CN108218215A - Cutter for substrate - Google Patents
Cutter for substrate Download PDFInfo
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- CN108218215A CN108218215A CN201711338426.8A CN201711338426A CN108218215A CN 108218215 A CN108218215 A CN 108218215A CN 201711338426 A CN201711338426 A CN 201711338426A CN 108218215 A CN108218215 A CN 108218215A
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- China
- Prior art keywords
- substrate
- cutter
- plate
- belt
- axis
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The present invention provides a kind of cutter for substrate, including：Aligned units are used for the position for the substrate for determining to be sent into from outside；First cutter unit is respectively formed the first axle cutting line and the second axis cutting line for being parallel to X-direction in the first face of the substrate and the second face；Second cutter unit is formed in parallel with the first Y-axis cutting line of Y direction in the first face of the substrate；Substrate roll-over unit is used to overturn the substrate for being formed with the first Y-axis cutting line；And third cutter unit, the second Y-axis cutting line of Y direction is formed in parallel in the second face of the substrate.
Description
Technical field
The present invention relates to a kind of cutter for substrate, are used for cutting substrate.
Background technology
It is commonly used for the liquid crystal display panel, organic EL display panel, inorganic EL of flat-panel monitor
Display pannel, transmission projection substrate, reflective projection substrate etc. use unit glass panel (hereinafter referred to as " unit substrate "), institute
It is by will such as glass brittleness mother glass panel (hereinafter referred to as " substrate ") be cut to predetermine sizes to state unit glass panel
And it obtains.
The process of cutting substrate includes：Dicing processes and sliver process, the dicing processes are along desire cutting substrate
Preset lines press and move by as made of the materials such as diamond score wheel come formed scribing line, and the sliver process be by along
Scribing line pressing substrate carrys out cutting substrate with obtaining unit substrate.
It as a result, for cutting substrate, needs that dicing processes and sliver process is individually performed, ask there is process is increased
Topic.
【Existing technical literature】
【Patent document】
KR published patent the 10-2007-0070824th (2007.07.04).
Invention content
It, can be with present invention aims at providing a kind of cutter for substrate in order to solve above-mentioned the problems of the prior art
Cutting substrate dicing processes and sliver process need not be individually performed.
In order to achieve the above object, the present invention provides a kind of cutter for substrate, and feature is, including：Aligned units,
It is used for the position for the substrate for determining to be sent into from outside；First cutter unit, in the first face of the substrate and the second face point
It is not formed in parallel with the first X-axis cutting line and the second X-axis cutting line of X-direction；Second cutter unit, in the substrate
First face is formed in parallel with the first Y-axis cutting line of Y direction；Substrate roll-over unit, is used to overturn and is formed with the first Y-axis and cuts
The substrate of secant；And third cutter unit, the second Y-axis cutting of Y direction is formed in parallel in the second face of the substrate
Line.
The aligned units include：Multiple belts extend to Y direction and separate at a predetermined interval in the X-axis direction
Setting；Belt lifting gear connect with the multiple belt and lifts the multiple belt；Multiple flotation gears, setting
The substrate is floated between the multiple belt；Pressue device is used to pressurize what is floated by the multiple flotation gear
The side of the substrate.
First cutter unit includes：To extended first framework of X-direction；At least a pair of first head, can be to X
Axis direction is movably set to first framework, also, at least a pair of first head is set opposite each other, it is described at least
A pair of first head includes：It is spaced apart in the Z-axis direction and is respectively provided with the first cutting wheel module of cutting wheel and second cuts
Cut wheel module；It is spaced apart and is respectively provided with the first roller module and the second roller module of roller in the Z-axis direction, described
The roller of the cutting wheel and second roller module of one cutting wheel model block is mutually aligned setting, the cutting of the second cutting wheel module
Wheel and the roller of first roller module are mutually aligned setting.
The cutting wheel of the cutting wheel of the first cutting wheel module and the second cutting wheel module separates in the Y-axis direction
Setting.
Second cutter unit includes：Second framework extends to X-direction and is moved to Y direction；Second
Portion can movably be set to the second framework to X-direction, and have cutting wheel；Belt is used to support the substrate；
And support plate, the lower section of the belt can be movably set to Z-direction, when the cutting wheel stresses on the substrate
The belt is supported to support the substrate.
The substrate roll-over unit includes：Multiple belts, are provided spaced in X-direction；Supporting table, to Z axis
Direction extends；First adsorption plate has the first adsorption nozzle；Second adsorption plate has the second adsorption nozzle；Adsorption plate liter
Falling unit moves first adsorption plate and second adsorption plate along the supporting table to Z-direction；And adsorption plate rotation
Rotary device, for rotating first adsorption plate and the second adsorption plate.
First adsorption plate and second adsorption plate are provided spaced in the Z-axis direction, so as to the substrate position
Between first adsorption plate and second adsorption plate, the first adsorption nozzle of first adsorption plate and described second is inhaled
Second adsorption nozzle of attached plate is set opposite each other.
The third cutter unit includes：Third framework extends to X-direction and is moved to Y direction；Third head,
It can movably be set to the third framework to X-direction, and have cutting wheel；Belt is used to support the substrate；And branch
Fagging can movably be set to the lower section of the belt to Z-direction, be supported when the cutting wheel stresses on the substrate
The belt supports the substrate.
Cutter for substrate in the embodiment of the present invention, further includes：First transfer unit is set to the aligned units
Between first cutter unit, for the substrate to be transferred to first cutter unit from aligned units；And second
Transfer unit is set between first cutter unit and second cutter unit, by the substrate from described first
Cutter unit is transferred to second cutter unit.
Second transfer unit includes：It is used to support the plate of the substrate；Belt, with the one Y-axis side in the same direction of plate
The substrate is transferred to movement.
Invention effect
Cutter for substrate in embodiment present invention as described above, multiple cutting lines, i.e. the first X-axis cutting line XL1
And the second X-axis cutting line XL2, the first Y-axis cutting line YL1, the second Y-axis cutting line YL2 are single by the first cutting set gradually
First 200, second cutter unit 300 and third cutter unit 500 sequentially form, so as to cutting substrate S.Therefore, in order to cut
Substrate and the prior art of dicing processes and sliver process is individually performed compared to process number is reduced, so as to improve cutting
The efficiency of substrate.
Description of the drawings
Fig. 1 is the module map that outline represents cutter for substrate in the embodiment of the present invention.
Fig. 2 is the generalized schematic for the substrate for representing to be cut by the cutter for substrate in the embodiment of the present invention.
Fig. 3 is the side view that outline represents the aligned units of cutter for substrate in the embodiment of the present invention.
Fig. 4 is the vertical view that outline represents the aligned units of cutter for substrate in the embodiment of the present invention.
Fig. 5 is the side view that outline represents the aligned units of cutter for substrate in the embodiment of the present invention.
Fig. 6 be outline represent the first transfer unit of cutter for substrate in the embodiment of the present invention, the first cutter unit and
The vertical view of second transfer unit.
Fig. 7 and Fig. 8 is that outline represents that the first transfer unit of cutter for substrate in the embodiment of the present invention, the first cutting are single
The side view of member and the second transfer unit.
Fig. 9 is the side view that outline represents the presser unit of the first transfer unit of cutter for substrate in the embodiment of the present invention
Figure.
Figure 10 to Figure 20 is to represent the first transfer unit of cutter for substrate in the embodiment of the present invention, the first cutting successively
The schematic diagram of the operational process of unit and the second transfer unit.
Figure 21 is the second transfer unit and the second cutter unit that outline represents cutter for substrate in the embodiment of the present invention
Side view.
Figure 22 to Figure 24 is that outline represents the second transfer unit of the cutter for substrate from the embodiment of the present invention to second
The schematic diagram of the process of cutter unit transferring substrates.
Figure 25 is the vertical view that outline represents the second cutter unit of cutter for substrate in the embodiment of the present invention.
Figure 26 is that outline represents the second cutter unit of cutter for substrate and substrate roll-over unit in the embodiment of the present invention
Side view.
Figure 27 to Figure 32 is that the operation of the substrate roll-over unit of cutter for substrate in the embodiment of the present invention illustrates schematic diagram.
Figure 33 is that outline represents the substrate roll-over unit of cutter for substrate and third cutter unit in the embodiment of the present invention
Side view.
Figure 34 is the vertical view that outline represents the third cutter unit of cutter for substrate in the embodiment of the present invention.
Reference numeral：
100：Aligned units 200：First cutter unit
300：Second cutter unit 400：Substrate roll-over unit
500：Third cutter unit 600：First transfer unit
700：Second transfer unit S：Substrate
S1：First face S2：Second face.
Specific embodiment
Hereinafter, the cutter for substrate in the embodiment of the present invention is illustrated with reference to attached drawing.
The object cut by cutter for substrate in the embodiment of the present invention is that first substrate and second substrate are bonded and are formed
Adhesive substrates.For example, first substrate can include thin film transistor (TFT), second substrate can include colour filter or opposite
Structure.Hereinafter, adhesive substrates are referred to as substrate, the surface for the first substrate being externally exposed is known as the first face, by exposure
It is known as the second face in the surface of Wai Bu second substrate.
Also, the transfer direction for the substrate for performing substrate cut process is defined as Y direction, with base plate transfer direction (Y
Axis direction) intersect (for example, orthogonal) direction be defined as X-direction.Also, it will be perpendicular to the side of the X-Y plane of substrate setting
To being defined as Z-direction.
As shown in Figures 1 and 2, cutter for substrate includes in the embodiment of the present invention：Aligned units 100 are determined from outer
The position for the substrate that portion enters；First cutter unit 200 is respectively formed parallel in the first face S1 and the second face S2 of substrate S
In the first X-axis cutting line XL1 and the second X-axis cutting line XL2 of X-direction；Second cutter unit 300, the first of substrate S
Face S1 is formed in parallel with the first Y-axis cutting line YL1 of Y direction；Substrate roll-over unit 400 is formed with the first Y-axis for overturning
The substrate S of cutting line YL1；Third cutter unit 500 is formed in parallel with the second Y-axis of Y direction in the second face S2 of substrate S
Cutting line YL2；First transfer unit 600 is set between 100 and first cutter unit 200 of aligned units, by substrate from right
Quasi- unit 100 is transferred to the first cutter unit 200；Second transfer unit 700 is set to the first cutter unit 200 and second
Between cutter unit 300, substrate is transferred to the second cutter unit 300 from the first cutter unit 200.
Aligned units 100, the first cutter unit 200, the second cutter unit 300, substrate roll-over unit 400, third cutting
Unit 500 is parallel to surface water level land and is arranged in a row.Therefore, substrate S is along aligned units 100, the first cutter unit 200,
Two cutter units 300, substrate roll-over unit 400, the transfer of 500 horizontal continuity of third cutter unit, substrate S is cut in the process
It cuts.
As shown in Fig. 2, the cutter for substrate in the embodiment of the present invention is distinguished in the first face S1 and the second face S2 of substrate S
The first X-axis cutting line XL1 and the second X-axis cutting line XL2 is formed, the first Y-axis cutting line YL1 is formed in the first face S1 of substrate S
Upset substrate S afterwards forms the second Y-axis cutting line YL2, so as to which substrate S is cut into unit substrate in the second face S2 of substrate S.
As shown in Figures 3 to 5, aligned units 100 include：Multiple belts 110, the direction (Y-axis transferred to substrate S
Direction) extend, and be spaced apart at a predetermined interval in the X-axis direction；Belt lifting gear 120 is connect with multiple belts 110
And lift multiple belts 110；Multiple flotation gears 130 are set between multiple belts 110, for floating substrate S；Pressurization
Device 140, for pressurizeing by the side of the substrate S of multiple 130 floats of flotation gear.
Multiple belts 110 are supported respectively by multiple belt wheels 111.At least one of multiple belt wheels 111, which are to provide, to be used for
Rotate the driving pulley of the driving force of belt 110.
Belt lifting gear 120 can be the actuator, the root that are run by air pressure or oil pressure being connect with multiple belt wheels 111
According to the linear motor of electromagnetic interaction operation or ball screw device isoline movement equipment.
Multiple flotation gears 130 can include the multiple gas nozzles 131 being connect with gas supply source (not shown).It is multiple
Gas nozzle 131 is spaced apart at a predetermined interval in the Y-axis direction.
Pressue device 140 includes：Pressing member 141, for the side for the substrate S that pressurizes；Pressing member mobile device 142,
It moves pressing member 141 to the direction in the direction towards substrate S and separate substrate S.Multiple pressing members 141 are configured to
Enough mutual at least two opposite sides of pressurization substrate S.The shape of pressing member 141 and the side of substrate S are correspondingly formed, with
Convenient for the side for the substrate S that presses.Another example, the shape of pressing member 141 is correspondingly formed with the corner portion of substrate S, in order to apply
Press the corner portion of substrate S.
According to constituted above, as shown in figure 3, during substrate S is fed through aligned units 100 from outside, multiple bands
Son 110 maintains the state risen from multiple flotation gears 130.Also, with the rotation of multiple belts 110, substrate S may be moved
It moves to the precalculated position between multiple pressing members 141.
Also, as shown in Figures 4 and 5, substrate S is moved to the precalculated position on multiple belts 110, then multiple belts 110
Gas nozzle 131 sprays gas to substrate S while decline, and substrate S is floated under the action of gas is sprayed.
Also, in the state of substrate S floatings, pressing member 141 pressurizes under the operating of pressing member mobile device 142
The side of substrate S, as a result, substrate S translated or rotated and determined position and the posture of substrate S.
After being determined in the position of substrate S and posture, while gas nozzle 131 interrupts gas injection on multiple belts 110
It rises, therefore, substrate S is supported in the state of being determined in its position by multiple belts 110.
In addition, according to the rotation of multiple belts 110, substrate S is sent out from aligned units 100, at the same time, the first sheet
Member 600 runs and substrate S is transferred to the first cutter unit 200.
As shown in Figures 6 to 9, the first transfer unit 600 includes：Multiple belts 610, are used to support substrate S；Shuttle unit
620, it is set between 100 and first cutter unit 200 of aligned units and adsorbs and transfer substrate S；First holding unit 630,
For holding the rear row end for being supported on the substrate S on multiple belts 610；First guide rail 640 connects with the first holding unit 630
It connects and extends to Y direction；Presser unit 650 presses the rear row end of substrate S when substrate S is fed through on multiple belts 610
And it is directed at substrate S；First plate 660 is adjacent to the first cutter unit 200 and sets, for floating or adsorbing and supporting substrate S.
The separated from each other setting in the X-axis direction of multiple belts 610.Each belt 610 is supported by multiple belt wheels 611, more
At least one of a belt wheel 611 can be to provide the driving pulley of the driving force of rotation belt 610.
Multiple belts 610 of first transfer unit 600 are adjacent to multiple belts 110 of aligned units 100 and are set to same
In one plane, substrate S can be transferred directly to multiple bands of the first transfer unit 600 from multiple belts 110 of aligned units 100
Son 610.
As shown in fig. 6, shuttle unit 620 includes to the extended guide rail 621 of Y direction, can be worn along what guide rail 621 moved
Shuttle component 622, the shuttle component lifting gear 623 for lifting shuttle component 622 to Z-direction.
The actuator run by air pressure or oil pressure can be set between shuttle component 622 and guide rail 621, according to electromagnetism phase
The linear motor of interaction operation or ball screw device isoline movement equipment.Shuttle component 622 can pass through straight line as a result,
Mobile equipment is moved along guide rail 621 to Y direction.
Guide rail 621 extends to aligned units 100, and shuttle component 622 can be moved to first from aligned units 100 as a result,
Transfer unit 600.
Shuttle component 622 is connect with vacuum source carrys out sorbing substrate S.As a result, as shuttle component 622 is sorbing substrate S's
It is moved under state to Y direction, substrate S can be moved to Y direction.
Shuttle component 622 moves back and forth between 100 and first transfer unit 600 of aligned units, performs substrate S from right
Quasi- unit 100 is transferred to the effect of the first transfer unit 600.
Shuttle component lifting gear 623 can include shuttle component 622 and the actuator, the root that are run by air pressure or oil pressure
According to the linear motor of electromagnetic interaction operation or ball screw device isoline movement equipment.When transferring substrate S, shuttle portion
Part lifting gear 623 rises shuttle component 622 so that 622 sorbing substrate S of shuttle component.Also, substrate S is by shuttle component 622
After being transferred to the first transfer unit 600, shuttle component lifting gear 623 decline shuttle component 622 prevent shuttle component 622 with
Substrate S, 652 and first holding unit 630 of propeller interfere with each other.
Can be provided between first holding unit 630 and the first guide rail 640 air pressure or oil pressure operation actuator,
Linear motor or ball screw device isoline the movement equipment run according to electromagnetic interaction.Therefore, it is held first single
In a state that member 630 holds substrate S, the first holding unit 630 is moved by the equipment that moves linearly to Y direction, and substrate S can be with
It is transferred to Y direction.At this point, the movement of multiple belts 610 and the first holding unit 630 rotates together with, so as to stablize twelve Earthly Branches
Support group plate S.
First holding unit 630 includes to X-direction extending and be connected to the supporting rod 631 of the first guide rail 640 and more
A holding component 632 for being set to supporting rod 631 and holding substrate S.Holding component 632 can be pressurization and maintain substrate S
Fixture.Another example, holding component 632 can have the vacuum hole being connect with vacuum source and carry out sorbing substrate S.
Presser unit 650 include to the extended guide rail 651 of Y direction, can along the propeller 652 that guide rail 651 moves and
The propeller lifting gear 653 that propeller 652 is lifted to Z-direction.
The actuator of air pressure or oil pressure operation can be provided between propeller 652 and guide rail 651, according to electromagnetism phase
The linear motor of interaction operation or ball screw device isoline movement equipment.Propeller 652 can be moved by straight line as a result,
Dynamic device is moved along guide rail 651 to Y direction.
Propeller lifting gear 653 may include the actuator, the root that are run by air pressure or oil pressure being connect with propeller 652
According to the linear motor of electromagnetic interaction operation or ball screw device isoline movement equipment.Propeller lifting gear 653 is logical
It crosses ascent propulsion device 652 and so that propeller 652 presses to the rear row end of substrate S, propeller 652 applies the rear row end of substrate S
653 descent propulsion device 652 of propeller lifting gear after pressure, so as to prevent propeller 652 and substrate S, shuttle component 622 and first
Holding unit 630 interferes.
In a state that substrate S is located on multiple belts 610, presser unit 650 promotes the rear row end of substrate S so that base
Plate S is located at accurate position P.
As another example, during the holding transferred to Y direction in advance of 622 sorbing substrate S of shuttle component, substrate S
Rear row end by propeller 652 when, propeller 652 is mobile and be contacted with the speed fast compared to the movement speed of substrate S
Behind the rear row end of substrate S, propeller 652 can be synchronous with the movement speed of substrate S driven by shuttle component 622, with substrate S
Identical speed movement.
As another example, during substrate S is transferred according to the rotation of multiple belts 610 to Y direction, propeller
After 652 are contacted with the rear row end of substrate S with the movement speed fast compared to the movement speed of substrate S, propeller 652 and substrate S
Movement speed synchronize, moved with the speed identical with substrate S.
By propeller 652 as described above, substrate S can be located at accurate position on belt 610 without moving reelingly
It puts.
First plate 660 can float or sorbing substrate S.For example, could be formed with can be with gas on the surface of the first plate 660
Source of supply and multiple groove portions of vacuum source connection.When gas is supplied to multiple groove portions of the first plate 660 from gas supply source, base
Plate S can be floated from the first plate 660.Also, gas is sucked into multiple groove portions of the first plate 660 under the action of vacuum source
When, substrate S is adsorbed by the first plate 660.
In substrate S in the state of the floating of the first plate 660, substrate S can be with the first plate 660 without frictionally moving.Also,
During the first face S1 and the second face S2 of substrate S form the first X-axis cutting line XL1 and the second X-axis cutting line XL2, base
Plate S is adsorbed and is fixed on the first plate 660.
Such as Fig. 6 to Fig. 8, the first cutter unit 200 is respectively formed the first X-axis in the first face S1 and the second face S2 of substrate S
Cutting line XL1 and the second X-axis cutting line XL2.
First cutter unit 200 includes to extended first framework 210 of X-direction and can movably be set to X-direction
In the first head 220 of the first framework 210.First framework 210 can have multiple first heads 220 in the X-axis direction.
Also, at least a pair of first head 220 is set to the first framework 210 opposite to each other in the Z-axis direction.
At least a pair of first head 220 includes：First cutting wheel module and the second cutting wheel module 221, in Z-direction
On be spaced apart, and have cutting wheel 225 respectively；First roller module and the second roller module 222, separate in Z-direction
Setting, and have roller 229 respectively.
The cutting wheel 225 of first cutting wheel module 221 is aligned setting with the roller 229 of the second roller module 222, and second cuts
The cutting wheel 225 for cutting wheel module 221 is aligned setting with the roller 229 of the first roller module 222.
The roller 229 of 225 and first roller module of cutting wheel of first cutting wheel module 221 can apply pressure to the first face
S1, the roller 229 of 225 and second roller module of cutting wheel of the second cutting wheel module 221 can apply pressure to the second face S2.
Therefore, the state of the first face S1 and the second face S2 is applied pressure to respectively in multiple cutting wheels 225 and multiple rollers 229
Under, the first head 220 is moved relative to substrate S to X-direction so that is respectively formed the first X in the first face S1 and the second face S2
Axis cutting line XL1 and the second X-axis cutting line XL2.
Also, the cutting wheel 225 of the 225 and second cutting wheel module 221 of cutting wheel of the first cutting wheel module 221 can be
It is separated in Y direction, the roller 229 of 229 and second roller module 222 of roller of the first roller module 222 can be in Y direction
On separate.The first X-axis cutting line XL1 and the second X-axis cutting line XL2 can be provided spaced in the Y-axis direction as a result,.
As a result, as shown in Fig. 2, can form Y-axis stepped part YS after substrate S is cut, the Y-axis stepped part has phase
When in the first X-axis cutting line XL1 and the second X-axis cutting line XL2 distances spaced apart from each other in the Y-axis direction, this Y-axis stepped part
YS could be formed with wiring and/or the electrode connected with wiring etc..
Also, as shown in Fig. 6 to Figure 21, the cutter for substrate in the embodiment of the present invention further includes illusory elimination unit
900, it holds (useless positioned at the leading end margin of substrate S and illusory (dummy, discarded, useless) part of rear row end margin
Glass (cullet), that is, not as unit substrate, after dicing by discarded non-active area) and eliminate illusory portion from substrate S
Point.
Illusory elimination unit 900 can be arranged between the first transfer unit 600 and the second transfer unit 700.
Illusory elimination unit 900 includes：Fixture 910 is used to hold the non-active area of substrate S；Fixture driving device
920, vertically and horizontally fixture 910, and the rolling clamp 910 centered on trunnion axis (X-axis) and vertical axis (Y-axis).
Fixture 910 can include a pair of of the clamp member moved with moving or be spaced from each other with adjoining each other.Pass through a pair
Clamp member across substrate S it is adjacent to each other it is mobile, substrate S is held by clamp member.
For example, fixture driving device 920 can be the multi-spindle machining hand for the multiple arms for including connecting with fixture 910.
As shown in Fig. 6 to Figure 21, the second transfer unit 700 includes：Second plate 760 is adjacent to the first cutter unit 200
Setting is floated or is adsorbed and supporting substrate S；Belt 710 is connected to the second plate 760；Mobile device 730, is used in Y-axis
The second plate 760 and belt 710 are moved back and forth on direction.The effect of mobile device 730 is along to the extended guide rail of Y direction
720 move back and forth the second plate 760 and belt 710 in the Y-axis direction.It can be applicable in through air pressure or oil as mobile device 730
Actuator, the linear motor run according to electromagnetic interaction or the ball screw device isoline of operation is pressed to move equipment.
Also, the second transfer unit 700 can selectively include the lifting gear 740 for lifting belt 710.
Second plate 760 can be moved with belt 710 with a Y direction in the same direction.That is, the second plate 760 can be together with belt 710
To being parallel to, the direction (Y direction) that substrate S transferred is mobile.
First X-axis cutting line is respectively formed by first face S1 and second face S2 of first cutter unit 200 in substrate S
During XL1 and the second X-axis cutting line XL2, the second plate 760 is moved to the first plate 660, and the first head 220 can be located at the first plate 660
Between the second plate 760.First X-axis is respectively formed by first face S1 and second face S2 of first cutter unit 200 in substrate S
During cutting line XL1 and the second X-axis cutting line XL2, the second plate 760 is moved to the first plate 660, and substrate S is by the first plate 660 and second
Plate 760 is supported.
Belt 710 can be multiple, and multiple belts 710 can be provided spaced in the X-axis direction.Each belt 710
It is supported by multiple belt wheels 711, the driving of at least one driving force that can be to provide rotation belt 710 in multiple belt wheels 711
Belt wheel.
Second plate 760 can float or sorbing substrate S.For example, 760 surface of the second plate could be formed with and gas supply source
And multiple groove portions of vacuum source connection.When gas is supplied to multiple groove portions of the second plate 760 from gas supply source, substrate S can be with
It is floated from the second plate 760.Also, when gas is sucked into multiple groove portions of the second plate 760 under vacuum source effect, substrate S can be with
It is adsorbed in the second plate 760.
During substrate S is transferred to the second plate 760, gas is supplied to the groove portion of the second plate 760, as a result, substrate S
It can be with the second plate 760 without frictionally being moved.
The mistake of the first X-axis cutting line XL1 and the second X-axis cutting line XL2 is formed in the first face S1 and the second face S2 of substrate S
Cheng Zhong, substrate S are adsorbed and fixed by the second plates 760.
In substrate S from during the second plate 760 is moved to subsequent handling, gas is supplied to the groove portion of the second plate 760, by
This, substrate S can be with the second plate 760 without frictionally being moved.
Hereinafter, with reference to such as 10 to Figure 20, to the first transfer unit 600, the first cutter unit 200 and the second transfer unit
700 operation illustrates.
As shown in Figure 10, substrate S is transferred to the first cutter unit in the state that its dummy portions held in advance is not eliminated
200.At this point, substrate S can be floated under the action of the gas sprayed from the first plate 660 from the first plate 660.
Also, substrate S is adsorbed by the first plate 660 when substrate S is located on the first plate 660.At this point, the first cutting wheel module
And second cutting wheel module 221 cutting wheel 225 be contacted with substrate S respectively after, to X-direction move, as a result, substrate S's
Dummy portions form the first X-axis cutting line XL1 and the second X-axis cutting line XL2.
Also, as shown in FIG. 11 and 12, the illusory fixture 910 for eliminating unit 900, which is moved to, is formed with the cutting of the first X-axis
The dummy portions of the substrate S of line XL1 and the second X-axis cutting line XL2.Also, fixture 910 is held after the dummy portions of substrate S
It rotates or moves horizontally, so as to which dummy portions be eliminated from substrate S.The fixture 910 for eliminating dummy portions revert to and does not interfere the
The home position of the movement of the cutting wheel 225 of one cutting wheel model block and the second cutting wheel module 221.
Also, as shown in figure 13, in the state of the fixation of the first plate 660 second plate 760 towards the first plate 660 to Y-axis side
To movement.The interval between the first plate 660 and the second plate 760 reduces as a result, and substrate S is by 760 institute of the first plate 660 and the second plate
Support.
In addition, as shown in figure 14, substrate S is transferred to the second transfer unit 700.At this point, substrate S is supplied to the first plate
660 and second plate 760 gas under the action of, floated from the first plate 660 and the second plate 760.
Also, as shown in figure 15, substrate S be located at when on the first plate 660 and the second plate 760 substrate S by the first plate 660 and
Second plate 760 is adsorbed.At this point, the cutting wheel 225 of the first cutting wheel module and the second cutting wheel module 221 is contacted with base respectively
It is moved after plate S to X-direction, forms the first X-axis cutting line XL1 and the second X-axis cutting line XL2 in substrate S as a result,.
Also, as shown in FIG. 16 and 17, the first X-axis cutting line XL1 and the second X-axis cutting line XL2 is formed in substrate S
Afterwards, the cutting wheel 225 of the first cutting wheel module and the second cutting wheel module 221, which separates, is moved to substrate S.Also, in substrate S quilts
In the state of first plate 660 and the absorption of the second plate 760, the second plate 760 is moved far from the first plate 660, then substrate S is along first
X-axis cutting line XL1 and the second X-axis cutting line XL2 are separated.
Also, it behind the middle section for as shown in figure 18, separating substrate S, is not eliminated with the dummy portions at row end after substrate S
State, substrate S is transferred to the first cutter unit 200.At this point, under the action of the gas sprayed from the second plate 760, substrate
It can be floated from the second plate 760.
Furthermore substrate S is adsorbed by the second plate 760 when substrate S is located at the second plate 760.At this point, the first cutting wheel module
And second the cutting wheel 225 of cutting wheel module 221 be contacted with after substrate S to X-direction and move respectively, as a result, in the void of substrate S
If part forms the first X-axis cutting line XL1 and the second X-axis cutting line XL2.
Also, as shown in FIG. 19 and 20, the illusory fixture 910 for eliminating unit 900, which is moved to, is formed with the cutting of the first X-axis
The dummy portions of the substrate S of line XL1 and the second X-axis cutting line XL2.Also, after fixture 910 holds the dummy portions of substrate S, rotation
Turn or move horizontally and eliminate dummy portions from substrate S.The fixture 910 for eliminating dummy portions restores to original position without hindering the
The movement of the cutting wheel 225 of one cutting wheel model block and the second cutting wheel module 221.
In addition, as shown in figure 21, pass through along the first X-axis cutting line XL1 and the second X-axis cutting line XL2 substrate S divided
The rotation of multiple belts 710 is transferred to the second cutter unit 300.
At this point, as shown in figure 22, the second transfer unit 700 and the second cutter unit 300 are arranged on sustained height, substrate S
It can be transferred directly to the second cutter unit 300.At this point, substrate S is from second under the influence of the gas supplied by the second plate 760
Plate 760 floats.
Another example is provided with liftable between the second transfer unit 700 and the second cutter unit 300 and moves horizontally
Substrate S is transferred to the second cutter unit 300 by pickup unit (not shown) from the second transfer unit 700.Such as Figure 24 and Figure 25 institutes
Show, the second transfer unit 700 can be arranged on the position than 300 low predetermined altitude H of the second cutter unit.At this point, belt 710 is logical
It crosses lifting gear 740 and rises predetermined altitude H so that belt 710 is located at the height identical with the second cutter unit 300.At this point, band
Son 710 is by lifting gear 740 when being risen, substrate S it is mobile and far from the second plate 760.As described above, by lifting gear 740, band
Son 710 rises relative to the second plate 760 so that substrate S is far from the second plate 760.As a result, without substrate S and second in order to prevent
Friction between plate 760 floats substrate S from the second plate 760.
As shown in Figure 25 and Figure 26, the second cutter unit 300 forms the first Y-axis cutting line in the first face S1 of substrate S
YL1。
Second cutter unit 300 includes：Second framework 310 extends to X-direction and is moved to Y direction；Second
Portion 320 can movably be set to second framework 310, and with cutting wheel 321 to X-direction；Second guiding rail 330 is used
In the movement of guiding second framework 310；Belt 340, supporting substrate S；Support plate 350 can movably be set to Z-direction
In the lower section of belt 340, belt 340 is supported when cutting wheel 321 applies pressure to substrate S, so as to supporting substrate S；Support plate lifts
Device 360 lifts support plate 350 to Z-direction.
Second framework 310 is provided with multiple second heads 320 in the X-axis direction.
Can be provided between 310 and second guiding rail 330 of second framework air pressure or oil pressure operation actuator,
Linear motor or ball screw device isoline the movement equipment run according to electromagnetic interaction.As a result, in cutting wheel
321 apply pressure to second framework 310 in the state of substrate S moves along the second guiding rail 330 to Y direction, and the first of substrate S
Face S1 forms the first Y-axis cutting line YL1.
Belt 340 is supported by multiple belt wheels 341, and at least one of multiple belt wheels 341 can be to provide to rotate
The driving pulley of the driving force of belt 340.Belt 340 is preferably the undivided one-piece type belt for multiple portions, with uniform
The integral face of ground supporting substrate S and transfer.
Belt 340 rotate and substrate S move when, support plate 350 decline under the action of support plate lifting gear 360 and with
Belt 340 separates, so as to which belt 340 can successfully be moved without the friction between support plate 350.Also, it is formed in substrate S
During the first Y-axis cutting line YL1, support plate 350 is supported the bottom surface that plate lifting gear 360 rises and support belt 340, so as to prop up
Support group plate S.For example, support plate 350 can have the vacuum hole being connect with vacuum source with sorbing substrate S.
During the first face S1 of substrate S forms the first Y-axis cutting line YL1, it is provided with and has the of cutting wheel 321
The second framework 310 on two heads 320 can move, and substrate S is supported plate 350 and supports, and therefore, cutting wheel 321 may be with larger
Pressure pressing is in substrate S, so as to be easily separated substrate S.
Also, substrate S is supported plate 350 and supports, and there is no need to be used to support the roller of cutting wheel 321.Correspond to as a result,
The width on the second head 320 can be reduced by removing the size in the space of roller, nearest so as to reduce multiple second heads 320
Ground adjacent to when multiple second heads 320 cutting wheel 321 between interval.It is possible thereby to reduce what is formed by cutting wheel 321
Interval between first Y-axis cutting line YL1.
As shown in figure 26, the substrate S for being formed with the first Y-axis cutting line YL1 is single from the second cutting by the rotation of belt 340
Member 300 is transferred to substrate roll-over unit 400.Another example, the pickup unit (not shown) that can be moved horizontally while lifting are set
It is placed between the second cutter unit 300 and substrate roll-over unit 400, for substrate S to be transferred to base from the second cutter unit 300
Plate roll-over unit 400.
As shown in Figure 26 to Figure 33, substrate roll-over unit 400 includes：Multiple belts 410, in the X-axis direction mutually every
It opens up and puts；Supporting table 420 extends to Z-direction；First adsorption plate 430 has the first adsorption nozzle 431；Second absorption
Plate 440 has the first adsorption nozzle 441；Adsorption plate lifting gear 450 moves along supporting table 420 to Z-direction
One adsorption plate 430 and the second adsorption plate 440；Adsorption plate rotating device 460 is used to rotate the first adsorption plate 430 and the second suction
Attached plate 440.
Belt 410 is supported by multiple belt wheels 411, at least one in multiple belt wheels 411 to be to provide rotation belt 410
The driving pulley of driving force.
Adsorption plate lifting gear 450 can include the actuator run by air pressure or oil pressure, according to electromagnetic interaction
Linear motor or ball screw device isoline the movement equipment of operation.
Adsorption plate rotating device 460 can include motor.
First adsorption plate 430 and the second adsorption plate 440 are provided spaced being provided with substrate S in-between.First inhales
First adsorption nozzle 431 of attached plate 430 can be set mutually opposite to each other with the second adsorption nozzle 441 of the second adsorption plate 440.
Hereinafter, the action of upset substrate S is illustrated.For convenience of description, it is located at second with the first adsorption plate 430 to inhale
It is illustrated subject to the state of 440 top of attached plate.
First, as shown in figure 27, when substrate S is not located at belt 410, the first adsorption plate 430 and the second adsorption plate 440 are located at
Space between belt 410.Also, as shown in figure 28, when substrate S is sent on belt 410, substrate S is located at the first adsorption plate
430 and second between adsorption plate 440.
Also, as shown in figure 29, as the first adsorption plate 430 and the second adsorption plate 440 rise, the absorption of substrate S and second
Second adsorption nozzle 441 of plate 440 contacts.Also, as the first adsorption plate 430 and the second adsorption plate 440 continue to rise, substrate
S is risen with being contacted with the state of the second adsorption nozzle 441 of the second adsorption plate 440.At this point, substrate S is to be inhaled by gravity by second
Attached nozzle 441 is supported, therefore even if the posture that substrate S is not maintained the second adsorption nozzle 441 applies adsorption capacity.
In addition, adsorption force is when the first adsorption nozzle 431 or the second adsorption nozzle 441, in order to by its strong adsorption force
Degree increase to can the appropriate size of sorbing substrate S, need the scheduled time.In the present invention, the first suction within the predetermined time
During the adsorption capacity of attached 431 or second adsorption nozzle 441 of nozzle is increased, substrate S can also be supported in by gravity
One adsorption nozzle 431 or the second adsorption nozzle 441, so as to rise substrate S.Thus, it is possible to it prevents from increasing in adsorption capacity intensity
The phenomenon that suitably can not can rising substrate S and wait in a period of the intensity of sorbing substrate S.That is, it is possible to reduce
Rise the time needed for substrate S.
The 441 sorbing substrate S of the second adsorption nozzle of the second adsorption plate 440 during substrate S rises, then such as Figure 30 institutes
It states, the first adsorption plate 430 and the second adsorption plate 440 are rotated by adsorption plate rotating device 460.
Also, as shown in figure 31, under substrate S by the second adsorption nozzle 441 of the second adsorption plate 440 in the state of being adsorbed
Drop.
Furthermore as shown in figure 32, when the first adsorption plate 430 is inserted into the space between belt 410, then substrate S is located at band
410 top of son is simultaneously detached from the second adsorption nozzle 441.In this state, the first adsorption plate 430 can be located at the second adsorption plate
440 lower section, so as to be immediately performed the action of subsequent upset substrate S, it is possible thereby to shorten the time needed for process.
In this state, as shown in figure 33, the substrate S of overturning by the rotation of belt 410 from substrate roll-over unit 400
It is transferred to third cutter unit 500.Another example, liftable and the pickup unit (not shown) moved horizontally are arranged on substrate overturning
Between unit 400 and third cutter unit 500, for substrate S to be transferred to third cutter unit from substrate roll-over unit 400
500。
As shown in Figure 33 and Figure 34, third cutter unit 500 forms the second Y-axis cutting line in the second face S2 of substrate S
YL2。
Third cutter unit 500 includes：Third framework 510 extends and can be moved to Y direction to X-direction；Third
Head 520 can movably be set to third framework 510 and with cutting wheel 521 to X-direction；Third guiding rail 530,
It is used for the movement for guiding third framework 510；Belt 540 is used to support substrate S；Support plate 550, can be to Z-direction
The lower section of belt 540 is movably set to, the support belt 540 when cutting wheel 521 applies pressure to substrate S and supporting substrate S；Support
Plate lifting gear 560 increases in the Z-axis direction descending branch fagging 550.
Third framework 510 can have multiple third heads 520 in the X-axis direction.
Actuator, the basis of air pressure or oil pressure operation are provided between third framework 510 and third guiding rail 530
The linear motor of electromagnetic interaction operation or ball screw device isoline movement equipment.As a result, in cutting wheel 521 by substrate
In the state of S pressures, third framework 510 is moved along third guiding rail 530 to Y direction, so as in the second face of substrate S
S2 forms the second Y-axis cutting line YL2.
Belt 540 is supported by multiple belt wheels 541, and at least one of multiple belt wheels 541 can be to provide to rotate
The driving pulley of the driving force of belt 540.Belt 540 is preferably the undivided one-piece type belt into multiple portions, with equably
The integral face of supporting substrate S simultaneously transfers substrate.
Belt 540 rotates and moving substrate S when moving, and support plate 550 is supported plate lifting gear 560 and declines and separate
Belt 540 so that belt 540 is with support plate 550 without frictionally smoothly mobile.Also, form the cutting of the second Y-axis in substrate S
During line YL2, support plate 550 is supported the bottom surface that plate lifting gear 560 rises and support belt 540, so as to supporting substrate S.Example
Such as, support plate 550 have the vacuum hole being connect with vacuum source and sorbing substrate S.
During the second face S2 of substrate S forms the second Y-axis cutting line YL2, it is provided with the with cutting wheel 521
The third framework 510 on three heads 520 can move, and substrate S is supported plate 550 and is supported, and therefore, cutting wheel 521 can be with bigger
Pressure pressing is in substrate S, so as to be easily isolated substrate S.
Also, substrate S is supported plate 550 and is supported, and there is no need for support the roller of cutting wheel 521.As a result, may be used
The width on third head 520 is reduced with the space size for corresponding to removal roller, thus, it is possible to shorten multiple third heads 520
Interval between the cutting wheel 521 on multiple third heads 520 when recently abutting.So as to shorten through cutting wheel 521
Interval between the second Y-axis cutting line YL2 formed.
As the second face S2 in substrate S forms the second Y-axis cutting line YL2, the first Y-axis cutting line YL1 and the second Y-axis are cut
Secant YL2 is connected with each other, and substrate S can be cut along the first Y-axis cutting line YL1 and the second Y-axis cutting line YL2.
As a result, after substrate S is cut, X-axis stepped part XS can be formed, has and is equivalent to the first Y-axis cutting line
The width of YL2 and the second Y-axis cutting line YL2 distances spaced apart from each other in the X-axis direction, the X-axis stepped part XS can be formed
There are wiring and/or the electrode connected with wiring etc..
Cut substrate S can be transferred to subsequent handling by the rotation of belt 540 from third cutter unit 500.Separately
An example, the pickup unit (not shown) that liftable is provided between third cutter unit 500 and subsequent technique and is moved horizontally,
Substrate S is transferred to subsequent technique from third cutter unit 500.
Cutter for substrate in embodiment present invention as described above, multiple cutting lines, i.e. the first X-axis cutting line XL1
And the second X-axis cutting line XL2, the first Y-axis cutting line YL1, the second Y-axis cutting line YL2 are single by the first cutting set gradually
First 200, second cutter unit 300 and third cutter unit 500 sequentially form, so as to cutting substrate S.Therefore, in order to cut
Substrate and the prior art of dicing processes and sliver process is individually performed compared to process number is reduced, so as to improve cutting
The efficiency of substrate.
Although having illustrated the preferred embodiment of the present invention, the scope of the present invention is not limited to such specific reality
Example is applied, can be suitably changed in the range recorded in claims.
Claims (10)
1. a kind of cutter for substrate, which is characterized in that including：
Aligned units are used for the position for the substrate for determining to be sent into from outside；
First cutter unit is respectively formed in the first face of the substrate and the second face and is parallel to the first X-axis of X-direction and cuts
Secant and the second X-axis cutting line；
Second cutter unit is formed in parallel with the first Y-axis cutting line of Y direction in the first face of the substrate；
Substrate roll-over unit is used to overturn the substrate for being formed with the first Y-axis cutting line；And
Third cutter unit is formed in parallel with the second Y-axis cutting line of Y direction in the second face of the substrate.
2. cutter for substrate according to claim 1, which is characterized in that the aligned units include：
Multiple belts extend to Y direction and are spaced apart at a predetermined interval in the X-axis direction；
Belt lifting gear connect with the multiple belt and lifts the multiple belt；
Multiple flotation gears are set between the multiple belt and float the substrate；
Pressue device is used for the side of the substrate floated by the multiple flotation gear of pressurizeing.
3. cutter for substrate according to claim 1, which is characterized in that
First cutter unit includes：To extended first framework of X-direction；At least a pair of first head, can be to X-axis side
To being movably set to first framework, also, at least a pair of first head is set opposite each other,
At least a pair of first head includes：The first cutting wheel of cutting wheel is spaced apart and is respectively provided in the Z-axis direction
Module and the second cutting wheel module；The first roller module and the second roller of roller are spaced apart and are respectively provided in the Z-axis direction
Submodule,
The cutting wheel of the first cutting wheel module and the roller of second roller module are mutually aligned setting, and described second cuts
The roller for cutting the cutting wheel and first roller module of wheel module is mutually aligned setting.
4. cutter for substrate according to claim 3, which is characterized in that the cutting wheel of the first cutting wheel module and
The cutting wheel of the second cutting wheel module is spaced apart in the Y-axis direction.
5. cutter for substrate according to claim 1, which is characterized in that second cutter unit includes：
Second framework extends to X-direction and is moved to Y direction；
Second head can movably be set to the second framework to X-direction, and have cutting wheel；
Belt is used to support the substrate；And
Support plate can movably be set to the lower section of the belt to Z-direction, the substrate is stressed in the cutting wheel
When support the belt to support the substrate.
6. cutter for substrate according to claim 1, which is characterized in that the substrate roll-over unit includes：
Multiple belts, are provided spaced in X-direction；
Supporting table extends to Z-direction；
First adsorption plate has the first adsorption nozzle；
Second adsorption plate has the second adsorption nozzle；
Adsorption plate lifting gear moves first adsorption plate and second absorption along the supporting table to Z-direction
Plate；And
Adsorption plate rotating device, for rotating first adsorption plate and the second adsorption plate.
7. cutter for substrate according to claim 6, which is characterized in that
First adsorption plate and second adsorption plate are provided spaced in the Z-axis direction, so that the substrate is located at institute
It states between the first adsorption plate and second adsorption plate,
Second adsorption nozzle of the first adsorption nozzle of first adsorption plate and second adsorption plate is set opposite each other.
8. cutter for substrate according to claim 1, which is characterized in that the third cutter unit includes：
Third framework extends to X-direction and is moved to Y direction；
Third head can movably be set to the third framework to X-direction, and have cutting wheel；
Belt is used to support the substrate；And
Support plate can movably be set to the lower section of the belt to Z-direction, the substrate is stressed in the cutting wheel
When support the belt to support the substrate.
9. cutter for substrate according to claim 1, which is characterized in that further include：
First transfer unit is set between the aligned units and first cutter unit, for by the substrate from
Aligned units are transferred to first cutter unit；And
Second transfer unit is set between first cutter unit and second cutter unit, by the substrate from
First cutter unit is transferred to second cutter unit.
10. cutter for substrate according to claim 9, which is characterized in that second transfer unit includes：For propping up
Support the plate of the substrate；Belt moves to transfer the substrate with one Y direction in the same direction of plate.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20160170295 | 2016-12-14 | ||
| KR10-2016-0170295 | 2016-12-14 | ||
| KR1020170120641A KR102593615B1 (en) | 2016-12-14 | 2017-09-19 | Substrate cutting apparatus |
| KR10-2017-0120641 | 2017-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108218215A true CN108218215A (en) | 2018-06-29 |
Family
ID=62652145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711338426.8A Pending CN108218215A (en) | 2016-12-14 | 2017-12-14 | Cutter for substrate |
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| Country | Link |
|---|---|
| CN (1) | CN108218215A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111883454A (en) * | 2019-05-03 | 2020-11-03 | 塔工程有限公司 | Dummy portion removing unit and dummy portion removing method using the same |
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| CN104030558A (en) * | 2013-03-05 | 2014-09-10 | 三星钻石工业股份有限公司 | Substrate processing system and substrate reverting device |
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| CN1646282A (en) * | 2002-04-01 | 2005-07-27 | 三星钻石工业股份有限公司 | Parting method for fragile material substrate and parting device using the method |
| CN1856392A (en) * | 2003-09-24 | 2006-11-01 | 三星钻石工业株式会社 | Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method |
| CN1976877A (en) * | 2004-02-17 | 2007-06-06 | 川崎成套设备股份有限公司 | System for cutting plate glass |
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| CN111883454A (en) * | 2019-05-03 | 2020-11-03 | 塔工程有限公司 | Dummy portion removing unit and dummy portion removing method using the same |
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