TWI565387B - 殼體、應用該殼體的電子裝置及其製作方法 - Google Patents
殼體、應用該殼體的電子裝置及其製作方法 Download PDFInfo
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
- B29C2045/14327—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles anchoring by forcing the material to pass through a hole in the article
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/1486—Details, accessories and auxiliary operations
- B29C2045/14868—Pretreatment of the insert, e.g. etching, cleaning
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29K2075/00—Use of PU, i.e. polyureas or polyurethanes or derivatives thereof, as moulding material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29L2031/00—Other particular articles
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Description
本發明係關於一種殼體、應用該殼體的電子裝置及該殼體的製作方法。
隨著現代電子技術的不斷進步和發展,電子裝置取得了相應的發展,同時消費者們對於產品外觀的要求也愈來愈高。由於金屬殼體在外觀、機構強度、散熱效果等方面具有優勢,故愈來愈多的廠商設計出具有金屬殼體的電子裝置來滿足消費者的需求。惟,金屬殼體容易干擾設置於其內的天線接收和傳遞訊號,導致天線性能不佳。為解決此問題,設計師往往會採取將金屬殼體靠近天線的部分切割成細小片狀,以達到增強訊號的效果,然而,由於金屬片體積過小,在組裝過程中,細小片狀金屬片易變形,不能保障尺寸精度,很難達到預期的效果。
鑒於以上情況,有必要提供一種既能避免訊號遮罩又能保證尺寸精度的殼體。
另,還有必要提供所述殼體的製作方法。
另,還有必要提供一種應用所述殼體的電子裝置。
一種殼體,所述殼體包括一基體及形成於基體內表面的加固層,該基體包括至少一本體部、複數金屬片及複數不導電的隔離層,所述金屬片與隔離層交替設置且金屬片藉由隔離層相固接,所述至少一本體部藉由隔離層與上述金屬片與隔離層交替設置的形成的部件相固接。
一種殼體的製作方法,包括以下步驟:提供一金屬的基體片材,在該基體片材上貫通開設複數縫隙,使得基體片材被切成複數金屬片及至少一本體部;將該本體部及所述金屬片間隔設置,在本體部與相鄰的金屬片之間及相鄰的兩個金屬片之間的縫隙內填充黏結性材料形成不導電的隔離層,形成基體;對該基體的內表面進行塗裝形成一加固層。
一種殼體的製作方法,其包括以下步驟:提供複數金屬片,在每一金屬片的相對的兩個側面形成不導電的隔離層以固接相鄰的金屬片;提供至少一本體部,本體部預留一缺口;將上述藉由隔離層固接的金屬片容置於該缺口內,形成加固層於上述金屬片、隔離層及本體部的內表面。
一種電子裝置,包括本體、殼體及設置於本體內的天線,所述殼體包括一基體及形成於基體內表面的加固層,該基體包括至少一本體部、複數金屬片及複數不導電的隔離層,所述金屬片與隔離層交替設置且金屬片藉由隔離層相固接,所述至少一本體部藉由隔離層與上述金屬片與隔離層交替設置的形成的部件相固接。所述本體組裝於該殼體,且殼體由所述金屬片及隔離層組成的部位與天線相對應。
所述殼體、應用該殼體的電子裝置及殼體的製作方法藉由金屬片
與隔離層交替設置,且藉由加固層提高金屬片、隔離層及本體部之間的結合力,既能避免訊號遮罩又能保證尺寸精度,且不影響殼體的外觀。
100‧‧‧電子裝置
10‧‧‧本體
30‧‧‧殼體
305‧‧‧容置空間
306‧‧‧內表面
31‧‧‧基體
310‧‧‧本體部
311‧‧‧金屬片
313‧‧‧隔離層
33‧‧‧加固層
40‧‧‧天線
圖1係本發明較佳實施例電子裝置的立體示意圖。
圖2係圖1所示的電子裝置的殼體的立體示意圖。
圖3係圖2所示殼體的部分分解示意圖。
圖4係圖2所示殼體沿IV-IV的剖視圖。
為了使本發明的目的、技術方案及優點更加清楚明白,以下結合附圖與實施例對本發明進行進一步詳細說明。
請參閱圖1,本發明較佳實施方式的電子裝置100,可以是但不限於是行動電話、PDA(Personal Digital Assistant)、平板電腦。電子裝置100包括本體10、安裝於本體10上的殼體30以及天線40。
請結合參閱圖2,該殼體30整體呈薄片狀,本實施例中,該殼體30為電子裝置的後蓋。殼體30包括基體31及形成於該基體31內表面的加固層33。
請結合參閱圖3及圖4,所述基體31具有殼體30所需的三維形狀,如本實施例中的近似為U形,並形成一容置空間305用於與本體10配合容置電子裝置100的內部零件,比如天線40、電池(圖未示)等。該基體31包括至少一本體部310、複數金屬片311以及複數不導電的隔離層313。本實施例中,該基體31包括兩個本體部310
。所述本體部310及該金屬片311均採用合金材料製造,優選為5系列鋁合金、6系列鋁合金、鈦合金、鎂合金或不銹鋼。複數金屬片311以及複數隔離層313被夾設於兩個本體部310之間。所述金屬片311與該隔離層313交替設置,隔離層313與設置於其兩側的金屬片311相黏結。每一本體部310與相鄰的金屬片311之間設置有一隔離層313,以使本體部310與相鄰的金屬片311連接。每一金屬片311沿該金屬片311與該隔離層313交替設置的方向的厚度為0.4~1.0mm。所述隔離層313可由不導電的樹脂塗料形成,比如聚氨酯紫外光固化塗料。該金屬片311為近似U形的金屬薄片,該隔離層313黏結於其相鄰設置的金屬片311,故,其形狀與金屬片311近似,也近似為U形。
所述基體31包括朝向容置空間305的內表面306。
所述加固層33形成於基體31的內表面306,並覆蓋所述每一金屬片311、每一隔離層313以及所述本體部310連接該隔離層313一端的一部分或全部,以將所述金屬片311、隔離層313及本體部310結合為一體,加強金屬片311、隔離層313與本體部310的結合強度。該加固層33為塑膠材質,該塑膠材質可為聚苯硫醚(PPS)、聚對苯二甲酸丁二醇酯(PBT)、尼龍(PA)、聚對苯二甲酸乙二醇酯(PET)、聚對苯二甲酸1.3丙二醇酯(PTT)、聚醚醯亞胺(PEI)、聚醚醚酮(PEEK)及聚對苯二甲酸1,4-環己烷二甲醇酯(PCT)及改性材料中的至少一種製成。
該殼體30組裝於該本體10上時,殼體30由所述金屬片311及隔離層313組成的部位與天線40相對應,以避免殼體30對天線40產生干擾。
上述電子裝置殼體30一種較佳實施例的製作方法包括如下步驟:提供一基體片材,該基體片材可採用鑄造、衝壓或數控機床(Computer Number Control,CNC)等常見方法製備,優選採用衝壓或數控機床製備。該基體片材具有殼體30所需的三維形狀。
藉由鐳射切割技術在該基體片材對應天線40的位置貫通開設複數縫隙,使得基體片材被切成複數金屬片311及至少一本體部310。將該本體部310及所述金屬片311按對接方式設置,並在本體部310與相鄰的金屬片311之間及相鄰的兩個金屬片311之間預留縫隙,在所述縫隙內填充聚氨酯,在常溫下於紫外光的照射下固化形成隔離層313,每一隔離層313的沿該金屬片311與該隔離層313交替設置的方向的厚度為20~60μm,以使相鄰金屬片311之間的間隔及每一本體部310與相鄰金屬片311之間的間隔為20~60μm,由此以較好地滿足殼體30不干擾天線40訊號的要求,同時該隔離層313使得金屬片311、隔離層313及本體部310黏結為一體,由此製得基體31。該基體31具有殼體30所需的三維形狀,並形成有容置空間305。
對該基體31的內表面306進行塗裝,從而在該殼體30的內表面306形成一連貫的加固層33。該加固層33覆蓋所述每一金屬片311、每一隔離層313以及所述本體部310連接該隔離層313一端的一部分或全部,以提高金屬片311、隔離層313與本體部310之間的結合力。該加固層33為塑膠材質。
該加固層33可藉由以下兩種方法形成:
方法一:首先藉由化學蝕刻或電化學蝕刻在該基體31的表面形成
複數小孔(未圖示),該小孔的直徑為15~100μm。藉由注塑成型工藝將熔融狀態的塑膠注入至該小孔內,使得加固層33成型於該基體31的內表面306。
方法二:在該基體31的內表面306塗一層熱固性膠(未圖示),於自然風乾或烤幹成膜,再藉由注塑成型形成加固層33於基體31的內表面306的熱固性膠膜上。該熱固性膠用於提高金屬材質的基體31與塑膠材質的加固層33之間的結合力。
上述電子裝置殼體30的另一個較佳實施例的製作方法包括如下步驟:
提供至少一本體部310,該本體部310可採用鑄造、衝壓或數控機床等常見方法製備,優選採用衝壓或數控機床製備該本體部310,且在該天線40的對應處預留一缺口(未圖示),該缺口用於放置金屬片311。藉由化學腐蝕或電化學腐蝕在該本體部310的表面形成複數小孔,該小孔的直徑為15~100μm。
提供複數金屬片311,該金屬片311藉由衝壓成型。在該金屬片311的側面藉由陽極氧化或塗絕緣層以使得金屬片311之間形成隔離層313,該隔離層313具有絕緣作用。該金屬片311可為覆膜板,所述覆膜板包括形成於金屬片311相對的兩個側面的隔離層313。每一隔離層313的沿該金屬片311與該隔離層313交替設置的方向的厚度為0.01~0.1mm。在該金屬片311的側面形成複數微孔(未圖示),且每一金屬片311的微孔均對應,該微孔用於填充塑膠。
該金屬片311與本體部310藉由嵌入成型技術將塑膠注入小孔及微
孔內達到金屬片311與本體部310一體成型,形成基體31,且該塑膠乾燥後在該基體31內表面形成加固層33,然後藉由數控機床以去除多餘的塑膠,最後做拋光或表面裝飾處理。
所述殼體30藉由金屬片311與隔離層313交替設置,且藉由加固層33覆蓋所述每一金屬片311、每一隔離層313以及所述本體部310連接該隔離層313一端的一部分或全部,提高了金屬片311、隔離層313及本體部310之間的結合力,既能避免訊號遮罩又能保證尺寸精度,且不影響殼體30的外觀。
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,舉凡熟悉本案技藝之人士,於爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。
310‧‧‧本體部
311‧‧‧金屬片
313‧‧‧隔離層
33‧‧‧加固層
Claims (9)
- 一種殼體的製作方法,包括以下步驟:提供一金屬的基體片材,在該基體片材上貫通開設複數縫隙,使得基體片材被切成複數金屬片及至少一本體部;將該本體部及所述金屬片間隔設置,在本體部與相鄰的金屬片之間及相鄰的兩個金屬片之間的縫隙內填充黏結性材料形成不導電的隔離層,形成基體;對該基體的內表面進行塗裝形成一加固層;其中所述加固層覆蓋所述金屬片、隔離層以及所述本體部連接該隔離層的一端的一部分或全部,每一隔離層沿該金屬片與隔離層交替設置的方向的厚度為20~60μm。
- 如申請專利範圍第1項所述之殼體的製作方法,其中所述加固層的形成係藉由在基體表面藉由化學蝕刻或電化學蝕刻形成若干個小孔,藉由注塑成型工藝將熔融狀態的塑膠注入至該小孔內,該小孔的直徑為15~100μm。
- 如申請專利範圍第1項所述之殼體的製作方法,其中所述加固層藉由在該基體內表面塗一層熱固性膠,於自然風乾或烤幹成膜,再藉由注塑成型工藝形成加固層於該基體的內表面的熱固性膠膜上。
- 一種殼體的製作方法,其包括以下步驟:提供複數金屬片,在每一金屬片的相對的兩個側面形成不導電的隔離層以固接相鄰的金屬片;提供至少一本體部,本體部預留一缺口;將上述藉由隔離層固接的金屬片容置於該缺口內,形成加固層於上述金屬片、隔離層及本體部的內表面。
- 如申請專利範圍第4項所述之殼體的製作方法,其中所述殼體藉由化學腐蝕或電化學腐蝕在該本體部的表面形成複數小孔,該小孔的直徑為15~100μm,每一隔離層的沿該金屬片與該隔離層交替設置的方向的厚度為 0.01~0.1mm。
- 如申請專利範圍第5項所述之殼體的製作方法,其中每一金屬片的側面均形成有複數微孔,且每一金屬片的微孔均對準,所述加固層藉由嵌入成型技術將塑膠注入小孔及微孔內形成於基體的內表面。
- 如申請專利範圍第4項所述之殼體的製作方法,其中所述隔離層係藉由陽極氧化或塗絕緣層形成於該金屬片的側面。
- 如申請專利範圍第4項所述之殼體的製作方法,其中所述金屬片係覆膜板,該覆膜板包括形成於金屬片相對的兩個側面的隔離層。
- 一種電子裝置,包括本體、殼體及設置於本體內的天線,其改良在於:所述殼體為如申請專利範圍第1-8項任一項所述的殼體,所述本體組裝於該殼體,且殼體由所述金屬片及隔離層組成的部位與天線相對應。
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