TWI619588B - 脆性材料基板之裂斷方法及裂斷裝置 - Google Patents

脆性材料基板之裂斷方法及裂斷裝置 Download PDF

Info

Publication number
TWI619588B
TWI619588B TW103114169A TW103114169A TWI619588B TW I619588 B TWI619588 B TW I619588B TW 103114169 A TW103114169 A TW 103114169A TW 103114169 A TW103114169 A TW 103114169A TW I619588 B TWI619588 B TW I619588B
Authority
TW
Taiwan
Prior art keywords
substrate
breaking
brittle material
material substrate
rod
Prior art date
Application number
TW103114169A
Other languages
English (en)
Chinese (zh)
Other versions
TW201511907A (zh
Inventor
Yuma Iwatsubo
Kenji Murakami
Masakazu Takeda
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201511907A publication Critical patent/TW201511907A/zh
Application granted granted Critical
Publication of TWI619588B publication Critical patent/TWI619588B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • B26D3/085—On sheet material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
TW103114169A 2013-09-30 2014-04-18 脆性材料基板之裂斷方法及裂斷裝置 TWI619588B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013203709A JP6154713B2 (ja) 2013-09-30 2013-09-30 脆性材料基板のブレイク方法並びにブレイク装置

Publications (2)

Publication Number Publication Date
TW201511907A TW201511907A (zh) 2015-04-01
TWI619588B true TWI619588B (zh) 2018-04-01

Family

ID=52788133

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103114169A TWI619588B (zh) 2013-09-30 2014-04-18 脆性材料基板之裂斷方法及裂斷裝置

Country Status (4)

Country Link
JP (1) JP6154713B2 (ko)
KR (1) KR102172680B1 (ko)
CN (1) CN104511973B (ko)
TW (1) TWI619588B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106514884A (zh) * 2015-09-09 2017-03-22 三星钻石工业股份有限公司 用于脆性衬底的切割方法及切割设备
TWI632040B (zh) * 2017-07-10 2018-08-11 煜峰投資顧問有限公司 脆性材料基板裂片裝置及使用該裝置之裂片方法
JP6967276B2 (ja) * 2017-12-28 2021-11-17 三星ダイヤモンド工業株式会社 ブレーク装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201111310A (en) * 2009-03-30 2011-04-01 Mitsuboshi Diamond Ind Co Ltd Method for dividing brittle material substrate
JP2011212963A (ja) * 2010-03-31 2011-10-27 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断方法
JP2012131216A (ja) * 2010-11-30 2012-07-12 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のブレイク方法
TW201323363A (zh) * 2011-12-05 2013-06-16 Mitsuboshi Diamond Ind Co Ltd 強化玻璃基板之刻劃方法及刻劃裝置
CN103203806A (zh) * 2012-01-16 2013-07-17 三星钻石工业股份有限公司 脆性材料基板的裂断方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62121906U (ko) * 1986-01-24 1987-08-03
JPH01210295A (ja) * 1988-02-19 1989-08-23 Ngk Insulators Ltd 脆性材の切断方法及び切断装置
JP4482328B2 (ja) * 2001-06-28 2010-06-16 三星ダイヤモンド工業株式会社 ブレイク装置及びマザー貼合基板の分断システム
JP4169565B2 (ja) * 2002-10-11 2008-10-22 三星ダイヤモンド工業株式会社 脆性材料基板のブレーク方法及びその装置並びに加工装置
JP2004216729A (ja) * 2003-01-15 2004-08-05 Seishin Shoji Kk 分割溝付き基板の分割装置
WO2009128314A1 (ja) * 2008-04-14 2009-10-22 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法
JP2010159187A (ja) * 2009-01-09 2010-07-22 Epson Imaging Devices Corp 基板ブレイク方法、基板ブレイク装置及びブレイクバー
JP5167161B2 (ja) * 2009-01-30 2013-03-21 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置
JP2012193080A (ja) * 2011-03-17 2012-10-11 Seiko Epson Corp ブレーク方法、及びブレーク装置
JP2013071335A (ja) * 2011-09-28 2013-04-22 Mitsuboshi Diamond Industrial Co Ltd マザー基板の分断方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201111310A (en) * 2009-03-30 2011-04-01 Mitsuboshi Diamond Ind Co Ltd Method for dividing brittle material substrate
JP2011212963A (ja) * 2010-03-31 2011-10-27 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断方法
JP2012131216A (ja) * 2010-11-30 2012-07-12 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のブレイク方法
TW201323363A (zh) * 2011-12-05 2013-06-16 Mitsuboshi Diamond Ind Co Ltd 強化玻璃基板之刻劃方法及刻劃裝置
CN103203806A (zh) * 2012-01-16 2013-07-17 三星钻石工业股份有限公司 脆性材料基板的裂断方法

Also Published As

Publication number Publication date
KR20150037481A (ko) 2015-04-08
JP2015066831A (ja) 2015-04-13
CN104511973A (zh) 2015-04-15
JP6154713B2 (ja) 2017-06-28
KR102172680B1 (ko) 2020-11-02
CN104511973B (zh) 2017-09-22
TW201511907A (zh) 2015-04-01

Similar Documents

Publication Publication Date Title
JP5210409B2 (ja) ブレイク装置
TWI623402B (zh) 脆性材料基板之分斷方法及分斷裝置
TWI680106B (zh) 脆性材料基板之分斷方法
TWI468354B (zh) 用於一玻璃基板之切割方法及切割設備
TWI498956B (zh) A method for dividing a brittle material substrate with resin
TWI620636B (zh) Fracture device and breaking method
TWI620635B (zh) Elastic support plate, breaking device and breaking method
TW201540680A (zh) 裂斷方法及裂斷裝置
TWI620634B (zh) Expander, breaking device and breaking method
JP6332618B2 (ja) スクライブ用カッターホイール並びにスクライブ装置
TW201720767A (zh) 分斷裝置
TWI619588B (zh) 脆性材料基板之裂斷方法及裂斷裝置
TWI607975B (zh) Elastic support plate, breaking device and breaking method
TWI619589B (zh) 脆性材料基板之裂斷方法及裂斷裝置
TWI474981B (zh) 伴隨表面壓縮應力控制，切割一強化玻璃基板之方法
JP6072215B2 (ja) 脆性材料基板用のブレイクバー
KR20200111628A (ko) 기판 분단방법 및 기판 분단장치
CN111438442A (zh) SiC基板的分割方法以及分割装置
TWI625314B (zh) 劃線工具、劃線工具之製造方法及劃線之形成方法
JP7137238B2 (ja) 脆性材料基板の加工方法
JP7385908B2 (ja) 貼り合わせ基板の分断方法および応力基板の分断方法
KR20200112655A (ko) 취성 재료 기판의 브레이크 장치 및 브레이크 방법
TW201937577A (zh) 裂斷裝置、裂斷方法、及裂斷板

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees