TWI571954B - Substrate processing system and substrate reversing device - Google Patents
Substrate processing system and substrate reversing device Download PDFInfo
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- TWI571954B TWI571954B TW103102243A TW103102243A TWI571954B TW I571954 B TWI571954 B TW I571954B TW 103102243 A TW103102243 A TW 103102243A TW 103102243 A TW103102243 A TW 103102243A TW I571954 B TWI571954 B TW I571954B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
- B65G47/24—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
- B65G47/248—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning over or inverting them
- B65G47/252—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning over or inverting them about an axis substantially perpendicular to the conveying direction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Registering Or Overturning Sheets (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Specific Conveyance Elements (AREA)
Description
本發明係關於一種對基板兩面進行加工處理之基板處理系統，尤其是關於進行基板之反轉之基板反轉裝置。 The present invention relates to a substrate processing system for processing both sides of a substrate, and more particularly to a substrate inverting device for performing substrate inversion.
作為將玻璃基板等之脆性材料基板(以下，僅稱為基板)加以分斷之手法，廣泛地使用下述手法，即使刀輪一邊壓接於基板之一面一邊轉動而形成刻劃線後，使基板表面背面反轉，以裂斷桿按壓另一面之先前形成之刻劃線之正上方部位以進行裂斷。上述情形，必須要有對基板一面形成刻劃線後使該基板表面背面反轉之機構。 As a method of dividing a brittle material substrate (hereinafter simply referred to as a substrate) such as a glass substrate, the following method is widely used, and even if the cutter wheel is pressed against one surface of the substrate and rotated to form a score line, The back surface of the substrate surface is reversed, and the cracking rod is pressed against the portion directly above the previously formed scribe line of the other surface to perform cracking. In the above case, it is necessary to have a mechanism for forming a back surface of the substrate after the scribe line is formed.
又，在液晶面板之製程，一般而言，二片脆性材料基板貼合而成之亦稱為貼合基板之大的母基板，係藉由刀輪進行之刻劃線之形成分斷，但作為上述分斷之手法，廣泛地使用下述手法，即使刀輪依序一邊壓接於母基板之表面背面一邊轉動而形成刻劃線、亦即使刀輪依序一邊壓接於構成母基板之各脆性材料基板之表面一邊轉動而形成刻劃線。此情形，亦必須藉由反轉機構使基板反轉。 Further, in the process of the liquid crystal panel, generally, a large mother substrate, which is also referred to as a bonded substrate, is formed by bonding two blank brittle material substrates, and is formed by a scribe line by a cutter wheel, but As a method of the above-described breaking, the following method is widely used, and even if the cutter wheel is pressed against the front surface of the mother substrate in order to rotate, a scribe line is formed, and even if the cutter wheel is sequentially pressed against the constituent mother substrate, The surface of each of the brittle material substrates is rotated to form a score line. In this case, the substrate must also be reversed by the reversing mechanism.
例如，具備將基板從上下夾入並使其反轉之反轉機構，將在基板之一面已形成刻劃線之基板從上游側暫時安裝在該反轉機構並使其反轉，將反轉後之基板交接至下游側之裝置之基板分斷系統已為公知(例如，參照專利文獻1)。 For example, an inversion mechanism that sandwiches and reverses a substrate from above and below is provided, and a substrate having a score line formed on one surface of the substrate is temporarily attached to the inversion mechanism from the upstream side and inverted, and reversed. A substrate breaking system in which a substrate is transferred to a device on the downstream side is known (for example, refer to Patent Document 1).
專利文獻1：日本特開2010-76957號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2010-76957
專利文獻1揭示之習知反轉機構之情形，反轉已完成之先前基板從反轉機構搬出之前，無法開始下一個基板之反轉。因此，會有無法進行連續分斷處理且作業效率低之問題。 In the case of the conventional reversing mechanism disclosed in Patent Document 1, the inversion of the next substrate cannot be started until the previous substrate that has been completed is reversed from the reversing mechanism. Therefore, there is a problem that the continuous breaking process cannot be performed and the work efficiency is low.
本發明係有鑑於上述課題而構成，其目的在於實現一種藉由連續地進行基板之反轉而能以高處理效率進行基板加工處理之基板反轉裝置、及具備此之基板處理系統。 The present invention has been made in view of the above problems, and an object thereof is to realize a substrate inverting device capable of performing substrate processing with high processing efficiency by continuously inverting a substrate, and a substrate processing system including the same.
為了解決上述課題，請求項1發明之基板處理系統，具備：第1搬送裝置及第2搬送裝置，分別將脆性材料基板往第1方向搬送；以及基板反轉裝置，配置在該第1搬送裝置與該第2搬送裝置之間，使被該第1搬送裝置搬送來之該脆性材料基板反轉並交接至該第2搬送裝置；該第1搬送裝置與該第2搬送裝置，藉由在與該第1方向正交之第2方向相隔間隙配置之複數個單位搬送要素一邊在下方支承一個該脆性材料基板一邊搬送；該基板反轉裝置，具備：一對保持臂群，相對於往該第2方向延伸之旋轉軸配置成旋轉對稱；旋轉驅動手段，使該一對保持臂群繞該旋轉軸旋轉；以及升降手段，使該一對保持臂群在該第1搬送裝置及該第2搬送裝置之間，於交接該脆性材料基板之高度位置即基板交接位置與其上方之間升降；該一對保持臂群之各個具有在該第2方向彼此分離配置且繞該旋轉軸旋轉時通過該間隙之複數個保持臂；該複數個保持臂之各個具備可吸附於該脆性材料基板之複數個吸附部；在該一對保持臂群配置在該基板交接位置之狀態下，使屬於該一對保持臂群之一方之該複數個保持臂之該複 數個吸附部吸附於作為反轉對象之該脆性材料基板即反轉對象基板，之後，藉由使該一對保持臂群繞該旋轉軸旋轉180度，使該反轉對象基板反轉；該一對保持臂群，在該反轉對象基板吸附於該複數個吸附部後、該反轉對象基板之反轉完成前之期間，上升地較該基板交接位置高，在該反轉對象基板之反轉後、解除對該反轉對象基板之該複數個吸附部之吸附時，下降至該基板交接位置。 In order to solve the problem, the substrate processing system according to the first aspect of the invention includes the first transfer device and the second transfer device, wherein the brittle material substrate is transported in the first direction, and the substrate inverting device is disposed in the first transport device. The brittle material substrate conveyed by the first conveying device is reversely transferred to the second conveying device, and the first conveying device and the second conveying device are The plurality of unit transport elements arranged in the gap in the second direction orthogonal to the first direction are transported while supporting one of the brittle material substrates. The substrate inverting device includes a pair of holding arm groups. a rotation axis extending in two directions is arranged to be rotationally symmetrical; a rotation driving means rotates the pair of holding arm groups about the rotation axis; and a lifting means for moving the pair of holding arm groups in the first conveying device and the second conveying Between the devices, the height position of the brittle material substrate is transferred, that is, between the substrate transfer position and the upper portion thereof; and each of the pair of holding arm groups is disposed apart from each other in the second direction. a plurality of holding arms that pass through the gap when rotating around the rotating shaft; each of the plurality of holding arms includes a plurality of adsorption portions that are adsorbable on the substrate of the brittle material; and the pair of holding arm groups are disposed at the substrate transfer position In the state, the complex retaining arm belonging to one of the pair of holding arm groups is caused by the complex a plurality of adsorption portions are adsorbed to the substrate to be reversed which is the target material for reversal, and then the pair of holding arm groups are rotated by 180 degrees around the rotation axis to invert the substrate to be reversed; a pair of holding arm groups are lifted higher than the substrate transfer position after the inversion target substrate is adsorbed to the plurality of adsorption portions and before the inversion of the inversion target substrate is completed, and the substrate is reversed. After the reversal, the adsorption of the plurality of adsorption portions of the substrate to be reversed is released, and the substrate is lowered to the substrate transfer position.
請求項2之發明，在請求項1記載之基板處理系統中，該一對保持臂群位於該基板交接位置時之反轉後之該反轉對象基板之被該複數個吸附部吸附之被吸附面之高度位置與該第2搬送裝置之搬送高度位置相同，藉由該第2搬送裝置一邊支承反轉後之該反轉對象基板一邊進行對反轉後之該反轉對象基板之該吸附之解除。 According to a second aspect of the invention, in the substrate processing system of claim 1, the inversion target substrate of the pair of holding arm groups is adsorbed by the plurality of adsorption portions after being inverted at the substrate transfer position The height position of the surface is the same as the transport height position of the second transport device, and the second transport apparatus supports the reversed target substrate while supporting the reversed target substrate. Lifted.
請求項3之發明，在請求項2記載之基板處理系統中，屬於該一對保持臂群之一方之該複數個保持臂之該複數個吸附部、與屬於該一對保持臂群之另一方之該複數個保持臂之該複數個吸附部，係設置成彼此之方向相異180度且兩者之端部位置位於與該旋轉軸平行之共通之平面上；該第1搬送裝置之搬送高度位置與該第2搬送裝置之搬送高度位置不同與該脆性材料基板之厚度相等之距離；在該一對保持臂群配置在該基板交接位置之狀態下，大致同時進行對反轉後之該反轉對象基板之該複數個吸附部之吸附之解除、與屬於該一對保持臂群之另一方之該複數個保持臂之該複數個吸附部對被該第1搬送裝置搬送來之新的反轉對象基板進行之吸附。 The invention of claim 3, wherein in the substrate processing system of claim 2, the plurality of adsorption portions of the plurality of holding arms belonging to one of the pair of holding arm groups and the other one of the pair of holding arm groups The plurality of adsorption portions of the plurality of holding arms are disposed 180 degrees apart from each other, and the end positions of the two are located on a common plane parallel to the rotation axis; the conveying height of the first conveying device The position is different from the transport height position of the second transport device by a distance equal to the thickness of the brittle material substrate; and the pair of the retaining arm groups are disposed at the substrate transfer position, and the reverse is performed substantially simultaneously The release of the adsorption of the plurality of adsorption portions of the transfer target substrate and the plurality of adsorption portions of the plurality of holding arms belonging to the other of the pair of holding arm groups are opposite to each other being transported by the first transfer device The adsorption is performed on the substrate to be transferred.
請求項4之發明，在請求項1至請求項3中任一項記載之基 板處理系統中，該旋轉軸係在一端部具備圓板狀之突緣部且另一端部連結於該旋轉驅動手段之棒狀之軸；該基板反轉裝置具有將該軸支承成可旋轉且包含該升降手段之一對支承手段；該突緣部相對於位於該一對支承手段之一方之筒狀構件滑動自如地嵌合；設在該突緣部之第1貫通孔透過第1吸引配管與該吸附部連接，且設在該筒狀構件之第2貫通孔藉由第2吸引配管與吸引手段連接。 The invention of claim 4, the basis of any one of claim 1 to claim 3 In the plate processing system, the rotating shaft has a disc-shaped flange portion at one end portion and the other end portion is coupled to a rod-shaped shaft of the rotational driving means; the substrate reversing device has the shaft rotatably supported And a pair of supporting means for supporting the lifting means; the flange portion is slidably fitted to the tubular member located in one of the pair of supporting means; and the first through hole provided in the flange portion is transmitted through the first suction pipe The second through hole provided in the tubular member is connected to the suction portion and connected to the suction means by the second suction pipe.
請求項5發明之基板反轉裝置，係使往第1方向搬送之脆性材料基板反轉，其特徵在於，具備：一對保持臂群，相對於往與該第1方向正交之第2方向延伸之旋轉軸配置成旋轉對稱；旋轉驅動手段，使該一對保持臂群繞該旋轉軸旋轉；以及升降手段，使該一對保持臂群在與外部之間，於交接該脆性材料基板之高度位置即基板交接位置與其上方之間升降；該一對保持臂群之各個具有在該第2方向彼此分離配置且繞該旋轉軸旋轉時通過該間隙之複數個保持臂；該複數個保持臂之各個具備可吸附於該脆性材料基板之複數個吸附部；在該一對保持臂群配置在該基板交接位置之狀態下，使屬於該一對保持臂群之一方之該複數個保持臂之該複數個吸附部吸附於作為反轉對象之該脆性材料基板即反轉對象基板，之後，藉由使該一對保持臂群繞該旋轉軸旋轉180度，使該反轉對象基板反轉；該一對保持臂群，在該反轉對象基板吸附於該複數個吸附部後、該反轉對象基板之反轉完成前之期間，上升地較該基板交接位置高，在該反轉對象基板之反轉後、解除對該反轉對象基板之該複數個吸附部之吸附時，下降至該基板交接位置。 The substrate inverting device according to claim 5 is characterized in that the brittle material substrate transferred in the first direction is reversed, and the pair of holding arm groups are provided in a second direction orthogonal to the first direction. The extended rotating shaft is configured to be rotationally symmetrical; the rotational driving means rotates the pair of holding arm groups about the rotating shaft; and the lifting means causes the pair of holding arm groups to communicate with the outside to transfer the brittle material substrate a height position, that is, a lifting and lowering position between the substrate transfer position and the upper portion thereof; each of the pair of holding arm groups having a plurality of holding arms that pass through the gap when the second direction is separated from each other and rotates around the rotating shaft; the plurality of holding arms Each of the plurality of adsorption portions that are adsorbable on the substrate of the brittle material; and the plurality of holding arms that belong to one of the pair of holding arm groups in a state in which the pair of holding arm groups are disposed at the substrate transfer position The plurality of adsorption portions are adsorbed to the substrate to be reversed which is the target material for reversal, and then the pair of holding arm groups are rotated by 180 degrees around the rotation axis to cause the reaction. The target substrate is reversed, and the pair of holding arm groups are raised higher than the substrate transfer position after the inversion target substrate is adsorbed to the plurality of adsorption portions and before the inversion of the inversion target substrate is completed. After the inversion of the substrate to be reversed and the adsorption of the plurality of adsorption portions of the substrate to be reversed is released, the substrate is lowered to the substrate transfer position.
根據請求項1至請求項5之發明，可大致同時進行欲反轉基 板之搬入動作與該基板之保持動作。又，可大致同時進行下一個欲反轉基板之搬入、先前已反轉處理之基板之交接、及保持臂對已搬入基板之吸附保持。亦即，可大致同時進行欲反轉基板之搬入與基板之反轉。藉此，可實現反轉處理效率優異之基板處理系統。 According to the invention of claim 1 to claim 5, the base to be reversed can be performed substantially simultaneously The loading operation of the board and the holding operation of the substrate. Further, the transfer of the substrate to be reversed, the transfer of the substrate which has been previously reversed, and the holding and holding of the holding arm to the loaded substrate can be performed substantially simultaneously. That is, the inversion of the substrate to be reversed and the inversion of the substrate can be performed substantially simultaneously. Thereby, a substrate processing system excellent in reverse processing efficiency can be realized.
100‧‧‧基板反轉裝置 100‧‧‧Substrate reversal device
101‧‧‧軸 101‧‧‧Axis
101a‧‧‧突緣部 101a‧‧‧Front Department
101b‧‧‧筒狀部 101b‧‧‧Cylinder
101c‧‧‧動力傳達部 101c‧‧‧Power Transmission Department
102‧‧‧保持臂 102‧‧‧ Keeping the arm
103‧‧‧吸附墊 103‧‧‧Adsorption pad
110‧‧‧腳部 110‧‧‧foot
120‧‧‧軸支承部 120‧‧‧ shaft support
130‧‧‧旋轉驅動手段 130‧‧‧Rotary drive
130a‧‧‧旋轉軸 130a‧‧‧Rotary axis
140‧‧‧吸引泵 140‧‧‧Attraction pump
200‧‧‧刻劃裝置 200‧‧‧ scoring device
201‧‧‧平台 201‧‧‧ platform
202‧‧‧橋部 202‧‧‧Bridge
203‧‧‧刻劃頭 203‧‧‧Scratch
300‧‧‧搬送裝置 300‧‧‧Transporting device
301‧‧‧單位搬送部 301‧‧‧Unit Transfer Department
302‧‧‧滾輪 302‧‧‧Roller
400‧‧‧移載裝置 400‧‧‧Transfer device
401‧‧‧吸附墊 401‧‧‧Adsorption pad
402‧‧‧吸附臂 402‧‧‧Adsorption arm
403‧‧‧導件 403‧‧‧Guide
1000‧‧‧基板處理系統 1000‧‧‧Substrate processing system
W(W1,W2)‧‧‧基板 W (W1, W2) ‧ ‧ substrate
圖1係顯示基板處理系統1000之主要部分構成之俯視圖。 1 is a plan view showing a configuration of a main part of a substrate processing system 1000.
圖2係顯示基板反轉裝置100附近之構成之俯視圖。 2 is a plan view showing a configuration in the vicinity of the substrate inverting device 100.
圖3係顯示基板反轉裝置100附近之構成之YZ側視圖。 3 is a side view showing the YZ of the configuration in the vicinity of the substrate inverting device 100.
圖4係在基板反轉裝置100附近之-Y側之ZX側視圖。 4 is a side view of the ZX on the -Y side in the vicinity of the substrate inverting device 100.
圖5係在基板反轉裝置100附近之+Y側之ZX側視圖。 Fig. 5 is a side view of the ZX on the +Y side in the vicinity of the substrate inverting device 100.
圖6係顯示一對保持臂群從基板交接位置上升時之途中之樣子之YZ側視圖。 Fig. 6 is a side view showing the YZ of the pair of holding arm groups as they rise from the substrate transfer position.
圖7係顯示使一對保持臂群上升既定距離後之狀態之圖。 Fig. 7 is a view showing a state in which a pair of holding arm groups are raised by a predetermined distance.
圖8(a)~(d)係依序顯示基板W在基板反轉裝置100反轉之樣子之圖。 8(a) to 8(d) are views sequentially showing the state in which the substrate W is reversed by the substrate inverting device 100.
圖9(a)~(d)係依序顯示基板W在基板反轉裝置100反轉之樣子之圖。 9(a) to 9(d) are views sequentially showing how the substrate W is reversed by the substrate inverting device 100.
圖10係變形例之包含搬送裝置300之基板處理系統1000之基板反轉裝置100附近之YZ側視圖。 FIG. 10 is a YZ side view of the vicinity of the substrate inverting device 100 of the substrate processing system 1000 including the transfer device 300 according to a modification.
(系統之概要) (summary of the system)
圖1係顯示本實施形態之基板處理系統1000之主要部分構成之俯視圖。本實施形態之基板處理系統1000，主要具備基板反轉裝置100、二個刻 劃裝置200(第1刻劃裝置200A及第2刻劃裝置200B)、二個搬送裝置300(第1搬送裝置300A及第2搬送裝置300B)。 Fig. 1 is a plan view showing the configuration of a main part of a substrate processing system 1000 of the present embodiment. The substrate processing system 1000 of the present embodiment mainly includes a substrate inverting device 100 and two engravings. The device 200 (the first scribing device 200A and the second scribing device 200B) and the two transport devices 300 (the first transport device 300A and the second transport device 300B).
基板處理系統1000，概略而言，為處理下述一連串處理之系統，即藉由第1刻劃裝置200A對玻璃基板等之脆性材料基板(以下，僅稱為基板)W之一主面形成刻劃線後，以基板反轉裝置100使該基板W反轉，接著，藉由第2刻劃裝置200B對另一主面形成刻劃線。 The substrate processing system 1000 is generally a system for processing a series of processes in which a main surface of a brittle material substrate (hereinafter simply referred to as a substrate) W such as a glass substrate is formed by the first scribing device 200A. After the scribing, the substrate W is reversed by the substrate inverting device 100, and then the other main surface is scribed by the second scribing device 200B.
此外，在圖1及之後之圖式，賦予以在基板處理系統1000依序進行一連串處理時之水平面內之基板W之行進方向為Y軸正方向、以在水平面內與Y軸正交之方向為X軸方向、以鉛垂方向為Z軸方向之右手系XYZ座標。 Further, in FIG. 1 and the following drawings, the traveling direction of the substrate W in the horizontal plane when the substrate processing system 1000 is sequentially processed in series is the Y-axis positive direction and the direction orthogonal to the Y-axis in the horizontal plane. The right-handed XYZ coordinate in the X-axis direction and the vertical direction in the Z-axis direction.
基板反轉裝置100主要具備往X軸方向延伸之棒狀構件即軸101、從軸101垂直延伸之複數個保持臂102。複數個保持臂102往相異180度之二個方向延伸，相同方向之保持臂102設成彼此分離。本實施形態中，例示在各方向設有6個保持臂102之構成。此外，在之後，會有適當地將往相同方向延伸之複數個保持臂102總稱為保持臂群之情形。在基板反轉裝置100，配置有分別所屬之保持臂102之延伸方向相異之二個保持臂群(一對保持臂群)。 The substrate inverting device 100 mainly includes a shaft 101 which is a rod-shaped member extending in the X-axis direction, and a plurality of holding arms 102 extending perpendicularly from the shaft 101. The plurality of holding arms 102 extend in two directions different from each other by 180 degrees, and the holding arms 102 in the same direction are disposed to be separated from each other. In the present embodiment, a configuration in which six holding arms 102 are provided in each direction is exemplified. Further, after that, a plurality of holding arms 102 extending in the same direction as appropriate will be collectively referred to as a holding arm group. In the substrate inverting device 100, two holding arm groups (a pair of holding arm groups) in which the extending directions of the holding arms 102 are different from each other are disposed.
又，在保持臂102配置有吸附墊103。基板反轉裝置100，在以吸附墊103從下方吸附保持有被第1搬送裝置300A搬送來之基板W之狀態下，以軸101作為旋轉軸使保持臂102反轉180度，藉此使基板W反轉，立刻將該基板W交接至第2搬送裝置300B。基板反轉裝置100之詳細構成將於後述。 Further, the adsorption pad 103 is disposed on the holding arm 102. In the state in which the substrate W that has been transported by the first transfer device 300A is sucked and held from below by the adsorption pad 103, the holding arm 102 is reversed by 180 degrees with the shaft 101 as a rotation axis, thereby making the substrate When the W is reversed, the substrate W is immediately transferred to the second transfer device 300B. The detailed configuration of the substrate inverting device 100 will be described later.
刻劃裝置200具備在上面載置固定有基板W之狀態下往Y軸方向移動自如之平台201、在平台201之移動範圍上方架設成X軸方向為長邊方向之橋部202、附設於該橋部202之至少一個(圖1中為4個)刻劃頭203。又，在刻劃頭203之鉛垂下部，以垂直姿勢且面內旋轉自如地附設有圓盤狀且外周部分成為刀前端之刻劃輪(未圖示)。 The scribing device 200 includes a platform 201 that is movable in the Y-axis direction while the substrate W is placed and fixed thereon, and a bridge portion 202 that is disposed in the longitudinal direction of the X-axis direction above the moving range of the stage 201, and is attached thereto. At least one of the bridges 202 (four in Figure 1) scribes the head 203. Further, in the vertical lower portion of the scribing head 203, a scribing wheel (not shown) having a disk shape and an outer peripheral portion serving as a tip end of the blade is rotatably attached in a vertical posture and in a plane.
在上述構成之刻劃裝置200，在刻劃頭203配置在橋部200之適當位置之狀態下，在基板W載置固定在平台201之狀態下使平台一邊往Y軸正方向移動一邊使刻劃輪壓接轉動於基板W，藉此可在基板W形成沿著Y軸方向之刻劃線。 In the scribing device 200 configured as described above, the scribing head 203 is placed at an appropriate position of the bridge portion 200, and the platform W is moved in the positive direction of the Y-axis while the substrate W is placed and fixed on the stage 201. The roller is crimped and rotated to the substrate W, whereby the substrate W can be formed with a scribe line along the Y-axis direction.
此外，構成基板處理系統100之刻劃裝置200之構成並不限於此。例如，在下方配置有基板W之狀態下，使在下部具備刻劃輪之刻劃頭203往X軸方向移動，藉此形成刻劃線之形態亦可。或者，配置複數個具備刻劃頭203之橋部202之形態亦可。 Further, the configuration of the scribing device 200 constituting the substrate processing system 100 is not limited thereto. For example, in a state in which the substrate W is disposed below, the scribe head 203 having the scribing wheel at the lower portion is moved in the X-axis direction, thereby forming a scribe line. Alternatively, a plurality of forms of the bridge portion 202 having the scribed head 203 may be disposed.
搬送裝置300係在基板反轉裝置100與刻劃裝置200之間搬送基板W之裝置。具體而言，第1搬送裝置300A將以第1刻劃裝置200A形成有刻劃線之基板W搬送至基板反轉裝置100之反轉開始位置。第2搬送裝置300B將被基板反轉裝置100反轉後之基板W從基板反轉裝置100之反轉結束位置朝向第2刻劃裝置200B搬送。 The transport device 300 is a device that transports the substrate W between the substrate inverting device 100 and the scribing device 200. Specifically, the first transfer device 300A transports the substrate W on which the score line is formed by the first scribing device 200A to the inversion start position of the substrate inverting device 100. The second transport apparatus 300B transports the substrate W inverted by the substrate inverting apparatus 100 from the inversion end position of the substrate inverting apparatus 100 toward the second scribing apparatus 200B.
搬送裝置300具備配置成與Y軸平行且彼此分離之複數個(本實施形態中為七個)單位搬送部(單位搬送要素)301。在搬送裝置300，在被所有單位搬送部301下方支承之狀態下搬送各基板W。更具體而言，各單位搬送部301係Y軸方向為長邊方向(搬送方向)且彼此同步地動作之帶式 輸送機。 The transport apparatus 300 includes a plurality of (seven in the present embodiment) unit transport units (unit transport elements) 301 that are disposed in parallel with the Y-axis and that are separated from each other. Each of the substrates W is transported in a state where the transport device 300 is supported by all of the unit transport units 301. More specifically, each unit transport unit 301 is a belt type in which the Y-axis direction is the longitudinal direction (transport direction) and operates in synchronization with each other. Conveyor.
又，各單位搬送部301係配置成可通過配置在基板反轉裝置100之保持臂102藉由軸101之旋轉而反轉動作時相鄰之二個單位搬送部301之間隙。然而，第1搬送裝置300A之單位搬送部301(第1單位搬送部301A)與第2搬送裝置300B之單位搬送部301(第2單位搬送部301B)係配置成在鉛垂方向之配置位置(高度位置)不同。具體而言，第2單位搬送部301B相較於第1單位搬送部301A，配置在高出與基板處理系統1000之處理對象即基板W之厚度t相等之距離之位置。 Further, each unit conveying unit 301 is disposed so as to be able to be disposed in a gap between two adjacent unit conveying units 301 when the holding arm 102 of the substrate reversing device 100 is reversely rotated by the rotation of the shaft 101. However, the unit transport unit 301 (the first unit transport unit 301A) of the first transport apparatus 300A and the unit transport unit 301 (the second unit transport unit 301B) of the second transport apparatus 300B are disposed at the position in the vertical direction ( Height position) is different. Specifically, the second unit transport unit 301B is disposed at a position higher than the thickness t of the substrate W which is the processing target of the substrate processing system 1000, as compared with the first unit transport unit 301A.
本實施形態之基板處理系統1000進一步具備二個移載裝置400(第1移載裝置400A及第2移載裝置400B)。移載裝置400處理刻劃裝置200與相鄰之搬送裝置300之間之基板W之移載。移載裝置400具備往X軸方向延伸且在前端部升降自如地具備朝向鉛垂下方之吸附墊401之吸附臂402、及將該吸附臂402支承成可往Y軸方向移動之導件403。 The substrate processing system 1000 of the present embodiment further includes two transfer devices 400 (the first transfer device 400A and the second transfer device 400B). The transfer device 400 handles the transfer of the substrate W between the scribing device 200 and the adjacent transfer device 300. The transfer device 400 includes a suction arm 402 that extends in the X-axis direction and that is provided with a suction pad 401 that is vertically downward at the distal end portion, and a guide 403 that supports the adsorption arm 402 so as to be movable in the Y-axis direction.
更具體而言，第1移載裝置400A吸附保持在第1刻劃裝置200A形成刻劃線後之基板W並移載至第1搬送裝置300A。第2移載裝置400B吸附保持被第2搬送裝置300B搬送之基板W並移載至第2刻劃裝置200B之平台201。 More specifically, the first transfer device 400A adsorbs and holds the substrate W that has been scribed by the first scribe device 200A and transfers it to the first transfer device 300A. The second transfer device 400B adsorbs and holds the substrate W transported by the second transfer device 300B and transfers it to the stage 201 of the second scribing device 200B.
此外，移載裝置400在基板處理系統1000並非必須之構成。以刻劃裝置200在與搬送裝置300之間直接交接基板W之方式構成基板處理系統1000亦可，上述情形，不需要移載裝置400。 Further, the transfer device 400 is not necessarily configured in the substrate processing system 1000. The substrate processing system 1000 may be configured such that the scribing device 200 directly transfers the substrate W to and from the transfer device 300. In the above case, the transfer device 400 is not required.
(基板反轉裝置之詳細構成) (Detailed structure of the substrate inverting device)
圖2及圖3分別係顯示本實施形態之基板處理系統1000之主要部分即 基板反轉裝置100附近之構成之俯視圖及YZ側視圖。圖2及圖3中，顯示在第1搬送裝置300A與基板反轉裝置100之間交接基板W時之樣子。 2 and 3 show the main part of the substrate processing system 1000 of the present embodiment, that is, A plan view and a YZ side view of the configuration in the vicinity of the substrate inverting device 100. In FIGS. 2 and 3, the state in which the substrate W is transferred between the first transfer device 300A and the substrate inverting device 100 is shown.
再者，圖4及圖5分別係圖2及圖3所示之狀況之基板反轉裝置100附近之-Y側之ZX側視圖及+Y側之ZX側視圖。然而，圖4及圖5中，省略配置在+Y側之構成要素，圖5中，省略配置在-Y側之構成要素。 Further, FIGS. 4 and 5 are a ZX side view on the -Y side and a ZX side view on the +Y side in the vicinity of the substrate inverting device 100 in the state shown in FIGS. 2 and 3, respectively. However, in FIGS. 4 and 5, the components arranged on the +Y side are omitted, and in FIG. 5, the components arranged on the -Y side are omitted.
如上述，基板反轉裝置100具備往X軸方向延伸且能以X軸方向為旋轉軸旋轉之軸101，且使由分別具備複數個吸附墊103之複數個保持臂102構成之保持臂群從軸101往相異180度之二個方向延伸。此外，圖2中，各保持臂群相對於軸101設成梳齒狀。 As described above, the substrate inverting device 100 includes the shaft 101 extending in the X-axis direction and rotatable in the X-axis direction, and the holding arm group including the plurality of holding arms 102 each having the plurality of adsorption pads 103 The shaft 101 extends in two directions different from each other by 180 degrees. Further, in FIG. 2, each of the holding arm groups is formed in a comb shape with respect to the shaft 101.
然而，屬於一方之保持臂群之保持臂102(將此等特別稱為保持臂102A)與屬於另一方之保持臂群之複數個保持臂102(將此等特別稱為保持臂102B)，係以彼此具備之吸附墊103之方向相異180度且一方之吸附墊103之端部位置(吸附位置)與另一方之吸附墊103之端部位置(吸附位置)即使保持臂102A與保持臂102B之姿勢變化亦位於與軸101平行之共通平面上之方式，固設於軸101。 However, the holding arms 102 (generally referred to as holding arms 102A) belonging to one of the holding arm groups and the plurality of holding arms 102 belonging to the other holding arm group (referred to as holding arms 102B in particular) are The end position (adsorption position) of one of the adsorption pads 103 and the end position (adsorption position) of the other adsorption pad 103 are 180 degrees apart from each other in the direction of the adsorption pad 103 provided to each other, even if the holding arm 102A and the holding arm 102B are held The posture change is also located on a common plane parallel to the axis 101, and is fixed to the shaft 101.
例如，若為圖1至圖5例示之保持臂102取得水平姿勢之情形，例如從圖3可知，保持臂102A之吸附墊103朝向鉛垂下方(-Z方向)，相對於此，保持臂102B之吸附墊103朝向鉛垂上方(+Z方向)，但前者之端部(下端部)與後者之端部(上端部)位於同一平面之水平面內。亦即，位於相同高度位置。藉由軸101旋轉，所有保持臂102之姿勢變化，但配置在保持臂102A之吸附墊103之方向與配置在保持臂102B之吸附墊103之方向恆相異180度。 For example, in the case where the holding arm 102 illustrated in FIGS. 1 to 5 has a horizontal posture, for example, as shown in FIG. 3, the suction pad 103 of the holding arm 102A faces downward (-Z direction), whereas the holding arm 102B is opposed thereto. The adsorption pad 103 faces vertically upward (+Z direction), but the end portion (lower end portion) of the former is located in the same plane as the end portion (upper end portion) of the latter. That is, at the same height position. By the rotation of the shaft 101, the posture of all the holding arms 102 changes, but the direction of the adsorption pad 103 disposed in the holding arm 102A is constant by 180 degrees from the direction of the adsorption pad 103 disposed in the holding arm 102B.
亦即，屬於一方之保持臂群之保持臂102A與屬於另一方之保持臂群之保持臂102B係設成在YZ面內相對於軸101成為旋轉對稱之位置。 In other words, the holding arm 102A belonging to one of the holding arm groups and the holding arm 102B belonging to the other holding arm group are arranged to be rotationally symmetrical with respect to the shaft 101 in the YZ plane.
基板反轉裝置100進一步具備一對腳部110、一對軸支承部120、及旋轉驅動手段130。 The substrate inverting device 100 further includes a pair of leg portions 110, a pair of shaft support portions 120, and a rotation driving means 130.
一對腳部110在X軸方向分離配置，透過軸支承部120將往X軸方向延伸之軸101在其兩端部分從下方支承。此外，本實施形態中，為了簡化圖示，顯示一對腳部110獨立地配置之形態，但一對腳部110設在未圖示之基台上之形態亦可。 The pair of leg portions 110 are disposed apart from each other in the X-axis direction, and the shaft 101 that extends in the X-axis direction through the shaft support portion 120 is supported at its both end portions from below. Further, in the present embodiment, in order to simplify the illustration, the pair of leg portions 110 are arranged to be independently arranged, but the pair of leg portions 110 may be provided on a base (not shown).
一對軸支承部120連接於軸101之兩端部分，且以往鉛垂方向升降自如之形態設在對應之腳部110之上側位置。亦即，軸支承部120能一邊支承軸101一邊升降。藉此，在基板反轉裝置100，能使軸101及固設於此之保持臂102之高度位置變化。關於軸支承部120之升降範圍之詳細將於後述。此外，上述升降動作能與軸101之旋轉動作並行進行。 The pair of shaft support portions 120 are connected to both end portions of the shaft 101, and are provided on the upper side of the corresponding leg portion 110 in a vertically movable manner. That is, the shaft support portion 120 can be raised and lowered while supporting the shaft 101. Thereby, in the substrate inverting device 100, the height position of the shaft 101 and the holding arm 102 fixed thereto can be changed. The details of the lifting range of the shaft support portion 120 will be described later. Further, the above-described lifting operation can be performed in parallel with the rotation of the shaft 101.
處理軸支承部120之升降之具體構成，可藉由公知技術實現。較佳為，軸支承部120之升降藉由線性馬達機構實現。例如，在腳部110往Z軸方向延伸設置未圖示之固定件，在軸支承部120設置未圖示之可動件，使可動件沿著固定件移動，藉此如圖4及圖5之箭頭AR所示，在Z軸方向之既定範圍能使軸支承部120升降。 The specific configuration of the raising and lowering of the shaft support portion 120 can be realized by a known technique. Preferably, the lifting of the shaft support portion 120 is achieved by a linear motor mechanism. For example, a fixing member (not shown) is extended in the Z-axis direction of the leg portion 110, and a movable member (not shown) is provided in the shaft supporting portion 120 to move the movable member along the fixing member, thereby being as shown in FIGS. 4 and 5. As indicated by the arrow AR, the shaft support portion 120 can be moved up and down in a predetermined range in the Z-axis direction.
此外，本實施形態中，以一對軸支承部120在X軸方向位於一對腳部110之間之方式配置兩者，但兩者之配置關係並不限於此。 In the present embodiment, the two shaft support portions 120 are disposed between the pair of leg portions 110 in the X-axis direction. However, the arrangement relationship between the two is not limited thereto.
旋轉驅動手段130係用以使軸101旋轉之驅動手段。作為旋 轉驅動手段130，較佳為例如旋轉汽缸。 The rotary drive means 130 is a drive means for rotating the shaft 101. As a spin The turning drive means 130 is preferably, for example, a rotary cylinder.
更詳細而言，在基板反轉裝置100，在軸101之一端部(本實施形態中為+X側端部)固設有圓板狀之突緣部101a。另一方面，在軸支承部120固設有往X軸方向開口之筒狀部101b。此外，突緣部101a之外周部係以滑動自如之狀態嵌合在筒狀部101b之開口部之內面。 More specifically, in the substrate inverting device 100, a disk-shaped flange portion 101a is fixed to one end portion of the shaft 101 (the +X side end portion in the present embodiment). On the other hand, the tubular support portion 120 is fixed to the tubular portion 101b that opens in the X-axis direction. Further, the outer peripheral portion of the flange portion 101a is fitted to the inner surface of the opening portion of the tubular portion 101b in a slidable state.
又，在軸101之另一端部(本實施形態中為-X側端部)固設有動力傳達部101c。在動力傳達部101c，往+X方向延伸之旋轉驅動手段130之旋轉軸130a被支承於軸支承部120並連結。 Moreover, the power transmission portion 101c is fixed to the other end portion of the shaft 101 (the -X side end portion in the present embodiment). In the power transmission unit 101c, the rotation shaft 130a of the rotation driving means 130 extending in the +X direction is supported by the shaft support portion 120 and coupled.
藉由具有以上構成，在基板反轉裝置100，若使旋轉驅動手段130動作，則透過支承於軸支承部120之旋轉軸130a與連接於此之動力傳達部101c，能使腳部110及被軸支承部120支承之軸101旋轉。藉此，可實現繞軸101之保持臂120之旋轉。又，此時，在軸101之另一端部，突緣部101a相對於筒狀部101b滑動，因此可穩定地進行旋轉動作。 With the above configuration, when the rotation driving device 130 is operated by the substrate reversing device 100, the rotation portion 130a supported by the shaft support portion 120 and the power transmission portion 101c connected thereto can transmit the foot portion 110 and The shaft 101 supported by the shaft support portion 120 rotates. Thereby, the rotation of the holding arm 120 about the shaft 101 can be achieved. Moreover, at this time, since the flange portion 101a slides with respect to the tubular portion 101b at the other end portion of the shaft 101, the rotation operation can be stably performed.
此外，圖1至圖3中雖省略圖示，但如圖4及圖5所示，在突緣部101a設有貫通孔即二個第1埠P1，在筒狀部101b之側面亦同樣地設有貫通孔即第2埠P2。此外，在第1埠P1連接有第1吸引用管T1，在第2埠P2連接有第2吸引用管T2。藉此，第1吸引用管T1與第2吸引用管T2之間為空間上連通之狀態。 Further, although not shown in FIGS. 1 to 3, as shown in FIGS. 4 and 5, two first 埠P1, which are through holes, are provided in the flange portion 101a, and the side surface of the tubular portion 101b is similarly The second hole P2 is provided as a through hole. Further, the first suction pipe T1 is connected to the first turn P1, and the second suction pipe T2 is connected to the second turn P2. Thereby, the first suction pipe T1 and the second suction pipe T2 are in a state of spatial communication.
再者，二個第1吸引用管T1之另一端分別經由設在保持臂102之吸引路徑連接於吸附墊103。更具體而言，一方之第1吸引用管T1連接於保持臂102A側之吸附墊103，另一方之第1吸引用管T1連接於保持臂102B側之吸附墊103。又，第2吸引用管T2之另一端連接於吸引泵140。 藉由具有上述構成，在基板反轉裝置100，在基板W載置於吸附墊103之上之狀態下使吸引泵140動作，藉此能藉由吸附墊103吸附固定基板W。圖4中，概念地例示第1吸引用管T1與一部分吸附墊103之連接之樣子、及第2吸引用管T2與吸引泵140之連接之樣子。 Further, the other ends of the two first suction tubes T1 are connected to the adsorption pad 103 via suction paths provided on the holding arm 102, respectively. More specifically, one of the first suction tubes T1 is connected to the adsorption pad 103 on the holding arm 102A side, and the other first suction tube T1 is connected to the adsorption pad 103 on the holding arm 102B side. Further, the other end of the second suction pipe T2 is connected to the suction pump 140. With the above configuration, in the substrate inverting device 100, the suction pump 140 is operated while the substrate W is placed on the adsorption pad 103, whereby the substrate W can be adsorbed and fixed by the adsorption pad 103. FIG. 4 conceptually shows a state in which the first suction pipe T1 is connected to a part of the adsorption pads 103 and a connection between the second suction pipe T2 and the suction pump 140.
而且，如上述，連接有第1吸引用管T1之突緣部101a，在軸101旋轉時相對於連接有第2吸引用管T2之筒狀體滑動自如，因此即使在軸101旋轉之狀態亦保持吸引狀態。藉此，本實施形態之基板反轉裝置100中，即使保持臂102旋轉之狀態，亦可藉由吸附墊103吸附保持基板W。 In addition, as described above, the flange portion 101a to which the first suction pipe T1 is connected is slidable with respect to the tubular body to which the second suction pipe T2 is connected when the shaft 101 rotates, so that even when the shaft 101 is rotated, Stay attractive. As a result, in the substrate inverting apparatus 100 of the present embodiment, the substrate W can be adsorbed and held by the adsorption pad 103 even if the holding arm 102 is rotated.
(搬送裝置300與基板反轉裝置之配置關係) (Arrangement relationship between the transfer device 300 and the substrate inverting device)
接著，說明搬送裝置300與基板反轉裝置100之配置關係，具體而言，說明第1搬送裝置300A及第2搬送裝置300B之單位搬送部301之配置關係與軸支承部120升降後軸101旋轉所變化之保持臂102A及保持臂102B之配置位置之關係。 Next, the arrangement relationship between the transport apparatus 300 and the substrate reversing apparatus 100 will be described. Specifically, the arrangement relationship between the unit transport unit 301 of the first transport apparatus 300A and the second transport apparatus 300B and the rotation of the shaft 101 after the shaft support unit 120 is raised and lowered will be described. The relationship between the position of the holding arm 102A and the holding arm 102B that are changed.
如上述，在本實施形態之基板處理系統1000，第1搬送裝置300A之單位搬送部301與第2搬送裝置300B之單位搬送部301之高度位置差異基板W之厚度t之量。另一方面，在基板反轉裝置100，保持臂102A與保持臂102B係以相對於軸101旋轉對稱且分別具備之吸附墊103之端部位於共通平面上之方式設置。又，藉由旋轉驅動手段130使軸101旋轉，藉此能使一對保持臂群繞軸101旋轉，藉由使軸支承部120升降，能使軸101與一對保持臂群之高度位置變化。 As described above, in the substrate processing system 1000 of the present embodiment, the height position of the unit transfer unit 301 of the first transfer device 300A and the unit transfer unit 301 of the second transfer device 300B differs by the thickness t of the substrate W. On the other hand, in the substrate inverting device 100, the holding arm 102A and the holding arm 102B are provided so as to be rotationally symmetrical with respect to the shaft 101 and the end portions of the adsorption pads 103 respectively provided are located on a common plane. Further, by rotating the shaft 101 by the rotation driving means 130, the pair of holding arm groups can be rotated about the shaft 101, and the height of the shaft 101 and the pair of holding arm groups can be changed by raising and lowering the shaft supporting portion 120. .
此等部位之配置關係及一對保持臂群之升降範圍係設定成能高效率地進行從第1搬送裝置300A之單位搬送部301往一對保持臂群之 一方之基板之交接、從一對保持臂群之另一方往第2搬送裝置300B之基板W之交接、及在此等交接間之基板W之反轉與在第1搬送裝置300A及第2搬送裝置300B之基板W之搬送。 The arrangement relationship of the parts and the lifting range of the pair of holding arm groups are set to be efficiently performed from the unit conveying unit 301 of the first conveying apparatus 300A to the pair of holding arm groups. The transfer of one of the substrates, the transfer from the other of the pair of holding arm groups to the substrate W of the second transfer device 300B, and the reversal of the substrate W between the transfer and the first transfer device 300A and the second transfer The substrate W of the device 300B is transported.
具體而言，首先，圖1至圖5所示為一對保持臂群位於基板交接位置時之樣子。基板交接位置，如圖2及圖3所示，規定為一對保持臂群係水平姿勢且此時較軸101位於-Y側之保持臂102A具備之吸附墊103下端之高度位置較第1搬送裝置300A之第1單位搬送部301A之上面高出基板W之厚度t之位置。一對保持臂群位於上述基板交接位置時，在第1搬送裝置300A，基板W被搬送至+Y側端部後，吸附墊103下端之高度位置與基板W上面之高度位置一致，因此吸附墊103可進行基板W之吸附。 Specifically, first, FIG. 1 to FIG. 5 show how a pair of holding arm groups are located at the substrate transfer position. As shown in FIG. 2 and FIG. 3, the substrate transfer position is defined as a pair of holding arm groups in a horizontal posture, and the height position of the lower end of the adsorption pad 103 provided in the holding arm 102A on the -Y side of the shaft 101 is lower than that of the first transfer. The upper surface of the first unit transfer unit 301A of the apparatus 300A is raised above the thickness t of the substrate W. When the pair of holding arm groups are located at the substrate transfer position, after the substrate W is transported to the +Y side end portion in the first transfer device 300A, the height position of the lower end of the adsorption pad 103 coincides with the height position of the upper surface of the substrate W, and thus the adsorption pad 103 can perform adsorption of the substrate W.
而且，此時，根據上述配置關係，第2搬送裝置300B上面之高度位置與較軸101位於+Y側之保持臂102B具備之吸附墊103上端之高度位置相同，因此作為被吸附面之下面被該吸附墊103吸附保持之基板W存在之情形，亦可藉由第2搬送裝置300B支承該基板W。 Further, at this time, according to the above-described arrangement relationship, the height position of the upper surface of the second conveying device 300B is the same as the height position of the upper end of the adsorption pad 103 provided on the holding arm 102B on the +Y side of the relatively axial axis 101, and thus the lower surface of the adsorption surface is The substrate W is held by the adsorption pad 103, and the substrate W can be supported by the second transfer device 300B.
亦即，一對保持臂群位於基板交接位置時，可大致同時進行從第1搬送裝置300A往基板反轉裝置100之基板W之交接、從基板反轉裝置100往第2搬送裝置300B之基板之交接。 In other words, when the pair of holding arm groups are located at the substrate transfer position, the substrate from the first transfer device 300A to the substrate W of the substrate inverting device 100 and the substrate from the substrate inverting device 100 to the second transfer device 300B can be substantially simultaneously. The handover.
又，圖6係顯示一對保持臂群從圖1至圖5所示之基板交接位置上升時之途中之樣子之YZ側視圖。然而，圖6中省略基板W。 Further, Fig. 6 is a side view showing the YZ of the pair of holding arm groups as they rise from the substrate transfer position shown in Figs. 1 to 5 . However, the substrate W is omitted in FIG.
如圖6所示，本實施形態中，使保持臂102如箭頭RT所示旋轉並同時使一對保持臂群上升。更具體而言，使保持臂102A與保持臂102B反轉180度之期間，軸支承部120上升，使一對保持臂群上升。或者， 使一對保持臂群上升後，使保持臂102A與保持臂102B反轉180度亦可。 As shown in Fig. 6, in the present embodiment, the holding arm 102 is rotated as indicated by an arrow RT while raising the pair of holding arm groups. More specifically, while the holding arm 102A and the holding arm 102B are reversed by 180 degrees, the shaft support portion 120 is raised to raise the pair of holding arm groups. or, After the pair of holding arm groups are raised, the holding arm 102A and the holding arm 102B may be reversed by 180 degrees.
另一方面，顯示一對保持臂群上升既定距離後之狀態者係圖7。然而，圖7中亦省略基板W。 On the other hand, the state in which the pair of holding arm groups are raised by a predetermined distance is shown in FIG. However, the substrate W is also omitted in FIG.
將圖7與一對保持臂群位於基板交接位置之狀態之圖3加以對比，前者中，軸支承部120相對於腳部110位於較高位置，又，一對保持臂群之相對配置關係相同，但保持臂102A與保持臂102B之配置關係在Y軸方向於軸101之兩側替換。 FIG. 3 is compared with FIG. 3 in a state in which the pair of holding arm groups are located at the substrate transfer position. In the former case, the shaft support portion 120 is located at a higher position with respect to the leg portion 110, and the relative arrangement relationship of the pair of holding arm groups is the same. However, the arrangement relationship between the holding arm 102A and the holding arm 102B is replaced on both sides of the shaft 101 in the Y-axis direction.
此外，進一步確認，從圖2所示之兩者之配置關係可明白旋轉之保持臂102不會與單位搬送部301碰撞。 Further, it has been confirmed that the rotation of the holding arm 102 does not collide with the unit conveying unit 301 from the arrangement relationship shown in FIG. 2 .
一對保持臂群從基板交接位置上升之距離，如圖7所示，恆與第2搬送裝置300B之單位搬送部301B上面之高度位置和較軸101位於+Y側之保持臂102A之吸附墊103上端之高度位置之距離d相等。此外，一對保持臂群之上升係為了確實地防止在第1搬送裝置300A進行之往+Y方向之基板W之搬送時保持臂102A之吸附墊103與搬送之基板W之干涉而進行。因此，一對保持臂群之上升距離只要有數mm程度即足夠。圖7中係誇大顯示上述距離d。 As shown in FIG. 7, the distance between the pair of holding arm groups rising from the substrate transfer position is constant, and the height position of the upper transfer unit 301B of the second transfer device 300B and the suction pad of the holding arm 102A on the +Y side of the lower axis 101 are shown. The distance d of the height position of the upper end of 103 is equal. In addition, the rise of the pair of holding arm groups is performed to prevent the interference between the adsorption pad 103 of the holding arm 102A and the substrate W to be conveyed during the conveyance of the substrate W in the +Y direction by the first conveying device 300A. Therefore, the rising distance of the pair of holding arm groups is sufficient as long as it is several mm. In Fig. 7, the above distance d is exaggerated.
暫時上升後之一對保持臂群往基板交接位置之下降，係在將保持臂102保持成水平姿勢之狀態下進行。此外，不需使一對保持臂群上升後靜止，上升與其後之下降連續地進行亦可。 The lowering of one of the holding arms to the substrate transfer position after the temporary rise is performed while the holding arm 102 is held in the horizontal posture. Further, it is not necessary to make the pair of holding arm groups rise and then stand still, and the ascending and descending may be continuously performed.
(基板反轉順序) (substrate reverse order)
接著，說明在具有以上構成之基板反轉裝置100之基板W之反轉順序。圖8及圖9係依序顯示在基板反轉裝置100基板W反轉之樣子之圖。此外， 圖8主要顯示基板反轉裝置100開始動作當初之樣子，圖9主要顯示基板W之反轉連續進行之正常狀態。 Next, the reverse sequence of the substrate W of the substrate inverting apparatus 100 having the above configuration will be described. 8 and 9 are views sequentially showing the state in which the substrate W of the substrate inverting device 100 is reversed. In addition, Fig. 8 mainly shows the state in which the substrate inverting device 100 starts to operate, and Fig. 9 mainly shows the normal state in which the inversion of the substrate W is continuously performed.
說明上，為了方便，如圖8(a)所示，一對保持臂群從基板交接位置上升，且從處於水平姿勢之狀態進行。在上述狀態，首先，在第1搬送裝置300A之第1單位搬送部301A之上，載置以第1刻劃裝置200A刻劃處理後之基板W(W1)。上述基板W1，如箭頭AR1所示，藉由第1單位搬送部301A往+Y方向搬送。 In the description, for convenience, as shown in FIG. 8( a ), the pair of holding arm groups are lifted from the substrate transfer position and are in a state of being in a horizontal posture. In the above-described state, first, the substrate W (W1) which has been subjected to the first scribing device 200A scribing process is placed on the first unit transport unit 301A of the first transport apparatus 300A. The substrate W1 is transported in the +Y direction by the first unit transport unit 301A as indicated by an arrow AR1.
接著，在基板W1往第1單位搬送部301A之+Y側端部側搬送為止之期間，如圖8(b)中箭頭AR2所示，一對保持臂群朝向基板交接位置下降。亦即，在第1搬送裝置300A之基板W1之搬送與一對保持臂群之下降大致同時(同時並行)進行。此有助於在基板處理系統1000之基板反轉處理之效率化。 Then, while the substrate W1 is being transported to the +Y side end side of the first unit transport unit 301A, as shown by an arrow AR2 in FIG. 8(b), the pair of holding arm groups are lowered toward the substrate transfer position. In other words, the transfer of the substrate W1 of the first transfer device 300A and the lowering of the pair of holding arm groups are performed substantially simultaneously (in parallel). This contributes to the efficiency of substrate inversion processing in the substrate processing system 1000.
一對保持臂群到達基板交接位置後，如圖8(c)所示，配置在保持臂102A之吸附墊103之下端部與基板W1之上面接觸。此外，圖8(c)顯示與圖3相同之狀況。如上述，在吸附墊103與基板W1接觸之狀態下，藉由使吸引泵140作動，使基板W吸附保持於吸附墊103。 After the pair of holding arm groups reach the substrate transfer position, as shown in FIG. 8(c), the lower end portion of the adsorption pad 103 disposed on the holding arm 102A is in contact with the upper surface of the substrate W1. Further, Fig. 8(c) shows the same situation as Fig. 3. As described above, in a state where the adsorption pad 103 is in contact with the substrate W1, the substrate W is adsorbed and held by the adsorption pad 103 by the suction pump 140 being activated.
此外，此時，保持臂102B位於單位搬送部301B之間，且其吸附墊103之上端之高度位置與單位搬送部301B之高度位置相同。 Further, at this time, the holding arm 102B is located between the unit conveying portions 301B, and the height position of the upper end of the suction pad 103 is the same as the height position of the unit conveying portion 301B.
上述吸附保持進行後，接著，驅動旋轉驅動手段130使軸101旋轉，藉此如圖8(d)中箭頭RT1所示，一對保持臂群順時針旋轉，反轉180度。藉此，保持臂102A在以吸附墊103吸附保持基板W1之狀態下旋轉。另一方面，保持臂102B一邊旋轉一邊通過第1搬送裝置300A之單位 搬送部301B之間隙。與上述旋轉同時，如箭頭AR3所示，使一對保持臂群上升。 After the adsorption holding is performed, the rotation driving means 130 is driven to rotate the shaft 101, whereby the pair of holding arm groups rotate clockwise and reverse 180 degrees as indicated by an arrow RT1 in Fig. 8(d). Thereby, the holding arm 102A rotates in a state in which the substrate W1 is adsorbed and held by the adsorption pad 103. On the other hand, the holding arm 102B passes through the unit of the first conveying device 300A while rotating. The gap between the transport units 301B. Simultaneously with the above rotation, as shown by the arrow AR3, the pair of holding arm groups are raised.
圖9(a)所示者為一對保持臂群反轉180度且一對保持臂群上升後之樣子。此時，基板W1為藉由較軸101位於+Y側之保持臂102A從下方吸附保持之狀態。亦即，為與一開始配置在第1搬送裝置300A之狀態反轉180度之狀態。此外，在較軸101靠-Y側，在保持臂102B與第1單位搬送部301A之間產生間隙。 The one shown in Fig. 9(a) is a state in which the pair of holding arm groups are reversed by 180 degrees and the pair of holding arm groups are raised. At this time, the substrate W1 is in a state of being sucked and held from below by the holding arm 102A on the +Y side of the relatively axial axis 101. In other words, the state is reversed by 180 degrees from the state in which the first transfer device 300A is initially placed. Further, a gap is formed between the holding arm 102B and the first unit conveying portion 301A on the -Y side of the smaller shaft 101.
又，圖9(a)所示之狀態實現前之期間，在第1搬送裝置300A之第1單位搬送部301A之上，接續基板W1載置以第1刻劃裝置200A刻劃處理後之基板W(W2)。上述基板W2，如箭頭AR4所示，藉由第1單位搬送部301A往+Y方向搬送。 In the first unit transfer unit 301A of the first transfer device 300A, the substrate after the first scribing device 200A is scribed by the first scribing device 200A is placed on the subsequent substrate W1 in the period before the state shown in Fig. 9(a) is realized. W (W2). The substrate W2 is transported in the +Y direction by the first unit transport unit 301A as indicated by an arrow AR4.
在基板W2往第1單位搬送部301A之+Y側端部側搬送後，如圖9(b)中箭頭AR5所示，一對保持臂群朝向基板交接位置下降。此等基板W2之搬送與一對保持臂群之下降，與基板W1之搬送時相同，同時並行進行，因此有助於在本實施形態之基板處理系統1000之基板反轉處理之效率化。 After the substrate W2 is transported to the +Y side end side of the first unit transport unit 301A, as shown by an arrow AR5 in FIG. 9(b), the pair of holding arm groups are lowered toward the substrate transfer position. The transport of the substrate W2 and the lowering of the pair of holding arm groups are performed in parallel as in the case of transporting the substrate W1, which contributes to the efficiency of the substrate inversion processing of the substrate processing system 1000 of the present embodiment.
一對保持臂群到達基板交接位置後，如圖9(c)所示，被吸附墊103從下方支承之基板W1之下面與第2搬送裝置300B之單位搬送部301B接觸。在取得上述接觸狀態之時點，解除吸附墊103進行之基板W1之吸附保持。藉此，實現基板W1載置於單位搬送部301B上之狀態。上述載置實現後，單位搬送部301B立刻如箭頭AR6所示，將基板W1往+Y側之端部搬送。被搬送之基板W1往第2刻劃裝置200B搬出。亦即，被基板 反轉裝置100反轉180度之基板W供應至第2刻劃裝置200B進行之刻劃處理。 After the pair of holding arm groups reach the substrate transfer position, as shown in FIG. 9(c), the lower surface of the substrate W1 supported by the adsorption pad 103 from below is in contact with the unit transfer portion 301B of the second transfer device 300B. When the contact state is obtained, the adsorption holding of the substrate W1 by the adsorption pad 103 is released. Thereby, the state in which the substrate W1 is placed on the unit transfer unit 301B is realized. After the above-described placement is completed, the unit transport unit 301B immediately transports the substrate W1 to the end portion on the +Y side as indicated by an arrow AR6. The transferred substrate W1 is carried out to the second scribing device 200B. Substrate The substrate W of the inversion device 100 reversed by 180 degrees is supplied to the scoring process performed by the second scribing device 200B.
另一方面，在較軸101靠-Y側，實現配置在保持臂102B之吸附墊103之下端部與基板W2之上面接觸之狀態。在對基板W1之吸附保持之解除與往+Y側之搬送進行後之時點，吸引泵140再次作動後，使基板W2吸附保持於吸附墊103。 On the other hand, on the -Y side of the lower shaft 101, a state in which the lower end portion of the adsorption pad 103 of the holding arm 102B is in contact with the upper surface of the substrate W2 is realized. After the suction holding of the substrate W1 is released and the transfer to the +Y side is performed, the suction pump 140 is again operated, and the substrate W2 is adsorbed and held by the adsorption pad 103.
上述吸附保持可在保持臂102A之吸附解除及接續之第2搬送裝置300B之基板W之搬送後立刻進行，因此在基板反轉裝置100，反轉處理後之基板W往第2搬送裝置300B之交接與下一個作為反轉對象之基板W之吸附保持可作為一連串之連續動作大致同時地(無時間滯後)進行。 The adsorption holding can be performed immediately after the adsorption of the holding arm 102A and the transfer of the substrate W of the second transfer device 300B, so that the substrate inverting device 100 reverses the substrate W to the second transfer device 300B. The adsorption holding of the substrate W and the next substrate W as the object of reversal can be performed substantially simultaneously (without time lag) as a series of continuous operations.
上述吸附保持進行後，接著，再次驅動旋轉驅動手段130使軸101旋轉，藉此如圖9(d)中箭頭RT2所示，一對保持臂群順時針旋轉，反轉180度。於是，保持臂102B在保持基板W2之狀態下旋轉。同時，如箭頭AR7所示，使一對保持臂群上升。 After the adsorption holding is performed, the rotation driving means 130 is again driven to rotate the shaft 101, whereby the pair of holding arm groups rotate clockwise and reverse 180 degrees as indicated by an arrow RT2 in Fig. 9(d). Then, the holding arm 102B rotates while holding the substrate W2. At the same time, as shown by the arrow AR7, the pair of holding arm groups are raised.
之後，在一對保持臂群上升之時點，除了保持臂102A與保持臂102B交替以外，實現與圖9(a)相同之狀態。因此，之後，若反覆圖9(a)~圖9(d)所示之順序，則從第1刻劃裝置200A搬入之基板W依序反轉，可供應至第2刻劃裝置200B進行之刻劃處理。 Thereafter, at the time when the pair of holding arm groups are raised, the same state as that of FIG. 9(a) is realized except that the holding arm 102A and the holding arm 102B are alternated. Therefore, when the order shown in FIG. 9(a) to FIG. 9(d) is repeated, the substrate W carried in from the first scribing device 200A is sequentially reversed, and can be supplied to the second scribing device 200B. Scoring.
如以上說明，根據本實施形態之基板處理系統，可大致同時進行欲反轉基板之搬入動作與該基板之保持動作。又，可大致同時進行下一個欲反轉基板之搬入、先前反轉處理後之基板之交接、保持臂對已搬入基板進行之吸附保持。概略觀之，本實施形態之基板處理系統，大致同時 進行基板之反轉與下一個欲反轉基板之搬入。藉此，可實現反轉處理效率優異之基板處理系統。 As described above, according to the substrate processing system of the present embodiment, the loading operation of the substrate to be reversed and the holding operation of the substrate can be performed substantially simultaneously. Further, the next substrate to be reversed, the substrate after the previous inversion processing, and the holding and holding of the holding substrate by the holding arm can be performed substantially simultaneously. In summary, the substrate processing system of the present embodiment is substantially simultaneously The inversion of the substrate and the advancement of the substrate to be reversed are performed. Thereby, a substrate processing system excellent in reverse processing efficiency can be realized.
(變形例) (Modification)
上述實施形態中，搬送裝置300之單位搬送部301構成為帶式輸送機，但單位搬送部301之構成並不限於此。圖10係變形例之包含搬送裝置300之基板處理系統1000之基板反轉裝置100附近之YZ側視圖。 In the above embodiment, the unit conveying unit 301 of the conveying device 300 is configured as a belt conveyor, but the configuration of the unit conveying unit 301 is not limited thereto. FIG. 10 is a YZ side view of the vicinity of the substrate inverting device 100 of the substrate processing system 1000 including the transfer device 300 according to a modification.
在圖10所示之基板處理系統1000，單位搬送部301具備在Y軸方向分離配置之複數個滾筒302。上述滾筒302藉由未圖示之驅動手段旋轉驅動亦可，或者為藉由在基板W接觸之狀態下移動而驅動之從動滾輪亦可。若為前者之情形，在載置有基板W之狀態下藉由驅動手段使滾輪302旋轉，藉此可將基板W搬送至所欲位置。若為後者之情形，藉由例如移載裝置400等保持基板W並同時移動時，與基板W背面接觸之滾輪302旋轉，藉此輔助基板W之搬送。 In the substrate processing system 1000 shown in FIG. 10, the unit transfer unit 301 includes a plurality of rollers 302 that are disposed apart from each other in the Y-axis direction. The drum 302 may be rotationally driven by a driving means (not shown) or may be a driven roller that is driven by movement of the substrate W. In the case of the former, the roller 302 is rotated by the driving means while the substrate W is placed, whereby the substrate W can be transported to a desired position. In the latter case, when the substrate W is held while moving, for example, by the transfer device 400 or the like, the roller 302 that is in contact with the back surface of the substrate W is rotated, thereby assisting the conveyance of the substrate W.
又，上述實施形態中，各保持臂102雖以從軸101直接延伸之形態設置，但替代此，在軸101之周圍具備與軸一體地旋轉之框架，將保持臂102設置在該框架之形態亦可。 Further, in the above-described embodiment, each of the holding arms 102 is provided to extend directly from the shaft 101. Alternatively, the frame 101 is provided with a frame that rotates integrally with the shaft around the shaft 101, and the holding arm 102 is provided in the frame. Also.
又，上述實施形態中，各保持臂102設成在長邊方向之寬度及厚度均勻且與長邊方向垂直之剖面為矩形狀，但保持臂102之形狀並不限於此。例如，具有愈朝向長邊方向前端部厚度愈小之形狀等亦可。 Further, in the above-described embodiment, each of the holding arms 102 has a rectangular shape in which the width and thickness in the longitudinal direction are uniform and perpendicular to the longitudinal direction, but the shape of the holding arm 102 is not limited thereto. For example, the shape having a smaller thickness toward the distal end portion in the longitudinal direction may be used.
100‧‧‧基板反轉裝置 100‧‧‧Substrate reversal device
101a‧‧‧突緣部 101a‧‧‧Front Department
101b‧‧‧筒狀部 101b‧‧‧Cylinder
102,102A,102B‧‧‧保持臂 102,102A, 102B‧‧‧ Keep arm
103‧‧‧吸附墊 103‧‧‧Adsorption pad
110‧‧‧腳部 110‧‧‧foot
120‧‧‧軸支承部 120‧‧‧ shaft support
301,301A,301B‧‧‧單位搬送部 301,301A, 301B‧‧‧Unit Transfer Department
W‧‧‧基板 W‧‧‧Substrate
Claims (5)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2013043127A JP6064684B2 (en) | 2013-03-05 | 2013-03-05 | Substrate processing system and substrate inversion apparatus |
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| TW201436087A TW201436087A (en) | 2014-09-16 |
| TWI571954B true TWI571954B (en) | 2017-02-21 |
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| TW103102243A TWI571954B (en) | 2013-03-05 | 2014-01-22 | Substrate processing system and substrate reversing device |
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| JP (1) | JP6064684B2 (en) |
| KR (1) | KR101830598B1 (en) |
| CN (1) | CN104030558B (en) |
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| CN107429386B (en) * | 2015-04-15 | 2019-09-27 | 株式会社爱发科 | The keeping method of substrate holding mechanism, film formation device and substrate |
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| KR101991267B1 (en) * | 2017-11-23 | 2019-06-20 | 주식회사 탑 엔지니어링 | Apparatus for cutting substrate |
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Also Published As
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| KR101830598B1 (en) | 2018-02-22 |
| CN104030558B (en) | 2018-09-28 |
| CN104030558A (en) | 2014-09-10 |
| TW201436087A (en) | 2014-09-16 |
| JP2014169177A (en) | 2014-09-18 |
| KR20140110711A (en) | 2014-09-17 |
| JP6064684B2 (en) | 2017-01-25 |
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