TWI570829B - Apparatus and method for conveying singulated electronic component - Google Patents
Apparatus and method for conveying singulated electronic component Download PDFInfo
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- TWI570829B TWI570829B TW103115317A TW103115317A TWI570829B TW I570829 B TWI570829 B TW I570829B TW 103115317 A TW103115317 A TW 103115317A TW 103115317 A TW103115317 A TW 103115317A TW I570829 B TWI570829 B TW I570829B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
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- Engineering & Computer Science (AREA)
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Specific Conveyance Elements (AREA)
Description
本發明係關於一種搬送將板狀之被切斷物切斷而單片化之複數個電子零件的經切片之電子零件之搬送裝置及搬送方法。 The present invention relates to a transport apparatus and a transport method for transporting a plurality of electronic components in which a plurality of electronic components are cut and cut into a single sheet.
將印刷基板或由引線框架等所構成之基板假想地劃分為格子狀之複數個區域，於各個區域安裝晶片狀之元件之後，對基板整體進行樹脂密封，將由此而成者稱為樹脂密封體(已密封之基板)。藉由使用旋轉刀等之切片裝置將該樹脂密封體切斷，以各區域為單位切片所得者成為電子零件。 A printed circuit board or a substrate made of a lead frame or the like is virtually divided into a plurality of regions in a lattice shape, and after the wafer-shaped elements are mounted in the respective regions, the entire substrate is resin-sealed, and the substrate is referred to as a resin sealing body. (sealed substrate). The resin sealing body is cut by using a dicing apparatus such as a rotary blade, and the obtained one is sliced in each area to become an electronic component.
將樹脂密封體切斷而單片化之電子零件、例如BGA(Ball Grid Array Package，球柵陣列封裝)製品於檢查步驟中進行密封樹脂側(模具面)及基板側(球面)之檢查，判斷其為良品抑或不良品。將檢查完之電子零件全部配置於分度盤(index table)。配置於分度盤之電子零件被分選為良品與不良品，並藉由移送機構而分別收納至良品用托盤與不良品用托盤。 The electronic component, such as a BGA (Ball Grid Array Package) product, in which the resin sealing body is cut and singulated, is inspected on the sealing resin side (mold surface) and the substrate side (spherical surface) in the inspection step, and is judged. It is a good or bad product. All the electronic parts that have been inspected are placed on the index table. The electronic components disposed on the indexing plate are sorted into good products and defective products, and are respectively stored in the good product tray and the defective product tray by the transfer mechanism.
近年來，一方面電子零件之小型化日益發展，另一方面為了提高電子零件之生產效率，而使基板大型化，欲增加自1片基板獲取之電 子零件之個數之要求變得強烈。伴隨於此，有分度盤或托盤大型化，並且收納電子零件之區域變得更小之傾向。 In recent years, on the one hand, the miniaturization of electronic components has been increasing, and on the other hand, in order to increase the production efficiency of electronic components, the substrate has been enlarged, and it is desired to increase the power obtained from one substrate. The number of sub-parts has become strong. Along with this, there is a tendency that the indexing plate or the tray is enlarged, and the area in which the electronic component is housed becomes smaller.
於切片裝置中，配置於分度盤之電子零件之個數與收納於托盤之電子零件之個數通常不同。進而，於分度盤配置電子零件之間距與於托盤收納電子零件之間距不同。因此，將配置於分度盤之電子零件高效率地移送並收納至托盤之技術變得重要。 In the slicing apparatus, the number of electronic components placed on the indexing plate is usually different from the number of electronic components housed in the tray. Further, the distance between the electronic components disposed on the indexing plate is different from the distance between the electronic components stored in the tray. Therefore, it is important to efficiently transfer and store electronic components disposed on the indexing tray to the tray.
作為拾取並搬送電子零件之搬送裝置，提出有如下搬送裝置：「其係具備具有用以摘取檢查對象元件之吸附手段之複數個拾取單元者，其特徵在於具有：卡合構件，其設置於各拾取單元；及共通構件，其切設有供該卡合構件卡合之卡合槽且可移動；拾取單元伴隨上述共通構件之移動而移動，且吸附手段之間隔改變」(例如，專利文獻1之段落[0013]，圖1)。 A transfer device that picks up and transports an electronic component is provided with a plurality of pick-up units having an adsorption means for picking up an inspection target element, and is characterized in that: an engagement member is provided Each of the pick-up unit and the common member is provided with an engaging groove for engaging the engaging member and is movable; the pick-up unit moves with the movement of the common member, and the interval of the adsorption means is changed" (for example, Patent Literature) Paragraph 1 of [0013], Figure 1).
[先前技術文獻] [Previous Technical Literature]
[專利文獻] [Patent Literature]
[專利文獻1]日本特開2004-39706號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-39706
然而，上述專利文獻中未敍述如下情況：於分度盤中之沿著一方向配置之電子零件之個數及間距與托盤中之沿著一方向收納之電子零件之個數及間距不同之情形時，如何有效率地將電子零件自分度盤收納至托盤。 However, the above patent document does not describe a case where the number and pitch of electronic components arranged in one direction in the indexing disk are different from the number and spacing of electronic components accommodated in one direction in the tray. How to efficiently store electronic parts from the indexing tray to the tray.
本發明之目的在於提供一種經切片之電子零件之搬送裝置及搬送方法，其係於分度盤中之沿著一方向配置之電子零件之個數及間距與托盤中之沿著一方向收納之電子零件之個數及間距不同之情形時，可根 據托盤之空凹穴數吸附電子零件並高效率地收納至托盤。 An object of the present invention is to provide a sliced electronic component transporting device and a transporting method, which are arranged in a direction in which the number and spacing of electronic components arranged in one direction are accommodated in a direction along the tray. When the number and spacing of electronic parts are different, it can be rooted. The electronic parts are attracted according to the number of empty pockets of the tray and efficiently stored in the tray.
為解決上述課題，本發明之經切片之電子零件之搬送裝置係搬送藉由以設置於板狀構件之複數個區域為單位將板狀構件切片而製造之複數個電子零件，其特徵在於具備：保管構件，其具有分別配置電子零件之複數個配置部位；收納構件，其具有分別收納電子零件之複數個收納部位；移送機構，其自複數個配置部位分別吸附電子零件，且移送並收納至複數個收納部位；及吸附部，其為N個(N為2以上之整數)，設置於移送機構，且具有吸附電子零件之功能及解除對該電子零件之吸附之功能；於複數個收納部位之沿著一方向之1列中收納部位之空部位之個數為M個(M為正整數)且M<N之情形時，藉由吸附部自保管構件吸附M個電子零件，於M≧N之情形時，藉由吸附部自保管構件吸附N個電子零件，經吸附之電子零件藉由移送機構移送至收納構件，且藉由解除吸附而收納至M個空部位中之至少一部分。 In order to solve the problem, the apparatus for transporting a sliced electronic component of the present invention is characterized in that: a plurality of electronic components manufactured by slicing a plate-shaped member in a plurality of regions provided in a plate-like member, and comprising: The storage member has a plurality of arrangement portions for arranging the electronic components, the storage member has a plurality of storage portions for respectively accommodating the electronic components, and the transfer mechanism respectively absorbs the electronic components from the plurality of arrangement portions, and transfers and stores the plurality of components. The storage portion and the adsorption portion are N (N is an integer of 2 or more), are disposed in the transfer mechanism, and have a function of adsorbing the electronic component and a function of releasing the adsorption of the electronic component; and the plurality of storage portions When the number of empty portions of the storage portion in one row in one direction is M (M is a positive integer) and M < N, the M-components are adsorbed from the storage member by the adsorption portion, and M≧N In the case of the adsorption unit, N electronic components are adsorbed from the storage member, and the adsorbed electronic components are transferred to the storage member by the transfer mechanism, and are removed by the adsorption. M to the empty sites in at least a portion.
又，本發明之經切片之電子零件之搬送裝置之特徵在於：於上述搬送裝置中具備控制部，計算空部位之個數，控制移送機構吸附與該空部位之個數對應之個數之電子零件且自保管構件移送並收納至收納構件。 Further, the apparatus for transporting a sliced electronic component according to the present invention is characterized in that the transfer device includes a control unit that counts the number of empty portions, and controls the transfer mechanism to adsorb the number of electrons corresponding to the number of the empty portions. The parts are transferred from the storage member and stored in the storage member.
又，本發明之經切片之電子零件之搬送裝置之特徵在於：於上述搬送裝置中具備第1移送機構與第2移送機構作為移送機構，於第1移送機構與第2移送機構中之一者吸附保管構件中之電子零件之期間，另一者將由吸附部吸附之電子零件收納至收納構件。 Further, the apparatus for transporting a sliced electronic component according to the present invention is characterized in that the transport device includes a first transfer mechanism and a second transfer mechanism as a transfer mechanism, and one of the first transfer mechanism and the second transfer mechanism While the electronic component in the storage member is being adsorbed, the other electronic component that is adsorbed by the adsorption unit is housed in the storage member.
又，本發明之經切片之電子零件之搬送裝置之特徵在於：於上述搬送裝置中，吸附部具有使該吸附部彼此之間隔可配合複數個配置部位之間距或複數個收納部位之間距而改變之功能。 Further, in the above-described transport apparatus for sliced electronic components, the adsorption unit has a function of changing the distance between the adsorption portions to match the distance between the plurality of arrangement portions or the distance between the plurality of storage portions. The function.
又，本發明之經切片之電子零件之搬送裝置之特徵在於：於上述搬送裝置中，板狀構件為樹脂密封體，電子零件具有電路基板、包含被動元件或主動元件之晶片、及由硬化樹脂所構成之密封樹脂。 Further, in the above-described conveying apparatus, the plate-shaped member is a resin sealing body, and the electronic component has a circuit board, a wafer including a passive element or an active element, and a hardened resin. The sealing resin is composed.
又，本發明之經切片之電子零件之搬送裝置之特徵在於：於上述搬送裝置中，板狀構件為半導體晶圓，電子零件為半導體晶片。 Further, in the above-described transport apparatus for slicing electronic parts of the present invention, in the transport apparatus, the plate member is a semiconductor wafer, and the electronic component is a semiconductor wafer.
為解決上述課題，本發明之經切片之電子零件之搬送方法係搬送藉由以設置於板狀構件之複數個區域為單位將板狀構件切片而製造之複數個電子零件，其特徵在於具備以下步驟：將經切片之電子零件分別配置於設置在保管構件之複數個配置部位；藉由設置於移送機構之N個(N為2以上之整數)吸附部自複數個配置部位吸附電子零件；藉由移送機構將電子零件自複數個配置部位移送至設置於收納構件之複數個收納部位；及藉由解除對電子零件之吸附而將電子零件收納至收納部位；吸附步驟中，於收納構件之沿著一方向之1列中收納部位之空部位之個數為M個(M為正整數)且M<N之情形時，藉由吸附部自保管構件吸附M個電子零件，於M≧N之情形時，藉由吸附部自保管構件吸附N個電子零件，移送步驟中，藉由移送機構將電子零件移送至M個空部位中之至少一部分，收納步驟中，藉由解除對電子零件之吸附而收納至M個空部位中之至少一部分。 In order to solve the problem, the method of transporting the sliced electronic component of the present invention is a plurality of electronic components manufactured by slicing the plate-shaped member in a plurality of regions provided in the plate-shaped member, and is characterized by having the following Step: disposing the sliced electronic components in a plurality of arrangement positions provided in the storage member; and adsorbing the electronic components from the plurality of arrangement portions by the N (N is an integer of 2 or more) adsorption portions provided in the transfer mechanism; The electronic component is displaced from the plurality of arrangement portions to a plurality of storage portions provided in the storage member by the transfer mechanism; and the electronic component is stored in the storage portion by releasing the adsorption of the electronic component; and in the adsorption step, along the storage member When the number of empty portions of the storage portion in one row in one direction is M (M is a positive integer) and M < N, the M components are adsorbed from the storage member by the adsorption portion, and In the case where the N-component is adsorbed from the storage member by the adsorption unit, the transfer unit transfers the electronic component to at least a part of the M empty portions by the transfer mechanism. Step, by releasing the adsorption of the electronic component M housed at least a portion of the empty portions.
又，本發明之經切片之電子零件之搬送方法之特徵在於：於上述搬送方法中具備如下步驟：計算空部位之個數，控制移送機構吸附與該空部位之個數對應之個數之電子零件且自保管構件移送並收納至收納構件。 Moreover, the method for conveying a sliced electronic component according to the present invention is characterized in that the transfer method includes the steps of: calculating the number of empty portions, and controlling the transfer mechanism to adsorb the number of electrons corresponding to the number of the empty portions The parts are transferred from the storage member and stored in the storage member.
又，本發明之經切片之電子零件之搬送方法之特徵在於：於上述搬送方法中，於作為移送機構而設置之第1移送機構與第2移送機構中之一者吸附保管構件中之電子零件之期間，另一者將吸附部所吸附之電子零件收納至收納構件。 Further, in the above-described transfer method, the electronic component in the storage member is adsorbed to one of the first transfer mechanism and the second transfer mechanism provided as the transfer mechanism. In the meantime, the other one accommodates the electronic component sucked by the adsorption unit to the storage member.
又，本發明之經切片之電子零件之搬送方法之特徵在於：於 上述搬送方法中具備如下步驟：使吸附部彼此之間隔可配合複數個配置部位之間距或複數個收納部位之間距而改變。 Moreover, the method for transporting the sliced electronic component of the present invention is characterized by: The above-described transfer method includes a step of changing the interval between the adsorption portions to match the distance between the plurality of arrangement portions or the distance between the plurality of storage portions.
又，本發明之經切片之電子零件之搬送方法之特徵在於：於 上述搬送方法中，板狀構件為樹脂密封體，電子零件具有電路基板、包含被動元件或主動元件之晶片、及由硬化樹脂所構成之密封樹脂。 Moreover, the method for transporting the sliced electronic component of the present invention is characterized by: In the above transfer method, the plate member is a resin sealing body, and the electronic component includes a circuit board, a wafer including a passive element or an active element, and a sealing resin made of a cured resin.
又，本發明之經切片之電子零件之搬送方法之特徵在於：於上述搬送方法中，板狀構件為半導體晶圓，電子零件為半導體晶片。 Further, in the method of conveying a sliced electronic component of the present invention, in the above transfer method, the plate member is a semiconductor wafer, and the electronic component is a semiconductor wafer.
根據本發明，於收納構件之沿著一方向之1列中空部位之個數M少於吸附部之個數N之情形時，自保管構件吸附等於空部位之個數之電子零件。藉由移送機構將經吸附之電子零件移送至收納構件並收納至空部位。藉由根據空部位之個數控制移送機構，而避免使將電子零件收納至空部位之動作連續進行2次。因此，可高效率地將電子零件自保管構件收納至收納構件。 According to the present invention, when the number M of the hollow portions in one row of the storage member in one direction is smaller than the number N of the adsorption portions, the number of electronic components equal to the number of empty portions is adsorbed from the storage member. The adsorbed electronic component is transferred to the storage member by the transfer mechanism and stored in the empty portion. By controlling the transfer mechanism in accordance with the number of empty portions, the operation of accommodating the electronic component to the empty portion is prevented from being continuously performed twice. Therefore, the electronic component can be efficiently stored in the storage member from the storage member.
1‧‧‧切片裝置 1‧‧‧Slice device
2‧‧‧前置平台 2‧‧‧front platform
3‧‧‧樹脂密封體(板狀構件) 3‧‧‧ resin sealing body (plate member)
4‧‧‧切斷用台 4‧‧‧Severance desk
5‧‧‧切斷用平台 5‧‧‧Scissing platform
6‧‧‧轉軸單元 6‧‧‧ shaft unit
7‧‧‧旋轉刀 7‧‧‧Rotary knife
8‧‧‧檢查用平台 8‧‧‧Checking platform
9‧‧‧由複數個電子零件所構成之集合體 9‧‧‧A collection of multiple electronic components
10‧‧‧分度盤(保管構件) 10‧‧‧Dividing plate (keeping member)
11A、11B‧‧‧移送機構(第1移送機構、第2移送機構) 11A, 11B‧‧‧Transfer mechanism (first transfer mechanism, second transfer mechanism)
12‧‧‧良品用托盤(收納構件) 12‧‧‧Good goods tray (storage unit)
13‧‧‧不良品用托盤 13‧‧‧Tray for defective products
14‧‧‧吸附口 14‧‧‧Adsorption port
A‧‧‧接收單元 A‧‧‧ receiving unit
B‧‧‧切片單元 B‧‧‧Slice unit
C‧‧‧檢查單元 C‧‧‧Check unit
D‧‧‧收納單元 D‧‧‧ storage unit
CTL‧‧‧控制部 CTL‧‧‧Control Department
P‧‧‧電子零件 P‧‧‧Electronic parts
S‧‧‧凹穴(收納部位) S‧‧‧ recess (storage part)
H‧‧‧吸附部 H‧‧‧Adsorption Department
a‧‧‧配置於分度盤之電子零件之間距 a‧‧‧The distance between electronic parts arranged on the indexing plate
b‧‧‧設置於托盤之凹穴之間距 b‧‧‧Set the distance between the pockets of the tray
M‧‧‧托盤之各列中之空凹穴數 Number of empty pockets in each column of M‧‧‧ pallets
N‧‧‧移送機構中之吸附部數 N‧‧‧ Number of adsorption units in the transfer mechanism
L‧‧‧分度盤之各列中之電子零件之剩餘數 Remaining number of electronic components in each column of the L‧‧‧ indexing plate
圖1係表示本實施例之切片裝置之概略俯視圖。 Fig. 1 is a schematic plan view showing a slicing apparatus of the present embodiment.
圖2係表示分度盤、移送機構及托盤之構成之概略俯視圖。 Fig. 2 is a schematic plan view showing the configuration of an indexing plate, a transfer mechanism, and a tray.
圖3係表示藉由移送機構將電子零件收納至托盤之步驟之概略剖面圖。 3 is a schematic cross-sectional view showing a step of accommodating electronic components to a tray by a transfer mechanism.
圖4係表示於托盤之第1列之凹穴收納電子零件之狀態之概略圖。 Fig. 4 is a schematic view showing a state in which electronic components are housed in the recesses of the first row of the tray.
圖5係表示於托盤之第2列之凹穴收納電子零件之狀態之概略圖。 Fig. 5 is a schematic view showing a state in which electronic components are housed in the second row of the tray.
圖6係表示於托盤整體收納電子零件之狀態之概略圖。 Fig. 6 is a schematic view showing a state in which electronic components are housed in the entire tray.
於良品用托盤之各列中，空凹穴數少於移送機構之吸附部數之情形時，自分度盤吸附等於空凹穴數之個數之電子零件。藉由移送機構將經吸附之電子零件移送至良品用托盤並收納至空凹穴。 In each column of the good product tray, when the number of empty pockets is less than the number of adsorption portions of the transfer mechanism, the self-indexing disk absorbs the number of electronic components equal to the number of empty pockets. The adsorbed electronic component is transferred to the good tray by the transfer mechanism and stored in the empty pocket.
[實施例] [Examples]
作為實施例，參照圖1~圖6對本發明之經切片之電子零件之搬送裝置進行說明。關於本申請案文檔中之任一圖，均適當省略或誇張且模式性地進行描述以易於理解。對於相同之構成要素標註相同之符號並適當省略說明。 As an embodiment, a sliced electronic component transfer apparatus of the present invention will be described with reference to Figs. 1 to 6 . Any of the figures in the documents of the present application are appropriately omitted or exaggerated and described in a schema for easy understanding. The same components are denoted by the same reference numerals, and the description thereof will be appropriately omitted.
圖1係表示本實施例之切片裝置1之概略俯視圖。切片裝置1將被切斷物切片為複數個電子零件。切片裝置1分別具有接收單元A、切片單元B、檢查單元C、及收納單元D作為構成要素(模組)。 Fig. 1 is a schematic plan view showing the slicing device 1 of the present embodiment. The slicing device 1 slices the object to be cut into a plurality of electronic components. The slicing apparatus 1 has a receiving unit A, a slicing unit B, an inspection unit C, and a storage unit D as constituent elements (modules).
接收單元A、切片單元B、檢查單元C、及收納單元D分別相對於其他構成要素可裝卸且可更換，且各者以具有與預想之要求規格對應之不同之複數個規格之方式預先予以準備。包含接收單元A、切片單元B、檢查單元C、及收納單元D而構成切片裝置1。 The receiving unit A, the slicing unit B, the inspection unit C, and the storage unit D are detachable and replaceable with respect to other components, and each of them is prepared in advance in a plurality of specifications having different specifications corresponding to the expected specifications. . The slicing device 1 is configured by including the receiving unit A, the slicing unit B, the inspection unit C, and the storage unit D.
於接收單元A設置有前置平台2。自作為前步驟之裝置之樹脂密封裝置，將相當於被切斷物之樹脂密封體(已成形之基板)3接收至前置平台2。樹脂密封體3係使密封樹脂之側朝下而配置於前置平台2。 The front platform 2 is provided in the receiving unit A. From the resin sealing device as the apparatus of the previous step, the resin sealing body (formed substrate) 3 corresponding to the object to be cut is received to the front stage 2 . The resin sealing body 3 is disposed on the front stage 2 with the side of the sealing resin facing downward.
樹脂密封體3具有引線框架或印刷基板等電路基板、安裝於電路基板中之格子狀之複數個區域且包含被動元件或主動元件之晶片、及由一次成形之硬化樹脂所構成之密封樹脂。 The resin sealing body 3 has a circuit board such as a lead frame or a printed board, a wafer including a passive element or an active element mounted on a plurality of regions in a lattice shape of the circuit board, and a sealing resin composed of a hard resin formed at one time.
於切片單元B設置有切斷用台4。切斷用台4可沿圖之X方向移動，且可沿θ方向旋動。於切斷用台4上安裝有切斷用平台5。於切片單元B之內側部分，設置有2個轉軸單元6作為切斷機構。2個轉軸單元 6可獨立沿Y方向移動。於2個轉軸單元6，分別設置有旋轉刀7。該等旋轉刀7藉由分別於沿著X方向之面內旋轉而切斷樹脂密封體3。因此，本實施例中，分別使用旋轉刀7之2個切斷機構設置於切片單元B。切斷機構既可為1個亦可為3個以上。 The cutting unit 4 is provided in the slicing unit B. The cutting table 4 is movable in the X direction of the drawing and is rotatable in the θ direction. A cutting platform 5 is attached to the cutting table 4. In the inner portion of the slicing unit B, two rotating shaft units 6 are provided as the cutting mechanism. 2 shaft units 6 can move independently in the Y direction. Rotary blades 7 are provided in each of the two spindle units 6. The rotary blades 7 cut the resin sealing body 3 by rotating in the plane along the X direction. Therefore, in the present embodiment, the two cutting mechanisms that respectively use the rotary blade 7 are provided in the slicing unit B. The cutting mechanism may be one or three or more.
於檢查單元C設置有檢查用平台8。由將樹脂密封體3切斷而單片化之複數個電子零件P所構成之集合體9由檢查用平台8總括地吸附。檢查用平台8構成為能夠以X方向為軸進行旋轉。經切片之複數個電子零件P(例如，BGA製品)係藉由檢查密封樹脂側(模具面)及基板側(球面)，而分選為良品與不良品。檢查完之電子零件P於分度盤10配置為棋盤格圖案狀(checker flag pattern狀)或格子狀。於圖1中，示出配置為棋盤格圖案狀之情形。於檢查單元C，設置有將配置於分度盤10之電子零件P移送至托盤之複數個移送機構11A、11B。 An inspection platform 8 is provided in the inspection unit C. The assembly 9 composed of a plurality of electronic components P that are diced by cutting the resin sealing body 3 is collectively adsorbed by the inspection platform 8. The inspection platform 8 is configured to be rotatable about the X direction. The plurality of electronic parts P (for example, BGA products) that have been sliced are sorted into good products and defective products by inspection of the sealing resin side (mold surface) and the substrate side (spherical surface). The electronic component P that has been inspected is arranged in the checkerboard pattern (checker flag pattern) or grid shape on the indexing plate 10. In Fig. 1, a case in which a checkerboard pattern is arranged is shown. The inspection unit C is provided with a plurality of transfer mechanisms 11A and 11B that transfer the electronic component P disposed on the index dial 10 to the tray.
於收納單元D設置有收納良品之良品用托盤12與收納不良品之不良品用托盤13。電子零件P藉由移送機構11A、11B而分選為良品與不良品並收納至各托盤。再者，此處假設配置於分度盤10之電子零件P全部為良品。 The storage unit D is provided with a good quality tray 12 for storing good products and a defective product tray 13 for accommodating defective products. The electronic component P is sorted into a good product and a defective product by the transfer mechanisms 11A and 11B, and is accommodated in each tray. Furthermore, it is assumed here that all of the electronic components P disposed on the indexing disk 10 are good.
以上，對切片裝置1之構成與動作進行了說明。切片裝置1之動作例如藉由設置於接收單元A內之控制部CTL而控制。 The configuration and operation of the slicing apparatus 1 have been described above. The operation of the slicing apparatus 1 is controlled by, for example, a control unit CTL provided in the receiving unit A.
圖2係表示分度盤10、移送機構11A、11B、及良品用托盤12之構成之概略圖。於圖2中，示出電子零件P配置為格子狀之情形。將分度盤10之沿著橫方向(X方向)之排列稱為「列」，將沿著縱方向(Y方向)之排列稱為「行」。於該情形時，10列×28行之共280個電子零件P配置於分度盤10之經劃分之各區域。由於電子零件P配置於10列×28行之矩陣上，故而例如將配置於第3列第4行之電子零件P稱為電子零件P34。因此，於第1列配置電子零件P11~P128，於第2列配置電子零件P21~ P228，…，於第10列配置電子零件P101~P1028，從而共280個電子零件P配置於分度盤10。 2 is a schematic view showing the configuration of the indexing disk 10, the transfer mechanisms 11A and 11B, and the good product tray 12. In FIG. 2, the case where the electronic component P is arranged in a lattice shape is shown. The arrangement of the indexing disk 10 in the lateral direction (X direction) is referred to as "column", and the arrangement along the vertical direction (Y direction) is referred to as "row". In this case, a total of 280 electronic components P of 10 columns x 28 rows are arranged in the divided regions of the indexing disk 10. Since the electronic component P is placed on a matrix of 10 columns × 28 rows, for example, the electronic component P disposed in the fourth row and the fourth row is referred to as an electronic component P34. Therefore, the electronic components P11 to P128 are arranged in the first column, and the electronic components P21 are arranged in the second column. P228, ..., the electronic components P101 to P1028 are arranged in the 10th column, so that a total of 280 electronic components P are arranged on the indexing disk 10.
同樣地，於良品用托盤12設置有用以收納9列×17行之共 153個電子零件P之凹穴S。各凹穴S形成為具有用以收納電子零件P之凹部之形狀。於第1列設置有凹穴S11~S117，於第2列設置有凹穴S21~S217，…，於第9列設置有凹穴S91~S917。 Similarly, the good product tray 12 is provided to accommodate a total of 9 columns × 17 rows. 530 electronic parts P pocket S. Each of the recesses S is formed in a shape having a recess for accommodating the electronic component P. The recesses S11 to S117 are provided in the first row, the recesses S21 to S217 are provided in the second row, and the recesses S91 to S917 are provided in the ninth row.
於分度盤10中，電子零件P於X方向及Y方向均隔開間距 a之間隔而配置。同樣地，於良品用托盤12中，凹穴S於X方向及Y方向均隔開間距b之間隔而形成。分度盤10之間距a與良品用托盤12之間距b不同。根據作為對象之製品，配置於分度盤10之電子零件之個數或收納於良品用托盤12之電子零件之個數亦不同。如此，配置於分度盤10之電子零件P之個數或間距與收納於良品用托盤12之電子零件P之個數或間距通常不同。 In the indexing plate 10, the electronic component P is spaced apart in the X direction and the Y direction. Configured at intervals of a. Similarly, in the good product tray 12, the pockets S are formed at intervals of the pitch b in the X direction and the Y direction. The distance a between the indexing discs 10 and the good tray 12 are different. The number of electronic components placed on the indexing plate 10 or the number of electronic components housed in the good product tray 12 differs depending on the product to be targeted. As described above, the number or pitch of the electronic components P placed on the indexing disk 10 is usually different from the number or pitch of the electronic components P accommodated in the good product tray 12.
於圖2中，移送機構11A、11B分別具備複數個獨立之吸附 部H(具體而言為6個吸附部H1~H6)。各吸附部H1~H6分別升降，且具有吸附電子零件P之功能及解除吸附之功能。又，移送機構11A、11B構成為可使各吸附部H1~H6之間隔可變。移送機構11A、11B可藉由吸附部H1~H6而吸附最多6個配置於分度盤10之電子零件P。移送機構11A、11B將所吸附之電子零件P依序移送至良品用托盤12並收納至特定之凹穴S。 移送機構11A、11B於自分度盤10吸附電子零件P之情形時使吸附部H之間隔與間距a一致而吸附，於收納至良品用托盤12之情形時與間距b一致而收納電子零件P。 In FIG. 2, the transfer mechanisms 11A, 11B respectively have a plurality of independent adsorptions. Part H (specifically, six adsorption sections H1 to H6). Each of the adsorption portions H1 to H6 moves up and down, and has a function of adsorbing the electronic component P and a function of releasing the adsorption. Further, the transfer mechanisms 11A and 11B are configured to change the interval between the adsorption portions H1 to H6. The transfer mechanisms 11A and 11B can adsorb up to six electronic components P disposed on the index dial 10 by the adsorption portions H1 to H6. The transfer mechanisms 11A and 11B sequentially transfer the adsorbed electronic components P to the good product tray 12 and store them in the specific pockets S. When the electronic components P are adsorbed from the indexing disk 10, the transfer mechanisms 11A and 11B are placed so that the distance between the adsorption portions H and the pitch a are aligned, and when they are stored in the good tray 12, the electronic components P are accommodated in accordance with the pitch b.
如圖2所示，藉由移送機構11A、11B將配置於分度盤10 之電子零件P按照第1列之P11~P128、第2列之P228~P21、第3列之P31~P328、第4列之P428~P41、…，以各列交替地沿著兩點鏈線之箭頭方向 吸附並移送。同樣地，於良品用托盤12，按照第1列之S11~S117、第2列之S217~S21、第3列之S31~S317、第4列之S417~S41、…，以各列交替地沿著兩點鏈線之箭頭之方向將電子零件P收納至凹穴S。 As shown in FIG. 2, the transfer mechanism 10A, 11B will be disposed on the indexing disk 10. The electronic parts P are alternately arranged along the two-point chain line in accordance with P11 to P128 in the first column, P228 to P21 in the second column, P31 to P328 in the third column, and P428 to P41 in the fourth column. Arrow direction Adsorb and transfer. Similarly, the good product tray 12 is alternately arranged in each column according to S11 to S117 in the first column, S217 to S21 in the second column, S31 to S317 in the third column, and S417 to S41 in the fourth column. The electronic component P is accommodated in the recess S in the direction of the arrow of the two-point chain line.
圖3係表示藉由移送機構11A將電子零件P11~P16收納至 良品用托盤12之步驟之概略剖面圖。如圖3(a)所示，於分度盤10設置有用以分別吸附各電子零件P之吸附口14。若為如分度盤10之經劃分之各區域具備用以配置電子零件P之凹部之情形，則亦可不特別設置吸附口14。 FIG. 3 shows that the electronic components P11 to P16 are stored by the transfer mechanism 11A. A schematic cross-sectional view of the steps of the good product tray 12. As shown in FIG. 3(a), the indexing disk 10 is provided with adsorption ports 14 for respectively adsorbing the respective electronic components P. If each of the divided regions such as the indexing disk 10 is provided with a recess for arranging the electronic component P, the adsorption port 14 may not be particularly provided.
首先，如圖3(a)所示，使移送機構11A之吸附部H之間 隔與間距a一致。移送機構11A移動至可吸附配置於分度盤10之第1列(參照圖2)之電子零件P11~P16之位置為止。吸附部H1~H6下降並分別吸附電子零件P11~P16。 First, as shown in Fig. 3 (a), between the adsorption portions H of the transfer mechanism 11A is made The spacing is consistent with the spacing a. The transfer mechanism 11A moves to a position where the electronic components P11 to P16 disposed in the first column (see FIG. 2) of the indexing disk 10 can be adsorbed. The adsorption portions H1 to H6 are lowered and the electronic components P11 to P16 are respectively adsorbed.
其次，如圖3(b)所示，移送機構11A移動至設置於良品 用托盤12之第1列(參照圖2)之凹穴S11~S16上，並使吸附部H之間隔與間距b一致。吸附部H下降，將電子零件P11~P16收納至凹穴S11~S16之後，解除吸附。藉由移送機構11A，而於良品用托盤12之第1列收納6個電子零件P11~P16。如此，移送機構11A、11B於自分度盤10吸附電子零件P時使吸附部H之間隔與間距a一致而吸附，於收納至良品用托盤12時與間距b一致而收納電子零件P。 Next, as shown in FIG. 3(b), the transfer mechanism 11A moves to a good setting. The pockets S11 to S16 of the first row (see FIG. 2) of the tray 12 are used, and the interval between the adsorption portions H is made to coincide with the pitch b. The adsorption portion H is lowered, and the electronic components P11 to P16 are housed in the pockets S11 to S16, and then the adsorption is released. The electronic components P11 to P16 are accommodated in the first row of the good product tray 12 by the transfer mechanism 11A. When the electronic component P is sucked from the indexing disk 10, the transfer mechanisms 11A and 11B adsorb the gap between the adsorption portions H and the pitch a, and accommodate the electronic component P when the storage tray 12 is accommodated.
使用圖4~圖6，對藉由移送機構11A、11B將電子零件P 收納至良品用托盤12之具體例進行說明。此處假設配置於分度盤10之電子零件P全部為良品而進行說明。再者，於存在不良品之情形時，首先，僅將良品自分度盤10移送並收納至良品用托盤12。繼而，於良品之收納全部結束之後，將剩餘之不良品移送並收納至不良品用托盤13。 The electronic parts P are transferred by the transfer mechanisms 11A, 11B using FIGS. 4 to 6 A specific example of storage into the good product tray 12 will be described. Here, it is assumed that all of the electronic components P disposed on the indexing disk 10 are good. In the case where there is a defective product, first, only the good product is transferred from the indexing tray 10 and stored in the good product tray 12. Then, after all the storage of the good products is completed, the remaining defective products are transferred and stored in the defective product tray 13.
圖4表示於良品用托盤12之第1列之凹穴S收納電子零件P之狀態。首先，移送機構11A吸附配置於分度盤10之第1列之6個電子 零件P11~P16，移送至設置於良品用托盤12之第1列之凹穴S11~S16上，並解除對電子零件P11~P16之吸附而收納電子零件P11~P16。移送機構11A進行移動而恢復至分度盤10上之位置。於移送機構11A將電子零件P11~P16收納至良品用托盤12之凹穴S11~S16之期間，移送機構11B吸附配置於分度盤10之第1列之6個電子零件P17~P112。繼而，將電子零件P17~P112收納至設置於良品用托盤12之第1列之凹穴S17~S112。如此，移送機構11A與11B交替地重複自分度盤10吸附電子零件P之動作與將電子零件P收納至良品用托盤12之動作。 FIG. 4 shows a state in which the electronic component P is housed in the pocket S of the first row of the good tray 12. First, the transfer mechanism 11A adsorbs six electrons disposed in the first column of the indexing disk 10. The parts P11 to P16 are transferred to the pockets S11 to S16 provided in the first row of the good tray 12, and the electronic components P11 to P16 are removed by the adsorption of the electronic components P11 to P16. The transfer mechanism 11A moves to return to the position on the indexing disk 10. While the transfer mechanism 11A stores the electronic components P11 to P16 in the pockets S11 to S16 of the good tray 12, the transfer mechanism 11B adsorbs the six electronic components P17 to P112 disposed in the first row of the indexing disk 10. Then, the electronic components P17 to P112 are housed in the pockets S17 to S112 provided in the first row of the good tray 12. In this manner, the transfer mechanisms 11A and 11B alternately repeat the operation of absorbing the electronic component P from the indexing disk 10 and the operation of accommodating the electronic component P to the good product tray 12.
至此為止，由於良品用托盤12之第1列中之空凹穴數M多 於移送機構11A、11B之吸附部H之個數(吸附部數)即N個(本實施例中為6個)，故而藉由移送機構11A、11B自分度盤10吸附6個電子零件P並收納至良品用托盤12。於該狀態下，於良品用托盤12之第1列，在凹穴S11~S112中收納有12個電子零件P11~P112，從而5個凹穴S113~S117成為空凹穴。由於第1列之空凹穴數M少於吸附部數N，故而接下來自分度盤10吸附相當於空凹穴數M之5個電子零件P。因此，移送機構11A自分度盤10吸附5個電子零件P113~P117，並收納至良品用托盤12之凹穴S113~S117。以此方式，於良品用托盤12之第1列，藉由移送機構11A、11B進行吸附~移送~收納~恢復之一連串之動作(循環)3次，而將17個電子零件P11~P117全部收納至良品用托盤12之第1列之凹穴S11~S117。 So far, since the number of empty pockets in the first column of the good product tray 12 is M The number of the adsorption portions H (the number of adsorption portions) of the transfer mechanisms 11A and 11B is N (six in the present embodiment), so that the six electronic parts P are sucked from the indexing disk 10 by the transfer mechanisms 11A and 11B. It is stored in the good product tray 12. In this state, in the first row of the good goods tray 12, twelve electronic parts P11 to P112 are accommodated in the pockets S11 to S112, and the five pockets S113 to S117 become empty pockets. Since the number of empty pockets M in the first row is smaller than the number N of the adsorption portions, five electronic parts P corresponding to the number of empty pockets M are adsorbed from the indexing disk 10 next. Therefore, the transfer mechanism 11A sucks the five electronic components P113 to P117 from the indexing disk 10 and stores them in the pockets S113 to S117 of the good product tray 12. In this manner, in the first row of the good product tray 12, the transfer mechanism 11A, 11B performs a series of operations (circulation) of adsorption, transfer, storage, and recovery three times, and all of the 17 electronic components P11 to P117 are housed. The pockets S11 to S117 of the first row of the tray 12 of the good product.
考慮於良品用托盤12之各列中之空凹穴數M少於吸附部數 N之情形時，吸附多於空凹穴數M之電子零件P之情形。於該情形時，例如，若移送機構11A、11B吸附可吸附之N個電子零件P，則必須跨及此列與下一列之2列連續地收納電子零件P。若跨及2列收納電子零件P，則收納動作會分為連續之2次，收納之時間成為2倍。若藉由分為連續之2次 之收納動作而收納電子零件P，則收納效率變差。為避免此種情況，本實施例中於良品用托盤12之各列中，空凹穴數M少於吸附部數N之情形時，吸附等於空凹穴數M之個數之電子零件P並收納至良品用托盤12。藉此，可避免藉由分為連續之2次之收納動作而將電子零件P收納至良品用托盤12，從而提高收納效率。 Considering that the number of empty pockets M in each column of the good product tray 12 is less than the number of adsorption portions In the case of N, the case of the electronic component P more than the number of empty pockets M is adsorbed. In this case, for example, when the transfer mechanisms 11A and 11B adsorb the N electronic components P that can be adsorbed, it is necessary to continuously store the electronic components P across the two columns of the column and the next column. When the electronic component P is stored in two rows, the storage operation is divided into two consecutive times, and the storage time is doubled. If divided into 2 consecutive times When the electronic component P is housed in the storage operation, the storage efficiency is deteriorated. In order to avoid such a situation, in the column of the good product tray 12 in the embodiment, when the number of empty pockets M is smaller than the number N of the adsorption portions, the number of electronic parts P equal to the number of empty pockets M is adsorbed. It is stored in the good product tray 12. Thereby, it is possible to prevent the electronic component P from being stored in the good product tray 12 by the storage operation divided into two consecutive times, thereby improving the storage efficiency.
自分度盤10吸附電子零件P之動作、將電子零件P移送並 收納至良品用托盤12之動作、計算良品用托盤12之空凹穴數之處理、自分度盤10吸附與良品用托盤12之空凹穴數相等之個數之電子零件P之動作等所有動作或處理係藉由設置於切片裝置1之控制部CTL(參照圖1)而控制。 The action of the electronic component P is absorbed from the indexing disk 10, and the electronic component P is transferred and The operation of storing the tray 12 for the good product, the calculation of the number of empty pockets of the good tray 12, and the operation of the electronic component P in which the number of the empty pockets of the good tray 12 is equal to the number of empty pockets of the good tray 12 Alternatively, the processing is controlled by the control unit CTL (see FIG. 1) provided in the slicing apparatus 1.
圖5表示於良品用托盤12之第2列之凹穴S收納電子零件 P之狀態。移送機構11B自分度盤10吸附P118~P123之6個電子零件P，並收納至良品用托盤12之第2列之凹穴S217~S212。其次，移送機構11A吸附分度盤10之第1列之P124~P128之5個與第2列之P228之1個之共6個電子零件P。繼而，收納至良品用托盤12之凹穴S211~S26。如此，於良品用托盤12之各列中空凹穴數M多於吸附部數N，且分度盤10中之此列之電子零件P之剩餘數L少於吸附部數N之情形時，自分度盤10跨及2列吸附6個電子零件P並收納至良品用托盤12。 Fig. 5 shows the storage of electronic parts in the recess S of the second row of the good tray 12. The state of P. The transfer mechanism 11B adsorbs the six electronic components P of P118 to P123 from the indexing disk 10, and stores them in the second rows of the pockets S217 to S212 of the good product tray 12. Next, the transfer mechanism 11A adsorbs a total of six electronic parts P of five of P124 to P128 in the first column of the indexing table 10 and one of P228 in the second column. Then, the pockets S211 to S26 of the good product tray 12 are stored. In this manner, when the number M of hollow pockets in each row of the good-purpose tray 12 is more than the number N of adsorption portions, and the remaining number L of the electronic components P in the column of the indexing tray 10 is smaller than the number N of the adsorption portions, the self-divided The dial 10 adsorbs six electronic parts P across the two rows and is stored in the good tray 12.
其次，移送機構11B吸附與良品用托盤12之第2列之空凹穴數相等之個數之5個電子零件P227~P223並收納至凹穴S25~S21。以此方式，於第2列中亦藉由3次之收納動作而收納所有電子零件P217~P21。同樣地，關於良品用托盤12之第3列至第9列亦自分度盤10吸附電子零件P並予以收納。 Next, the transfer mechanism 11B adsorbs the five electronic components P227 to P223 which are equal to the number of empty pockets in the second row of the good tray 12, and stores them in the pockets S25 to S21. In this way, in the second column, all the electronic components P217 to P21 are also accommodated by the storage operation three times. Similarly, in the third to ninth columns of the good product tray 12, the electronic component P is also sucked from the indexing disk 10 and stored.
圖6表示直至良品用托盤12之第9列為止全部收納有電子零件P之狀態。與良品用托盤12之第1列、第2列同樣地，於良品用托盤 12之第3列、第4列、…、第9列中，亦藉由移送機構11A與11B將各電子零件P收納至良品用托盤12之各凹穴S。於良品用托盤12，收納9列×17行共153個電子零件P。於良品用托盤12之凹穴S全部收納電子零件P之後，更換為下一托盤而將電子零件P收納至新的托盤。 FIG. 6 shows a state in which all of the electronic components P are housed up to the ninth column of the good product tray 12. In the same manner as the first column and the second column of the good product tray 12, the tray for good products In the third column, the fourth column, the ..., and the ninth column of 12, the electronic components P are also accommodated in the respective pockets S of the good tray 12 by the transfer mechanisms 11A and 11B. In the good product tray 12, a total of 153 electronic parts P are stored in 9 rows × 17 rows. After the electronic parts P are all stored in the pockets S of the good product tray 12, the electronic parts P are replaced with the next tray, and the electronic parts P are stored in a new tray.
於實施例中，於良品用托盤12之各列設置有17個凹穴S。 移送機構11A、11B之吸附部H設置有6個。因此，若自分度盤10按照6個、6個、5個藉由3次動作吸附電子零件P並收納至良品用托盤12，則於各列之凹穴S中全部收納電子零件P。即，於良品用托盤12之各列之凹穴中藉由3次之收納動作而全部裝填電子零件P。再者，良品用托盤12之各列中之凹穴數M或移送機構中之吸附部數N等並不限定於此，可任意設定。 In the embodiment, 17 pockets S are provided in each column of the good product tray 12. There are six adsorption units H of the transfer mechanisms 11A and 11B. Therefore, when the electronic component P is sucked by the indexing disk 10 by three, six, and five, and stored in the good product tray 12, the electronic component P is accommodated in all the pockets S of each row. In other words, the electronic component P is entirely filled in the pockets of the respective rows of the good trays 12 by the storage operation three times. Further, the number of the holes M in each row of the good product tray 12 or the number N of adsorption portions in the transfer mechanism is not limited thereto, and can be arbitrarily set.
如至此為止所說明般，於良品用托盤12之各列中之空凹穴 數M少於吸附部數N之情形時，自分度盤10吸附等於空凹穴數M之個數之電子零件P並收納至良品用托盤12之空凹穴。藉此，可避免跨及良品用托盤12之2列連續地進行收納動作，從而於各列中可將收納電子零件P之動作全部以1次之動作進行。因此，可縮短將電子零件P收納至良品用托盤12之時間，從而可提高收納效率。 As described so far, the empty pockets in the columns of the good tray 12 When the number M is smaller than the number N of the adsorption portions, the self-indexing disk 10 adsorbs the number of electronic parts P equal to the number of empty pockets M and stores them in the empty pockets of the good tray 12. Thereby, it is possible to prevent the storage operation from being continuously performed in two rows of the good product trays 12, and the operation of accommodating the electronic component P can be performed in one operation in each row. Therefore, the time for storing the electronic component P in the good product tray 12 can be shortened, and the storage efficiency can be improved.
移送機構11A與11B交替地重複吸附分度盤10中之電子零 件P之動作與收納至良品用托盤12之動作。如此，可藉由2個移送機構11A與11B有效率地將電子零件P自分度盤10移送並收納至良品用托盤12。本實施例中，藉由切片裝置1之控制部CTL，而計算良品用托盤12之各列中之空凹穴數M，根據空凹穴數M對2個移送機構11A、11B之動作進行控制。藉此，可有效率地自分度盤10吸附電子零件P並收納至良品用托盤12。 因此，可縮短將電子零件P收納至良品用托盤12之時間，從而可提高切片裝置1之生產性。 The transfer mechanisms 11A and 11B alternately repeat the electron zero in the adsorption indexing disk 10. The operation of the piece P and the movement of the piece P to the good product tray 12. In this manner, the electronic component P can be efficiently transferred from the indexing tray 10 and stored in the good tray 12 by the two transfer mechanisms 11A and 11B. In the present embodiment, the number of empty pockets M in each column of the good tray 12 is calculated by the control unit CTL of the slicing device 1, and the operations of the two transfer mechanisms 11A and 11B are controlled based on the number of empty pockets M. . Thereby, the electronic component P can be efficiently sucked from the indexing disk 10 and stored in the good product tray 12. Therefore, the time for storing the electronic component P in the good product tray 12 can be shortened, and the productivity of the slicing device 1 can be improved.
根據本發明，於良品用托盤12之各列中，剩餘之空凹穴數 M少於移送機構11A、11B之吸附部數N之情形時，自分度盤10吸附等於空凹穴數M之個數之電子零件P並收納至良品用托盤12。因此，可將所吸附之電子零件P無多或少而恰當地僅以設置於各列之凹穴數收納至良品用托盤12之各列。又，藉由2個移送機構11A與11B，而交替地重複吸附電子零件P之動作與收納之動作。因此，於切片裝置1中，可縮短收納電子零件P之時間，從而可提高生產性。 According to the present invention, the number of remaining empty pockets in each column of the good product tray 12 When M is smaller than the number N of adsorption portions of the transfer mechanisms 11A and 11B, the electronic component P equal to the number of empty pockets M is sucked from the indexing disk 10 and stored in the good tray 12. Therefore, the electronic components P to be adsorbed can be accommodated in the respective rows of the good trays 12 only by the number of the pockets provided in each row, more or less. Moreover, the operation of absorbing and accommodating the electronic component P is alternately repeated by the two transfer mechanisms 11A and 11B. Therefore, in the slicing apparatus 1, the time for accommodating the electronic component P can be shortened, and productivity can be improved.
本實施例中，對2個移送機構11A、11B自分度盤10吸附 各電子零件P並收納至良品用托盤12之情形進行了說明。並不限於此，移送機構亦可為1個或3個以上。 In this embodiment, the two transfer mechanisms 11A, 11B are adsorbed from the indexing disk 10. The case where each electronic component P is accommodated in the good product tray 12 is demonstrated. The present invention is not limited thereto, and the transfer mechanism may be one or three or more.
作為被切斷物，除樹脂密封體3以外亦可使用半導體晶圓。 由於在半導體晶圓之各區域製作有電子電路，故而相當於切斷後之各區域之部分(半導體晶片)成為電子零件P。 As the object to be cut, a semiconductor wafer can be used in addition to the resin sealing body 3. Since an electronic circuit is formed in each region of the semiconductor wafer, the portion (semiconductor wafer) corresponding to each region after the cutting becomes the electronic component P.
又，本發明並不限定於上述實施例，於不脫離本發明之主旨之範圍內可視需要任意且適當地組合、變更、或選擇而採用。 Further, the present invention is not limited to the above-described embodiments, and may be arbitrarily and appropriately combined, changed, or selected as needed within the scope of the gist of the invention.
9‧‧‧由複數個電子零件所構成之集合體 9‧‧‧A collection of multiple electronic components
10‧‧‧分度盤(保管構件) 10‧‧‧Dividing plate (keeping member)
11A、11B‧‧‧移送機構(第1移送機構、第2移送機構) 11A, 11B‧‧‧Transfer mechanism (first transfer mechanism, second transfer mechanism)
12‧‧‧良品用托盤(收納構件) 12‧‧‧Good goods tray (storage unit)
P‧‧‧電子零件 P‧‧‧Electronic parts
S‧‧‧凹穴(收納部位) S‧‧‧ recess (storage part)
H、H1~H6‧‧‧吸附部 H, H1~H6‧‧‧ adsorption department
a‧‧‧配置於分度盤之電子零件之間距 a‧‧‧The distance between electronic parts arranged on the indexing plate
b‧‧‧設置於托盤之凹穴之間距 b‧‧‧Set the distance between the pockets of the tray
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2014
- 2014-04-29 TW TW103115317A patent/TWI570829B/en active
- 2014-07-18 KR KR1020140091043A patent/KR101641771B1/en active IP Right Grant
- 2014-07-28 CN CN201410363740.1A patent/CN104347463B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040146383A1 (en) * | 2003-01-14 | 2004-07-29 | International Product Technology, Inc. | Apparatus having a variable pitch pick-and-place head for packaging electrical parts and methods of operating the same |
| US20100313415A1 (en) * | 2009-06-11 | 2010-12-16 | Chan Wai Lik | Rotary clip bonder |
| JP2012119548A (en) * | 2010-12-02 | 2012-06-21 | Yamaha Motor Co Ltd | Mounting machine |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201505119A (en) | 2015-02-01 |
| KR20150014377A (en) | 2015-02-06 |
| KR101641771B1 (en) | 2016-07-21 |
| JP2015026789A (en) | 2015-02-05 |
| CN104347463B (en) | 2017-12-19 |
| CN104347463A (en) | 2015-02-11 |
| JP6017382B2 (en) | 2016-11-02 |
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