TWI562263B - - Google Patents

Info

Publication number
TWI562263B
TWI562263B TW103125855A TW103125855A TWI562263B TW I562263 B TWI562263 B TW I562263B TW 103125855 A TW103125855 A TW 103125855A TW 103125855 A TW103125855 A TW 103125855A TW I562263 B TWI562263 B TW I562263B
Authority
TW
Taiwan
Application number
TW103125855A
Other languages
Chinese (zh)
Other versions
TW201521138A (zh
Inventor
Masaki Matsuyama
Hiroshi Maki
Original Assignee
Fasford Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fasford Technology Co Ltd filed Critical Fasford Technology Co Ltd
Publication of TW201521138A publication Critical patent/TW201521138A/zh
Application granted granted Critical
Publication of TWI562263B publication Critical patent/TWI562263B/zh

Links

TW103125855A 2013-08-09 2014-07-29 筒夾及固晶裝置 TW201521138A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013166600A JP6341641B2 (ja) 2013-08-09 2013-08-09 ダイボンダ

Publications (2)

Publication Number Publication Date
TW201521138A TW201521138A (zh) 2015-06-01
TWI562263B true TWI562263B (ko) 2016-12-11

Family

ID=52502785

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103125855A TW201521138A (zh) 2013-08-09 2014-07-29 筒夾及固晶裝置

Country Status (4)

Country Link
JP (1) JP6341641B2 (ko)
KR (1) KR101666276B1 (ko)
CN (1) CN104347435B (ko)
TW (1) TW201521138A (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104900575B (zh) * 2015-06-23 2018-11-20 上海航天电子通讯设备研究所 真空共晶焊的芯片定位夹具、制造方法及芯片转运方法
JP6705668B2 (ja) * 2016-03-11 2020-06-03 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
CN107403755A (zh) * 2016-05-19 2017-11-28 胡川 芯片制作方法
WO2018146880A1 (ja) * 2017-02-09 2018-08-16 ボンドテック株式会社 部品実装システム、樹脂成形装置、部品実装方法および樹脂成形方法
JP6846958B2 (ja) * 2017-03-09 2021-03-24 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP7033878B2 (ja) * 2017-10-16 2022-03-11 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
CN109616430B (zh) * 2018-11-13 2020-10-30 武汉电信器件有限公司 一种芯片贴装识别***及方法
US11728202B2 (en) 2019-01-29 2023-08-15 Boe Technology Group Co., Ltd. Element pickup device, method for manufacturing the same and method for using the same
TWI748763B (zh) * 2020-11-23 2021-12-01 鴻勁精密股份有限公司 拾取機構及其應用之作業設備
CN112735982B9 (zh) * 2020-12-30 2021-10-08 江苏新智达新能源设备有限公司 晶圆蓝膜取晶固晶装置
CN112846521B (zh) * 2020-12-31 2024-03-12 大族激光科技产业集团股份有限公司 一种夹具及激光标记***

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060094387A (ko) * 2005-02-24 2006-08-29 삼성테크윈 주식회사 칩 분리장치
US20110308738A1 (en) * 2010-06-17 2011-12-22 Hiroshi Maki Die bonder, pickup method, and pickup device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0732190B2 (ja) * 1990-10-12 1995-04-10 同和鉱業株式会社 半導体ペレットのピックアップ方法
JP4140190B2 (ja) * 2000-11-22 2008-08-27 松下電器産業株式会社 電子部品実装方法
KR100769111B1 (ko) * 2006-03-13 2007-10-22 캐논 머시너리 가부시키가이샤 콜렛, 다이 본더 및 칩의 픽업 방법
JP2009200377A (ja) * 2008-02-25 2009-09-03 Panasonic Corp ダイボンディング装置
JP5065969B2 (ja) 2008-03-31 2012-11-07 株式会社日立ハイテクインスツルメンツ 部品実装装置
JP5989313B2 (ja) * 2011-09-15 2016-09-07 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法
JP5814713B2 (ja) * 2011-09-16 2015-11-17 ファスフォードテクノロジ株式会社 ダイボンダ及びダイボンディング方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060094387A (ko) * 2005-02-24 2006-08-29 삼성테크윈 주식회사 칩 분리장치
US20110308738A1 (en) * 2010-06-17 2011-12-22 Hiroshi Maki Die bonder, pickup method, and pickup device

Also Published As

Publication number Publication date
CN104347435B (zh) 2018-09-11
JP2015035548A (ja) 2015-02-19
KR20150018405A (ko) 2015-02-23
TW201521138A (zh) 2015-06-01
CN104347435A (zh) 2015-02-11
KR101666276B1 (ko) 2016-10-13
JP6341641B2 (ja) 2018-06-13

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