CN104168730B - 壳体、应用该壳体的电子装置及其制作方法 - Google Patents

壳体、应用该壳体的电子装置及其制作方法 Download PDF

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CN104168730B
CN104168730B CN201410065545.0A CN201410065545A CN104168730B CN 104168730 B CN104168730 B CN 104168730B CN 201410065545 A CN201410065545 A CN 201410065545A CN 104168730 B CN104168730 B CN 104168730B
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sheet metal
shell
body part
separation layer
layer
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CN104168730A (zh
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谷长海
刘小凯
秦姚姚
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Shenzhen Futaihong Precision Industry Co Ltd
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Priority to US14/556,658 priority patent/US20150241921A1/en
Priority to JP2014255953A priority patent/JP6526408B2/ja
Priority to EP14200698.0A priority patent/EP2913988B1/en
Priority to US15/472,299 priority patent/US20170199546A1/en
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    • H01Q—ANTENNAS, i.e. RADIO AERIALS
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    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C2045/14327—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles anchoring by forcing the material to pass through a hole in the article
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Abstract

一种壳体，所述壳体包括一基体及形成于基体内表面的加固层，该基体包括至少一本体部、若干个金属片及若干个不导电的隔离层，所述金属片与隔离层交替设置且金属片通过隔离层相固接，所述至少一本体部通过隔离层与上述金属片与隔离层交替设置的形成的部件相固接。本发明还提供应用该壳体的电子装置及该壳体的制作方法。所述壳体、应用该壳体的电子装置及壳体的制作方法通过金属片与隔离层交替设置，且通过加固层提高金属片、隔离层及基体的结合力，既能避免信号屏蔽又能保证尺寸精度，且不影响壳体的外观。

Description

壳体、应用该壳体的电子装置及其制作方法
技术领域
本发明涉及一种壳体、应用该壳体的电子装置及该壳体的制作方法。
背景技术
随着现代电子技术的不断进步和发展，电子装置取得了相应的发展，同时消费者们对于产品外观的要求也越来越高。由于金属壳体在外观、机构强度、散热效果等方面具有优势，因此越来越多的厂商设计出具有金属壳体的电子装置来满足消费者的需求。但是，金属壳体容易干扰设置在其内的天线接收和传递信号，导致天线性能不佳。为解决此问题，设计师往往会采取将金属壳体靠近天线的部分切割成细小片状，以达到增强信号的效果但是由于金属片体积过小，在组装过程中，细小片状金属片易变形，不能保障尺寸精度，很难达到预期的效果。
发明内容
针对上述问题，有必要提供一种既能避免信号屏蔽又能保证尺寸精度的壳体。
另，还有必要提供一种应用所述壳体的电子装置。
另，还有必要提供所述壳体的制作方法。
一种壳体，所述壳体包括一基体及形成于基体内表面的加固层，该基体包括至少一本体部、若干个金属片及若干个不导电的隔离层，所述金属片与隔离层交替设置且金属片通过隔离层相固接，所述至少一本体部通过隔离层与上述金属片与隔离层交替设置的形成的部件相固接。
一种壳体的制作方法，包括以下步骤：提供一金属的基体片材，在该基体片材上贯通开设若干条缝隙，使得基体片材被切成若干个金属片及至少一本体部；将该本体部及所述金属片间隔设置，在本体部与相邻的金属片之间及相邻的两个金属片之间的缝隙内填充粘结性材料形成不导电的隔离层，形成基体；对该基体的内表面进行涂装形成一加固层。
一种壳体的制作方法，其包括以下步骤：提供若干个金属片，在每一金属片的相对的两个侧面形成不导电的隔离层以固接相邻的金属片；提供至少一本体部，本体部预留一缺口；将上述通过隔离层固接的金属片容置于该缺口内，形成加固层于上述金属片、隔离层及本体部的内表面。
一种电子装置，包括本体、壳体及设置于本体内的天线，所述壳体包括一基体及形成于基体内表面的加固层，该基体包括至少一本体部、若干个金属片及若干个不导电的隔离层，所述金属片与隔离层交替设置且金属片通过隔离层相固接，所述至少一本体部通过隔离层与上述金属片与隔离层交替设置的形成的部件相固接。所述本体组装于该壳体，且壳体由所述金属片及隔离层组成的部位与天线相对应。
所述壳体、应用该壳体的电子装置及壳体的制作方法通过金属片与隔离层交替设置，且通过加固层提高金属片、隔离层及基体的结合力，既能避免信号屏蔽又能保证尺寸精度，且不影响壳体的外观。
附图说明
图1是本发明较佳实施例电子装置的立体示意图。
图2是图1所示的电子装置的壳体的立体示意图。
图3为图2所示壳体的部分分解示意图。
图4是图2所示壳体沿IV-IV的剖视图。
主要元件符号说明
电子装置 100
本体 10
壳体 30
容置空间 305
内表面 306
基体 31
本体部 310
金属片 311
隔离层 313
加固层 33
天线 40
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图1，本发明较佳实施方式的电子装置100，可以是但不限于为手机、PDA(Personal Digital Assistant)、平板电脑。电子装置100包括本体10、安装于本体10上的壳体30以及天线40。
请结合参阅图2，该壳体30整体呈薄片状，本实施例中，该壳体30为电子装置的后盖。壳体30包括基体31及形成于该基体31内表面的加固层33。
请结合参阅图3及图4，所述基体31具有壳体30所需的三维形状，如本实施例中的近似为U形，并形成一容置空间305用于与本体10配合容置电子装置100的内部零件，比如天线40、电池（图未示）等。该基体31包括至少一本体部310、若干个金属片311以及若干个不导电的隔离层313。本实施例中，该基体31包括两个本体部310。所述本体部310及该金属片311均采用合金材料制造，优选为5系列铝合金、6系列铝合金、钛合金、镁合金或不锈钢。若干个金属片311以及若干个隔离层313被夹设于两个本体部310之间。所述金属片311与该隔离层313交替设置，隔离层313与设置于其两侧的金属片相粘结。每一本体部310与相邻的金属片311之间设置有一隔离层313，以使本体部310与相邻的金属片311连接。每一金属片311沿该金属片311与该隔离层313交替设置的方向的厚度为0.4～1.0mm。所述隔离层313可由不导电的树脂涂料形成，比如聚氨酯紫外光固化涂料。该金属片311为近似U形的金属薄片，该隔离层313粘结于其相邻设置的金属片311，故，其形状与金属片311近似，也近似为U形。
所述基体31包括朝向容置空间305的内表面306。
所述加固层33形成于基体31的内表面306，并覆盖所述每一金属片311、每一隔离层313以及所述本体部310连接该隔离层313一端的一部分或全部，以将所述金属片311、隔离层313及本体部310结合为一体，加强金属片311、隔离层313与本体部310的结合强度。该加固层33为塑料材质，该塑料材质可以为聚苯硫醚（PPS）、聚对苯二甲酸丁二醇酯（PBT）、尼龙（PA）、聚对苯二甲酸乙二醇酯（PET）、聚对苯二甲酸1.3丙二醇酯（PTT）、聚醚酰亚胺（PEI）、聚醚醚酮（PEEK）及聚对苯二甲酸1,4-环己烷二甲醇酯(PCT)及改性材料中的一种或几种的组合物制成。
该壳体30组装于该本体10上时，壳体30由所述金属片311及隔离层313组成的部位与天线40相对应，以避免壳体30对天线40产生干扰。
上述电子装置壳体30一种较佳实施例的制作方法包括如下步骤：
提供一基体片材，该基体片材可采用铸造、冲压或数控机床(Computer NumberControl，CNC)等常见方法制备，优选采用冲压或数控机床制备。该基体片材具有壳体30所需的三维形状。
通过镭射切割技术在该基体片材对应天线40的位置贯通开设若干条缝隙，使得基体片材被切成若干个金属片311及至少一本体部310。将该本体部310及所述金属片311按对接方式设置，并在本体部310与相邻的金属片311之间及相邻的两个金属片311之间预留缝隙，在所述缝隙内填充聚氨酯，在常温下于紫外光的照射下固化形成隔离层313，每一隔离层313的沿该金属片311与该隔离层313交替设置的方向的厚度为20～60μm，以使相邻金属片311之间的间隔及每一本体部310与相邻金属片311之间的间隔为20～60μm，由此以较好地满足壳体30不干扰天线40信号的要求，同时该隔离层313使得金属片311、隔离层313及本体部310粘结为一体，由此制得基体31。该基体31具有壳体30所需的三维形状，并形成有容置空间305。
对该基体31的内表面306进行涂装，从而在该壳体30的内表面306形成一连贯的加固层33。该加固层33覆盖所述每一金属片311、每一隔离层313以及所述本体部310连接该隔离层313一端的一部分或全部，以提高金属片311、隔离层313与本体部310之间的结合力。该加固层33为塑料材质。
该加固层33可通过以下两种方法形成。
方法一：首先通过化学蚀刻或电化学蚀刻在该基体31的表面形成若干个小孔（未图示），该小孔的直径为15～100μm。通过注塑成型工艺将熔融状态的塑料注入至该小孔内，使得加固层33成型于该基体31的内表面306。
方法二：在该基体31的内表面306涂一层热固性胶（未图示），于自然风干或烤干成膜，再通过注塑成型形成加固层33于基体31的内表面306的热固性胶膜上。该热固性胶用以提高金属材质的基体31与塑料材质的加固层33之间的结合力。
上述电子装置壳体30的另一个较佳实施例的制作方法包括如下步骤：
提供至少一本体部310，该本体部310可采用铸造、冲压或数控机床等常见方法制备，优选采用冲压或数控机床制备该本体部310，且在该天线40的对应处预留一缺口（未图示），该缺口用于放置金属片311。通过化学腐蚀或电化学腐蚀在该本体部310的表面形成若干个小孔，该小孔的直径为15～100μm。
提供若干个金属片311，该金属片311通过冲压成型。在该金属片311的侧面通过阳极氧化或涂绝缘层以使得金属片311之间形成隔离层313，该隔离层313具有绝缘作用。该金属片311可以是覆膜板，所述覆膜板包括形成于金属片311相对的两个侧面的隔离层313。每一隔离层313的沿该金属片311与该隔离层313交替设置的方向的厚度为0.01~0.1mm。在该金属片311的侧面形成若干个微孔（未图示），且每一金属片311的微孔均对应，该微孔用于填充塑料。
该金属片311与本体部310通过嵌入成型技术将塑料注入小孔及微孔内达到金属片311与本体部310一体成型，形成基体31，且该塑料干燥后在该基体31内表面形成加固层33，然后通过数控机床以去除多余的塑料，最后做抛光或表面装饰处理。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (5)

1.一种壳体的制作方法，其包括以下步骤：提供至少二个金属片，在每一金属片的相对的两个侧面通过阳极氧化或涂绝缘层而形成不导电的隔离层以固接相邻的金属片，所述金属片之间彼此电绝缘；提供至少一本体部，本体部预留一缺口；将上述通过隔离层固接的金属片容置于该缺口内，并将塑料注入所述本体部与所述金属片之间，使得所述金属片与所述本体部一体成型而形成基体；形成加固层于上述金属片、隔离层及本体部的内表面。
2.如权利要求1所述的壳体的制作方法，其特征在于：所述壳体通过化学腐蚀或电化学腐蚀在该本体部的表面形成若干个小孔，该小孔的直径为15～100μm。
3.如权利要求2所述的壳体的制作方法，其特征在于：每一金属片的侧面均形成有若干个微孔，且每一金属片的微孔均对准，通过嵌入成型技术将塑料注入小孔及微孔内达到所述金属片与所述本体部的一体成型。
4.如权利要求1所述的壳体的制作方法，其特征在于：每一隔离层沿该金属片与该隔离层交替设置的方向的厚度为0.01～0.1mm，所述金属片沿该金属片与隔离层交替设置的方向的厚度为0.4～1.0mm。
5.如权利要求1所述的壳体的制作方法，其特征在于：通过在该金属片的内表面形成若干个微孔，通过化学腐蚀或电化学腐蚀在该本体部的内表面形成若干个小孔，以及通过将塑料注入小孔及微孔内而于该基体内表面形成所述加固层。
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