TWI541843B - Surface mount inductor and method of making same - Google Patents
Surface mount inductor and method of making same Download PDFInfo
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- TWI541843B TWI541843B TW102100532A TW102100532A TWI541843B TW I541843 B TWI541843 B TW I541843B TW 102100532 A TW102100532 A TW 102100532A TW 102100532 A TW102100532 A TW 102100532A TW I541843 B TWI541843 B TW I541843B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/288—Shielding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
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- H01F3/08—Cores, Yokes, or armatures made from powder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
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Description
本發明係關於一種小型的表面安裝感應器及其製造方法。 The present invention relates to a small surface mount inductor and a method of fabricating the same.
現在,將捲繞線材而得的線圈(coil)內包在芯部內的表面安裝感應器受到廣泛的利用。伴隨著近年之行動電話等電子機器的小型化及薄型化,類似表面安裝感應器之電子零件也要求小型化及低高度化。申請人已提案有一種將扁平導線以其端部的兩方拉出到外周的方式捲繞為漩渦狀的線圈、及使用了預成型的平板(tablet)的小型表面安裝感應器及其製造方法(日本特開2010-245473)。 Nowadays, a surface mount inductor in which a coil obtained by winding a wire is enclosed in a core is widely used. With the miniaturization and thinning of electronic devices such as mobile phones in recent years, electronic components such as surface mount sensors are also required to be smaller and lower in height. The applicant has proposed a coil in which a flat wire is wound into a spiral shape with both ends thereof drawn out to the outer circumference, and a small surface mount inductor using a preformed tablet and a method of manufacturing the same (Japan Special Open 2010-245473).
該表面安裝感應器係在將捲繞扁平導線而得的線圈載置在錠塊(tablet)上的狀態下放置在成形模具內,並藉由於錠塊的軟化點以上壓縮成形來得到長方體狀的成形體。該成形體使用從兩側面沾浸(dip)等的方法形成外部電極。因此,如第13圖所示,在該表面安裝感應器中,係遍及成形體102的5個表面而形成有外部電極103。 The surface mount inductor is placed in a molding die in a state in which a coil obtained by winding a flat wire is placed on a tablet, and is formed into a rectangular parallelepiped shape by compression molding of a softening point or more of the ingot. Shaped body. The formed body is formed into an external electrode by a method of dip or the like from both sides. Therefore, as shown in Fig. 13, in the surface mount inductor, the external electrodes 103 are formed over the five surfaces of the molded body 102.
伴隨著電子機器的更小型化及大電流化,要求電子零件對電路基板上的高密度安裝。在習知的表面安裝感應器中,外部電極103的寬度比長方體狀的成形體102的寬度更大,達到電極膜的厚度量,且電極形成到側面。因此,此種表面安裝感應器必須以相鄰電子零件的外部電極彼此不會接觸的方式,設置某種程度的距離來安裝,對高密度安裝而言,是不利的構造。此外,在此種表面安裝感應器中,會有形成在上面的外部電極與金屬製的屏蔽(Shield)板接觸而短路(short)的可能性。 Along with the miniaturization and high current of electronic equipment, high-density mounting of electronic components on a circuit board is required. In the conventional surface mount inductor, the width of the external electrode 103 is larger than the width of the rectangular parallelepiped molded body 102, reaching the thickness of the electrode film, and the electrode is formed to the side. Therefore, such a surface mount inductor must be installed with a certain distance in such a manner that external electrodes of adjacent electronic components do not contact each other, which is an unfavorable structure for high-density mounting. Further, in such a surface mount inductor, there is a possibility that an external electrode formed on the upper surface is in contact with a metal shield plate and short-circuited.
因此,本發明之目的在於提供一種對電路基板上的高密度安裝有利之小型的表面安裝感應器。 Accordingly, it is an object of the present invention to provide a small surface mount inductor that is advantageous for high density mounting on a circuit substrate.
為解決上述課題,本發明之表面安裝感應器係具有:線圈,係捲繞線材而得;芯部,係利用主要包含磁性粉末與樹脂的封裝材料而在其內部封入有線圈;及L字形的外部電極,係使用導電膠(paste)而形成在芯部的表面。將芯部形成為具有上面、底面、及寬度比芯部的中央部狹窄之相對向的一對端面的形狀。此時,以線圈之端部各者露出於相對向之端部表面的方式形成芯部。將導電膠塗佈在該芯部端面與底面的一部分而與線圈之端部電性連接來形成外部電極。外部電極是以比芯部的中央部更狹窄的寬度,且不到達芯部上面的方式來形成。 In order to solve the above problems, the surface mount inductor of the present invention has a coil obtained by winding a wire, and a core portion in which a coil is enclosed by a sealing material mainly containing a magnetic powder and a resin; and an L-shaped The external electrode is formed on the surface of the core using a conductive paste. The core portion is formed into a shape having a top surface, a bottom surface, and a pair of end faces whose width is narrower than a central portion of the core portion. At this time, the core portion is formed such that each end portion of the coil is exposed to the end surface of the opposite end portion. A conductive paste is applied to a portion of the end surface and the bottom surface of the core to be electrically connected to an end portion of the coil to form an external electrode. The external electrode is formed to have a narrower width than the central portion of the core and does not reach the upper surface of the core.
本發明的表面安裝感應器,係將外部電極以形成為比芯部的寬度狹窄,並且不到達上面的方式形成,因此能夠實現對電路基板上的高密度安裝。 The surface mount inductor of the present invention is formed such that the external electrode is formed to be narrower than the width of the core and does not reach the upper surface, so that high-density mounting on the circuit substrate can be achieved.
本發明的表面安裝感應器與習知的表面安裝感應器相比,能夠使芯部與繞線的面積增大達安裝面以外的電極厚度量,因此,在L值、直流電阻、直流重疊特性等特性上有利。而且,能夠小型化及低高度化達電極的厚度量。 Compared with the conventional surface mount inductor, the surface mount inductor of the present invention can increase the area of the core and the winding up to the thickness of the electrode outside the mounting surface, and therefore, the L value, the DC resistance, and the DC overlap characteristic. It is advantageous in terms of characteristics. Moreover, it is possible to reduce the size and thickness of the electrode to a small size.
此外,本發明的表面安裝感應器係電極面積比習知的面安裝感應器小,因此,難以產生因漏洩磁束導致的渦電流,在電路效率上有利。 Further, since the area of the surface mount inductor of the present invention is smaller than that of the conventional surface mount inductor, it is difficult to generate an eddy current due to leakage of the magnetic flux, which is advantageous in circuit efficiency.
1‧‧‧線圈 1‧‧‧ coil
1a‧‧‧捲繞部 1a‧‧‧Winding Department
1b‧‧‧端部 1b‧‧‧End
2、12‧‧‧芯部 2, 12 ‧ ‧ core
3、13、103‧‧‧外部電極 3, 13, 103‧‧‧ External electrodes
102‧‧‧成形體 102‧‧‧Formed body
H1、H2‧‧‧高度 H1, H2‧‧‧ height
W1、W2‧‧‧寬度 W1, W2‧‧‧ width
第1圖係為在本發明的實施例中使用的線圈的立體圖。 Fig. 1 is a perspective view of a coil used in an embodiment of the present invention.
第2圖係為本發明第1實施例之芯部的立體圖。 Fig. 2 is a perspective view of a core portion according to a first embodiment of the present invention.
第3圖係為本發明第1實施例之芯部的俯視圖。 Fig. 3 is a plan view showing a core portion according to a first embodiment of the present invention.
第4圖係為本發明第1實施例之面安裝感應器的立體圖。 Fig. 4 is a perspective view showing the surface mount sensor of the first embodiment of the present invention.
第5圖係為用以說明本發明第1實施例之面安裝感應器的外部電極的圖式。 Fig. 5 is a view for explaining an external electrode of the surface mount inductor of the first embodiment of the present invention.
第6圖係為本發明之面安裝感應器另一實施例的立體圖。 Figure 6 is a perspective view of another embodiment of the surface mount inductor of the present invention.
第7圖係為本發明之面安裝感應器另一實施例的立體 圖。 Figure 7 is a perspective view of another embodiment of the surface mounting inductor of the present invention. Figure.
第8圖係為本發明第2實施例之芯部的立體圖。 Fig. 8 is a perspective view showing a core portion of a second embodiment of the present invention.
第9圖係為本發明第2實施例之芯部的側視圖。 Fig. 9 is a side view showing the core portion of the second embodiment of the present invention.
第10圖係為本發明第2實施例之面安裝感應器的立體圖。 Fig. 10 is a perspective view showing the surface mount sensor of the second embodiment of the present invention.
第11圖係為本發明之面安裝感應器另一實施例的立體圖。 Figure 11 is a perspective view of another embodiment of the surface mount inductor of the present invention.
第12圖係為本發明之面安裝感應器另一實施例的立體圖。 Figure 12 is a perspective view of another embodiment of the surface mount inductor of the present invention.
第13圖係為習知的面安裝感應器的立體圖。 Figure 13 is a perspective view of a conventional surface mount inductor.
以下,一面參照圖式,一面說明本發明之面安裝感應器及其製造方法的實施例。 Hereinafter, an embodiment of the surface mount inductor of the present invention and a method of manufacturing the same will be described with reference to the drawings.
一面參照第1圖至第5圖,一面說明本發明的表面安裝感應器的第1實施例。於第1圖顯示在以下的實施例使用之線圈的立體圖。於第2圖與第3圖顯示本發明第1實施例的芯部,第2圖是立體圖,第3圖是俯視圖。第4圖是從本發明第1實施例之表面安裝感應器的底面側觀看的立體圖。於第5圖顯示說明本發明第1實施例的表面安裝感應器的外部電極的圖式。 A first embodiment of the surface mount inductor of the present invention will be described with reference to Figs. 1 to 5. Fig. 1 is a perspective view showing a coil used in the following embodiment. The cores of the first embodiment of the present invention are shown in Figs. 2 and 3, and Fig. 2 is a perspective view, and Fig. 3 is a plan view. Fig. 4 is a perspective view of the surface mount sensor of the first embodiment of the present invention as viewed from the bottom surface side. Fig. 5 is a view showing the external electrodes of the surface mount inductor according to the first embodiment of the present invention.
首先,如第1圖所示,使用剖面形狀為卵形的捲繞芯,將具有自融性皮膜的扁平導線以2段的外外捲 繞的方式進行捲繞而得到線圈1。線圈1係做成為具有捲繞線材而得的捲繞部1a、及以隔著捲繞部1a相對向的方式拉出的兩端部1b的形狀。 First, as shown in Fig. 1, using a winding core having an oval shape in cross section, a flat wire having a self-melting film is rolled into two outer diameters. The coil 1 is obtained by winding in a winding manner. The coil 1 has a shape in which the winding portion 1a having the wound wire member and the both end portions 1b which are pulled out so as to face each other across the winding portion 1a.
接著,如第2圖所示,以利用將鐵系金屬磁性粉末與環氧樹脂混合而得到的封裝材料將線圈1封入其內部的方式,使用壓縮成形法形成芯部2。此時,以使線圈1的端部1b露出於芯部2之相對向兩端面的表面上之方式來形成。如第3圖所示,在本實施例中,以芯部2端面的寬度W2成為比芯部2中央部的寬度W1更小的方式,將芯部2形成為八角形。 Next, as shown in FIG. 2, the core 2 is formed by a compression molding method in such a manner that the coil 1 is sealed inside by a sealing material obtained by mixing an iron-based metal magnetic powder and an epoxy resin. At this time, the end portion 1b of the coil 1 is formed so as to be exposed on the surface of the core portion 2 opposite to both end faces. As shown in Fig. 3, in the present embodiment, the core portion 2 is formed in an octagonal shape such that the width W2 of the end surface of the core portion 2 is smaller than the width W1 of the central portion of the core portion 2.
接著,進行噴砂(sandblast)處理,並在進行去毛邊及去除露出兩端部1b表面的皮膜後,將導電膠轉印塗佈在芯部2的端面與底面的一部分並使其硬化。藉此,導電膠與內部的線圈1會導通。最後,進行電鍍處理並在導電膠的表面上形成電鍍層,形成L字形的外部電極3,得到第4圖所示的表面安裝感應器。此時,會如第5圖所示,外部電極3形成為外部電極3的寬度W3比芯部2中央部的寬度W1狹窄。進而,利用印刷方式使導電膠以不會到達芯部2的上面的方式進行轉印,而以不會到達芯部2的上面的方式形成外部電極3。另外,藉由電鍍處理形成的電極可由Ni、Sn、Cu、Au、Pd等適當選擇1種或複數種。 Next, a sandblasting treatment is performed, and after the burrs are removed and the film on the surface of the both end portions 1b is removed, the conductive paste is transferred and applied to a part of the end surface and the bottom surface of the core portion 2 to be cured. Thereby, the conductive paste and the inner coil 1 are turned on. Finally, a plating treatment was performed and a plating layer was formed on the surface of the conductive paste to form an L-shaped external electrode 3, and the surface mount inductor shown in Fig. 4 was obtained. At this time, as shown in FIG. 5, the external electrode 3 is formed such that the width W3 of the external electrode 3 is narrower than the width W1 of the central portion of the core portion 2. Further, the conductive paste is transferred so as not to reach the upper surface of the core 2 by a printing method, and the external electrode 3 is formed so as not to reach the upper surface of the core 2. Further, the electrode formed by the plating treatment may be appropriately selected from Ni, Sn, Cu, Au, Pd, or the like, one or more kinds.
在此,顯示類似第1實施例之另一實施例。第6圖與第7圖顯示本發明之表面安裝感應器另一實施例 的立體圖。即使芯部2形成為如第6圖的十字形或第7圖的圓角長方形,亦能達成與第1實施例的八角形芯部同樣的效果。 Here, another embodiment similar to the first embodiment is shown. 6 and 7 show another embodiment of the surface mount inductor of the present invention Stereogram. Even if the core portion 2 is formed in a cross shape as shown in Fig. 6 or a rounded rectangle in Fig. 7, the same effect as the octagonal core portion of the first embodiment can be achieved.
一面參照第8圖至第10圖,一面說明本發明之表面安裝感應器的第2實施例。第9圖及第10圖顯示本發明第2實施例的芯部,第8圖為立體圖,第9圖為側視圖。第10圖顯示從本發明第2實施例之表面安裝感應器的上面側觀看的立體圖。另外,在第2實施例中,使用在第1實施例中使用的線圈與封裝材料。省略與第1實施例重複部分的說明。 A second embodiment of the surface mount inductor of the present invention will be described with reference to Figs. 8 to 10. Fig. 9 and Fig. 10 show a core portion according to a second embodiment of the present invention, and Fig. 8 is a perspective view, and Fig. 9 is a side view. Fig. 10 is a perspective view showing the upper surface side of the surface mount sensor of the second embodiment of the present invention. Further, in the second embodiment, the coil and the sealing material used in the first embodiment are used. Description of the overlapping portions with the first embodiment will be omitted.
首先,以利用封裝材料將線圈封入其內部的方式,使用壓縮成形法形成芯部12。此時,使線圈的端部1b露出於芯部12之相對向的兩端部表面上之方式形成。在本實施例中,係與第1實施例同樣地以八角形形成芯部12,進而,如第9圖所示,以芯部12的端面高度H2比中央部的高度H1低的方式,將上面形成為錐(taper)形。 First, the core portion 12 is formed by compression molding in such a manner that the coil is sealed inside by the encapsulating material. At this time, the end portion 1b of the coil is formed to be exposed on the surfaces of the opposite end portions of the core portion 12. In the present embodiment, the core portion 12 is formed in an octagonal shape as in the first embodiment, and as shown in Fig. 9, the end surface height H2 of the core portion 12 is lower than the height H1 of the central portion. The upper surface is formed in a taper shape.
接著,進行噴砂處理,並在進行去毛邊及去除露出兩端部1b表面的皮膜後,利用轉筒(roller)印刷將導電膠轉印塗佈在芯部12的端面與底面的一部分並使其硬化。藉此,導電膠與內部的線圈1會導通。最後,進行電鍍處理並在導電膠的表面上形成電鍍層,形成L字形的外部電極13,得到第10圖所示的表面安裝感應器。第2實施例的表面安裝感應器,係預先將芯部的上面形成為凸 狀,並以印刷方式塗佈導電膠,因此,不需以第1實施例的方式進行高度控制,也不需以使外部電極到達芯部上面的方式來形成。 Next, sand blasting is performed, and after removing the burrs and removing the film which exposes the surface of the both ends 1b, the conductive paste is transferred and applied to the end surface and the bottom part of the core part 12 by the roller printing, and it is made. hardening. Thereby, the conductive paste and the inner coil 1 are turned on. Finally, a plating treatment is performed and a plating layer is formed on the surface of the conductive paste to form an L-shaped external electrode 13 to obtain a surface mount inductor shown in FIG. The surface mount inductor of the second embodiment is formed by forming the upper surface of the core into a convex shape in advance. Since the conductive paste is applied by printing, it is not necessary to carry out the height control in the manner of the first embodiment, and it is not necessary to form the external electrode so as to reach the upper surface of the core.
在此,顯示類似第2實施例之其他實施例。第11圖與第12圖顯示本發明之表面安裝感應器其他實施例的立體圖。如第11圖及第12圖所示,即使在芯部12的上面形成具有段差的形狀,芯部12亦能達成與第2實施例之具有錐形上面的芯部同樣的效果。 Here, other embodiments similar to the second embodiment are shown. 11 and 12 show perspective views of other embodiments of the surface mount inductor of the present invention. As shown in Figs. 11 and 12, even if a shape having a step is formed on the upper surface of the core portion 12, the core portion 12 can achieve the same effect as the core portion having the tapered upper surface of the second embodiment.
在上述實施例中,以封裝材料而言,係在磁性粉末使用鐵系金屬磁性粉末,在結合材料使用環氧樹脂。藉由使用鐵系金屬磁性粉末,能夠製造直流重疊特性優異的表面安裝感應器。然而,並不限定於此,例如,以磁性粉末而言,也能夠使用鐵氧體(ferrite)系磁性粉末等、或經進行過絕緣皮膜形成或表面氧化等表面改質的磁性粉末。此外,也能夠添加玻璃粉末等無機物。而且,以結合材料而言,也能夠使用聚醯亞胺(polyimide)樹脂或酚樹脂(phenol)等熱硬化性樹脂、或聚乙烯樹脂或聚醯胺樹脂等熱可塑性樹脂或無機結合材料等。 In the above embodiment, in the case of the encapsulating material, an iron-based metal magnetic powder is used for the magnetic powder, and an epoxy resin is used for the bonding material. By using an iron-based metal magnetic powder, it is possible to manufacture a surface mount inductor having excellent DC superposition characteristics. However, the magnetic powder may be a magnetic powder such as a ferrite-based magnetic powder or a surface-modified surface such as an insulating film or a surface oxidation. Further, an inorganic substance such as glass powder can also be added. Further, as the bonding material, a thermosetting resin such as a polyimide resin or a phenol resin, a thermoplastic resin such as a polyethylene resin or a polyamide resin, or an inorganic bonding material can be used.
在上述實施例中,雖使用扁平導線來做成卵形的外外捲繞線圈,但並非限定於此,也能夠使用圓形、扇形、半圓形、梯形或多角形、或者將該等形狀予以組合之形狀的線圈。此外,也能夠使用圓線而不使用扁平導線,也能夠不使用外外捲繞而使用整列捲繞或扁立(edgewise)捲繞等。 In the above embodiment, although the flat outer wire is used to form the oval outer and outer winding coils, the present invention is not limited thereto, and a circular shape, a sector shape, a semicircular shape, a trapezoidal shape or a polygonal shape, or the like may be used. A coil of a combined shape. Further, it is also possible to use a round wire instead of a flat wire, or to use an entire row winding or an edgewise winding without using the outer winding.
在上述實施例中,使用屬於塑膠成形法之一的壓縮成形法來做成芯部,但並不限定於此,也能夠使用例如壓粉成形法等成形法來做成芯部。 In the above embodiment, the core portion is formed by a compression molding method which is one of the plastic molding methods. However, the present invention is not limited thereto, and a core portion may be formed by a molding method such as a powder molding method.
在上述實施例中,以去毛邊與剝離線圈端部表面的皮膜的方法而言,雖使用噴砂處理,但並不限定於此,也能夠利用滾筒拋磨等所進行之去毛邊或機械剝離等被膜剝離方法。此外,也能夠在形成芯部之前預先剝離端部的皮膜。 In the above embodiment, the method of deburring and peeling off the film on the end surface of the coil is sandblasted, but it is not limited thereto, and it is also possible to perform burring or mechanical peeling by roller polishing or the like. Film peeling method. Further, it is also possible to peel off the film of the end portion before forming the core portion.
2‧‧‧芯部 2‧‧‧ core
3‧‧‧外部電極 3‧‧‧External electrode
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