TWI670754B - Method and device of transferring micro die - Google Patents
Method and device of transferring micro die Download PDFInfo
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Abstract
一種微晶粒移轉方法以及微晶粒移轉裝置，其方法包括以下順序的步驟：將頂推機構與承載薄膜相對移動或轉動，使頂推機構位置對應於目標微晶粒，而使目標微晶粒之端面為受頂推件的頂推端所承置；以隔著承載薄膜的方式利用頂推件及頂撐件朝向貼覆載具的方向推動目標微晶粒，使目標微晶粒接觸貼覆載具而貼覆於貼覆面，再使該頂撐件戳破承載薄膜並持續撐頂目標微晶粒之端面；在頂撐件相對於目標微晶粒為定位接觸的狀態下使頂推件退回，則頂撐件為撐頂目標微晶粒直至承載薄膜完全脫離目標微晶粒；以及使頂撐件退回而脫離目標微晶粒。A micro-grain transfer method and a micro-grain transfer device, the method comprising the steps of: moving or rotating the push-pull mechanism and the carrier film relatively so that the position of the push-up mechanism corresponds to the target micro-grain, and the target is The end face of the micro-grain is received by the pushing end of the pushing member; the target micro-grain is pushed in the direction of the applicator by the pushing member and the top strut in a manner of carrying the film, so that the target microcrystal The granule contacts the carrier and is attached to the affixing surface, and then the struts are punctured to carry the film and continue to support the end surface of the target micro-grain; in the state where the top struts are in contact with the target micro-grain When the pusher is retracted, the top support is the top target micro-grain until the carrier film is completely detached from the target micro-grain; and the top support is retracted away from the target micro-grain.
Description
本發明相關於一種晶粒移轉方法及晶粒移轉裝置，特別是相關於一種微晶粒移轉方法及微晶粒移轉裝置。The invention relates to a grain transfer method and a grain transfer device, in particular to a micro-grain transfer method and a micro-grain transfer device.
近年來，晶粒的尺寸越來越趨向小型化，因此，將大量的微晶粒自一黏性膜移轉至另一處亦顯得更加困難、手續繁瑣。常見的作法是利用頂撐件（頂針）將晶粒推升，然而在這過程中，容易使晶粒歪斜而喪失精準度。In recent years, the size of crystal grains has become more and more compact, and therefore, it has become more difficult and complicated to transfer a large number of microcrystal grains from one adhesive film to another. It is common practice to use a top support (thimble) to push the die up, but in the process, it is easy to skew the die and lose accuracy.
因此，為解決上述問題，本發明的目的即在提供一種微晶粒移轉方法及微晶粒移轉裝置。Therefore, in order to solve the above problems, an object of the present invention is to provide a micro-grain transfer method and a micro-grain transfer device.
本發明為解決習知技術之問題所採用之技術手段係提供一種微晶粒移轉方法，係用於將一承載薄膜上的複數個微晶粒利用一頂推機構轉移至一貼覆載具，該承載薄膜具有一承載面及一相反於該承載面的背面，該貼覆載具具有對向於該承載面的一貼覆面，該承載薄膜的該承載面承載有複數個微晶粒，該頂推機構包括一頂推件以及一設置於該頂推件中的頂撐件，該頂推件的頂推端係對向於該背面且該頂推機構係抵頂於該背面，該晶粒移轉方法包括以下順序的步驟：(a) 將該頂推機構與該承載薄膜相對移動或轉動，使該頂推機構位置對應於該承載薄膜所承載的複數個該微晶粒中的一目標微晶粒，而使該目標微晶粒之端面為受該頂推件的頂推端所承置；(b) 以隔著該承載薄膜的方式利用該頂推件及該頂撐件朝向該貼覆載具的方向推動該目標微晶粒，使該目標微晶粒接觸該貼覆載具而貼覆於該貼覆面，再使該頂撐件戳破該承載薄膜並持續撐頂該目標微晶粒之端面，其中該頂推件的頂推端之頂面面積係不小於該目標微晶粒之端面之面積，以及該頂撐件之頂面面積係小於該頂推件的頂推端之頂面面積；(c) 在該頂撐件相對於該目標微晶粒為定位接觸的狀態下使該頂推件退回，則該頂撐件為撐頂該目標微晶粒直至該承載薄膜脫離該目標微晶粒；以及(d) 使該頂撐件退回而脫離該目標微晶粒。The technical means adopted by the present invention to solve the problems of the prior art provides a micro-grain transfer method for transferring a plurality of micro-grains on a carrier film to a sticker carrier by using a push mechanism. The carrier film has a bearing surface and a back surface opposite to the bearing surface. The mounting carrier has a facing surface opposite to the bearing surface, and the bearing surface of the bearing film carries a plurality of micro-grains. The pushing mechanism includes a pushing member and a top member disposed in the pushing member, the pushing end of the pushing member is opposite to the back surface and the pushing mechanism is abutted against the back surface, The grain transfer method comprises the following sequence of steps: (a) moving or rotating the pushing mechanism relative to the carrier film such that the pushing mechanism position corresponds to a plurality of the micro-grains carried by the carrier film a target micro-grain such that an end surface of the target micro-grain is received by the pushing end of the pushing member; (b) utilizing the pushing member and the top member in a manner of interposing the supporting film Pushing the target micro-grain in the direction of the sticker carrier to make the target The die contacts the mounting carrier and is attached to the bonding surface, and then the supporting member punctures the bearing film and continues to support the end surface of the target micro-grain, wherein the top of the pushing end of the pushing member The surface area is not less than the area of the end surface of the target micro-grain, and the top surface area of the top support is less than the top surface area of the pushing end of the pushing member; (c) in the top support relative to the When the target micro-grain returns the pusher in a state of positioning contact, the top support is to support the target micro-grain until the carrier film is separated from the target micro-grain; and (d) the top support Retreat away from the target micro-grain.
在本發明的一實施例中係提供一種微晶粒移轉方法，其中於該步驟(a)之前，更包括一步驟(e)：施加張力於該承載薄膜，以增加該承載薄膜上的該複數個微晶粒之間的間距。In an embodiment of the invention, a micro-grain transfer method is provided, wherein before the step (a), a step (e) is further included: applying a tension to the carrier film to increase the load on the carrier film The spacing between a plurality of microcrystal grains.
本發明為解決習知技術之問題所採用之另一技術手段係提供一種微晶粒移轉裝置，包含：一承載薄膜，具有一承載面及一相反於該承載面的背面，該承載面承載有複數個微晶粒；一貼覆載具，具有對向於該承載面的一貼覆面；一頂推機構，包括一頂推件以及一設置於該頂推件中的頂撐件，該頂推件的頂推端係對向於該背面且該頂推機構係抵頂於該背面，該頂推機構經設置而可朝向該貼覆載具往復移動，其中該頂推件的頂推端之頂面面積係不小於該微晶粒之端面之面積，以及該頂撐件之頂面面積係小於該頂推件的頂推端之頂面面積；以及一控制機構，訊號連接於該承載薄膜的一承載薄膜定位平台、該貼覆載具的一貼覆載具定位平台、及該頂推機構，該控制機構控制該承載薄膜定位平台及該頂推機構而使該頂推機構位置對應於該承載薄膜所承載的複數個該微晶粒中的一目標微晶粒，並控制該頂推件及該頂撐件朝向該貼覆載具的方向推動該目標微晶粒，使該目標微晶粒接觸該貼覆載具而貼覆於該貼覆面，再使該頂撐件戳破該承載薄膜並持續撐頂該目標微晶粒之端面，在該頂撐件相對於該目標微晶粒為定位接觸的狀態下該控制機構控制該頂推件退回而使該頂撐件為撐頂該目標微晶粒直至該承載薄膜完全脫離該目標微晶粒後，控制該頂撐件退回。Another technical means for solving the problems of the prior art is to provide a micro-grain transfer device, comprising: a carrier film having a bearing surface and a back surface opposite to the bearing surface, the bearing surface carrying a plurality of micro-grains; a mounting carrier having a facing surface opposite to the bearing surface; a pushing mechanism comprising a pushing member and a top member disposed in the pushing member, The pushing end of the pushing member is opposite to the back surface and the pushing mechanism is abutted against the back surface, and the pushing mechanism is configured to reciprocate toward the covering carrier, wherein the pushing of the pushing member The top surface area of the end is not less than the area of the end surface of the micro-grain, and the top surface area of the top support is smaller than the top surface area of the pushing end of the pushing member; and a control mechanism, the signal is connected to the a load bearing film positioning platform carrying the film, a mounting vehicle positioning platform of the mounting vehicle, and the pushing mechanism, the control mechanism controlling the carrying film positioning platform and the pushing mechanism to position the pushing mechanism Corresponding to the plural carried by the carrier film a target micro-grain in the micro-grain, and controlling the pushing member and the top-supporting member to push the target micro-grain in a direction toward the covering carrier, so that the target micro-grain contacts the covering carrier And attaching to the bonding surface, causing the top support to puncture the carrier film and continuing to support the end surface of the target micro-grain, in a state in which the top support is in contact with the target micro-grain The control mechanism controls the pushing member to retract such that the top support member supports the target micro-grain until the carrier film completely separates from the target micro-grain, and then controls the top support to retreat.
在本發明的一實施例中係提供一種微晶粒移轉裝置，該貼覆載具為一待貼覆基板。In an embodiment of the invention, a micro-grain transfer device is provided, the applicator carrier being a substrate to be attached.
在本發明的一實施例中係提供一種微晶粒移轉裝置，該貼覆載具為一黏性膜。In an embodiment of the invention, a micro-grain transfer device is provided, the applicator carrier being a viscous film.
在本發明的一實施例中係提供一種微晶粒移轉裝置，更包括複數個訊號連接該控制機構的頂推機構，該控制機構同時控制複數個該頂推機構推動複數個目標微晶粒。In an embodiment of the invention, a micro-grain transfer device is provided, further comprising a plurality of signals connected to the push mechanism of the control mechanism, the control mechanism simultaneously controlling a plurality of the push-push mechanisms to push a plurality of target micro-grains .
經由本發明所採用之技術手段，可容易地將大量複數個微晶粒自一承載薄膜轉移至對向的貼覆載具，不僅微晶粒容易脫離黏性膜，微晶粒在移轉的過程中亦穩定而不偏移，且在微晶粒被頂出時，不會碰到隔壁晶粒，能夠有效解決碰傷隔壁微晶粒之問題。Through the technical means adopted by the present invention, a large number of micro-grains can be easily transferred from a carrier film to an oppositely-coated carrier, and not only the micro-grains are easily separated from the viscous film, but also the micro-grains are transferred. The process is also stable without offset, and when the microcrystal grains are ejected, the partition crystal grains are not hit, and the problem of colliding the partition microcrystals can be effectively solved.
本發明所採用的具體實施例，將藉由以下之實施例及附呈圖式作進一步之說明。The specific embodiments of the present invention will be further described by the following examples and the accompanying drawings.
以下根據第1圖至第5圖，而說明本發明的實施方式。該說明並非為限制本發明的實施方式，而為本發明之實施例的一種。Hereinafter, embodiments of the present invention will be described based on Figs. 1 to 5 . This description is not intended to limit the embodiments of the invention, but is an embodiment of the invention.
本發明提出一種微晶粒移轉方法以及執行該微晶粒移轉方法的微晶粒移轉裝置100，係用於將一承載薄膜1上的複數個微晶粒D利用一頂推機構3轉移至一貼覆載具2。The present invention provides a micro-grain transfer method and a micro-grain transfer device 100 for performing the micro-grain transfer method, which is used to utilize a plurality of micro-grains D on a carrier film 1 by using a push mechanism 3 Transfer to a sticker carrier 2.
如第1圖所示，本發明的微晶粒移轉裝置100包含承載薄膜1、貼覆載具2、頂推機構3及控制機構4。As shown in FIG. 1, the micro-grain transfer apparatus 100 of the present invention includes a carrier film 1, a mounting carrier 2, a pushing mechanism 3, and a control mechanism 4.
承載薄膜1具有一承載面11及一相反於承載面11的背面12，承載面11承載有複數個微晶粒D。承載薄膜1由一承載薄膜定位平台10所定位。The carrier film 1 has a bearing surface 11 and a back surface 12 opposite to the bearing surface 11, and the bearing surface 11 carries a plurality of micro-grains D. The carrier film 1 is positioned by a carrier film positioning platform 10.
貼覆載具2具有對向於承載面11的一貼覆面21。在本實施例中，貼覆載具2為與承載薄膜1相同的一黏性膜，然而本發明不限於此，貼覆載具2亦可以為一待貼覆基板。貼覆載具2由一貼覆載具定位平台20所定位。The sticker carrier 2 has a facing surface 21 opposite the bearing surface 11. In the present embodiment, the sticker carrier 2 is the same adhesive film as the carrier film 1, but the invention is not limited thereto, and the sticker carrier 2 may also be a substrate to be attached. The sticker carrier 2 is positioned by a sticker carrier positioning platform 20.
頂推機構3包括一頂推件31、一設置於頂推件31中的頂撐件32以及一帽蓋結構33，頂推件31及頂撐件32皆設置於帽蓋結構33中。頂推件31的頂推端之頂面311面積係不小於微晶粒D之端面之面積，換言之，頂推件31的頂面311面積大於微晶粒D。頂推件31的頂推端係對向於背面12且頂推機構3係抵頂於背面12，頂撐件32之頂面面積係小於頂推件31的頂推端之頂面311面積，頂撐件32例如為一頂針。頂推機構3經設置而可與承載薄膜定位平台10及貼覆載具定位平台20相對移動或轉動，藉此而可與承載薄膜1相對移動或轉動以及可朝向貼覆載具2往復移動。The pushing mechanism 3 includes a pushing member 31, a top member 32 disposed in the pushing member 31, and a cap structure 33. The pushing member 31 and the top member 32 are disposed in the cap structure 33. The top surface 311 of the pushing end of the pushing member 31 is not smaller than the area of the end surface of the micro-grain D, in other words, the top surface 311 of the pushing member 31 is larger than the micro-grain D. The pushing end of the pushing member 31 is opposite to the back surface 12 and the pushing mechanism 3 is abutted against the back surface 12. The top surface area of the top supporting member 32 is smaller than the top surface 311 of the pushing end of the pushing member 31. The top support 32 is, for example, a thimble. The pushing mechanism 3 is configured to be relatively movable or rotatable with the carrier film positioning platform 10 and the sticker carrier positioning platform 20, thereby being movable or rotatable relative to the carrier film 1 and reciprocable toward the sticker carrier 2.
控制機構4訊號連接承載薄膜定位平台10、貼覆載具定位平台20及頂推機構3，而能夠經由承載薄膜定位平台10、貼覆載具定位平台20及頂推機構3控制承載薄膜1、貼覆載具2、頂推件31及頂撐件32各自的移動。The control mechanism 4 is connected to the carrier film positioning platform 10, the carrier positioning platform 20 and the pushing mechanism 3, and can control the carrier film 1 via the carrier film positioning platform 10, the sticker carrier positioning platform 20 and the pushing mechanism 3. The respective movements of the carrier 2, the pushing member 31, and the top member 32 are attached.
接著說明本發明的晶粒移轉方法之步驟。Next, the steps of the grain transfer method of the present invention will be described.
首先，如第1圖所示，於步驟(a)，控制機構4控制頂推機構3相對於承載薄膜1而在承載薄膜1的背面12平行移動或轉動，使頂推機構3位置對應於承載薄膜1所承載的複數個微晶粒中的一目標微晶粒D，而使目標微晶粒D之端面為受頂推件31的頂推端所承置。其中，頂推機構3與承載薄膜1之間的相對移動或轉動，可藉由僅頂推機構3移動、僅承載薄膜1移動或轉動、或頂推機構3及承載薄膜1二者皆移動來實現。First, as shown in FIG. 1, in the step (a), the control mechanism 4 controls the pushing mechanism 3 to move or rotate in parallel with the back surface 12 of the carrier film 1 with respect to the carrier film 1, so that the position of the pushing mechanism 3 corresponds to the bearing. A target micro-grain D of the plurality of micro-grains carried by the film 1 is such that the end surface of the target micro-grain D is received by the pushing end of the pushing member 31. Wherein, the relative movement or rotation between the pushing mechanism 3 and the carrier film 1 can be moved by only pushing the mechanism 3, only the film 1 is moved or rotated, or both the pushing mechanism 3 and the carrier film 1 are moved. achieve.
接著如第2圖所示，於步驟(b)，控制機構4控制頂推機構3，以隔著承載薄膜1的方式利用頂推件31及頂撐件32朝向貼覆載具2的方向推動目標微晶粒D，使目標微晶粒D接觸貼覆載具2而貼覆於貼覆面21。由於頂推件31的頂面311面積相對於微晶粒D具有一定的大小（即，頂推件31的頂推端之頂面311面積不小於微晶粒D之端面之面積），因此在推動目標微晶粒D的過程中，頂推件31不會刺破承載薄膜1，使得目標微晶粒D穩固不偏移。並且，如第3圖所示，再使頂撐件32戳破承載薄膜1並持續撐頂微晶粒D之端面。Next, as shown in FIG. 2, in the step (b), the control mechanism 4 controls the pushing mechanism 3 to push the pushing member 31 and the supporting member 32 toward the attaching carrier 2 so as to sandwich the carrier film 1 therebetween. The target micro-grain D causes the target micro-grain D to contact the mounting carrier 2 and adhere to the bonding surface 21. Since the area of the top surface 311 of the pushing member 31 has a certain size with respect to the micro-grain D (that is, the area of the top surface 311 of the pushing end of the pushing member 31 is not smaller than the area of the end surface of the micro-grain D), During the pushing of the target micro-grain D, the pushing member 31 does not pierce the carrier film 1 so that the target micro-grain D is stable and does not shift. Further, as shown in Fig. 3, the top stay member 32 is again pierced by the carrier film 1 and continues to support the end faces of the micro-grains D.
再如第4圖所示，於步驟(c)，在頂撐件32相對於目標微晶粒D為定位接觸的狀態下，控制機構4控制頂推件31退回，則頂撐件32為撐頂目標微晶粒D直至承載薄膜1完全脫離目標微晶粒D。As shown in FIG. 4, in the step (c), in a state in which the top support member 32 is in positional contact with respect to the target micro-grain D, the control mechanism 4 controls the push-up member 31 to retract, and the top support member 32 is supported. The top target micro-grain D until the carrier film 1 is completely separated from the target micro-grain D.
最後如第5圖所示，於步驟(d)，於承載薄膜1脫離目標微晶粒D後，控制機構4控制頂撐件32退回而脫離目標微晶粒D。Finally, as shown in FIG. 5, in step (d), after the carrier film 1 is detached from the target micro-grain D, the control mechanism 4 controls the top support member 32 to retreat away from the target micro-grain D.
進一步地，在本實施例中，於該步驟(a)之前，更包括一步驟(e)：施加張力於承載薄膜1，以增加承載薄膜1上的複數個微晶粒D之間的間距，而使頂推機構3容易地位置對應於目標微晶粒D。除此之外，在步驟(c)中，承載薄膜1所增加的張力也使承載薄膜1更容易退回原本的平面位置而脫離目標微晶粒D。Further, in this embodiment, before the step (a), a step (e) is further included: applying tension to the carrier film 1 to increase the spacing between the plurality of micro-grains D on the carrier film 1. The push mechanism 3 is easily positioned to correspond to the target micro-grain D. In addition, in the step (c), the increased tension of the carrier film 1 also makes it easier for the carrier film 1 to retreat to the original planar position away from the target micro-grain D.
進一步地，在另一個例子中，微晶粒移轉裝置100更包括複數個訊號連接控制機構4的頂推機構3，控制機構4同時控制複數個頂推機構3推動複數個目標微晶粒D，使得複數個微晶粒D可以同時被轉移，增加轉移效率。Further, in another example, the micro-grain transfer device 100 further includes a push mechanism 3 of a plurality of signal connection control mechanisms 4, and the control mechanism 4 simultaneously controls a plurality of push-up mechanisms 3 to push a plurality of target micro-grains D So that a plurality of micro-grains D can be transferred at the same time, increasing transfer efficiency.
綜上所述，本發明的微晶粒移轉方法及微晶粒移轉裝置，可容易地將大量複數個微晶粒自一承載薄膜轉移至對向的貼覆載具，不僅微晶粒容易脫離黏性膜，微晶粒在移轉的過程中亦穩定而不偏移，且在微晶粒被頂出時，不會碰到隔壁晶粒，能夠有效解決碰傷隔壁微晶粒之問題。In summary, the micro-grain transfer method and the micro-grain transfer device of the present invention can easily transfer a large number of micro-grains from a carrier film to an opposite mounting carrier, not only the micro-grain It is easy to break away from the viscous film, and the micro-grains are stable and not offset during the transfer process, and when the micro-grains are ejected, they do not touch the partition walls, which can effectively solve the damage of the partition micro-grains. problem.
以上之敘述以及說明僅為本發明之較佳實施例之說明，對於此項技術具有通常知識者當可依據以下所界定申請專利範圍以及上述之說明而作其他之修改，惟此些修改仍應是為本發明之發明精神而在本發明之權利範圍中。The above description and description are only illustrative of the preferred embodiments of the present invention, and those of ordinary skill in the art can make other modifications in accordance with the scope of the invention as defined below and the description above, but such modifications should still be It is within the scope of the invention to the invention of the invention.
100‧‧‧微晶粒移轉裝置 100‧‧‧Micro-grain transfer device
1‧‧‧承載薄膜 1‧‧‧ carrying film
10‧‧‧承載薄膜定位平台 10‧‧‧Loading film positioning platform
11‧‧‧承載面 11‧‧‧ bearing surface
12‧‧‧背面 12‧‧‧ Back
2‧‧‧貼覆載具 2‧‧‧Sticker
20‧‧‧貼覆載具定位平台 20‧‧‧Overlay positioning platform
21‧‧‧貼覆面 21‧‧‧Face
3‧‧‧頂推機構 3‧‧‧Pushing mechanism
31‧‧‧頂推件 31‧‧‧Pushing pieces
311‧‧‧頂面 311‧‧‧ top surface
32‧‧‧頂撐件 32‧‧‧Top support
33‧‧‧帽蓋結構 33‧‧‧Cap structure
4‧‧‧控制機構 4‧‧‧Control agency
D‧‧‧微晶粒 D‧‧‧Microcrystalline
第1圖為顯示根據本發明一實施例的微晶粒移轉裝置之示意圖。 第2圖至第5圖為顯示根據本發明的實施例的微晶粒移轉裝置執行微晶粒移轉方法之示意圖。FIG. 1 is a schematic view showing a micro-grain transfer apparatus according to an embodiment of the present invention. 2 to 5 are schematic views showing a micrograin transfer device performing micrograin transfer method according to an embodiment of the present invention.
Claims (6)
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| TW107145772A TWI670754B (en) | 2018-12-18 | 2018-12-18 | Method and device of transferring micro die |
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| TW202025239A TW202025239A (en) | 2020-07-01 |
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| TWI811652B (en) * | 2021-03-25 | 2023-08-11 | 梭特科技股份有限公司 | Method for transferring chips by thin film |
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|---|---|---|---|---|
| TW201444754A (en) * | 2013-05-22 | 2014-12-01 | Mpi Corp | Dies sorting method and equipment |
| TW201742177A (en) * | 2016-05-31 | 2017-12-01 | 致茂電子股份有限公司 | Die pick-up method |
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| TW201444754A (en) * | 2013-05-22 | 2014-12-01 | Mpi Corp | Dies sorting method and equipment |
| TW201742177A (en) * | 2016-05-31 | 2017-12-01 | 致茂電子股份有限公司 | Die pick-up method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI811652B (en) * | 2021-03-25 | 2023-08-11 | 梭特科技股份有限公司 | Method for transferring chips by thin film |
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