TW201539637A - Test sorting machine and its advancing device, test tray and test machine interface board - Google Patents
Test sorting machine and its advancing device, test tray and test machine interface board Download PDFInfo
- Publication number
- TW201539637A TW201539637A TW104110738A TW104110738A TW201539637A TW 201539637 A TW201539637 A TW 201539637A TW 104110738 A TW104110738 A TW 104110738A TW 104110738 A TW104110738 A TW 104110738A TW 201539637 A TW201539637 A TW 201539637A
- Authority
- TW
- Taiwan
- Prior art keywords
- test
- semiconductor component
- terminal
- semiconductor
- tray
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2644—Adaptations of individual semiconductor devices to facilitate the testing thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
本發明涉及一種使用於半導體元件的測試的測試分選機、作為測試分選機的配件的推進裝置和測試托盤、以及測試機的介面板。 The present invention relates to a test sorter for testing semiconductor components, a propulsion device and test tray as an accessory for a test sorter, and a mediator for the tester.
測試分選機將製造的半導體元件電連接於測試機。另外,測試分選機根據測試結果而將半導體元件進行分類。關於測試分選機可參考韓國公開專利2012-0106320號(以下,稱為“第一引用文獻”)等。 The test sorter electrically connects the fabricated semiconductor components to the tester. In addition, the test sorter classifies semiconductor components based on the test results. Regarding the test sorting machine, Korean Patent Publication No. 2012-0106320 (hereinafter referred to as "first cited document") and the like can be referred to.
為了將半導體元件電連接於測試機,測試分選機具有測試托盤和推進裝置。 In order to electrically connect the semiconductor component to the test machine, the test handler has a test tray and a propulsion device.
測試托盤可承載半導體元件。半導體元件被安置在配備於測試托盤的***件中。如韓國公開專利10-2011-0011462號(以下,稱為“第二引用文獻”)所記載,***件具有用於固定安置的半導體元件的閂鎖裝置。閂鎖裝置由固定杠杆(第二引用文獻中命名為“閂鎖部件”)和彈性部件(第二引用文獻中命名為“復原彈簧”)構成。固定杠杆 通過正反向旋轉而固定半導體元件或解除固定。彈性部件朝向使固定杠杆固定半導體元件的正方向施加彈性力。應予說明,當固定杠杆解除對半導體元件的固定時,借助於專門的開放裝置而對固定杠杆施加反方向的外力。 The test tray can carry semiconductor components. The semiconductor component is placed in an insert that is provided in the test tray. As described in Korean Laid-Open Patent Publication No. 10-2011-0011462 (hereinafter referred to as "Second Reference"), the insert has a latching device for fixedly disposed semiconductor elements. The latching device consists of a fixed lever (named "Latch-up part" in the second reference) and an elastic member (designated "Recovery Spring" in the second reference). Fixed lever The semiconductor element is fixed or released by rotation in the forward and reverse directions. The elastic member applies an elastic force toward a positive direction in which the fixed lever fixes the semiconductor element. It should be noted that when the fixed lever releases the fixing of the semiconductor element, an external force in the opposite direction is applied to the fixed lever by means of a special opening device.
推進裝置推動承載於測試托盤的半導體元件而使半 導體元件電連接於測試機的介面板。如第一引用文獻所記載,推進裝置由推進器(第一引用文獻中命名為“推進單元”)、推進器設置板(第一引用文獻中命名為“設置板”)以及移動源構成。推進器用於與介面板的測試插座對向而支撐半導體元件或者對半導體元件加壓。推進器設置板設置有推進器。移動源用於使推進器設置板向介面板移動,或者使推進器設置板朝反方向移動。 The propulsion device pushes the semiconductor component carried on the test tray to make half The conductor element is electrically connected to the interface panel of the test machine. As described in the first cited document, the propulsion device is composed of a propeller (named "propulsion unit" in the first cited document), a propeller setting plate (named "setting plate" in the first cited document), and a moving source. The pusher is used to support or pressurize the semiconductor component opposite the test socket of the interface panel. The thruster setting plate is provided with a pusher. The moving source is used to move the pusher setting plate toward the media panel or to move the pusher setting plate in the opposite direction.
介面板通常是以與測試機的主體分離的狀態結合於 測試分選機。如韓國公開實用新型2009-0002814號所記載,介面板具有能夠與半導體元件電連接的測試插座。因此,得到推進器的支撐或加壓的半導體元件電連接於測試插座。 The interface panel is usually combined with the state separated from the main body of the test machine. Test the sorter. As described in Korean Laid-Open Utility Model No. 2009-0002814, the dielectric panel has a test socket that can be electrically connected to a semiconductor element. Thus, the semiconductor component that is supported or pressurized by the pusher is electrically connected to the test socket.
所述測試托盤、推進裝置和介面板的關係可參考第一引用文獻的參照圖2進行的說明。 The relationship between the test tray, the propulsion device, and the mediation panel can be referred to the description of the first cited document with reference to FIG.
另外,半導體元件受到外界的電氣影響而可能發生誤操作。這樣的問題可能隨著電子部件的密集度增加而頻繁出現。尤其,近來由於需要實現電子產品的多樣的功能,因此電子部件的密集度較高。因此,對半導體元件的表面進行遮罩處理。在半導體元件的表面進行處理的遮罩層保護半導體元件免受源於外界的電氣作用的不利影響。即,通過接地 的遮罩層而消除外界的電氣作用。 In addition, semiconductor components are subject to external electrical influences and may malfunction. Such problems may occur frequently as the density of electronic components increases. In particular, recently, due to the need to implement various functions of electronic products, the density of electronic components is high. Therefore, the surface of the semiconductor element is subjected to a masking process. The mask layer that is processed on the surface of the semiconductor component protects the semiconductor component from the adverse effects of electrical effects originating from the outside. That is, through grounding The mask layer eliminates the electrical effects of the outside world.
製作遮罩層的一種方法就是利用較薄的金屬板而覆蓋半導體元件的表面。然而,利用金屬板覆蓋半導體元件表面的工藝繁瑣,從而使生產效率降低。 One method of making a mask layer is to cover the surface of the semiconductor component with a thin metal plate. However, the process of covering the surface of the semiconductor element with a metal plate is cumbersome, thereby reducing the production efficiency.
製作遮罩層的另一種方法則是利用導電性材料塗覆半導體元件的表面。這種方法工藝簡單且生產性良好。然而,如果存在塗覆不良就會遇到難以確認的麻煩。 Another method of making a mask layer is to coat the surface of the semiconductor component with a conductive material. This method is simple in process and good in productivity. However, if there is a poor coating, it will be difficult to confirm.
塗覆不良不會對半導體元件的電學特性測試產生影響。因此,測試合格卻塗覆不良的半導體元件可能被應用於電子產品。在此情況下,塗覆不良可能會擴大為電子產品自身的不良。 Poor coating does not affect the electrical property test of the semiconductor component. Therefore, a test-qualified but poorly coated semiconductor component may be applied to an electronic product. In this case, poor coating may expand into the defect of the electronic product itself.
本發明的目的在於提供一種可在檢查半導體元件的電學特性的過程中確認半導體元件的表面是否恰當地形成遮罩層的技術。 An object of the present invention is to provide a technique for confirming whether or not a surface of a semiconductor element is properly formed in a mask during inspection of electrical characteristics of a semiconductor element.
根據本發明的一種測試分選機用推進裝置,包括:推進器,與配備於測試機的介面板的測試插座對向而支撐半導體元件,從而將半導體元件電連接於所述測試插座;推進器設置板,用於設置所述推進器;移動源,用於使所述推進器設置板向所述介面板移動;接觸端子,接觸於借助所述推進器而電連接於所述測試插座的半導體元件的表面;以及連接電路,用於將所述接觸端子電連接於測量端子,該測量端子輸出用於測量半導體元件的表面電阻的信號。 A propulsion device for a test sorter according to the present invention, comprising: a pusher, supporting a semiconductor component opposite to a test socket provided in a test panel of the test machine, thereby electrically connecting the semiconductor component to the test socket; a plate for setting the pusher; a moving source for moving the pusher setting plate toward the interface panel; and a contact terminal contacting the semiconductor electrically connected to the test socket by the pusher a surface of the component; and a connection circuit for electrically connecting the contact terminal to the measurement terminal, the measurement terminal outputting a signal for measuring a surface resistance of the semiconductor component.
所述接觸端子和連接電路可設置於所述推進器。 The contact terminal and the connection circuit may be disposed on the pusher.
所述測試分選機用推進裝置還可以包括:連接端子,用於將所述接觸端子電連接於測試插座,其中,所述連接電路將所述接觸端子與所述連接端子電連接。 The propulsion device for the test sorter may further include: a connection terminal for electrically connecting the contact terminal to the test socket, wherein the connection circuit electrically connects the contact terminal with the connection terminal.
根據本發明的一種測試分選機,其特徵在於,包括:測試托盤,能夠用於安置半導體元件,並借助於多個移送裝置而迴圈於預定的閉合路徑;裝載裝置,用於將半導體元件裝載(loading)於所述測試托盤;推進裝置,將所述測試托盤推向測試機的介面板,以使借助於所述裝載裝置而被裝載於所述測試托盤的半導體元件電連接於測試機;以及卸載裝置,從所裝載的半導體元件的測試完畢的測試托盤中卸載(unloading)半導體元件,其中,所述推進裝置為具有所述接觸端子和連接電路的測試分選機用推進裝置。 A test sorter according to the present invention, comprising: a test tray capable of locating a semiconductor component and looping over a predetermined closed path by means of a plurality of transfer devices; loading means for transferring the semiconductor component Loading the test tray; pushing the device to push the test tray toward the interface panel of the test machine, so that the semiconductor component loaded on the test tray by means of the loading device is electrically connected to the test machine And an unloading device that unloads the semiconductor component from the tested test tray of the loaded semiconductor component, wherein the propulsion device is a test device propulsion device having the contact terminal and the connection circuit.
根據本發明的一種測試機用介面板,包括:測試插座,電連接於半導體元件;插座設置板,用於設置所述測試插座;以及測量端子,輸出用於測量半導體元件的表面電阻的信號。 A dielectric panel for a test machine according to the present invention includes: a test socket electrically connected to a semiconductor element; a socket setting plate for setting the test socket; and a measurement terminal for outputting a signal for measuring a surface resistance of the semiconductor element.
所述測量端子可設置於所述測試插座。 The measuring terminal can be disposed on the test socket.
所述測量端子還能夠以與所述測試插座相互獨立的方式設置於所述插座設置板。 The measuring terminal can also be disposed on the socket setting board in a manner independent of the test socket.
所述測量端子中接觸於半導體元件的表面的連接端能夠借助於外力而彎曲或旋轉,在此情況下,還能夠實現彈性復原。 The connection end of the measurement terminal that is in contact with the surface of the semiconductor element can be bent or rotated by an external force, and in this case, elastic recovery can also be achieved.
根據本發明的一種測試分選機用測試托盤,包括: ***件,具有能夠安置半導體元件的安置槽;設置框架,用於設置所述***件,所述***件包括:***件主體,形成有所述安置槽;固定杠杆,用於將安置於所述安置槽的半導體元件固定於所述安置槽或解除固定,並將半導體元件的表面電連接於測量端子,該測量端子輸出用於測量半導體元件的表面電阻的信號;以及彈性部件,向所述固定杠杆將半導體元件固定到所述安置槽的方向施加彈性力,所述固定杠杆包括:固定端,將安置於所述安置槽的半導體元件固定於所述安置槽或解除固定,並在半導體元件被固定時接觸於半導體元件的表面;以及接觸端,接觸於測量端子,該測量端子輸出用於測量半導體元件的表面電阻的信號。 A test tray for a test sorter according to the present invention includes: An insert having a seating groove capable of arranging a semiconductor element; a frame for arranging the insert, the insert comprising: an insert body formed with the seating groove; a fixing lever for being disposed in the a semiconductor element for locating the groove is fixed to the seating groove or unsecured, and electrically connects a surface of the semiconductor element to the measurement terminal, the measurement terminal outputs a signal for measuring a surface resistance of the semiconductor element; and an elastic member to the fixed The lever applies an elastic force in a direction in which the semiconductor element is fixed to the seating groove, and the fixed lever includes a fixed end that fixes the semiconductor component disposed in the seating groove to the seating groove or is unfixed, and is Contacting the surface of the semiconductor component at a fixed time; and contacting the contact terminal to the measurement terminal, the measurement terminal outputting a signal for measuring the surface resistance of the semiconductor component.
根據本發明的一種測試分選機,其特徵在於,包括: 測試托盤,能夠安置半導體元件,並借助於多個移送裝置而迴圈於預定的閉合路徑;裝載裝置,將半導體元件裝載(loading)於所述測試托盤;推進裝置,將所述測試托盤推向測試機的介面板,以使借助於所述裝載裝置而被裝載於所述測試托盤的半導體元件電連接於測試機;以及卸載裝置,用於從所裝載的半導體元件的測試完畢的測試托盤中卸載(unloading)半導體元件,其中,所述測試托盤為具有包括所述接觸端的固定杠杆的測試分選機用測試托盤。 A test sorter according to the present invention, comprising: a test tray capable of locating a semiconductor component and looping over a predetermined closed path by means of a plurality of transfer devices; loading device loading a semiconductor component to the test tray; propelling device, pushing the test tray toward Testing the interface panel of the machine such that the semiconductor component loaded on the test tray by means of the loading device is electrically connected to the test machine; and the unloading device for testing from the tested test tray of the loaded semiconductor component Unloading the semiconductor component, wherein the test tray is a test tray for a test handler having a fixed lever including the contact end.
根據本發明,在檢查半導體元件的電學特性的過程中可確認半導體元件表面的遮罩層是否恰當形成。因此,具有如下技術效果: According to the present invention, it is confirmed in the process of inspecting the electrical characteristics of the semiconductor element whether or not the mask layer on the surface of the semiconductor element is properly formed. Therefore, it has the following technical effects:
第一,可提高測試的可靠性。 First, the reliability of the test can be improved.
第二,由於遮罩層的檢查與電學特性的檢查一起執行,因此不需要經過專門的檢查過程。 Second, since the inspection of the mask layer is performed together with the inspection of the electrical characteristics, a special inspection process is not required.
100‧‧‧測試分選機 100‧‧‧Test Sorter
110‧‧‧測試托盤 110‧‧‧Test tray
111‧‧‧***件 111‧‧‧ Inserts
111a‧‧‧固定杠杆 111a‧‧‧Fixed lever
111b‧‧‧彈性部件 111b‧‧‧Flexible parts
111c‧‧‧***件主體 111c‧‧‧ insert body
S‧‧‧安置槽 S‧‧ ‧ placement trough
HP‧‧‧固定端 HP‧‧‧ fixed end
CP‧‧‧接觸端 CP‧‧‧ contact end
112‧‧‧設置框架 112‧‧‧Set the framework
120‧‧‧裝載裝置 120‧‧‧Loading device
150‧‧‧推進裝置 150‧‧‧ propulsion device
151‧‧‧推進器 151‧‧‧ propeller
152‧‧‧推進器設置板 152‧‧‧propeller setting board
153‧‧‧移動源 153‧‧‧Mobile source
170‧‧‧卸載裝置 170‧‧‧Unloading device
CT‧‧‧接觸端子 CT‧‧Contact terminal
CC‧‧‧連接電路 CC‧‧‧Connected circuit
200‧‧‧介面板 200‧‧‧Intermediate panel
210‧‧‧測試插座 210‧‧‧Test socket
220‧‧‧插座設置板 220‧‧‧Socket setting board
MT‧‧‧測量端子 MT‧‧‧Measurement terminal
MTa‧‧‧連接端 MTa‧‧‧ connection
圖1為關於根據本發明的測試分選機和介面板的概略平面圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic plan view of a test handler and a mediator panel in accordance with the present invention.
圖2為關於應用在圖1的測試分選機的測試托盤的概略平面圖。 2 is a schematic plan view of a test tray applied to the test handler of FIG. 1.
圖3和圖4為關於本發明的第一實施例的特徵部分的示意圖。 3 and 4 are schematic views of the characterizing portions of the first embodiment of the present invention.
圖5和圖6為關於本發明的第二實施例的特徵部分的示意圖。 5 and 6 are schematic views of the characterizing portions relating to the second embodiment of the present invention.
圖7和圖8為關於本發明的第三實施例的特徵部分的示意圖。 7 and 8 are schematic views of characteristic portions relating to a third embodiment of the present invention.
圖9為關於應用在圖7的介面板的測試插座的連接端的另一變形例的圖。 Fig. 9 is a view showing another modification of the connection end of the test socket applied to the interface panel of Fig. 7.
圖10和圖11為關於本發明的第四實施例的特徵部分的示意圖。 10 and 11 are schematic views of characteristic portions relating to a fourth embodiment of the present invention.
圖12為關於根據本發明的測試分選機、測量機以及介面板的概略構成圖。 Figure 12 is a schematic configuration diagram of a test sorter, a measuring machine, and a mediating panel according to the present invention.
圖13表示作為接觸部分的接觸端子被設置於測試分選機的其他配件中的示例。 Fig. 13 shows an example in which the contact terminals as the contact portions are provided in other fittings of the test handler.
參考附圖說明根據本發明的優選實施例。為了說明的簡要性,儘量省略或縮減重複性說明。 Preferred embodiments in accordance with the present invention are described with reference to the drawings. For the sake of simplicity of description, the repetitive description is omitted or reduced as much as possible.
<對測試分選機和介面板的基本構造的說明> <Description of the basic construction of the test sorter and the interface panel>
圖1是對根據本發明的測試分選機100和介面板200的概略平面圖。 1 is a schematic plan view of a test handler 100 and a media panel 200 in accordance with the present invention.
測試分選機100包括測試托盤110、裝載裝置120、均熱室(SOAK CHAMBER)130、測試室(TEST CHAMBER)140、推進裝置150、退均熱室(DESOAK CHAMBER)160、卸載裝置170等。 The test sorter 100 includes a test tray 110, a loading device 120, a soaking chamber (SOAK CHAMBER) 130, a test chamber (TEST CHAMBER) 140, a propulsion device 150, a DESOAK CHAMBER 160, an unloading device 170, and the like.
測試托盤110沿著經由裝載位置(LOADING POSITION)LP、測試位置(TEST POSITION)TP、卸載位置(UNLOADING POSITION)UP的閉合路徑C而迴圈。這樣的測試托盤110可裝載有半導體元件。如圖2的平面圖所示,測試托盤110包括多個***件111和設置框架112。多個***件111設置於設置框架112。半導體元件被安置於***件111的安置槽S。當然,可以如同背景技術中記載的那樣,***件111具有固定杠杆和彈性部件。 The test tray 110 is looped along a closed path C via a LOADING POSITION LP, a TEST POSITION TP, and an UNLOADING POSITION UP. Such a test tray 110 can be loaded with semiconductor components. As shown in the plan view of FIG. 2, the test tray 110 includes a plurality of inserts 111 and a set frame 112. A plurality of inserts 111 are disposed in the setting frame 112. The semiconductor element is placed in the seating groove S of the insert 111. Of course, the insert 111 can have a fixed lever and an elastic member as described in the background art.
裝載裝置120將客戶托盤CT1的半導體元件裝載(loading)於裝載位置LP的測試托盤110。 The loading device 120 loads the semiconductor components of the customer tray CT 1 to the test tray 110 at the loading position LP.
均熱室130用於根據測試條件而對來自裝載位置LP的測試托盤110中的半導體元件進行預熱或預冷。 The soaking chamber 130 is for preheating or pre-cooling the semiconductor components in the test tray 110 from the loading position LP according to the test conditions.
測試室140用於對經過均熱室130而來到測試位置TP的測試托盤110中的半導體元件進行測試。 The test chamber 140 is used to test the semiconductor components in the test tray 110 that have passed through the soaking chamber 130 to the test position TP.
推進裝置150將位於測試室140內的測試托盤110 推向測試機的介面板200。據此,承載於測試托盤110的半導體元件電連接於介面板200。當然,如同背景技術中記載的那樣,推進裝置150具有推進器、推進器設置板以及移動源153。 The propulsion device 150 will be placed on the test tray 110 within the test chamber 140 Push to the media panel 200 of the test machine. Accordingly, the semiconductor elements carried on the test tray 110 are electrically connected to the via panel 200. Of course, as described in the background art, the propulsion device 150 has a propeller, a propeller setting plate, and a moving source 153.
退均熱室160用於使來自測試室140的測試托盤110 中的半導體元件回歸到常溫。 The de-heating chamber 160 is used to bring the test tray 110 from the test chamber 140 The semiconductor component in the process returns to normal temperature.
卸載裝置170用於卸載(unloading)從退均熱室160 來到卸載位置UP的測試托盤110中的半導體元件。此時,卸載裝置170將半導體元件按測試等級分別進行分類而裝載於客戶托盤CT2、CT3、CT4。 The unloading device 170 is for unloading the semiconductor elements in the test tray 110 from the de-heating chamber 160 to the unloading position UP. At this time, the unloading device 170 classifies the semiconductor elements by the test level and loads them on the customer trays CT 2 , CT 3 , and CT 4 .
形成於半導體元件的表面的遮罩層的不良與否還可 以通過測量電阻而確認。即,可根據半導體元件的表面電阻究竟是標準值以上還是標準值以下而確認遮罩層的不良與否。 The defect of the mask layer formed on the surface of the semiconductor element can also It is confirmed by measuring the resistance. In other words, whether or not the mask layer is defective can be confirmed depending on whether the surface resistance of the semiconductor element is equal to or higher than a standard value or less.
因此,測試分選機100還可以具有能夠電接觸於半 導體元件的表面的接觸部分。接觸部分用於測量半導體元件的表面電阻。這樣的接觸部分也可以選擇性地構成於測試托盤110或推進裝置150之類的配件中。 Therefore, the test sorter 100 can also have electrical contact with the half The contact portion of the surface of the conductor element. The contact portion is used to measure the surface resistance of the semiconductor element. Such contact portions may also be selectively formed in accessories such as test tray 110 or propulsion device 150.
當測試分選機100具有用於測量表面電阻的接觸部 分時,卸載裝置170的分類操作可多樣化。例如,在圖1中,在電學特性測試中被判定為不良的半導體元件可被分類於符號為CT3的客戶托盤,在表面電阻測量中被判定為不良的半導體元件可被分類於符號為CT4的客戶托盤,在表面電阻測量和電學特性測試中均被判定為不良的半導體元件可被分類 於符號為CT5的客戶托盤。當然,也可以不區分電學特性測試中的不良與否以及表面電阻測量中的不良與否,而是只根據總體上的不良與否而進行分類。 When the test sorter 100 has a contact portion for measuring surface resistance, the sorting operation of the unloading device 170 can be diversified. For example, in FIG. 1, the electrical characteristics test is determined to be a semiconductor element failure may be classified in the symbol CT customer tray 3, it is determined that the surface resistance measurement as a semiconductor element failure may be classified in the symbol CT customer tray 4, and the surface resistance measuring electrical characteristics of a semiconductor test device are determined to be defective can be classified to the symbol CT 5 of the tray to customers. Of course, it is also possible to distinguish between the defect in the electrical property test and the defect in the surface resistance measurement, but only based on the overall defect or not.
另外,介面板200包括測試插座210和插座設置板220。 In addition, the interface panel 200 includes a test socket 210 and a socket setting board 220.
測試插座210具有電連接於半導體元件的引出端子的多個測試端子。 The test socket 210 has a plurality of test terminals electrically connected to the lead terminals of the semiconductor element.
插座設置板220設置有測試插座210。 The socket setting board 220 is provided with a test socket 210.
另外,根據本發明的介面板200還可以具有測量端子。測量端子輸出用於測量半導體元件的表面電阻的信號。這樣的測量端子可以是以彈針(pogo pin)的形態配備。 In addition, the mesas panel 200 according to the present invention may also have measurement terminals. The measurement terminal outputs a signal for measuring the surface resistance of the semiconductor element. Such a measuring terminal can be provided in the form of a pogo pin.
對具有如上所述的基本構造的測試分選機100和介面板200的具體實施例進行說明。 A specific embodiment of the test handler 100 and the media panel 200 having the basic configuration as described above will be described.
<第一實施例> <First Embodiment>
圖3是對第一實施例的特徵部分的示意圖。 Fig. 3 is a schematic view of a characteristic portion of the first embodiment.
在本實施例中,接觸部分設置於推進裝置150的推進器151,測量端子MT設置於介面板200的測試插座210。 In the present embodiment, the contact portion is disposed on the pusher 151 of the propulsion device 150, and the measurement terminal MT is disposed on the test socket 210 of the mediation panel 200.
推進器151設置有接觸端子CT和連接電路CC。其中,接觸端子CT和連接電路CC為配備於測試分選機100的接觸部分。 The pusher 151 is provided with a contact terminal CT and a connection circuit CC. Among them, the contact terminal CT and the connection circuit CC are contact portions provided in the test sorter 100.
接觸端子CT接觸於半導體元件D的表面。接觸端子CT可以是以彈針的形態配備。 The contact terminal CT is in contact with the surface of the semiconductor element D. The contact terminal CT may be provided in the form of a pin.
連接電路CC用於將接觸端子CT電連接於介面板 200的測量端子MT。 The connection circuit CC is used to electrically connect the contact terminal CT to the interface panel Measuring terminal MT of 200.
圖4表示半導體元件D電連接於測試插座210的狀 態。 4 shows a state in which the semiconductor element D is electrically connected to the test socket 210. state.
安置於***件111的半導體元件D的引出端子OT 電連接於測試插座210的測試端子TT。另外,設置於推進器151的接觸端子CT接觸於半導體元件D的表面,測量端子MT接觸於連接電路CC。於是,借助於測試機一併實現對半導體元件的電學特性和表面電阻的測試。 The lead terminal OT of the semiconductor element D disposed in the interposer 111 The test terminal TT is electrically connected to the test socket 210. Further, the contact terminal CT provided to the pusher 151 is in contact with the surface of the semiconductor element D, and the measurement terminal MT is in contact with the connection circuit CC. Thus, the test of the electrical characteristics and surface resistance of the semiconductor element was carried out by means of a test machine.
<第二實施例> <Second embodiment>
圖5是對第二實施例的特徵部分的示意圖。 Fig. 5 is a schematic view of a characteristic portion of the second embodiment.
在本實施例中,作為接觸部分利用***件111的固 定杠杆111a。在此,固定杠杆111a為配備於測試分選機100的接觸部分。 In the present embodiment, the solid portion of the insert 111 is used as the contact portion. Fixed lever 111a. Here, the fixed lever 111a is a contact portion provided to the test sorter 100.
固定杠杆111a由導電性材料的金屬構成。這樣的固 定杠杆111a以旋轉點LP為基準而在兩側具有固定端HP和接觸端CP。 The fixed lever 111a is made of a metal of a conductive material. Such solid The fixed lever 111a has a fixed end HP and a contact end CP on both sides with reference to the rotation point LP.
固定端HP用於固定安置於***件主體111c的安置 槽S的半導體元件D或解除固定。當然,彈性部件111b朝向將半導體元件D固定於安置槽S的方向對固定杠杆111a施加彈性力。另外,固定端HP接觸於半導體元件的表面。 The fixed end HP is used for fixing the placement of the insert body 111c The semiconductor element D of the trench S is either unsecured. Of course, the elastic member 111b applies an elastic force to the fixed lever 111a in a direction in which the semiconductor element D is fixed to the seating groove S. In addition, the fixed end HP contacts the surface of the semiconductor element.
接觸端CP向安置槽S的外側突出。這樣的接觸端 CP用於與測量端子MT接觸。 The contact end CP protrudes to the outside of the seating groove S. Such contact end The CP is used to make contact with the measurement terminal MT.
圖6表示半導體元件D電連接於測試插座210的狀 態。即,介面板200的測量端子MT可通過固定杠杆111a而連接於半導體元件D的表面。 FIG. 6 shows a state in which the semiconductor element D is electrically connected to the test socket 210. state. That is, the measurement terminal MT of the meso panel 200 can be connected to the surface of the semiconductor element D by the fixed lever 111a.
應予說明,也可以如下實現固定杠杆111a:只有接 觸於半導體元件D的部分和接觸於測量端子MT的部分為導電性材料,並具有用於連接兩側的佈線。即,只要能夠使固定杠杆111a將半導體元件D的表面與測量端子MT電連接即可。 It should be noted that the fixed lever 111a can also be realized as follows: The portion contacting the semiconductor element D and the portion contacting the measurement terminal MT are electrically conductive materials and have wirings for connecting the both sides. That is, the fixed lever 111a can electrically connect the surface of the semiconductor element D to the measurement terminal MT.
<第三實施例> <Third embodiment>
圖7是對第三實施例的特徵部分的示意圖。 Fig. 7 is a schematic view of a characteristic portion of the third embodiment.
本實施例的特徵在於介面板200的測量端子MT。 This embodiment is characterized by the measurement terminal MT of the interface panel 200.
測量端子MT在末端具有連接端MTa。兩個連接端MTa朝彼此相對的方向維持傾斜的狀態。 The measuring terminal MT has a connecting end MTa at the end. The two connection ends MTa maintain a tilted state in directions opposite to each other.
圖8表示半導體元件D電連接於測試插座210的狀態。 FIG. 8 shows a state in which the semiconductor element D is electrically connected to the test socket 210.
在本實施例中,***件111借助於推進器151而向測試插座210側移動並對連接端MTa施加外力。於是,連接端MTa直接連接於半導體元件D的表面。 In the present embodiment, the insert 111 is moved toward the test socket 210 side by means of the pusher 151 and an external force is applied to the connection terminal MTa. Thus, the connection terminal MTa is directly connected to the surface of the semiconductor element D.
本實施例中假設了連接端MTa在彎曲之後彈性復原的情形。然而,也可以如圖9所示,構成為測量端子MT的連接端MTa借助於外力而旋轉,然後借助於復原彈簧RS而實現彈性復原。 In the present embodiment, a case where the connection end MTa is elastically restored after bending is assumed. However, as shown in FIG. 9, the connection end MTa of the measurement terminal MT may be rotated by an external force, and then the elastic recovery may be realized by means of the return spring RS.
<第四實施例> <Fourth embodiment>
圖10是對第四實施例的特徵部分的示意圖。 Fig. 10 is a schematic view of a characteristic portion of the fourth embodiment.
在本實施例中,還具有設置於推進裝置150的推進 器設置板152的連接端子LT。連接端子LT通過連接電路CC而與設置於推進器151的接觸端子CT電連接。另外,測量端子MT設置於介面板200的插座設置板220。在此,連接端子LT與測量端子MT位於相互對應的位置。於是,測量端子MT被設置為與測試插座210相互獨立。當然,優選地,多個連接端子LT或多個測量端子MT分別以一個插座捆綁而構成。 In this embodiment, there is also a propulsion provided in the propulsion device 150. The connection terminal LT of the board 152 is set. The connection terminal LT is electrically connected to the contact terminal CT provided to the pusher 151 via the connection circuit CC. In addition, the measurement terminal MT is disposed on the socket setting board 220 of the mezzanine panel 200. Here, the connection terminal LT and the measurement terminal MT are located at mutually corresponding positions. Thus, the measurement terminal MT is set to be independent of the test socket 210. Of course, preferably, the plurality of connection terminals LT or the plurality of measurement terminals MT are respectively bundled by one socket.
圖11表示半導體元件D電連接於測試插座210的 狀態。 FIG. 11 shows that the semiconductor element D is electrically connected to the test socket 210. status.
設置於推進器151的接觸端子CT接觸於半導體元 件D的表面,測量端子MT連接於連接端子LT。當然,接觸端子CT與連接端子LT通過連接電路CC而連接。 The contact terminal CT disposed on the pusher 151 is in contact with the semiconductor element The surface of the piece D, the measuring terminal MT is connected to the connection terminal LT. Of course, the contact terminal CT and the connection terminal LT are connected by the connection circuit CC.
在本實施例中,接觸端子CT、連接電路CC以及連 接端子LT成為配備於測試分選機100的接觸部分。 In this embodiment, the contact terminal CT, the connection circuit CC, and the connection The terminal LT becomes a contact portion provided in the test handler 100.
在所述的各個實施例中,為了防止接觸錯誤,接觸 端子CT與測量端子MT例如可採用開爾文探針(Kelvin probe)結構。 In the various embodiments described, in order to prevent contact errors, contact The terminal CT and the measurement terminal MT can be, for example, a Kelvin probe structure.
另外,所述的第一實施例、第二實施例以及第四實 施例可選擇性地應用於測試分選機100。 In addition, the first embodiment, the second embodiment, and the fourth embodiment are described. The embodiment can be selectively applied to the test sorter 100.
應予說明,在所述的實施例中對一併執行半導體元 件的電學特性測試和半導體元件的表面電阻測量的情形進行了說明。然而,根據設備的運用,也可以選擇性地執行半導 體元件的表面電阻測量和半導體元件的電學特性測試。即,既可以採用並行半導體元件的電學特性測試和表面電阻測量的運用方式,也可以採用只選擇半導體元件的電學特性測試和表面電阻測量中的一種而執行的運用方式。 It should be noted that in the embodiment described, the semiconductor element is executed together. The case of the electrical characteristic test of the piece and the surface resistance measurement of the semiconductor element is explained. However, semi-conducting can also be selectively performed depending on the application of the device. Surface resistance measurement of body components and electrical property testing of semiconductor components. That is, it is possible to employ the operation of the electrical characteristic test and the surface resistance measurement of the parallel semiconductor element, or the operation mode in which only one of the electrical characteristic test and the surface resistance measurement of the semiconductor element is selected.
另外,所述的各個實施例假定了測試機一併輸出電 學特性測試用信號和表面電阻測量用信號的情形。 In addition, the various embodiments described assume that the test machine outputs power together. The case of the signal for signal measurement and surface resistance measurement.
然而,根據實施情況,也可以如圖12所示地配備不 同於測試機(TESTER)的測量機(RTA)。測量機輸出用於測量半導體元件的表面電阻的信號。在這樣的示例中,公開於第一實施例、第二實施例、第四實施例的測試分選機100的接觸部分與測量機(RTA)相關。因此,介面板200不具有測量端子。 However, depending on the implementation, it can also be equipped as shown in Figure 12. Same as the measuring machine (RTA) of the test machine (TESTER). The measuring machine outputs a signal for measuring the surface resistance of the semiconductor component. In such an example, the contact portion of the test handler 100 disclosed in the first embodiment, the second embodiment, and the fourth embodiment is associated with a measuring machine (RTA). Therefore, the interface panel 200 does not have a measurement terminal.
並且,所述的各個實施例只對接觸部分構成於測試 托盤110或推進裝置150的示例進行了說明。然而,根據實施情況,接觸部分也可以設置於測試分選機100的其他配件中。當然,也可以使接觸部分獨立於測試分選機100的現有部件而單獨構成。例如,如圖13所示,可以使配備於裝載裝置或卸載裝置的拾取器P具有接觸端子CT。其中,拾取器P為通過真空拾取而抓持半導體元件D或解除抓持的元件。在圖13所示的實施例中,半導體元件D的電學特性測試和表面電阻測量並不同時執行,而是隔著時間間隔而獨立地執行。 Moreover, the various embodiments described are only for testing the contact portion. An example of the tray 110 or the propulsion device 150 is illustrated. However, depending on the implementation, the contact portion may also be disposed in other accessories of the test handler 100. Of course, the contact portion can also be constructed separately from the existing components of the test handler 100. For example, as shown in FIG. 13, the pickup P equipped with the loading device or the unloading device may have the contact terminal CT. Among them, the pickup P is an element that grips or unwraps the semiconductor element D by vacuum pickup. In the embodiment shown in FIG. 13, the electrical characteristic test and the surface resistance measurement of the semiconductor element D are not performed at the same time, but are performed independently with time intervals.
如上所述,已通過結合附圖的實施例完成對本發明的具體說明。然而,所述的實施例只是本發明的優選實施例。因此,不能認為本發明局限於所述的實施例。 As described above, the detailed description of the present invention has been made by the embodiments in conjunction with the accompanying drawings. However, the described embodiments are only preferred embodiments of the invention. Therefore, the invention is not considered limited to the embodiments described.
100‧‧‧測試分選機 100‧‧‧Test Sorter
110‧‧‧測試托盤 110‧‧‧Test tray
111‧‧‧***件 111‧‧‧ Inserts
112‧‧‧設置框架 112‧‧‧Set the framework
120‧‧‧裝載裝置 120‧‧‧Loading device
150‧‧‧推進裝置 150‧‧‧ propulsion device
151‧‧‧推進器 151‧‧‧ propeller
152‧‧‧推進器設置板 152‧‧‧propeller setting board
153‧‧‧移動源 153‧‧‧Mobile source
170‧‧‧卸載裝置 170‧‧‧Unloading device
CT‧‧‧接觸端子 CT‧‧Contact terminal
CC‧‧‧連接電路 CC‧‧‧Connected circuit
200‧‧‧介面板 200‧‧‧Intermediate panel
Claims (10)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140042815A KR102102830B1 (en) | 2014-04-10 | 2014-04-10 | Test handler, pushing device and test tray for testhandler, interface board for tester |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201539637A true TW201539637A (en) | 2015-10-16 |
TWI549219B TWI549219B (en) | 2016-09-11 |
Family
ID=54269190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104110738A TWI549219B (en) | 2014-04-10 | 2015-04-01 | Test sorting machine and its propulsion device, test tray and test machine interface board |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR102102830B1 (en) |
CN (1) | CN104971908B (en) |
TW (1) | TWI549219B (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI624675B (en) * | 2016-02-19 | 2018-05-21 | 泰克元股份有限公司 | Pushing apparatus of handler for testing electronic devices |
TWI629489B (en) * | 2016-09-09 | 2018-07-11 | 南韓商泰克元股份有限公司 | Handler for testing electronic devices |
TWI631066B (en) * | 2016-12-23 | 2018-08-01 | 典泰科技股份有限公司 | Bundling mechanism for strapping Tray disc fixing strap |
TWI782566B (en) * | 2020-06-17 | 2022-11-01 | 韓商泰克元股份有限公司 | Handling system for testing electric component and adapter for mounting electronic component |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102470315B1 (en) * | 2016-01-29 | 2022-11-25 | (주)테크윙 | Insert for test handler |
CN107931154B (en) * | 2016-10-13 | 2019-07-26 | 泰克元有限公司 | Electronic component test sorting machine and its taught point method of adjustment |
CN108325863B (en) * | 2018-01-19 | 2019-10-18 | 温州职业技术学院 | The sorting equipment of semiconductor chilling plate integral test system |
CN109013402B (en) * | 2018-09-26 | 2020-08-07 | 通富微电子股份有限公司 | Semiconductor test system, test sorting machine and test machine |
KR102642193B1 (en) | 2018-10-24 | 2024-03-05 | 삼성전자주식회사 | Device and method for testing semiconductor device and test handler |
KR20200071357A (en) * | 2018-12-11 | 2020-06-19 | (주)테크윙 | Handler for testing electronic components |
KR102185035B1 (en) * | 2019-07-02 | 2020-12-01 | 세메스 주식회사 | Semiconductor package test apparatus |
JP6685526B1 (en) * | 2019-10-11 | 2020-04-22 | ハイソル株式会社 | Prober device and measuring jig |
KR102144806B1 (en) * | 2020-04-24 | 2020-08-14 | 티씨에스 주식회사 | Socket for electronic component testing apparatus |
CN116273994B (en) * | 2023-05-26 | 2023-07-21 | 北京京瀚禹电子工程技术有限公司 | Electrical equipment aging test equipment with intelligent feeding and sorting functions |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5325052A (en) * | 1990-11-30 | 1994-06-28 | Tokyo Electron Yamanashi Limited | Probe apparatus |
JP4018254B2 (en) * | 1998-08-20 | 2007-12-05 | 株式会社アドバンテスト | Testing method for electronic components |
US6946866B2 (en) * | 2003-05-30 | 2005-09-20 | Lsi Logic Corporation | Measurement of package interconnect impedance using tester and supporting tester |
JP4767147B2 (en) * | 2005-11-16 | 2011-09-07 | パナソニック株式会社 | Inspection apparatus and inspection method |
JP2008076308A (en) * | 2006-09-22 | 2008-04-03 | Advantest Corp | Interface device for electronic component test equipment |
KR101341566B1 (en) * | 2007-07-10 | 2013-12-16 | 삼성전자주식회사 | A socket, a test equipment, and method for manufacturing a multi-chip semiconductor device package |
KR101532952B1 (en) * | 2010-06-23 | 2015-07-01 | (주)테크윙 | Method for unloading semiconductor device in testhandler |
KR101559419B1 (en) * | 2011-12-27 | 2015-10-13 | (주)테크윙 | Test handler |
-
2014
- 2014-04-10 KR KR1020140042815A patent/KR102102830B1/en active IP Right Grant
-
2015
- 2015-03-30 CN CN201510144784.XA patent/CN104971908B/en active Active
- 2015-04-01 TW TW104110738A patent/TWI549219B/en active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI624675B (en) * | 2016-02-19 | 2018-05-21 | 泰克元股份有限公司 | Pushing apparatus of handler for testing electronic devices |
TWI629489B (en) * | 2016-09-09 | 2018-07-11 | 南韓商泰克元股份有限公司 | Handler for testing electronic devices |
TWI631066B (en) * | 2016-12-23 | 2018-08-01 | 典泰科技股份有限公司 | Bundling mechanism for strapping Tray disc fixing strap |
TWI782566B (en) * | 2020-06-17 | 2022-11-01 | 韓商泰克元股份有限公司 | Handling system for testing electric component and adapter for mounting electronic component |
Also Published As
Publication number | Publication date |
---|---|
CN104971908A (en) | 2015-10-14 |
CN104971908B (en) | 2019-04-19 |
TWI549219B (en) | 2016-09-11 |
KR102102830B1 (en) | 2020-04-23 |
KR20150117732A (en) | 2015-10-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI549219B (en) | Test sorting machine and its propulsion device, test tray and test machine interface board | |
US7046027B2 (en) | Interface apparatus for semiconductor device tester | |
US7105856B1 (en) | Test key having a chain circuit and a kelvin structure | |
KR101177133B1 (en) | Mock wafer, system calibrated using mock wafer, and method for calibrating automated test equipment | |
US8098076B2 (en) | Method and apparatus for terminating a test signal applied to multiple semiconductor loads under test | |
JP4532570B2 (en) | Circuit board inspection apparatus and circuit board inspection method | |
JP2014515095A (en) | Wireless probe card verification system and method | |
KR20120065790A (en) | Method and equipment for testing semiconductor apparatus simultaneously and continuously | |
US7281181B2 (en) | Systems, methods and computer programs for calibrating an automated circuit test system | |
US20080074130A1 (en) | Apparatus and method for testing conductive bumps | |
TW200305725A (en) | Test board for testing semiconductor device | |
TWI310837B (en) | Semiconductor test interface | |
JP2001272440A (en) | Method and apparatus for calibration of pulse sending timing | |
TW529110B (en) | Film carrier tape and method of evaluating the same | |
JP2012018116A (en) | Probe unit for circuit board checkup and circuit board checkup device | |
US6323666B1 (en) | Apparatus and method for testing test burn-in board and device under test, and test burn-in board handler | |
KR102287237B1 (en) | Insert assembly for receiving semiconductor device and test tray including the same | |
JP2007322127A (en) | Method for inspecting substrate and substrate inspection system | |
US10295563B2 (en) | Test socket for semiconductor device and test device including the same | |
US10816594B2 (en) | Apparatus for testing a signal speed of a semiconductor package and method of manufacturing a semiconductor package | |
KR102270542B1 (en) | inspection system | |
TWM579282U (en) | Aging test circuit board module | |
KR102037924B1 (en) | Test tray for using test handler | |
TWM270488U (en) | A RF interface apparatus applied for prober | |
JPH039280A (en) | Ic inspecting device |