TW201438975A - Chip sorter and tray exchanging module thereof - Google Patents
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Abstract
Description
一種挑揀機及其托盤交換模組，其係用於吸取與置放晶粒，以及更換托盤的裝置。 A picker and a pallet change module thereof are used for picking up and placing a die, and replacing the tray.
現有的光電產業，其已趨近於高度成熟的產業，該光電產業約略可分為晶圓製程、晶圓切割製程與晶粒取放製程，而前述之晶圓製程與晶圓切割製程能夠突破的空間有限，但晶粒取放製程仍有可以進步的空間。 The existing optoelectronic industry has approached a highly mature industry. The optoelectronic industry can be roughly divided into a wafer process, a wafer dicing process and a die pick and place process, and the aforementioned wafer process and wafer dicing process can break through. The space is limited, but there is still room for improvement in the grain pick and place process.
現有的晶粒取放製程，其係將複數個晶粒置放於托盤，再將複數個托盤依序放置於一取放機台，一取放裝置係依序取放位於各托盤的晶粒，雖前述之動作已可概括現有的晶粒取放製程。 In the existing die pick-and-place process, a plurality of dies are placed on a tray, and then a plurality of trays are sequentially placed on a pick-and-place machine, and a pick-and-place device sequentially picks up the dies in each tray. Although the foregoing actions have been able to summarize the existing die pick and place processes.
但上述的晶粒取放製程仍有無法突破的瓶頸，因放置於托盤的晶粒之數量有限，所以托盤的更換較高，故影響晶粒取放的速率，進而影響晶粒的生產率。 However, the above-mentioned die pick-and-place process still has a bottleneck that cannot be broken. Because the number of crystal grains placed on the tray is limited, the replacement of the tray is high, so that the rate of grain pick-and-place is affected, thereby affecting the productivity of the die.
另外，於晶圓製程中，晶粒載板的取放亦為考量的應用之一，主要係因出貨等需求時，因裝載安全考量，必需做載具的交換，該載具係用於承接晶粒載板，但現有的機具無法提升載具的交換速度。 In addition, in the wafer process, the pick-and-place of the die carrier is also considered as one of the applications, mainly due to the need for shipment, etc., due to the safety of loading, the carrier must be exchanged, the carrier is used for The die carrier is accepted, but the existing tools cannot increase the exchange speed of the carrier.
有鑑於上述之課題，本發明之目的在於提供一種挑揀機及其托盤交換模組，其係利用多個平台的設計，以將托盤分別置放於多個平台，而使晶粒吸取與置放作業，不因更換托盤停頓，再藉由托盤交換模組，以達到迅速交換托盤的效果，藉此提升晶粒的生產率以及載具的交換速度。 In view of the above problems, an object of the present invention is to provide a picker and a pallet change module thereof, which are designed by using multiple platforms to place trays on a plurality of platforms, respectively, so that the dies are sucked and placed. The operation does not stop the pallet change, and the pallet exchange module is used to achieve the effect of quickly exchanging the tray, thereby improving the productivity of the die and the exchange speed of the carrier.
為了達到上述之目的，本發明之技術手段在於提供一種挑揀機，其具有：一托盤上載單元；一托盤下載單元；一交換單元，其係能夠移動地設於該托盤上載單元與該托盤下載單元之間；至少一供料平台，其係能夠移動地設於該交換單元的一側；一第一取放單元，其係設於該供料平台的上方；一中繼單元，其係能夠移動地設於該供料平台的一側；至少一收料平台，其係能夠移動地設於該中繼單元的一側；以及一第二取放單元，其係設於該收料平台的上方。 In order to achieve the above object, the technical means of the present invention is to provide a picker having: a tray uploading unit; a tray downloading unit; and an exchange unit movably disposed on the tray uploading unit and the tray downloading unit At least one feeding platform is movably disposed on one side of the exchange unit; a first pick-and-place unit is disposed above the feeding platform; and a relay unit capable of moving The ground receiving platform is disposed at one side of the feeding platform; at least one receiving platform is movably disposed at one side of the relay unit; and a second pick-and-place unit is disposed above the receiving platform .
本發明之技術手段復提供一種托盤交換模組，其具有：一平台，其具有至少二卡掣部；以及一交換單元，其具有：一交換移動部，其係能夠呈一縱向或一徑向移動；以及至少二叉部，其係設於交換移動部的一側，該些叉部係能夠選擇性延伸至該些卡掣部之間；其中，該交換移動部係呈一縱向移動，而使該些叉部呈一昇降，以完成一托盤交換作業。 The technical means of the present invention further provides a pallet change module having: a platform having at least two latching portions; and an exchange unit having: an exchange moving portion capable of being longitudinal or radial Moving; and at least a bifurcated portion disposed on one side of the exchange moving portion, the fork portions being selectively extendable between the plurality of latch portions; wherein the exchange moving portion is in a longitudinal movement The forks are lifted and lowered to complete a pallet exchange operation.
如上所述，本發明係將多個托盤置放於至少一供料平台與至少一收料平台，以提升晶粒吸取的速度與數量。 As described above, the present invention places a plurality of trays on at least one feeding platform and at least one receiving platform to increase the speed and quantity of die picking.
另外，本發明係利用交換單元，以提升更換托盤的速度，藉此更多的托盤能夠被置放於供料平台或收料平台。 In addition, the present invention utilizes an exchange unit to increase the speed at which the tray is replaced, whereby more trays can be placed on the feed platform or the receiving platform.
再者，若本發明的供料平台與收料平台為複數個，則於更換托盤時，另一供料平台與另一收料平台能夠進行吸取與置放晶粒的作業，直至該另一供料平台與該另一收料平台需要進行更換托盤的作業，再一供料平台與再一收料平台能夠進行吸取與置放晶粒的作業，或者已完成更換托盤作業的供料平台與收料平台回至起始位置，以進行吸取與置放晶粒的作業，藉由前述之動作，以提升晶粒的生產率與載具的交換速度。 Furthermore, if the feeding platform and the receiving platform of the present invention are plural, when the tray is replaced, another feeding platform and another receiving platform can perform the operation of sucking and placing the crystal grains until the other one The feeding platform and the other receiving platform need to perform the operation of replacing the tray, and the feeding platform and the further receiving platform can perform the operations of sucking and placing the crystal grains, or the feeding platform for replacing the tray operation and The receiving platform returns to the starting position for the operation of sucking and placing the crystal grains, and the above operation is performed to increase the productivity of the crystal grains and the exchange speed of the carriers.
10‧‧‧托盤上載單元 10‧‧‧Tray upload unit
11‧‧‧托盤下載單元 11‧‧‧Tray download unit
2‧‧‧交換單元 2‧‧‧Exchange unit
20‧‧‧交換移動部 20‧‧‧Exchange of the Ministry of Movement
21‧‧‧叉部 21‧‧‧Fork
30‧‧‧供料平台 30‧‧‧Feeding platform
300‧‧‧移動部 300‧‧‧moving department
301‧‧‧卡掣部 301‧‧‧Card Department
31‧‧‧托盤 31‧‧‧Tray
32‧‧‧收料平台 32‧‧‧ receiving platform
320‧‧‧移動部 320‧‧‧Mobile Department
321‧‧‧卡掣部 321‧‧‧Card Department
33、34、35‧‧‧托盤 33, 34, 35‧‧‧ tray
40‧‧‧第一取放單元 40‧‧‧First pick and place unit
41‧‧‧第一影像定位單元 41‧‧‧First image positioning unit
42‧‧‧第二影像定位單元 42‧‧‧Second image positioning unit
43‧‧‧第二取放單元 43‧‧‧Second pick and place unit
44‧‧‧第三影像定位單元 44‧‧‧ Third image positioning unit
50‧‧‧中繼單元 50‧‧‧Relay unit
51‧‧‧回收單元 51‧‧‧Recycling unit
圖1為本發明之一種挑揀機之示意圖。 Figure 1 is a schematic view of a picker of the present invention.
圖2為本發明之一種托盤交換模組之示意圖。 2 is a schematic view of a pallet change module of the present invention.
圖3至圖8為一平台與一交換單元之動作示意圖。 3 to 8 are schematic diagrams showing the operation of a platform and an exchange unit.
以下係藉由特定的具體實施例說明本發明之實施方式，所屬技術領域中具有通常知識者可由本說明書所揭示之內容，輕易地瞭解本發明之其他優點與功效。 The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can readily understand the other advantages and advantages of the present invention.
請配合參考圖1所示，本發明係一種挑揀機，其具有一托盤上載單元10、一托盤下載單元11、一交換單元2、至少一供料平台30、至少一收料平台32、一第一取放單元40、一第一影像定位單元41、一第二影像定位單元42、一第二取放單元43、一第三影像定位單元44、一中繼單元50與一回收單元51。 Referring to FIG. 1 , the present invention is a picker having a tray uploading unit 10 , a tray downloading unit 11 , an exchange unit 2 , at least one feeding platform 30 , at least one receiving platform 32 , and a first A pick-and-place unit 40, a first image positioning unit 41, a second image positioning unit 42, a second pick-and-place unit 43, a third image positioning unit 44, a relay unit 50 and a recycling unit 51.
托盤上載單元10係具有複數個托盤，各托盤具有複數個晶粒，該托盤上載單元10具有一能夠上載托盤或移動托盤的功能。 The tray uploading unit 10 has a plurality of trays each having a plurality of dies, and the tray uploading unit 10 has a function of being able to upload a tray or move the tray.
托盤下載單元11係設於相鄰於托盤上載單元10，托盤下載單元11具有一能夠收容托盤或移動托盤的功能。 The tray download unit 11 is disposed adjacent to the tray upload unit 10, and the tray download unit 11 has a function of being able to accommodate a tray or a moving tray.
交換單元2係可移動地設於托盤上載單元10與托盤下載單元11之間，請配合參考圖2所示，交換單元2具有一交換移動部20與至少二叉部21。 The exchange unit 2 is movably disposed between the tray uploading unit 10 and the tray download unit 11. Referring to FIG. 2, the exchange unit 2 has an exchange moving portion 20 and at least a fork portion 21.
交換移動部20係能夠呈一縱向與一橫向移動。 The exchange moving unit 20 is capable of moving in a longitudinal direction and a lateral direction.
叉部21係以至少一層設於交換移動部20的一側，於本實施例，叉部21係以至少二層式設於交換移動部20，叉部21的層數係能夠隨著實際設計而改變，非受到本實施例的限制。 The fork portion 21 is provided on at least one side of the exchange moving portion 20. In the present embodiment, the fork portion 21 is provided in the exchange moving portion 20 in at least two layers, and the number of layers of the fork portion 21 can be designed according to the actual design. The change is not limited by this embodiment.
請再配合參考圖1所示，供料平台30係能夠移動地設於交換單元2的一側，於本實施例中，供料平台30的數量為兩個，其一供料平台30係相對於托盤下載單元11，另一供料平台30係相對於托盤上載單元10，而兩個供料平台30的設計，其係可用於獨自相對於托盤下載單元11或托盤上載單元10作業，該供料平台30的數量能夠隨著實際設計而改變，非受到本實施例的限制，舉例 而言，供料平台30能夠多個排列於托盤下載單元11一側或托盤上載單元10一側。 Referring to FIG. 1 , the feeding platform 30 is movably disposed on one side of the exchange unit 2 . In the embodiment, the number of the feeding platforms 30 is two, and one feeding platform 30 is opposite. In the tray downloading unit 11, another feeding platform 30 is opposite to the tray uploading unit 10, and the design of the two feeding platforms 30 can be used to work alone with respect to the tray downloading unit 11 or the tray uploading unit 10, which is provided for The number of material platforms 30 can be changed according to the actual design, and is not limited by the embodiment, for example. In other words, the feeding platform 30 can be arranged in plurality on the tray download unit 11 side or the tray upload unit 10 side.
請再配合參考圖2所示，供料平台30具有一移動部300與至少二卡掣部301。 Referring to FIG. 2 again, the feeding platform 30 has a moving portion 300 and at least two latching portions 301.
移動部300係能夠呈一徑向移動。 The moving portion 300 is capable of moving in a radial direction.
該至少二卡掣部301係能夠移動地設於移動部300的兩側，於本實施例中，該卡掣部301的數量為四個，該數量能夠隨著實際設計而改變，非受到本實施例的限制。 The at least two latching portions 301 are movably disposed on two sides of the moving portion 300. In the embodiment, the number of the latching portions 301 is four, and the number can be changed according to the actual design. Limitations of the embodiments.
第一取放單元40係設於供料平台30的上方。 The first pick-and-place unit 40 is disposed above the feeding platform 30.
第一影像定位單元41係設於第一取放單元40的一端。 The first image positioning unit 41 is disposed at one end of the first pick and place unit 40.
第二影像定位單元42係設於第一取放單元40的另一端。 The second image positioning unit 42 is disposed at the other end of the first pick-and-place unit 40.
中繼單元50係能夠移動地設於供料平台30一側，並且位於第二影像定位單元42與第一取放單元40的下方。 The relay unit 50 is movably disposed on one side of the feeding platform 30 and located below the second image positioning unit 42 and the first pick-and-place unit 40.
回收單元51係能夠移動地設於中繼單元50的一端。 The recovery unit 51 is movably provided at one end of the relay unit 50.
收料平台32係能夠移動地設於中繼單元50的另一側，於本實施例中，收料平台32的數量為兩個，如上所述之供料平台30，其一收料平台32係相對於供料平台30，另一收料平台32係相對於另一供料平台30，該收料平台32的數量能夠隨著實際設計而改變，非受到本實施例的限制，舉例而言，收料平台32能夠多個排列於中繼單元50的另一側。 The receiving platform 32 is movably disposed on the other side of the relay unit 50. In the present embodiment, the number of the receiving platforms 32 is two, as described above, the feeding platform 30, and a receiving platform 32. The other receiving platform 32 is relative to the other feeding platform 30 with respect to the feeding platform 30, and the number of the receiving platforms 32 can be changed according to the actual design, which is not limited by the embodiment, for example, for example The receiving platform 32 can be arranged in plurality on the other side of the relay unit 50.
如上所述之供料平台30，收料平台32亦具有一移動部320與至少二卡掣部321，其結構係等同供料平台30，故不再此多作贅述，而供料平台30、收料平台32與交換單元2三者之間的動作，請見下述。 As shown in the above-mentioned feeding platform 30, the receiving platform 32 also has a moving portion 320 and at least two latching portions 321 , the structure of which is equivalent to the feeding platform 30, so the description is not repeated here, and the feeding platform 30, The actions between the receiving platform 32 and the switching unit 2 are as follows.
第二取放單元43係設於收料平台32的上方。 The second pick-and-place unit 43 is disposed above the receiving platform 32.
上述之第二影像定位單元42係能夠設於第一取放單元41與第二取放單元43之間。 The second image positioning unit 42 can be disposed between the first pick-and-place unit 41 and the second pick-and-place unit 43.
第三影像定位單元44係設於第二取放單元43的一端，並且位於收料平台32的上方。 The third image positioning unit 44 is disposed at one end of the second pick-and-place unit 43 and above the receiving platform 32.
請再配合參考圖1所示，另一托盤上載單元10、另一托盤下 載單元11、另一交換單元2係設於收料平台32的另一側，如上所述，該另一托盤上載單元10係相對於其一收料平台32，該另一托盤下載單元11係相對於另一收料平台32，如上述之供料平台30，二收料平台32的設計，其係可用於獨自相對於托盤下載單元11或托盤上載單元10作業。 Please refer to FIG. 1 again, another tray uploading unit 10, under another tray The loading unit 11 and the other exchange unit 2 are disposed on the other side of the receiving platform 32. As described above, the other tray uploading unit 10 is opposite to one of the receiving platforms 32, and the other tray downloading unit 11 is Relative to the other receiving platform 32, such as the feed platform 30 described above, the design of the two receiving platforms 32 can be used to work alone with respect to the tray download unit 11 or the tray upload unit 10.
請再配合參考圖1所示，一具有複數個晶粒的托盤31係設於設於供料平台30，一未具有晶粒的托盤33設於設於收料平台32。 Referring to FIG. 1 , a tray 31 having a plurality of dies is disposed on the feeding platform 30 , and a tray 33 having no dies is disposed on the receiving platform 32 .
第一影像定位單元41係擷取位於托盤31的晶粒的影像，並對位該些晶粒，第一影像定位單元41係將該影像與定位資訊傳送給第一取放單元40，第一取放單元40係依據該影像與定位資訊，以吸取欲取的晶粒。 The first image positioning unit 41 captures the image of the die located in the tray 31, and the first image positioning unit 41 transmits the image and the positioning information to the first pick-and-place unit 40. The pick and place unit 40 is based on the image and the positioning information to absorb the desired crystal grains.
第二影像定位單元42係定位中繼單元50，並擷取由第一取放單元40取來置放於中繼單元50之晶粒的影像，以做為定位使用。 The second image positioning unit 42 is configured to locate the relay unit 50 and capture an image of the die placed by the first pick-and-place unit 40 and placed in the relay unit 50 for use as a positioning.
若第一取放單元40所吸取的晶粒為故障、毀損或方向等規格不符，則中繼單元50係移離第一取放單元40的下方，回收單元51係移動至第一取放單元40的下方，使第一取放單元能將晶粒置放於設在回收單元51之托盤。 If the die sucked by the first pick-and-place unit 40 is faulty, damaged, or the direction does not conform to the specifications, the relay unit 50 is moved away from the first pick-and-place unit 40, and the recovery unit 51 is moved to the first pick-and-place unit. Below the 40, the first pick-and-place unit can place the die on the tray provided in the recovery unit 51.
第一取放單元40已將晶粒放置於回收單元51後，回收單元51移離第一取放單元40的下方，中繼單元50係移回第一取放單元40的下方。 After the first pick-and-place unit 40 has placed the die in the recovery unit 51, the recovery unit 51 moves away from the first pick-and-place unit 40, and the relay unit 50 moves back to the lower side of the first pick-and-place unit 40.
第二影像定位單元42復定位與擷取位於中繼單元50之晶粒的影像，並將該定位與影像資訊傳送給第二取放單元43，第二取放單元43依據該些資訊，以吸取位於中繼單元50之所欲吸取的晶粒。 The second image positioning unit 42 re-positions and captures the image of the die located in the relay unit 50, and transmits the positioning and image information to the second pick-and-place unit 43. The second pick-and-place unit 43 uses the information according to the information. The die to be sucked at the relay unit 50 is sucked.
第三影像定位單元44係定位與擷取位於收料平台32之托盤33的影像，並將該些資訊傳送給第二取放單元43，第二取放單元43依據該些資訊，以將晶粒放置於托盤33。 The third image positioning unit 44 locates and captures the image of the tray 33 located on the receiving platform 32, and transmits the information to the second pick-and-place unit 43. The second pick-and-place unit 43 uses the information to The pellets are placed on the tray 33.
承上所述，若位於供料平台30的托盤31已不具有任何晶粒時，該供料平台30係移離第一取放單元40的下方，另一供料平台30且具有複數個晶粒的托盤31係移動至第一取放單元40的下 方，並進行如上所述之定位、擷取影像與吸取晶粒的動作。 As described above, if the tray 31 located in the feeding platform 30 does not have any crystal grains, the feeding platform 30 is moved away from the first pick-and-place unit 40, and the other feeding platform 30 has a plurality of crystals. The tray 31 of the grain is moved to the lower side of the first pick-and-place unit 40 The square, and the positioning, capturing images and sucking the crystal grains as described above.
若收料平台32的托盤33已無法容置任何晶粒時，該收料平台32係移離第二取放單元43的下方，另一收料平台32係移動至第二取放單元43的下方，該另一收料平台32具有一托盤33，該托盤33未具有任何晶粒。 If the tray 33 of the receiving platform 32 can no longer accommodate any die, the receiving platform 32 is moved away from the second pick-and-place unit 43 and the other receiving platform 32 is moved to the second pick-and-place unit 43. Below, the other receiving platform 32 has a tray 33 that does not have any dies.
請配合參考圖3所示，若托盤34係設於供料平台30，該托盤34未具有任何晶粒，則交換移動部20係朝向移動部300方向移動，或者交換移動部20與移動部300係朝向彼此移動。 Referring to FIG. 3, if the tray 34 is attached to the feeding platform 30, and the tray 34 does not have any crystal grains, the exchange moving portion 20 moves toward the moving portion 300, or exchanges the moving portion 20 and the moving portion 300. The systems move towards each other.
請配合參考圖4所示，叉部21係延伸至供料平台30中，舉例而言，若叉部21為兩層式，位於第一層的叉部21係與位於供料平台30之托盤34的底端接觸。 Referring to FIG. 4, the fork portion 21 extends into the feeding platform 30. For example, if the fork portion 21 is of two layers, the fork portion 21 located in the first layer and the tray at the feeding platform 30 are attached. The bottom end of 34 is in contact.
請配合參考圖5與圖6所示，卡掣部301係移離托盤34的底端，交換移動部20會上昇，直到位於多層之底層的叉部21高於供料平台30的頂面，於交換移動部20上昇時，原先位於供料平台30的托盤34會被第一層之叉部21頂離。 Referring to FIG. 5 and FIG. 6, the latching portion 301 is moved away from the bottom end of the tray 34, and the exchange moving portion 20 is raised until the fork portion 21 located on the bottom layer of the plurality of layers is higher than the top surface of the feeding platform 30. When the exchange moving portion 20 ascends, the tray 34 originally located on the supply platform 30 is separated from the fork portion 21 of the first layer.
請配合參考圖7與圖8所示，卡掣部301係回復至最初的位置，已上昇的交換移動部20會下降，如圖7所示，位於底層之叉部21的托盤35之底端會與卡掣部301接觸，交換移動部20會持續下降，直至托盤35與叉部21相互脫離，並且留於供料平台30的頂端。 Referring to FIG. 7 and FIG. 8, the latching portion 301 is returned to the original position, and the raised exchange moving portion 20 is lowered. As shown in FIG. 7, the bottom end of the tray 35 of the bottom fork portion 21 is shown. Will come into contact with the latch portion 301, and the exchange moving portion 20 will continue to descend until the tray 35 and the fork portion 21 are separated from each other and remain at the top end of the feeding platform 30.
如上所述，若叉部21為多層式，卡掣部301能夠選擇任一層的叉部21，再回復至最初的位置，而與位於該層之托盤35相互卡掣。 As described above, if the fork portion 21 is of a multi-layer type, the latch portion 301 can select the fork portion 21 of any one layer and return to the original position to be engaged with the tray 35 located on the layer.
若交換單元2已完成上述之托盤交換的動作，交換單元2係移動至托盤上載單元10，以接收具有晶粒的托盤，或者交換單元2係移動至托盤下載單元11，以將未具有晶粒的托盤給予托盤下載單元11。 If the exchange unit 2 has completed the above-described operation of pallet exchange, the exchange unit 2 moves to the tray uploading unit 10 to receive the tray having the die, or the exchange unit 2 moves to the tray downloading unit 11 to have no crystal grains. The tray is given to the tray download unit 11.
請再配合參考圖3至圖8所示，若托盤位於收料平台32，則該另一交換單元2與收料平台32係如上述。 Referring to FIG. 3 to FIG. 8 together, if the tray is located on the receiving platform 32, the other exchange unit 2 and the receiving platform 32 are as described above.
如圖3至圖8所示，位於收料平台32頂端之托盤34，其係具 有晶粒，如上所述，卡掣部321係進行退出與回復至最初位置的動作，移動部320係不動，交換移動部20係朝向移動部320移動，或者移動部320與交換移動部20朝向彼此移動。 As shown in Figures 3 to 8, the tray 34 at the top end of the receiving platform 32 is provided with a tie As described above, the click portion 321 performs the operation of withdrawing and returning to the initial position, the moving portion 320 is not moved, the exchange moving portion 20 is moved toward the moving portion 320, or the moving portion 320 and the exchange moving portion 20 are oriented. Move to each other.
上升的叉部21係頂離位於收料平台32頂端之托盤34，而後下降，以使托盤35留置於收料平台32頂端。 The raised fork portion 21 is lifted off the tray 34 at the top end of the receiving platform 32 and then lowered to allow the tray 35 to remain on top of the receiving platform 32.
如上所述，該另一交換單元2係移動至另一托盤上載單元10，以接收未具有晶粒的托盤，或者該另一交換單元2係移動至該另一托盤下載單元11，以將具有晶粒的托盤給予該另一托盤下載單元11。 As described above, the other exchange unit 2 is moved to another tray upload unit 10 to receive a tray having no die, or the other exchange unit 2 is moved to the other tray download unit 11 to have The tray of the die is given to the other tray download unit 11.
請再配合參考圖2所示，本發明係一種托盤交換模組，其具有一平台30、32與一交換單元2，該平台30、32係為上述之供料平台30與收料平台32，為了便於說明，以下僅以平台30說明。 Referring to FIG. 2, the present invention is a pallet change module having a platform 30, 32 and an exchange unit 2, wherein the platforms 30, 32 are the above-mentioned feeding platform 30 and receiving platform 32, For ease of explanation, the following is only described with platform 30.
平台30具有一移動部300與至少二卡掣部301，卡掣部301係設於移動部300的兩側。 The platform 30 has a moving portion 300 and at least two latching portions 301 , and the latching portions 301 are disposed on both sides of the moving portion 300 .
交換單元2具有一交換移動部20與至少二叉部21。 The exchange unit 2 has an exchange moving portion 20 and at least a fork portion 21.
交換移動部20係能夠相對於上述之平台30呈一縱向或一橫向移動，其係詳述於上述之圖3至8中與相關說明。 The exchange moving portion 20 is capable of moving longitudinally or laterally relative to the platform 30 described above, as described in detail in Figures 3 through 8 above.
叉部21係設於交換移動部20的一側，叉部21係以多層式設於交換移動部20的一側，叉部21係選擇性延伸至卡掣部301之間，交換移動20部係呈一縱向移動，而使該些叉部20呈一昇降，以完成一托盤交換作業。 The fork portion 21 is provided on one side of the exchange moving portion 20, the fork portion 21 is provided on one side of the exchange moving portion 20 in a multi-layer manner, and the fork portion 21 is selectively extended between the cassette portions 301, and the exchange movement is 20 portions. The longitudinal movement is performed, and the forks 20 are lifted and lowered to complete a pallet exchange operation.
上述之托盤交換模組的動作係論述於上述之圖2至圖8的說明，於此不再多做論述。 The operation of the above described pallet change module is discussed in the above description of Figs. 2 to 8, and will not be discussed further herein.
綜合上述，本發明係利用平台與交換單元之間的配合，以達到迅速更換托盤的目的。 In summary, the present invention utilizes the cooperation between the platform and the exchange unit to achieve the purpose of promptly replacing the tray.
另外，至少一供料平台與至少一收料平台的設計，其係能夠提升取放晶粒的速度與數量。 In addition, the design of at least one feeding platform and at least one receiving platform can improve the speed and quantity of picking and placing the crystal grains.
若供料平台與收料平台為複數個，則於更換托盤時，另一供料平台與另一收料平台能夠進行吸取與置放晶粒的作業，直至該另一供料平台與該另一收料平台需要進行更換托盤的作業，再一 供料平台與再一收料平台能夠進行吸取與置放晶粒的作業，或者已完成更換托盤作業的供料平台與收料平台回至起始位置，以進行吸取與置放晶粒的作業，藉以提升取放晶粒的速度與數量。 If there are a plurality of feeding platforms and receiving platforms, when the tray is replaced, another feeding platform and another receiving platform can perform the operations of sucking and placing the crystal grains until the other feeding platform and the other A receiving platform needs to change the tray, and then The feeding platform and the further receiving platform can perform the operations of sucking and placing the die, or the feeding platform and the receiving platform that have completed the replacement of the pallet returning to the starting position for the operation of sucking and placing the die In order to increase the speed and quantity of the grain.
如上所述，藉由迅速更換托盤與提升取放晶粒的速度與數量，以提升晶粒的生產率與載具的交換速度，該載具能夠被視為上述之供料平台、收料平台、托盤下載單元或托盤上載單元。 As described above, by rapidly changing the tray and increasing the speed and quantity of the pick-and-place die to improve the productivity of the die and the exchange speed of the carrier, the carrier can be regarded as the above-mentioned feeding platform, receiving platform, Tray download unit or tray upload unit.
惟以上所述之具體實施例，僅係用於例釋本發明之特點及功效，而非用於限定本發明之可實施範疇，於未脫離本發明上揭之精神與技術範疇下，任何運用本發明所揭示內容而完成之等效改變及修飾，均仍應為下述之申請專利範圍所涵蓋。 However, the specific embodiments described above are merely used to exemplify the features and functions of the present invention, and are not intended to limit the scope of the present invention, and may be applied without departing from the spirit and scope of the present invention. Equivalent changes and modifications made to the disclosure of the present invention are still covered by the scope of the following claims.
10‧‧‧托盤上載單元 10‧‧‧Tray upload unit
11‧‧‧托盤下載單元 11‧‧‧Tray download unit
2‧‧‧交換單元 2‧‧‧Exchange unit
30‧‧‧供料平台 30‧‧‧Feeding platform
31‧‧‧托盤 31‧‧‧Tray
32‧‧‧收料平台 32‧‧‧ receiving platform
33‧‧‧托盤 33‧‧‧Tray
40‧‧‧第一取放單元 40‧‧‧First pick and place unit
41‧‧‧第一影像定位單元 41‧‧‧First image positioning unit
42‧‧‧第二影像定位單元 42‧‧‧Second image positioning unit
43‧‧‧第二取放單元 43‧‧‧Second pick and place unit
44‧‧‧第三影像定位單元 44‧‧‧ Third image positioning unit
50‧‧‧中繼單元 50‧‧‧Relay unit
51‧‧‧回收單元 51‧‧‧Recycling unit
Claims (12)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102113070A TWI592352B (en) | 2013-04-12 | 2013-04-12 | Sorter and its tray exchange module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102113070A TWI592352B (en) | 2013-04-12 | 2013-04-12 | Sorter and its tray exchange module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201438975A true TW201438975A (en) | 2014-10-16 |
| TWI592352B TWI592352B (en) | 2017-07-21 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102113070A TWI592352B (en) | 2013-04-12 | 2013-04-12 | Sorter and its tray exchange module |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI592352B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI617821B (en) * | 2017-05-16 | 2018-03-11 | 亞克先進科技股份有限公司 | Electronic element testing system |
| CN113120609A (en) * | 2021-03-22 | 2021-07-16 | 深圳格芯集成电路装备有限公司 | Chip disk replacing equipment |
-
2013
- 2013-04-12 TW TW102113070A patent/TWI592352B/en active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI617821B (en) * | 2017-05-16 | 2018-03-11 | 亞克先進科技股份有限公司 | Electronic element testing system |
| CN113120609A (en) * | 2021-03-22 | 2021-07-16 | 深圳格芯集成电路装备有限公司 | Chip disk replacing equipment |
| CN113120609B (en) * | 2021-03-22 | 2022-02-08 | 深圳格芯集成电路装备有限公司 | Chip disk replacing equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI592352B (en) | 2017-07-21 |
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