JP2015026789A - Apparatus and method for conveying individualized electronic component - Google Patents

Apparatus and method for conveying individualized electronic component Download PDF

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JP2015026789A
JP2015026789A JP2013156950A JP2013156950A JP2015026789A JP 2015026789 A JP2015026789 A JP 2015026789A JP 2013156950 A JP2013156950 A JP 2013156950A JP 2013156950 A JP2013156950 A JP 2013156950A JP 2015026789 A JP2015026789 A JP 2015026789A
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electronic component
electronic components
transfer mechanism
electronic
transporting
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JP2015026789A5 (en
JP6017382B2 (en
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一郎 今井
Ichiro Imai
一郎 今井
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Towa Corp
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Priority to CN201410363740.1A priority patent/CN104347463B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Specific Conveyance Elements (AREA)

Abstract

PROBLEM TO BE SOLVED: To efficiently accommodate electronic components even when the number of electronic components to be disposed and accommodated in an index table and within one row of a tray is different.SOLUTION: In the case where a number M of empty pockets becomes less than a number N of adsorption parts in transfer mechanisms 11A and 11B in each row of a non-defective article tray 12, electronic components P as many as the number M of empty pockets are adsorbed from an index table 10 and accommodated in the empty pockets of the tray 12. The two transfer mechanisms 11A and 11B are controlled in accordance with the number M of empty pockets, thereby preventing one of the transfer mechanisms 11A and 11B from performing an operation for accommodating the electronic components P separately twice. Therefore, the time required for accommodating the electronic components P in the non-defective article tray 12 can be shortened and productivity of an individualizing device can be improved.

Description

本発明は、板状の被切断物を切断して個片化された複数の電子部品を搬送する個片化された電子部品の搬送装置及び搬送方法に関するものである。   The present invention relates to a transport apparatus and a transport method for individualized electronic components that transport a plurality of individual electronic components by cutting a plate-shaped workpiece.

プリント基板やリードフレームなどからなる基板を格子状の複数の領域に仮想的に区画して、各々の領域にチップ状の素子を装着した後、基板全体を樹脂封止したものを樹脂封止体（封止済基板）という。この樹脂封止体を回転刃などを使用した個片化装置によって切断し、各領域単位に個片化したものが電子部品となる。   A substrate made of a printed circuit board, a lead frame, or the like is virtually divided into a plurality of grid-like areas, chip-like elements are mounted in each area, and the entire board is resin-sealed. It is called (sealed substrate). An electronic component is obtained by cutting the resin sealing body with a singulation device using a rotary blade or the like, and dividing the resin into individual regions.

樹脂封止体を切断して個片化された電子部品、例えば、ＢＧＡ（Ball Grid Array Package）製品は、検査工程において封止樹脂側（モールド面）及び基板側（ボール面）の検査を行って、良品か不良品か否かを判断される。検査済みの電子部品はすべてインデックステーブルに配置される。インデックステーブルに配置された電子部品は、良品と不良品とに選別され、移送機構によって良品用トレイと不良品用トレイとにそれぞれ収容される。   Electronic parts separated by cutting the resin sealing body, for example, BGA (Ball Grid Array Package) products, inspect the sealing resin side (mold surface) and the substrate side (ball surface) in the inspection process Whether the product is good or defective is determined. All inspected electronic components are placed in the index table. The electronic components arranged on the index table are sorted into non-defective products and defective products, and are accommodated in the non-defective product tray and the defective product tray by the transfer mechanism, respectively.

近年、電子部品の小型化がますます進む一方、電子部品の生産効率を高めるために、基板を大型化して、１枚の基板から取り出す電子部品の数を増やしたいという要求が強くなっている。これに伴い、インデックステーブルやトレイは大型化するとともに、電子部品を収容する領域はより小さくなる傾向にある。   In recent years, electronic components have been increasingly miniaturized, and in order to increase the production efficiency of electronic components, there has been a strong demand for increasing the number of electronic components to be taken out from a single substrate by increasing the size of the substrate. As a result, the index table and the tray are increased in size, and the area for storing the electronic components tends to be smaller.

個片化装置において、インデックステーブルに配置される電子部品の数とトレイに収容される電子部品の数とは通常異なる。さらに、インデックステーブルに電子部品を配置するピッチとトレイに電子部品を収容するピッチとが異なる。したがって、インデックステーブルに配置された電子部品を効率よくトレイに移送して収容する技術が重要となってくる。   In the singulation apparatus, the number of electronic components arranged in the index table is usually different from the number of electronic components accommodated in the tray. Furthermore, the pitch for arranging the electronic components on the index table is different from the pitch for accommodating the electronic components on the tray. Therefore, a technique for efficiently transporting and storing the electronic components arranged on the index table to the tray becomes important.

電子部品をピックアップして搬送する搬送装置として、「検査対象デバイスを摘み上げるための吸着手段を有する複数のピックアップユニットを備えた搬送装置において、各ピックアップユニットに設けられた係合部材と、この係合部材が係合される係合溝が切られていて移動可能な共通部材と、を有し、前記共通部材の移動に伴ってピックアップユニットが移動し、吸着手段の間隔が変わることを特徴とする」搬送装置が提案されている（例えば、特許文献１の段落、［００１３］、図１）。   As a transport device that picks up and transports an electronic component, “in a transport device including a plurality of pickup units having suction means for picking up a device to be inspected, an engagement member provided in each pickup unit; And a common member movable with the engagement groove engaged therewith, wherein the pickup unit moves in accordance with the movement of the common member, and the interval of the suction means changes. A “conveying device” has been proposed (for example, paragraph [0013], FIG. 1 of Patent Document 1).

特開２００４−３９７０６号公報JP 2004-39706 A

しかしながら、上記の特許文献には、インデックステーブルにおける１方向に沿って配置される電子部品の数及びピッチと、トレイにおける１方向に沿って収容される電子部品の数及びピッチとが異なる場合において、どのようにして効率的に電子部品をインデックステーブルからトレイに収容するのか述べられていない。   However, in the above patent document, when the number and pitch of electronic components arranged along one direction in the index table is different from the number and pitch of electronic components accommodated along one direction in the tray, There is no mention of how to efficiently store electronic components from the index table to the tray.

本発明は、インデックステーブルにおける１方向に沿って配置される電子部品の数及びピッチと、トレイにおける１方向に沿って収容される電子部品の数及びピッチとが異なる場合において、トレイの空きポケット数に応じて電子部品を吸着してトレイに効率よく収容することを可能とした個片化された電子部品の搬送装置及び搬送方法を提供することを目的とする。   The present invention relates to the number of empty pockets in a tray when the number and pitch of electronic components arranged along one direction in the index table are different from the number and pitch of electronic components accommodated along one direction in the tray. Accordingly, it is an object of the present invention to provide an apparatus and a method for transporting individual electronic components that can be efficiently accommodated in a tray by adsorbing the electronic components.

上記の課題を解決するために、本発明に係る個片化された電子部品の搬送装置は、板状部材に設けられた複数の領域を単位として板状部材を個片化することによって製造された複数の電子部品を搬送する個片化された電子部品の搬送装置であって、電子部品がそれぞれ配置される複数の配置場所を有する保管部材と、電子部品がそれぞれ収容される複数の収容場所を有する収容部材と、複数の配置場所から電子部品をそれぞれ吸着して複数の収容場所に移送して収容する移送機構と、移送機構に設けられ、電子部品を吸着する機能及び該電子部品に対する吸着を解除する機能を有するＮ個（Ｎは２以上の整数）の吸着部とを備え、複数の収容場所の１方向に沿う１行において収容場所の空き場所の数がＭ個（Ｍは正の整数）であってＭ＜Ｎである場合には保管部材からＭ個の電子部品が吸着部によって吸着され、Ｍ≧Ｎである場合には保管部材からＮ個の電子部品を吸着部によって吸着され、吸着された電子部品が、移送機構によって収容部材に移送され、吸着が解除されることによってＭ個の空き場所のうちの少なくとも一部に収容されることを特徴とする。   In order to solve the above-described problems, a device for transporting an individualized electronic component according to the present invention is manufactured by dividing a plate-like member into units of a plurality of regions provided in the plate-like member. A device for transporting individual electronic components for transporting a plurality of electronic components, the storage member having a plurality of placement locations where the electronic components are respectively placed, and the plurality of accommodation locations where the electronic components are respectively accommodated A housing member, a transfer mechanism that sucks and transports electronic components from a plurality of placement locations to a plurality of placement locations, a function provided in the transport mechanism and sucks the electronic components, and suction to the electronic components N (N is an integer greater than or equal to 2) suction portions having a function of releasing the number, and the number of empty places in the storage place in one line along one direction of the plurality of storage places (M is positive) Integer) and M <N If M ≧ N, the electronic parts are adsorbed by the adsorption part, and if M ≧ N, the N electronic parts are adsorbed by the adsorption part, and the adsorbed electronic parts are transferred. It is transferred to an accommodation member by a mechanism, and is accommodated in at least a part of M free spaces by releasing the suction.

また、本発明に係る個片化された電子部品の搬送装置は、上述した搬送装置において、空き場所の数を計算して、該空き場所の数に応じた数の電子部品を吸着して保管部材から収容部材に移送して収容するように移送機構を制御する制御部を備えたことを特徴とする。   In addition, according to the present invention, the device for transporting the separated electronic parts calculates the number of empty places and sucks and stores the number of electronic components according to the number of empty places in the above-described transport device. A control unit is provided for controlling the transfer mechanism so as to be transferred from the member to the storage member and stored.

また、本発明に係る個片化された電子部品の搬送装置は、上述した搬送装置において、移送機構として第１の移送機構と第２の移送機構とを備え、第１の移送機構と第２の移送機構とのうち一方が保管部材における電子部品を吸着する間において、他方が吸着部に吸着された電子部品を収容部材に収容することを特徴とする。   According to another aspect of the present invention, there is provided a device for transporting individualized electronic components, including the first transport mechanism and the second transport mechanism as the transport mechanism in the transport device described above. While one of the transfer mechanisms adsorbs the electronic component on the storage member, the other accommodates the electronic component adsorbed on the adsorbing portion in the accommodating member.

また、本発明に係る個片化された電子部品の搬送装置は、上述した搬送装置において、吸着部は、該吸着部同士の間隔を複数の配置場所のピッチ又は複数の収容場所のピッチに合わせて可変する機能を有することを特徴とする。   In addition, in the transport device for individualized electronic components according to the present invention, in the transport device described above, the suction unit adjusts the spacing between the suction units to the pitch of a plurality of placement locations or the pitch of a plurality of storage locations. And has a variable function.

また、本発明に係る個片化された電子部品の搬送装置は、上述した搬送装置において、板状部材は樹脂封止体であり、電子部品は回路基板と受動素子又は能動素子を含むチップと硬化樹脂からなる封止樹脂とを有することを特徴とする。   Further, according to the present invention, there is provided a device for transporting individualized electronic components, wherein the plate-shaped member is a resin sealing body, and the electronic component includes a circuit board and a chip including a passive element or an active element. And a sealing resin made of a cured resin.

また、本発明に係る個片化された電子部品の搬送装置は、上述した搬送装置において、板状部材は半導体ウェーハであり、電子部品は半導体チップであることを特徴とする。   According to another aspect of the present invention, there is provided an apparatus for transporting separated electronic components, wherein the plate-like member is a semiconductor wafer and the electronic component is a semiconductor chip.

上記の課題を解決するために、本発明に係る個片化された電子部品の搬送方法は、板状部材に設けられた複数の領域を単位として板状部材を個片化することによって製造された複数の電子部品を搬送する個片化された電子部品の搬送方法であって、個片化された電子部品を保管部材に設けられた複数の配置場所にそれぞれ配置する工程と、移送機構に設けられたＮ個（Ｎは２以上の整数）の吸着部によって複数の配置場所から電子部品を吸着する工程と、移送機構によって複数の配置場所から収容部材に設けられた複数の収容場所に電子部品を移送する工程と、電子部品に対する吸着を解除することによって電子部品を収容場所に収容する工程とを備え、吸着する工程では、収容部材の１方向に沿う１行において収容場所の空き場所の数がＭ個（Ｍは正の整数）であってＭ＜Ｎである場合には保管部材からＭ個の電子部品を吸着部によって吸着し、Ｍ≧Ｎである場合には保管部材からＮ個の電子部品を吸着部によって吸着し、移送する工程では、移送機構によって電子部品をＭ個の空き場所のうちの少なくとも一部に移送し、収容する工程では、電子部品に対する吸着を解除することによってＭ個の空き場所のうちの少なくとも一部に収容することを特徴とする。   In order to solve the above-described problems, the method for transporting an individualized electronic component according to the present invention is manufactured by dividing a plate-like member into a plurality of regions provided in the plate-like member. A method of transporting individual electronic components for transporting a plurality of electronic components, the step of disposing the individual electronic components at a plurality of placement locations provided in a storage member, and a transfer mechanism A step of adsorbing electronic components from a plurality of arrangement locations by the provided N (N is an integer of 2 or more) adsorbing portions, and a plurality of arrangement locations from the plurality of arrangement locations by a transfer mechanism A step of transferring the component and a step of accommodating the electronic component in the accommodation location by releasing the adsorption to the electronic component. In the adsorption step, the empty space of the accommodation location is arranged in one line along one direction of the accommodation member. Number is M (M is a positive integer), and when M <N, M electronic components are sucked from the storage member by the suction unit. When M ≧ N, N electronic components are stored from the storage member. In the process of adsorbing and transferring by the adsorption unit, the electronic component is transferred to at least a part of the M empty places by the transfer mechanism, and in the process of storing, the M empty parts are released by releasing the adsorption to the electronic part. It is housed in at least a part of the place.

また、本発明に係る個片化された電子部品の搬送方法は、上述した搬送方法において、空き場所の数を計算して、該空き場所の数に応じた数の電子部品を吸着して保管部材から収容部材に移送して収容するように移送機構を制御する工程を備えることを特徴とする。   In addition, the method for transporting individualized electronic components according to the present invention is the above transport method, wherein the number of empty places is calculated and the number of electronic components according to the number of empty places is sucked and stored. A step of controlling the transfer mechanism so as to be transferred from the member to the storage member and stored therein is provided.

また、本発明に係る個片化された電子部品の搬送方法は、上述した搬送方法において、移送機構として設けられた第１の移送機構と第２の移送機構とのうち一方が保管部材における電子部品を吸着する間において、他方が吸着部が吸着した電子部品を収容部材に収容することを特徴とする。   According to another aspect of the present invention, there is provided a method for transporting individualized electronic components, wherein one of a first transport mechanism and a second transport mechanism provided as a transport mechanism is an electronic component in a storage member. While the component is adsorbed, the other is characterized in that the electronic component adsorbed by the adsorbing portion is accommodated in the accommodating member.

また、本発明に係る個片化された電子部品の搬送方法は、上述した搬送方法において、吸着部同士の間隔を複数の配置場所のピッチ又は複数の収容場所のピッチに合わせて可変する工程を備えることを特徴とする。   Further, the method for transporting the separated electronic components according to the present invention includes the step of varying the interval between the suction portions in accordance with the pitch of the plurality of placement locations or the pitch of the plurality of storage locations in the transport method described above. It is characterized by providing.

また、本発明に係る個片化された電子部品の搬送方法は、上述した搬送方法において、板状部材は樹脂封止体であり、電子部品は回路基板と受動素子又は能動素子を含むチップと硬化樹脂からなる封止樹脂とを有することを特徴とする。   In addition, the method for transporting the separated electronic component according to the present invention is the above-described transport method, wherein the plate-like member is a resin sealing body, and the electronic component includes a circuit board and a chip including a passive element or an active element. And a sealing resin made of a cured resin.

また、本発明に係る個片化された電子部品の搬送方法は、上述した搬送方法において、板状部材は半導体ウェーハであり、電子部品は半導体チップであることを特徴とする。   According to another aspect of the present invention, there is provided a method for transporting an individualized electronic component, wherein the plate-like member is a semiconductor wafer and the electronic component is a semiconductor chip.

本発明によれば、収容部材の１方向に沿う１行において空き場所の数Ｍが吸着部の数Ｎよりも少なくなった場合には、空き場所の数に等しい電子部品を保管部材から吸着する。移送機構によって吸着された電子部品を収容部材に移送して空き場所に収容する。空き場所の数に応じて移送機構を制御することによって、電子部品を空き場所に収容する動作を２回連続して行うことが回避される。したがって、効率よく保管部材から収容部材に電子部品を収容することが可能となる。   According to the present invention, when the number M of vacant places is smaller than the number N of suction portions in one row along one direction of the housing member, electronic components equal to the number of vacant places are sucked from the storage member. . The electronic component sucked by the transfer mechanism is transferred to the storage member and stored in the empty space. By controlling the transfer mechanism in accordance with the number of empty places, it is possible to avoid performing the operation of accommodating electronic components twice in the empty places. Therefore, it is possible to efficiently accommodate the electronic component from the storage member to the accommodating member.

本実施例に係る個片化装置を示す概略平面図である。It is a schematic plan view which shows the singulation apparatus which concerns on a present Example. インデックステーブルと移送機構とトレイとの構成を示す概略平面図である。It is a schematic plan view which shows the structure of an index table, a transfer mechanism, and a tray. 移送機構によって電子部品をトレイに収容する工程を示す概略断面図である。It is a schematic sectional drawing which shows the process of accommodating an electronic component in a tray with a transfer mechanism. トレイの１行目のポケットに電子部品を収容する状態を示す概略図である。It is the schematic which shows the state which accommodates an electronic component in the pocket of the 1st line of a tray. トレイの２行目のポケットに電子部品を収容する状態を示す概略図である。It is the schematic which shows the state which accommodates an electronic component in the pocket of the 2nd line of a tray. トレイ全体に電子部品を収容する状態を示す概略図である。It is the schematic which shows the state which accommodates an electronic component in the whole tray.

良品用トレイの各行において、空きポケット数が移送機構の吸着部数よりも少なくなった場合には、空きポケット数に等しい数の電子部品をインデックステーブルから吸着する。移送機構によって吸着された電子部品を良品用トレイに移送して空きポケットに収容する。   When the number of empty pockets in each row of the non-defective product tray is smaller than the number of sucking parts of the transfer mechanism, a number of electronic components equal to the number of empty pockets are sucked from the index table. The electronic component sucked by the transfer mechanism is transferred to a non-defective tray and accommodated in an empty pocket.

実施例として、図１〜図６を参照して本発明に係る個片化された電子部品の搬送装置について説明する。本出願書類におけるいずれの図についても、わかりやすくするために、適宜省略し又は誇張して模式的に描かれている。同一の構成要素については、同一の符号を付して説明を適宜省略する。   As an embodiment, a description will be given of a device for transporting separated electronic components according to the present invention with reference to FIGS. Any figure in the present application document is schematically omitted or exaggerated as appropriate for easy understanding. About the same component, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably.

図１は、本実施例に係る個片化装置１を示す概略平面図である。個片化装置１は、被切断物を複数の電子部品に個片化する。個片化装置１は、受け入れユニットＡと個片化ユニットＢと検査ユニットＣと収容ユニットＤとを、それぞれ構成要素（モジュール）として有する。   FIG. 1 is a schematic plan view showing a singulation apparatus 1 according to this embodiment. The singulation apparatus 1 divides an object to be cut into a plurality of electronic components. The singulation apparatus 1 includes a receiving unit A, a singulation unit B, an inspection unit C, and a storage unit D as components (modules).

受け入れユニットＡと個片化ユニットＢと検査ユニットＣと収容ユニットＤとが、それぞれ他の構成要素に対して着脱可能かつ交換可能であり、それぞれが予想される要求仕様に応じた異なる複数の仕様を有するようにして予め用意される。受け入れユニットＡと個片化ユニットＢと検査ユニットＣと収容ユニットＤとを含んで個片化装置１が構成される。   The receiving unit A, the singulation unit B, the inspection unit C, and the housing unit D are detachable and replaceable with respect to other components, respectively, and each of the specifications differs according to the expected required specifications. It is prepared in advance so as to have. The singulation apparatus 1 includes the receiving unit A, the singulation unit B, the inspection unit C, and the accommodation unit D.

受け入れユニットＡにはプレステージ２が設けられる。前工程の装置である樹脂封止装置から、被切断物に相当する樹脂封止体（成形済基板）３がプレステージ２に受け入れられる。樹脂封止体３は、封止樹脂の側を下にしてプレステージ２に配置される。   The receiving unit A is provided with a prestage 2. A resin-sealed body (molded substrate) 3 corresponding to an object to be cut is received by the prestage 2 from a resin-sealing device that is a device in the previous process. The resin sealing body 3 is disposed on the prestage 2 with the sealing resin side down.

樹脂封止体３は、リードフレームやプリント基板などの回路基板と、回路基板における格子状の複数の領域に装着され受動素子又は能動素子を含むチップと、一括して成形された硬化樹脂からなる封止樹脂とを有する。   The resin sealing body 3 includes a circuit board such as a lead frame or a printed board, a chip including passive elements or active elements mounted in a plurality of grid-like regions on the circuit board, and a cured resin formed in a lump. And a sealing resin.

個片化ユニットＢには切断用テーブル４が設けられる。切断用テーブル４は、図のＸ方向に移動可能であり、かつ、θ方向に回動可能である。切断用テーブル４の上には切断用ステージ５が取り付けられる。個片化ユニットＢの奥の部分には、切断機構として２個のスピンドルユニット６が設けられる。２個のスピンドルユニット６は、独立してＹ方向に移動可能である。２個のスピンドルユニット６には、それぞれ回転刃７が設けられる。これらの回転刃７は、それぞれＸ方向に沿う面内において回転することによって樹脂封止体３を切断する。したがって、本実施例では、それぞれ回転刃７を使用した２個の切断機構が個片化ユニットＢに設けられる。切断機構は１個であっても３個以上であってもよい。   The separation unit B is provided with a cutting table 4. The cutting table 4 can move in the X direction in the figure and can rotate in the θ direction. A cutting stage 5 is attached on the cutting table 4. Two spindle units 6 are provided as a cutting mechanism at the back of the singulation unit B. The two spindle units 6 can move independently in the Y direction. Each of the two spindle units 6 is provided with a rotary blade 7. These rotary blades 7 cut the resin sealing body 3 by rotating in a plane along the X direction. Therefore, in this embodiment, the cutting unit B is provided with two cutting mechanisms each using the rotary blade 7. There may be one cutting mechanism or three or more cutting mechanisms.

検査ユニットＣには検査用ステージ８が設けられる。樹脂封止体３を切断して個片化された複数の電子部品Ｐからなる集合体９は、検査用ステージ８に一括して吸着される。検査用ステージ８はＸ方向を軸にして回転できるように構成されている。個片化された複数の電子部品Ｐ（例えば、ＢＧＡ製品）は、封止樹脂側（モールド面）及び基板側（ボール面）を検査することによって、良品と不良品とに選別される。検査済みの電子部品Ｐは、インデックステーブル１０に市松模様状（checker flag pattern状）又は格子状に配置される。図１においては、市松模様状に配置された場合について示している。検査ユニットＣには、インデックステーブル１０に配置された電子部品Ｐをトレイに移送する複数の移送機構１１Ａ、１１Ｂが設けられる。   The inspection unit C is provided with an inspection stage 8. The assembly 9 composed of a plurality of electronic components P cut into pieces by cutting the resin sealing body 3 is collectively sucked to the inspection stage 8. The inspection stage 8 is configured to be rotatable about the X direction. A plurality of separated electronic parts P (for example, BGA products) are sorted into non-defective products and defective products by inspecting the sealing resin side (mold surface) and the substrate side (ball surface). The inspected electronic components P are arranged on the index table 10 in a checkered pattern (checker flag pattern) or lattice. In FIG. 1, it has shown about the case where it arrange | positions in checkered pattern shape. The inspection unit C is provided with a plurality of transfer mechanisms 11A and 11B that transfer the electronic components P arranged on the index table 10 to a tray.

収容ユニットＤには良品を収容する良品用トレイ１２と不良品を収容する不良品用トレイ１３とが設けられる。電子部品Ｐは、移送機構１１Ａ、１１Ｂによって良品と不良品とに選別されて各トレイに収容される。なお、ここではインデックステーブル１０に配置された電子部品Ｐはすべて良品であると仮定する。   The storage unit D is provided with a non-defective product tray 12 for storing non-defective products and a defective product tray 13 for storing defective products. The electronic components P are sorted into non-defective products and defective products by the transfer mechanisms 11A and 11B and stored in each tray. Here, it is assumed that all the electronic components P arranged in the index table 10 are non-defective products.

以上、個片化装置１の構成と動作について説明してきた。個片化装置１における動作は、例えば、受け入れユニットＡ内に設けられた制御部ＣＴＬによって制御される。   The configuration and operation of the singulation apparatus 1 have been described above. The operation in the singulation apparatus 1 is controlled by a control unit CTL provided in the receiving unit A, for example.

図２は、インデックステーブル１０と移送機構１１Ａ、１１Ｂと良品用トレイ１２との構成を示す概略図である。図２においては、電子部品Ｐが格子状に配置された場合について示している。インデックステーブル１０の横方向（Ｘ方向）に沿う並びを「行」と呼び、縦方向（Ｙ方向）に沿う並びを「列」と呼ぶことにする。この場合は、１０行×２８列の合計２８０個の電子部品Ｐが、インデックステーブル１０の区画された各領域に配置される。電子部品Ｐは１０行×２８列のマトリクス上に配置されるので、例えば、３行目の４列目に配置された電子部品Ｐを電子部品Ｐ３４と呼ぶことにする。したがって、１行目には電子部品Ｐ１１〜Ｐ１２８、２行目には電子部品Ｐ２１〜Ｐ２２８、・・・、１０行目には電子部品Ｐ１０１〜Ｐ１０２８が配置され、合計２８０個の電子部品Ｐがインデックステーブル１０に配置される。   FIG. 2 is a schematic diagram showing the configuration of the index table 10, the transfer mechanisms 11 </ b> A and 11 </ b> B, and the non-defective product tray 12. FIG. 2 shows a case where the electronic components P are arranged in a grid pattern. The arrangement along the horizontal direction (X direction) of the index table 10 is called “row”, and the arrangement along the vertical direction (Y direction) is called “column”. In this case, a total of 280 electronic components P of 10 rows × 28 columns are arranged in each partitioned area of the index table 10. Since the electronic component P is arranged on a matrix of 10 rows × 28 columns, for example, the electronic component P arranged in the fourth column of the third row is referred to as an electronic component P34. Therefore, the electronic components P11 to P128 are arranged in the first row, the electronic components P21 to P228 are arranged in the second row, and the electronic components P101 to P1028 are arranged in the tenth row, and a total of 280 electronic components P are arranged. Arranged in the index table 10.

同様にして、良品用トレイ１２には９行×１７列の合計１５３個の電子部品Ｐを収容するためのポケットＳが設けられている。各ポケットＳは電子部品Ｐを収容するための凹部を有する形状に形成されている。１行目にはポケットＳ１１〜Ｓ１１７、２行目にはポケットＳ２１〜Ｓ２１７、・・・、９行目にはポケットＳ９１〜Ｓ９１７が設けられている。   Similarly, the non-defective product tray 12 is provided with pockets S for accommodating a total of 153 electronic components P of 9 rows × 17 columns. Each pocket S is formed in a shape having a recess for accommodating the electronic component P. Pockets S11 to S117 are provided on the first line, pockets S21 to S217,... Are provided on the second line, and pockets S91 to S917 are provided on the ninth line.

インデックステーブル１０においては、電子部品ＰはＸ方向及びＹ方向ともピッチａの間隔をおいて配置される。同様に、良品用トレイ１２においては、ポケットＳはＸ方向及びＹ方向ともピッチｂの間隔をおいて形成されている。インデックステーブル１０のピッチａと良品用トレイ１２のピッチｂとは異なる。対象とする製品によって、インデックステーブル１０に配置される電子部品の数や良品用トレイ１２に収容される電子部品の数も異なる。このように、インデックステーブル１０に配置される電子部品Ｐの数やピッチと良品用トレイ１２に収容される電子部品Ｐの数やピッチとは通常異なる。   In the index table 10, the electronic components P are arranged with a pitch a in both the X direction and the Y direction. Similarly, in the non-defective product tray 12, the pockets S are formed at an interval of a pitch b in both the X direction and the Y direction. The pitch a of the index table 10 and the pitch b of the non-defective tray 12 are different. The number of electronic components arranged in the index table 10 and the number of electronic components accommodated in the non-defective product tray 12 vary depending on the target product. As described above, the number and pitch of the electronic components P arranged on the index table 10 are usually different from the number and pitch of the electronic components P accommodated in the non-defective product tray 12.

図２において、移送機構１１Ａ、１１Ｂはそれぞれ複数の独立した吸着部Ｈ（具体的には６個の吸着部Ｈ１〜Ｈ６）を備えている。各吸着部Ｈ１〜Ｈ６はそれぞれが昇降し、かつ、電子部品Ｐを吸着する機能及び吸着を解除する機能を有している。また、移送機構１１Ａ、１１Ｂは各吸着部Ｈ１〜Ｈ６の間隔を可変できるように構成されている。移送機構１１Ａ、１１Ｂは、吸着部Ｈ１〜Ｈ６によってインデックステーブル１０に配置された電子部品Ｐを最大で６個吸着することができる。移送機構１１Ａ、１１Ｂは、吸着した電子部品Ｐを順次良品用トレイ１２に移送して所定のポケットＳに収容する。移送機構１１Ａ、１１Ｂは、電子部品Ｐをインデックステーブル１０から吸着する場合には吸着部Ｈの間隔をピッチａに合わせて吸着し、良品用トレイ１２に収容する場合にはピッチｂに合わせて電子部品Ｐを収容する。   In FIG. 2, each of the transfer mechanisms 11 </ b> A and 11 </ b> B includes a plurality of independent suction portions H (specifically, six suction portions H <b> 1 to H <b> 6). Each of the suction portions H1 to H6 has a function of lifting and lowering the electronic component P and a function of releasing the suction. In addition, the transfer mechanisms 11A and 11B are configured so that the intervals between the suction portions H1 to H6 can be varied. The transfer mechanisms 11A and 11B can suck up to six electronic components P arranged on the index table 10 by the suction portions H1 to H6. The transfer mechanisms 11 </ b> A and 11 </ b> B sequentially transfer the sucked electronic components P to the non-defective product tray 12 and store them in a predetermined pocket S. The transport mechanisms 11A and 11B adsorb the electronic parts P from the index table 10 when the electronic parts P are adsorbed according to the pitch a. The part P is accommodated.

図２に示すように、インデックステーブル１０に配置された電子部品Ｐは、移送機構１１Ａ、１１Ｂによって、１行目のＰ１１〜Ｐ１２８、２行目のＰ２２８〜Ｐ２１、３行目のＰ３１〜Ｐ３２８、４行目のＰ４２８〜Ｐ４１、・・・と各行、交互に二点鎖線の矢印の方向に沿って吸着されて移送される。同様にして、良品用トレイ１２においては、１行目のＳ１１〜Ｓ１１７、２行目のＳ２１７〜Ｓ２１、３行目のＳ３１〜Ｓ３１７、４行目のＳ４１７〜Ｓ４１、・・・と各行、交互に二点鎖線の矢印の方向に沿って電子部品ＰはポケットＳに収容される。   As shown in FIG. 2, the electronic components P arranged in the index table 10 are transferred by the transfer mechanisms 11A and 11B to P11 to P128 on the first row, P228 to P21 on the second row, P31 to P328 on the third row, The fourth row P428 to P41,... And each row are alternately adsorbed and transferred along the direction of the two-dot chain line arrow. Similarly, in the non-defective product tray 12, the first row S11 to S117, the second row S217 to S21, the third row S31 to S317, the fourth row S417 to S41,. The electronic component P is accommodated in the pocket S along the direction of the two-dot chain line arrow.

図３は、移送機構１１Ａによって電子部品Ｐ１１〜Ｐ１６を良品用トレイ１２に収容する工程を示す概略断面図である。図３（ａ）に示すように、インデックステーブル１０には各電子部品Ｐをそれぞれ吸着するための吸着口１４が設けられている。インデックステーブル１０の区画された各領域が、電子部品Ｐを配置するための凹部を備えているような場合であれば、吸着口１４は特に設けなくてもよい。   FIG. 3 is a schematic cross-sectional view showing a process of accommodating the electronic components P11 to P16 in the non-defective product tray 12 by the transfer mechanism 11A. As shown in FIG. 3A, the index table 10 is provided with suction ports 14 for sucking each electronic component P. If each divided area of the index table 10 is provided with a recess for placing the electronic component P, the suction port 14 may not be provided.

まず、図３（ａ）に示すように、移送機構１１Ａの吸着部Ｈの間隔をピッチａに合わせる。移送機構１１Ａがインデックステーブル１０の１行目（図２参照）に配置された電子部品Ｐ１１〜Ｐ１６を吸着できる位置まで移動する。吸着部Ｈ１〜Ｈ６が下降してそれぞれが電子部品Ｐ１１〜Ｐ１６を吸着する。   First, as shown to Fig.3 (a), the space | interval of the adsorption | suction part H of 11 A of transfer mechanisms is match | combined with the pitch a. The transport mechanism 11A moves to a position where the electronic components P11 to P16 arranged in the first row (see FIG. 2) of the index table 10 can be picked up. The suction portions H1 to H6 descend and each sucks the electronic components P11 to P16.

次に、図３（ｂ）に示すように、移送機構１１Ａが良品用トレイ１２の１行目（図２参照）に設けられたポケットＳ１１〜Ｓ１６上に移動し、吸着部Ｈの間隔をピッチｂに合わせる。吸着部Ｈが下降して電子部品Ｐ１１〜Ｐ１６をポケットＳ１１〜Ｓ１６に収容した後に、吸着を解除する。移送機構１１Ａによって、良品用トレイ１２の１行目には６個の電子部品Ｐ１１〜Ｐ１６が収容される。このように、移送機構１１Ａ、１１Ｂは、電子部品Ｐをインデックステーブル１０から吸着する時には吸着部Ｈの間隔をピッチａに合わせて吸着し、良品用トレイ１２に収容する時にはピッチｂに合わせて電子部品Ｐを収容する。   Next, as shown in FIG. 3B, the transfer mechanism 11 </ b> A moves onto the pockets S <b> 11 to S <b> 16 provided in the first row (see FIG. 2) of the non-defective product tray 12 and pitches the intervals between the suction portions H. Set to b. After the suction part H is lowered and the electronic components P11 to P16 are accommodated in the pockets S11 to S16, the suction is released. Six electronic components P11 to P16 are accommodated in the first row of the non-defective product tray 12 by the transfer mechanism 11A. As described above, the transfer mechanisms 11A and 11B adsorb the electronic parts P from the index table 10 when the electronic parts P are adsorbed according to the pitch a, and when the electronic parts P are accommodated in the non-defective product tray 12, the electronic components P are adjusted according to the pitch b. The part P is accommodated.

図４〜図６を用いて、移送機構１１Ａ、１１Ｂによって、電子部品Ｐを良品用トレイ１２に収容する具体例について説明する。ここではインデックステーブル１０に配置された電子部品Ｐがすべて良品であると仮定して説明する。なお、不良品があった場合には、まず良品のみをインデックステーブル１０から良品用トレイ１２に移送して収容する。そして、良品の収容がすべて完了した後に、残った不良品を不良品用トレイ１３に移送して収容する。   A specific example in which the electronic component P is accommodated in the non-defective product tray 12 by the transfer mechanisms 11A and 11B will be described with reference to FIGS. Here, description will be made assuming that all the electronic components P arranged in the index table 10 are non-defective products. If there is a defective product, only the good product is first transferred from the index table 10 to the good product tray 12 and stored. Then, after all the non-defective products are accommodated, the remaining defective products are transferred to the defective product tray 13 and accommodated.

図４は、良品用トレイ１２の１行目のポケットＳに電子部品Ｐを収容する状態を示す。まず、移送機構１１Ａがインデックステーブル１０の１行目に配置された６個の電子部品Ｐ１１〜Ｐ１６を吸着し、良品用トレイ１２の１行目に設けられたポケットＳ１１〜Ｓ１６の上に移送し、電子部品Ｐ１１〜Ｐ１６に対する吸着を解除して電子部品Ｐ１１〜Ｐ１６を収容する。移送機構１１Ａは、移動してインデックステーブル１０の上の位置に復帰する。移送機構１１Ａが電子部品Ｐ１１〜Ｐ１６を良品用トレイ１２のポケットＳ１１〜Ｓ１６に収容している間に、移送機構１１Ｂはインデックステーブル１０の１行目に配置された６個の電子部品Ｐ１７〜Ｐ１１２を吸着する。そして、良品用トレイ１２の１行目に設けられたポケットＳ１７〜Ｓ１１２に電子部品Ｐ１７〜Ｐ１１２を収容する。このように、移送機構１１Ａと１１Ｂとは、インデックステーブル１０から電子部品Ｐを吸着する動作と良品用トレイ１２に電子部品Ｐを収容する動作とを交互に繰り返す。   FIG. 4 shows a state where the electronic component P is accommodated in the pocket S in the first row of the non-defective product tray 12. First, the transfer mechanism 11A sucks the six electronic components P11 to P16 arranged in the first row of the index table 10 and transfers them to the pockets S11 to S16 provided in the first row of the non-defective product tray 12. Then, the suction of the electronic components P11 to P16 is released and the electronic components P11 to P16 are accommodated. The transfer mechanism 11 </ b> A moves and returns to a position on the index table 10. While the transfer mechanism 11A accommodates the electronic components P11 to P16 in the pockets S11 to S16 of the good product tray 12, the transfer mechanism 11B has six electronic components P17 to P112 arranged in the first row of the index table 10. To adsorb. Then, the electronic components P17 to P112 are accommodated in the pockets S17 to S112 provided in the first row of the non-defective product tray 12. As described above, the transfer mechanisms 11 </ b> A and 11 </ b> B alternately repeat the operation of sucking the electronic component P from the index table 10 and the operation of storing the electronic component P in the non-defective product tray 12.

ここまでは、良品用トレイ１２の１行目における空きポケット数Ｍが移送機構１１Ａ、１１Ｂの吸着部Ｈの数（吸着部数）であるＮ個（本実施例では６個）よりも多いので、移送機構１１Ａ、１１Ｂによって６個の電子部品Ｐがインデックステーブル１０から吸着されて良品用トレイ１２に収容される。この状態で、良品用トレイ１２の１行目にはポケットＳ１１〜Ｓ１１２に１２個の電子部品Ｐ１１〜Ｐ１１２が収容され、５個のポケットＳ１１３〜Ｓ１１７が空きポケットとなっている。１行目の空きポケット数Ｍが吸着部数Ｎよりも少なくなったので、次は空きポケット数Ｍに相当する５個の電子部品Ｐをインデックステーブル１０から吸着する。したがって、移送機構１１Ａはインデックステーブル１０から５個の電子部品Ｐ１１３〜Ｐ１１７を吸着して、良品用トレイ１２のＳ１１３〜Ｓ１１７に収容する。このようにして、良品用トレイ１２の１行目には、移送機構１１Ａ、１１Ｂが、吸着〜移送〜収容〜復帰の一連の動作（サイクル）を３回行うことによって、１７個の電子部品Ｐ１１〜Ｐ１１７がすべて良品用トレイ１２の１行目のポケットＳ１１〜Ｓ１１７に収容されたことになる。   Up to this point, the number M of empty pockets in the first row of the non-defective product tray 12 is larger than N (six in this embodiment), which is the number of suction portions H (the number of suction portions) of the transfer mechanisms 11A and 11B. The six electronic components P are sucked from the index table 10 by the transfer mechanisms 11A and 11B and stored in the non-defective product tray 12. In this state, 12 electronic components P11 to P112 are accommodated in the pockets S11 to S112 in the first row of the good product tray 12, and the five pockets S113 to S117 are empty pockets. Since the number M of empty pockets in the first row is smaller than the number N of sucked portions, next, five electronic components P corresponding to the number of empty pockets M are sucked from the index table 10. Accordingly, the transfer mechanism 11A sucks the five electronic components P113 to P117 from the index table 10 and stores them in S113 to S117 of the non-defective product tray 12. In this way, in the first row of the non-defective product tray 12, the transfer mechanisms 11A and 11B perform a series of operations (cycles) of adsorption, transfer, storage, and return three times, thereby causing 17 electronic components P11. -P117 are all stored in the pockets S11-S117 in the first row of the non-defective product tray 12.

良品用トレイ１２の各行における空きポケット数Ｍが吸着部数Ｎよりも少ない場合において、空きポケット数Ｍよりも多く電子部品Ｐを吸着する場合を考える。この場合において、例えば、移送機構１１Ａ、１１Ｂが吸着可能なＮ個の電子部品Ｐを吸着すると、その行と次の行との２行に亘って電子部品Ｐを連続して収容しなければならなくなる。２行に亘って電子部品Ｐを収容すると収容動作が連続する２回に分けられたこととなり、収容する時間が２倍となる。連続する２回に分けられた収容動作によって電子部品Ｐを収容すると収容効率が悪くなる。このような状況を避けるため、本実施例では良品用トレイ１２の各行において、空きポケット数Ｍが吸着部Ｎよりも少なくなった場合は、空きポケット数Ｍに等しい数の電子部品Ｐを吸着して良品用トレイ１２に収容する。このことにより、連続する２回に分けられた収容動作によって良品用トレイ１２に電子部品Ｐを収容することを回避して、収容効率を高めることができる。   Consider a case where the number of empty pockets M in each row of the non-defective product tray 12 is smaller than the number N of sucked portions, and the electronic component P is sucked more than the number of empty pockets M. In this case, for example, when the N electronic parts P that can be picked up by the transfer mechanisms 11A and 11B are picked up, the electronic parts P must be continuously accommodated over two lines, that line and the next line. Disappear. When the electronic component P is accommodated over two rows, the accommodating operation is divided into two consecutive times, and the accommodating time is doubled. If the electronic component P is accommodated by the accommodating operation divided into two consecutive times, the accommodation efficiency is deteriorated. In order to avoid such a situation, in this embodiment, when the number of empty pockets M is smaller than the suction portion N in each row of the non-defective product tray 12, the number of electronic components P equal to the number of empty pockets M is sucked. And stored in the non-defective product tray 12. Accordingly, it is possible to avoid the electronic component P from being accommodated in the non-defective product tray 12 by the accommodating operation divided into two consecutive times, and to enhance the accommodation efficiency.

インデックステーブル１０から電子部品Ｐを吸着する動作、良品用トレイ１２に電子部品Ｐを移送して収容する動作、良品用トレイ１２の空きポケット数を計算する処理、良品用トレイ１２の空きポケット数に等しい数の電子部品Ｐをインデックステーブル１０から吸着する動作など、すべての動作や処理は個片化装置１に設けられた制御部ＣＴＬ（図１参照）によって制御される。   The operation of sucking the electronic component P from the index table 10, the operation of transporting and storing the electronic component P in the good product tray 12, the process of calculating the number of empty pockets of the good product tray 12, and the number of empty pockets of the good product tray 12 All operations and processes such as an operation of sucking an equal number of electronic components P from the index table 10 are controlled by a control unit CTL (see FIG. 1) provided in the singulation apparatus 1.

図５は、良品用トレイ１２の２行目のポケットＳに電子部品Ｐを収容する状態を示す。移送機構１１Ｂが、インデックステーブル１０からＰ１１８〜Ｐ１２３の６個の電子部品Ｐを吸着して、良品用トレイ１２の２行目のポケットＳ２１７〜Ｓ２１２に収容する。次に、移送機構１１Ａが、インデックステーブル１０の１行目のＰ１２４〜Ｐ１２８の５個と２行目のＰ２２８の１個との合計６個の電子部品Ｐを吸着する。そして、良品用トレイ１２のＳ２１１〜Ｓ２６に収容する。このように、良品用トレイ１２の各行において、空きポケット数Ｍが吸着部数Ｎよりも多く、かつ、インデックステーブル１０におけるその行の電子部品Ｐの残り数Ｌが吸着部数Ｎよりも少ない場合には、インデックステーブル１０からは２行に亘って６個の電子部品Ｐを吸着して良品用トレイ１２に収容する。   FIG. 5 shows a state in which the electronic component P is stored in the pocket S in the second row of the non-defective product tray 12. The transport mechanism 11B sucks the six electronic components P 118 to P123 from the index table 10 and stores them in the second-row pockets S217 to S212 of the non-defective product tray 12. Next, the transfer mechanism 11 </ b> A sucks a total of six electronic components P including five of P 124 to P 128 in the first row of the index table 10 and one of P 228 in the second row. And it accommodates in S211-S26 of the non-defective product tray 12. In this way, in each row of the non-defective product tray 12, when the number of empty pockets M is larger than the number N of suction parts, and the remaining number L of electronic components P in that row in the index table 10 is smaller than the number N of suction parts, From the index table 10, six electronic components P are sucked and stored in the non-defective product tray 12 over two rows.

次に、移送機構１１ｂが良品用トレイ１２の２行目の空きポケット数に等しい数の５個の電子部品Ｐ２２７〜Ｐ２２３を吸着してポケットＳ２５〜Ｓ２１に収容する。このようにして、２行目においても３回の収容動作によってすべての電子部品Ｐ２１７〜Ｐ２１が収容される。同様にして、良品用トレイ１２の３行目から９行目についてもインデックステーブル１０から電子部品Ｐを吸着して収容する。   Next, the transfer mechanism 11b sucks the five electronic components P227 to P223 equal to the number of empty pockets in the second row of the good product tray 12 and stores them in the pockets S25 to S21. In this way, all the electronic components P217 to P21 are accommodated by the accommodating operation three times in the second row. Similarly, the electronic parts P are attracted and accommodated from the index table 10 in the third to ninth lines of the non-defective product tray 12.

図６は、良品用トレイ１２の９行目まですべて電子部品Ｐを収容した状態を示す。良品用トレイ１２の１行目、２行目と同様にして、良品用トレイ１２の３行目、４行目、・・・、９行目においても、移送機構１１Ａと１１Ｂとによって各電子部品Ｐが良品用トレイ１２の各ポケットＳに収容される。良品用トレイ１２には、９行×１７行、合計１５３個の電子部品Ｐが収容される。良品用トレイ１２のポケットＳにすべて電子部品Ｐが収容された後は、次のトレイに交換して新しいトレイに電子部品Ｐが収容される。   FIG. 6 shows a state where all the electronic parts P are accommodated up to the ninth line of the non-defective product tray 12. Similarly to the first and second lines of the non-defective product tray 12, each electronic component is also transferred by the transfer mechanisms 11A and 11B in the third, fourth,. P is accommodated in each pocket S of the non-defective product tray 12. The non-defective product tray 12 accommodates a total of 153 electronic components P in 9 rows × 17 rows. After all the electronic components P are stored in the pockets S of the non-defective product tray 12, the electronic components P are stored in a new tray by exchanging with the next tray.

実施例においては、良品用トレイ１２の各行には１７個のポケットＳが設けられている。移送機構１１Ａ、１１Ｂの吸着部Ｈは６個設けられている。したがって、インデックステーブル１０から電子部品Ｐを６個、６個、５個と３回の動作によって吸着して良品用トレイ１２に収容すると各行のポケットＳには電子部品Ｐがすべて収容される。つまり、良品用トレイ１２の各行のポケットには３回の収容動作によってすべて電子部品Ｐが満たされる。なお、良品用トレイ１２の各行におけるポケット数Ｍや移送機構における吸着部数Ｎなどはこれに限らず、任意に設定することができる。   In the embodiment, 17 pockets S are provided in each row of the good product tray 12. Six suction portions H of the transfer mechanisms 11A and 11B are provided. Therefore, when the electronic component P is attracted from the index table 10 by six, six, and five operations and stored in the non-defective product tray 12, all the electronic components P are stored in the pockets S of each row. That is, all the electronic parts P are filled in the pockets of each row of the non-defective product tray 12 by the accommodating operation three times. The number M of pockets in each row of the non-defective product tray 12 and the number N of suction portions in the transfer mechanism are not limited to this, and can be arbitrarily set.

ここまで説明してきたように、良品用トレイ１２の各行における空きポケット数Ｍが吸着部数Ｎよりも少なくなった場合には、空きポケット数Ｍに等しい数の電子部品Ｐをインデックステーブル１０から吸着して良品用トレイ１２の空きポケットに収容する。このことにより、良品用トレイ１２の２行に亘って連続して収容動作を行うことが回避でき、各行において電子部品Ｐを収容する動作をすべて１回の動作で行うことが可能となる。したがって、電子部品Ｐを良品用トレイ１２に収容する時間を短縮することができ、収容効率を高めることができる。   As described above, when the number of empty pockets M in each row of the non-defective product tray 12 is smaller than the number N of sucked portions, the number of electronic components P equal to the number of empty pockets M is sucked from the index table 10. In the empty pocket of the non-defective product tray 12. As a result, it is possible to avoid performing the accommodating operation continuously over two rows of the non-defective product tray 12, and it is possible to perform all the operations of accommodating the electronic components P in each row in one operation. Therefore, the time for accommodating the electronic component P in the non-defective product tray 12 can be shortened, and the accommodation efficiency can be improved.

移送機構１１Ａと１１Ｂとは、インデックステーブル１０における電子部品Ｐを吸着する動作と良品用トレイ１２における収容する動作とを交互に繰り返す。このように、２個の移送機構１１Ａと１１Ｂとによって、効率的に電子部品Ｐをインデックステーブル１０から良品用トレイ１２に移送して収容することができる。本実施例では、個片化装置１の制御部ＣＴＬによって、良品用トレイ１２の各行における空きポケット数Ｍを計算し、空きポケット数Ｍに応じて２個の移送機構１１Ａ、１１Ｂの動作を制御する。このことにより、効率的にインデックステーブル１０から電子部品Ｐを吸着して良品用トレイ１２に収容することができる。したがって、電子部品Ｐを良品用トレイ１２に収容する時間を短縮することができ、個片化装置１の生産性を向上することができる。   The transfer mechanisms 11 </ b> A and 11 </ b> B alternately repeat the operation of sucking the electronic component P in the index table 10 and the operation of receiving it in the non-defective product tray 12. Thus, the electronic parts P can be efficiently transferred from the index table 10 to the non-defective product tray 12 and accommodated by the two transfer mechanisms 11A and 11B. In this embodiment, the control unit CTL of the singulation apparatus 1 calculates the number of empty pockets M in each row of the non-defective product tray 12, and controls the operation of the two transfer mechanisms 11A and 11B according to the number of empty pockets M. To do. Thus, the electronic component P can be efficiently sucked from the index table 10 and stored in the non-defective product tray 12. Therefore, the time for accommodating the electronic component P in the non-defective product tray 12 can be shortened, and the productivity of the singulation apparatus 1 can be improved.

本発明によれば、良品用トレイ１２の各行において、残りの空きポケット数Ｍが移送機構１１Ａ、１１Ｂの吸着部数Ｎよりも少ない場合には、空きポケット数Ｍに等しい数の電子部品Ｐをインデックステーブル１０から吸着して良品用トレイ１２に収容する。したがって、良品用トレイ１２の各行には吸着した電子部品Ｐを過不足なく各行に設けられたポケット数だけきちんと収容することができる。また、２個の移送機構１１Ａと１１Ｂとによって、電子部品Ｐを吸着する動作と収容する動作とを交互に繰り返す。したがって、個片化装置１において、電子部品Ｐを収容する時間を短縮することができ、生産性を向上することができる。   According to the present invention, in each row of the non-defective product tray 12, when the number M of remaining empty pockets is smaller than the number N of suction portions of the transfer mechanisms 11A and 11B, the number of electronic components P equal to the number of empty pockets M is indexed. Adsorbed from the table 10 and accommodated in the non-defective product tray 12. Therefore, the adsorbed electronic parts P can be properly accommodated in each row of the non-defective product tray 12 as many as the number of pockets provided in each row. In addition, the operation of sucking and housing the electronic component P is alternately repeated by the two transfer mechanisms 11A and 11B. Therefore, in the singulation apparatus 1, the time for housing the electronic component P can be shortened, and the productivity can be improved.

本実施例では、２個の移送機構１１Ａ、１１Ｂがインデックステーブ１０から各電子部品Ｐを吸着して良品用トレイ１２に収容する場合について説明した。これに限らず、移送機構は１個又は３個以上であってもよい。   In the present embodiment, the case where the two transfer mechanisms 11 </ b> A and 11 </ b> B attract each electronic component P from the index table 10 and accommodate it in the non-defective product tray 12 has been described. However, the number of transfer mechanisms may be one or three or more.

被切断物としては、樹脂封止体３の他に半導体ウェーハを使用してもよい。半導体ウェーハの各領域には電子回路が作り込まれているので、切断後の各領域に相当する部分（半導体チップ）が電子部品Ｐとなる。   As the object to be cut, a semiconductor wafer may be used in addition to the resin sealing body 3. Since an electronic circuit is built in each region of the semiconductor wafer, a portion (semiconductor chip) corresponding to each region after cutting becomes an electronic component P.

また、本発明は、上述した実施例に限定されるものではなく、本発明の趣旨を逸脱しない範囲内で、必要に応じて、任意にかつ適宜に組み合わせ、変更し、又は選択して採用できるものである。   Further, the present invention is not limited to the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary within the scope not departing from the gist of the present invention. Is.

１ 個片化装置
２ プレステージ
３ 樹脂封止体（板状部材）
４ 切断用テーブル
５ 切断用ステージ
６ スピンドルユニット
７ 回転刃
８ 検査用ステージ
９ 複数の電子部品からなる集合体
１０ インデックステーブル（保管部材）
１１Ａ、１１Ｂ 移送機構（第１の移送機構、第２の移送機構）
１２ 良品用トレイ（収容部材）
１３ 不良品用トレイ
１４ 吸着口
Ａ 受け入れユニット
Ｂ 個片化ユニット
Ｃ 検査ユニット
Ｄ 収容ユニット
ＣＴＬ 制御部
Ｐ 電子部品
Ｓ ポケット（収容場所）
Ｈ 吸着部
ａ インデックステーブルに配置される電子部品のピッチ
ｂ トレイに設けられたポケットのピッチ
Ｍ トレイの各行における空きポケット数
Ｎ 移送機構における吸着部数
Ｌ インデックステーブルの各行における電子部品の残り数 1 Separation device 2 Prestige 3 Resin encapsulant (plate member)
4 Cutting Table 5 Cutting Stage 6 Spindle Unit 7 Rotary Blade 8 Inspection Stage 9 Aggregate of Multiple Electronic Components 10 Index Table (Storage Member)
11A, 11B transfer mechanism (first transfer mechanism, second transfer mechanism)
12 Non-defective tray (housing member)
13 Defective product tray 14 Suction port A Receiving unit B Divided unit C Inspection unit D Storage unit CTL Control unit P Electronic component S Pocket (accommodation place)
H suction part a pitch of electronic parts arranged in the index table b pitch of pockets provided in the tray M number of empty pockets in each line of the tray N number of suction parts in the transfer mechanism L remaining number of electronic parts in each line of the index table

Claims (12)

板状部材に設けられた複数の領域を単位として前記板状部材を個片化することによって製造された複数の電子部品を搬送する個片化された電子部品の搬送装置であって、
前記電子部品がそれぞれ配置される複数の配置場所を有する保管部材と、
前記電子部品がそれぞれ収容される複数の収容場所を有する収容部材と、
前記複数の配置場所から前記電子部品をそれぞれ吸着して前記複数の収容場所に移送して収容する移送機構と、
前記移送機構に設けられ、前記電子部品を吸着する機能及び該電子部品に対する吸着を解除する機能を有するＮ個（Ｎは２以上の整数）の吸着部とを備え、
前記複数の収容場所の１方向に沿う１行において前記収容場所の空き場所の数がＭ個（Ｍは正の整数）であってＭ＜Ｎである場合には前記保管部材からＭ個の前記電子部品が前記吸着部によって吸着され、Ｍ≧Ｎである場合には前記保管部材からＮ個の前記電子部品を前記吸着部によって吸着され、
吸着された前記電子部品が、前記移送機構によって前記収容部材に移送され、前記吸着が解除されることによって前記Ｍ個の空き場所のうちの少なくとも一部に収容されることを特徴とする個片化された電子部品の搬送装置。 A device for transporting individualized electronic components for transporting a plurality of electronic components manufactured by separating the plate-shaped member into a plurality of regions provided in the plate-shaped member,
A storage member having a plurality of placement locations where the electronic components are respectively placed;
A housing member having a plurality of housing locations each housing the electronic component;
A transfer mechanism for adsorbing and transferring the electronic components from the plurality of arrangement locations to the plurality of accommodation locations;
Provided with the transfer mechanism, and N (N is an integer of 2 or more) suction portions having a function of sucking the electronic component and a function of releasing the suction to the electronic component;
When the number of empty places in the accommodation place is M (M is a positive integer) and M <N in one row along one direction of the plurality of accommodation places, M pieces of the storage places are stored in the storage member. When the electronic component is adsorbed by the adsorption unit and M ≧ N, N electronic components from the storage member are adsorbed by the adsorption unit,
The sucked electronic component is transferred to the storage member by the transfer mechanism, and is stored in at least a part of the M empty spaces by releasing the suction. Electronic component transport device. 請求項１に記載された個片化された電子部品の搬送装置において、
前記空き場所の数を計算して、該空き場所の数に応じた数の前記電子部品を吸着して前記保管部材から前記収容部材に移送して収容するように前記移送機構を制御する制御部を備えたことを特徴とする個片化された電子部品の搬送装置。 In the conveyance device of the separated electronic component according to claim 1,
A control unit that calculates the number of empty places and controls the transfer mechanism so that the number of the electronic components corresponding to the number of empty places is sucked and transferred from the storage member to the receiving member A device for transporting individualized electronic components, comprising: 請求項２に記載された個片化された電子部品の搬送装置において、
前記移送機構として第１の移送機構と第２の移送機構とを備え、
前記第１の移送機構と前記第２の移送機構とのうち一方が前記保管部材における前記電子部品を吸着する間において、他方が前記吸着部に吸着された前記電子部品を前記収容部材に収容することを特徴とする個片化された電子部品の搬送装置。 In the conveying device of the separated electronic component according to claim 2,
A first transfer mechanism and a second transfer mechanism as the transfer mechanism;
While one of the first transfer mechanism and the second transfer mechanism attracts the electronic component in the storage member, the other accommodates the electronic component adsorbed by the adsorption portion in the accommodation member. An apparatus for transporting individualized electronic components, characterized in that: 請求項３に記載された個片化された電子部品の搬送装置において、
前記吸着部は、該吸着部同士の間隔を前記複数の配置場所のピッチ又は前記複数の収容場所のピッチに合わせて可変する機能を有することを特徴とする個片化された電子部品の搬送装置。 In the conveying apparatus of the separated electronic component according to claim 3,
The adsorbing unit has a function of changing the interval between the adsorbing units according to the pitch of the plurality of arrangement locations or the pitch of the plurality of accommodation locations, and a transport device for the separated electronic components, . 請求項４に記載された個片化された電子部品の搬送装置において、
前記板状部材は樹脂封止体であり、前記電子部品は回路基板と受動素子又は能動素子を含むチップと硬化樹脂からなる封止樹脂とを有することを特徴とする個片化された電子部品の搬送装置。 In the conveying apparatus of the separated electronic component described in Claim 4,
The plate-shaped member is a resin sealing body, and the electronic component includes a circuit board, a chip including a passive element or an active element, and a sealing resin made of a cured resin. Transport device. 請求項４に記載された個片化された電子部品の搬送装置において、
前記板状部材は半導体ウェーハであり、前記電子部品は半導体チップであることを特徴とする個片化された電子部品の搬送装置。 In the conveying apparatus of the separated electronic component described in Claim 4,
The plate-like member is a semiconductor wafer, and the electronic component is a semiconductor chip. 板状部材に設けられた複数の領域を単位として前記板状部材を個片化することによって製造された複数の電子部品を搬送する個片化された電子部品の搬送方法であって、
前記個片化された電子部品を保管部材に設けられた複数の配置場所にそれぞれ配置する工程と、
移送機構に設けられたＮ個（Ｎは２以上の整数）の吸着部によって前記複数の配置場所から前記電子部品を吸着する工程と、
前記移送機構によって前記複数の配置場所から収容部材に設けられた複数の収容場所に前記電子部品を移送する工程と、
前記電子部品に対する吸着を解除することによって前記電子部品を前記収容場所に収容する工程とを備え、
前記吸着する工程では、前記収容部材の１方向に沿う１行において前記収容場所の空き場所の数がＭ個（Ｍは正の整数）であってＭ＜Ｎである場合には前記保管部材からＭ個の前記電子部品を前記吸着部によって吸着し、Ｍ≧Ｎである場合には前記保管部材からＮ個の前記電子部品を前記吸着部によって吸着し、
前記移送する工程では、前記移送機構によって前記電子部品を前記Ｍ個の空き場所のうちの少なくとも一部に移送し、
前記収容する工程では、前記電子部品に対する吸着を解除することによって前記Ｍ個の空き場所のうちの少なくとも一部に収容することを特徴とする個片化された電子部品の搬送方法。 A method for transporting individualized electronic components that transports a plurality of electronic components manufactured by separating the plate-shaped member into a plurality of regions provided in the plate-shaped member,
Placing each of the separated electronic components at a plurality of placement locations provided in a storage member;
Adsorbing the electronic component from the plurality of arrangement locations by N (N is an integer of 2 or more) adsorbing portions provided in the transfer mechanism;
A step of transferring the electronic component from the plurality of arrangement locations to a plurality of accommodation locations provided in the accommodation member by the transfer mechanism;
A step of accommodating the electronic component in the accommodating place by releasing the suction to the electronic component;
In the adsorbing step, if the number of empty places in the accommodation place is M (M is a positive integer) in one line along one direction of the accommodation member, and M <N, the storage member M pieces of electronic components are sucked by the suction portion, and when M ≧ N, N pieces of electronic components from the storage member are sucked by the suction portion,
In the transferring step, the electronic device is transferred to at least a part of the M empty places by the transfer mechanism,
In the accommodating step, the electronic component is transported in pieces, wherein the electronic component is accommodated in at least a part of the M empty spaces by releasing the suction to the electronic component. 請求項７に記載された個片化された電子部品の搬送方法において、
前記空き場所の数を計算して、該空き場所の数に応じた数の前記電子部品を吸着して前記保管部材から前記収容部材に移送して収容するように前記移送機構を制御する工程を備えることを特徴とする個片化された電子部品の搬送方法。 In the method for conveying the separated electronic component according to claim 7,
Calculating the number of empty places, and controlling the transfer mechanism so that the number of the electronic components corresponding to the number of empty places is adsorbed and transferred from the storage member to the receiving member and stored. A method for transporting an individualized electronic component, comprising: 請求項８に記載された個片化された電子部品の搬送方法において、
前記移送機構として設けられた第１の移送機構と第２の移送機構とのうち一方が前記保管部材における前記電子部品を吸着する間において、他方が前記吸着部が吸着した前記電子部品を前記収容部材に収容することを特徴とする個片化された電子部品の搬送方法。 In the conveyance method of the separated electronic component described in Claim 8,
While one of the first transfer mechanism and the second transfer mechanism provided as the transfer mechanism sucks the electronic component in the storage member, the other accommodates the electronic component sucked by the suction portion. A method for transporting an individualized electronic component, wherein the electronic component is housed in a member. 請求項９に記載された個片化された電子部品の搬送方法において、
前記吸着部同士の間隔を前記複数の配置場所のピッチ又は前記複数の収容場所のピッチに合わせて可変する工程を備えることを特徴とする個片化された電子部品の搬送方法。 In the method for transporting individualized electronic components according to claim 9,
A method for transporting an individualized electronic component, comprising: a step of varying an interval between the suction portions according to a pitch of the plurality of arrangement locations or a pitch of the plurality of accommodation locations. 請求項１０に記載された個片化された電子部品の搬送方法において、
前記板状部材は樹脂封止体であり、前記電子部品は回路基板と受動素子又は能動素子を含むチップと硬化樹脂からなる封止樹脂とを有することを特徴とする個片化された電子部品の搬送方法。 In the conveyance method of the separated electronic component according to claim 10,
The plate-shaped member is a resin sealing body, and the electronic component includes a circuit board, a chip including a passive element or an active element, and a sealing resin made of a cured resin. Transport method. 請求項１０に記載された個片化された電子部品の搬送方法において、
前記板状部材は半導体ウェーハであり、前記電子部品は半導体チップであることを特徴とする個片化された電子部品の搬送方法。 In the conveyance method of the separated electronic component according to claim 10,
The plate-shaped member is a semiconductor wafer, and the electronic component is a semiconductor chip.
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