TWI611997B - 用於傳送基板的氣動端效器設備與基板傳送系統 - Google Patents

用於傳送基板的氣動端效器設備與基板傳送系統 Download PDF

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TWI611997B
TWI611997B TW103133258A TW103133258A TWI611997B TW I611997 B TWI611997 B TW I611997B TW 103133258 A TW103133258 A TW 103133258A TW 103133258 A TW103133258 A TW 103133258A TW I611997 B TWI611997 B TW I611997B
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base
end effector
pneumatic
coupled
substrate
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格林博格丹尼爾
瑪強達亞彥
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應用材料股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract

提供用於在電子裝置製造系統的系統元件間傳送基板的包含氣動端效器之系統、設備與方法。在一個態樣中，端效器具有經調整而與機械臂元件連接的基部，及定位於該基部上的一或多個氣吸元件。使用氣動源於氣吸元件以將基板拉入而與端效器的接觸墊接觸。揭露方法與系統及眾多其他態樣。

Description

用於傳送基板的氣動端效器設備與基板傳送系統 【相關申請案的交叉引用】
本申請案主張於2013年9月26日提出申請的美國臨時專利申請案第61/882,787號之優先權權益，該美國臨時專利申請案發明名稱為「用於傳送基板的氣動端效器設備、基板傳送系統與方法」(代理人案號21232/L)，本申請案之參考整體上結合此美國臨時專利申請案之揭露。
本發明係關於電子裝置的製造，而更特定言之係關於用於傳送基板的端效器設備、系統與方法。
在電子裝置的製造中，到此等半導體晶圓(例如，基板-圖案以及非圖案的)的產品與記憶體物件、前導物件可藉由機械臂設備於各式製造設施的元件之間與工具中傳送。例如，在傳送腔室中可由一個處理腔室傳送到另一個處理腔室，從負載鎖定室傳送到處理腔室，從基板載體傳送到叢集工具的生產介面中的載入口，或諸如此類。在此機械臂傳送 期間，對於具有速度與精確度的基板移動與放置係有需求的。端效器上任何基板的滑動可能導致不必要的粒子被產生且可能需要失準校正，其可能係花費時間的。
因此，尋求電子裝置製造中用於傳送基板具效率的系統、設備與方法。
根據第一態樣，提供一種用於電子裝置製造系統中的系統元件間傳送基板的端效器設備。該端效器設備包括經調整而與機械臂元件連接的基部，及定位在該基部上的氣吸元件。
在另一個態樣中，提供一種用於電子裝置製造系統系統元件之間傳送基板的基板傳送系統。該基板傳送系統包括機械臂元件，及與機械臂元件耦接的端效器，端效器包含經調整而與機械臂元件連接的基部，及定位在該基部上的氣吸元件。
在又另一個態樣中，提供一種於電子裝置製造系統的元件之間傳送基板的方法。該方法包括提供與機械臂元件耦接的端效器，端效器具有一或多個氣吸元件及三個或三個以上接觸墊，支撐在三個或三個以上接觸墊上的基板，及經由一或多個氣吸元件的操作而產生吸力以將基板拉入而與至少三個接觸墊有增加的接觸，該吸力超過重力所提供的力。
根據本發明的此等與其他實施例，提供諸多其他態樣。本發明實施例的其他特徵與態樣將從以下詳盡說明、所附申請專利範圍與所附圖示而得以彰顯。
100‧‧‧端效器
102‧‧‧基部
105A‧‧‧氣吸元件
105B‧‧‧氣吸元件
105C‧‧‧氣吸元件
105D‧‧‧氣吸元件
106‧‧‧第一支腳
106T‧‧‧第一支腳尖端
107‧‧‧第二支腳
107T‧‧‧第二支腳尖端
108‧‧‧連接部分
109‧‧‧機械臂元件
111A‧‧‧氣動通道
111B‧‧‧氣動通道
111C‧‧‧氣動通道
111D‧‧‧氣動通道
112A‧‧‧凹槽
112B‧‧‧凹槽
112C‧‧‧凹槽
112D‧‧‧凹槽
114‧‧‧蓋件
115‧‧‧主要連接部
116‧‧‧主要氣動供應通道
118‧‧‧氣動供應系統
120‧‧‧氣動源
122‧‧‧閥
124‧‧‧控制器
325‧‧‧主體
326‧‧‧導件部分
328‧‧‧內凹部
330A‧‧‧流動埠
330B‧‧‧流動埠
330C‧‧‧流動埠
332‧‧‧凸緣部分
333‧‧‧環形流動通道
334‧‧‧凹孔
335‧‧‧主要板
336‧‧‧外壁
338‧‧‧密封件
340‧‧‧固定件
342‧‧‧接觸墊
345‧‧‧基板
346‧‧‧支柱
400‧‧‧基板傳送系統
450‧‧‧機械臂
452‧‧‧傳送腔室
454‧‧‧主框架殼體
455A‧‧‧處理腔室
455B‧‧‧處理腔室
455C‧‧‧處理腔室
455D‧‧‧處理腔室
455E‧‧‧處理腔室
455F‧‧‧處理腔室
456A‧‧‧負載鎖定室
456B‧‧‧負載鎖定室
458‧‧‧臂
460‧‧‧臂
461‧‧‧機械臂
462‧‧‧生產介面
464‧‧‧基板載體
500‧‧‧方法
600‧‧‧端效器
602‧‧‧基部
605A‧‧‧氣吸元件
605B‧‧‧氣吸元件
606‧‧‧第一支腳
607‧‧‧第二支腳
611A‧‧‧氣動通道
611B‧‧‧氣動通道
612A‧‧‧凹槽
612B‧‧‧凹槽
612C‧‧‧凹槽
612D‧‧‧凹槽
615‧‧‧主要連接部
625‧‧‧主體
626‧‧‧導件部分
628‧‧‧內凹部
630A‧‧‧流動埠
630B‧‧‧流動埠
630C‧‧‧流動埠
630D‧‧‧流動埠
632‧‧‧凸緣部分
633‧‧‧環形流動通道
636‧‧‧外壁
642‧‧‧接觸墊
645‧‧‧基板
第1圖根據實施例繪示包括氣吸元件的端效器之透視圖。
第2圖根據實施例繪示包括裸露氣動通道(移除覆蓋物)的端效器基部之實施例的部分之下側透視圖。
第3A圖繪示沿著第1圖的線3A-3A之端效器的氣吸元件之截面示意圖。
第3B圖係根據實施例的端效器設備的吸力元件之透視圖。
第4圖根據實施例繪示包括帶有一或多個氣吸元件的端效器之電子裝置處理系統之頂部概要示意圖。
第5圖係根據實施例繪示了介於電子裝置製造系統的元件之間傳送基板的方法之流程圖。
第6A-6C圖根據實施例繪示帶有一或多個氣吸元件的另一各端效器之各式組件與元件的示意圖。
電子裝置製造處理使用各式前導物件以產生最後裝置，如半導體晶圓、玻璃板、遮罩(本發明中的全部此等前導物件被稱為「基板」(「substrate」或「substrates」))。在基板從製造處理過程與系統中的一個位置到另一個位置的傳送期間，基板可由端效器(有時被稱為「葉片(blade)」)承載。在傳送期間，基板靜置在端效器上且可預期葉片與基板之間的滑動被減少或消除。當經歷橫向移動時，減少或消除端效器與基板之間的此相對滑動移動可減少定位誤差、減 少當實際滑動產生時的重定位時間(如失準校正時間)，即可進一步減少粒子產生，粒子產生可能用為污染工具、其他系統元件及基板。
本發明人發現，如果提供適當的向下吸力用於將基板夾到端效器或將基板黏接到端效器，則端效器與固定的基板的加速度(如垂直與(或)橫向加速度)增加。因為基板可在各式系統元件之間被更快速地移動，如此可轉換成增加的處理量，潛在地導致降低電子裝置製造成本。此外，可減少的粒子產生可能導致改善的處理產率。此外，亦可期望夾緊或黏接機制可被輕易地操作與放開。
根據第一態樣，端效器設備的一或多個實施例可包括具有一或多個氣吸元件(在所繪示的實施例中有多個)於其中的基部。氣動元件可操作性地增加黏附力而將基板吸引到端效器的接觸墊。因此，端效器與固定的基板的快速移動可藉由使用一或多個氣動元件而執行。
根據另一個實施例，提供一種基板傳送系統。基板傳送系統可包括機械構件，如機械腕、機械臂與(或)一系列的機械元件，及端效器設備包括與機械構件耦接的一或多個氣吸元件。包括一或多個氣吸元件的端效器可適當產生高黏附力(有時稱為「夾緊力」)使得在垂直與(或)橫向移動期間可減少或消除端效器與基板之間的滑動。在某些例子中，可達到在基板上大於1磅的吸力。
包括一或多個氣吸元件、基板傳送系統的端效器設備以及於電子裝置製造系統的元件之間傳送基板及操作端效 器與系統的方法之此等與其他實施例參考第1-6C圖而描述於下。相同的數字編號在各處用於代表相同的元件。
第1-3B圖根據本發明一或多個實施例繪示端效器100及端效器100的各式元件。端效器100包括基部102，基部102包含經調整而附接於機械臂元件(未圖示出)的第一端，及相對於第一端的端上之第二端，第二端包括第一支腳106與第二支腳107。如圖所示，基部102可係實質平坦，且可具有約0.118英吋(3mm)至約0.157英吋(4mm)之間的厚度，且可由適當材料製造，如鋁、鈦、不鏽鋼或陶瓷。根據基板的尺寸與端效器100可暴露的處理溫度，可使用其他的材料與尺寸。
基部102與第一支腳及第二支腳106、107可如實際容納讓基板支撐件(如處理腔室的升舉銷(未圖示出))通過的寬度。端效器100可藉由適當方法(如藉由固定件(如螺絲、鉚釘、夾具、快拆或其類似物))附接於第一端上的機械臂元件109(如第4圖中虛線所示的機械腕或可選擇的機械臂)。
一或多個氣動元件(如氣吸元件105A-105D)可藉由機械固定或凹陷定位在基部102上。如圖所示的係四個氣吸元件，但可依據所需額外黏附力的程度而提供少如一個或多如四個或更多。在所示的端效器100中，複數個氣吸元件105A-105D定位在基部102上。可依適當間距設置複數個氣吸元件105A-105D。例如，在所繪示的實施例中，第一氣吸元件105A可設置於靠近於第一支腳尖端106T的第一支腳 106。第二氣吸元件105B可設置於靠近於第二支腳尖端107T的第二支腳107。第三氣吸元件105C與甚至於第四氣吸元件105D可設置於靠近連接部分108的基部102上。連接部分108經調整而與機械臂元件109耦接(如虛線所示)。如本說明書將進一步討論，由於所提供的至少1 lb.的吸力(至少1.1N)，端效器100經調整而產生完全向下的吸力以將基板345夾持在端效器100上(見第4圖)。在某些實驗性的實施例中，預估各氣吸元件在約60psi的流處會產生約4.3N。同樣地，在40psi的流處，可產生約0.43 lb.(約1.9N)的力。所以使用四個氣吸元件105A-105D並在40psi處操作可能產生約1.7 lb.的黏附力(約0.43 lb.x4=1.7 lb.(約7.5N))。
端效器100可包括形成於基部102內的一或多個氣動通道(如111A-111D)。如所示，提供四個氣動通道111A-111D。氣動通道111A-111D與氣吸元件105A-105D連接且在氣吸元件105A-105D處提供氣動流。通道111A-111D可藉由凹槽112A-112D與容納於該等凹槽之上的一或多個蓋件114(只有一個蓋件114示於第2圖中)之組件形成。凹槽112A-112D可於基部102的下側中形成，圖示於第2圖。因此，氣動通動111A-111D可於基部102的層之間形成。蓋件114(只圖示了一個)可容納於凹穴中且固定於其中，凹穴環繞基部102中的凹槽112A-112D。可藉由固定件、烤(braising)、黏接劑等固定。因此，在所繪示的實施例中，基部102中的氣動通道111A-111D可由具有凹槽112A-112D形成於其中的第一層及包含蓋件114的第二層組成。因此， 氣動通道111A-111D可介於層之間形成，如介於基部102的層之間。可使用其他用於連接到氣吸元件105A-105D的適當構造與導管。
在某些實施例中，氣動通道111A-111D可往氣吸元件105A-105D延展且可與氣吸元件105A-105D相交。各氣動通道111A、111D可與主要連接部115相交。主要連接部115可與主要氣動供應通道116耦接，如第1圖中的主要氣動供應通道116(以虛線示於第1圖中)，其可將氣動通道111A-111D及氣吸元件105A-105D連接至氣動供應系統118。在某些實施例中，主要氣動供應通道116可經由端效器100所附接的機械臂的各式臂元件而通過。
通過主要氣動供應通道116的流以及由氣吸元件105A-105D施於基板的吸力程度可由氣動供應系統118控制。氣動供應系統118可包括氣動源120、一或多個閥122及控制器124。氣動源120可包括泵、儲存器、蓄電池及(或)供應約25slm至約90slm之間的流動速率之適當氣動元件。可使用用於控制氣體流動的其他流動速率與方法。可藉由氣動供應系統118打開及關閉流動或者可控制或調整流動速率。
現在參考第3A與3B圖，將描述氣吸元件105A-105D的細節。氣吸元件105A-105D的各個可係與本說明書所述的氣吸元件105A相同。如圖所示，氣吸元件105A包括主體325，主體325經調整而與基部102耦接的且具有導件(pilot)部分326、內凹部328，及與內凹部328相交並通過進入內凹部328的一或多個流動埠330A-330C。在繪示的實施例中， 凸緣部分332亦可被提供。如圖示，氣吸元件105A包括形成於主體325與凹孔334之間的環形流動通道333，凹孔334於基部102中形成。環形流動通道333與氣動通道111A相交，氣動通道111A於基部102中形成且氣流自氣動通道111A接收。如第3A圖中所示，蓋件114與基部102的主要板335可形成氣動通道111A。
在所繪示的實施例中，圖示了三個流動埠330A-330C。然而，可使用較少個或更多個。流動埠330A-330C於環形流動通道333與內凹部328之間連接。具體言之，流動埠330A-330C與內凹部328的外壁336相交。在所繪示的實施例中，一或多個流動埠330A-330C通過進入內凹部328並經配置而將流導向內凹部328的外壁336。例如，流動埠330A-330C可係斜角的使得流以與內凹部328的外壁336相切的方式進入內凹部328。在此方式中，通過流動埠330A-330C的流可設定類渦流的流圖案，類渦流的流圖案在內凹部328中附近循環移動。
如圖所示，主體325可容納於凹孔334中且可提供凸緣部分332而與該密封件338密封接觸，如O形環密封件。固定件340可將氣吸元件105A固定到基部102。
此外，氣吸元件105A可包括接觸墊342，用於將基板345(只顯示了部分)從基部102分隔出適當距離。在所繪示的實施例中，接觸墊342與主體325耦接，如與支柱346耦接，支柱346在內凹部328中向上延伸。在第1圖與第2圖所繪示的實施例中，接觸墊342的數量可實質上由每氣吸 元件105A-105D一個接觸墊組成。在其他實施例中，接觸墊342可在適當位置與基部102耦接或與基部102整合，即不同於氣吸元件105A-105D的位置。
接觸墊342可係任何適合形狀(在頂視圖中)，如圓形、卵形、正方形、六邊形、八邊形或矩形。可使用其他形狀。在所繪示的實施例中，兩個接觸墊342可在橫向方向分隔開，如在支腳106、107上，且至少一個以上可設置在基部102的其他地方上。在所繪示的實施例中，接觸墊342可實質設置在氣吸元件105A的中心線上。在某些實施例中，接觸墊342提供與基板345至少三點的接觸，從而提供介於基板345與基部102頂表面之間的間隙。該間隙在某些實施例中可係約0.5mm至約1.5mm之間。例如，可使用小於0.15mm的間隙，或甚至可使用小於0.10mm，或甚至可使用小於0.9mm。可使用其他的間隙尺寸。
接觸墊342可藉由任何適當的方法固定至主體325，如焊接、壓配合、黏接、以螺絲旋住、閂或其他機械固定，或類似者。接觸墊342可具有平坦或半圓頂外形。
第4圖繪示經調整而用於在電子裝置製造系統元件之間傳送基板345(虛線所示)的基板傳送系統400。基板傳送系統400包括機械臂元件109，如機械腕元件或其他可移除的機械臂元件或臂。在所繪示的實施例中，機械臂元件109可係機械臂450的元件(如機械腕構件)，其可設置在所繪示實施例中的主框架殼體454的傳送腔室452中。機械臂450與所耦接的端效器100可經配置與調整而將基板345(在第4 圖中以虛線表示)於叢集工具的各式腔室來回傳送，如在處理腔室455A-455F來回傳送，及如在負載鎖定室456A、456B來回傳送。與機械臂元件109耦接的端效器100可係包括本說明書所述的一或多個氣吸元件105A-105D的端效器100的任一個。
如圖所示，可與端效器100的主要連接部115(第1圖)耦接的主要氣動供應通道116可經由機械臂450的各式元件通過，例如經由機械臂元件109與臂458、460通過並與氣動供應系統118耦接。
機械臂450可係機械臂的任意形式，如三連桿機械臂、四連桿機械臂、選擇順應性關節機械臂(SCARA)機械臂，或可獨立控制機械臂。可使用其他類型的機械臂。例如，機械臂450可包括支撐基部，經調整而安置到如主框架殼體454。選擇性地，包括本說明書所述的端效器100之生產介面機械臂461(如虛線框所示)可用於生產介面462中而將基板從與生產介面462的載入口及負載鎖定室456A、456B耦接的基板載體464傳送。在某些實施例中，機械臂450、461可包括垂直(Z軸)移動能力。沿著Z軸的端效器100之垂直運動可用於完成將基板345放置於基板支撐件上，如藉由將基板345放置在處理腔室(如任何一或多個處理腔室455A-455F)中的升舉銷上，或放置在如基板載體464或負載鎖定室456A、456B中的槽部上。機械臂450、461可包括任意數量的機械臂，其可由帶或其他傳輸元件連接與驅動。機械臂控制器(未圖示出)可提供適當的控制訊號到機械臂 450、461以控制端效器100的移動。氣動供應系統118的控制器124(第1圖)可與機械臂控制器整合或通訊以完成基板345的傳送。
端效器100可經調整而與任何適當的機械臂450、461使用，經調整以傳送基板345。例如，端效器100可經調整而與如美國專利號5,789,878；5,879,127；6,267,549；6,379,095；6,582,175；與6,722,834及美國專利公開號2010/0178147；2013/0039726；2013/0149076：2013/0115028；與2010/0178146中所述的機械臂使用。同樣地，端效器100可經調整而與其他類型與構造的處理腔室使用。
第5圖繪示於電子裝置製造系統的元件之間傳送基板的方法500(見第4圖)。方法500包括，在502中，提供與機械臂元件(如機械臂元件109，如腕構件或其他機械臂元件)耦接的端效器(如端效器100)，端效器具有一或多個氣吸元件(如氣吸元件105A、105B、105C與(或)105D)及三個或三個以上的接觸墊(如接觸墊342)。
方法500進一步包括，在504中，將基板(如基板345)支撐在三個或三個以上接觸墊上，及，在506中，經由一或多個氣吸元件的操作產生吸力而將基板拉入與至少三個接觸墊的增加之接觸，該吸力超過重力所提供的力。吸力提供的額外之向下力可係1 lb.(約4.45N)或更多而超過重力提供的力。
第6A-6C圖繪示端效器600的另一個實施例及其各式元件。端效器600包括基部602，基部602包括經調整而附 接於機械臂元件的第一端(未圖示出)，及相對於第一端的端上之第二端，第二端包括第一支腳606與第二支腳607。如圖所示，基部602可係實質平坦，且可具有一厚度，且可由如上所討論的材料製成。
端效器100可藉由任何適合的方法而附接於機械臂元件109，如藉由固定件(如閂、螺絲、鉚釘、夾具、快拆或類似物)。
一或多個氣吸元件可藉由機械固定件、烤或凹陷而定位在基部602上。如圖所示的係兩個氣吸元件605A、605B，但可依據超過重力的所需額外黏附力(如吸力)的程度而提供少如一個或多如四個或更多。在所繪示的端效器600中，氣吸元件605A、605B定位於基部602上。除了在支腳606、607上，氣吸元件605A、605B可設置在基部602上。
端效器600可包括形成於其中的一或多個氣動通道(如611A、611B)。如所繪示的，氣動通道611A、611B提供在氣吸元件605A、605B處的氣動流。通道611A、611B可藉由凹槽612A、612B與凹槽612C、612D的組件形成，凹槽612A、612B於基部602中形成，凹槽612C、612D於主體625中形成。因此，氣動通道611A、611B可於基部602與主體625的層之間形成。主體625可容納於凹穴中，凹穴於基部602中形成。可藉由固定件或黏接劑或類似物固定。
在某些實施例中，氣動通道611A、611B可向氣吸元件605A、605B延伸且可與氣吸元件605A、605B延伸相交。各氣動通道611A、611B可與主要連接部615相交。主要連接 部615可與主要氣動供應通道耦接，如第1圖中的主要氣動供應通道116。
再參考第6A-6C圖，將描述氣吸元件605A、605B的細節。氣吸元件605A、605B的各個可係相同，但只是鏡像。如圖所示，氣吸元件605A、605B包括經調整而與基部602耦接的主體625。主體625與基部602形成導件部分626、內凹部628，及與內凹部628相交並通過進入內凹部628的一或多個流動埠630A-630D。
在繪示的實施例中，亦提供凸緣部分632。如圖示，氣吸元件605A、605B各包括形成於主體625與基部602之間的環形流動通道633，其中環形流動通道633與氣動通道611A、611B相交。
在繪示的實施例中，圖示四個流動埠630A-630D。然而，可使用較少個或更多個。流動埠630A-630D連接並提供環形流動通道633與內凹部628之間的流動埠。具體言之，流動埠630A-630D與內凹部628的外壁636相交。在繪示的實施例中，一或多個流動埠630A-630D通過進入內凹部628並經配置而將氣體流導向內凹部628的外壁636。例如，流動埠630A-630D可係斜角的使得氣體流以與內凹部328的外壁636相切的方式進入內凹部628。在此方式中，通過流動埠630A-630D的流可在內凹部628中設定類渦流的氣體流圖案，而產生在基板645(在第6A圖中以虛線表示)上的向下力。
如所示，主體625可容納於基部602的凹孔中且可 與該主體密封接觸，如藉由焊接、烤、黏接劑、固定件等。
此外，基部602可包括將基板645從基部602分隔一適當距離的接觸墊642。接觸墊642的數量可包括三個或三個以上且可在適當位置與基部602耦接或整合。
接觸墊642可係任意形狀(在頂視圖中)，如圓形、卵形、正方形、六邊形、八邊形或矩形。可使用其他形狀。兩個接觸墊642最好可在橫向方向分隔開，如在支腳606、607上，且至少一個以上可設置在基部602的其他地方上。在所繪示的實施例中，接觸墊642提供與基板645至少三點的接觸，從而提供介於基板645與基部602頂表面之間的間隙。該間隙在某些實施例中可係約0.5mm至約1.5mm之間。例如，可使用小於0.15mm的間隙，或甚至可使用小於0.10mm，或甚至可使用小於0.9mm。可使用其他的間隙尺寸。接觸墊342可具有平坦或半圓頂外形。
前述說明只揭露了本發明的示範實施例。落於本發明範圍內的以上揭露之系統、設備與方法的變化將對發明所屬領域具有通常知識者彰顯。因此，雖然已揭露本發明與其相關聯的若干實施例，但可藉由以下申請專利範圍所定義而了解其他實施例可落於本發明範圍內。
100‧‧‧端效器
102‧‧‧基部
105A‧‧‧氣吸元件
105B‧‧‧氣吸元件
105C‧‧‧氣吸元件
105D‧‧‧氣吸元件
106‧‧‧第一支腳
106T‧‧‧第一支腳尖端
107‧‧‧第二支腳
107T‧‧‧第二支腳尖端
108‧‧‧連接部分
109‧‧‧機械臂元件
111A‧‧‧氣動通道
111B‧‧‧氣動通道
111C‧‧‧氣動通道
111D‧‧‧氣動通道
115‧‧‧主要連接部
116‧‧‧主要氣動供應通道
118‧‧‧氣動供應系統
120‧‧‧氣動源
122‧‧‧閥
124‧‧‧控制器

Claims (15)

  1. 一種端效器設備，包括：一基部，該基部經調整而連接到一機械臂元件；及一氣吸元件，該氣吸元件定位於該基部上，該氣吸元件包含一主體、一內凹部、一環形流動通道、一導件部分及一或多個流動埠，該主體與該基部耦接，該環形流動通道包含一環，該環圍繞該內凹部且設置在該主體與該基部之間，該導件部分介於該環形流動通道與該內凹部之間，該一或多個流動埠連接於該環形流動通道與該內凹部之間且穿過該導件部分。
  2. 如請求項1所述之端效器設備，包括複數個定位於該基部上的氣吸元件，其中該等氣吸元件由該主體與該基部形成。
  3. 如請求項1所述之端效器設備，其中該端效器經調整而產生至少1 lb的一總吸力。
  4. 如請求項1所述之端效器設備，其中該基部進一步包括一第一支腳與一第二支腳。
  5. 如請求項1所述之端效器設備，其中該基部包括一第一層與第二層。
  6. 如請求項1所述之端效器設備，包括至少部分形成於該基部內的氣動通道。
  7. 如請求項6所述之端效器設備，其中該等氣動通道形成於層之間。
  8. 如請求項1所述之端效器設備，其中該基部進一步包括一第一層與一第二層，及至少一個氣動通道形成於該等層之間並往氣吸元件延伸。
  9. 如請求項1所述之端效器設備，其中該氣吸元件包括經調整而與該基部耦接的一主體及與該主體耦接的一接觸墊。
  10. 如請求項1所述之端效器設備，其中該氣吸元件包括經調整而與該基部耦接的一主體及一環形流動通道，該環形流動通道包含形成於該主體與該基部之間的一環，其中該環形流動通道與一氣動通道相交。
  11. 如請求項1所述之端效器設備，其中通過進入該內凹部的該一或多個流動埠與該內凹部的一外壁實質地相切。
  12. 一種用於在電子裝置製造系統元件之間傳送一基板的基板傳送系統，包括：一機械臂元件；及 一端效器，該端效器與該機械臂元件耦接，該端效器包含一基部，該基部經調整而與一機械臂元件連接，及一氣吸元件，該氣吸元件定位在該基部上，該氣吸元件包含一主體、一內凹部、一環形流動通道、一導件部分及一或多個流動埠，該主體與該基部耦接，該環形流動通道包含一環，該環圍繞該內凹部且設置在該主體與該基部之間，該導件部分介於該環形流動通道與該內凹部之間，該一或多個流動埠連接於該環形流動通道與該內凹部之間且穿過該導件部分。
  13. 如請求項12所述之基板傳送系統，包括至少部分形成於該基部的一或多個氣動通道。
  14. 如請求項13所述之基板傳送系統，包括與該一或多個氣動通道耦接的一氣動供應系統。
  15. 如請求項12所述之基板傳送系統，包括該氣吸元件，及定位於該基部上的至少一個其他氣吸元件。
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