CN103219131A - Surface mount inductor and method of manufacturing the same - Google Patents

Surface mount inductor and method of manufacturing the same Download PDF

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Publication number
CN103219131A
CN103219131A CN2013100198272A CN201310019827A CN103219131A CN 103219131 A CN103219131 A CN 103219131A CN 2013100198272 A CN2013100198272 A CN 2013100198272A CN 201310019827 A CN201310019827 A CN 201310019827A CN 103219131 A CN103219131 A CN 103219131A
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CN
China
Prior art keywords
core
mentioned
width
surface mounting
mounting inductor
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Pending
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CN2013100198272A
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Chinese (zh)
Inventor
狮子仓洋
户塚昌明
佐佐森邦夫
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Murata Manufacturing Co Ltd
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Toko Inc
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Publication of CN103219131A publication Critical patent/CN103219131A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/24Magnetic cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/288Shielding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • H01F27/292Surface mounted devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F3/00Cores, Yokes, or armatures
    • H01F3/08Cores, Yokes, or armatures made from powder
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets

Abstract

The invention aims to provide a miniature surface mount inductor beneficial for being installed onto a circuit board in high density, and a method of manufacturing the surface mount inductor. The surface mount inductor of the invention is characterized by comprising a coil which is formed by winding a wire; a core part which internally seals the core and is mainly composed of magnetic powder and resin; and an external electrode which is letter L-shaped and is formed on the surface of the core part by using conductive paste. The core part is formed to be a shape having an upper surface, a bottom surface, and a pair of opposite end surfaces. The width of each of the pair of the end surfaces is smaller than the width of the central portion of the core part. For the time being, the core part is formed in a mode that the end portions of the coil are respectively exposed from the surfaces of the opposite end surfaces. A printing mode is employed to coat the conductive paste onto a part of the bottom surface and the end surfaces. The external electrode is formed in a manner of being electrically connected with the end portions of the coil. The width of the external electrode is smaller than the width of the central portion of the core part, and the external electrode does not reach the upper surface of the core part.

Description

Surface mounting inductor and manufacture method thereof
Technical field
The present invention relates to small-sized surface mounting inductor and manufacture method thereof.
Background technology
The surface mounting inductor that wraps in the coil that wound skein product is obtained in the core (core) is widely used.Be accompanied by miniaturization, the slimming of electronic equipments such as mobile phone in recent years, also require surface mounting inductor such electronic unit miniaturization, low level.The applicant has proposed a kind of small-sized surface mounting inductor and manufacture method thereof, and this surface mounting inductor has used preformed sheet element and by the mode of drawing to periphery this flat conductor has been wound into swirl shape and the coil (TOHKEMY 2010-245473) that obtains with the both ends of flat conductor.
This surface mounting inductor is positioned in the shaping dies under the coil that the winding flat lead is obtained is positioned in state on the sheet element, and carries out compression molding more than the softening temperature of sheet element, thereby obtains rectangular-shaped formed body.By using dipping methods such as (dip) to form outer electrode in the two sides of this formed body.Therefore, as shown in figure 13, in this surface mounting inductor, outer electrode 103 is formed on 5 surfaces of formed body 102.
Be accompanied by the further miniaturization of electronic equipment, big electric currentization, require on circuit board, to install to high-density electronic unit.In surface mounting inductor in the past, the width of outer electrode 103 grows the thickness of electrode film than the width of rectangular-shaped formed body 102, and all is formed with electrode until the side.Therefore, for this surface mounting inductor, contact with each other between the outer electrode of adjacent electronic unit, the distance ground that need be provided with between the outer electrode of adjacent electronic unit is to a certain degree installed, and is the structure that is unfavorable for high-density installation.In addition, in this surface mounting inductor, have also that the outer electrode that is formed on upper surface and metal barricade contact and the possibility that is short-circuited.
Summary of the invention
Therefore, the objective of the invention is to, a kind of that install, small-sized to high-density surface mounting inductor on circuit board that helps is provided.
In order to solve above-mentioned problem, surface mounting inductor of the present invention has: coil, and it forms by wound skein product; Core, it is sealed to its inside with coil, mainly is made of magnetic and resin; And outer electrode, it is that letter is L shaped, is formed on core surface by using conductive paste.Core form have upper surface, the shape of bottom surface and pair of opposing end faces, the width of this a pair of end face is all less than the width of the central portion of core.At this moment, the mode that exposes from the surface of opposing end faces respectively with overhang forms core.Coating electrically conductive paste on the part of the bottom surface of this core and end face forms outer electrode with overhang with being electrically connected.Outer electrode forms the width of its width less than the central portion of core, and and the upper surface of no show core.
In surface mounting inductor of the present invention, because outer electrode forms narrowlyer than the width of core, and form the also upper surface of no show core, therefore, can realize the high-density installation on circuit board.
In surface mounting inductor of the present invention, owing to compare with mounted on surface electricity inductor in the past, the area increase of core and coil is measured accordingly with the thickness of installed surface electrode in addition, therefore, becoming favourable aspect the characteristics such as L value, D.C. resistance, the overlapping characteristic of direct current.In addition, can realize miniaturization, low level with the thickness respective amount of electrode.
In addition, in surface mounting inductor of the present invention, compare with surface mounting inductor in the past, electrode area is less, therefore, is difficult for producing the vortex flow that is caused by leakage flux, becomes favourable aspect circuit efficiency.
Description of drawings
Fig. 1 is the stereogram of employed coil in the embodiments of the invention.
Fig. 2 is the stereogram of the core of the 1st embodiment of the present invention.
Fig. 3 is the vertical view of the core of the 1st embodiment of the present invention.
Fig. 4 is the stereogram of the surface mounting inductor of the 1st embodiment of the present invention.
Fig. 5 is the figure of outer electrode of the surface mounting inductor of explanation the 1st embodiment of the present invention.
Fig. 6 is the stereogram of another embodiment of surface mounting inductor of the present invention.
Fig. 7 is the stereogram of an embodiment again of surface mounting inductor of the present invention.
Fig. 8 is the stereogram of the core of the 2nd embodiment of the present invention.
Fig. 9 is the end view of the core of the 2nd embodiment of the present invention.
Figure 10 is the stereogram of the surface mounting inductor of the 2nd embodiment of the present invention.
Figure 11 is the stereogram of an embodiment again of surface mounting inductor of the present invention.
Figure 12 is the stereogram of an embodiment again of surface mounting inductor of the present invention.
Figure 13 is the stereogram of surface mounting inductor in the past.
Embodiment
Below, with reference to the embodiment of description of drawings surface mounting inductor of the present invention and manufacture method thereof.
Embodiment
The 1st embodiment
With reference to Fig. 1~Fig. 5, the 1st embodiment of surface mounting inductor of the present invention is described.Fig. 1 represents the stereogram of employed coil among the following embodiment.Fig. 2 and Fig. 3 represent the core of the 1st embodiment of the present invention, and Fig. 2 is a stereogram, and Fig. 3 is a vertical view.Fig. 4 represents to observe from bottom surface side the stereogram of the surface mounting inductor of the 1st embodiment of the present invention.Fig. 5 represents to illustrate the figure of outer electrode of the surface mounting inductor of the 1st embodiment of the present invention.
At first, as shown in Figure 1, using cross sectional shape is oval-shaped volume core, and the flat conductor that will have the tack tunicle is wound into two-layer outer external formula coiling (reeling in the mode that two wire terminations form most peripheral) and obtains coil 1.Coil 1 is made into the 1a of coiling portion that has wound skein product and obtain and the clamping coiling 1a of portion and the shape of the both ends 1b that relatively extracted.
Then, as shown in Figure 2, use to mix Ferrious material magnetic and epoxy resin and the encapsulant that obtains coil 1 is sealed to the mode of the inside of core 2, utilize compression forming method to form core 2.At this moment, forming the end 1b that makes coil 1 exposes from the surface of the relative both ends of the surface of core 2.As shown in Figure 3, in the present embodiment, less than the mode of the width W 1 of the central portion of core 2 core 2 is formed octagon (octagon) with the width W 2 of the end face of core 2.
Then, carrying out after blasting treatment removed the tunicle on surface of both ends 1b of burr and exposure transfer printing coating electrically conductive paste and make it sclerosis on the part of the bottom surface of core 2 and end face.Thus, conductive paste and inner coil 1 conducting.At last, carry out the plating processing and on the surface of conductive paste, form coating, form the L shaped outer electrode 3 of letter, thereby obtain surface mounting inductor as shown in Figure 4.At this moment, as shown in Figure 5, outer electrode 3 forms the width W 1 of the width W 3 of outer electrode 3 less than the central portion of core 2.And the upper surface ground that makes conductive paste and no show core 2 in the mode of printing is with the conductive paste transfer printing, thus and the upper surface ground of no show core 2 formation outer electrode 3.In addition, handling the electrode that forms by plating can form by suitably select one or more from Ni, Sn, Cu, Au, Pd etc.
At this, similar other embodiment with the 1st embodiment is shown.Fig. 6 and Fig. 7 represent the stereogram of other embodiment of surface mounting inductor of the present invention.Even core 2 forms the such cross of Fig. 6 (cross-shaped), the such round rectangle (rounded rectangle) of Fig. 7, also can obtain the effect identical with the octagonal core of the 1st embodiment.
The 2nd embodiment
With reference to Fig. 8~Figure 10, the 2nd embodiment of surface mounting inductor of the present invention is described.Fig. 8 and Fig. 9 represent the core of the 2nd embodiment of the present invention, and Fig. 8 is a stereogram, and Fig. 9 is an end view.Figure 10 represents to observe from upper surface side the stereogram of the surface mounting inductor of the 2nd embodiment of the present invention.In addition, in the 2nd embodiment, use employed encapsulant among the 1st embodiment.Omission is to the explanation of the part that repeats with the 1st embodiment.
At first,, utilize compression forming method to form core 12, at this moment, form overhang 1b is exposed from the surface of the relative both ends of the surface of core 12 coil is sealed to the mode of the inside of core 12 with encapsulant.In the present embodiment, the same with the 1st embodiment, make core 12 form octagon, and as shown in Figure 9, the mode of height H 1 that is lower than the central portion of core 12 with the height H 2 of the end face of core 12 make the upper surface of core 12 form taper.
Then, carrying out after blasting treatment removed the tunicle on surface of both ends 1b of burr and exposure, utilizing roll printing coating electrically conductive paste and make it sclerosis on the part of the bottom surface of core 12 and end face.Thus, conductive paste and inner coil conducting.At last, carry out the plating processing and on the surface of conductive paste, form coating, form the L shaped outer electrode 13 of letter, thereby obtain surface mounting inductor as shown in figure 10.For the surface mounting inductor of the 2nd embodiment, owing to make the upper surface of core form convex in advance, and mode coating electrically conductive paste to print, therefore, need not to carry out as the 1st embodiment height control, the upper surface ground that just can make outer electrode not arrive core forms outer electrode.
At this, similar other embodiment with the 2nd embodiment is shown.Figure 11 and Figure 12 represent the stereogram of other embodiment of surface mounting inductor of the present invention.Even core 12 is as Figure 11 and form the shape that has step at the upper surface of core 12 as shown in Figure 12, also can obtain the identical effect of core with the upper surface of the 2nd embodiment with taper.
In the above-described embodiments, as encapsulant, magnetic has used the Ferrious material magnetic, and binding material has used epoxy resin.Can make the surface mounting inductor of the overlapping excellent of direct current by using the Ferrious material magnetic.But be not limited thereto,, can also use to form insulation tunicle, the magnetic that has carried out surface modifications such as surface oxidation, ferrite class magnetic etc. for example as magnetic.In addition, can also add inorganic matters such as glass dust.And, as binding material, can also use thermoplastic resins such as thermosetting resins such as polyimide resin, phenolic resins, polyvinyl resin, polyamide, inorganic cementitious material etc.
In the above-described embodiments, use flat conductor to make the coil that oval-shaped outer externally formula is reeled, but be not limited thereto, can also use circle, fan-shaped, semicircle, trapezoidal, polygon, perhaps the coil of the shape that above-mentioned these combination of shapes are formed.In addition, can also not adopt flat conductor and adopt round conductor etc., can also not be that outer externally formula is reeled but rule is reeled (regular winding), flat upright coiling etc.
In the above-described embodiments, use as the compression forming method of one of plastics forming method and make core, but be not limited thereto, for example can also use forming process making cores such as powder pressing method.
In the above-described embodiments, as deburring with peel off the method for tunicle of the end surface of coil, used blasting treatment, but be not limited thereto, can also use tunicle stripping means such as mechanical stripping, utilize deburring such as barreling.In addition, can also be before forming core the tunicle of stripped end in advance.
The Reference numeral translation
1 coil; 1a coiling portion; The 1b end; 2,12 cores; 3,13 outer electrodes

Claims (13)

1. surface mounting inductor is characterized in that having:
Coil, it forms by wound skein product;
Core, it is sealed to its inside with coil, mainly is made of magnetic and resin; And
Outer electrode, it is that letter is L shaped, is formed on the surface of this core by using conductive paste;
This core form have upper surface, the shape of bottom surface and pair of opposing end faces, the width of this a pair of end face is all less than the width of the central portion of this core;
This overhang exposes from the surface of this opposing end faces respectively;
Coating electrically conductive paste on the part of this bottom surface and this end face forms this outer electrode with this overhang with being electrically connected;
This moment, this outer electrode formed the width of its width less than the central portion of this core, and and the upper surface of this core of no show.
2. surface mounting inductor according to claim 1, wherein,
Above-mentioned core forms the shape of having excised 4 angles, so that the width of above-mentioned end face is less than the width of central portion.
3. surface mounting inductor according to claim 2, wherein,
Above-mentioned core from observed any one shape that is shaped as octagon, cross, the round rectangle of above-mentioned upper surface.
4. surface mounting inductor according to claim 1, wherein,
In above-mentioned core,
Above-mentioned upper surface forms convex, and the height of above-mentioned end face is lower than the height of the central portion of above-mentioned core.
5. surface mounting inductor according to claim 2, wherein,
In above-mentioned core,
Above-mentioned upper surface forms convex, and the height of above-mentioned end face is lower than the height of the central portion of above-mentioned core.
6. surface mounting inductor according to claim 3, wherein,
In above-mentioned core,
Above-mentioned upper surface forms convex, and the height of above-mentioned end face is lower than the height of the central portion of above-mentioned core.
7. surface mounting inductor according to claim 4, wherein,
In above-mentioned core,
Above-mentioned upper surface is taper or has the shape of step.
8. surface mounting inductor according to claim 5, wherein,
In above-mentioned core,
Above-mentioned upper surface is taper or has the shape of step.
9. surface mounting inductor according to claim 6, wherein,
In above-mentioned core,
Above-mentioned upper surface is taper or has the shape of step.
10. the manufacture method of a surface mounting inductor is characterized in that, has following operation:
Form the operation of coil by wound skein product;
Prepare mainly the operation of the encapsulant that constitutes by magnetic and resin;
Utilize the sealing material to form the operation of core in the mode that this coil is sealed to the inside of core; And
Coating electrically conductive paste on the part of this bottom surface and this end face forms the operation of alphabetical L shaped outer electrode with this overhang with being electrically connected;
Form in the operation of core at this,
This core is formed have upper surface, the shape of bottom surface and pair of opposing end faces, the width of this a pair of end face is all less than the width of the central portion of this core, the mode that exposes from the surface of this opposing end faces respectively with this overhang seals;
Form in the operation of outer electrode at this, make this outer electrode form the width of its width less than the central portion of this core, and and the upper surface of this core of no show.
11. the manufacture method of surface mounting inductor according to claim 10, wherein,
In the operation of above-mentioned formation core,
Form the shape of having excised 4 angles, so that the width of above-mentioned end face is less than the width of central portion.
12. the manufacture method of surface mounting inductor according to claim 10, wherein,
In the operation of above-mentioned formation core,
Make above-mentioned upper surface form convex, make the height of above-mentioned end face be lower than the height of the central portion of above-mentioned core.
13. the manufacture method of surface mounting inductor according to claim 11, wherein,
In the operation of above-mentioned formation core,
Make above-mentioned upper surface form convex, make the height of above-mentioned end face be lower than the height of the central portion of above-mentioned core.
CN2013100198272A 2012-01-20 2013-01-18 Surface mount inductor and method of manufacturing the same Pending CN103219131A (en)

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* Cited by examiner, † Cited by third party
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KR101686989B1 (en) 2014-08-07 2016-12-19 주식회사 모다이노칩 Power Inductor
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US11657955B2 (en) 2018-04-10 2023-05-23 Murata Manufacturing Co., Ltd. Surface mount inductor
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JP6567152B2 (en) * 2018-09-05 2019-08-28 太陽誘電株式会社 Coil parts and electronic equipment
JP6549779B2 (en) * 2018-12-28 2019-07-24 太陽誘電株式会社 Coil component, method of manufacturing the same, electronic device
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JP7188258B2 (en) 2019-04-22 2022-12-13 Tdk株式会社 Coil component and its manufacturing method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001068356A (en) * 1999-08-24 2001-03-16 Tokin Corp Laminated impedance element
CN1722318A (en) * 2004-07-12 2006-01-18 Tdk株式会社 Coil component
JP2010186910A (en) * 2009-02-13 2010-08-26 Toko Inc Method of manufacturing mold coil
CN101859641A (en) * 2009-04-10 2010-10-13 东光株式会社 The manufacture method of surface mounting inductor and surface mounting inductor
JP2011035147A (en) * 2009-07-31 2011-02-17 Tdk Corp Method of manufacturing coil component, and coil component

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5646510A (en) * 1979-09-25 1981-04-27 Tdk Corp Inductor, inductor assembly, and method of manufacture thereof
JP2001155938A (en) * 1999-09-17 2001-06-08 Fdk Corp Laminated inductor and manufacturing method therefor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001068356A (en) * 1999-08-24 2001-03-16 Tokin Corp Laminated impedance element
CN1722318A (en) * 2004-07-12 2006-01-18 Tdk株式会社 Coil component
JP2010186910A (en) * 2009-02-13 2010-08-26 Toko Inc Method of manufacturing mold coil
CN101859641A (en) * 2009-04-10 2010-10-13 东光株式会社 The manufacture method of surface mounting inductor and surface mounting inductor
JP2011035147A (en) * 2009-07-31 2011-02-17 Tdk Corp Method of manufacturing coil component, and coil component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112349475A (en) * 2019-08-07 2021-02-09 株式会社村田制作所 Inductor component and electronic component

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