TWI619588B - 脆性材料基板之裂斷方法及裂斷裝置 - Google Patents
脆性材料基板之裂斷方法及裂斷裝置 Download PDFInfo
- Publication number
- TWI619588B TWI619588B TW103114169A TW103114169A TWI619588B TW I619588 B TWI619588 B TW I619588B TW 103114169 A TW103114169 A TW 103114169A TW 103114169 A TW103114169 A TW 103114169A TW I619588 B TWI619588 B TW I619588B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- breaking
- brittle material
- material substrate
- rod
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
- B26D3/085—On sheet material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013203709A JP6154713B2 (ja) | 2013-09-30 | 2013-09-30 | 脆性材料基板のブレイク方法並びにブレイク装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201511907A TW201511907A (zh) | 2015-04-01 |
TWI619588B true TWI619588B (zh) | 2018-04-01 |
Family
ID=52788133
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103114169A TWI619588B (zh) | 2013-09-30 | 2014-04-18 | 脆性材料基板之裂斷方法及裂斷裝置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6154713B2 (ko) |
KR (1) | KR102172680B1 (ko) |
CN (1) | CN104511973B (ko) |
TW (1) | TWI619588B (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106514884A (zh) * | 2015-09-09 | 2017-03-22 | 三星钻石工业股份有限公司 | 用于脆性衬底的切割方法及切割设备 |
TWI632040B (zh) * | 2017-07-10 | 2018-08-11 | 煜峰投資顧問有限公司 | 脆性材料基板裂片裝置及使用該裝置之裂片方法 |
JP6967276B2 (ja) * | 2017-12-28 | 2021-11-17 | 三星ダイヤモンド工業株式会社 | ブレーク装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201111310A (en) * | 2009-03-30 | 2011-04-01 | Mitsuboshi Diamond Ind Co Ltd | Method for dividing brittle material substrate |
JP2011212963A (ja) * | 2010-03-31 | 2011-10-27 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板の分断方法 |
JP2012131216A (ja) * | 2010-11-30 | 2012-07-12 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板のブレイク方法 |
TW201323363A (zh) * | 2011-12-05 | 2013-06-16 | Mitsuboshi Diamond Ind Co Ltd | 強化玻璃基板之刻劃方法及刻劃裝置 |
CN103203806A (zh) * | 2012-01-16 | 2013-07-17 | 三星钻石工业股份有限公司 | 脆性材料基板的裂断方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62121906U (ko) * | 1986-01-24 | 1987-08-03 | ||
JPH01210295A (ja) * | 1988-02-19 | 1989-08-23 | Ngk Insulators Ltd | 脆性材の切断方法及び切断装置 |
JP4482328B2 (ja) * | 2001-06-28 | 2010-06-16 | 三星ダイヤモンド工業株式会社 | ブレイク装置及びマザー貼合基板の分断システム |
JP4169565B2 (ja) * | 2002-10-11 | 2008-10-22 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のブレーク方法及びその装置並びに加工装置 |
JP2004216729A (ja) * | 2003-01-15 | 2004-08-05 | Seishin Shoji Kk | 分割溝付き基板の分割装置 |
WO2009128314A1 (ja) * | 2008-04-14 | 2009-10-22 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の加工方法 |
JP2010159187A (ja) * | 2009-01-09 | 2010-07-22 | Epson Imaging Devices Corp | 基板ブレイク方法、基板ブレイク装置及びブレイクバー |
JP5167161B2 (ja) * | 2009-01-30 | 2013-03-21 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のブレイク装置 |
JP2012193080A (ja) * | 2011-03-17 | 2012-10-11 | Seiko Epson Corp | ブレーク方法、及びブレーク装置 |
JP2013071335A (ja) * | 2011-09-28 | 2013-04-22 | Mitsuboshi Diamond Industrial Co Ltd | マザー基板の分断方法 |
-
2013
- 2013-09-30 JP JP2013203709A patent/JP6154713B2/ja not_active Expired - Fee Related
-
2014
- 2014-04-18 TW TW103114169A patent/TWI619588B/zh not_active IP Right Cessation
- 2014-05-22 KR KR1020140061302A patent/KR102172680B1/ko active IP Right Grant
- 2014-07-28 CN CN201410364678.8A patent/CN104511973B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201111310A (en) * | 2009-03-30 | 2011-04-01 | Mitsuboshi Diamond Ind Co Ltd | Method for dividing brittle material substrate |
JP2011212963A (ja) * | 2010-03-31 | 2011-10-27 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板の分断方法 |
JP2012131216A (ja) * | 2010-11-30 | 2012-07-12 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板のブレイク方法 |
TW201323363A (zh) * | 2011-12-05 | 2013-06-16 | Mitsuboshi Diamond Ind Co Ltd | 強化玻璃基板之刻劃方法及刻劃裝置 |
CN103203806A (zh) * | 2012-01-16 | 2013-07-17 | 三星钻石工业股份有限公司 | 脆性材料基板的裂断方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20150037481A (ko) | 2015-04-08 |
JP2015066831A (ja) | 2015-04-13 |
CN104511973A (zh) | 2015-04-15 |
JP6154713B2 (ja) | 2017-06-28 |
KR102172680B1 (ko) | 2020-11-02 |
CN104511973B (zh) | 2017-09-22 |
TW201511907A (zh) | 2015-04-01 |
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Legal Events
Date | Code | Title | Description |
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MM4A | Annulment or lapse of patent due to non-payment of fees |