the positioning device 20 described above, and is mounted on the machine 40 and located between the feeding device 50 and the working device 60 for Positioning a plurality of electronic components at a time; the working device 60 is provided with at least one working mechanism for performing a preset operation on the electronic components. In the embodiment, the working device 60 includes a carrying mechanism 61, an image capturing mechanism 62, and an operation The mechanism 63 is provided with a first power structure for driving at least one carrier structure for at least one direction displacement. The carrier structure carries electronic components. In this embodiment, the first power structure is Including first power source 611 and first The first power source 611 can be a motor, and the first carrier 612 drives the carrier structure to be displaced in a first direction. The carrier structure is provided with at least one carrier for mounting electronic components, and is provided with In the embodiment, the carrier structure includes a first pinch 613, a second pinch 614, and a carrier 615. The first pinch 613 is provided for use. The first clamp 6131 of the third direction is opened and closed for clamping on one side of the stage 615. The stage 615 is provided with a plurality of receiving slots 6151 for receiving a plurality of electronic components, and the second clamping The second clamping device 6141 is configured to be detachably opened and closed in a third direction for clamping on the other side of the loading platform 615. The first clamping device 613 and the second clamping device 614 are composed of at least one plate. The image capturing mechanism 62 is provided with at least one image capturing device for capturing the electronic component. In the embodiment, the image capturing mechanism 62 is mounted on the working mechanism 63 and provided with The image taking unit 621 of the CCD is configured to take out the plurality of electronic components mounted on the image carrier 615, and transmit the image data to the central control device. The working mechanism 63 includes a second power structure, at least a floating structure and a processing structure, the second power structure is configured to drive at least one floating structure and the processing structure for displacement in a third direction, the floating structure is used for floating displacement of the processing structure, and the processing structure is used for electronic The component performs a preset operation. In this embodiment, the working mechanism 63 includes a second power structure, a first floating structure, a second floating structure, and a processing structure. The second power structure includes a second power source 631 and a second The second power source 631 is a motor, and the second floating structure 632 drives the first floating structure to be displaced upward in the third direction relative to the stage 615. The actuator 632 further drives the second floating structure to be displaced downward in the third direction relative to the stage 615 via the third actuator 633 and the fourth actuator 634. The first floating structure is provided with a connecting second actuator 632. The first connecting seat 635 is equipped with at least one floating device. In this embodiment, a plurality of floating devices are provided, and the floating device is provided with a first diaphragm 636, and is first. A first connecting member 637 is disposed on the diaphragm 636. The first connecting member 637 is coupled to a first movable seat 638, and a first guiding structure is disposed between the first connecting base 635 and the first movable base 638. The first connecting seat 635 and the first movable seat 638 are positioned and coupled to each other. The first guiding structure is disposed between the first connecting seat 635 and the first movable seat 638. In the embodiment, the first guiding structure is provided with a first engaging part 639 having a tapered head on the first connecting seat 635, and is configured as a class in the first movable seat 638. The first guiding member 6381 of the hole, the first guiding member 6381 is configured to allow the tapered heads of the first engaging member 639 to be placed against the top and to be snap-fitted to each other, and the second floating structure is provided with a connecting fourth actuator a second joint 640 of the 634, the second joint 640 is equipped with at least one floater, in this embodiment, There are a plurality of floating devices, the floating device is provided with a plurality of second diaphragms 641, and a second connecting member 642 is disposed on the second diaphragm 641, and the second connecting member 642 is coupled to a second movable seat 643. A second guiding structure is disposed between the second connecting base 640 and the second movable base 643 for guiding the second connecting base 640 and the second movable base 643 to be positioned and connected to each other. The second guiding position is connected. The second guiding member 640 and the second movable seat 643 are provided with a second guiding member and a second engaging member. In this embodiment, the second guiding structure is disposed on the second connecting base 640. a second joint member having a tapered head The second movable seat 643 is provided with a second guiding member 6431 as a class hole, and the second guiding member 6431 is configured to allow the tapered head portions of the second engaging member 644 to be placed in abutment and connected to each other. The structure is provided with at least one circuit board, wherein the circuit board is electrically connected to the electrical contact portion of the electronic component by at least one transmission member for testing the electronic component. In the embodiment, the processing structure is provided with a plurality of guides. The first circuit board 645 of the connector 6451, the first circuit board 645 is connected to the first movable seat 638 of the first floating structure, and the other processing structure is connected to the plurality of connecting parts 6451 of the first circuit board 645 corresponding to the loading platform 615. The second circuit board 646 is provided with a first transmission member 647 and a second transmission member 648. The second circuit board 646 is provided with a plurality of perforations 6152, a second circuit board 646 disposed at the second movable seat 643 of the second floating structure. The first transmission member 647 is for electrically contacting the electrical contact portion of the electronic component, and the second transmission member 648 is threaded through the through hole 6152 of the extending stage 615 to electrically contact the guiding member 6451 of the first circuit board 645. The second positioning device 20B is the same positioning device 20 as described above, and It is disposed on the machine table 40 and located between the working device 60 and the receiving device 70 for positioning a plurality of electronic components at a time; the receiving device 70 is mounted on the machine table 40 and provided with at least one receiving mechanism for In the embodiment, a plurality of receiving mechanisms 71 are disposed, and the receiving mechanism 71 is provided with at least one tray 72 for receiving good electronic components. And different levels of electronic components; the transfer device 80 is provided with at least one transfer mechanism for transferring electronic components. In the embodiment, the first transfer mechanism 81 and the second transfer mechanism 82 are provided. The first moving mechanism 81 is provided with a plurality of first pick-and-placers 811 for first and third direction displacement, for transferring a plurality of loads between the feeding device 50, the first positioning device 20A and the working device 60. For the electronic component to be operated, the second transfer mechanism 82 is provided with a plurality of second pick-and-placers 821 for first and third direction displacement, for the working device 60, the second positioning device 20B and the receiving device 70. Transferring multiple electronic components that have been operated, the central control unit is used to control and integrate the devices. Move to implement automation.
請參閱第13、14圖，於執行測試作業時，該供料裝置50之供料機構51係載送具複數個待作業電子元件91之料盤52作第二方向位移至預設位置，該移載裝置80係以第一移料機構81之第一取放器811作第一方向位移至供料裝置50之料盤52上方，並作第三方向位移於料盤52之容置槽521內一次取出多顆待作業電子元件91，該多顆待作業電子元件91係可為整盤待作業電子元件；於移載裝置80一 次取出多顆待作業電子元件91後，係以第一取放器811作第一、三方向位移將多顆待作業電子元件91移載至第一定位裝置20A處，並置入於第一定位件211A之第一容置空間2111A及第二定位件213A之第二容置空間2131A間，而置放於第一承置件212A上。Referring to Figures 13 and 14, when the test operation is performed, the feeding mechanism 51 of the feeding device 50 carries the plurality of trays 52 of the electronic component 91 to be operated for the second direction to the preset position. The transfer device 80 is displaced in the first direction by the first pick-and-place 811 of the first transfer mechanism 81 to the tray 52 of the feeding device 50, and is displaced in the third direction by the receiving groove 521 of the tray 52. The plurality of electronic components to be operated 91 are taken out at a time, and the plurality of electronic components to be operated 91 can be electronic components to be operated on the whole disk; After the plurality of electronic components 91 to be operated are taken out, the first and third directional displacements are used to transfer the plurality of electronic components 91 to be operated to the first positioning device 20A, and placed in the first The first accommodating space 2111A of the positioning member 211A and the second accommodating space 2131A of the second positioning member 213A are disposed between the first receiving member 212A.
請參閱第15圖，於第一定位裝置20A承置多顆待作業電子元件91後，該驅動機構22A之驅動器221A係驅動第一定位件211A及第二定位件213A作相對斜向位移，令呈角部之第一抵靠部2113A抵靠電子元件91之一角部，以及令呈角部之第二抵靠部2132A抵靠電子元件91之另一相對角部，而以角部對角部的方式相互抵靠，使第一定位件211A及第二定位件213A夾持電子元件91作中心定位，因此，定位裝置20A一次同時定位多顆電子元件91。Referring to FIG. 15 , after the plurality of electronic components 91 to be operated are mounted on the first positioning device 20A, the driver 221A of the driving mechanism 22A drives the first positioning member 211A and the second positioning member 213A to perform relative oblique displacement. The first abutting portion 2113A of the corner portion abuts against a corner of the electronic component 91, and the second abutting portion 2132A of the corner portion abuts against the opposite corner of the electronic component 91, and the corner is opposite to the corner The manner of abutting each other causes the first positioning member 211A and the second positioning member 213A to be sandwiched by the electronic component 91 for central positioning. Therefore, the positioning device 20A simultaneously positions the plurality of electronic components 91.
請參閱第11、15、16、17圖，於第一定位裝置20A定位多顆待作業電子元件91後，移載裝置80之第一取放器811係於第一定位裝置20A取出多顆待作業電子元件91，並移載至作業裝置60之載台615處，且準確置入於載台615之容置槽6151，該取像機構62係以取像器621取像載台615所承置之多顆電子元件91，並將取像資料傳輸至中央控制裝置，於取像完畢後，該第一動力源611係經由第一傳動器612帶動第一夾移器613及第二夾移器614同步作第一方向位移，第一夾移器613及第二夾移器614係分別利用第一夾具6131及第二夾具6141夾持具多顆電子元件91之載台615作第一方向位移至作業機構63處，該作業機構63之第二動力源631係經由第二傳動器632帶動第一浮動結構及第一電路板645相對載台615作第三方向向上位移，並以第一電路板645承置載台615，第一浮動結構之第一連結件637係受反作用力頂推而壓抵第一膜片636，第一膜片636係作一緩衝吸振，令第一接合部件639與第一導引部件6331分離而不會連結作動，另該第二傳動器632並同時經由第三傳動器633及第四傳動器634而帶動第二浮動結構、第二電路板646、第一傳輸件647及第二傳輸件648相對載台615作第三方向向下位移，第一傳輸件647係電性接觸電子元件91之電性接觸部，而第二傳輸件648則穿伸出載台615之穿孔6152而與第一電 路板645之導接件6451作電性接觸而進行測試作業，並將測試資料傳輸至中央控制裝置，中央控制裝置係依測試資料判斷電子元件91之品質，第二浮動結構之第二連結件642亦受反作用力頂推而壓抵第二膜片641，第二膜片641係作一緩衝吸振，令第二接合部件644與第二導引部件6431分離而不會連結作動，該第一夾移器613之第一夾具6131及第二夾移器614之第二夾具6141則釋放載台615，因此，作業機構63可利用第一浮動結構及第二浮動結構使載台615完全浮動，以避免載台615內之電子元件91受下方傳達之振動所產生的聲音雜訊影響測試作業，進而提升測試品質。Referring to the figures 11, 15, 16, and 17, after the plurality of electronic components 91 to be operated are positioned in the first positioning device 20A, the first pick-and-placer 811 of the transfer device 80 is taken out from the first positioning device 20A. The operation electronic component 91 is transferred to the loading stage 615 of the working device 60, and is accurately placed in the receiving groove 6151 of the loading table 615. The image capturing mechanism 62 is taken by the image capturing unit 621. The plurality of electronic components 91 are disposed, and the image capturing data is transmitted to the central control device. After the image capturing is completed, the first power source 611 drives the first pinch 613 and the second pinch via the first actuator 612. The first aligner 613 and the second nipper 614 are respectively configured to hold the stage 615 with the plurality of electronic components 91 as the first direction by using the first clamp 6131 and the second clamp 6141, respectively. Displacement to the working mechanism 63, the second power source 631 of the working mechanism 63 drives the first floating structure and the first circuit board 645 to be displaced upward in the third direction with respect to the stage 615 via the second actuator 632, and is first The circuit board 645 carries the stage 615, and the first connecting member 637 of the first floating structure is subjected to a reaction force top The first diaphragm 636 is damped to the first diaphragm 636, and the first diaphragm 639 is separated from the first guiding member 6331 without being connected. The second actuator 632 is simultaneously The third transmission 633 and the fourth transmission 634 drive the second floating structure, the second circuit board 646, the first transmission member 647 and the second transmission member 648 to be displaced downward in the third direction relative to the stage 615, the first transmission The member 647 electrically contacts the electrical contact portion of the electronic component 91, and the second transmission member 648 extends through the through hole 6152 of the carrier 615 and the first electrical component. The guiding member 6451 of the road board 645 performs electrical testing for the test operation, and transmits the test data to the central control device. The central control device determines the quality of the electronic component 91 according to the test data, and the second connecting member of the second floating structure 642 is also pushed against the second diaphragm 641 by the reaction force, and the second diaphragm 641 is used for buffer absorption, so that the second joint member 644 is separated from the second guiding member 6431 without interlocking. The first jig 6131 of the pinch 613 and the second jig 6141 of the second pinch 614 release the stage 615. Therefore, the working mechanism 63 can completely float the stage 615 by using the first floating structure and the second floating structure. The sound noise caused by the vibration transmitted by the electronic component 91 in the stage 615 is prevented from affecting the test operation, thereby improving the test quality.
請參閱第11、18圖，於測試完畢後，該作業機構63之第二動力結構係帶動第一浮動結構、第二浮動結構及處理結構復位，該載送機構61之第一夾移器613之第一夾具6131及第二夾移器614之第二夾具6141則再次夾持載台615，第一動力源611係經由第一傳動器612帶動第一夾移器613、第二夾移器614及載台615作第一方向位移，而輸出已作業之電子元件91，該移載裝置80係以第二移料機構82之第二取放器821於載台615取出多顆已作業電子元件91，並移載置入於第二定位裝置20B，第二定位裝置20B係一次定位多顆已作業電子元件91，於定位完畢後，移載裝置80之第二取放器821係於第二定位裝置20B取出多顆已作業電子元件91，並依測試結果，而移載於收料裝置之收料機構71處，且準確置入於料盤72之容置槽721而分類收置。Referring to FIGS. 11 and 18, after the test is completed, the second power structure of the working mechanism 63 drives the first floating structure, the second floating structure and the processing structure to be reset, and the first pinch 613 of the carrying mechanism 61 The first clamp 6131 and the second clamp 6141 of the second clamper 614 clamp the stage 615 again, and the first power source 611 drives the first clamper 613 and the second clamper via the first actuator 612. The 614 and the stage 615 are displaced in the first direction, and the electronic component 91 that has been operated is outputted. The transfer device 80 takes out the plurality of used electronic devices on the stage 615 by the second pick-and-placer 821 of the second transfer mechanism 82. The component 91 is placed in the second positioning device 20B, and the second positioning device 20B positions a plurality of the operated electronic components 91 at a time. After the positioning is completed, the second pick-and-place device 821 of the transfer device 80 is attached to the The two positioning devices 20B take out a plurality of the operated electronic components 91 and transfer them to the receiving mechanism 71 of the receiving device according to the test result, and accurately place them in the receiving grooves 721 of the tray 72 to be sorted and stored.
20‧‧‧定位裝置20‧‧‧ Positioning device
21‧‧‧定位機構21‧‧‧ Positioning agency
211‧‧‧第一定位件211‧‧‧First positioning piece
2111‧‧‧第一容置空間2111‧‧‧First accommodation space
2112‧‧‧第一斜面2112‧‧‧First bevel
2113‧‧‧第一抵靠部2113‧‧‧First Abutment
213‧‧‧第二定位件213‧‧‧Second positioning parts
2131‧‧‧第二容置空間2131‧‧‧Second accommodation space
2132‧‧‧第二抵靠部2132‧‧‧Second Abutment
22‧‧‧驅動機構22‧‧‧ drive mechanism
221‧‧‧驅動器221‧‧‧ drive
223‧‧‧第二活動件223‧‧‧Second event
224‧‧‧板體224‧‧‧ board
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103103154A TWI505051B (en) | 2014-01-28 | 2014-01-28 | A plurality of electronic components can be positioned at the same time positioning device and its application of the operating equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103103154A TWI505051B (en) | 2014-01-28 | 2014-01-28 | A plurality of electronic components can be positioned at the same time positioning device and its application of the operating equipment |
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| TWI505051B true TWI505051B (en) | 2015-10-21 |
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Citations (6)
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|---|---|---|---|---|
| JPH07175522A (en) * | 1993-11-05 | 1995-07-14 | Toshiba Corp | Device and method for positioning, and bare board tester |
| TW200928385A (en) * | 2007-12-21 | 2009-07-01 | Hon Tech Inc | Carrying device for precisely aligning electronic elements |
| CN201852912U (en) * | 2010-09-03 | 2011-06-01 | 界鸿科技股份有限公司 | Electronic element testing mechanism |
| CN102084260A (en) * | 2008-07-08 | 2011-06-01 | 株式会社爱德万测试 | Electronic component testing method, insert, tray, and electronic component testing apparatus |
| US8013624B2 (en) * | 2005-11-15 | 2011-09-06 | Advantest Corporation | Electronic device test apparatus and method of mounting of performance board in electronic device test apparatus |
| TWM429985U (en) * | 2012-01-12 | 2012-05-21 | Nada Elite Technologies Inc | Apparatus for holding wafer |
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2014
- 2014-01-28 TW TW103103154A patent/TWI505051B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07175522A (en) * | 1993-11-05 | 1995-07-14 | Toshiba Corp | Device and method for positioning, and bare board tester |
| US8013624B2 (en) * | 2005-11-15 | 2011-09-06 | Advantest Corporation | Electronic device test apparatus and method of mounting of performance board in electronic device test apparatus |
| TW200928385A (en) * | 2007-12-21 | 2009-07-01 | Hon Tech Inc | Carrying device for precisely aligning electronic elements |
| CN102084260A (en) * | 2008-07-08 | 2011-06-01 | 株式会社爱德万测试 | Electronic component testing method, insert, tray, and electronic component testing apparatus |
| CN201852912U (en) * | 2010-09-03 | 2011-06-01 | 界鸿科技股份有限公司 | Electronic element testing mechanism |
| TWM429985U (en) * | 2012-01-12 | 2012-05-21 | Nada Elite Technologies Inc | Apparatus for holding wafer |
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