TWI561603B - Adhesive composition, adhesive film and electronic component - Google Patents
Adhesive composition, adhesive film and electronic componentInfo
- Publication number
- TWI561603B TWI561603B TW101143662A TW101143662A TWI561603B TW I561603 B TWI561603 B TW I561603B TW 101143662 A TW101143662 A TW 101143662A TW 101143662 A TW101143662 A TW 101143662A TW I561603 B TWI561603 B TW I561603B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive
- electronic component
- adhesive composition
- adhesive film
- film
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
- H01B1/122—Ionic conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110122928A KR101391696B1 (ko) | 2011-11-23 | 2011-11-23 | 이방 전도성 조성물 및 필름 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201326336A TW201326336A (zh) | 2013-07-01 |
TWI561603B true TWI561603B (en) | 2016-12-11 |
Family
ID=48425913
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101143662A TWI561603B (en) | 2011-11-23 | 2012-11-22 | Adhesive composition, adhesive film and electronic component |
Country Status (4)
Country | Link |
---|---|
US (1) | US9390831B2 (ko) |
KR (1) | KR101391696B1 (ko) |
CN (1) | CN103131367B (ko) |
TW (1) | TWI561603B (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101596544B1 (ko) * | 2012-06-15 | 2016-02-22 | 제일모직주식회사 | 광경화 조성물, 이를 포함하는 장벽층, 및 이를 포함하는 봉지화된 장치 |
KR101665171B1 (ko) * | 2014-01-29 | 2016-10-11 | 제일모직주식회사 | 이방 도전성 필름 및 상기 필름에 의해 접속된 반도체 장치 |
KR101706818B1 (ko) * | 2014-04-30 | 2017-02-15 | 제일모직주식회사 | 이방 도전성 필름용 조성물, 이방 도전성 필름 및 반도체 장치 |
KR101712703B1 (ko) * | 2014-07-18 | 2017-03-06 | 삼성에스디아이 주식회사 | 접착 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치 |
KR101721732B1 (ko) * | 2014-07-25 | 2017-04-10 | 삼성에스디아이 주식회사 | 접착 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치 |
KR101706821B1 (ko) * | 2014-09-01 | 2017-02-14 | 삼성에스디아이 주식회사 | 이방 도전성 필름 및 상기 필름에 의해 접속된 반도체 장치 |
KR101780544B1 (ko) * | 2015-05-20 | 2017-09-21 | 삼성에스디아이 주식회사 | 접착 필름 및 이를 이용한 반도체 장치 |
JP6918445B2 (ja) * | 2016-06-24 | 2021-08-11 | 日東電工株式会社 | 加熱接合用シート及びダイシングテープ付き加熱接合用シート |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1527869A (zh) * | 2001-05-29 | 2004-09-08 | 3M | 可紫外活化的胶粘膜 |
TWI291977B (en) * | 2004-06-28 | 2008-01-01 | Canon Kk | Cationic photopolymerizable epoxy resin composition, minute structural member using the same and method for manufacturing minute structural member |
TW200902582A (en) * | 2007-06-15 | 2009-01-16 | Sony Chem & Inf Device Corp | Epoxy resin composition |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2706833B2 (ja) | 1990-02-14 | 1998-01-28 | 三新化学工業株式会社 | カチオン重合開始剤および重合性組成物 |
US5362421A (en) * | 1993-06-16 | 1994-11-08 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive compositions |
US7053133B2 (en) * | 2001-05-29 | 2006-05-30 | Hiroaki Yamaguchi | Ultraviolet activatable adhesive film |
JP2008303167A (ja) * | 2007-06-07 | 2008-12-18 | Sony Chemical & Information Device Corp | 新規なスルホニウムボレート錯体 |
KR100934553B1 (ko) * | 2007-11-16 | 2009-12-29 | 제일모직주식회사 | 이방 전도성 필름의 제조방법 및 그에 의해서 제조되는이방 전도성 필름 |
JP5444702B2 (ja) * | 2008-12-05 | 2014-03-19 | デクセリアルズ株式会社 | 新規なスルホニウムボレート錯体 |
EP2230283B1 (en) * | 2009-03-18 | 2014-07-02 | Konica Minolta IJ Technologies, Inc. | Actinic energy radiation curable ink-jet ink and ink-jet recording method |
JP5250854B2 (ja) * | 2009-11-30 | 2013-07-31 | コニカミノルタ株式会社 | インクジェット画像形成方法及びインクジェットインクセット |
-
2011
- 2011-11-23 KR KR1020110122928A patent/KR101391696B1/ko active IP Right Grant
-
2012
- 2012-11-19 US US13/680,893 patent/US9390831B2/en active Active
- 2012-11-21 CN CN201210477338.7A patent/CN103131367B/zh active Active
- 2012-11-22 TW TW101143662A patent/TWI561603B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1527869A (zh) * | 2001-05-29 | 2004-09-08 | 3M | 可紫外活化的胶粘膜 |
TWI291977B (en) * | 2004-06-28 | 2008-01-01 | Canon Kk | Cationic photopolymerizable epoxy resin composition, minute structural member using the same and method for manufacturing minute structural member |
TW200902582A (en) * | 2007-06-15 | 2009-01-16 | Sony Chem & Inf Device Corp | Epoxy resin composition |
Also Published As
Publication number | Publication date |
---|---|
US9390831B2 (en) | 2016-07-12 |
KR20130057151A (ko) | 2013-05-31 |
US20130126788A1 (en) | 2013-05-23 |
CN103131367B (zh) | 2015-02-25 |
KR101391696B1 (ko) | 2014-05-07 |
CN103131367A (zh) | 2013-06-05 |
TW201326336A (zh) | 2013-07-01 |
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