TWI614309B - 熱硬化性樹脂組成物、硬化膜、彩色濾光片、液晶顯示元件、固體攝影元件及發光二極體發光體 - Google Patents

熱硬化性樹脂組成物、硬化膜、彩色濾光片、液晶顯示元件、固體攝影元件及發光二極體發光體 Download PDF

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Publication number
TWI614309B
TWI614309B TW102143356A TW102143356A TWI614309B TW I614309 B TWI614309 B TW I614309B TW 102143356 A TW102143356 A TW 102143356A TW 102143356 A TW102143356 A TW 102143356A TW I614309 B TWI614309 B TW I614309B
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TW
Taiwan
Prior art keywords
group
resin composition
thermosetting resin
weight
composition according
Prior art date
Application number
TW102143356A
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English (en)
Chinese (zh)
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TW201422719A (zh
Inventor
近藤学
木村佑希
Original Assignee
捷恩智股份有限公司
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Publication of TW201422719A publication Critical patent/TW201422719A/zh
Application granted granted Critical
Publication of TWI614309B publication Critical patent/TWI614309B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C08G59/46—Amides together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/44—Polyester-amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/12—Polyester-amides
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Epoxy Resins (AREA)
  • Optical Filters (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW102143356A 2012-12-13 2013-11-28 熱硬化性樹脂組成物、硬化膜、彩色濾光片、液晶顯示元件、固體攝影元件及發光二極體發光體 TWI614309B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-272298 2012-12-13
JP2012272298A JP6048106B2 (ja) 2012-12-13 2012-12-13 熱硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
TW201422719A TW201422719A (zh) 2014-06-16
TWI614309B true TWI614309B (zh) 2018-02-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW102143356A TWI614309B (zh) 2012-12-13 2013-11-28 熱硬化性樹脂組成物、硬化膜、彩色濾光片、液晶顯示元件、固體攝影元件及發光二極體發光體

Country Status (3)

Country Link
JP (1) JP6048106B2 (ko)
KR (1) KR102102672B1 (ko)
TW (1) TWI614309B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI692505B (zh) * 2014-11-18 2020-05-01 日商捷恩智股份有限公司 感光性組成物與其用途
JP2016183258A (ja) * 2015-03-26 2016-10-20 Jnc株式会社 熱硬化性樹脂組成物
CN106554618A (zh) * 2015-09-24 2017-04-05 捷恩智株式会社 热硬化性组合物及其用途
JP6427690B2 (ja) * 2015-11-16 2018-11-21 三井化学株式会社 半導体装置用の膜を生成するための組成物、半導体装置用の膜を生成するための組成物の製造方法、半導体用部材の製造方法、半導体用工程材の製造方法及び半導体装置
JP2018005088A (ja) * 2016-07-06 2018-01-11 Jnc株式会社 感光性組成物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201207561A (en) * 2010-08-04 2012-02-16 Jnc Corp Photosensitive composition, cured film obtained from the composition, and display device having the cured film
TW201237098A (en) * 2011-03-02 2012-09-16 Jnc Corp Thermal curing resin, cured film, color filter, liquid crystal display device, solid photographic device and LED luminous body

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Publication number Priority date Publication date Assignee Title
JP3418526B2 (ja) * 1997-04-25 2003-06-23 ナトコ株式会社 新規組成物、スティッキング防止剤および感熱転写記録フィルム
JPH11343321A (ja) * 1998-06-01 1999-12-14 Kansai Paint Co Ltd 滑水性表面を形成し得るポリマー組成物
JP4569233B2 (ja) * 2003-09-09 2010-10-27 チッソ株式会社 熱硬化性樹脂組成物及び硬化膜
JP5298428B2 (ja) * 2006-12-26 2013-09-25 Ｊｎｃ株式会社 熱硬化性樹脂組成物及び硬化膜
TW200909521A (en) * 2007-07-27 2009-03-01 Chisso Corp Composition comprising polyester amide acid and ink-jet composition using the composition
JP2009237030A (ja) * 2008-03-26 2009-10-15 Chisso Corp カラーフィルター用着色組成物及びこれを用いたカラーフィルター
JP2009256553A (ja) 2008-04-21 2009-11-05 Fujifilm Corp 光硬化性コーティング組成物、オーバープリント及びその製造方法
JP2010006955A (ja) * 2008-06-27 2010-01-14 Nof Corp 光半導体封止用熱硬化性樹脂組成物
JP2010101985A (ja) * 2008-10-22 2010-05-06 Chisso Corp ポジ型感光性組成物、この組成物から得られる硬化膜、及びこの硬化膜を有する表示素子
JP6123194B2 (ja) * 2011-11-11 2017-05-10 Jnc株式会社 熱硬化性組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201207561A (en) * 2010-08-04 2012-02-16 Jnc Corp Photosensitive composition, cured film obtained from the composition, and display device having the cured film
TW201237098A (en) * 2011-03-02 2012-09-16 Jnc Corp Thermal curing resin, cured film, color filter, liquid crystal display device, solid photographic device and LED luminous body

Also Published As

Publication number Publication date
JP2014118425A (ja) 2014-06-30
JP6048106B2 (ja) 2016-12-21
KR102102672B1 (ko) 2020-04-21
TW201422719A (zh) 2014-06-16
KR20140077108A (ko) 2014-06-23

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